Semiconductor module rib cutting and bending equipment

Abstract

The invention discloses semiconductor module rib cutting and bending equipment which comprises a workbench, a feeding device, a module push-out device, a first carrying device, a punching and bending device, a shaping detection device, a second carrying device and a discharging device, and the feeding device, the module push-out device, the first carrying device, the punching and bending device, the shaping detection device, the second carrying device and the discharging device are arranged on the workbench. The module push-out device is used for pushing the frame out of the cartridge holder, and then the first carrying device takes away the frame and places the frame in the punching and bending device. The semiconductor module rib cutting and bending equipment has the beneficial effects that the semiconductor module rib cutting and bending equipment performs Y-direction shaping, X-direction shaping, visual detection and flatness detection on the semiconductor module after punching and bending the semiconductor module, so that the manufactured semiconductor module finished product meets the requirements of the PIN angle + / -1 degree, the PIN position degree + / -0.3 mm, the PIN height + / -0.3 mm, the flatness and the like; and the manufactured semiconductor module product is excellent and high in quality, so that the high-quality product quality requirement of customers is met.

Description

Technical Field

[0001] The invention relates to the field of IGBT products, and in particular to a semiconductor module rib cutting and bending device. Background Art

[0002] With the continuous upgrading of products, IGBT products have been upgraded from potting modules to plastic-encapsulated modules, the overall product performance has been improved, and the structure has been updated to a combination of frame and injection molding, which has led to the development of rib cutting and bending equipment, which is used to punch the frame and bend the PIN of the plastic-encapsulated module. However, the existing rib cutting and bending equipment still has the problem of low rib cutting and bending quality during actual use, which makes it difficult for the manufactured semiconductor module products to meet customers' high-quality product quality requirements. Summary of the invention

[0003] The main purpose of the present invention is to provide a semiconductor module cutting and bending device, aiming to solve the problem that the existing cutting and bending devices cannot produce high-quality semiconductor module products.

[0004] In order to solve the above problems, the present invention proposes a semiconductor module cutting and bending equipment, including a workbench and a loading device, a module pushing device, a first conveying device, a punching and bending device, a shaping and detecting device, a second conveying device and a unloading device arranged on the workbench. A frame with a semiconductor module is placed in the clip conveyed by the loading device. The module pushing device is used to push the frame out of the clip. Then the first conveying device takes the frame and places the frame in the punching and bending device. The punching and bending device punches and bends the semiconductor module in the frame to obtain a finished semiconductor module and separates it from the frame. The shaping and detecting device picks up the finished semiconductor module to perform PIN shaping, visual inspection and flatness inspection in the Y and X directions. After the shaping and detecting is completed, the second conveying device delivers the finished semiconductor module to the unloading device to load it into a tray and basket to complete the unloading.

[0005] In one embodiment, the semiconductor module cutting and bending equipment also includes a laser coding device and a code reading device. The module pushing device pushes the frame from the clip to the laser coding device for laser coding. The frame after laser coding is read by the code reading device, and the frame after code reading is taken away by the transport device.

[0006] In one embodiment, the loading device includes a conveyor line four and a conveyor line five arranged directly above the conveyor line four. The conveyor line four and the conveyor line five are arranged horizontally and parallel to each other, and are fixedly connected to the workbench. The conveyor line four and the conveyor line five can horizontally transfer the magazine. A plurality of stacked frames with semiconductor modules are horizontally slidably inserted in the magazine, and the upper and lower adjacent frames do not contact each other.

[0007] In one embodiment, the module ejection device is located on the same side of conveyor line 4 and conveyor line 5, and the module ejection device includes:

[0008] A second translation device is fixedly connected to the workbench;

[0009] The lifting device 2 is connected to the translation device 2, and the lifting device 2 is driven by the translation device 2 to translate close to or away from the conveying line 4 and the conveying line 5. The translation direction is the same as the conveying direction of the conveying line 4 and the conveying line 5. The lifting device 2 is provided with a mounting plate 2, and the mounting plate 2 is driven by the lifting device 2 to lift close to or away from the conveying line 4 or the conveying line 5. The mounting plate 2 is installed with a lifting device 3, a lower clamping arm and a motor 1. The lower clamping arm is located at the lower end of the lifting device 3, and the upper end of the lifting device 3 is connected to the upper clamping arm. When approaching conveyor line four or conveyor line five and being flush with conveyor line four or conveyor line five, conveyor line four translates the magazine to the lower clamp arm or conveyor line five takes the magazine on the lower clamp arm, and lifting device three drives the upper clamp arm to move downward and cooperate with the lower clamp arm to clamp and fix the magazine, and motor one is located beside the upper clamp arm, and motor one is connected to a slewing block, which is driven by motor one to rotate around its own vertical axis, and a pair of stop pins are arranged at intervals at the lower end of the slewing block and symmetrically distributed on both sides of the axis of the slewing block itself;

[0010] A mounting frame 6 is fixedly connected to the workbench, and a translation device 12 and a mounting plate 8 are arranged on the mounting frame 6. The mounting plate 8 is horizontally slidably connected to the mounting frame 6. The translation device 12 is connected to the mounting plate 8 and is used to drive the mounting plate 8 to slide horizontally on the mounting frame 6, and the sliding direction is the same as the translation direction of the translation device 2;

[0011] A translation device 13 is horizontally slidably mounted on the mounting plate 8, and the sliding direction is perpendicular to the sliding direction of the mounting plate 8. A spring is connected between the translation device 13 and the mounting plate 8, and the expansion and contraction direction of the spring is the same as the sliding direction of the translation device 13;

[0012] A push rod is connected to the translation device 13, and the translation device 13 drives the push rod to move horizontally to push out the frame in the magazine;

[0013] The magazine is open at both ends in the translation direction of the push rod, one end of the push rod enters from the opening at one end of the magazine, and then pushes the frame to extend from the opening at the other end of the magazine, the upper surface of the magazine is provided with grooves at both ends of the opening, a lever that can rotate around a vertical axis is provided in the groove, one end of the lever is connected to a blocking rod, the lever rotates to drive the blocking rod to leave the open end of the magazine or return to the open end of the magazine, when the blocking rod is located at the open end of the magazine, the frame cannot enter or exit the magazine;

[0014] When the magazine is translated onto the lower clamp arm, the rotating block moves horizontally into the groove, and a pair of stop pins are located on both sides of the shifting rod. The motor drives the rotating block to rotate, and the shifting rod is rotated through the pair of stop pins.

[0015] In one embodiment, the laser coding device includes a laser coding machine and a conveyor line six arranged below the laser coding machine. The laser coding machine and the conveyor line six are both fixedly connected to the workbench. The push rod pushes the frame in the magazine onto the conveyor line six, and the conveyor line six conveys the frame to the bottom of the laser coding machine for laser coding.

[0016] In one embodiment, the code reading device includes a mounting frame 2 and a code reader disposed at the upper end of the mounting frame 2, the mounting frame 2 is fixedly connected to the workbench, and the conveyor line 6 conveys the laser-coded frame to the bottom of the code reader for code reading.

[0017] In one embodiment, the transport device 1 and the transport device 2 have the same structure;

[0018] The transport device 1 includes a mounting frame 3 and a three-axis translation mechanism arranged on the mounting frame 3, the three-axis translation mechanism is provided with a motor 2, and the motor 2 is driven by the three-axis translation mechanism to translate along the XYZ three axes, the lower end of the motor 2 is connected to a suction nozzle 1, and the suction nozzle 1 is driven by the motor 2 to rotate around the vertical axis, and the suction nozzle 1 is used to suck the semiconductor module.

[0019] In one embodiment, the punching and bending device comprises:

[0020] Mounting plate three, fixedly connected to the workbench;

[0021] A lower runner rod is horizontally fixedly mounted on the mounting plate 3, and a plurality of lower limit pins arranged at equal intervals are arranged on the lower runner rod along the length direction;

[0022] A pair of flow channel slides are vertically slidably mounted on the mounting plate three and symmetrically arranged on both sides of the lower flow channel rod. The flow channel slides are horizontally arranged, and the frame with the semiconductor module can be placed on the pair of flow channel slides by the handling device one;

[0023] The lifting device 4 is fixedly connected with the mounting plate 3 and the runner slide plate, and is used to drive the runner slide plate to move up and down. When the runner slide plate is lowered, the frame on the runner slide plate contacts the lower runner rod and is limited by the lower limit pin;

[0024] A translation device three, fixedly connected to the workbench;

[0025] The upper runner rod is located directly above the lower runner rod, and a plurality of upper limit pins are arranged on the upper runner rod along the length direction at equal intervals. The upper runner rod, the upper limit pins and the lower runner rod, the lower limit pins are arranged symmetrically up and down. The upper runner rod is connected to the translation device three, and the upper runner rod is driven to move horizontally by the translation device three, and the moving direction is the same as the length direction of the lower runner rod. When the runner slide rises, the frame located on the runner slide contacts the upper runner rod and is limited by the upper limit pins. At this time, the translation device three drives the frame to move horizontally on a pair of runner slides through the upper runner rod and the upper limit pins, and the moving direction is along the length direction of the lower runner rod and the runner slide;

[0026] The punching die comprises a punching movable die, a punching fixed die and a lifting device 5, wherein the punching fixed die is located below the lower runner rod and the runner slide plate and is fixedly connected to the mounting plate 3, the punching movable die is located above the runner slide plate and the upper runner rod and is connected to the lifting device 5, and the lifting device 5 is fixedly connected to the workbench, and the punching movable die is driven to descend through the lifting device 5 to cooperate with the punching fixed die to punch the frame with the semiconductor module;

[0027] The bending die comprises a fixed bending die, a movable bending die and a lifting device 6. The fixed bending die is located below the lower runner rod and the runner slide plate and is fixedly connected to the mounting plate 3. The movable bending die is located above the runner slide plate and the upper runner rod and is connected to the lifting device 6. The lifting device 6 is fixedly connected to the workbench. The movable bending die is driven to descend through the lifting device 6 to cooperate with the fixed bending die to bend the PIN angle of the semiconductor module and separate the semiconductor module from the frame.

[0028] The frame with the semiconductor module moves horizontally on a pair of runner slides, first passing through the punching die and then through the bending die.

[0029] In one embodiment, the shaping detection device comprises:

[0030] The translation device 4 is fixedly connected to the workbench, and a lifting device 7 is arranged on it. The translation device 4 drives the lifting device 7 to move horizontally. The lifting device 7 is connected to a suction nozzle 2, and the suction nozzle 2 is driven to move up and down by the lifting device 7. The suction nozzle 2 can go to the end of the flow channel slide to suck the frame and the semiconductor module under the drive of the translation device 4 and the lifting device 7;

[0031] A translation device 5 is fixedly connected to the workbench, and its translation direction is the same as that of the translation device 4. The translation device 5 is provided with a lifting device 8, which is driven by the translation device 5 to move horizontally. The lifting device 8 is provided with a mounting plate 4, which is driven by the lifting device 8 to move up and down. Five suction nozzles 3 are installed on the mounting plate 4, and the five suction nozzles 3 are arranged in a straight line on the mounting plate 4 along the translation direction of the translation device 5 and are arranged at intervals;

[0032] The carrier 1, the Y-direction shaping mechanism, the X-direction shaping mechanism, the carrier 4, the visual inspection mechanism, and the flatness inspection mechanism are located below the suction nozzle 2 and the suction nozzle 3 and are sequentially arranged along the translation direction of the translation device 5. The carrier 1, the Y-direction shaping mechanism, the X-direction shaping mechanism, and the carrier 4 are installed on the mounting plate 5. The mounting plate 5 is fixedly connected to the workbench. The visual inspection mechanism and the flatness inspection mechanism are fixedly connected to the workbench.

[0033] The Y-direction shaping mechanism comprises:

[0034] A rotating device 1 is fixedly connected to the mounting plate 5, and a carrier 2 is arranged at the upper end of the rotating device 1, and the carrier 2 is driven to rotate around the vertical axis by the rotating device 1;

[0035] A lifting device nine, fixedly connected to the mounting plate five;

[0036] The translation device 6 is connected to the lifting device 9, and the translation device 6 is driven to rise and fall through the lifting device 9;

[0037] The mounting frame five is connected with the translation device six, and the translation device six drives the mounting frame five to move horizontally. The mounting frame five is provided with a shaping block one and a translation device seven. A shaping plate is vertically fixedly installed on the upper end of the shaping block one. The translation device seven is connected with the shaping block two, and the shaping block two is driven to move horizontally close to or away from the shaping plate through the translation device seven. The translation movement direction of the translation device seven is the same as that of the translation device six. The upper end of the shaping plate and the side of the shaping block two close to the shaping plate are both provided with shaping edges that are parallel to each other and of equal height. When the semiconductor module is placed on the carrier two, the bent PIN angle of the semiconductor module extends between a pair of shaping edges, and the PIN angle bent by 90 degrees contacts the shaping edge at the upper end of the shaping plate.

[0038] The X-direction shaping mechanism comprises:

[0039] The second rotating device is fixedly connected to the mounting plate 5, and the upper end of the second rotating device is provided with a carrier 3, and the carrier 3 is driven to rotate around the vertical axis by the second rotating device;

[0040] The translation device 8 is fixedly connected to the mounting plate 5, and its translation direction is perpendicular to the translation direction of the translation device 6;

[0041] A translation device nine is connected to the translation device eight, and is driven by the translation device eight to move horizontally. The translation direction of the translation device nine is the same as that of the translation device six;

[0042] The shaping block 3 is connected to the translation device 9, and the translation device 9 drives the shaping block 3 to move horizontally close to or away from the carrier 3. A shaping rack is provided on the side of the shaping block 3 close to the carrier 3, and a plurality of shaping tooth grooves are provided on the shaping rack. The shaping block 3 moves horizontally close to the carrier 3 so that the bent plurality of PIN corners of the semiconductor module on the carrier 3 can extend into each shaping tooth groove;

[0043] The visual inspection mechanism comprises:

[0044] A mounting plate six is ​​fixedly connected to the workbench, a mounting plate seven is horizontally slidably mounted on the mounting plate six, and a carrier five is arranged on the mounting plate seven;

[0045] The translation device 10 is fixedly mounted on the lower surface of the mounting plate 6 and connected to the mounting plate 7, and is used to drive the mounting plate 7 to slide horizontally;

[0046] The lower vision backlight source and the side vision backlight source are both located above the carrier five and fixedly connected to the mounting plate six;

[0047] The lower vision camera is located directly below the lower vision backlight source and is fixedly connected to the lower surface of the mounting plate 6;

[0048] A side vision camera, mounted on mounting plate six;

[0049] The flatness detection mechanism comprises:

[0050] A translation device eleven, fixedly connected to the workbench;

[0051] The three-dimensional laser line scanner is connected to the translation device 11, and the three-dimensional laser line scanner is driven to move horizontally by the translation device 11;

[0052] A conveyor line 7 is located below the three-dimensional laser line scanner and is fixedly connected to the workbench. The conveying direction of the conveyor line 7 is perpendicular to the translation direction of the translation device 11. A carrier 6 is arranged on the conveyor line 7, and the conveyor line 7 is used to drive the carrier 6 to move horizontally.

[0053] The suction nozzle 2 places the sucked semiconductor module on the carrier 1 under the drive of the translation device 4 and the lifting device 7. The five suction nozzles 3 place the semiconductor module on the carrier 1 on the carrier 2, carrier 3, carrier 4, carrier 5 and carrier 6 in turn under the drive of the translation device 5 and the lifting device 8, so that the semiconductor module undergoes Y-direction shaping, X-direction shaping, visual inspection and flatness inspection in turn.

[0054] In one embodiment, the feeding device comprises:

[0055] A mounting plate 1 is fixedly connected to the workbench, a translation device 1 and a slide rail 1 are arranged on the mounting plate 1, a gripper is connected to the translation device 1, and the gripper is driven to move horizontally by the translation device 1, the gripper holds a tray, and the tray is horizontally slidably mounted on the slide rail 1, the translation device 1 drives the tray to slide horizontally on the slide rail 1 through the gripper, and the handling device 2 picks up the semiconductor module on the carrier 6 and places it on the tray;

[0056] Conveyor line 1 and conveyor line 2 are arranged on the same side of mounting plate 1 and are fixedly connected to the workbench. Conveyor line 1 and conveyor line 2 are arranged horizontally and parallel to each other. Conveyor line 2 is located directly above conveyor line 1. Conveyor line 1 and conveyor line 2 are provided with baskets. Multiple stacked trays are inserted in the baskets for horizontal sliding movement. Two adjacent trays above and below do not touch each other.

[0057] Lifting device 1 is arranged on the same side of conveyor line 1 and conveyor line 2. Conveyor line 3 is arranged on the lifting device 1. Conveyor line 3 is lifted and lowered by lifting device 1. Conveyor line 3 is arranged horizontally. Its conveying direction is the same as that of conveyor line 1 and conveyor line 2. When lifting device 1 drives conveyor line 3 to rise and fall to a position flush with conveyor line 1 or conveyor line 2, conveyor line 1 can translate the basket on it to conveyor line 3 or conveyor line 3 can translate the basket on it to conveyor line 2. The lifting basket on conveyor line 1 and conveyor line 2 has opposite horizontal movement directions. The lifting device 1 drives conveyor line 3 to lift and lower so that each layer of trays in the lifting basket on conveyor line 3 is flush with the slide rail 1. Driven by the translation device 1, the gripper clamps the trays in the lifting basket on conveyor line 3 that are flush with the slide rail 1 and drives the trays to move horizontally to the slide rail 1. After the trays are filled with semiconductor modules, the gripper pushes the trays to move horizontally along the slide rail 1 and enter the lifting basket on conveyor line 3 under the drive of the translation device 1.

[0058] Beneficial effect: The semiconductor module cutting and bending equipment of the present application performs Y-direction shaping, X-direction shaping, visual inspection and flatness inspection on the semiconductor module after punching and bending the semiconductor module, ensuring that the manufactured semiconductor module product meets the requirements of PIN needle angle ±1°, PIN needle position ±0.3mm, needle height ±0.3mm, flatness, etc. The manufactured semiconductor module products are of excellent quality and high quality, thus meeting customers' high-quality product quality requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0060] Figure 1 It is a structural schematic diagram of a semiconductor module cutting and bending device of the present invention;

[0061] Figure 2 is a top view of a semiconductor module rib cutting and bending device of the present invention;

[0062] Figure 3 It is a structural schematic diagram of the feeding device of the present invention;

[0063] Figure 4 The structure of the module ejection device of the present invention is shown in FIG. Figure 1 ;

[0064] Figure 5 yes Figure 4 A magnified view of part A in FIG.

[0065] Figure 6 The structure of the module ejection device of the present invention is shown in FIG. Figure 2 ;

[0066] Figure 7 It is a schematic diagram of the structure of the laser coding device of the present invention;

[0067] Figure 8 It is a structural schematic diagram of the code reading device of the present invention;

[0068] Fig. 9 It is a schematic diagram of the structure of the transport device 1 and the transport device 2 of the present invention;

[0069] Fig.10 It is a schematic structural diagram of the punching and bending device of the present invention;

[0070] Fig.11 yes Fig.10 A magnified view of part B in FIG.

[0071] Fig.12 yes Fig.10 Illustration after removing the punching die and bending die Figure 1 ;

[0072] Fig.13 yes Fig.10 Illustration after removing the punching die and bending die Figure 2 ;

[0073] Fig.14is a schematic diagram of a frame with a semiconductor module;

[0074] Fig.15 is a schematic diagram of a semiconductor module with an unbent PIN corner;

[0075] Fig.16 It is a structural schematic diagram of the shaping detection device of the present invention;

[0076] Fig.17 It is a structural schematic diagram of the Y-direction shaping mechanism of the present invention;

[0077] Fig.18 It is a structural schematic diagram of the X-direction shaping mechanism of the present invention;

[0078] Fig.19 The structure diagram of the visual inspection mechanism of the present invention is shown in FIG. Figure 1 ;

[0079] Fig. 20 The structure of the visual inspection mechanism of the present invention is shown in FIG. Figure 2 ;

[0080] Fig.21 It is a structural schematic diagram of the flatness detection mechanism of the present invention;

[0081] Fig. 22 It is a structural schematic diagram of the blanking device of the present invention;

[0082] Fig.23 It is a structural schematic diagram of the lifting device 1 and the conveying line 3 of the present invention;

[0083] Fig.24 This is a schematic diagram of the structure of the clamping hand of the present invention. Figure 1 ;

[0084] Fig.25 This is a schematic diagram of the structure of the clamping hand of the present invention. Figure 2 .

[0085] The following are the descriptions of the reference numerals:

[0086] 1. Unloading device; 101. Mounting plate 1; 102. Translation device 1; 103. Clamping hand; 1031. Mounting frame 1; 1032. Push-pull device 1; 1033. Fixed clamping arm; 1034. Moving clamping arm; 1035. Rotating shaft 1; 1036. Rotating shaft 2; 104. Slide rail 1; 105. Conveyor line 1; 106. Conveyor line 2; 107. Lifting device 1; 108. Conveyor line 3;

[0087] 2. Loading device; 21. Conveyor line 4; 22. Conveyor line 5;

[0088] 3. Module ejection device; 31. Translation device 2; 32. Lifting device 2; 33. Mounting plate 2; 34. Lifting device 3; 35. Lower clamping arm; 36. Upper clamping arm; 37. Motor 1; 38. Rotating block; 39. Stop pin; 310. Mounting frame 6; 311. Translation device 12; 312. Mounting plate 8; 313. Translation device 13; 314. Spring; 315. Push rod;

[0089] 4. Laser coding device; 41. Laser coding machine; 42. Conveyor line six;

[0090] 5. code reading device; 51. mounting frame 2; 52. code reader;

[0091] 6. Handling device 1; 61. Mounting frame 3; 62. X-axis translation device; 63. Y-axis translation device; 64. Z-axis lifting device; 65. Motor 2; 66. Suction nozzle 1;

[0092] 7. Punching and bending device; 71. Mounting plate three; 72. Lower runner rod; 73. Lower limit pin; 74. Runner slide plate; 75. Translation device three; 76. Upper runner rod; 77. Upper limit pin; 78. Lifting device four; 79. Punching moving die; 710. Punching fixed die; 711. Lifting device five; 712. Bending fixed die; 713. Bending moving die; 714. Lifting device six; 715. Accommodating groove;

[0093] 8. Shaping inspection device; 81. Translation device 4; 82. Lifting device 7; 83. Suction nozzle 2; 84. Translation device 5; 85. Lifting device 8; 86. Mounting plate 4; 87. Suction nozzle 3; 88. Mounting plate 5; 89. Carrier 1;

[0094] 810, Y-direction shaping mechanism; 8100, shaping plate; 8101, lifting device nine; 8102, mounting frame four; 8103, translation device six; 8104, mounting frame five; 8105, translation device seven; 8106, shaping block one; 8107, shaping block two; 8108, rotating device one; 8109, carrier two; 8110, shaping edge;

[0095] 811, X-direction shaping mechanism; 8111, translation device eight; 8112, translation device nine; 8113, shaping block three; 8114, shaping rack; 8115, shaping tooth groove; 8116, rotation device two; 8117, carrier three;

[0096] 812, Vehicle 4;

[0097] 813, visual inspection mechanism; 8131, mounting plate six; 8132, lower visual camera; 8133, lower visual backlight source; 8134, mounting plate seven; 8135, translation device ten; 8136, slide rail two; 8137, carrier five; 8138, side visual backlight source; 8139, side visual camera;

[0098] 814, flatness detection mechanism; 8141, bracket; 8142, translation device eleven; 8143, three-dimensional laser line scanner; 8144, conveyor line seven; 8145, carrier six;

[0099] 10. Workbench; 11. Transport device 2; 12. Tray; 13. Semiconductor module; 14. Basket; 15. Clip; 16. Frame; 161. Connecting ribs; 162. Pin removal line; 163. Connecting strip; 17. Groove; 18. Lever; 19. Stop lever. DETAILED DESCRIPTION

[0100] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0101] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0102] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0103] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0104] The present invention proposes a semiconductor module cutting and bending equipment, which performs Y-direction shaping, X-direction shaping, visual inspection and flatness inspection on the semiconductor module 13 after punching and bending the semiconductor module 13, thereby ensuring that the manufactured semiconductor module 13 meets the requirements of PIN needle angle ±1°, PIN needle position ±0.3mm, needle height ±0.3mm, flatness, etc. The manufactured semiconductor module 13 product has excellent quality and high quality, thereby meeting the customer's high-quality product quality requirements.

[0105] Specifically, in one embodiment of the invention, Figure 1 and Figure 2 As shown, the semiconductor module cutting and bending equipment includes a workbench 10 and a loading device 2, a module pushing device 3, a conveying device 1 6, a punching and bending device 7, a shaping and detecting device 8, a conveying device 2 11, and a unloading device 1 arranged on the workbench 10. The frame 16 with the semiconductor module 13 is placed in the clip 15 conveyed by the loading device 2. The module pushing device 3 is used to push the frame 16 out of the clip 15. Then the conveying device 1 6 takes the frame 16 and places the frame 16 in the punching and bending device 7. The punching and bending device 7 punches and bends the semiconductor module 13 in the frame 16 to obtain a finished semiconductor module 13 and separates it from the frame 16. The shaping and detecting device 8 picks up the finished semiconductor module 13 to perform PIN shaping, visual inspection, and flatness inspection in the Y and X directions. After the shaping and detecting is completed, the conveying device 2 11 delivers the finished semiconductor module 13 to the unloading device 1 to load it into a tray and basket to complete the unloading.

[0106] Further, such as Figure 1 and Figure 2As shown, the semiconductor module cutting and bending equipment also includes a laser coding device 4 and a code reading device 5. The module pushing device 3 pushes the frame 16 from the clip 15 to the laser coding device 4 for laser coding. The frame 16 after laser coding is read by the code reading device 5, and the frame 16 after code reading is taken away by the transport device 6.

[0107] Specifically, Figure 3 As shown, the feeding device 2 includes a conveyor line 21 and a conveyor line 22 arranged directly above the conveyor line 21. The conveyor line 21 and the conveyor line 22 are arranged horizontally and parallel to each other, and are fixedly connected to the workbench 10. The conveyor line 21 and the conveyor line 22 can horizontally transfer the magazine 15, and the transfer direction is as shown in FIG. Figure 3 As shown by the middle arrow, a plurality of stacked frames 16 with semiconductor modules 13 are inserted into the clip 15 for horizontal sliding, and two adjacent frames 16 are not in contact with each other. This design makes it easy to push the frames 16 out of the clip 15.

[0108] Specifically, Figure 4-Figure 6 As shown, the module ejection device 3 is located on the same side of the conveyor line four 21 and the conveyor line five 22, and the module ejection device 3 includes: a translation device two 31, a lifting device two 32, a mounting frame six 310, a translation device thirteen 313, and a push rod 315. The translation device two 31 is fixedly connected to the workbench 10; the lifting device two 32 is connected to the translation device two 31, and the lifting device two 32 is driven by the translation device two 31 to move horizontally close to or away from the conveyor line four 21 and the conveyor line five 22, and the horizontal movement direction is the same as the conveying direction of the conveyor line four 21 and the conveyor line five 22.

[0109] In this embodiment, if Figure 4 and Figure 6 As shown, the lifting device 2 32 is provided with a mounting plate 2 33, and the lifting device 2 32 drives the mounting plate 2 33 to rise and fall close to or away from the conveyor line 4 21 or the conveyor line 5 22. The mounting plate 2 33 is installed with a lifting device 3 34, a lower clamping arm 35 and a motor 1 37. The lower clamping arm 35 is located at the lower end of the lifting device 3 34, and the upper end of the lifting device 3 34 is connected to the upper clamping arm 36. When the lower clamping arm 35 is close to the conveyor line 4 21 or the conveyor line 5 22 and is flush with the conveyor line 4 21 or the conveyor line 5 22, the conveyor line 4 21 translates the clip 15 to the lower clamping arm 35 or the conveyor line 5 22 takes the clip 15 off the lower clamping arm 35, and the lifting device 3 34 drives the upper clamping arm 36 to move downward to cooperate with the lower clamping arm 35 to clamp and fix the clip 15.

[0110] In this embodiment, if Figure 5As shown, the motor 37 is located next to the upper clamping arm 36, and the lower end of the motor 37 is connected to a rotating block 38, which is driven by the motor 37 to rotate around its own vertical axis. The lower end of the rotating block 38 has a pair of stop pins 39 that are spaced apart and symmetrically distributed on both sides of the axis of the rotating block 38 itself.

[0111] In this embodiment, if Figure 4 and Figure 6 As shown, the six mounting frames 310 are fixedly connected to the workbench 10, and the six mounting frames 310 are provided with a translating device 12 311 and a mounting plate 8 312. The mounting plate 8 312 is horizontally slidably connected to the six mounting frames 310. The translating device 12 311 is connected to the mounting plate 8 312, and is used to drive the mounting plate 8 312 to slide horizontally on the six mounting frames 310, and the sliding direction is the same as the translation direction of the translating device 2 31; the translating device 13 313 is horizontally slidably installed on the mounting plate 8 312, The sliding direction is perpendicular to the sliding direction of the mounting plate eight 312. A spring 314 is connected between the translation device thirteen 313 and the mounting plate eight 312. The extension and contraction direction of the spring 314 is the same as the sliding direction of the translation device thirteen 313. The push rod 315 is connected to the translation device thirteen 313. The translation device thirteen 313 drives the push rod 315 to move horizontally to push out the frame 16 in the magazine 15. The horizontal moving direction of the push rod 315 is the same as the horizontal sliding direction of the translation device thirteen 313.

[0112] In this embodiment, if Figure 5 and Figure 6 As shown, the two ends of the magazine 15 located in the translation direction of the push rod 315 are open, one end of the push rod 315 enters from the opening of one end of the magazine 15, and then pushes the frame 16 to extend from the opening of the other end of the magazine 15, and the upper surface of the magazine 15 is provided with grooves 17 at both ends of the opening, and a lever 18 that can rotate around a vertical axis is provided in the groove 17, one end of the lever 18 is connected to a blocking rod 19, and the rotation of the lever 18 drives the blocking rod 19 to leave the open end of the magazine 15 or return to the open end of the magazine 15, when the blocking rod 19 is located at the open end of the magazine 15, the frame 16 cannot enter or exit the magazine 15, thereby protecting the safety of the frame 16 in the magazine 15 and preventing the frame 16 in the magazine 15 from sliding out and falling during the movement of the magazine 15.

[0113] In this embodiment, when the translation device 2 31 and the lifting device 2 32 drive the lower clamping arm 35 to approach the conveyor line 4 21 and are flush with the conveyor line 4 21, the conveyor line 4 21 can horizontally transfer the clip 15 thereon to the lower clamping arm 35, and then the lifting device 3 34 drives the upper clamping arm 36 to descend to cooperate with the lower clamping arm 35 to clamp and fix the clip 15. In the process of the conveyor line 4 21 horizontally transferring the clip 15 thereon to the lower clamping arm 35, the rotating block 38 moves horizontally into the groove 17, and a pair of stop pins 39 are located on both sides of the shifting rod 18, as shown in FIG. Figure 5 As shown, the design is such that at this moment, the motor 1 37 drives the rotating block 38 to rotate, and the lever 18 is driven to rotate through a pair of stop pins 39. The rotation of the lever 18 drives the stop rod 19 to leave the open end of the magazine 15, and then the translation device 12 311 drives the push rod 315 to translate to the working position, and then the translation device 13 313 drives the push rod 315 to move horizontally to push out the frame 16 in the magazine 15. After pushing out one frame 16, the lifting device 2 32 drives the next frame 16 to rise to a position flush with the push rod 315, and then the push rod 315 continues to move horizontally to push out the next frame 16, and this cycle is repeated until all the frames 16 in the entire magazine 15 are pushed out, and then the lifting device 2 32 drives the empty magazine 15 to rise to a position where the lower clamping arm 35 is flush with the conveyor line 5 22. The second translation device 31 then drives the lower clamp arm 35 close to the conveyor line five 22, so that the empty magazine 15 is partially located on the conveyor line five 22, and then the conveyor line five 22 is started to remove the empty magazine 15 on the lower clamp arm 35, and then the lifting device 2 32 drives the lower clamp arm 35 to descend to a position flush with the conveyor line four 21, and the conveyor line four 21 conveys the next magazine 15 to the lower clamp arm 35, and then the lifting device three 34 drives the upper clamp arm 36 to descend and cooperate with the lower clamp arm 35 to clamp and fix the magazine 15, and then the translation device 2 31 drives the lower clamp arm 35 away from the conveyor line four 21 to prevent the lifting device 2 32 from driving the magazine 15 to collide with the conveyor line four 21 and the conveyor line five 22 during the lifting process, and then repeat the above-mentioned actions, and use the push rod 315 to push out each layer of the frame 16 in the magazine 15 layer by layer.

[0114] In this embodiment, the setting of the spring 314 can prevent the push rod 315 from hitting the frame 16 or damaging the push rod 315 and the magazine 15 when the push rod 315 is not flush with the frame 16. When the push rod 315 is not flush with the frame 16, the push rod 315 will hit the magazine 15 when it moves horizontally, and it cannot be smoothly pushed out of the frame 16. The magazine 15 is fixed and the spring 314 will be stretched at this moment, and drive the translation device thirteen 313 to slide horizontally, buffering the impact of the push rod 315 on the magazine 15, thereby avoiding damage to the push rod 315 and the magazine 15 and protecting the safety of the push rod 315 and the magazine 15.

[0115] In this embodiment, if Figure 7As shown, the laser coding device 4 includes a laser coding machine 41 and a conveyor line 6 42 arranged below the laser coding machine 41. The laser coding machine 41 and the conveyor line 6 42 are both fixedly connected to the workbench 10. The push rod 315 pushes the frame 16 in the clip 15 onto the conveyor line 6 42, and the conveyor line 6 42 conveys the frame 16 to the bottom of the laser coding machine 41 for laser coding. The laser coding machine 41 performs a two-dimensional code engraving on the semiconductor module 13 in the frame 16, and codes the semiconductor module 13 by compiling a serial code, date, logo, etc.

[0116] In this embodiment, if Figure 8 As shown, the code reading device 5 includes a mounting frame 51 and a code reader 52 arranged at the upper end of the mounting frame 51. The mounting frame 51 is fixedly connected to the workbench 10. The conveyor line 6 42 conveys the laser-coded frame 16 to the bottom of the code reader 52 for code reading. The code reader 52 performs a two-dimensional code rating on the two-dimensional code product engraved by the laser coding machine 41, and the rating reaches B level or above for passing.

[0117] In this embodiment, the transport device 1 6 and the transport device 2 11 have the same structure, so only the specific structure of the transport device 1 6 will be described in detail later. Fig. 9 As shown, the transport device 1 6 includes a mounting frame 3 61 and a three-axis translation mechanism arranged on the mounting frame 3 61, and a motor 2 65 is arranged on the three-axis translation mechanism, and the motor 2 65 is driven by the three-axis translation mechanism to translate along the XYZ three axes. The mounting frame 3 61 is fixedly connected to the workbench 10, and the three-axis translation mechanism includes an X-axis translation device 62, a Y-axis translation device 63, and a Z-axis lifting device 64. The lower end of the motor 2 65 is connected to a suction nozzle 1 66, and the suction nozzle 1 66 is driven by the motor 2 65 to rotate around the vertical axis. The suction nozzle 1 66 is used to suck semiconductors. Module 13, specifically, the transport device 16 sucks the semiconductor module 13 after code reading on the conveyor line 6 42 through a suction nozzle 1 66, and the qualified semiconductor module 13 is transferred to the punching and bending device 7, and the unqualified semiconductor module 13 is transferred to the NG material box, and the NG material box is located on the workbench 10; the transport device 2 11 sucks the semiconductor module 13 after flatness inspection on the carrier 6 8145 through a suction nozzle 1 66, and the qualified semiconductor module 13 is transferred to the unloading device 1, and the unqualified semiconductor module 13 is transferred to the NG material box.

[0118] In this embodiment, if Fig.10As shown, the punching and bending device 7 includes: a mounting plate 3 71, a lower runner rod 72, a pair of runner slides 74, a lifting device 4 78, a translation device 3 75, an upper runner rod 76, a punching die, and a bending die. The mounting plate 3 71 is fixedly connected to the workbench 10; the lower runner rod 72 is horizontally fixedly mounted on the mounting plate 3 71, as shown in FIG. Fig.12 As shown, the lower flow channel rod 72 is provided with a plurality of lower limit pins 73 arranged at equal intervals along the length direction; a pair of flow channel slides 74 are vertically slidably mounted on the mounting plate 3 71 and symmetrically arranged on both sides of the lower flow channel rod 72, and the flow channel slides 74 are arranged horizontally, and the frame 16 with the semiconductor module 13 can be placed on the handling device 16 Fig.10 and Fig.12 The left end of a pair of flow channel slides 74; Fig.13 As shown, the lifting device 4 78 is fixedly connected to the mounting plate 3 71 and the flow channel slide 74, and is used to drive the flow channel slide 74 to move up and down. When the flow channel slide 74 is lowered, the frame 16 located on the flow channel slide 74 contacts the lower flow channel rod 72 and is limited by the lower limit pin 73, as shown in FIG. Fig.12 As shown, with this design, the multiple frames 16 on the flow channel slide 74 can be arranged at equal intervals by means of the lower limit pin 73, which is convenient for subsequent punching and bending, thereby improving the efficiency of punching and bending operations. Accordingly, after the flow channel slide 74 is lowered, the frame 16 with the semiconductor module 13 is transferred to the conveying device 6. Fig.10 and Fig.12 The left end of the pair of flow channel slides 74 is directly limited by the lower limit pin 73 at the leftmost end.

[0119] In this embodiment, if Fig.12 As shown, the translation device 3 75 is fixedly connected to the workbench 10; the upper runner rod 76 is located directly above the lower runner rod 72, and a plurality of upper limit pins 77 are arranged at equal intervals along the length direction on the upper runner rod 76, and the upper runner rod 76, the upper limit pins 77 and the lower runner rod 72, the lower limit pins 73 are arranged symmetrically up and down. This design makes it convenient to move a pair of frames 16 with semiconductor modules 13 arranged at equal intervals on the runner slide 74 through a plurality of upper limit pins 77 to translate synchronously in the same direction along the length direction of the runner slide 74 at the same time, thereby realizing assembly line punching and bending operations and improving the efficiency of punching and bending operations. Specifically, Fig.12As shown, the upper flow channel rod 76 is connected to the translation device three 75, and the upper flow channel rod 76 is driven by the translation device three 75 to move horizontally, and the moving direction is the same as the length direction of the lower flow channel rod 72. When the flow channel slide 74 rises, the frame 16 located on the flow channel slide 74 is separated from the lower flow channel rod 72 and the lower limit pin 73. At the same time, the frame 16 located on the flow channel slide 74 contacts the upper flow channel rod 76 and is limited by the upper limit pin 77. At this time, the translation device three 75 drives all the frames 16 to move horizontally and synchronously in the same direction on a pair of flow channel slides 74 through the upper flow channel rod 76 and the upper limit pin 77, and the moving direction is along the length direction of the lower flow channel rod 72 and the flow channel slide 74.

[0120] In this embodiment, if Fig.10 As shown, the punching die includes a punching die 79, a punching fixed die 710 and a lifting device 5 711. The punching fixed die 710 is located below the lower runner rod 72 and the runner slide 74, and is fixedly connected to the mounting plate 3 71. The punching die 79 is located above the runner slide 74 and the upper runner rod 76, and is connected to the lifting device 5 711. The lifting device 5 711 is fixedly connected to the workbench 10, and the punching die 79 is driven to descend through the lifting device 5 711 to cooperate with the punching fixed die 710 to punch the semiconductor module 1 with the punching die 79. 3, specifically, three working acupoints are arranged at equal intervals on the punching movable mold 79 and the punching fixed mold 710 along the moving direction of the frame 16, which are respectively recorded as acupoint 1, acupoint 2, and acupoint 3. Acupoint 1 is used to shape the glue port on the frame 16 with the semiconductor module 13, and glue port shaping belongs to the common knowledge in the injection molding industry. Acupoint 2 is used to cut off the connecting rib 161 on the frame 16 with the semiconductor module 13. Acupoint 3 is used to cut off the pins on the frame 16 with the semiconductor module 13. The frame 16 with the semiconductor module 13 is as shown in FIG. Fig.14 As shown, acupoint 2 is used to cut the connecting tendon 161, and acupoint 3 is used to cut the pin along the pin cutting line 162. After the semiconductor module 13 is punched by acupoints 1, 2, and 3, as shown in FIG. Fig.15 As shown, at this time, the semiconductor module 13 is not completely separated from the frame 16 and is only fixedly connected via the connecting strip 163 .

[0121] In this embodiment, if Fig.10As shown, the bending mold includes a bending fixed mold 712, a bending movable mold 713, and a lifting device 6 714. The bending fixed mold 712 is located below the lower runner rod 72 and the runner slide 74, and is fixedly connected to the mounting plate 3 71. The bending movable mold 713 is located above the runner slide 74 and the upper runner rod 76, and is connected to the lifting device 6 714. The lifting device 6 714 is fixedly connected to the workbench 10. The bending movable mold 713 is driven to descend by the lifting device 6 714 to cooperate with the bending fixed mold 712 to bend the PIN angle of the semiconductor module 13 and completely separate the semiconductor module 13 from the frame 16. The moving direction of the frame 16 on the runner slide 74 is as shown in FIG. Fig.10 As shown by the middle arrow, the frame 16 with the semiconductor module 13 moves horizontally on a pair of flow channel slides 74, first passes through the punching mold, and then passes through the bending mold. Three working acupoints are equidistantly arranged on the bending fixed mold 712 and the bending movable mold 713 along the moving direction of the frame 16, which are respectively recorded as acupoint four, acupoint five, and acupoint six. Acupoint four is used to pre-bend the PIN angle of the semiconductor module 13 by 45°, and acupoint two is used to continue bending the PIN angle of the semiconductor module 13 by 45°, thereby completing the work of bending the PIN angle by 90°. Acupoint three is used to cut off the connecting strip 163 to completely separate the semiconductor module 13 from the frame 16.

[0122] In this embodiment, the translation device 3 75 drives all the frames 16 arranged at equal intervals to move horizontally and synchronously in the same direction on a pair of flow channel slides 74 through the upper flow channel rod 76 and the upper limit pin 77, and only moves one acupoint at a time, so that each frame 16 with a semiconductor module 13 can pass through acupoint one, acupoint two, acupoint three, acupoint four, acupoint five, and acupoint six in sequence, and complete the processes of glue mouth shaping, rib 161 removal, pin removal, PIN angle pre-bending 45°, PIN angle further bending 45°, connecting strip 163 removal, and complete separation of the semiconductor module 13 from the frame 16, thereby realizing assembly line punching and bending operations and improving punching and bending operation efficiency.

[0123] In this embodiment, if Fig.11 As shown, the lower surfaces of the punching movable die 79 and the bending movable die 713 are both provided with a receiving groove 715, and the receiving groove 715 is used to accommodate the upper runner rod 76 and the upper limit pin 77 to prevent the upper runner rod 76 and the upper limit pin 77 from affecting the punching and bending operations.

[0124] In this embodiment, if Figure 1 , Figure 2 and Fig.16 As shown, the shaping detection device 8 includes: a translation device 4 81, a translation device 5 84, a carrier 1 89, a Y-direction shaping mechanism 810, an X-direction shaping mechanism 811, a carrier 4 812, a visual detection mechanism 813, and a flatness detection mechanism 814. Fig.16 As shown, the translation device 4 81 is fixedly connected to the workbench 10, and a lifting device 7 82 is arranged on it. The translation device 4 81 drives the lifting device 7 82 to move horizontally. The lifting device 7 82 is connected to the suction nozzle 2 83, and the suction nozzle 2 83 is driven to move up and down by the lifting device 7 82. The suction nozzle 2 83 can move forward under the drive of the translation device 4 81 and the lifting device 7 82. Fig.10 The right end of the middle channel slide 74 absorbs the punched and bent frame 16 and semiconductor module 13, and places the frame 16 in a material box, and places the bent semiconductor module 13 on a carrier 89, and the material box is installed on the workbench 10.

[0125] In this embodiment, if Fig.16 As shown, the translation device five 84 is fixedly connected to the workbench 10, and its translational movement direction is the same as that of the translation device four 81. The translation device five 84 is provided with a lifting device eight 85, which is driven by the translation device five 84 to move horizontally. The lifting device eight 85 is provided with a mounting plate four 86, which is driven by the lifting device eight 85 to move up and down. Five suction nozzles three 87 are installed on the mounting plate four 86. The five suction nozzles three 87 are arranged in a straight line on the mounting plate four 86 along the translational movement direction of the translation device five 84 and are arranged at intervals. With this design, the bent semiconductor module 13 can be placed from the carrier one 89 to the carrier two 8109, the carrier three 8117, the carrier four 812, the carrier five 8137, and the carrier six 8145 in sequence, so that the bent semiconductor module 13 can be successively subjected to Y-direction shaping, X-direction shaping, visual inspection and flatness inspection.

[0126] Specifically, in this embodiment, if Figure 1 , Figure 2 and Fig.16 As shown, carrier one 89, Y-direction shaping mechanism 810, X-direction shaping mechanism 811, carrier four 812, visual inspection mechanism 813, and flatness inspection mechanism 814 are located below suction nozzle two 83 and suction nozzle three 87 and are arranged in sequence along the translation direction of translation device five 84. The carrier one 89, Y-direction shaping mechanism 810, X-direction shaping mechanism 811, and carrier four 812 are installed on mounting plate five 88, and the mounting plate five 88 is fixedly connected to the workbench 10. The visual inspection mechanism 813 and flatness inspection mechanism 814 are fixedly connected to the workbench 10. With this design, the translation device five 84 drives the five suction nozzles three 87 to move simultaneously to transfer the bent semiconductor module 13 from the previous carrier to the next carrier. Specifically, Fig.16From left to right, the first suction nozzle 3 87 transfers the bent semiconductor module 13 on the carrier 1 89 to the carrier 2 8109 under the drive of the translation device 5 84 and the lifting device 85. The second suction nozzle 3 87 transfers the bent semiconductor module 13 on the carrier 2 8109 to the carrier 3 8117 under the drive of the translation device 5 84 and the lifting device 85. The third suction nozzle 3 87 transfers the bent semiconductor module 13 on the carrier 3 8117 to the carrier 4 812 under the drive of the translation device 5 84 and the lifting device 85. The fourth suction nozzle 3 87 transfers the bent semiconductor module 13 on the carrier 4 812 to the carrier 4 817 under the drive of the translation device 5 84 and the lifting device 85. The semiconductor module 13 is sent to the carrier five 8137, and the fifth suction nozzle three 87 is driven by the translation device five 84 and the lifting device eight 85 to transfer the bent semiconductor module 13 on the carrier five 8137 to the carrier six 8145. The above five suction nozzles three 87 act synchronously, so that the bent semiconductor module 13 is placed from the carrier one 89 to the carrier two 8109, the carrier three 8117, the carrier four 812, the carrier five 8137, and the carrier six 8145 in turn, so that the bent semiconductor module 13 is successively subjected to Y-direction shaping, X-direction shaping, visual inspection and flatness inspection, thereby realizing assembly line-type semiconductor module 13 shaping and inspection, thereby improving the shaping and inspection efficiency of the semiconductor module 13.

[0127] Specifically, Fig.16 and Fig.17 As shown, the Y-direction shaping mechanism 810 includes: a rotating device 8108, a lifting device 8101, a translation device 8103, and a mounting frame 8104. The rotating device 8108 is fixedly connected to the mounting plate 88. The upper end of the rotating device 8108 is provided with a carrier 8109. The rotating device 8108 drives the carrier 8109 to rotate around the vertical axis to adjust the direction of the bent semiconductor module 13, thereby improving the compatibility requirements; the lifting device 8101 is fixedly connected to the mounting plate 88. The upper end of the lifting device 8101 is fixedly installed with a mounting frame 8102, and the translation device 8109 is fixedly installed on the mounting frame 8102. 8103, the translation device 6 8103 is driven to rise and fall through the lifting device 9 8101; the mounting frame 5 8104 is connected with the translation device 6 8103, and the translation device 6 8103 drives the mounting frame 5 8104 to move horizontally, and the mounting frame 5 8104 is provided with a shaping block 1 8106 and a translation device 7 8105, and the upper end of the shaping block 1 8106 is vertically fixed with a shaping plate 8100, and the translation device 7 8105 is connected to the shaping block 2 8107, and the shaping block 2 8107 is driven to move horizontally close to or away from the shaping plate 8100 through the translation device 7 8105, and the translation action direction of the translation device 7 8105 is the same as that of the translation device 6 8103, as shown in FIG. Fig.17As shown, the upper end of the shaping plate 8100 and the side of the shaping block 8107 close to the shaping plate 8100 are both provided with shaping edges 8110 that are parallel to each other and of equal height. When the semiconductor module 13 is placed on the carrier 8109, the bent PIN corner of the semiconductor module 13 extends between a pair of shaping edges 8110, and the PIN corner bent by 90 degrees contacts the shaping edge 8110 at the upper end of the shaping plate 8100. Accordingly, if the PIN corner is not bent In place, it does not contact the shaping edge 8110 at the upper end of the shaping plate 8100. Therefore, a pair of shaping edges 8110 are driven to move to the shaping position by the lifting device nine 8101 and the translation device six 8103. Then the translation device seven 8105 drives a pair of shaping edges 8110 to approach each other to shape the PIN angle in the Y direction, so that the PIN angle is bent into place. This can ensure that the PIN angle is bent 90 degrees, ensuring that the bending angle of the PIN angle meets the requirement of 90°±1°.

[0128] Specifically, in this embodiment, if Fig.16 and Fig.18 As shown, the X-direction shaping mechanism 811 includes: a second rotating device 8116, a translation device 8111, a translation device 8112, and a shaping block 8113. The second rotating device 8116 is fixedly connected to the mounting plate 88. A carrier 8117 is arranged on the upper end of the second rotating device 8116. The carrier 8117 is driven to rotate around the vertical axis by the second rotating device 8116. The translation device 8111 is fixedly connected to the mounting plate 88. The translation direction and the translation device 8112 are The translation direction of the six 8103 is vertical; the translation device nine 8112 is connected to the translation device eight 8111, and the translation device eight 8111 drives the translation device nine 8112 to move horizontally, and the translation direction of the translation device nine 8112 is the same as the translation direction of the translation device six 8103; the shaping block three 8113 is connected to the translation device nine 8112, and the shaping block three 8113 is driven by the translation device nine 8112 to move horizontally close to or away from the carrier three 8117, such as Fig.18 As shown, a shaping rack 8114 is provided on one side of the shaping block three 8113 close to the carrier three 8117, and a plurality of shaping tooth grooves 8115 are provided on the shaping rack 8114. The shaping block three 8113 is horizontally moved close to the carrier three 8117 so that a plurality of bent PIN corners of the semiconductor module 13 on the carrier three 8117 can extend into each of the shaping tooth grooves 8115, and the bent PIN angles are shaped in the X direction with the help of the shaping tooth grooves 8115 to avoid the bent PIN angles from tilting, to ensure that the bent PIN angles are vertical, and to ensure that the position of the PIN angles in the X direction meets the ±0.3MM accuracy requirement.

[0129] Specifically, in this embodiment, if Fig.19 and Fig. 20 As shown, the visual inspection mechanism 813 includes: a mounting plate 6 8131, a translation device 10 8135, a lower visual backlight source 8133 and a side visual backlight source 8138, a lower visual camera 8132, and a side visual camera 8139. The mounting plate 6 8131 is fixedly connected to the workbench 10, and a mounting plate 7 8134 is horizontally slidably installed on the mounting plate 6 8131 through a slide rail 2 8136, and a carrier 5 8137 is arranged on the mounting plate 7 8134; the translation device 10 The ten 8135 is fixedly mounted on the lower surface of the six mounting plates 8131 and connected to the seven mounting plates 8134, and is used to drive the seven mounting plates 8134 to slide horizontally; the lower visual backlight source 8133 and the side visual backlight source 8138 are both located above the carrier five 8137 and are fixedly connected to the six mounting plates 8131; the lower visual camera 8132 is located directly below the lower visual backlight source 8133 and is fixedly connected to the lower surface of the six mounting plates 8131; the side visual camera 8139 It is arranged on the mounting plate six 8131; after the semiconductor module 13 is placed on the carrier five 8137, the translation device ten 8135 drives the carrier five 8137 to slide horizontally along the slide rail two 8136 to the lower visual detection position, and then the lower visual camera 8132 and the lower visual backlight source 8133 cooperate with each other to take pictures of the semiconductor module 13, and transmit the photographing information to the computer for identification and analysis processing, and visually detect whether the position of the PIN angle of the semiconductor module 13 in the X direction meets the ±0.3MM accuracy requirement, and then, the translation device ten 8135 drives the carrier five 8137 to slide horizontally along the slide rail two 8136 to the side visual detection position, and the side visual camera 8139 and the side visual backlight source 8138 cooperate with each other to take pictures of the semiconductor module 13, and transmit the photographing information to the computer for identification and analysis processing, and visually detect whether the bending angle of the PIN angle of the semiconductor module 13 meets the requirement of 90°±1° and whether the PIN needle height meets the requirement of ±0.3mm.

[0130] Specifically, in this embodiment, if Fig.21As shown, the flatness detection mechanism 814 includes: a translation device 11 8142, a three-dimensional laser line scanner 8143, and a conveyor line 7 8144. The translation device 11 8142 is fixedly mounted on a bracket 8141, and the bracket 8141 is made of marble. The bracket 8141 is fixedly connected to the workbench 10. The three-dimensional laser line scanner 8143 is connected to the translation device 11 8142, and the three-dimensional laser line scanner 8143 is driven to move horizontally by the translation device 11 8142; the conveyor line 7 8144 is located below the three-dimensional laser line scanner 8143 and is fixedly connected to the workbench 10. The conveying direction of the conveyor line seven 8144 is perpendicular to the translation direction of the translation device eleven 8142. A carrier six 8145 is arranged on the conveyor line seven 8144. The conveyor line seven 8144 is used to drive the carrier six 8145 to move horizontally and pass under the three-dimensional laser line scanner 8143. The three-dimensional laser line scanner 8143 is used to detect the flatness of the semiconductor module 13 on the carrier six 8145. The three-dimensional laser line scanner 8143 irradiates the detection surface of the entire semiconductor module 13 with a line laser, detects the height data and feeds back, and compares it with the required value to determine whether the flatness of the semiconductor module 13 is qualified.

[0131] In this embodiment, the suction nozzle 2 83 places the sucked semiconductor module 13 on the carrier 1 89 under the drive of the translation device 4 81 and the lifting device 7 82. The five suction nozzles 3 87 place the semiconductor module 13 on the carrier 1 89 on the carrier 2 8109, the carrier 3 8117, the carrier 4 812, the carrier 5 8137 and the carrier 6 8145 in sequence under the drive of the translation device 5 84 and the lifting device 85, so that the semiconductor module 13 undergoes Y-direction shaping, X-direction shaping, visual inspection and flatness inspection in sequence.

[0132] In this embodiment, if Fig. 22 As shown, the unloading device 1 includes: a mounting plate 101, a conveyor line 105 and a conveyor line 2 106, and a lifting device 107. The mounting plate 101 is fixedly connected to the workbench 10. A translation device 102 and a slide rail 104 are arranged on the mounting plate 101. The translation device 102 is connected to a gripper 103, and the gripper 103 is driven to move horizontally by the translation device 102. The gripper 103 grips a tray 12, and the tray 12 is horizontally moved. The slide rail 104 is slidably installed, and the slide rail 104 is fixedly connected to the mounting plate 101. The translation device 102 drives the tray 12 to slide horizontally on the slide rail 104 through the clamp 103. The transport device 11 picks up the qualified semiconductor module 13 on the carrier 6 8145 and places it on the tray 12. The transport device 11 picks up the unqualified semiconductor module 13 on the carrier 6 8145 and places it into the NG material box.

[0133] In this embodiment, if Fig. 22 As shown, the conveyor line 105 and the conveyor line 2 106 are arranged on the same side of the mounting plate 101 and are fixedly connected to the workbench 10. The conveyor line 105 and the conveyor line 2 106 are arranged horizontally and parallel to each other. The conveyor line 2 106 is located directly above the conveyor line 105. The conveyor line 105 and the conveyor line 2 106 are provided with a basket 14. A plurality of stacked trays 12 are horizontally slidably inserted in the basket 14, and the upper and lower adjacent trays 12 do not contact each other; the lifting device 107 is arranged on the same side of the conveyor line 105 and the conveyor line 2 106. Fig.23 As shown, the lifting device 107 is provided with a conveyor line 3 108, and the conveyor line 3 108 is lifted and lowered by the lifting device 107. The conveyor line 3 108 is horizontally arranged, and its conveying direction is the same as that of the conveyor line 105 and the conveyor line 2 106. When the lifting device 107 drives the conveyor line 3 108 to lift and lower to a position flush with the conveyor line 105 or the conveyor line 2 106, the conveyor line 105 can translate the basket 14 thereon to the conveyor line 3 108 or the conveyor line 3 108 can translate the basket 14 thereon to the conveyor line 2 106. The horizontal movement direction of the basket 14 on the conveyor line 105 and the conveyor line 2 106 is as shown in FIG. Fig. 22As shown by the middle arrow, on the contrary, the lifting device 107 drives the conveyor line 3 108 to lift and lower so that each layer of the tray 12 in the basket 14 on the conveyor line 3 108 is flush with the slide rail 104. In this design, the gripper 103 moves horizontally close to the basket 14 driven by the translation device 102 to clamp the tray 12 in the basket 14 on the conveyor line 3 108 that is flush with the slide rail 104 and drives the tray 12 to move horizontally onto the slide rail 104. When the tray 12 is filled with semi-conductive After the body module 13, the gripper 103 moves horizontally under the drive of the translation device 102, pushing the tray 12 to move horizontally along the slide rail 104 into the basket 14 on the conveyor line 3 108, and then the lifting device 107 drives the conveyor line 3 108 to move up and down so that the next layer of trays 12 are flush with the slide rail 104, and then the gripper 103 moves horizontally under the drive of the translation device 102, approaches the basket 14, grabs the next layer of trays 12, and pulls the tray 12 onto the slide rail 104. The transport device 2 11 continues to place semiconductor modules 13 on the tray 12. When the tray 12 is full, the tray 12 is sent back to the basket 14. This cycle repeats until all trays 12 in the basket 14 are full of semiconductor modules 13. Then the lifting device 107 drives the conveyor line 3 108 to rise until the basket 14 is flush with the conveyor line 2 106. The conveyor line 3 108 transports the basket 14 to the conveyor line 2 106 and sends it away. Then the lifting device 107 drives the conveyor line 3 108 down. The conveyor line 105 is lowered to a position flush with the conveyor line 105, and the conveyor line 105 sends the basket 14 thereon to the conveyor line 3 108, and then the lifting device 107 drives the conveyor line 3 108 to rise and fall so that each layer of tray 12 in the basket 14 on the conveyor line 3 108 is flush with the slide rail 104 at the same height, and the aforementioned actions are repeated to place semiconductor modules 13 in each layer of tray 12 in the basket 14, and this cycle is repeated until all the semiconductor modules 13 are placed in the basket 14 to complete the unloading operation.

[0134] In this embodiment, if Fig. 22 , Fig.24 and Fig.25 As shown, the gripper 103 includes a mounting frame 1031, a push-pull device 1032, a fixed clamping arm 1033, a movable clamping arm 1034, a rotating shaft 1035, and a rotating shaft 1036. The mounting frame 1031 is fixedly connected to the translation device 102, the push-pull device 1032 and the fixed clamping arm 1033 are fixedly connected to the mounting frame 1031, the movable clamping arm 1034 is rotatably connected to the mounting frame 1031 through the rotating shaft 1035, and the push-pull device 1032 is hinged to the movable clamping arm 1034 through the rotating shaft 1036. Fig.24 and Fig.25As shown, after the translation device 102 drives the clamping arm 103 to approach the tray 12 in the basket 14, the push-pull device 1032 pushes the movable clamping arm 1034 to rotate around the rotation axis 1035 and approach the fixed clamping arm 1033, so that the movable clamping arm 1034 cooperates with the fixed clamping arm 1033 to clamp the tray 12. Conversely, the push-pull device 1032 pushes the movable clamping arm 1034 to rotate in the opposite direction around the rotation axis 1035, so that the movable clamping arm 1034 releases the clamping of the tray 12.

[0135] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A semiconductor module cutting and bending device, characterized in that: It includes a workbench and a loading device, a module pushing device, a first conveying device, a punching and bending device, a shaping and detecting device, a second conveying device and a unloading device arranged on the workbench. A frame with a semiconductor module is placed in the clip conveyed by the loading device. The module pushing device is used to push the frame out of the clip. Then the first conveying device takes the frame and places the frame in the punching and bending device. The punching and bending device punches and bends the semiconductor module in the frame to obtain a finished semiconductor module and separates it from the frame. The shaping and detecting device picks up the finished semiconductor module to shape the PIN needles in the Y direction and the X direction, visually inspect and inspect the flatness. After the shaping and inspecting is completed, the second conveying device delivers the finished semiconductor module to the unloading device to load it into a tray and basket to complete the unloading.

2. A semiconductor module cutting and bending device as claimed in claim 1, characterized in that: It also includes a laser coding device and a code reading device. The module pushing device pushes the frame from the magazine to the laser coding device for laser coding. The frame after laser coding is read by the code reading device, and the frame after code reading is taken away by the transport device.

3. A semiconductor module cutting and bending device as claimed in claim 2, characterized in that: The loading device includes a conveyor line four and a conveyor line five arranged directly above the conveyor line four. The conveyor line four and the conveyor line five are arranged horizontally and parallel to each other, and are fixedly connected to the workbench. The conveyor line four and the conveyor line five can horizontally transfer the magazine. A plurality of stacked frames with semiconductor modules are horizontally slidably inserted in the magazine, and the upper and lower adjacent frames do not contact each other.

4. A semiconductor module cutting and bending device as claimed in claim 3, characterized in that: The module ejection device is located on the same side of the conveyor line four and the conveyor line five, and the module ejection device includes: A second translation device is fixedly connected to the workbench; The lifting device 2 is connected to the translation device 2, and the lifting device 2 is driven by the translation device 2 to translate close to or away from the conveying line 4 and the conveying line 5. The translation direction is the same as the conveying direction of the conveying line 4 and the conveying line 5. The lifting device 2 is provided with a mounting plate 2, and the mounting plate 2 is driven by the lifting device 2 to lift close to or away from the conveying line 4 or the conveying line 5. The mounting plate 2 is installed with a lifting device 3, a lower clamping arm and a motor 1. The lower clamping arm is located at the lower end of the lifting device 3, and the upper end of the lifting device 3 is connected to the upper clamping arm. When approaching conveyor line four or conveyor line five and being flush with conveyor line four or conveyor line five, conveyor line four translates the magazine to the lower clamp arm or conveyor line five takes the magazine on the lower clamp arm, and lifting device three drives the upper clamp arm to move downward and cooperate with the lower clamp arm to clamp and fix the magazine, and motor one is located beside the upper clamp arm, and motor one is connected to a slewing block, which is driven by motor one to rotate around its own vertical axis, and a pair of stop pins are arranged at intervals at the lower end of the slewing block and symmetrically distributed on both sides of the axis of the slewing block itself; A mounting frame 6 is fixedly connected to the workbench, and a translation device 12 and a mounting plate 8 are arranged on the mounting frame 6. The mounting plate 8 is horizontally slidably connected to the mounting frame 6. The translation device 12 is connected to the mounting plate 8 and is used to drive the mounting plate 8 to slide horizontally on the mounting frame 6, and the sliding direction is the same as the translation direction of the translation device 2; A translation device 13 is horizontally slidably mounted on the mounting plate 8, and the sliding direction is perpendicular to the sliding direction of the mounting plate 8. A spring is connected between the translation device 13 and the mounting plate 8, and the expansion and contraction direction of the spring is the same as the sliding direction of the translation device 13; A push rod is connected to the translation device 13, and the translation device 13 drives the push rod to move horizontally to push out the frame in the magazine; The magazine is open at both ends in the translation direction of the push rod, one end of the push rod enters from the opening at one end of the magazine, and then pushes the frame to extend from the opening at the other end of the magazine, the upper surface of the magazine is provided with grooves at both ends of the opening, a lever that can rotate around a vertical axis is provided in the groove, one end of the lever is connected to a blocking rod, the lever rotates to drive the blocking rod to leave the open end of the magazine or return to the open end of the magazine, when the blocking rod is located at the open end of the magazine, the frame cannot enter or exit the magazine; When the magazine is translated onto the lower clamp arm, the rotating block moves horizontally into the groove, and a pair of stop pins are located on both sides of the shifting rod. The motor drives the rotating block to rotate, and the shifting rod is rotated through the pair of stop pins.

5. A semiconductor module cutting and bending device as claimed in claim 4, characterized in that: The laser coding device includes a laser coding machine and a conveyor line six arranged below the laser coding machine. The laser coding machine and the conveyor line six are both fixedly connected to the workbench. The push rod pushes the frame in the magazine onto the conveyor line six, and the conveyor line six conveys the frame to the bottom of the laser coding machine for laser coding.

6. A semiconductor module cutting and bending device as claimed in claim 5, characterized in that: The code reading device includes a mounting frame 2 and a code reader arranged at the upper end of the mounting frame 2. The mounting frame 2 is fixedly connected to the workbench, and the conveyor line 6 conveys the frame after laser coding to the bottom of the code reader for code reading.

7. A semiconductor module cutting and bending device as claimed in claim 6, characterized in that: The transport device 1 and the transport device 2 have the same structure; The transport device 1 includes a mounting frame 3 and a three-axis translation mechanism arranged on the mounting frame 3, the three-axis translation mechanism is provided with a motor 2, and the motor 2 is driven by the three-axis translation mechanism to translate along the XYZ three axes, the lower end of the motor 2 is connected to a suction nozzle 1, and the suction nozzle 1 is driven by the motor 2 to rotate around the vertical axis, and the suction nozzle 1 is used to suck the semiconductor module.

8. A semiconductor module cutting and bending device as claimed in claim 7, characterized in that: The punching and bending device comprises: Mounting plate three, fixedly connected to the workbench; A lower runner rod is horizontally fixedly mounted on the mounting plate 3, and a plurality of lower limit pins arranged at equal intervals are arranged on the lower runner rod along the length direction; A pair of flow channel slides are vertically slidably mounted on the mounting plate three and symmetrically arranged on both sides of the lower flow channel rod. The flow channel slides are horizontally arranged, and the frame with the semiconductor module can be placed on the pair of flow channel slides by the handling device one; The lifting device 4 is fixedly connected with the mounting plate 3 and the runner slide plate, and is used to drive the runner slide plate to move up and down. When the runner slide plate is lowered, the frame on the runner slide plate contacts the lower runner rod and is limited by the lower limit pin; A translation device three, fixedly connected to the workbench; The upper runner rod is located directly above the lower runner rod, and a plurality of upper limit pins are arranged on the upper runner rod along the length direction at equal intervals. The upper runner rod, the upper limit pins and the lower runner rod, the lower limit pins are arranged symmetrically up and down. The upper runner rod is connected to the translation device three, and the upper runner rod is driven to move horizontally by the translation device three, and the moving direction is the same as the length direction of the lower runner rod. When the runner slide rises, the frame located on the runner slide contacts the upper runner rod and is limited by the upper limit pins. At this time, the translation device three drives the frame to move horizontally on a pair of runner slides through the upper runner rod and the upper limit pins, and the moving direction is along the length direction of the lower runner rod and the runner slide; The punching die comprises a punching movable die, a punching fixed die and a lifting device 5, wherein the punching fixed die is located below the lower runner rod and the runner slide plate and is fixedly connected to the mounting plate 3, the punching movable die is located above the runner slide plate and the upper runner rod and is connected to the lifting device 5, and the lifting device 5 is fixedly connected to the workbench, and the punching movable die is driven to descend through the lifting device 5 to cooperate with the punching fixed die to punch the frame with the semiconductor module; The bending die comprises a fixed bending die, a movable bending die and a lifting device 6. The fixed bending die is located below the lower runner rod and the runner slide plate and is fixedly connected to the mounting plate 3. The movable bending die is located above the runner slide plate and the upper runner rod and is connected to the lifting device 6. The lifting device 6 is fixedly connected to the workbench. The movable bending die is driven to descend through the lifting device 6 to cooperate with the fixed bending die to bend the PIN angle of the semiconductor module and separate the semiconductor module from the frame. The frame with the semiconductor module moves horizontally on a pair of runner slides, first passing through the punching die and then through the bending die.

9. A semiconductor module cutting and bending device as claimed in claim 8, characterized in that: The shaping detection device comprises: The translation device 4 is fixedly connected to the workbench, and a lifting device 7 is arranged on it. The translation device 4 drives the lifting device 7 to move horizontally. The lifting device 7 is connected to a suction nozzle 2, and the suction nozzle 2 is driven to move up and down by the lifting device 7. The suction nozzle 2 can go to the end of the flow channel slide to suck the frame and the semiconductor module under the drive of the translation device 4 and the lifting device 7; A translation device 5 is fixedly connected to the workbench, and its translation direction is the same as that of the translation device 4. The translation device 5 is provided with a lifting device 8, which is driven by the translation device 5 to move horizontally. The lifting device 8 is provided with a mounting plate 4, which is driven by the lifting device 8 to move up and down. Five suction nozzles 3 are installed on the mounting plate 4, and the five suction nozzles 3 are arranged in a straight line on the mounting plate 4 along the translation direction of the translation device 5 and are arranged at intervals; The carrier 1, the Y-direction shaping mechanism, the X-direction shaping mechanism, the carrier 4, the visual inspection mechanism, and the flatness inspection mechanism are located below the suction nozzle 2 and the suction nozzle 3 and are sequentially arranged along the translation direction of the translation device 5. The carrier 1, the Y-direction shaping mechanism, the X-direction shaping mechanism, and the carrier 4 are installed on the mounting plate 5. The mounting plate 5 is fixedly connected to the workbench. The visual inspection mechanism and the flatness inspection mechanism are fixedly connected to the workbench. The Y-direction shaping mechanism comprises: A rotating device 1 is fixedly connected to the mounting plate 5, and a carrier 2 is arranged at the upper end of the rotating device 1, and the carrier 2 is driven to rotate around the vertical axis by the rotating device 1; A lifting device nine, fixedly connected to the mounting plate five; The translation device 6 is connected to the lifting device 9, and the translation device 6 is driven to rise and fall through the lifting device 9; The mounting frame five is connected with the translation device six, and the translation device six drives the mounting frame five to move horizontally. The mounting frame five is provided with a shaping block one and a translation device seven. A shaping plate is vertically fixedly installed on the upper end of the shaping block one. The translation device seven is connected with the shaping block two, and the shaping block two is driven to move horizontally close to or away from the shaping plate through the translation device seven. The translation movement direction of the translation device seven is the same as that of the translation device six. The upper end of the shaping plate and the side of the shaping block two close to the shaping plate are both provided with shaping edges that are parallel to each other and of equal height. When the semiconductor module is placed on the carrier two, the bent PIN angle of the semiconductor module extends between a pair of shaping edges, and the PIN angle bent by 90 degrees contacts the shaping edge at the upper end of the shaping plate. The X-direction shaping mechanism comprises: The second rotating device is fixedly connected to the mounting plate 5, and the upper end of the second rotating device is provided with a carrier 3, and the carrier 3 is driven to rotate around the vertical axis by the second rotating device; The translation device 8 is fixedly connected to the mounting plate 5, and its translation direction is perpendicular to the translation direction of the translation device 6; A translation device nine is connected to the translation device eight, and is driven by the translation device eight to move horizontally. The translation direction of the translation device nine is the same as that of the translation device six; The shaping block 3 is connected to the translation device 9, and the translation device 9 drives the shaping block 3 to move horizontally close to or away from the carrier 3. A shaping rack is provided on the side of the shaping block 3 close to the carrier 3, and a plurality of shaping tooth grooves are provided on the shaping rack. The shaping block 3 moves horizontally close to the carrier 3 so that the bent plurality of PIN corners of the semiconductor module on the carrier 3 can extend into each shaping tooth groove; The visual inspection mechanism comprises: A mounting plate six is ​​fixedly connected to the workbench, a mounting plate seven is horizontally slidably mounted on the mounting plate six, and a carrier five is arranged on the mounting plate seven; The translation device 10 is fixedly mounted on the lower surface of the mounting plate 6 and connected to the mounting plate 7, and is used to drive the mounting plate 7 to slide horizontally; The lower vision backlight source and the side vision backlight source are both located above the carrier five and fixedly connected to the mounting plate six; The lower vision camera is located directly below the lower vision backlight source and is fixedly connected to the lower surface of the mounting plate 6; A side vision camera, mounted on mounting plate six; The flatness detection mechanism comprises: A translation device eleven, fixedly connected to the workbench; The three-dimensional laser line scanner is connected to the translation device 11, and the three-dimensional laser line scanner is driven to move horizontally by the translation device 11; A conveyor line 7 is located below the three-dimensional laser line scanner and is fixedly connected to the workbench. The conveying direction of the conveyor line 7 is perpendicular to the translation direction of the translation device 11. A carrier 6 is arranged on the conveyor line 7, and the conveyor line 7 is used to drive the carrier 6 to move horizontally. The suction nozzle 2 places the sucked semiconductor module on the carrier 1 under the drive of the translation device 4 and the lifting device 7. The five suction nozzles 3 place the semiconductor module on the carrier 1 on the carrier 2, carrier 3, carrier 4, carrier 5 and carrier 6 in turn under the drive of the translation device 5 and the lifting device 8, so that the semiconductor module undergoes Y-direction shaping, X-direction shaping, visual inspection and flatness inspection in turn.

10. The semiconductor module cutting and bending equipment according to claim 9, characterized in that: The unloading device comprises: A mounting plate 1 is fixedly connected to the workbench, a translation device 1 and a slide rail 1 are arranged on the mounting plate 1, a gripper is connected to the translation device 1, and the gripper is driven to move horizontally by the translation device 1, the gripper holds a tray, and the tray is horizontally slidably mounted on the slide rail 1, the translation device 1 drives the tray to slide horizontally on the slide rail 1 through the gripper, and the handling device 2 picks up the semiconductor module on the carrier 6 and places it on the tray; Conveyor line 1 and conveyor line 2 are arranged on the same side of mounting plate 1 and are fixedly connected to the workbench. Conveyor line 1 and conveyor line 2 are arranged horizontally and parallel to each other. Conveyor line 2 is located directly above conveyor line 1. Conveyor line 1 and conveyor line 2 are provided with baskets. Multiple stacked trays are inserted in the baskets for horizontal sliding movement. Two adjacent trays above and below do not touch each other. Lifting device 1 is arranged on the same side of conveyor line 1 and conveyor line 2. Conveyor line 3 is arranged on the lifting device 1. Conveyor line 3 is lifted and lowered by lifting device 1. Conveyor line 3 is arranged horizontally. Its conveying direction is the same as that of conveyor line 1 and conveyor line 2. When lifting device 1 drives conveyor line 3 to rise and fall to a position flush with conveyor line 1 or conveyor line 2, conveyor line 1 can translate the basket on it to conveyor line 3 or conveyor line 3 can translate the basket on it to conveyor line 2. The lifting basket on conveyor line 1 and conveyor line 2 has opposite horizontal movement directions. The lifting device 1 drives conveyor line 3 to lift and lower so that each layer of trays in the lifting basket on conveyor line 3 is flush with the slide rail 1. Driven by the translation device 1, the gripper clamps the trays in the lifting basket on conveyor line 3 that are flush with the slide rail 1 and drives the trays to move horizontally to the slide rail 1. After the trays are filled with semiconductor modules, the gripper pushes the trays to move horizontally along the slide rail 1 and enter the lifting basket on conveyor line 3 under the drive of the translation device 1.

Images