Traceable circuit board manufacturing method and system

Abstract

The invention relates to the technical field of circuit board manufacturing, and discloses a traceable circuit board manufacturing method and system, and the method comprises the steps: obtaining a label of a circuit board, corresponding production process operation data and a qualification coefficient threshold value, and building an influence coefficient calculation function; calculating the production process operation data according to the influence coefficient calculation function to obtain a production operation influence coefficient; establishing a parameter matrix according to the production operation influence coefficient; according to the parameter matrix, calculating to obtain a circuit board qualification coefficient; and judging the qualified coefficient of the circuit board and the qualified coefficient threshold value, and performing corresponding operation according to the judgment result. The method has the following effects: the quality of the circuit board can be specifically quantified, and the unqualified circuit board can be found through the set label, so that the operation process with problems in the manufacturing process can be found, the traceability in the manufacturing process of the circuit board can be realized, and the production efficiency of the circuit board can be improved. And the quality of the manufactured circuit board is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a traceable circuit board manufacturing method and system. Background Art

[0002] The circuit board is one of the core components of electronic devices. It carries and connects the various components in the electronic devices, making many functions and circuit integration of electronic devices possible. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, filling, electrical boundaries, etc. The production of circuit boards is a complex and delicate process, which involves multiple links and multiple professional technologies. With the continuous development of electronic technology, the technology of circuit board production is also constantly improving and improving.

[0003] However, with the rapid advancement of technology and the continuous upgrading of market demand, people have put forward more stringent standards for the production quality of circuit boards. The production process of circuit boards is complicated and involves multiple precision processes, each of which has a different degree of impact on the quality of the final product. Given the many factors that affect the circuit board processing process, it is particularly difficult to achieve accurate traceability during the circuit board production process.

[0004] In one prior art, the system first constructs a circuit board manufacturing process database, wherein the circuit board manufacturing process database includes a mapping relationship between process parameters of each circuit board manufacturing process and circuit board conductivity; then, the current process parameter information of the target circuit board is obtained, and the current process parameter information is used to characterize the current process parameters corresponding to the target circuit board manufacturing process in the target circuit board's completed manufacturing process; finally, the current loss rate corresponding to the current process parameter information is determined, and corresponding operations are performed according to the comparison result between the current loss rate and the preset loss rate.

[0005] However, the above-mentioned prior art mainly focuses on how to control the production process of circuit boards, but does not achieve traceability of the circuit board production process, resulting in the inability to accurately find the circuit boards with problems in the production process and the corresponding specific production steps. Summary of the invention

[0006] The present invention provides a traceable circuit board manufacturing method and system to solve the problem that the circuit board production process cannot be accurately traced during the circuit board manufacturing process.

[0007] In a first aspect, in order to solve the above technical problems, the present invention provides a traceable circuit board manufacturing method, comprising: Obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish an influence coefficient calculation function; The production process operation data is calculated according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient; Establishing a parameter matrix according to the production operation influence coefficient; According to the parameter matrix, a circuit board qualification coefficient is calculated; Determine the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0008] In an optional implementation, the production process operation data includes design process data, manufacturing operation data, testing equipment data and relevant production personnel information.

[0009] In an optional implementation, the production process operation data is calculated according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient, including: Calculating the production process operation data according to the influence coefficient calculation function to obtain the solder paste printing height coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the line cutting deviation coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the pad solder height coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient; The solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient are integrated to obtain the production operation influence coefficient.

[0010] In an optional implementation, establishing a parameter matrix according to the production operation influence coefficient includes: Obtaining the production operation influence coefficients of a plurality of circuit boards; Establishing an initial parameter matrix according to the production operation influence coefficient; Performing a normalization operation on the initial parameter matrix to obtain the parameter matrix; The initial parameter matrix is ​​established according to the following formula: in, represents the initial parameter matrix, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of a circuit board, Indicates the total number of circuit boards.

[0011] In an optional implementation manner, calculating the circuit board qualification coefficient according to the parameter matrix includes: The circuit board qualification coefficient is calculated according to the following formula: in, Indicates The circuit board qualification coefficient of the circuit board, Represents the weight of the solder paste printing height coefficient, represents the weight of the line cutting deviation coefficient, represents the weight of the pad solder height coefficient, represents the weight of the circuit board cleanliness factor, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of a circuit board.

[0012] In an optional implementation, the calculating the production process operation data according to the influence coefficient calculation function to obtain the solder paste printing height coefficient includes: The solder paste printing height coefficient is calculated according to the following formula: in, Indicates the solder paste printing height coefficient, Indicates the actual height after solder paste printing. Indicates the standard printing height of solder paste.

[0013] In an optional implementation, the calculating the production process operation data according to the influence coefficient calculation function to obtain the line cutting deviation coefficient includes: The line cutting deviation coefficient is calculated according to the following formula: in, represents the line cutting deviation coefficient, Indicates the actual cutting length of the circuit board. Indicates the standard length of the circuit board.

[0014] In an optional implementation, the calculating the production process operation data according to the influence coefficient calculation function to obtain the pad solder height coefficient includes: The pad solder height coefficient is calculated according to the following formula: in, Represents the pad solder height coefficient, Indicates the actual height of the circuit board after soldering. Indicates the standard height of the circuit board after soldering.

[0015] In an optional implementation, the calculating the production process operation data according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient includes: The circuit board cleaning coefficient is calculated according to the following formula: in, represents the circuit board cleanliness factor, Indicates the actual brightness of the solder joints after the circuit board is cleaned. Indicates the standard brightness of the solder joints after the circuit board is cleaned.

[0016] In a second aspect, the present invention provides a traceable circuit board manufacturing system, comprising: A data acquisition module is used to obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish an influence coefficient calculation function; An influence coefficient calculation module, used to calculate the production process operation data according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient; A matrix establishment module, used to establish a parameter matrix according to the production operation influence coefficient; A qualified coefficient calculation module, used to calculate the qualified coefficient of the circuit board according to the parameter matrix; The result judgment module is used to judge the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0017] In a third aspect, the present invention further provides an electronic device comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements any one of the above-described traceable circuit board manufacturing methods when executing the computer program.

[0018] In a fourth aspect, the present invention further provides a computer-readable storage medium, the computer-readable storage medium comprising a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the traceable circuit board manufacturing methods described above.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a traceable circuit board manufacturing method, comprising obtaining a label of a circuit board, corresponding production process operation data and a qualified coefficient threshold, and establishing an influence coefficient calculation function; calculating the production process operation data according to the influence coefficient calculation function to obtain a production operation influence coefficient; wherein the production operation influence coefficient includes a solder paste printing height coefficient, a line cutting deviation coefficient, a pad solder height coefficient and a circuit board cleaning coefficient; establishing a parameter matrix according to the production operation influence coefficient; calculating a circuit board qualified coefficient according to the parameter matrix; judging the size of the circuit board qualified coefficient and the qualified coefficient threshold; if the circuit board qualified coefficient is less than the qualified coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualified coefficient is greater than the qualified coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0020] The method establishes the influence coefficient calculation function, calculates the production process operation data and establishes the parameter matrix, then calculates the circuit board qualification coefficient, and finally judges the quality of the circuit board according to the circuit board qualification coefficient and the qualification coefficient threshold, so as to perform corresponding operations. The judgment process can specifically quantify the quality of the circuit board, and find the circuit board with unqualified quality through the set label, so as to find the operation process with problems, thereby realizing the traceability of the circuit board production process and further improving the quality of the manufactured circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic flow chart of a traceable circuit board manufacturing method provided by a first embodiment of the present invention; Figure 2 It is a schematic structural diagram of a traceable circuit board manufacturing method provided by the second embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Reference Figure 1 The first embodiment of the present invention provides a traceable circuit board manufacturing method, comprising the following steps: S1, obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish the influence coefficient calculation function.

[0024] S2, calculating the production process operation data according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient.

[0025] S3, establishing a parameter matrix according to the production operation influence coefficient.

[0026] S4, calculating and obtaining the circuit board qualification coefficient according to the parameter matrix.

[0027] S5, judging the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0028] It should be noted that with the development of science and technology and the increase in demand, people have put forward higher requirements for the production quality of circuit boards. However, the production and processing of circuit boards is a complex and delicate process, which often requires multiple closely connected and interdependent processes to complete together, and each process has a different impact on the quality of the circuit board. At the same time, there are many production links that affect the processing technology of circuit boards, and it is difficult to achieve accurate traceability in the production process of circuit boards, so it is impossible to make timely adjustments to unqualified processes in the production process of circuit boards.

[0029] In the present invention, a circuit board manufacturing method that can accurately trace the production process is proposed. In this method, the steps mainly include obtaining the label and production process operation data of the circuit board, and using the influence coefficient calculation function to calculate the production process operation data to obtain the production operation influence coefficient, and then establish a parameter matrix, and calculate the circuit board qualification coefficient according to the parameter matrix, and finally judge whether the circuit board is qualified according to the circuit board qualification coefficient, and find out the specific unqualified operation process of the unqualified circuit board in the production process. Through this method, the accurate tracing of the circuit board production process can be achieved, so that unqualified processes and operations in the production process can be found in time, and adjustments can be made in time.

[0030] In step S1, firstly, the label of each circuit board in the batch, the production process operation data corresponding to the batch and the qualified coefficient threshold are obtained, and then an influence coefficient calculation function for calculating the influence coefficient is established.

[0031] In one embodiment, the production process operation data includes design process data, manufacturing operation data, testing equipment data and relevant production personnel information.

[0032] Specifically, in the circuit board production process, each circuit board will have a corresponding built-in radio frequency identification chip (RFID). The chip stores the device model, label, process operation time, operator and other information of the current circuit board. Therefore, when obtaining the label and production process operation data of the circuit board, it is mainly obtained through the built-in radio frequency identification chip of the circuit board. At the same time, the relevant production process operation data will also be stored in the database, and the correctness of the acquired data can be ensured by comparing it with the database data.

[0033] It should be noted that when an RFID tag enters the magnetic field generated by an RFID reader, the antenna in the tag will capture the radio frequency signal emitted by the reader, and use the energy obtained from the induced current to send out the product information stored in the chip, or actively send a signal of a certain frequency; after the reader reads and decodes the information, it is sent to the central information system for relevant data processing. However, in the presence of metal, moisture and other environmental conditions, RFID identification may be interfered with, affecting the accurate reading of information. In the process of making circuit boards, there will be a large number of metal components, and some components will also emit signals, which will interfere with the RFID signal. Therefore, the data obtained through RFID needs to be compared with the records in the database, or cross-verified with data from other sources (such as barcode scanning, manual entry, etc.) to reduce the risk of misreading caused by interference from environmental factors.

[0034] In step S2, the obtained influence coefficient calculation function is used to calculate the production process operation data to obtain the production operation influence coefficient.

[0035] In one embodiment, the production process operation data is calculated according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient, including the following steps: S21, calculating the production process operation data according to the influence coefficient calculation function to obtain the solder paste printing height coefficient.

[0036] S22, calculating the production process operation data according to the influence coefficient calculation function to obtain the line cutting deviation coefficient.

[0037] S23, calculating the production process operation data according to the influence coefficient calculation function to obtain the pad solder height coefficient.

[0038] S24, calculating the production process operation data according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient.

[0039] S25, integrating the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient to obtain the production operation impact coefficient.

[0040] In step S21, the production process operation data is calculated according to the influence coefficient calculation function to obtain the solder paste printing height coefficient, including: calculating the solder paste printing height coefficient according to the following formula: in, Indicates the solder paste printing height coefficient, Indicates the actual height after solder paste printing. Indicates the standard printing height of solder paste.

[0041] It should be noted that the solder paste printing height coefficient refers to the ratio or relationship between the thickness or height of the solder paste on the printed circuit board and the preset value during the printing process, which determines the contact area and welding strength between the solder paste and the circuit board and electronic components during welding. By calculating the solder paste printing height coefficient, the uniformity and firmness of the welding process and the reliability of the circuit board in long-term use can be quantitatively reflected.

[0042] In step S22, the production process operation data is calculated according to the influence coefficient calculation function to obtain the line cutting deviation coefficient, including: calculating the line cutting deviation coefficient according to the following formula:

[0043] in, represents the line cutting deviation coefficient, Indicates the actual cutting length of the circuit board. Indicates the standard length of the circuit board.

[0044] It should be noted that the circuit cutting deviation coefficient refers to the degree of deviation between the actual cutting size and the theoretical design size during the circuit cutting process of the circuit board. This degree of deviation can be expressed in absolute or relative values, which reflects the accuracy and consistency of the cutting process. By calculating the circuit cutting deviation coefficient, the reliability and stability of the circuit board, as well as the electrical performance characteristics of the circuit board, can be quantitatively reflected.

[0045] In step S23, the production process operation data is calculated according to the influence coefficient calculation function to obtain the pad solder height coefficient, including: calculating the pad solder height coefficient according to the following formula: in, Represents the pad solder height coefficient, Indicates the actual height of the circuit board after soldering. Indicates the standard height of the circuit board after soldering.

[0046] It should be noted that the pad solder height coefficient refers to the proportional relationship between the height of the solder joint formed by the solder during the soldering process and the height of the bottom of the pad or electronic component. This proportional relationship can be expressed as a specific value or range, which reflects the accuracy and consistency of the welding process. By calculating the pad solder height coefficient, the strength and reliability of the welded joint and the electrical performance characteristics of the circuit board can be quantitatively reflected.

[0047] In step S24, the production process operation data is calculated according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient, including: calculating the circuit board cleaning coefficient according to the following formula: in, represents the circuit board cleanliness factor, Indicates the actual brightness of the solder joints after the circuit board is cleaned. Indicates the standard brightness of the solder joints after the circuit board is cleaned.

[0048] It should be noted that the circuit board cleaning coefficient is an indicator to measure the cleanliness of the circuit board surface, which reflects the ability of the circuit board to remove pollutants and residues during the production process. Generally, the circuit board cleaning coefficient is quantitatively calculated by measuring the bright reflection value of the tin point. By calculating the circuit board cleaning coefficient, the phenomenon of electrical connection on the circuit board surface can be quantitatively reflected, thereby improving the transmission quality and stability of the signal. By cleaning the circuit board, component damage caused by corrosion or accumulation of pollutants can be reduced, thereby extending the service life of the circuit board.

[0049] In step S25, it is first necessary to obtain the previously calculated solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient, and then integrate these four coefficients to obtain the production operation influence coefficient.

[0050] Specifically, the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient of a circuit board are first obtained, and then the label of the current circuit board is obtained, and then the label and the data of the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient are stored in the form of a row matrix, and finally the production operation influence coefficient of a circuit board is obtained.

[0051] It should be noted that the process of integrating these four coefficients is to collect these four coefficients and the labels of the circuit boards corresponding to the coefficients, and then store the production operation influence coefficients of the current circuit board in the form of a matrix. Since the production of circuit boards is usually carried out in batches, the above data collection and matrix storage steps need to be repeated many times. A single production operation influence coefficient only represents the production data of one circuit board. This means that at every stage of the entire batch production, it is necessary to continuously obtain the data of the newly produced circuit boards from the production line and update them to the matrix in real time.

[0052] In step S3, a parameter matrix is ​​established based on the calculated production operation influence coefficients for subsequent calculation of circuit board qualification coefficients.

[0053] In one embodiment, establishing a parameter matrix according to the production operation influence coefficient comprises the following steps: S31, obtaining the production operation influence coefficients of multiple circuit boards.

[0054] S32, establishing an initial parameter matrix according to the production operation influence coefficient.

[0055] S33, performing a normalization operation on the initial parameter matrix to obtain the parameter matrix.

[0056] In step S31, the production operation influence coefficients of the plurality of circuit boards produced in the current batch are obtained.

[0057] It should be noted that the obtained production operation influence coefficient may contain missing values, or abnormal values ​​whose values ​​differ too much from other values. Since missing values ​​will cause errors in the matrix establishment process and the matrix cannot be established, it can be directly judged that the quality of the corresponding circuit board is unqualified; and abnormal values ​​generally indicate that there may be some abnormal conditions in the production process, such as abnormal operation of equipment, quality problems of raw materials or operational errors, so the quality of the corresponding circuit board can also be judged as unqualified. Finally, it is necessary to output the labels of the unqualified circuit boards and skip the data in the matrix establishment process to improve the efficiency of subsequent calculations.

[0058] In step S32, the initial parameter matrix is ​​established according to the obtained production operation influence coefficient.

[0059] Specifically, the initial parameter matrix is ​​established according to the following formula: in, represents the initial parameter matrix, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of the circuit board Indicates the total number of circuit boards.

[0060] It should be noted that when establishing the initial parameter matrix, it is necessary to strictly ensure that the order of the matrix elements corresponds to the labels of the circuit board, so as to ensure that the corresponding circuit board can be correctly found when the unqualified labels are found later. At the same time, the four columns of the matrix should correspond to the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient, that is, the same column should represent the same coefficient. This setting ensures that the data in each column represents the same type of coefficient, which is convenient for subsequent data analysis and processing. There is no requirement for the order of arrangement between columns.

[0061] In step S33, a normalization operation is performed on the established initial parameter matrix to obtain the parameter matrix.

[0062] Specifically, the initial parameter matrix is ​​normalized according to the following formula: in, represents the parameter matrix after normalization operation, represents the matrix elements after normalization operation, Represents the initial parameter matrix The smallest element of a column, Represents the initial parameter matrix The smallest element of a column, Represents the total number of circuit boards. After the parameter matrix is ​​calculated, the initial parameter matrix can be deleted to save storage space.

[0063] It should be noted that the normalization operation can scale the data to a specific range. The normalized data has a similar scale, which can make all features have the same importance in the calculation process, thereby improving the accuracy of the judgment. At the same time, the normalized data is more intuitive and easy to understand when visualized, which facilitates faster adjustments in subsequent calculations. Therefore, it is necessary to normalize the parameter matrix.

[0064] In step S4, the processed parameter matrix is ​​obtained, and the circuit board qualification coefficient is calculated according to the parameter matrix using a set formula.

[0065] In one embodiment, the circuit board qualification coefficient is calculated according to the parameter matrix, including: the circuit board qualification coefficient is calculated according to the following formula: in, Indicates The circuit board qualification coefficient of the circuit board, Represents the weight of the solder paste printing height coefficient, represents the weight of the line cutting deviation coefficient, represents the weight of the pad solder height coefficient, represents the weight of the circuit board cleanliness factor, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of a circuit board.

[0066] It should be noted that the weight coefficient in the formula is used to adjust the proportion of the four coefficients in the circuit board manufacturing process. Each coefficient has a different impact on the circuit board, and will be affected by objective factors such as the manufacturing process, circuit board model and function, and production environment. Therefore, when setting the weight of each coefficient, it is necessary to consider the above factors to adjust the weight coefficient so as to accurately reflect the qualified status of the circuit board.

[0067] In step S5, it is necessary to obtain the circuit board qualification coefficient and the qualification coefficient threshold, and then determine the size between the two; if the circuit board qualification coefficient is less than the qualification coefficient threshold, it is determined that the quality of the current circuit board is unqualified, and the label corresponding to the circuit board is output to relevant personnel as a reminder; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, it is determined that the quality of the current circuit board is qualified, and the label and the production process operation data are saved to the corresponding location.

[0068] It should be noted that the judgment process needs to be repeated several times to complete the judgment of all circuit boards produced in the batch. At the same time, sufficient storage space needs to be reserved in advance to store the labels and production process operation data of multiple circuit boards.

[0069] To facilitate understanding of the present invention, the working process of the present invention is described below using a relatively common scenario as an example.

[0070] In this embodiment, a traceable circuit board manufacturing system is planned to be used. The system is designed to be able to record various data in the circuit board manufacturing process and find the specific process where the problem of the unqualified circuit board occurs based on the data, thereby improving the manufacturing quality of the circuit board.

[0071] Step 1: Obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold through the wireless radio frequency identification chip built into the circuit board.

[0072] Step 2: Establish a set of influence coefficient calculation functions in advance.

[0073] Step 3: Use the impact coefficient calculation function to calculate the production process operation data to obtain the production data impact coefficient.

[0074] Step 4: Establish a parameter matrix based on the production operation impact coefficients and corresponding circuit board labels.

[0075] Step 5: Based on the parameter matrix, use the formula to calculate the circuit board qualification coefficient.

[0076] Step six: Determine the size between the calculated circuit board qualification coefficient and the obtained qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, then determine that the quality of the current circuit board is unqualified, and output the label corresponding to the circuit board to relevant personnel as a reminder; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, then determine that the quality of the current circuit board is qualified, and save the label and the production process operation data to the corresponding location.

[0077] Through the above steps, the system can trace each step in the circuit board manufacturing process, so as to find out the unqualified processes in the production process, thereby improving the manufacturing quality of the circuit board.

[0078] In summary, the present invention provides a traceable circuit board manufacturing method, including obtaining a label of a circuit board, corresponding production process operation data and a qualified coefficient threshold, and establishing an influence coefficient calculation function; calculating the production process operation data according to the influence coefficient calculation function to obtain a production operation influence coefficient; wherein the production operation influence coefficient includes a solder paste printing height coefficient, a line cutting deviation coefficient, a pad solder height coefficient and a circuit board cleaning coefficient; establishing a parameter matrix according to the production operation influence coefficient; calculating a circuit board qualified coefficient according to the parameter matrix; judging the size of the circuit board qualified coefficient and the qualified coefficient threshold; if the circuit board qualified coefficient is less than the qualified coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualified coefficient is greater than the qualified coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0079] The method establishes the influence coefficient calculation function, calculates the production process operation data and establishes the parameter matrix, then calculates the circuit board qualification coefficient, and finally judges the quality of the circuit board according to the circuit board qualification coefficient and the qualification coefficient threshold, so as to perform corresponding operations. The judgment process can specifically quantify the quality of the circuit board, and find the circuit board with unqualified quality through the set label, so as to find the operation process with problems, thereby realizing the traceability of the circuit board production process and further improving the quality of the manufactured circuit board.

[0080] Reference Figure 2 The second embodiment of the present invention provides a traceable circuit board manufacturing system, comprising: A data acquisition module is used to obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish an influence coefficient calculation function; Among them, the data acquisition module includes a circuit board data acquisition module, which is used to obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold; and an algorithm establishment module, which is used to establish an influence coefficient calculation function.

[0081] An influence coefficient calculation module, used to calculate the production process operation data according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient; Among them, the influence coefficient calculation module includes a solder paste printing height coefficient calculation module, which is used to calculate the solder paste printing height coefficient; a line cutting deviation coefficient calculation module, which is used to calculate the line cutting deviation coefficient; a pad solder height coefficient calculation module, which is used to calculate the pad solder height coefficient; a circuit board cleanliness coefficient calculation module, which is used to calculate the circuit board cleanliness coefficient; a production operation influence coefficient integration module, which is used to integrate the calculated solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleanliness coefficient.

[0082] A matrix establishment module, used to establish a parameter matrix according to the production operation influence coefficient; Among them, the matrix establishment module includes an initial parameter matrix establishment module, which is used to establish an initial parameter matrix according to the production operation influence coefficient; and a parameter normalization module, which is used to perform normalization operation on the initial parameter matrix to obtain the parameter matrix.

[0083] A qualified coefficient calculation module, used to calculate the qualified coefficient of the circuit board according to the parameter matrix; Among them, the qualified coefficient calculation module includes a weight acquisition module, which is used to obtain the weight of each production operation influencing coefficient; and a coefficient calculation module, which is used to calculate the qualified coefficient of the circuit board using a set formula based on the parameter matrix and the acquired weight.

[0084] The result judgment module is used to judge the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

[0085] Among them, the result judgment module includes a judgment module, which is used to judge the size of the circuit board qualification coefficient and the qualification coefficient threshold; an output label module, which is used to judge that the quality of the current circuit board is unqualified when the circuit board qualification coefficient is less than the qualification coefficient threshold, and output the label; a data storage module, which is used to judge that the quality of the current circuit board is qualified when the circuit board qualification coefficient is greater than the qualification coefficient threshold, and save the label and the production process operation data.

[0086] It should be noted that the traceable circuit board manufacturing system provided in the embodiment of the present invention is used to execute all the process steps of the traceable circuit board manufacturing method in the above embodiment, and the working principles and beneficial effects of the two correspond one to one, so they are not described in detail.

[0087] An embodiment of the present invention further provides an electronic device. The electronic device includes: a processor, a memory, and a computer program stored in the memory and executable on the processor, such as a traceable circuit board manufacturing program. When the processor executes the computer program, the steps in the above-mentioned traceable circuit board manufacturing method embodiments are implemented, such as Figure 1 Alternatively, when the processor executes the computer program, the functions of each module / unit in the above-mentioned system embodiments are realized, such as the influence coefficient calculation module.

[0088] Exemplarily, the computer program may be divided into one or more modules / units, which are stored in the memory and executed by the processor to implement the present invention. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program in the electronic device.

[0089] The electronic device may be a computing device such as a desktop computer, a notebook, a PDA, and a smart tablet. The electronic device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that the above components are merely examples of electronic devices and do not constitute a limitation on the electronic device. The electronic device may include more or fewer components than the above components, or may combine certain components, or different components. For example, the electronic device may also include input and output devices, network access devices, buses, etc.

[0090] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the electronic device, and uses various interfaces and lines to connect various parts of the entire electronic device.

[0091] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the electronic device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0092] Wherein, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0093] It should be noted that the system embodiment described above is merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the system embodiment provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0094] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A traceable circuit board manufacturing method, characterized in that: include: Obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish an influence coefficient calculation function; The production process operation data is calculated according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient; Establishing a parameter matrix according to the production operation influence coefficient; According to the parameter matrix, a circuit board qualification coefficient is calculated; Determine the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

2. The traceable circuit board manufacturing method according to claim 1, characterized in that: The production process operation data includes design process data, production operation data, testing equipment data and relevant production personnel information.

3. The traceable circuit board manufacturing method according to claim 1, characterized in that: The production process operation data is calculated according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient, including: Calculating the production process operation data according to the influence coefficient calculation function to obtain the solder paste printing height coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the line cutting deviation coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the pad solder height coefficient; Calculating the production process operation data according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient; The solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient are integrated to obtain the production operation influence coefficient.

4. The traceable circuit board manufacturing method according to claim 1, characterized in that: The step of establishing a parameter matrix according to the production operation influence coefficient comprises: Obtaining the production operation influence coefficients of a plurality of circuit boards; Establishing an initial parameter matrix according to the production operation influence coefficient; Performing a normalization operation on the initial parameter matrix to obtain the parameter matrix; The initial parameter matrix is ​​established according to the following formula: in, represents the initial parameter matrix, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of a circuit board, Indicates the total number of circuit boards.

5. The traceable circuit board manufacturing method according to claim 1, characterized in that: The step of calculating the circuit board qualification coefficient according to the parameter matrix includes: The circuit board qualification coefficient is calculated according to the following formula: in, Indicates The circuit board qualification coefficient of the circuit board, Represents the weight of the solder paste printing height coefficient, represents the weight of the line cutting deviation coefficient, represents the weight of the pad solder height coefficient, represents the weight of the circuit board cleanliness factor, Indicates The solder paste printing height coefficient of a circuit board, Indicates The line cutting deviation coefficient of a circuit board, Indicates The solder height factor of the pad of the circuit board, Indicates The circuit board cleanliness factor of a circuit board.

6. The traceable circuit board manufacturing method according to claim 3, characterized in that: The step of calculating the production process operation data according to the influence coefficient calculation function to obtain the solder paste printing height coefficient includes: The solder paste printing height coefficient is calculated according to the following formula: in, Indicates the solder paste printing height coefficient, Indicates the actual height after solder paste printing. Standard printing height.

7. The traceable circuit board manufacturing method according to claim 3, characterized in that: The step of calculating the production process operation data according to the influence coefficient calculation function to obtain the line cutting deviation coefficient includes: The line cutting deviation coefficient is calculated according to the following formula: in, represents the line cutting deviation coefficient, Indicates the actual cutting length of the circuit board. Indicates the standard length of the circuit board.

8. The traceable circuit board manufacturing method according to claim 3, characterized in that: The step of calculating the production process operation data according to the influence coefficient calculation function to obtain the pad solder height coefficient includes: The pad solder height coefficient is calculated according to the following formula: in, Represents the pad solder height coefficient, Indicates the actual height of the circuit board after soldering. Indicates the standard height of the circuit board after soldering.

9. The traceable circuit board manufacturing method according to claim 3, characterized in that: The step of calculating the production process operation data according to the influence coefficient calculation function to obtain the circuit board cleaning coefficient includes: The circuit board cleaning coefficient is calculated according to the following formula: in, represents the circuit board cleanliness factor, Indicates the actual brightness of the solder joints after cleaning the circuit board. Indicates the standard brightness of the solder joints after the circuit board is cleaned.

10. A traceable circuit board production system, characterized in that: include: A data acquisition module is used to obtain the label of the circuit board, the corresponding production process operation data and the qualified coefficient threshold, and establish an influence coefficient calculation function; An influence coefficient calculation module, used to calculate the production process operation data according to the influence coefficient calculation function to obtain the production operation influence coefficient; wherein the production operation influence coefficient includes the solder paste printing height coefficient, the line cutting deviation coefficient, the pad solder height coefficient and the circuit board cleaning coefficient; A matrix establishment module, used to establish a parameter matrix according to the production operation influence coefficient; A qualified coefficient calculation module, used to calculate the qualified coefficient of the circuit board according to the parameter matrix; The result judgment module is used to judge the size of the circuit board qualification coefficient and the qualification coefficient threshold; if the circuit board qualification coefficient is less than the qualification coefficient threshold, the quality of the current circuit board is unqualified, and the label is output; if the circuit board qualification coefficient is greater than the qualification coefficient threshold, the quality of the current circuit board is qualified, and the label and the production process operation data are saved.

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