A method and device for ultra-high aspect ratio copper deposition and electroplating

Abstract

The present invention relates to the field of copper electroplating technology, specifically, a method and device for copper electroplating with an ultra-high aspect ratio, including a plating box for storing electroplating liquid, a plating assembly for electroplating a copper electroplated part with an ultra-high aspect ratio placed in the middle of the plating box; the electroplating assembly includes a plating liquid delivery pipe for delivering the plating liquid, the plating liquid delivery pipe includes an outer jacket and a negative electrode tube, wherein the outer jacket is wrapped around the outer wall of the negative electrode tube, and the outer jacket is made of an insulating material; a sliding sealing cover is arranged outside the plating liquid delivery pipe. The sliding sealing cover can contact the bottom of the outer wall of the copper electroplated part through the arrangement of the sliding sealing cover, and when the mass of the copper electroplated part increases, the pressure on the upper surface of the sliding sealing cover will increase, so that the sliding sealing cover will slide downward, wherein the sliding distance of the sliding sealing cover can judge the mass change of the electroplating of the copper electroplated part, thereby controlling the thickness of the electroplating.

Description

Technical Field

[0001] The invention relates to the technical field of copper deposition and electroplating, in particular to an ultra-high aspect ratio copper deposition and electroplating method and device. Background Art

[0002] Aspect ratio copper deposition is a key technology in the PCB (printed circuit board) manufacturing process, especially in the high-end PCB manufacturing, such as high aspect ratio, HDI (high density interconnect) boards and various special substrates PCB manufacturing, this technology is particularly important.

[0003] Due to the small and deep aperture, it is difficult for the etching solution to pass through the entire hole smoothly, resulting in the difficulty in controlling the depth of the micro-etching. Part of the epoxy resin first contacts the etching solution and is etched. By the time it is completely immersed in the etching solution, the etching depth of the first contacted part may have exceeded the standard, exposing the glass fiber and forming a cavity, which affects the subsequent copper deposition effect; the small aperture and deep hole make it difficult to exchange the solution and replace the fresh copper deposition solution, which reduces the coverage of the copper deposition. During the electroplating process, due to the large aperture, the electroplating needs to control the electroplating layer within about 0.2~1 microns. It is difficult to detect the thickness of the electroplating during the electroplating process, which easily causes the problem of unqualified thickness of the electroplating layer. Summary of the invention

[0004] In response to the problems in the prior art, the present invention provides an ultra-high aspect ratio copper deposition and electroplating method and device. Through the setting of a sliding sealing cover, it can contact the bottom of the outer wall of the copper deposition and electroplating part. When the mass of the copper deposition and electroplating part increases, the pressure on the upper surface of the sliding sealing cover will increase, so that the sliding sealing cover will slide downward. The sliding distance of the sliding sealing cover can be used to judge the quality change of the electroplating of the copper deposition and electroplating part, thereby controlling the electroplating thickness.

[0005] The technical solution adopted by the present invention to solve its technical problems is: an ultra-high aspect ratio copper electroplating device, including a plating box for storing plating liquid, a plating assembly for electroplating copper electroplating parts with ultra-high aspect ratio is placed in the middle of the plating box; the electroplating assembly includes a plating liquid delivery pipe for delivering the plating liquid, the plating liquid delivery pipe includes an outer jacket and an anode tube, wherein the outer jacket is wrapped around the outer wall of the anode tube, and the outer jacket is made of insulating material; a sliding sealing cover is arranged on the outside of the plating liquid delivery pipe.

[0006] Specifically, the electroplating assembly includes a first mounting platform, which is installed in the middle of an electroplating box. An outer ring step is provided on the inner wall of the electroplating box. A gap is left between the first mounting platform and the outer ring step to form an annular groove. A plurality of circulating liquid holes are provided at the bottom of the annular groove. The circulating liquid holes are connected to the cavity of the electroplating box for storing the electroplating liquid.

[0007] Specifically, the first mounting platform is provided with a plurality of mounting grooves on one side close to the electroplating liquid delivery pipe, a liquid pump is fixedly connected to the middle of the mounting groove, and the lower end of the liquid pump extends to the electrolytic liquid in the electroplating box through a pipeline.

[0008] Specifically, a mounting platform is sealed and welded on the upper surface of the first mounting platform, wherein the mounting platform is hollow and covers the upper surface of the first mounting platform, and the lower end of the electroplating liquid delivery pipe extends into the mounting platform.

[0009] Specifically, a support cover is welded on the upper surface of the mounting platform, a seal is arranged at the connection between the support cover and the mounting platform, the bottom of the sliding sealing cover slides through and extends into the support cover, and a floating ring is arranged at one end of the sliding sealing cover placed in the support cover.

[0010] Specifically, the plurality of sliding sealing covers are connected by a connecting floating plate, the density of the connecting floating plate is less than the density of the electrolyte, and an attachment ring is provided at one end of the sliding sealing cover away from the floating ring.

[0011] Specifically, the upper surfaces of the mounting platform and the supporting outer cover are both provided with a concentrated groove, and the concentrated groove is placed inside the sliding sealing cover. A plurality of leakage holes are opened through the concentrated groove, wherein the leakage holes placed on the surface of the supporting outer cover are larger than the corresponding leakage holes placed on the surface of the mounting platform.

[0012] Specifically, the top of the electroplating box is integrally formed with an upper outer cover, and a cover is provided inside the upper outer cover for covering the outside of the copper-plated parts during the electroplating process. The lower end of the cover contacts the inner wall of the outer ring step and is placed in the ring groove.

[0013] The present invention also provides an ultra-high aspect ratio copper electroplating method, comprising the following steps:

[0014] S1: Pre-treat the copper electroplated parts, remove glue residue, neutralize and degrease;

[0015] S2: placing the pre-treated copper plating parts into a copper plating solution for chemical copper plating treatment;

[0016] S3: After the copper plating is completed, the copper plating parts are washed with water to clean the residual copper plating liquid.

[0017] Specifically, pre-treating the copper electroplated parts includes the following steps:

[0018] Step 1: Use pressurized water to clean the copper-plated parts;

[0019] Step 2: Use high-pressure water flow to perform the final cleaning of the copper-plated parts;

[0020] Step 3: Use strong wind to dry the cleaned copper-plated parts.

[0021] Beneficial effects of the present invention:

[0022] (1) The ultra-high aspect ratio copper plating device described in the present invention can contact the bottom of the outer wall of the copper plating part through the setting of the sliding sealing cover. When the mass of the copper plating part increases, the pressure on the upper surface of the sliding sealing cover will increase, so that the sliding sealing cover will slide downward. The sliding distance of the sliding sealing cover can be used to judge the mass change of the copper plating part, thereby controlling the plating thickness.

[0023] (2) In the ultra-high aspect ratio copper plating device described in the present invention, multiple sliding sealing covers are connected by a floating plate to ensure that the multiple sliding sealing covers can be subjected to relatively balanced buoyancy and move synchronously. The copper plating parts are lifted up by the buoyancy of the floating ring and the connecting floating plate, and can be attached to the bottom of the copper plating parts by the setting of the attachment ring to avoid shaking of the copper plating parts when the plating solution flows. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the three-dimensional structure of the copper electroplating part of the present invention;

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the electroplating assembly of the present invention;

[0028] Figure 4 It is a partial view of the first mounting platform of the present invention;

[0029] Figure 5 This is a position diagram of the sliding sealing cover and the electroplating liquid delivery pipe of the present invention;

[0030] Figure 6 is a cross-sectional view of the electroplating solution delivery pipe of the present invention;

[0031] Figure 7 A top view of the electroplating box of the present invention;

[0032] Figure 8 For the present invention Figure 7 Schematic diagram of the structure at point A in the middle.

[0033] In the figure: 1. electroplating box; 2. upper outer cover; 21. outer ring step; 22. ring groove; 23. circulating liquid hole; 3. cover; 4. copper plating parts; 6. electroplating components; 61. first mounting platform; 611. mounting groove; 612. liquid pump; 62. mounting platform; 63. supporting outer cover; 64. sliding sealing cover; 641. floating ring; 642. attachment ring; 65. connecting floating plate; 66. electroplating liquid delivery pipe; 661. anode tube; 662. outer jacket; 67. leakage hole; 68. concentrated groove. DETAILED DESCRIPTION

[0034] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0035] like Figure 1-Figure 8 As shown, an ultra-high aspect ratio copper electroplating device of the present invention includes a plating box 1 for storing a plating liquid, a plating assembly 6 for electroplating a copper-plated part 4 with an ultra-high aspect ratio is placed in the middle of the plating box 1; the plating assembly 6 includes a plating liquid delivery pipe 66 for delivering the plating liquid, the plating liquid delivery pipe 66 includes a jacket 662 and an anode tube 661, wherein the jacket 662 is wrapped around the outer wall of the anode tube 661, and the jacket 662 is made of insulating material; a sliding sealing cover 64 is provided on the outside of the plating liquid delivery pipe 66.

[0036] The plating liquid can be delivered to the holes of the copper-plated parts 4 through the plating liquid delivery pipe 66, wherein the diameter of the plating liquid delivery pipe 66 is smaller than the diameter of the holes of the copper-plated parts 4. When electroplating the same batch of copper-plated parts 4, the plating liquid delivery pipe 66 can be inserted into the holes of the copper-plated parts 4 to increase the fluidity of the plating liquid in the holes of the copper-plated parts 4, which is conducive to quickly electroplating the inner walls of the holes of the copper-plated parts 4.

[0037] During the electroplating process, the sliding sealing cover 64 is configured to be in contact with the bottom of the outer wall of the copper-plated component 4. When the mass of the copper-plated component 4 increases, the pressure on the upper surface of the sliding sealing cover 64 will increase, so that the sliding sealing cover 64 will slide downward. When the sliding sealing cover 64 slides to the preset range, the mass of the electroplating on the inner wall of the hole of the copper-plated component 4 reaches the preset range, thereby ensuring that the thickness of the electroplating is within the preset range during the electroplating process.

[0038] During the electroplating process, the anode tube 661 and the copper-plated component 4 are two electrodes, and the inner hole of the copper-plated component 4 is electroplated by the electroplating solution.

[0039] Specifically, the electroplating assembly 6 includes a first mounting platform 61, which is installed in the middle of the electroplating box 1. The inner wall of the electroplating box 1 is provided with an outer ring step 21. A gap is left between the first mounting platform 61 and the outer ring step 21 to form an annular groove 22. A plurality of circulating liquid holes 23 are provided at the bottom of the annular groove 22. The circulating liquid holes 23 are connected to the cavity of the electroplating box 1 for storing the electroplating liquid.

[0040] The first mounting platform 61 serves to mount components. The circulating liquid hole 23 can allow the liquid to leak into the electroplating box 1 for reuse. The circulating liquid will first flow into the annular groove 22 and then enter the electroplating box 1 through the circulating liquid hole 23 .

[0041] Specifically, the first mounting platform 61 has multiple groups of mounting grooves 611 on one side close to the electroplating liquid delivery pipe 66, and a liquid pump 612 is fixedly connected to the middle of the mounting groove 611. The lower end of the liquid pump 612 extends to the electrolytic liquid in the electroplating box 1 through a pipeline.

[0042] A mounting platform 62 is sealed and welded on the upper surface of the first mounting platform 61 , wherein the mounting platform 62 is hollow and covers the upper surface of the first mounting platform 61 , and the lower end of the electroplating liquid delivery pipe 66 extends into the mounting platform 62 .

[0043] During the electroplating process, the electrolyte can be continuously delivered to the first mounting platform 61 through the liquid pump 612. Since the electrolyte pumped by the liquid pump 612 leaks into the electrolyte in the electroplating box 1, the electrolyte will enter the electroplating liquid delivery pipe 66, and be delivered to the hole of the copper-plated electroplating part 4 through the electroplating liquid delivery pipe 66, so that the flow rate of the electroplating liquid in the hole of the copper-plated electroplating part 4 is increased, so as to achieve the purpose of rapid electroplating in the hole of the copper-plated electroplating part 4. The top of the copper-plated electroplating part 4 is sealed during the electroplating process, which is conducive to the reflux of the electroplating liquid. Since the hole of the copper-plated electroplating part 4 is relatively small, there may be a situation where the electrolyte cannot enter. Through the setting of the electroplating liquid delivery pipe 66, the electrolyte can be directly injected into the hole of the copper-plated electroplating part 4 to achieve the purpose of electroplating, avoiding the problem that the inner wall of the hole of the smaller copper-plated electroplating part 4 cannot be electroplated in time. After the plating solution flows out of the plating solution delivery pipe 66, a portion of the plating solution will flow down along the outside of the plating solution delivery pipe 66 due to gravity and contact the inner wall of the copper-plated electroplated part 4. At the same time, the gain and loss of electrons realize the metal reduction reaction and electroplate on the inner wall of the hole of the copper-plated electroplated part 4.

[0044] Specifically, a support outer cover 63 is welded on the upper surface of the mounting platform 62, and a sealing arrangement is provided at the connection between the support outer cover 63 and the mounting platform 62. The bottom of the sliding sealing cover 64 slides through and extends into the support outer cover 63. A floating ring 641 is provided at one end of the sliding sealing cover 64 placed in the support outer cover 63.

[0045] The electroplating liquid is passed through the electroplating liquid delivery pipe 66 to electroplate the inner wall of the hole of the copper-plated part 4, and the excess electroplating liquid will flow into the supporting outer cover 63. Before electroplating, the supporting outer cover 63 is full of electroplating liquid. When the copper-plated part 4 is placed on the upper surface of the floating ring 641, the floating ring 641 is still in a floating state. When the mass of the copper-plated part 4 increases through electroplating, the floating ring 641 will be pressed down through the sliding sealing cover 64. The floating ring 641 can provide buoyancy for the sliding sealing cover 64, and the change in buoyancy can highly sensitively reflect the change in the mass of the copper-plated part 4 during the electroplating process.

[0046] Specifically, the plurality of sliding sealing covers 64 are connected by a connecting floating plate 65 , the density of the connecting floating plate 65 is less than the density of the electrolyte, and an attachment ring 642 is provided at one end of the sliding sealing cover 64 away from the floating ring 641 .

[0047] Multiple sliding sealing covers 64 are connected by connecting floating plates 65 to ensure that the multiple sliding sealing covers 64 can be subjected to relatively balanced buoyancy and move synchronously. The copper-plated component 4 is lifted up by the buoyancy of the floating ring 641 and the connecting floating plates 65, and can be attached to the bottom of the copper-plated component 4 through the setting of the attachment ring 642 to avoid shaking of the copper-plated component 4 when the plating liquid flows.

[0048] Specifically, the upper surfaces of the mounting platform 62 and the supporting outer cover 63 are both provided with a concentrated groove 68, and the concentrated groove 68 is placed inside the sliding sealing cover 64, and a plurality of leakage holes 67 are opened through the concentrated groove 68, wherein the leakage hole 67 placed on the surface of the supporting outer cover 63 is larger than the corresponding leakage hole 67 placed on the surface of the mounting platform 62.

[0049] The electroplating liquid can flow between the mounting platform 62 and the supporting outer cover 63 through the leakage hole 67, wherein the leakage hole 67 disposed on the surface of the supporting outer cover 63 is larger than the corresponding leakage hole 67 disposed on the surface of the mounting platform 62, thereby ensuring that there is sufficient electroplating liquid in the supporting outer cover 63 to provide buoyancy for the floating ring 641 and the connecting floating plate 65, which is conducive to timely observation of the electroplating situation.

[0050] Specifically, the top of the electroplating box 1 is integrally formed with an upper outer cover 2, and the upper outer cover 2 is provided with a cover 3 for externally covering the copper-plated parts 4 during the electroplating process. The lower end of the cover 3 contacts the inner wall of the outer ring step 21 and is placed in the annular groove 22.

[0051] The upper outer cover 2 is made of transparent material, and the internal components can be directly observed. The cover 3 is set on the outer wall of the copper-plated part 4 to prevent the plating liquid from splashing everywhere. The cover 3 is also made of transparent non-metallic material and is installed through the bottom of the ring groove 22 placed in the outer ring step 21.

[0052] An ultra-high aspect ratio copper electroplating method comprises the following steps:

[0053] S1: pre-treating the copper electroplating part 4, removing glue residue, neutralizing and degreasing;

[0054] Ensure that the board surface is clean, free of oil and impurities, remove the oxide layer, stains and uneven parts on the surface, and ensure that the hole wall is properly roughened for subsequent copper plating. After grinding the board, perform a water washing step to clean off the debris and stains generated during the grinding process; remove the glue residue generated during the drilling process to ensure that the hole wall is clean, providing a good foundation for subsequent copper plating.

[0055] S2: placing the pre-treated copper plating component 4 into a copper plating solution for chemical copper plating;

[0056] S2: After the copper deposition is completed, the copper-plated part 4 is washed with water to clean the residual copper deposition liquid.

[0057] The treated copper-plated parts are subjected to the first copper-plating treatment. This step usually involves a chemical reaction, in which a thin layer of copper (about 0.2~1 micron) is deposited on the hole wall through specific chemicals, making the non-conductive hole wall conductive. This provides the basis for the subsequent electroplating process and ensures the initial formation of the conductive layer;

[0058] Based on the first copper deposition, a second copper deposition process is performed to further enhance the thickness and uniformity of the copper layer on the hole wall.

[0059] Specifically, pre-treating the copper-plated part 4 includes the following steps:

[0060] Step 1: Use pressurized water to clean the copper-plated part 4;

[0061] To ensure that the hole and the plate surface are fully cleaned;

[0062] Step 2: Use high pressure water flow to perform final cleaning on the copper plated parts 4

[0063] To ensure that the board surface and the holes are clean and free of stains;

[0064] Step 3: Use strong wind to dry the cleaned copper-plated parts 4.

[0065] Working principle: First, place the copper-plated electroplating part 4 on the upper surface of the sliding sealing cover 64, turn on the liquid pump 612, and the electrolyte can be continuously delivered to the first mounting platform 61 through the liquid pump 612. As the electrolyte pumped by the liquid pump 612 leaks into the electrolyte in the electroplating box 1, the electrolyte will enter the electroplating liquid delivery pipe 66, and be delivered to the hole of the copper-plated electroplating part 4 through the electroplating liquid delivery pipe 66, so that the flow rate of the electroplating liquid in the hole of the copper-plated electroplating part 4 is increased, so as to achieve the purpose of rapid electroplating in the hole of the copper-plated electroplating part 4. The top of the copper-plated electroplating part 4 is sealed during the electroplating process, which is conducive to the reflux of the electroplating liquid. Since the hole of the copper-plated electroplating part 4 is relatively small, there may be a situation where the electrolyte cannot enter. Through the setting of the electroplating liquid delivery pipe 66, the electrolyte can be directly injected into the hole of the copper-plated electroplating part 4 to achieve the purpose of electroplating, avoiding the problem that the inner wall of the hole of the smaller copper-plated electroplating part 4 cannot be electroplated in time. After the plating solution flows out of the plating solution delivery pipe 66, a portion of the plating solution will flow down along the outside of the plating solution delivery pipe 66 due to gravity and contact the inner wall of the copper-plated electroplated part 4. At the same time, the gain and loss of electrons realize the metal reduction reaction and electroplate on the inner wall of the hole of the copper-plated electroplated part 4.

[0066] Before electroplating, the supporting outer cover 63 is filled with electroplating liquid. When the copper-plated part 4 is placed on the upper surface of the floating ring 641, the floating ring 641 is still in a floating state. When the mass of the copper-plated part 4 increases through electroplating, the floating ring 641 will be pressed down through the sliding sealing cover 64. The floating ring 641 can provide buoyancy for the sliding sealing cover 64. The change in buoyancy can highly sensitively reflect the change in the mass of the copper-plated part 4 during the electroplating process.

[0067] Multiple sliding sealing covers 64 are connected by connecting floating plates 65 to ensure that the multiple sliding sealing covers 64 can be subjected to relatively balanced buoyancy and move synchronously. The copper-plated component 4 is lifted up by the buoyancy of the floating ring 641 and the connecting floating plates 65, and can be attached to the bottom of the copper-plated component 4 through the setting of the attachment ring 642 to avoid shaking of the copper-plated component 4 when the plating liquid flows.

[0068] The electroplating liquid can flow between the mounting platform 62 and the supporting outer cover 63 through the leakage hole 67, wherein the leakage hole 67 disposed on the surface of the supporting outer cover 63 is larger than the corresponding leakage hole 67 disposed on the surface of the mounting platform 62, thereby ensuring that there is sufficient electroplating liquid in the supporting outer cover 63 to provide buoyancy for the floating ring 641 and the connecting floating plate 65, which is conducive to timely observation of the electroplating situation.

[0069] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. An ultra-high aspect ratio copper electroplating device, comprising an electroplating box (1) for storing electroplating solution, characterized in that: An electroplating assembly (6) for electroplating a copper-plated part (4) having an ultra-high aspect ratio is placed in the middle of the electroplating box (1); The electroplating assembly (6) comprises a plating liquid delivery pipe (66) for delivering the plating liquid, the plating liquid delivery pipe (66) comprising a jacket (662) and an anode tube (661), wherein the jacket (662) is wrapped around the outer wall of the anode tube (661), and the jacket (662) is made of an insulating material; A sliding sealing cover (64) is provided outside the electroplating liquid delivery pipe (66); The electroplating assembly (6) comprises a first mounting platform (61), the first mounting platform (61) being mounted at a middle position of the electroplating box (1), the inner wall of the electroplating box (1) being provided with an outer ring step (21), a gap being left between the first mounting platform (61) and the outer ring step (21) to form an annular groove (22), a plurality of circulating liquid holes (23) being provided at the bottom of the annular groove (22), the circulating liquid holes (23) being connected to a cavity of the electroplating box (1) for storing the electroplating liquid; A plurality of mounting grooves (611) are provided on one side of the first mounting platform (61) close to the electroplating liquid delivery pipe (66); a liquid pump (612) is fixedly connected to the middle of the mounting groove (611); and the lower end of the liquid pump (612) extends through a pipeline into the electrolytic liquid in the electroplating box (1); A mounting platform (62) is sealed and welded to the upper surface of the first mounting platform (61), wherein the mounting platform (62) is hollow and arranged to cover the upper surface of the first mounting platform (61), and the lower end of the electroplating liquid delivery pipe (66) extends into the mounting platform (62); A support outer cover (63) is welded to the upper surface of the mounting platform (62); a seal is provided at the connection between the support outer cover (63) and the mounting platform (62); a bottom of the sliding sealing cover (64) slides through and extends into the supporting outer cover (63); a floating ring (641) is provided at one end of the sliding sealing cover (64) that is placed in the supporting outer cover (63).

2. The ultra-high aspect ratio copper electroplating device according to claim 1, characterized in that: The plurality of sliding sealing covers (64) are connected via a connecting floating plate (65), the density of the connecting floating plate (65) being less than the density of the electrolyte, and an attachment ring (642) is provided at one end of the sliding sealing cover (64) away from the floating ring (641).

3. The ultra-high aspect ratio copper electroplating device according to claim 2, characterized in that: The upper surfaces of the mounting platform (62) and the supporting outer cover (63) are both provided with a centralizing groove (68), and the centralizing groove (68) is disposed inside the sliding sealing cover (64). A plurality of liquid leakage holes (67) are provided through the centralizing groove (68), wherein the liquid leakage hole (67) disposed on the surface of the supporting outer cover (63) is larger than the corresponding liquid leakage hole (67) disposed on the surface of the mounting platform (62).

4. The ultra-high aspect ratio copper electroplating device according to claim 3, characterized in that: The top of the electroplating box (1) is integrally formed with an upper outer cover (2), and a cover (3) is provided inside the upper outer cover (2) for externally covering the copper-plated parts (4) during the electroplating process. The lower end of the cover (3) contacts the inner wall of the outer ring step (21) and is placed in the annular groove (22).

5. An ultra-high aspect ratio copper electroplating method, applicable to the copper electroplating device according to any one of claims 1 to 4, characterized in that: The method comprises the following steps: S1: pre-treating the copper electroplated parts (4) by removing sludge, neutralizing and degreasing; S2: placing the pre-treated copper electroplated part (4) into a copper plating solution to perform a chemical copper plating treatment; S2: After the copper plating is completed, the copper plating part (4) is washed with water to clean off the residual copper plating liquid.

6. The ultra-high aspect ratio copper electroplating method according to claim 5, characterized in that: Pre-treating the copper electroplated part (4) comprises the following steps: Step 1: using pressurized water to clean the copper plated part (4); Step 2: Use high-pressure water flow to perform final cleaning on the copper-plated parts (4); Step 3: Use strong wind to dry the cleaned copper-plated parts (4).

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