Cold plate and electronic equipment
The cold plate design with a partitioned cavity and grooves/capillary wicks addresses the limitations of current cold plates, improving heat dissipation efficiency in electronic devices by increasing exchange area and reducing thermal resistance.
Patent Information
- Application Number
- CN202411363278.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2024-12-13
AI Technical Summary
Current cold plates are limited in size and heat exchange area, leading to low heat exchange efficiency and difficulty in dissipating high heat flux densities in electronic devices.
A cold plate design with a partition that divides the cavity into a phase change and cooling cavity, featuring grooves and capillary wicks to increase heat exchange area and reduce thermal resistance.
Enhances heat dissipation performance by increasing the heat exchange area and reducing flow resistance, effectively managing high heat flux densities in electronic equipment.
Smart Images
Figure CN119136509A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat exchange technology, and in particular to a cold plate and electronic equipment. Background Art
[0002] Cold plates are devices used to dissipate heat and are widely used in a variety of electronic devices. As the performance of electronic devices improves, power density continues to increase, and the heat generated by the devices also increases significantly. If the heat cannot be dissipated in time, the electronic device will overheat and its performance and life will be affected.
[0003] Most of the current cold plates are VC (Vapor Chamber) cold plates, which usually include a shell with a cavity inside. The cavity is filled with a phase change medium. The phase change medium changes into steam after exchanging heat with the electronic equipment in the evaporation zone in the cavity. The steam moves to the condensation zone, exchanges heat in the condensation zone and condenses into liquid, and then returns to the evaporation zone for circulation.
[0004] This type of cold plate is limited in size due to the space available for installation inside the electronic equipment, so that the heat exchange area available for heat exchange when steam is exchanging heat in the condensation zone is small, resulting in low heat exchange efficiency of the cold plate. Summary of the invention
[0005] The embodiments of the present application provide a cold plate and an electronic device, which improve the heat dissipation performance of the cold plate by increasing the heat exchange area.
[0006] In a first aspect, an embodiment of the present application provides a cold plate and an electronic device, comprising: a mounting portion and a main body portion disposed on the mounting portion, the mounting portion being used to connect to a heat dissipation element, the main body portion having a cavity;
[0007] A partition is provided in the cavity to separate the cavity into a phase change cavity and a cooling cavity through the partition, the partition is located above the bottom plate of the phase change cavity, and the partition is bent toward the phase change cavity to form at least one groove, so that the cooling cavity is at least partially embedded in the phase change cavity;
[0008] The phase change cavity is filled with a phase change medium; the cooling cavity is provided with a cooling liquid inlet and a cooling liquid outlet, and the cooling liquid inlet and the cooling liquid outlet are both connected to the cooling cavity.
[0009] In a possible implementation manner, a capillary wick is disposed on the bottom plate.
[0010] In a possible implementation manner, a capillary wick or a plurality of guide grooves are disposed on the side wall of the phase change cavity, and the guide grooves extend from the top of the phase change cavity to the bottom of the phase change cavity.
[0011] In a possible implementation manner, a cover plate is further included, and a mounting opening is provided on a side of the cooling cavity away from the phase change cavity, and the cover plate is used to close the mounting opening.
[0012] In a possible implementation manner, the groove passes through the partition, and the cover plate is provided with at least one protrusion on a side close to the cooling cavity. When the cover plate closes the mounting opening, the protrusion is correspondingly inserted into the groove to form a first flow channel between the partition plate and the cover plate that matches the shape of the partition plate.
[0013] The length of the protrusion is smaller than the length of the groove, so as to form a second flow channel at both ends of the groove, the second flow channel is connected with the first flow channel, and the coolant inlet and the coolant outlet are correspondingly connected with the two second flow channels.
[0014] In a possible implementation manner, a plurality of teeth are provided on a side of the partition away from the phase change cavity, an extension direction of the teeth is the same as an extension direction of the groove, and the teeth are located in the first flow channel.
[0015] In a possible implementation manner, the cooling cavity is provided with openings at both ends of the extending direction of the partition to form the coolant inlet and the coolant outlet, the cover plate is provided with a frame, the frame cover is provided on the outside of the main body, and seals the coolant inlet and the coolant outlet;
[0016] Two connecting pipes are arranged on the frame, and the two connecting pipes are connected to the coolant inlet and the coolant outlet respectively.
[0017] In a possible implementation manner, a mounting hole is provided in the middle of the mounting portion, and the main body is at least partially inserted into the mounting hole and fixedly connected to a hole wall of the mounting hole.
[0018] In a possible implementation manner, a heat conducting layer is further provided on the main body, one side of the heat conducting layer is in contact with the outer wall of the cavity, and the other side of the heat conducting layer is used to contact with the heat element to be cooled.
[0019] In a second aspect, an embodiment of the present application provides an electronic device, comprising: a device body and any one of the above-mentioned cold plates, wherein the device body is connected to the cold plate.
[0020] The present application provides a cold plate and electronic device. The cold plate is divided into a main body and a mounting part. The partition of the main body divides the main body into a phase change cavity and a cooling cavity. The phase change cavity is below the cooling cavity, and the partition is bent into the phase change cavity to form at least one groove. When the heat sink contacts the bottom of the phase change cavity, heat is introduced into the phase change cavity. The phase change medium of the phase change cavity absorbs heat and vaporizes into steam. The steam passes through the groove and releases heat to the cooling cavity. The coolant in the cooling cavity absorbs heat, and the steam liquefies. The liquefied liquid flows back to the bottom of the phase change cavity. The present application increases the heat exchange area and reduces the diffusion thermal resistance by setting the groove, thereby achieving the effect of improving the heat transfer capacity of the cold plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0022] Figure 1 A three-dimensional diagram of a cold plate provided in an embodiment of the present application;
[0023] Figure 2 An exploded view of a cold plate provided in an embodiment of the present application;
[0024] Figure 3 A cross-sectional view of the assembly of the main body and the cover plate of the cold plate provided in the embodiment of the present application;
[0025] Figure 4 A three-dimensional diagram of the main body of the cold plate provided in an embodiment of the present application;
[0026] Figure 5 A cross-sectional view of a cold plate provided in an embodiment of the present application;
[0027] Figure 6 A three-dimensional view of a cover plate in a cold plate provided in an embodiment of the present application.
[0028] Reference numerals:
[0029] 100-mounting portion; 101-mounting hole;
[0030] 200-main body; 201-phase change cavity; 202-cooling cavity; 2021-cooling liquid inlet; 2022-cooling liquid outlet; 2023-first flow channel; 2024-second flow channel; 2025-tooth plate; 203-partition plate;
[0031] 300-cover plate; 301-bump; 302-connecting pipe; 303-frame;
[0032] 400-heat dissipation parts;
[0033] 500-Thermal conductive layer.
[0034] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0035] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0036] First, the terms involved in this application are explained:
[0037] Phase change medium: refers to a type of material that can achieve phase change (such as from solid to liquid or from liquid to solid) by absorbing or releasing a large amount of latent heat at a specific temperature. Phase change media can store or release a large amount of energy during the phase change process, so it has a wide range of applications in temperature control, thermal management and energy storage. Phase change media are divided into organic phase change materials, inorganic phase change materials and composite phase change materials. Organic phase change materials include paraffin, fatty acids, etc., which are suitable for low temperature environments; inorganic phase change materials include salt hydrates, metal alloys, etc., which are suitable for high temperature environments; composite phase change materials are achieved by combining organic and inorganic phase change materials, or by compounding phase change materials with other materials to improve their performance.
[0038] Capillary wick: refers to a key component used in thermal management systems that can use capillary action to quickly transfer liquid working fluids, thereby achieving effective heat transfer. Capillary action is a physical phenomenon in which liquids rise or fall in tiny capillaries or porous materials due to the mutual attraction between liquid molecules and the interaction between liquids and solid surfaces. Capillary wicks mainly include sintered copper powder wicks, metal mesh wicks, groove structure wicks, and composite capillary structure wicks.
[0039] TIM: refers to a material specially used to improve the heat dissipation efficiency of electronic equipment. TIM is the abbreviation of Thermal Interface Material. TIM is usually placed between the heat-generating component (such as the CPU) and the heat sink to fill the gap between the two, reduce thermal resistance, and thus improve heat conduction efficiency.
[0040] The cold plate provided in this application is used to solve the problem of heat dissipation of high heat flux density components in electronic equipment and reduce the flow resistance of liquid cooling system. In the prior art, metal skived cold plates are usually used. The cold plates are limited by the diffusion thermal resistance and are used in high-performance network switching chips. For example, the current Broadcom TH5 switching chip has a power consumption of nearly 800W and a heat flux density of more than 100W / CM. 2 The performance of traditional metal skived cold plates has reached its limit and it is difficult to solve such high power consumption and high heat flux density heat dissipation scenarios. In the existing technology, another common solution is to use a cold plate with an evaporation chamber bottom plate and a flow channel. Although this cold plate can meet the high power consumption and high heat flux density heat dissipation, it is affected by the lateral structure space inside the equipment. The gap between the flow channel teeth can only be similar to that of ordinary metal skived cold plates, and the flow resistance cannot be reduced by increasing the gap between the flow channel teeth.
[0041] The present application provides a cold plate, which includes a mounting portion and a main body portion. The main body portion has a cavity, and a partition is arranged in the cavity. The partition is bent toward the phase change cavity to form at least one groove. The partition divides the cavity into a phase change cavity and a cooling cavity, and the phase change cavity is filled with a phase change medium. A coolant inlet and a coolant outlet are arranged on the cooling cavity, and the coolant flows in the cooling cavity. The phase change medium can have the same composition as the coolant, for example, the phase change medium and the coolant are both water; the phase change medium can also have a different composition from the coolant, for example, the phase change medium can use water, and the coolant can use an ethylene glycol aqueous solution.
[0042] The component to be cooled contacts the bottom of the mounting portion, the main body is arranged on the mounting portion, the cooling cavity is arranged on the phase change cavity, and the heat transfer process is as follows: the component to be cooled introduces heat into the phase change cavity, the phase change medium in the phase change cavity is heated and vaporized into steam, the steam flows upward and exchanges heat with the cooling cavity; the steam releases heat and liquefies into liquid, adheres to the partition, and returns to the bottom of the phase change cavity under the influence of gravity; the coolant that absorbs heat is discharged from the coolant outlet, and the low-temperature coolant flows in from the coolant inlet to complete the heat dissipation.
[0043] The present application forms a groove by setting a partition that bends into the phase change cavity in the cavity, thereby increasing the heat exchange area and improving the heat dissipation performance of the cold plate. In addition, as the heat exchange area increases, the tooth gap can be increased while ensuring the heat dissipation performance, thereby achieving the effect of reducing the flow resistance.
[0044] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0045] Example 1
[0046] In this embodiment, the cold plate includes a mounting portion 100 and a main body 200, wherein the main body 200 is a closed cavity structure surrounded by a shell of the main body 200. A partition 203 in the main body 200 divides the main body 200 into a phase change cavity 201 and a cooling cavity 202, and the cooling cavity 202 is arranged above the phase change cavity 201.
[0047] The partition 203 is bent into the phase change cavity 201 to form at least one groove. For example, the partition 203 can be bent inward to form a groove in a U shape. The partition 203 can also be bent continuously to form multiple grooves. Through the grooves, the cold plate increases the heat exchange area and improves the heat dissipation efficiency.
[0048] The partition 203 can be installed at the top of the side wall of the main body 200, and the cooling cavity 202 is completely embedded in the phase change cavity 201. The partition 203 can also be installed at the rest of the side wall of the main body 200, and the middle of the partition 203 is bent into the phase change cavity 201, and the cooling cavity 202 is partially embedded in the phase change cavity 201.
[0049] The partition 203 can be installed by common connection methods such as integral molding, welding, and screws.
[0050] The phase change cavity 201 is filled with a phase change medium, such as water, ethylene glycol aqueous solution and propylene glycol aqueous solution. The cooling cavity 202 is provided with a coolant inlet 2021 and a coolant outlet 2022, and the coolant inlet 2021 and the coolant outlet 2022 are both connected to the cooling cavity 202. After the phase change cavity 201 absorbs heat, the phase change medium evaporates into steam, the steam rises, and exchanges heat with the cooling cavity 202. The coolant enters the cooling cavity 202 from the coolant inlet 2021 and flows in the cavity. The coolant can directly contact the top plate and side wall of the phase change cavity 201 through the cooling cavity 202, fully exchange heat with the steam, and absorb heat. The coolant with increased temperature flows out of the cooling cavity through the coolant outlet 2022.
[0051] The main body 200 and the mounting portion 100 are integrally formed.
[0052] In addition, during use, a heat conducting layer 500 is provided between the cold plate and the heat dissipation element 400 to fill the small gap between the cold plate and the heat dissipation element 400, reduce thermal resistance, and improve heat transfer capacity. The heat conducting layer 500 can be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, etc.
[0053] Example 2
[0054] In this embodiment, the cold plate includes a mounting portion 100 and a main body 200, wherein the main body 200 is a closed cavity structure surrounded by a shell of the main body 200. A partition 203 in the main body 200 divides the main body 200 into a phase change cavity 201 and a cooling cavity 202, and the cooling cavity 202 is arranged above the phase change cavity 201.
[0055] The difference between Example 2 and Example 1 is that, in this embodiment, a capillary wick is also provided on the bottom plate of the phase change cavity 201. Through the guidance of the capillary wick, the droplets formed after heat exchange return to the bottom plate. The side wall of the phase change cavity 201 is also provided with a capillary wick, and the capillary wick of the side wall allows the droplets to return to the bottom plate under the action of capillary force. By providing the capillary wick, the droplets quickly return to the bottom plate, thereby improving the heat exchange efficiency.
[0056] Among them, the capillary wick can be a sintered metal core, a woven metal mesh core, a metal powder sintered core, etc.
[0057] The capillary wick may be cylindrical, flat or mesh-shaped, and the capillary wick may be fixed mechanically, fixed with an adhesive, welded or sintered.
[0058] When in use, the main body 200 is arranged on the mounting portion 100. A heat conducting layer 500 is arranged between the cold plate and the heat dissipation element 400 to fill the small gap between the cold plate and the heat dissipation element 400, reduce thermal resistance, and improve heat transfer capacity. The heat conducting layer 500 can be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, etc.
[0059] Example 3
[0060] In this embodiment, the cold plate includes a mounting portion 100 and a main body 200, wherein the main body 200 is a closed cavity structure surrounded by a shell of the main body 200. A partition 203 in the main body 200 divides the main body 200 into a phase change cavity 201 and a cooling cavity 202, and the cooling cavity 202 is arranged above the phase change cavity 201.
[0061] The difference between Example 3 and Example 2 is that a guide groove can also be provided on the side wall of the phase change cavity 201. Since it is difficult to achieve the continuity of the capillary wick at the bend where the side wall of the phase change cavity 201 is connected to the bottom plate, a guide groove is provided on the side wall of the phase change cavity 201, and the guide groove extends from the top of the phase change cavity 201 to the bottom of the phase change cavity 201. The droplets fall back to the bottom plate along the guide groove by gravity, which can achieve the effect of improving the reflux resistance and enhancing the transmission efficiency.
[0062] Furthermore, the guide groove can be integrally formed with the phase change cavity 201, or the guide groove can be set on the side wall of the phase change cavity 201 by coating or etching the side wall of the phase change cavity 201; the guide groove can also be installed on the side wall of the phase change cavity 201 by welding, gluing, etc.
[0063] The guide groove can be in the shape of a rectangular groove, a triangular groove, a semicircular groove, or the like.
[0064] When in use, the main body 200 is arranged on the mounting portion 100. A heat conducting layer 500 is arranged between the cold plate and the heat dissipation element 400 to fill the small gap between the cold plate and the heat dissipation element 400, reduce thermal resistance, and improve heat transfer capacity. The heat conducting layer 500 can be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, etc.
[0065] Example 4
[0066] In this embodiment, the cold plate includes a mounting portion 100 and a main body 200, wherein the main body 200 is a closed cavity structure surrounded by a shell of the main body 200. A partition 203 in the main body 200 divides the main body 200 into a phase change cavity 201 and a cooling cavity 202, and the cooling cavity 202 is arranged above the phase change cavity 201.
[0067] The difference between the fourth embodiment and the first embodiment is that the mounting portion 100 has a mounting hole 101, and the main body 200 is mounted on the mounting portion 100 through the mounting hole 101. For example, the mounting portion 100 can be made of metal materials such as copper or aluminum, the main body can be made of metal materials such as copper, and the cavity of the main body 200 is welded to the edge of the mounting hole 101.
[0068] In addition, the main body 200 can also be detachably connected to the mounting part 100. For example, the main body 200 is snap-connected to the mounting part 100 through the mounting hole 101, a protrusion is provided on the side wall of the main body 200, and a groove matching the protrusion is provided on the side wall of the mounting hole 101, or a groove is provided on the side wall of the main body 200, and a protrusion matching the groove is provided on the side wall of the mounting hole 101, and the main body 200 is inserted into the mounting part 100; the main body 200 and the mounting part 100 can also be connected by screws.
[0069] Compared with the integral molding of embodiment 1, the mounting portion 100 having the mounting hole 101 can reduce the consumption of the material of the mounting portion 100, thereby achieving the effect of reducing the cost. The detachable connection also has the advantages of easy disassembly and maintenance.
[0070] In addition, when in use, a heat conducting layer 500 is provided between the cold plate and the heat dissipating element 400 to fill the tiny gap between the cold plate and the heat dissipating element 400, reduce thermal resistance, and improve heat transfer capability. The heat conducting layer 500 may be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, and the like.
[0071] Example 5
[0072] refer to Figure 3 , Figure 4 In this embodiment, the cold plate includes a mounting portion 100, a main body 200 and a cover plate 300. The main body 200 is a cavity structure having a bottom plate and a side wall, and the cavity structure includes a phase change cavity 201, a partition 203 and a cooling cavity 202. The cooling cavity 202 is arranged above the phase change cavity 201, and the cooling cavity 202 is provided with a mounting port on a side away from the phase change cavity 201 for mounting the cover plate 300 to form a sealed cavity structure. The cover plate 300 is made of metal or plastic material, and is fixed and installed by welding, screws, buckles or sealing rings, which is easy to disassemble.
[0073] At this time, the coolant flows in the entire cooling cavity 202. In order to further make full use of the coolant, a protrusion 301 is provided on the side of the cover plate 300 close to the cooling cavity 202. The protrusion 301 corresponds to the groove inserted into the partition 203, and a gap is left between the protrusion 301 and the partition 203 to form a first flow channel; in order to ensure that the coolant can flow in the cooling cavity, the length of the protrusion 301 in the extension direction of the groove is less than the length of the groove, and a second flow channel 2024 is formed at both ends of the groove, and the second flow channel 2024 is connected with the first flow channel 2023. The cooling cavity 202 is provided with a coolant inlet 2021 and a coolant outlet 2022. The second flow channel 2024 is connected with the coolant inlet 2021 and the coolant outlet 2022. The coolant flows into the second flow channel 2024 through the coolant inlet 2021, flows through the first flow channel 2023, and then passes through the second flow channel 2024 and flows through the coolant outlet 2022 to complete the heat exchange. In this embodiment, the protrusion 301 is provided on the cover plate 300 to limit the flow path of the coolant, which can ensure that the coolant is fully in contact with the steam and that the coolant is fully utilized, thereby reducing unnecessary losses caused by coolant diversion.
[0074] In order to further improve the heat dissipation capacity of the cold plate, a plurality of teeth 2025 are arranged on the side of the partition 203 away from the phase change cavity 201, so as to increase the heat exchange area and improve the heat dissipation power. Among them, the teeth 2025 are arranged in the first flow channel, and the extension direction is consistent with the extension direction of the groove, so as to ensure that the coolant can enter the first flow channel through the second flow channel and flow in the flow channel, so as to avoid the extension direction of the teeth 2025 being perpendicular to the extension direction of the groove, the flow channel being blocked, and the coolant being unable to flow in the flow channel. The teeth 2025 can be formed in one piece or installed by welding.
[0075] In addition, this embodiment has multiple heat exchange surfaces by setting grooves, thereby increasing the heat exchange area. Therefore, under the premise of ensuring heat dissipation efficiency, the gap between the tooth plates 2025 can be increased to reduce the flow resistance of the cold plate and the probability of flow channel blockage.
[0076] When in use, the main body 200 is arranged on the mounting portion 100. A heat conducting layer 500 is arranged between the cold plate and the heat dissipation element 400 to fill the small gap between the cold plate and the heat dissipation element 400, reduce thermal resistance, and improve heat transfer capacity. The heat conducting layer 500 can be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, etc.
[0077] Example 6
[0078] refer to Figure 1 , Figure 2 , Figure 5 , Figure 6 In this embodiment, the cold plate includes a mounting portion 100, a main body 200 and a cover plate 300. The difference between Example 6 and Example 5 is that in Example 6, the phase change cavity 201 is a sealed cavity, and the cooling cavity 202 is provided with openings at both ends of the extension direction of the partition 203. The cooling cavity 202 is provided above the phase change cavity 201 to form a coolant inlet 2021 and a coolant outlet 2022. The cover plate 300 has a frame 303, which is provided on the outside of the main body 200, sealing the coolant inlet 2021 and the coolant outlet 2022. The cover plate 300 and the main body 200 cooperate to form a sealed cavity. Two connecting pipes 302 are provided on the frame 303 of the cover plate 300, and the two connecting pipes 302 are respectively connected to the coolant inlet 2021 and the coolant outlet 2022. The coolant enters the coolant inlet 2021 through the connecting pipe 302 of the cover plate 300, flows into the first flow channel 2023 for heat exchange, and after the heat exchange is completed, the coolant with increased temperature flows into the coolant outlet 2022, and is discharged from the cooling cavity 202 through the connecting pipe 302 of the cover plate 300. The cover plate 300 is made of metal or plastic material and can be fixed to the mounting part 100 by welding; further, the internal pressure of the cold plate is small, and the cover plate 300 and the mounting part 100 can also be selected to be packaged with a sealing ring to reduce product cost.
[0079] When in use, the main body 200 is arranged on the mounting portion 100. A heat conducting layer 500 is arranged between the cold plate and the heat dissipation element 400 to fill the small gap between the cold plate and the heat dissipation element 400, reduce thermal resistance, and improve heat transfer capacity. The heat conducting layer 500 can be a TIM material, and the main types include thermal conductive paste, thermal conductive pads made of materials such as silicone, thermal conductive glue, etc.
[0080] The present application also provides an electronic device, including a device body of the electronic device and a cold plate in any of the above embodiments, wherein the device body of the electronic device is connected to the cold plate. The electronic device includes but is not limited to IDC devices such as servers and switches, and IDC (Internet Data Center) devices refer to various hardware and software components used to build and maintain data center infrastructure. The above cold plate has the above effects, and the electronic device having the above cold plate also has the above effects, so it will not be repeated in this article.
[0081] Finally, it should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device that includes the element.
[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0083] Finally, it should be noted that those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art not disclosed by the present invention, are not limited to the precise structure described above and shown in the drawings, and may be modified and changed in various ways without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims
1. A cold plate, characterized in that: It comprises a mounting portion (100) and a main body portion (200) arranged on the mounting portion (100), the mounting portion (100) being used to be connected to a heat element (400) to be cooled, and the main body portion (200) having a cavity; A partition (203) is provided in the cavity, so as to separate the cavity into a phase change cavity (201) and a cooling cavity (202) through the partition (203); the partition (203) is located above the bottom plate of the phase change cavity (201); the partition (203) is bent toward the phase change cavity (201) to form at least one groove, so that the cooling cavity (202) is at least partially embedded in the phase change cavity (201); The phase change cavity (201) is filled with a phase change medium; the cooling cavity (202) is provided with a cooling liquid inlet (2021) and a cooling liquid outlet (2022), and the cooling liquid inlet (2021) and the cooling liquid outlet (2022) are both connected to the cooling cavity (202).
2. The cold plate according to claim 1, characterized in that The bottom plate is provided with a capillary liquid wick.
3. The cold plate according to claim 2, characterized in that A capillary wick or a plurality of guide grooves are provided on the side wall of the phase change cavity (201), and the guide grooves extend from the top of the phase change cavity (201) to the bottom of the phase change cavity (201).
4. The cold plate according to claim 1, characterized in that It also comprises a cover plate (300), a mounting opening is provided on a side of the cooling cavity (202) facing away from the phase change cavity (201), and the cover plate (300) is used to close the mounting opening.
5. The cold plate according to claim 4, characterized in that The groove passes through the partition (203); at least one protrusion (301) is provided on a side of the cover plate (300) close to the cooling cavity (202); when the cover plate (300) closes the installation opening, the protrusion (301) is correspondingly inserted into the groove to form a first flow channel (2023) that matches the shape of the partition (203) between the partition (203) and the cover plate (300); The length of the protrusion (301) is smaller than the length of the groove, so as to form a second flow channel (2024) at both ends of the groove, the second flow channel (2024) is connected to the first flow channel (2023), and the coolant inlet (2021) and the coolant outlet (2022) are correspondingly connected to the two second flow channels (2024).
6. The cold plate according to claim 5, characterized in that A plurality of tooth pieces (2025) are arranged on the side of the partition (203) facing away from the phase change cavity (201); the extension direction of the tooth pieces (2025) is the same as the extension direction of the groove; and the tooth pieces (2025) are located in the first flow channel (2023).
7. The cold plate according to claim 4, characterized in that The cooling cavity (202) is provided with openings at both ends corresponding to the extension direction of the partition (203) to form the cooling liquid inlet (2021) and the cooling liquid outlet (2022); the cover plate (300) is provided with a frame (303); the frame (303) is provided on the outside of the main body (200) and seals the cooling liquid inlet (2021) and the cooling liquid outlet (2022); Two connecting pipes (302) are provided on the frame (303), and the two connecting pipes (302) are connected to the cooling liquid inlet (2021) and the cooling liquid outlet (2022) respectively.
8. The cold plate according to any one of claims 1 to 7, characterized in that: A mounting hole (101) is provided in the middle of the mounting portion (100), and the main body (200) is at least partially inserted into the mounting hole (101) and fixedly connected to the hole wall of the mounting hole (101).
9. The cold plate according to any one of claims 1 to 7, characterized in that: A heat-conducting layer (500) is also provided on the main body (200); one side of the heat-conducting layer (500) is in contact with the outer wall of the cavity, and the other side is used to contact the heat element (400) to be cooled.
10. An electronic device, characterized in that: The invention comprises a device body and the cold plate according to any one of claims 1 to 9, wherein the device body is connected to the cold plate.