Wafer transfer device

Abstract

The present invention relates to the field of semiconductor technology, and provides a wafer transmission device, including a shell assembly and a wafer carrier. The shell assembly includes a box body and a cover body, the cover body is covered on the box body, the cover body and the box body surround a receiving cavity, and a valve assembly is provided on the box body; the wafer carrier is arranged in the receiving cavity, and the wafer carrier includes a first carrier and a second carrier that are arranged oppositely, the first carrier and the second carrier are connected to each other, and the first carrier and the second carrier are respectively provided with a plurality of bearing grooves for placing wafers, and a first flexible limiting member is provided on the two opposite groove walls of each bearing groove; when the receiving cavity is maintained in a vacuum environment by the valve assembly, the first flexible limiting member expands and extends to limit the corresponding wafer. The present invention can not only form a buffer for the wafer, but also provide a stable limit for the wafer to prevent the wafer from shaking in the bearing groove, so as to facilitate the wafer transmission device to transmit the wafer and avoid the risk of scratches or even breakage of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer transmission device. Background Art

[0002] Wafer transfer devices, such as wafer carriers and wafer carrier transfer boxes, are containers used to protect, transport and store wafers in the semiconductor process. They are used to protect wafers from external impacts and prevent wafers from being contaminated and oxidized during the transfer process, thereby affecting the yield.

[0003] In the related art, the wafer transfer device has wedge-shaped teeth made of low-release plastic material distributed in a mirror-like manner inside. The wafer is placed in the tooth groove between two adjacent teeth to separate it from adjacent wafers. The width of the tooth groove is generally greater than the thickness of the wafer to ensure that the wafer is smoothly placed in the tooth groove and that there is enough space between the wafer and the groove wall.

[0004] When the wafer is placed in the tooth groove, it is in hard contact with the tooth piece. When the wafer transfer device is transmitting, the wafer is easy to shake in the tooth groove and collide with the tooth piece, causing scratches on the wafer and generating wear and contamination particles, and even the risk of breakage. Summary of the invention

[0005] The present invention provides a wafer transmission device to solve the above-mentioned technical defects in the prior art. It can not only form a buffer for the wafer, but also provide a stable limit for the wafer to prevent the wafer from shaking in the supporting groove, thereby facilitating the wafer transmission device to transport the wafer and avoiding the risk of scratches or even breakage of the wafer.

[0006] The invention provides a wafer transmission device, comprising a housing component and a wafer carrier.

[0007] The housing assembly comprises a box body and a cover body, wherein the cover body is covered on the box body, the cover body and the box body enclose a containing cavity, and the box body is provided with a valve assembly;

[0008] The wafer carrier is arranged in the accommodating cavity, and the wafer carrier comprises a first carrier and a second carrier which are arranged opposite to each other, the first carrier and the second carrier are connected to each other, and the first carrier and the second carrier are respectively provided with a plurality of bearing grooves for placing wafers, and a first flexible stopper is arranged on two opposite groove walls of each bearing groove;

[0009] When the accommodating chamber is maintained in a vacuum environment by the valve assembly, the first flexible limiting member expands and extends to limit the corresponding wafer.

[0010] According to the wafer transfer device provided by the present invention, the first flexible stopper is arranged at a position where the carrying groove is tangent to the outer contour of the wafer.

[0011] According to the wafer transmission device provided by the present invention, a first limiting portion is provided at the bottom of the box body, and a plurality of first limiting grooves for limiting the wafer are provided at intervals on the first limiting portion, and the positions of the first limiting grooves correspond one to one with the positions of the carrying grooves;

[0012] and / or,

[0013] The inner wall of the cover body is provided with a second limiting portion, and a plurality of second limiting grooves for limiting the wafer are provided at intervals on the second limiting portion, and the positions of the second limiting grooves correspond one-to-one to the positions of the bearing grooves.

[0014] According to the wafer transfer device provided by the present invention, a second flexible stopper is provided on two opposite groove walls of each of the first stopper grooves, and when the accommodating chamber is maintained in a vacuum environment by the valve assembly, the second flexible stopper expands and extends to stop the corresponding wafer;

[0015] And / or, each of the second limiting grooves is provided with a third flexible limiting member on two opposite groove walls, and when the accommodating chamber is maintained in a vacuum environment through the valve assembly, the third flexible limiting member expands and extends to limit the corresponding wafer.

[0016] According to the wafer transmission device provided by the present invention, the second flexible limiter is arranged at a position where the first limiter groove is tangent to the outer contour of the wafer; the third flexible limiter is arranged at a position where the second limiter groove is tangent to the outer contour of the wafer.

[0017] According to the wafer transfer device provided by the present invention, a sealing groove is provided on one of the box body and the cover body, and a sealing protrusion is provided on the other of the box body and the cover body for sealing in cooperation with the sealing groove;

[0018] A sealing airbag is provided on at least one of the sealing groove and the sealing protrusion. When the accommodating cavity is maintained in a vacuum environment through a valve assembly, the sealing airbag expands and extends to seal the gap between the groove wall of the sealing groove and the sealing protrusion.

[0019] According to the wafer transfer device provided by the present invention, when the sealing groove is provided in the box body, the groove wall of the sealing groove is provided with an air passage communicating with the accommodating cavity.

[0020] According to the wafer transmission device provided by the present invention, the first inner wall of the box body is provided with a first limiting rib and a second limiting rib, and the wafer carrier is inserted between the first limiting rib and the second limiting rib; the first carrier abuts against the first limiting rib, and the second carrier abuts against the second limiting rib;

[0021] A second inner wall of the box body opposite to the first inner wall is provided with a limiting air bag. When the accommodating chamber is maintained in a vacuum environment by the valve assembly, the limiting air bag expands and extends to abut against the first supporting member or the second supporting member.

[0022] According to the wafer transfer device provided by the present invention, a first limiting strip and a second limiting strip are provided at intervals on the inner wall of the cover body, and when the cover body is covered on the box body, the first limiting strip abuts against the top of the first carrier, and the second limiting strip abuts against the top of the second carrier;

[0023] The bottom of the first bearing member is clamped on one side of the first limiting portion of the box body, and the bottom of the second bearing member is clamped on the other side of the first limiting portion of the box body.

[0024] According to the wafer transfer device provided by the present invention, the first flexible limiter, the second flexible limiter, the third flexible limiter, the sealing airbag or the limiting airbag all include a flexible body, the interior of the flexible body is filled with compressed light molecular weight inert gas, and under a vacuum environment, the inert gas inside the flexible body expands to extend the flexible body.

[0025] The wafer transmission device provided by the present invention is provided with a first flexible stopper on two opposite groove walls of each bearing groove, and a valve assembly is provided on the box body. When the accommodating chamber is maintained in a vacuum environment by the valve assembly, the first flexible stopper expands and extends to limit the corresponding wafer, which can not only form a buffer for the wafer, but also provide a stable limit for the wafer to prevent the wafer from shaking in the bearing groove, so as to facilitate the wafer transmission device to transport the wafer and avoid the risk of scratches or even breakage of the wafer. When the wafer needs to be taken out, the valve assembly on the box body is opened, and the ambient air enters the accommodating chamber, so that the accommodating chamber returns to the atmospheric pressure environment, the first flexible stopper returns to the compressed state, and the cover body can be smoothly opened and separated from the box body, so that the wafer can be taken out smoothly.

[0026] In addition, when the accommodating cavity is under atmospheric pressure, the first flexible limiter located on the two side walls of the supporting groove is in a compressed state, and the wafer can be smoothly placed in the corresponding supporting groove. At this time, there is space for the wafer to move, and the first flexible limiter acts as a buffer for the corresponding wafer to prevent the wafer from forming hard contact with the groove wall of the supporting groove when being placed in the supporting groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the structural decomposition of the wafer transfer device provided in an embodiment of the present invention.

[0029] Figure 2 It is a structural schematic diagram of a wafer carrier in a wafer transmission device provided in an embodiment of the present invention.

[0030] Figure 3 It is a structural schematic diagram of a wafer carrier in a wafer transmission device provided in an embodiment of the present invention from another perspective.

[0031] Figure 4 It is a cross-sectional view of a wafer transfer device provided by an embodiment of the present invention.

[0032] Figure 5 It is a schematic diagram of the structure of a box body in a wafer transmission device provided in an embodiment of the present invention.

[0033] Figure 6 It is a schematic structural diagram of a cover body in a wafer transfer device provided in an embodiment of the present invention.

[0034] Figure 7 It is a structural schematic diagram of a first flexible limiter, a second flexible limiter, a third flexible limiter, a sealing airbag or a limit airbag in a wafer transmission device provided in an embodiment of the present invention.

[0035] Figure 8 yes Figure 7 The structural schematic diagram shown is a cross-sectional view along the main viewing direction.

[0036] Fig. 9 yes Figure 8 The structural schematic diagram shown is a cross-sectional view along the side view direction.

[0037] Fig.10 yes Figure 7 Schematic diagram of the structure in use.

[0038] Fig.11 It is a schematic diagram of the usage status of the wafer transfer device provided by an embodiment of the present invention (under atmospheric pressure environment).

[0039] Fig.12 This is a schematic diagram of the use status of the wafer transfer device provided by an embodiment of the present invention (under a vacuum environment)

[0040] Fig.13 It is a structural schematic diagram of another embodiment of the wafer transmission device provided by an embodiment of the present invention.

[0041] Fig.14 yes Fig.13 The schematic diagram of the structure of the box body in the wafer transmission device is shown.

[0042] Fig.15 yes Fig.13 A schematic structural diagram of a cover body in a wafer transfer device is shown.

[0043] Reference numerals:

[0044] 10. Shell assembly; 11. Box body; 111. First limiting portion; 112. First limiting tooth; 113. First limiting groove; 114. Sealing groove; 115. First limiting rib; 116. Second limiting rib; 12. Cover body; 121. Second limiting portion; 122. Second limiting tooth; 123. Second limiting groove; 124. Sealing protrusion; 125. First limiting strip; 126. Second limiting strip; 127. Handle; 13. Accommodating chamber; 14. Valve assembly;

[0045] 20. Wafer carrier; 21. First carrier; 22. Second carrier; 23. Carrying teeth; 24. Carrying slot;

[0046] 30. first flexible stopper; 31. flexible body; 311. fixing part; 312. telescopic part; 313. anti-slip layer;

[0047] 40. Second flexible limiting member; 50. Third flexible limiting member; 60. Sealing airbag; 70. Limiting airbag;

[0048] 80. Wafer;

[0049] P, atmospheric pressure environment; T, vacuum environment; H, inert gas. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0052] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0054] Wafers are silicon wafers used to make semiconductor chips. They are hard and brittle. The semiconductor chip manufacturing process is a complex and precise process with extremely strict requirements on contaminants. Wafers need to go through multiple process steps repeatedly. The entire wafer production cycle is long, which means that during the production process, wafers will be moved back and forth between different process tools or stored waiting for rotation.

[0055] Wafer transfer devices, such as open wafer carriers (CASSETTE) and wafer carrier transfer boxes (POD), as well as front-opening wafer transfer boxes (FOUP) and front-opening wafer shipping boxes (FOSB) that integrate carriers and transfer boxes, are equipped with wedge-shaped teeth inside the wafer carriers. The wedge-shaped teeth are distributed in a mirror image. The wafer is placed in the tooth groove between two adjacent teeth, so as to be separated from the adjacent wafers. The tooth groove width between adjacent teeth will leave enough space to ensure that the wafer is smoothly placed. The teeth are usually made of low-release plastic material with good rigidity and stable size. The wafer carrier carrying the wafer is placed inside the wafer carrier transfer box for transportation and storage.

[0056] In order to prevent the wafer from colliding with the teeth and causing breakage or scratches, a hard stop block is usually installed inside the wafer carrier transfer box to limit the displacement of the wafer carrier. The part of the wafer carrier transfer box that contacts the wafer is equipped with a corresponding pressing structure to press the wafer to prevent it from moving in the tooth groove. The pressing piece is mostly made of soft plastic sheet or solid elastomer. In order to prevent the wafer from being contaminated and oxidized during wafer storage, the wafer carrier transfer box is often filled with protective nitrogen or vacuumed. The wafer carrier transfer box will be equipped with a sealing rubber ring to ensure its airtightness.

[0057] When the wafer carrier is placed in the transfer box, it is easy to collide and rub against the hard limit blocks on the transfer box, causing the wafer to shake. The soft plastic sheet or solid elastomer pressing structure set in the contact part of the wafer carrier transfer box with the wafer will cause the wafer to shake when the transfer box is closed and opened, and even excessive downward pressure will cause the wafer to break; in order to prevent the wafer from being contaminated and oxidized during wafer storage, the sealing rubber rings set in the wafer carrier transfer box are mostly solid or hollow rubber rings, and most of them are passive compression structures, which have the risk of reduced airtightness such as extreme compression rupture and creep failure.

[0058] Figure 1 It is a schematic diagram of the structural decomposition of the wafer transfer device provided in an embodiment of the present invention. Figure 2 It is a structural schematic diagram of a wafer carrier in a wafer transmission device provided in an embodiment of the present invention. Figure 3 It is a structural schematic diagram of a wafer carrier in a wafer transmission device provided in an embodiment of the present invention from another perspective.

[0059] See also Figures 1 to 3 The embodiment of the present invention provides a wafer transfer device, which can be moved manually or placed on a ground transfer vehicle to be transported between various process equipments. The wafer transfer device includes a housing assembly 10 and a wafer carrier 20 .

[0060] The shell assembly 10 includes a box body 11 and a cover body 12. The cover body 12 is covered on the box body 11. The cover body 12 and the box body 11 surround a receiving chamber 13. Handles 127 are arranged on both sides of the cover body 12 to facilitate taking the cover body 12. A valve assembly 14 is arranged on the box body 11. The valve assembly 14 may include an air pipe and an air valve. The air pipe runs through the side wall of the box body 11. The air valve is arranged on the air pipe and can be quickly opened or closed. The air pipe is used to connect a vacuum pumping device to vacuum the receiving chamber 13, or the air pipe is used to connect an air supply device to supply air to the receiving chamber 13.

[0061] The wafer carrier 20 is disposed in the accommodating chamber 13. The wafer carrier 20 includes a first carrier 21 and a second carrier 22 that are disposed opposite to each other. The first carrier 21 and the second carrier 22 are connected to each other. A plurality of bearing grooves 24 for placing the wafers 80 are disposed on the first carrier 21 and the second carrier 22, respectively. A first flexible stopper 30 is disposed on two opposite groove walls of each bearing groove 24. When the accommodating chamber 13 is maintained in a vacuum environment T by the valve assembly 14, the first flexible stopper 30 expands and extends, and can flexibly stop the corresponding wafer 80 to prevent the wafer 80 from shaking during the transmission process.

[0062] Among them, wedge-shaped load-bearing teeth 23 made of low-release plastic material are arranged at intervals along the length direction on the first load-bearing member 21 and the second load-bearing member 22, and a load-bearing groove 24 is formed between two adjacent load-bearing teeth 23. The wafer 80 is located in the load-bearing groove 24 and is separated from the adjacent wafer 80. The groove width of the load-bearing groove 24 will leave enough space to ensure that the wafer 80 is smoothly placed. On the two load-bearing teeth 23 forming the load-bearing groove 24, the first flexible limit member 30 is provided on the two mirrored wedge surfaces facing the wafer 80, and the extension direction of the first flexible limit member 30 is perpendicular to the normal of the contact surface of the wafer 80 to determine the installation angle of the first flexible limit member 30.

[0063] This is equivalent to the first flexible limiter 30 located on the two side walls of the supporting groove 24 being in a compressed state under the atmospheric pressure environment P, and the wafer 80 can be smoothly placed in the corresponding supporting groove 24. At this time, there is space for the wafer 80 to move, and the first flexible limiter 30 plays a buffering role for the corresponding wafer 80, thereby preventing the wafer 80 from forming a hard contact with the groove wall of the supporting groove 24 when being placed in the supporting groove 24.

[0064] When a vacuum pump is connected to the valve assembly 14 to maintain the accommodating chamber 13 in a vacuum environment T, the first flexible limiter 30 expands and extends to provide a stable limit for the corresponding wafer 80 to prevent the wafer 80 from shaking in the supporting groove 24, making it easier for the wafer transfer device to transport the wafer 80 and avoiding the risk of scratches or even breakage of the wafer 80.

[0065] When the wafer 80 needs to be taken out, the valve assembly 14 on the box body 11 is opened, and the ambient air enters the accommodating chamber 13, so that the accommodating chamber 13 returns to the atmospheric pressure environment P, and the first flexible limit member 30 returns to the compressed state, and the cover body 12 can be smoothly opened and separated from the box body 11, so that the wafer 80 can be smoothly taken out.

[0066] It can be understood that the wafer transfer device provided in the embodiment of the present invention is provided with the first flexible stopper 30 on the two opposite groove walls of each bearing groove 24, and the valve assembly 14 is provided on the box body 11. When the accommodating chamber 13 is maintained in the vacuum environment T by the valve assembly 14, the first flexible stopper 30 expands and extends, which can not only form a buffer for the wafer 80, but also provide a stable limit for the wafer 80 to prevent the wafer 80 from shaking in the bearing groove 24, so as to facilitate the wafer transfer device to transfer the wafer 80 and avoid the risk of scratching or even breaking the wafer 80.

[0067] Figure 4 It is a cross-sectional view of a wafer transfer device provided by an embodiment of the present invention.

[0068] See also Figure 4 In some embodiments of the present invention, the first flexible stopper 30 is disposed at a position where the bearing groove 24 is tangent to the outer contour of the wafer 80 .

[0069] When the wafer 80 is placed in the bearing slot 24 , the position tangent to the outer contour of the wafer 80 is most obviously squeezed or collided. Therefore, providing the first flexible stopper 30 at this position can play a good buffering and limiting role.

[0070] Figure 5 It is a schematic diagram of the structure of a box body in a wafer transmission device provided in an embodiment of the present invention. Figure 6 It is a schematic structural diagram of a cover body in a wafer transfer device provided in an embodiment of the present invention.

[0071] See also Figure 5 and Figure 6 In some embodiments of the present invention, a first limiting portion 111 is provided at the bottom of the box body 11, and a plurality of first limiting grooves 113 are provided on the first limiting portion 111 at intervals. The positions of the first limiting grooves 113 correspond one-to-one to the positions of the bearing grooves 24, and the first limiting grooves 113 are used to limit the wafer 80.

[0072] At the same time, a second limiting portion 121 is provided on the inner wall of the cover body 12 , and a plurality of second limiting grooves 123 are provided on the second limiting portion 121 at intervals. The positions of the second limiting grooves 123 correspond one-to-one to the positions of the bearing grooves 24 , and the second limiting grooves 123 are used to limit the wafer 80 .

[0073] That is, wedge-shaped first limiting teeth 112 made of low-release plastic material are arranged at intervals along the length direction on the first limiting portion 111, and a first limiting groove 113 is formed between two adjacent first limiting teeth 112. The wafer 80 is located in the first limiting groove 113, and the groove width of the first limiting groove 113 will leave enough space to ensure that the wafer 80 can be smoothly inserted.

[0074] Wedge-shaped second limiting teeth 122 made of low-release plastic material are arranged at intervals along the length direction on the second limiting portion 121, and a second limiting groove 123 is formed between two adjacent second limiting teeth 122. The wafer 80 is located in the second limiting groove 123, and the groove width of the second limiting groove 123 will leave enough space to ensure that the wafer 80 can be smoothly inserted.

[0075] This is equivalent to when the wafer 80 is placed on the wafer transmission device, the left and right directions of the wafer 80 are limited by the first carrier 21 and the second carrier 22 on both sides of the wafer carrier 20, the front and back directions of the wafer 80 are limited by the two opposite groove walls of the supporting groove 24, and the up and down directions of the wafer 80 are limited by the first limiting part 111 and the second limiting part 121. The wafer 80 can be stably maintained in the wafer transmission device, and the wafer 80 can be prevented from shaking during the transmission process.

[0076] In addition, a first limiting portion 111 may be provided at the bottom of the box body 11, and a plurality of first limiting grooves 113 may be provided at intervals on the first limiting portion 111 for limiting the wafer 80, or a second limiting portion 121 may be provided on the inner wall of the cover body 12, and a plurality of second limiting grooves 123 may be provided at intervals on the second limiting portion 121 for limiting the wafer 80. In other words, one of the first limiting groove 113 and the second limiting groove 123 is selected for setting, and the other limiting groove may adopt the existing structure for limiting.

[0077] Continue reading Figures 4 to 6 In some embodiments of the present invention, a second flexible limiting member 40 is provided on two opposite groove walls of each first limiting groove 113. When the accommodating chamber 13 is maintained in a vacuum environment T through the valve assembly 14, the second flexible limiting member 40 expands and extends to limit the corresponding wafer 80.

[0078] A third flexible limiting member 50 is disposed on two opposite groove walls of each second limiting groove 123 . When the accommodating chamber 13 is maintained in a vacuum environment T through the valve assembly 14 , the third flexible limiting member 50 expands and extends to limit the corresponding wafer 80 .

[0079] That is, on the two second limiting teeth 122 forming the second limiting groove 123 , the third flexible limiting member 50 is provided on the two mirrored wedge surfaces facing the wafer 80 , and the extension direction of the third flexible limiting member 50 is perpendicular to the normal of the contact surface of the wafer 80 .

[0080] Under the atmospheric pressure environment P, the first flexible limit member 30 located on the two opposite side walls of the supporting groove 24 is in a compressed state, and the wafer 80 can be smoothly placed in the corresponding supporting groove 24. At this time, there is space for the wafer 80 to move, and the first flexible limit member 30 plays a buffering role for the corresponding wafer 80 to avoid the wafer 80 from forming a hard contact with the groove wall of the supporting groove 24 when it is placed in the supporting groove 24; at the same time, the second flexible limit member 40 located on the two opposite groove walls of the first limit groove 113 is in a compressed state; the third flexible limit member 50 located on the two opposite groove walls of the second limit groove 123 is in a compressed state, which is convenient for the wafer 80 to be placed in the corresponding limit groove.

[0081] When a vacuum pumping device is connected to the valve assembly 14 to maintain the accommodating chamber 13 in a vacuum environment T, the first flexible limit member 30, the second flexible limit member 40 and the third flexible limit member 50 all expand and extend to provide a stable limit for the wafer 80 to prevent the wafer 80 from shaking in the supporting groove 24, making it easier for the wafer transfer device to transport the wafer 80 and avoiding the risk of scratches or even breakage of the wafer 80.

[0082] When the wafer 80 needs to be taken out, the valve assembly 14 on the box body 11 is opened, and the ambient air enters the accommodating chamber 13, so that the accommodating chamber 13 returns to the atmospheric pressure environment P, and the first flexible limit member 30, the second flexible limit member 40 and the third flexible limit member 50 are all restored to the compressed state, and the cover body 12 can be smoothly opened and separated from the box body 11, so that the wafer 80 can be smoothly taken out.

[0083] In other words, in the embodiment of the present invention, the wafer transfer device can not only limit the wafer 80 in six directions, namely, front-to-back direction, left-to-right direction, and up-down direction, but also each limiting position can be flexibly supported by a corresponding flexible limiting member.

[0084] In addition, a second flexible stopper 40 may be provided on two opposite groove walls of the first stopper groove 113 to flexibly stop the wafer 80, or a third flexible stopper 50 may be provided on two opposite groove walls of the second stopper groove 123 to stop the wafer 80. In other words, any one of the second flexible stopper 40 and the third flexible stopper 50 may be selected for setting, and the other stopper may be stopped by a hard stopper block.

[0085] Continue reading Figure 4 In some embodiments of the present invention, the second flexible limiter 40 is disposed at a position where the first limiter groove 113 is tangent to the outer contour of the wafer 80 ; the third flexible limiter 50 is disposed at a position where the second limiter groove 123 is tangent to the outer contour of the wafer 80 .

[0086] When the wafer 80 is placed in the supporting groove 24, the position tangent to the outer contour of the wafer 80 is most obviously squeezed or collided. Therefore, a second flexible limit member 40 is set at the position where the first limit groove 113 is tangent to the outer contour of the wafer 80, and a third flexible limit member 50 is set at the position where the second limit groove 123 is tangent to the outer contour of the wafer 80, both of which can play a good buffering and flexible limiting role.

[0087] This is equivalent to that when the wafer 80 is placed on the wafer transport device, the wafer 80 is flexibly limited by the first flexible limiter 30 , the second flexible limiter 40 and the third flexible limiter 50 , and the wafer 80 can be stably maintained in the wafer transport device.

[0088] Continue reading Figure 4 In some embodiments of the present invention, a sealing groove 114 is provided on one of the box body 11 and the cover body 12, and a sealing protrusion 124 that cooperates with the sealing groove 114 for sealing is provided on the other of the box body 11 and the cover body 12.

[0089] That is, an annular sealing groove 114 may be provided on the upper edge of the box body 11, and a sealing protrusion 124 may be provided on the lower edge of the cover body 12 and at a position that cooperates with the box body 11; or a sealing protrusion 124 may be provided on the upper edge of the box body 11, and a sealing groove 114 may be provided on the lower edge of the cover body 12 and at a position that cooperates with the box body 11.

[0090] A sealing airbag 60 is provided on at least one of the sealing groove 114 and the sealing protrusion 124, that is, the sealing airbag 60 can be provided at the bottom of the sealing groove 114, or at the bottom of the sealing protrusion 124, that is, the shape of the sealing airbag 60 is the same as that of the sealing groove 114, and can be annular. When the accommodating chamber 13 is maintained in a vacuum environment T by the valve assembly 14, the sealing airbag 60 expands and extends to seal the gap between the groove wall of the sealing groove 114 and the sealing protrusion 124, so as to increase the sealing area, increase the pressing force of the atmospheric pressure inside and outside the accommodating chamber 13 on the cover body 12 and the box body 11, and ensure the airtightness of the wafer transmission device.

[0091] Furthermore, when the sealing groove 114 is provided in the box body 11, the groove wall of the sealing groove 114 is provided with an air passage communicating with the accommodating chamber 13. Therefore, when the accommodating chamber 13 is maintained in a vacuum environment T through the valve assembly 14, the sealing airbag 60 expands and extends to seal the gap between the groove wall of the sealing groove 114 and the sealing protrusion 124. When the wafer 80 needs to be taken out, the valve assembly 14 on the box body 11 is opened, and the ambient air enters the accommodating chamber 13, so that the accommodating chamber 13 returns to the atmospheric pressure environment P, and the sealing airbag 60 can quickly return to the compressed state, and the cover body 12 can be smoothly opened and separated from the box body 11, so that the wafer 80 can be taken out smoothly.

[0092] Continue reading Figure 4 and Figure 5 In some embodiments of the present invention, a first inner wall of the box body 11 is provided with a first limiting rib 115 and a second limiting rib 116, and the wafer carrier 20 is inserted between the first limiting rib 115 and the second limiting rib 116; the first carrier 21 abuts against the first limiting rib 115, and the second carrier 22 abuts against the second limiting rib 116.

[0093] A second inner wall of the box body 11 opposite to the first inner wall is provided with a limiting airbag 70, which may be in a long strip shape, and the maximum length of the limiting airbag 70 may be the same as the length of the first carrier 21 or the second carrier 22. When the accommodating chamber 13 is maintained in a vacuum environment T by the valve assembly 14, the limiting airbag 70 expands and extends to abut against the first carrier 21 or the second carrier 22.

[0094] In other words, the wafer carrier 20 is limited in the left-right direction by the first limiting rib 115 and the second limiting rib 116, the wafer carrier 20 is limited in the front-back direction by the first inner wall of the box body 11 and the limiting airbag 70, and the wafer carrier 20 is limited in the top-bottom direction by the bottom wall of the box body 11 and the cover body 12. Not only are the degrees of freedom of the wafer 80 on the wafer carrier 20 limited, but also the degrees of freedom of the wafer carrier 20 itself are limited, so that the wafer 80 can be more stable during transmission.

[0095] Continue reading Figure 4 and Figure 6 In some embodiments of the present invention, the inner wall of the cover body 12 is provided with a first limiting strip 125 and a second limiting strip 126 at intervals. When the cover body 12 is covered on the box body 11, the first limiting strip 125 abuts against the top of the first carrier 21, and the second limiting strip 126 abuts against the top of the second carrier 22.

[0096] In other words, the first limiting strip 125 and the second limiting strip 126 are used to fill the gap between the first carrier 21 and the second carrier 22 and the cover 12. When the cover 12 is covered on the box body 11 and can abut against the first carrier 21 and the second carrier 22, the first limiting strip 125 and the second limiting strip 126 are not required.

[0097] The bottom of the first carrier 21 is clamped on one side of the first limiting portion 111 of the box body 11 , and the bottom of the second carrier 22 is clamped on the other side of the first limiting portion 111 of the box body 11 .

[0098] In this way, the left and right directions of the entire wafer carrier 20 are still limited by the first limiting portion 111, and the upper and lower directions of the entire wafer carrier 20 are limited by the bottom wall of the box body 11 and the first limiting bar 125 and the second limiting bar 126, so that the wafer carrier 20 is more stable in the box body 11.

[0099] Figure 7 It is a schematic diagram of the structure of the first flexible limiter 30, the second flexible limiter 40, the third flexible limiter 50, the sealing airbag 60 or the limit airbag 70 in the wafer transfer device provided in an embodiment of the present invention. Figure 8 yes Figure 7 The structural schematic diagram shown is a cross-sectional view along the main viewing direction. Fig. 9 yes Figure 8 The structural schematic diagram shown is a cross-sectional view along the side view direction.

[0100] See also Figures 7 to 9 The first flexible limiter 30, the second flexible limiter 40, the third flexible limiter 50, the sealing airbag 60 and the limit airbag 70 provided in the embodiment of the present invention have the same structural principle and similar structural arrangement. The structural design is mainly determined according to the specific arrangement position of each component.

[0101] The first flexible stopper 30, the second flexible stopper 40, the third flexible stopper 50, the sealing airbag 60 or the stopper airbag 70 all include a flexible body 31, the interior of the flexible body 31 is filled with compressed light molecular weight inert gas H, and even if the inert gas H is leaked, it will not pollute the internal environment of the accommodating cavity 13. In the vacuum environment T, the inert gas H inside the flexible body 31 expands, so that the flexible body 31 extends; in the atmospheric pressure environment P, the atmospheric pressure outside the flexible body 31 is stronger than the air pressure inside the flexible body 31, and the flexible body 31 shrinks to compress the inert gas H.

[0102] Among them, the flexible body 31 is an airbag structure made of perfluororubber, and the light molecular weight inert gas H can be helium, which is more commonly used and easier to expand. That is, the flexible body 31 is filled with compressed helium, and then the flexible body 31 is sealed. The compressed helium inside the flexible body 31 plays an important role in the working process of the flexible body 31. The low density of helium makes the flexible body 31 light after being filled with gas, and the expansion and contraction response speed is fast and the effect is obvious with the change of air pressure outside the flexible body 31; at the same time, the chemical properties of helium are stable and it is not easy to react with other substances, which ensures the reliability and safety of the flexible body 31.

[0103] In addition, the flexible body 31 may also be made of other rubber elastic materials with stable chemical properties, and the compressed gas filled in the flexible body 31 may also be other low-density gases.

[0104] It should be noted that the connection between the flexible body 31 and the external fixed substrate includes but is not limited to adhesive bonding, integral injection molding, and snap connection. For example, when the flexible body 31 is used as the first flexible limiter 30, the flexible body 31 is connected to the load-bearing tooth by gluing.

[0105] Fig.10 yes Figure 7 Schematic diagram of the structure in use.

[0106] like Fig.10 As shown, when the flexible body 31 is placed in an atmospheric pressure environment P, the flexible body 31 and the compressed helium inside are in the original compressed state; when the flexible body 31 is placed in an environment P below the atmospheric pressure or in a vacuum environment T, the compressed helium inside the flexible body 31 will expand, causing the flexible body 31 to expand and stretch outward, and the expansion and stretching amount can be adjusted according to the environmental pressure value outside the flexible body 31. When the external environment of the flexible body 31 returns to normal atmospheric pressure, the external air pressure causes the flexible body 31 to retract, and the helium inside the flexible body 31 is in a compressed state.

[0107] Continue reading Figure 8 and Fig. 9 In some embodiments of the present invention, the flexible body 31 includes a fixed portion 311 and a telescopic portion 312 connected to each other, the fixed portion 311 is connected to a corresponding fixed substrate, and the telescopic portion 312 is suitable for extending outward as the inert gas H expands under a vacuum environment T.

[0108] Continue reading Figure 8 and Fig. 9 In some embodiments of the present invention, the thickness of the telescopic portion 312 gradually decreases from the position of the fixed portion 311 to the direction away from the fixed portion 311.

[0109] In other words, the flexible body 31 is composed of two parts, namely the base and the upper wall, and the thickness of the upper wall gradually becomes thinner from the base to the upper wall, which makes the flexible body 31 have different strength and elastic properties in different parts. The thicker base plays a role of stable support, providing a foundation for the entire flexible body 31 to be firmly connected to the outside. The gradually thinning upper wall gives the flexible body 31 flexibility and directional telescopic properties. This directional telescopic function enables the flexible body 31 to more accurately adapt to different working scenes and stress conditions during use.

[0110] For example, in situations where cushioning or support in a specific direction is required, the flexible body 31 of the airbag structure can provide more effective protection and support through directional expansion and contraction.

[0111] Continue reading Figure 7 In some embodiments of the present invention, an anti-slip layer 313 is provided on the outer surface of the telescopic portion 312 to improve the supporting performance of the flexible body 31 .

[0112] Since the flexible body 31 is made of rubber elastic body, the support provided has anti-slip properties, or an anti-slip layer is directly provided on the outer side of the flexible body 31 to increase the friction of the flexible body 31 and improve the support performance of the flexible body 31 .

[0113] In some embodiments of the present invention, the flexible limiter also includes a support shell (not shown in the figure) and an elastic telescopic body (equivalent to the flexible body 31 of the above embodiment), and a limit hole is provided on the support shell. The elastic telescopic body is arranged inside the support shell, and the inside of the elastic telescopic body is filled with an inert gas H suitable for expansion under a vacuum environment T so that the flexible body 31 extends, and the elastic telescopic body is suitable for extending from the limit hole.

[0114] In other words, the flexible body 31 can be a single-layer structure or a double-layer structure. When the flexible body 31 is a double-layer structure, the outer layer of the flexible body 31 is a hard shell protective layer with openings in a specific direction, and the inner layer is a soft elastic expansion body filled with compressed helium.

[0115] When the flexible body 31 is placed in an atmospheric pressure environment P, the elastic expansion body and the compressed helium inside are in an original compressed state, and the elastic expansion body is in the supporting shell.

[0116] When the flexible body 31 is placed in an environment P below atmospheric pressure or in a vacuum environment T, the compressed helium gas inside the elastic body will expand, causing the elastic body to expand and stretch outward and protrude from the opening on the supporting shell.

[0117] Fig.11 It is a schematic diagram of the usage status of the wafer transfer device provided by an embodiment of the present invention (under atmospheric pressure environment). Fig.12 This is a schematic diagram of the use status of the wafer transfer device provided by an embodiment of the present invention (under a vacuum environment)

[0118] The use process of the wafer transfer device provided by the embodiment of the present invention is as follows:

[0119] like Fig.11 As shown, under the atmospheric pressure environment P, the first flexible limit member 30 on the load-bearing tooth 23 is in a compressed state, and the wafer 80 is smoothly placed in the load-bearing groove 24 between the two load-bearing teeth 23 of the corresponding wafer carrier 20 and arranged in sequence. Adjacent wafers 80 are separated by the load-bearing teeth 23. At this time, the wafer 80 falls vertically on the load-bearing area formed between the first load-bearing member 21 and the second load-bearing member 22. There is space for the wafer 80 to move, but the first flexible limit member 30 acts as a buffer for the movement of the wafer 80, and will not collide violently with the load-bearing teeth 23.

[0120] The wafer carrier 20 carrying the wafer 80 is placed inside the box body 11 and the cover body 12 is closed. At this time, the wafer transmission device is in an atmospheric pressure environment P. The sealing protrusion 124 on the cover body 12 cooperates with the sealing groove 114 of the box body 11 to ensure that the cover body 12 and the box body 11 are accurately matched; the corresponding limit strips of the cover body 12 cooperate and press with the corresponding carriers on the wafer carrier 20 to ensure that the wafer carrier 20 is limited in the vertical direction inside the wafer transmission device. The limiting edges of the carrier of the wafer carrier 20 cooperate with the limiting ribs of the inner wall of the box body 11 to ensure that the wafer carrier 20 is limited in the horizontal left and right directions inside the wafer transmission device; at this time, the first flexible limiting member 30, the second flexible limiting member 40 and the third flexible limiting member 50 are distributed on the circumferential edge of the wafer 80, the first flexible limiting member 30 is mirror-distributed on both sides of the wafer 80 in the horizontal direction, and the second flexible limiting member 40 and the third flexible limiting member 50 are mirror-distributed on the upper and lower ends of the wafer 80 in the vertical direction.

[0121] like Fig.11 As shown in the enlarged view of part A in FIG. 1 , the sealing airbag 60 and the internal helium in the annular sealing groove 114 are in a compressed state, and the gap between the sealing protrusion 124 outside the sealing airbag 60 and the sealing groove 114 is in an atmospheric pressure environment P. Fig.11 As shown in the enlarged view of part B in FIG, the limiting airbag 70 and the internal helium are in a compressed state, the limiting airbag 70 and the corresponding bearing member are in a separated state, and the gap between the limiting airbag 70 and the corresponding bearing member is an atmospheric pressure environment P. Fig.11 As shown in the enlarged view of part C in FIG, the second flexible stopper 40 on the first stopper tooth 112 and the internal helium are in a compressed state, the second flexible stopper 40 and the wafer 80 are in a separated state, and the gap between the two is an atmospheric pressure environment P. That is, the first flexible stopper 30, the second flexible stopper 40, the third flexible stopper 50, the sealing airbag 60 or the limit airbag 70 are all in a compressed state.

[0122] At this time, the external device is connected through the valve assembly 14, the inside of the wafer transfer device is evacuated and the valve assembly 14 is closed, and the atmospheric pressure outside the wafer transfer device will press the cover body 12 and the box body 11 tightly. Fig.12 As shown in the enlarged view of the D part in FIG. 1 , the sealing airbag 60 and the internal helium in the sealing groove 114 are in an expanded state, and a part of the sealing airbag 60 is embedded in the gap between the sealing protrusion 124 outside the sealing airbag 60 and the sealing groove 114, and the gap is a vacuum environment T. Fig.12 As shown in the enlarged view of part E in FIG. 1 , the limiting airbag 70 and the helium inside are in an expanded state, and the limiting airbag 70 and the corresponding carrier are in a contact state, ensuring that the wafer carrier 20 is horizontally limited inside the entire wafer transfer device. Fig.12As shown in the enlarged view of the F part in FIG, the second flexible stopper 40 on the first stopper tooth 112 and the internal helium are in an expanded state, and the second flexible stopper 40 and the wafer 80 are in contact. The other first flexible stopper 30, the second flexible stopper 40, the third flexible stopper 50, the sealing airbag 60 or the limit airbag 70 are all in an expanded state, and can provide flexible support for the wafer 80.

[0123] When the wafer transfer device is in a vacuum state, it can be moved and stored. When the wafer 80 needs to be taken, the valve assembly 14 is opened, and the external atmospheric pressure air enters the wafer transfer device, and the first flexible stopper 30, the second flexible stopper 40, the third flexible stopper 50, the sealing airbag 60 or the stopper airbag 70 inside the wafer transfer device are restored to a compressed state, the cover body 12 can be smoothly opened and separated from the box body 11, and the wafer carrier 20 and the wafer 80 can be smoothly taken out.

[0124] When the wafer transmission device is placed in an atmospheric pressure environment P, the first flexible limiter 30, the second flexible limiter 40 and the third flexible limiter 50 are in an original compressed state, and the wafer 80 can be smoothly placed and fall on the inner walls of the first flexible limiter 30, the second flexible limiter 40 and the third flexible limiter 50. The first flexible limiter 30, the second flexible limiter 40 and the third flexible limiter 50 have a buffering effect on the placement of the wafer 80; when the wafer transmission device is placed in an environment P below atmospheric pressure or in a vacuum environment T, the internal compressed helium will expand, causing the mirror-distributed flexible body 31 on the two wedge-shaped surfaces facing the wafer 80 in the corresponding groove to expand and stretch outward, contact and tighten at a tangent position to the outer contour of the wafer 80, and the contact is elastic, thereby avoiding the wafer 80 from shaking in the corresponding groove during use, limiting the displacement of the wafer 80 in the four horizontal directions in the wafer carrier 20, and avoiding collision with the corresponding teeth to cause breakage and scratches. When the wafer carrier 20 is restored to the atmospheric pressure environment P, the first flexible limiter 30, the second flexible limiter 40 and the third flexible limiter 50 of the airbag on the teeth of the wafer carrier 20 that clamp the wafer 80 shrink and separate from the wafer 80, so that the wafer 80 can be easily and smoothly taken out.

[0125] Fig.13 It is a structural schematic diagram of another embodiment of the wafer transmission device provided by an embodiment of the present invention. Fig.14 yes Fig.13 The schematic diagram of the structure of the box body in the wafer transmission device is shown. Fig.15 yes Fig.13 A schematic structural diagram of a cover body in a wafer transfer device is shown.

[0126] See also Figures 13 to 15The present invention provides a schematic diagram of another embodiment of a wafer transfer device, which is equivalent to a wafer carrier and a box body being integrally arranged to form a front-opening wafer transfer box. The wafer transfer device belongs to a FOUP or FOSB, and the wafer transfer device runs on a track through an overhead crane, and travels back and forth between various process equipment.

[0127] The front-opening wafer transfer box includes a cover 12 and a box body 11. The fixing block (not numbered in the figure) above the box body 11 is used to fix the link device of the overhead crane. An air valve is provided on the box body 11, through which the interior of the transfer box can be evacuated and filled with air, and the air valve can be opened and closed quickly.

[0128] An annular sealing airbag 60 is provided in the sealing groove 114 between the box body 11 and the cover body 12, and an air passage is provided between the upper wall of the sealing airbag 60 and the inside of the transmission box. When the inside of the transmission box is evacuated, the compressed helium gas inside the sealing airbag 60 will expand, causing the upper wall of the sealing airbag 60 to embed into the air passage, thereby increasing the sealing area and increasing the pressing force of the atmospheric pressure inside and outside the transmission box on the cover body 12 and the box body 11, thereby ensuring the airtightness of the transmission box.

[0129] Wedge-shaped load-bearing teeth 23 are provided inside the cover body 12 and the box body 11, as well as on both sides of the inner wall of the box body 11. The wafer 80 can be directly placed in the load-bearing groove 24 formed by the load-bearing teeth 23 without passing through the wafer carrier 20. The load-bearing teeth 23 are provided with a first flexible limiter 30, which can limit the movement of the wafer 80 in the four horizontal directions and the vertical direction in the transmission box, and avoid collision with the load-bearing teeth 23 to cause breakage and scratches.

[0130] When the wafer 80 needs to be taken out, the air valve is opened, and the external atmospheric pressure air enters the transmission box, and the first flexible limiter 30, the second flexible limiter 40, the third flexible limiter 50, the sealing airbag 60 or the limit airbag 70 inside the transmission box are restored to the compressed state, the cover body 12 can be smoothly opened and separated from the box body 11, and the wafer 80 can be smoothly taken out.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer transfer device, characterized in that: include: A housing assembly (10) comprises a box body (11) and a cover body (12), wherein the cover body (12) is disposed on the box body (11), the cover body (12) and the box body (11) enclose a receiving cavity (13), and a valve assembly (14) is disposed on the box body (11); A wafer carrier (20) is arranged in the accommodating cavity (13), the wafer carrier (20) comprising a first carrier (21) and a second carrier (22) arranged opposite to each other, the first carrier (21) and the second carrier (22) being connected to each other, the first carrier (21) and the second carrier (22) being respectively provided with a plurality of bearing grooves (24) for placing wafers (80), two opposite groove walls of each bearing groove (24) being provided with a first flexible stopper (30), the first flexible stopper (30) comprising a flexible body (31), the interior of the flexible body (31) being filled with a compressed light molecular weight inert gas (H); When the accommodating chamber (13) is maintained in a vacuum environment (T) through the valve assembly (14), the inert gas (H) inside the flexible body (31) expands, causing the flexible body (31) to extend, thereby limiting the position of the corresponding wafer (80).

2. The wafer transfer device according to claim 1, characterized in that: The first flexible stopper (30) is arranged at a position where the bearing groove (24) is tangent to the outer contour of the wafer (80).

3. The wafer transfer device according to claim 1, characterized in that: A first limiting portion (111) is provided at the bottom of the box body (11), a plurality of first limiting grooves (113) for limiting the wafer (80) are provided at intervals on the first limiting portion (111), and the positions of the first limiting grooves (113) correspond one-to-one to the positions of the bearing grooves (24); and / or, The inner wall of the cover body (12) is provided with a second limiting portion (121), and the second limiting portion (121) is provided with a plurality of second limiting grooves (123) for limiting the wafer (80) at intervals, and the positions of the second limiting grooves (123) correspond one-to-one to the positions of the bearing grooves (24).

4. The wafer transfer device according to claim 3, characterized in that: Two opposite groove walls of each first limiting groove (113) are provided with a second flexible limiting member (40), and when the accommodating chamber (13) is maintained in a vacuum environment (T) through the valve assembly (14), the second flexible limiting member (40) expands and extends to limit the corresponding wafer (80); And / or, a third flexible limiting member (50) is provided on two opposite groove walls of each second limiting groove (123), and when the accommodating chamber (13) is maintained in a vacuum environment (T) through the valve assembly (14), the third flexible limiting member (50) expands and extends to limit the corresponding wafer (80).

5. The wafer transfer device according to claim 4, characterized in that: The second flexible stopper (40) is arranged at a position where the first stopper groove (113) is tangent to the outer contour of the wafer (80); and the third flexible stopper (50) is arranged at a position where the second stopper groove (123) is tangent to the outer contour of the wafer (80).

6. The wafer transfer device according to claim 1, characterized in that: A sealing groove (114) is provided on one of the box body (11) and the cover body (12), and a sealing protrusion (124) is provided on the other of the box body (11) and the cover body (12) for sealing in cooperation with the sealing groove (114); A sealing airbag (60) is provided on at least one of the sealing groove (114) and the sealing protrusion (124); when the accommodating chamber (13) is maintained in a vacuum environment (T) through a valve assembly (14), the sealing airbag (60) expands and extends to seal a gap between a groove wall of the sealing groove (114) and the sealing protrusion (124).

7. The wafer transfer device according to claim 6, characterized in that: When the sealing groove (114) is provided on the box body (11), a groove wall of the sealing groove (114) is provided with an air passage communicating with the accommodating cavity (13).

8. The wafer transfer device according to any one of claims 1 to 7, characterized in that: A first limiting rib (115) and a second limiting rib (116) are provided on the first inner wall of the box body (11), and the wafer carrier (20) is inserted between the first limiting rib (115) and the second limiting rib (116); the first carrier (21) abuts against the first limiting rib (115), and the second carrier (22) abuts against the second limiting rib (116); A second inner wall of the box body (11) arranged opposite to the first inner wall is provided with a limiting airbag (70); when the accommodating chamber (13) is maintained in a vacuum environment (T) through the valve assembly (14), the limiting airbag (70) expands and extends to abut against the first supporting member (21) or the second supporting member (22).

9. The wafer transfer device according to any one of claims 1 to 7, characterized in that: The inner wall of the cover body (12) is provided with a first limiting strip (125) and a second limiting strip (126) at intervals, and when the cover body (12) is covered on the box body (11), the first limiting strip (125) abuts against the top of the first bearing member (21), and the second limiting strip (126) abuts against the top of the second bearing member (22); The bottom of the first bearing member (21) is clamped on one side of the first limiting portion (111) of the box body (11), and the bottom of the second bearing member (22) is clamped on the other side of the first limiting portion (111) of the box body (11).

10. The wafer transfer device according to claim 1, characterized in that: The second flexible stopper (40), the third flexible stopper (50), the sealing airbag (60) or the stopper airbag (70) all comprise a flexible body (31), the interior of the flexible body (31) being filled with compressed light molecular weight inert gas (H), and in a vacuum environment (T), the inert gas (H) inside the flexible body (31) expands, causing the flexible body (31) to extend.

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