Low-temperature photoresist removing equipment

Abstract

The low-temperature photoresist removing equipment comprises a body and a blocking assembly, the body is provided with a process cavity, an inlet and an outlet, the inlet and the outlet are communicated with the process cavity, the inlet and the outlet are oppositely arranged, and process gas is suitable for flowing into the process cavity through the inlet and flowing out of the process cavity through the outlet; the blocking assembly is arranged in the process cavity and is arranged between the inlet and the outlet so as to divide the process cavity into a working cavity and an outflow cavity, a plurality of communicating parts are formed in the blocking assembly, and any communicating part is communicated with the working cavity and the outflow cavity; wherein the inlet is communicated with the working cavity, the outlet is communicated with the outflow cavity, the working cavity is suitable for containing a workpiece to be machined, and the blocking assembly is suitable for blocking flowing of process gas, so that when the process gas flows from the working cavity to the outflow cavity, the blocking assembly blocks flowing of the process gas and enables the process gas to flow into the outflow cavity through all the communicating parts. The low-temperature photoresist removing equipment with the structure can improve the processing uniformity of the surface of the workpiece to be processed.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and in particular to a low-temperature debonding device. Background Art

[0002] Chips are the cornerstone of modern information technology and are widely used. The chip manufacturing process involves glue coating, metal plating, indium column growth, and stripping. The purpose of stripping is to remove unnecessary metal thin layers and photoresist to make metal patterns.

[0003] In the prior art, low-temperature stripping equipment is a device for performing a stripping process, which ionizes the process gas through a coil to ionize the process gas into plasma, and guides the plasma to a cavity where the wafer is placed through a guide ring, so that the plasma contacts the photoresist on the surface of the wafer, and then etches the photoresist. In addition, the low-temperature stripping equipment is also provided with a cooling system and a bias power supply, so that the cooling system controls the temperature in the cavity where the wafer is placed, so that the temperature in the cavity is controlled within a low temperature range, and the bias power supply can improve the low-temperature process capability of the plasma, thereby increasing the rate at which the plasma etches the photoresist on the surface of the wafer.

[0004] However, the existing low-temperature debonding equipment guides the plasma into the cavity where the wafer is placed through a guide ring, so that the plasma gathers more at the exit of the guide ring, which in turn makes the etching rate of the wafer in the cavity different, resulting in poor uniformity of debonding on the wafer surface. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the efficiency and safety of the existing low-temperature degumming equipment cannot meet the construction of the suspension bridge in a complex and changing construction environment.

[0006] To this end, the present invention provides a low-temperature degumming device, comprising:

[0007] A body, wherein the body has a process chamber and an inlet and an outlet connected to the process chamber, the inlet and the outlet are arranged opposite to each other, and the process gas is suitable for flowing into the process chamber through the inlet and flowing out of the process chamber through the outlet;

[0008] A blocking component is arranged in the process chamber and between the inlet and the outlet to separate the process chamber into a working chamber and an outflow chamber. The blocking component is provided with a plurality of connecting parts, and any of the connecting parts connects the working chamber and the outflow chamber.

[0009] Wherein, the inlet is connected with the working chamber, the outlet is connected with the outflow chamber, and the working chamber is suitable for placing the workpiece to be processed, and the blocking component is suitable for blocking the flow of process gas, so that when the process gas flows from the working chamber to the outflow chamber, the blocking component blocks the flow of process gas and allows the process gas to flow into the outflow chamber through all the connecting parts.

[0010] Optionally, in the above-mentioned low-temperature debonding device, the blocking component includes a blocking member and a flow guide member, the flow guide member is arranged on the blocking member and arranged in the outflow cavity, and all the communication parts are opened on the blocking member corresponding to the flow guide member;

[0011] The flow guide member is provided with a plurality of flow guide portions, any of the flow guide portions is connected to a corresponding connecting portion, and the axis of the flow guide portion is perpendicular to the axis of the connecting portion.

[0012] Optionally, the above-mentioned low-temperature degumming equipment further includes an ionization component, which is arranged in the working chamber. Under the action of electricity, the ionization component is suitable for ionizing the process gas into plasma, and the plasma is suitable for etching the workpiece to be processed.

[0013] Optionally, the above-mentioned low-temperature debonding equipment further includes a guide member, which is arranged in the working chamber and between the ionization member and the blocking member, and the guide member is suitable for guiding the plasma.

[0014] Optionally, in the above-mentioned low-temperature adhesive removal equipment, a mounting portion is provided on the blocking member, and the mounting portion avoids all the connecting portions;

[0015] It also includes a cooling member, which is arranged in the installation portion and is suitable for cooling the plasma under the action of electricity. The workpiece to be processed is suitable for being arranged on the cooling member.

[0016] Optionally, the above-mentioned low-temperature degumming equipment further includes a power supply component, which is arranged on the main body. Under the action of electricity, the power supply component is suitable for providing a bias voltage to the workpiece to be processed in the working chamber.

[0017] Optionally, in the above-mentioned low-temperature degumming equipment, the main body has at least two process chambers, the two process chambers are arranged at intervals, and the blocking component, the ionization component, the guide component and the power supply component are correspondingly arranged in any one of the process chambers.

[0018] Optionally, in the above-mentioned low-temperature degumming equipment, the main body includes a partition, and the partition is arranged between the two process chambers to separate the two process chambers and enable the two process chambers to be arranged at intervals.

[0019] Optionally, in the above-mentioned low-temperature debonding equipment, a clearance portion is provided on one side of the partition, the clearance portion connects the two process chambers, and the clearance portion is suitable for providing a working space for an external robot.

[0020] Optionally, the above-mentioned low-temperature debonding equipment further includes at least two partitions, which are respectively arranged on both sides of the yielding portion, and one end of any partition is connected to the partition, and the other end extends into one of the working chambers.

[0021] The technical solution provided by the present invention has the following advantages:

[0022] 1. The low-temperature degumming equipment provided by the present invention is provided with a blocking component in a main body, wherein the main body has a process chamber and an inlet and an outlet connected to the process chamber, and the inlet and the outlet are arranged relative to each other, and the process gas can flow into the process chamber through the inlet and can also flow out of the process chamber through the outlet, and the blocking component is specifically arranged in the process chamber and between the inlet and the outlet, so as to separate the process chamber into a working chamber and an outflow chamber, and the inlet is connected to the working chamber, and the outlet is connected to the outflow chamber, and at the same time, a plurality of connecting parts are provided on the blocking component, each of which can connect the working chamber and the outflow chamber, so that the process gas flowing into the working chamber through the inlet flows to the outlet. When the process gas flows from the working chamber to the outflow chamber, it must pass through the connecting part on the blocking component, and then the process gas can flow out of the outflow chamber through the outlet. In addition, the workpiece to be processed can be placed in the working chamber. When the process gas flows into the working chamber through the inlet, the process gas will contact the surface of the workpiece to be processed, so as to process the workpiece. Due to the blocking of the blocking component, most of the process gas accumulates in the working chamber, and a small part flows into the outflow chamber through the connecting part, so that the distribution of the process gas in the working chamber is more uniform, so that the amount of process gas dispersed on the surface of the workpiece to be processed is more even, thereby improving the processing uniformity of the surface of the workpiece to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a vertical cross-sectional schematic diagram of a low-temperature adhesive removal device provided in an embodiment of the present invention;

[0025] Figure 2 A schematic cross-sectional view of a process chamber of a low-temperature debonding device provided in an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of the first viewing angle structure of a blocking component provided in an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of the structure of a blocking component provided in an embodiment of the present invention from a second viewing angle;

[0028] Figure 5 A schematic cross-sectional view of a blocking assembly provided in an embodiment of the present invention;

[0029] Figure 6 Provided in the embodiments of the present invention Figure 5 Schematic diagram at A in the middle;

[0030] Figure 7 It is a schematic transverse cross-sectional view of a low-temperature debonding device provided in an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of the structure of a barrier member provided in an embodiment of the present invention;

[0032] Fig. 9 A schematic plan view of a barrier member provided in an embodiment of the present invention;

[0033] Description of reference numerals:

[0034] 1-body; 11-process chamber; 111-working chamber; 112-outflow chamber; 12-inlet; 13-outlet; 14-separator;

[0035] 2-blocking assembly; 21-blocking member; 211-connecting portion; 212-installing portion; 22-flow guide member; 221-flow guide portion;

[0036] 3-ionization component; 4-guide component; 5-cooling component; 6-power supply component; 7-blocking component. DETAILED DESCRIPTION

[0037] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0041] Example 1

[0042] This embodiment provides a low-temperature degumming device, such as Figures 1 to 9 As shown, it includes a main body 1 and a blocking component 2, the main body 1 has a process chamber 11 and an inlet 12 and an outlet 13 connected to the process chamber 11, the inlet 12 and the outlet 13 are arranged opposite to each other, the process gas is suitable for flowing into the process chamber 11 through the inlet 12, and is suitable for flowing out of the process chamber 11 through the outlet 13; the blocking component 2 is arranged in the process chamber 11 and between the inlet 12 and the outlet 13, so as to separate the process chamber 11 into a working chamber 111 and an outflow chamber 112, and a plurality of connecting parts 211 are opened on the blocking component 2, and any connecting part 211 connects the working chamber 111 and the outflow chamber 112; wherein, the inlet 12 is connected to the working chamber 111, the outlet 13 is connected to the outflow chamber 112, and the working chamber 111 is suitable for placing the workpiece to be processed, and the blocking component 2 is suitable for blocking the flow of the process gas, so that when the process gas flows from the working chamber 111 to the outflow chamber 112, the blocking component 2 blocks the flow of the process gas, and allows the process gas to flow into the outflow chamber 112 through all the connecting parts 211.

[0043] The low-temperature degumming equipment of the above structure is provided with a blocking component 2 in a main body 1, wherein the main body 1 has a process chamber 11 and an inlet 12 and an outlet 13 connected to the process chamber 11, and the inlet 12 and the outlet 13 are arranged relative to each other, and the process gas can flow into the process chamber 11 through the inlet 12 and can also flow out of the process chamber 11 through the outlet 13, and the blocking component 2 is specifically arranged in the process chamber 11 and between the inlet 12 and the outlet 13, so as to separate the process chamber 11 into a working chamber 111 and an outlet chamber 112. The inlet 12 is connected to the working chamber 111, and the outlet 13 is connected to the outflow chamber 112. At the same time, a plurality of connecting parts 211 are provided on the blocking component 2, and each connecting part 211 can connect the working chamber 111 and the outflow chamber 112, so that the process gas flowing into the working chamber 111 through the inlet 12 must flow from the working chamber 111 to the outflow chamber 112 through the connecting part 211 on the blocking component 2 when flowing to the outlet 13, and then the process gas can flow out of the outflow chamber 112 through the outlet 13.

[0044] In addition, the workpiece to be processed can be placed in the working chamber 111. When the process gas flows into the working chamber 111 through the inlet 12, the process gas will contact the surface of the workpiece to be processed, thereby processing the workpiece. Due to the blocking of the blocking component 2, most of the process gas accumulates in the working chamber 111, and a small part flows into the outflow chamber 112 through the connecting portion 211, so that the distribution of the process gas in the working chamber 111 is more uniform, so that the amount of process gas dispersed on the surface of the workpiece to be processed is more even, thereby improving the processing uniformity of the surface of the workpiece to be processed.

[0045] This embodiment provides a low-temperature degumming device, such as Figures 3 to 6 As shown, the blocking assembly 2 includes a blocking member 21 and a guide member 22. The guide member 22 is arranged on the blocking member 21 and in the outflow chamber 112. All the connecting parts 211 are opened on the blocking member 21 corresponding to the guide member 22. A plurality of guide parts 221 are opened on the guide member 22. Any guide part 221 is connected to a connecting part 211 correspondingly, and the axis of the guide part 221 is perpendicular to the axis of the connecting part 211.

[0046] The low-temperature degumming equipment of the above structure is provided with a blocking component 2 including a blocking member 21 and a guide member 22. The blocking member 21 and the guide member 22 are respectively a blocking plate and a guide ring in the present embodiment, wherein the blocking member 21 is arranged in the process chamber 11 and between the inlet 12 and the outlet 13, and the guide member 22 is arranged on the blocking member 21 and in the outflow chamber 112. All the connecting parts 211 are opened on the blocking member 21 corresponding to the guide member 22, and a plurality of guide parts 221 are opened on the guide member 22. The guide part 221 is a guide hole in the present embodiment, and each guide part 221 is connected to a connecting part 211, so that after the process gas flows from the working chamber 111 into the connecting part 211, the process gas can flow into the outflow chamber 112 through the guide part 221.

[0047] In addition, the axis of the connecting portion 211 is arranged perpendicular to the axis of the guide portion 221, so that when the process gas flows from the connecting portion 211 into the guide portion 221 and flows into the outflow chamber 112 through the guide portion 221, the flow time of the process gas will increase, and the guide portion 221 can also provide a blocking effect on the process gas, preventing the process gas from directly flowing to the outlet through the connecting portion 211, thereby allowing a larger portion of the process gas flowing into the working chamber 111 through the inlet 12 to accumulate in the working chamber 111, which is beneficial to further improve the uniformity of the process gas in the working chamber 111; at the same time, the opening positions of the connecting portion 211 and the guide portion 221 are set to be chamfered, and the connection between the connecting portion 211 and the guide portion 221 is set to be rounded, this is to avoid the situation where the gas directly hits the sharp edge and rebounds when flowing into the connecting portion 211, which is beneficial to improve the flow efficiency of the process gas.

[0048] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 As shown, an ionization element 3 is also included. The ionization element 3 is arranged in the working chamber 111. Under the action of electricity, the ionization element 3 is suitable for ionizing the process gas into plasma, and the plasma is suitable for etching the workpiece to be processed.

[0049] The low-temperature degumming equipment of the above structure is provided with an ionization element 3 in the working chamber 111. The ionization element 3 is a coil in this embodiment. When the process gas flows into the working chamber 111 through the inlet 12, the coil can ionize the process gas in an energized state, so that the process gas is ionized into plasma, and the plasma is the main gas for processing the workpiece to be processed. This is because the workpiece to be processed is mainly a wafer, and the plasma can etch the wafer, thereby realizing the processing of the workpiece to be processed.

[0050] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1As shown, it also includes a guide member 4, which is arranged in the working chamber 111 and between the ionization member 3 and the blocking member 21, and the guide member 4 is suitable for guiding plasma.

[0051] The low-temperature degumming equipment of the above structure is provided with a guide member 4 in the working chamber 111. The guide member 4 in this embodiment is a guide ring. The guide member 4 is specifically provided between the ionization member 3 and the blocking member 21. Therefore, after the ionization member 3 ionizes the process gas into plasma, the guide member 4 can guide the plasma to the blocking member 21, thereby preventing the plasma from flowing everywhere in the working chamber 111 and affecting the processing efficiency of the workpiece to be processed.

[0052] The low temperature degumming equipment provided in this embodiment is as follows: Figures 1 to 3 As shown, the blocking member 21 is provided with a mounting portion 212, and the mounting portion 212 avoids all the connecting portions 211; it also includes a cooling member 5, which is arranged in the mounting portion 212, and under the action of electricity, the cooling member 5 is suitable for cooling the plasma, and the workpiece to be processed is suitable for being arranged on the cooling member 5.

[0053] The low-temperature degumming equipment of the above structure is provided with a mounting portion 212 on the blocking member 21 and a cooling member 5 arranged in the mounting portion 212. The mounting portion 212 in this embodiment is a mounting hole. The mounting portion 212 is specifically provided on the blocking member 21 to avoid all the connecting portions 211. Therefore, when the cooling member 5 is installed on the mounting portion 212, the cooling member 5 will not block any connecting portion 211, thereby ensuring the normal flow of plasma. In addition, the workpiece to be processed can be placed on the cooling member 5, and the cooling member 5 can also cool the plasma under the action of electricity, so that the plasma can etch the workpiece to be processed at its optimal etching temperature, which is beneficial to improve the etching efficiency of the workpiece to be processed.

[0054] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 As shown, it also includes a power supply 6, which is arranged on the body 1. Under the action of electricity, the power supply 6 is suitable for providing a bias voltage to the workpiece to be processed in the working chamber 111.

[0055] The low-temperature degumming equipment of the above structure is provided with a power supply 6 on the main body 1. The power supply 6 is a bias power supply in this embodiment. Since the main body 1 and the cooling member 5 are both made of aluminum, the power supply 6 can apply current to the main body 1 under the action of electric power, thereby generating an electromagnetic field in the working chamber 111, and forming an electromagnetic field perpendicular to the surface of the cooling member on the surface of the cooling member 5 to apply a bias to the workpiece to be processed. At the same time, the electromagnetic field can ionize the workpiece to be processed placed on the cooling member 5 in the working chamber 111, so that the workpiece to be processed can obtain better molecular activity, thereby accelerating the etching reaction of the workpiece to be processed with the plasma, which is beneficial to further improve the etching efficiency of the workpiece to be processed.

[0056] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 and Figure 2 As shown, the main body 1 has at least two process chambers 11 , the two process chambers 11 are arranged at intervals, and a blocking component 2 , an ionizing component 3 , a guide component 4 and a power supply component 6 are correspondingly arranged in any process chamber 11 .

[0057] The low-temperature degumming equipment of the above structure is provided with a main body 1 having two process chambers 11, the two process chambers 11 are arranged at intervals, and each process chamber 11 is correspondingly provided with a blocking component 2, an ionizing component 3, a guide component 4 and a power supply component 6, so that the main body 1 can process two workpieces to be processed at the same time, which is beneficial to improve the processing efficiency of the workpieces to be processed.

[0058] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 and Figure 2 As shown, the body 1 includes a partition 14, which is disposed between the two process chambers 11 to separate the two process chambers 11 and allow the two process chambers 11 to be spaced apart.

[0059] The low-temperature degumming equipment of the above structure also includes a partition 14 by setting the main body 1. The partition 14 is a partition plate in this embodiment. The partition 14 is specifically arranged between the two process chambers 11, so as to separate the two process chambers 11, so that the two process chambers 11 are arranged at a distance, thereby avoiding the process chambers 11 from affecting each other when processing the workpiece to be processed.

[0060] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 and Figure 2 As shown, a clearance portion is provided on one side of the partition 14 , the clearance portion connects the two process chambers 11 , and the clearance portion is suitable for providing a working space for an external robot.

[0061] The low-temperature degumming equipment of the above structure is provided with a yielding portion on the partition 14. The yielding portion is a yielding groove in the present embodiment. The yielding portion is specifically provided on one side of the partition 14, and the yielding portion can connect the two process chambers 11, so that when an external robot places the workpiece to be processed into the two working chambers 111 at the same time, the external robot can extend into the two working chambers 111 at the same time through the yielding portion.

[0062] The low temperature degumming equipment provided in this embodiment is as follows: Figure 1 and Figure 2 As shown, at least two barrier members 7 are also included. The two barrier members 7 are respectively arranged on both sides of the yielding portion, and one end of any barrier member 7 is connected to the partition 14 , and the other end extends into a working chamber 111 .

[0063] The low-temperature degumming equipment of the above structure is provided with two partition members 7 on the partition member 14. The partition member 7 in this embodiment is a baffle plate. The two partition members 7 are respectively provided on both sides of the making way portion, and one end of each partition member 7 is connected to the partition member 14, and the other end extends into a working chamber 111 respectively, so that when the plasma in the working chamber 111 flows toward the making way portion, the partition member 7 can re-introduce the plasma into the working chamber 111.

[0064] In addition, the barrier member 7 is specifically made of aluminum, so that when the power supply 6 provides an electromagnetic field to the working chamber 111, the barrier member 7 can block the electromagnetic fields in the two working chambers 111 to avoid mutual interference between the electromagnetic fields in the two working chambers 111, thereby causing inconsistency in the electromagnetic fields generated in the two working chambers 111, making it impossible for the power supply 6 to apply a stable bias to the workpiece to be processed. When the electromagnetic field generated in the working chamber 111 moves toward the yielding portion, the electromagnetic field will hit the barrier member 7. Since the barrier member 7 is connected to the main body 1, the electromagnetic field is directly conducted away through the main body 1. Therefore, through the barrier member 7, the electromagnetic fields in the two working chambers 111 will not interfere with each other.

[0065] like Figure 8 and Fig. 9 As shown, the surface of the barrier 7 is specifically configured to be arc-shaped, and rounded transitions are also provided at its corners. This is because the plasma is in an irregular wandering state in the working chamber 111. After the barrier 7 is installed, if the barrier 7 is straight-edged or has no rounded corners, the free plasma will directly hit the straight edges or sharp corners on the barrier 7 and be bounced back at these positions, resulting in the plasma being unable to form a loop, which will cause the plasma to be unable to evenly act on the surface of the entire workpiece to be processed, and will reduce the processing uniformity of the workpiece to be processed.

[0066] The low-temperature degumming equipment provided by the present invention is provided with a blocking component 2 arranged in a main body 1, wherein the main body 1 has a process chamber 11 and an inlet 12 and an outlet 13 connected to the process chamber 11, and the inlet 12 and the outlet 13 are arranged relative to each other, and the process gas can flow into the process chamber 11 through the inlet 12, and can also flow out of the process chamber 11 through the outlet 13, and the blocking component 2 is specifically arranged in the process chamber 11 and between the inlet 12 and the outlet 13, so as to separate the process chamber 11 into a working chamber 111 and an outflow chamber 112, and the inlet 12 is connected to the working chamber 111, and the outlet 13 is connected to the outflow chamber 112, and at the same time, a plurality of connecting parts 211 are provided on the blocking component 2, and each connecting part 211 can connect the working chamber 111 and the outflow chamber 112, so that the gas flowing into the working chamber through the inlet 12 When the process gas in the chamber 111 flows toward the outlet 13, it must pass through the connecting portion 211 on the blocking component 2 to flow from the working chamber 111 into the outflow chamber 112, and then the process gas can flow out of the outflow chamber 112 through the outlet 13. In addition, the workpiece to be processed can be placed in the working chamber 111. When the process gas flows into the working chamber 111 through the inlet 12, the process gas will contact the surface of the workpiece to be processed, thereby processing the workpiece. Due to the obstruction of the blocking component 2, most of the process gas accumulates in the working chamber 111, and a small part flows into the outflow chamber 112 through the connecting portion 211, so that the distribution of the process gas in the working chamber 111 is more uniform, so that the amount of process gas dispersed on the surface of the workpiece to be processed is more even, thereby improving the processing uniformity of the surface of the workpiece to be processed.

[0067] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A low temperature degumming device, characterized in that: include: A body (1), the body (1) having a process chamber (11) and an inlet (12) and an outlet (13) arranged in communication with the process chamber (11), the inlet (12) and the outlet (13) being arranged opposite to each other, and a process gas is suitable for flowing into the process chamber (11) through the inlet (12) and for flowing out of the process chamber (11) through the outlet (13); A blocking component (2) is arranged in the process chamber (11) and between the inlet (12) and the outlet (13) to separate the process chamber (11) into a working chamber (111) and an outflow chamber (112); a plurality of connecting parts (211) are provided on the blocking component (2); any of the connecting parts (211) connects the working chamber (111) and the outflow chamber (112); The inlet (12) is connected to the working chamber (111), the outlet (13) is connected to the outflow chamber (112), and the working chamber (111) is suitable for placing a workpiece to be processed. The blocking component (2) is suitable for blocking the flow of process gas, so that when the process gas flows from the working chamber (111) to the outflow chamber (112), the blocking component (2) blocks the flow of process gas and allows the process gas to flow into the outflow chamber (112) through all the connecting parts (211).

2. The low temperature degumming equipment according to claim 1, characterized in that: The blocking component (2) comprises a blocking member (21) and a flow guide member (22); the flow guide member (22) is arranged on the blocking member (21) and in the outflow cavity (112); all the communication portions (211) are arranged on the blocking member (21) corresponding to the flow guide member (22); The flow guide member (22) is provided with a plurality of flow guide portions (221), any of the flow guide portions (221) is correspondingly connected to a connecting portion (211), and the axis of the flow guide portion (221) is perpendicular to the axis of the connecting portion (211).

3. The low temperature degumming equipment according to claim 2, characterized in that: It also comprises an ionization component (3), which is arranged in the working chamber (111). Under the action of electric power, the ionization component (3) is suitable for ionizing the process gas into plasma, and the plasma is suitable for etching the workpiece to be processed.

4. The low temperature degumming equipment according to claim 3, characterized in that: It also comprises a guide member (4), wherein the guide member (4) is arranged in the working chamber (111) and between the ionization member (3) and the blocking member (21), and the guide member (4) is suitable for guiding the plasma.

5. The low temperature degumming equipment according to claim 4, characterized in that: The blocking member (21) is provided with a mounting portion (212), and the mounting portion (212) avoids all the connecting portions (211); It also includes a cooling member (5), which is arranged in the mounting portion (212) and is suitable for cooling the plasma under the action of electric power, and the workpiece to be processed is suitable for being arranged on the cooling member (5).

6. The low temperature degumming equipment according to claim 5, characterized in that: It also comprises a power supply component (6), which is arranged on the main body (1). Under the action of electric power, the power supply component (6) is suitable for providing a bias voltage to the workpiece to be processed in the working chamber (111).

7. The low temperature degumming equipment according to claim 6, characterized in that: The body (1) has at least two process chambers (11), the two process chambers (11) are arranged at intervals, and the blocking component (2), the ionization component (3), the guide component (4) and the power supply component (6) are correspondingly arranged in any one of the process chambers (11).

8. The low temperature degumming equipment according to any one of claims 1 to 7, characterized in that: The body (1) comprises a partition (14), wherein the partition (14) is arranged between the two process chambers (11) to separate the two process chambers (11) and to allow the two process chambers (11) to be arranged at intervals.

9. The low-temperature debonding equipment according to claim 8, characterized in that: A clearance portion is provided on one side of the partition (14), the clearance portion is connected to the two process chambers (11), and the clearance portion is suitable for providing a working space for an external robot.

10. The low temperature debonding equipment according to claim 9, characterized in that: It also comprises at least two barrier members (7), the two barrier members (7) being respectively arranged on both sides of the evacuation portion, and one end of any barrier member (7) being connected to the partition member (14), and the other end extending into one of the working chambers (111).

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