Tensile mechanical testing device and control method

Abstract

The invention discloses a tensile mechanical testing device and a control method, and belongs to the technical field of tensile mechanical testing devices.The tensile mechanical testing device comprises a wafer, a floating end and a fixed end, the floating end and the fixed end are formed on the surface of the wafer through etching, and the floating end and the fixed end are staggered and arranged in a crossed mode; a stretching area is formed between the floating end and the fixed end, and the stretching area is used for carrying out a stretching mechanical test on a polymer film. The method can adapt to the micro-scale polymer film with small size and thin thickness, the polymer film is transferred and fixed by replacing the existing epoxy resin with the ethanol solvent, the time of the fixing process is shortened, and the light transmission and the uniformity of the bonding layer at the edge fixing position of the polymer film are improved.

Description

Technical Field

[0001] The invention relates to the technical field of tensile mechanics testing devices, in particular to a tensile mechanics testing device and an operating method. Background Art

[0002] With the rapid development of materials science, nanotechnology and microelectronics, the demand for nanomechanical property testing of microscale polymer films is increasing. Microscale polymer film materials have broad application prospects in many fields such as microelectronic devices, biosensors, flexible electronics, energy storage, etc. However, due to the small size and thin thickness of microscale polymer films, the testing of their mechanical properties faces great challenges. Traditional macroscopic mechanical testing devices (such as universal mechanical testing machines) cannot be directly applied to microscale polymer films, so new testing technologies and devices need to be developed.

[0003] At present, the nanomechanical properties testing methods for microscale polymer films mainly include focused ion beam (FIB) cutting and in-situ transmission electron microscopy (TEM) testing. Testing the FIB-cut films in TEM can achieve the mechanical properties testing of microscale polymer films to a certain extent, but there are significant limitations.

[0004] In-situ transmission electron microscopy (TEM) testing technology tests the nanomechanical properties of polymer films by directly observing the deformation behavior of polymer films under mechanical loading in TEM. However, the TEM testing environment has extremely stringent requirements on samples, requiring samples to have extremely high electron transparency, which limits its application range. In addition, the irradiation of the electron beam during the TEM test may damage the polymer film, further affecting the accuracy of the test results.

[0005] In order to overcome the limitations of the prior art, it is particularly important to develop a novel nanomechanical testing device for microscale polymer films. Therefore, the present invention needs to design a push-turn-pull type micro testing device that can perform in-situ tensile testing on microscale polymer films in an optical microscope.

[0006] In addition, in the prior art, the target to be tested is fixed on the stretching device by epoxy resin, and the target to be tested is a one-dimensional nanomaterial, that is, the one-dimensional nanomaterial is fixed to the stretching device by epoxy resin. However, the target to be tested in the present invention is a polymer film. If the polymer film is directly fixed to the stretching device by epoxy resin, the epoxy resin will have a negative impact on the polymer film, that is, the epoxy resin and the polymer film are not well adapted, and the existing epoxy resin takes 24 hours to cure to fix the target to be tested, which is too inefficient and affects the accuracy and efficiency of the polymer film when performing a stretching test. Therefore, a substance needs to be selected to replace the epoxy resin to fix the polymer film. Summary of the invention

[0007] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0008] In view of the problems existing in the prior art, the present invention is proposed.

[0009] Therefore, the first object of the present invention is to provide a tensile mechanics testing device, which can adapt to small-sized and thin micro-scale polymer films and perform non-destructive tensile mechanics tests on them.

[0010] In order to solve the above technical problems, the present invention provides the following technical solutions: a tensile mechanical testing device, which includes a wafer, and a floating end and a fixed end formed on the surface of the wafer by etching, and the floating end and the fixed end are offset and cross-arranged with each other; a stretching area is formed between the floating end and the fixed end, and the stretching area is used to perform a tensile mechanical test on a polymer film.

[0011] As a preferred solution of the tensile mechanical testing device described in the present invention, wherein: a U-shaped groove is also etched on the surface of the wafer, rectangular grooves are etched on the floating end and the fixed end, the rectangular groove is arranged corresponding to the U-shaped groove, and a U-shaped elastic part is formed between the rectangular groove and the U-shaped groove; a force-bearing part is also etched on the floating end, and the floating end is driven to move in a direction away from the fixed end by applying force to the force-bearing part.

[0012] As a preferred solution of the tensile mechanical testing device described in the present invention, wherein: a rectangular column is also etched on the surface of the wafer, a hook portion is provided on the rectangular column, a wedge portion is also etched on the floating end, and at least one wedge portion is provided; when the floating end moves more than 10 μm in a direction away from the fixed end, the wedge portion can be engaged with the hook portion.

[0013] A second object of the present invention is to provide a manipulation method that can quickly transfer and fix a polymer film and reduce interference when performing tensile mechanical testing on the polymer film.

[0014] In order to solve the above technical problems, the present invention provides the following technical solutions: an operating method including the tensile mechanics testing device, further comprising pre-treating the polymer film and the tensile mechanics testing device respectively; transferring the pre-treated polymer film to the pre-treated tensile mechanics testing device; adjusting the position of the polymer film so that it covers the stretching area of ​​the tensile mechanics testing device; performing a tensile mechanics test on the polymer film after fixation; and recording and analyzing the deformation behavior of the polymer film during stretching and recovery.

[0015] As a preferred embodiment of the manipulation method of the present invention, the polymer film is placed in a cooling chamber of a microtome and cooled to -85°C.

[0016] As a preferred solution of the manipulation method of the present invention, the same volume of ethanol solvent is applied to the floating end and the fixed end of the tensile mechanics testing device respectively.

[0017] As a preferred embodiment of the manipulation method of the present invention, the volume of the ethanol solvent is 1×10 -4 μL.

[0018] As a preferred embodiment of the manipulation method of the present invention, the polymer film is picked up by a driving probe and placed on the tensile mechanics testing device, and the polymer film covers the ethanol solvent on the floating end and the fixed end.

[0019] As a preferred embodiment of the manipulation method of the present invention, the test environment temperature is adjusted to between -85°C and -100°C so that the ethanol solvent on the floating end and the fixed end melts but does not evaporate, and the position of the polymer film is adjusted so that it covers the stretching area of ​​the tensile mechanics testing device.

[0020] As a preferred embodiment of the manipulation method of the present invention, the test environment temperature is adjusted to room temperature, the ethanol solvent evaporates, and the edge positions of both ends of the polymer film in the length direction are fixed on the floating end and the fixed end respectively.

[0021] The beneficial effects of the present invention are as follows: the present invention can adapt to small-sized and thin micro-scale polymer films, transfer and fix the polymer films by replacing the existing epoxy resin with ethanol solvent, shorten the time of the fixing process, and improve the light transmittance and uniformity of the bonding layer at the edge fixing point of the polymer film. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0023] Figure 1 Schematic diagram of the tensile mechanics testing device in Example 1 of the present invention.

[0024] Figure 2 It is a structural diagram of the hook portion and the wedge portion of the tensile mechanics testing device in Example 1 of the present invention.

[0025] Figure 3 Schematic diagram of the tensile mechanics testing device in Example 2 of the present invention. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] Example 1

[0030] Reference Figure 1 and Figure 2 , this embodiment provides a tensile mechanics testing device.

[0031] Specifically, the tensile mechanical testing device includes a wafer 100 . The wafer 100 of this embodiment is a silicon-on-insulator (SOI) wafer 100 .

[0032] Preferably, Figure 1 , a floating end 101 and a fixed end 102 are etched on the surface of the wafer 100 by deep reactive ion etching, and the floating end 101 and the fixed end 102 are staggered and cross-arranged. The deep reactive ion etching method is a prior art and will not be described in detail here.

[0033] Preferably, Figure 1 A stretching region M is formed between the floating end 101 and the fixed end 102. When performing a tensile mechanical test, the two ends of the polymer film A in the length direction are respectively fixed on the floating end 101 and the fixed end 102, and the middle area of ​​the polymer film A is covered on the stretching region M. The tensile mechanical test of the polymer film A is performed through the stretching region M.

[0034] Preferably, Figure 1 A U-shaped groove 103 is also etched on the surface of the wafer 100 by a deep reactive ion etching method. In this embodiment, four U-shaped grooves 103 are provided, three rectangular grooves 104 are etched on the floating end 101, and one rectangular groove 104 is etched on the fixed end 102, for a total of four rectangular grooves 104. These four rectangular grooves 104 and the four U-shaped grooves 103 are arranged in a one-to-one correspondence, that is, the rectangular groove 104 goes deep into the U-shaped groove 103, and a U-shaped elastic portion 105 is formed between the outer wall of the rectangular groove 104 and the inner wall of the U-shaped groove 103, and the U-shaped elastic portion 105 provides a reset force to the floating end 101 and the fixed end 102.

[0035] Preferably, Figure 1 A force-bearing portion 106 is also etched on the floating end 101. The force-bearing portion 106 of this embodiment is arc-shaped. The driving probe applies a force F to the force-bearing portion 106 to drive the floating end 101 to move away from the fixed end 102, so that the stretching area M expands, driving the polymer film A to stretch.

[0036] Further, such as Figure 1 and Figure 2, a rectangular column 107 is also etched on the surface of the wafer 100. In this embodiment, there are two rectangular columns 107. The length direction of the two rectangular columns 107 is parallel to the stretching direction of the polymer film A. The two rectangular columns 107 are respectively arranged on the left and right sides of the floating end 101, and a hook portion 107a is arranged on the side of the rectangular column 107 facing the floating end 101. Wedge portions 101a are also etched on the left and right sides of the floating end 101. The wedge portions 101a can be engaged with the hook portions 107a. When the floating end 101 moves more than 10μm in the direction away from the fixed end 102, the wedge portions 101a can be engaged with the hook portions 107a, which ensures the stable application of the stretching force and the accurate control of the stretching length. In this embodiment, there are three wedge portions 101a etched on the left and right sides of the floating end 101, respectively. The shapes of the three wedge portions 101a are consistent, and the three wedge portions 101a are arranged continuously to achieve three-speed adjustment.

[0037] The present invention can stretch the polymer film A through a tensile mechanics testing device, and can replace the existing in-situ transmission electron microscope (TEM), thereby avoiding damage to the polymer film A caused by electron beam irradiation during the TEM test and improving the accuracy of the test results.

[0038] Example 2

[0039] like Figure 3 , the difference between this embodiment and embodiment 1 is that the driving probe is adjusted. The force-bearing part 106 of this embodiment is straight, and a rectangular block group 200 and a transmission rod 300 are etched on the surface of the wafer. There are four rectangular block groups 200, and each rectangular block group 200 includes two rectangular blocks 201. The rectangular block group 200 is connected to the transmission rod 300 through a driving rod 400. The driving rod 400 is a three-rod form, two of which are respectively in conflict with two rectangular blocks 201 of a group of rectangular block groups 200, and the third rod of the driving rod 400 is connected with the transmission rod 300 in a wedge shape, while the transmission rod 300 conflicts with the force-bearing part 106. The rectangular block group 200 and the driving rod 400 form a thermal actuator, and the actuator can be alternately heated to alternately push continuously. The material of the driving rod 400 of this embodiment is doped silicon. The pushing distance of the transmission rod 300 is controlled by the thermal actuator, so as to accurately control the tensile displacement of the polymer film A.

[0040] Example 3

[0041] This embodiment provides a manipulation method.

[0042] The manipulation method is based on the tensile mechanics testing apparatus described above.

[0043] The manipulation method includes the following steps:

[0044] S100: pre-treating the polymer film A and the tensile mechanics testing device respectively;

[0045] S101: placing the polymer film A into the cooling chamber of the microtome and cooling it to -85°C;

[0046] S102: Apply the same volume of ethanol solvent to the floating end 101 and the fixed end 102 of the tensile mechanics testing device, respectively. The volume of the ethanol solvent is 1×10 -4 μL, the ethanol solvent was anhydrous ethanol;

[0047] S200: transferring the pretreated polymer film A to the pretreated tensile mechanics testing device;

[0048] S201: Pick up the polymer film A using a driving probe and place it on a tensile mechanics testing device, and the polymer film A covers the ethanol solvent on the floating end 101 and the fixed end 102;

[0049] S300: adjusting the position of the polymer film A so that it covers the stretching area M of the tensile mechanics testing device;

[0050] S301: adjusting the test environment temperature to between -85°C and -100°C so that the ethanol solvent on the floating end 101 and the fixed end 102 melts but does not evaporate, and adjusting the position of the polymer film A so that it covers the stretching area M of the tensile mechanics testing device;

[0051] S400: performing a tensile mechanical test on the polymer film A after fixing it;

[0052] S401: adjusting the test environment temperature to room temperature, evaporating the ethanol solvent, and fixing the edges of both ends of the polymer film A in the length direction on the floating end 101 and the fixed end 102 respectively;

[0053] S500: Record and analyze the deformation behavior of polymer film A during stretching and recovery.

[0054] Under the same test environment, polymer film A was subjected to tensile tests using ethanol solvent and epoxy resin solvent, and ten sets of experimental data were read respectively. The experimental data are as follows:

[0055] Ethanol treatment:

[0056]

[0057] Epoxy resin treatment:

[0058]

[0059]

[0060] The experimental results are analyzed as follows:

[0061] Transmittance comparison:

[0062] The average light transmittance of polymer film A after ethanol treatment is 94.72%, while the average light transmittance after epoxy resin treatment is 70.18%. Obviously, ethanol treatment maintains the transparency of the film, while epoxy resin treatment significantly reduces the light transmittance.

[0063] Bonding layer uniformity comparison:

[0064] The average standard deviation of the bonding layer after ethanol treatment is 1.18 μm, indicating that the bonding layer is relatively uniform; while the average standard deviation of the bonding layer after epoxy resin treatment is 2.71 μm, indicating that the bonding layer is uneven and easily leads to local stress concentration.

[0065] The ethanol treatment maintained the toughness and mechanical properties of the film edge, while the epoxy resin treatment made the film edge brittle.

[0066] Through the above experimental data and analysis, the following conclusions can be drawn:

[0067] Light transmittance: The ethanol solvent treatment was significantly better than the epoxy resin treatment, maintaining the high light transmittance of polymer film A.

[0068] Bond layer uniformity: The bond layer treated with ethanol solvent is more uniform, with a smaller standard deviation, which reduces local stress concentration.

[0069] In summary, ethanol solvent treatment has a better effect on the edge fixation of polymer film A, while epoxy resin treatment will bring negative effects, so epoxy resin is not suitable for this application scenario.

[0070] Based on the above, the beneficial effects of the present invention are:

[0071] 1. Stretching the polymer film A by a tensile mechanics testing device can replace the existing in-situ transmission electron microscope (TEM), avoid the damage to the polymer film A caused by the irradiation of the electron beam during the TEM test, and improve the accuracy of the test results.

[0072] 2. Fixing the test target of the polymer film A of the present invention by using ethanol solvent instead of epoxy resin has better effects on the light transmittance of the edge bonding point of the polymer film A and the uniformity of the bonding layer than fixing the polymer film A by epoxy resin; while the light transmittance and the uniformity of the bonding layer affect the observation or experimental effect during the tensile mechanics test of the polymer film; and the time for the fixing process of the polymer film A by using ethanol solvent is significantly shorter than the curing time of the epoxy resin, achieving unexpected technical effects.

[0073] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A tensile mechanics testing device, It is characterized in that include: A wafer (100), and a floating end (101) and a fixed end (102) formed on the surface of the wafer (100) by etching, wherein the floating end (101) and the fixed end (102) are mutually offset and cross-arranged; A stretching region (M) is formed between the floating end (101) and the fixed end (102), and the stretching region (M) is used to perform a stretching mechanical test on the polymer film (A).

2. The tensile mechanics testing device according to claim 1, It is characterized in that A U-shaped groove (103) is also etched on the surface of the wafer (100), and rectangular grooves (104) are etched on the floating end (101) and the fixed end (102). The rectangular groove (104) is arranged corresponding to the U-shaped groove (103), and a U-shaped elastic portion (105) is formed between the rectangular groove (104) and the U-shaped groove (103); a force-bearing portion (106) is also etched on the floating end (101), and the floating end (101) is driven to move in a direction away from the fixed end (102) by applying force to the force-bearing portion (106).

3. The tensile mechanics testing device according to claim 1 or 2, It is characterized in that A rectangular column (107) is also etched on the surface of the wafer (100), and a hook portion (107a) is provided on the rectangular column (107). A wedge portion (101a) is also etched on the floating end (101), and at least one wedge portion (101a) is provided; when the floating end (101) moves more than 10 μm in a direction away from the fixed end (102), the wedge portion (101a) can be engaged with the hook portion (107a).

4. A method of manipulation, It is characterized in that include: The tensile mechanics testing device according to any one of claims 1 to 3, and Pre-treating the polymer film (A) and the tensile mechanics testing device respectively; Transferring the pretreated polymer film (A) to the pretreated tensile mechanics testing device; Adjusting the position of the polymer film (A) so that it covers the stretching area (M) of the tensile mechanics testing device; Performing a tensile mechanical test on the polymer film (A) after fixing it; The deformation behavior of the polymer film (A) during stretching and recovery is recorded and analyzed.

5. The method of manipulation as claimed in claim 4, It is characterized in that The polymer film (A) was placed in the cooling chamber of a microtome and cooled to -85°C.

6. The method of manipulation according to claim 4, It is characterized in that The same volume of ethanol solvent is applied to the floating end (101) and the fixed end (102) of the tensile mechanics testing device respectively.

7. The method of manipulation as claimed in claim 6, It is characterized in that The volume of ethanol solvent is 1×10 -4 μL.

8. The method of manipulation according to claim 6, It is characterized in that The polymer film (A) is picked up using a driving probe and placed on the tensile mechanics testing device, and the polymer film (A) covers the ethanol solvent on the floating end (101) and the fixed end (102).

9. The manipulation method according to claim 6, It is characterized in that The test environment temperature is adjusted to between -85°C and -100°C so that the ethanol solvent on the floating end (101) and the fixed end (102) melts but does not evaporate, and the position of the polymer film (A) is adjusted so that it covers the stretching area (M) of the tensile mechanics testing device.

10. The manipulation method according to claim 6, It is characterized in that The test environment temperature is adjusted to room temperature, the ethanol solvent evaporates, and the edge positions of both ends of the polymer film (A) in the length direction are fixed on the floating end (101) and the fixed end (102) respectively.

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