S-band phased array radio frequency front-end transmitting assembly

Abstract

The invention discloses an S-band phased array radio frequency front-end transmitting assembly, and belongs to the technical field of phased array antennas. Comprising two cabinet sub-systems. When two paths of radio frequency signals are externally input, the two paths of radio frequency signals enter the first power division driving module and the second power division driving module through the power division switch selection network to be divided into a first preset number of signals which enter the first power division switching module and the second power division switching module respectively; and the first power division switching module and the second power division switching module divide the received signals into a second preset number of signals respectively, and send the second preset number of signals to the first T assembly module and the second T assembly module respectively to finally obtain a third preset number of emission signals. 768 paths of transmitting signals are realized through 192 paths of transmitting links, A and B array plane switching and horizontal and vertical antenna transmitting switching are realized, transmitting of any number of units can also be realized, and the amplitude and the phase can be calibrated.

Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to an S-band phased array radio frequency front-end transmitting component. Background Art

[0002] Phased array technology is widely used in many fields such as satellite communications, radar guidance, radar electronic warfare, and communication electronics. The essence of a phased array is to properly phase-shift the signals of the array elements arranged in a certain pattern to obtain the deflection of the array beam. How to accurately and low-loss transmit the signals of the array elements has always been a hot research topic in the field of phased arrays. In the engineering application of multi-channel phased array systems, how to complete signal transmission in a smaller volume, lower loss, and better cost is also a key research topic at home and abroad.

[0003] Traditional phased array systems often have problems such as large size, high cost and high loss. In addition, the phases of various channels in traditional phased array systems are often different, making calibration more complicated. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an S-band phased array radio frequency front-end transmitting component.

[0005] The objective of the present invention is achieved through the following technical solutions: an S-band phased array RF front-end transmitting component, comprising a first cabinet subsystem, the first cabinet subsystem is connected to a second cabinet subsystem, a power module, and a wave control module; the first cabinet subsystem comprises a power division switch selection network, a first power division drive module, a first power division transfer module, and a first T component module, the second cabinet subsystem comprises a first power division drive module, a first power division transfer module, and a first T component module; the power division switch selection network connects the first power division drive module and the second power division drive module, the first power division drive module is connected to the first power division transfer module, and the first power division transfer module is connected to the first T component module; the second power division drive module is connected to the second power division transfer module, and the second power division transfer module is connected to the second T component module; When two RF signals are input externally, the two RF signals enter the first power division driving module and the second power division driving module through the power division switch selection network and are respectively divided into a first preset number of signals and enter the first power division switching module and the second power division switching module respectively. The first power division switching module and the second power division switching module each divide the received signal into a second preset number of signals, and each send them to the first T component module and the second T component module, and finally obtain a third preset number of transmission signals.

[0006] Preferably, the power division switch selection network includes a first power divider, a second power divider, a first switching matrix switch, and a second switching matrix switch; the first power divider is connected to the first switching matrix switch and the second switching matrix switch; the second power divider is connected to the first switching matrix switch and the second switching matrix switch; the output end of the first matrix switch is connected to the first power division driving module; the output end of the second matrix switch is connected to the second power division driving module.

[0007] Preferably, the first power division driving module and the second power division driving module each include a bandpass filter, a directional coupler, a limiter, a first amplifier, a temperature compensated attenuator, a second amplifier, an attenuator, and a third power divider which are connected in sequence.

[0008] Preferably, the first power division switching module and the second power division switching module both include a first preset number of fourth power dividers; the fourth power dividers are used to divide the received signal into multiple signals and input them into subsequent circuits.

[0009] Preferably, the first T component module and the second T component module each include a second preset number of T components and relay switches; each T component is connected to a relay switch; the T component outputs the received signal to multiple horizontal antenna ports and vertical antenna ports through the relay switch. Preferably, the T component is controlled by FPGA.

[0010] Preferably, the T component includes a first T component attenuator, a first phase shifter, an equalizer, a switch, a digitally controlled attenuator, a first T component amplifier, a T component temperature compensated attenuator, a second T component amplifier, a second T component attenuator, a third T component amplifier, a fourth T component amplifier, an isolator, and a T component directional coupler connected in sequence.

[0011] Preferably, the T assembly is integrated on the liquid cooling plate.

[0012] Preferably, the first cabinet subsystem is also connected to a cooling liquid supply module.

[0013] Preferably, the active devices in the first power division driving module, the second power division driving module, the first T component module, and the second T component module are all gallium nitride power devices; the gallium nitride power device is a copper-molybdenum-copper-copper structure with a thickness ratio of 1:4:1.

[0014] The beneficial effects of the present invention are: 1) 768 transmission signals are realized through 192 transmission links, A and B array switching, horizontal and vertical antenna transmission switching are realized, and any number of unit transmissions can be realized, and the amplitude and phase can be calibrated. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the overall block diagram of the S-band phased array RF front-end transmitting component; Figure 2 This is the principle block diagram of the S-band phased array RF front-end transmitting component; Figure 3 Select the network hardware link diagram for the power splitter switch; Figure 4 This is the hardware link diagram of the power division drive module; Figure 5 This is the hardware link diagram of the T component. DETAILED DESCRIPTION

[0016] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-Figure 5 The present invention provides a technical solution: an S-band phased array RF front-end transmitting component, comprising a first cabinet subsystem, the first cabinet subsystem is connected to a second cabinet subsystem, a power module, and a wave control module; the first cabinet subsystem comprises a power division switch selection network, a first power division drive module, a first power division transfer module, and a first T component module, the second cabinet subsystem comprises a first power division drive module, a first power division transfer module, and a first T component module; the power division switch selection network connects the first power division drive module and the second power division drive module, the first power division drive module is connected to the first power division transfer module, and the first power division transfer module is connected to the first T component module; the second power division drive module is connected to the second power division transfer module, and the second power division transfer module is connected to the second T component module; When two RF signals are input externally, the two RF signals enter the first power division driving module and the second power division driving module through the power division switch selection network and are respectively divided into a first preset number of signals and enter the first power division switching module and the second power division switching module respectively. The first power division switching module and the second power division switching module each divide the received signal into a second preset number of signals, and each send them to the first T component module and the second T component module, and finally obtain a third preset number of transmission signals.

[0018] In this embodiment, the first preset number is 12, the second preset number is 96, and the third preset number is 768. The first power division driving module and the second power division driving module each have a 1-to-12 power divider, 2×12=24; the first power division switching module and the second power division switching module each have 12 1-to-8 power dividers, 12×8=96, 96×2=192; 192×4=768. Figure 2 As shown, the S-band phased array RF front-end transmitting component consists of two cabinet subsystems, main control software, a complete set of RF cables and a complete set of low-frequency cables. A cabinet subsystem consists of 1 cabinet, 1 power divider and amplifier network chassis, 12 8-way power divider adapter modules (backplane), 96 T components, 96 SP4T coaxial electromechanical switches (relay switches), etc.

[0019] Working principle of the system: The RF link of the system mainly completes the power amplification and amplitude and phase control functions of 192 channels. The power supply system provides power for the entire link, and the liquid cooling system provides heat dissipation for the whole machine. The wave control module mainly realizes independent control of the amplitude and phase of 192 channels, 384-channel A array and 384-channel B array array selection, and has status reporting and fault location functions.

[0020] Working principle of RF link: 2-way RF signals input from the outside enter the 1-to-12 power division and amplifier network module after power division and switch network selection, and then enter the 8-way power divider to divide the signal into 8 channels, which enter the T component respectively. In the T component, after array switch selection, amplitude and phase control, gain amplification, and power amplification, polarization switch selection is performed after passing through the isolator. Each T component has 4 output options, and the entire chassis has 768 outputs. After passing through a 3.5-meter RF cable, it is fed into the antenna. There are a total of 192 T components in the whole system, each component has 4 outputs, 2 of which go to the A array and 2 to the B array, so the AB arrays each have 192×2=384 transmission signals, a total of 768 transmission signals.

[0021] In some embodiments, the power division switch selection network includes a first power divider, a second power divider, a first switching matrix switch, and a second switching matrix switch; the first power divider is connected to the first switching matrix switch and the second switching matrix switch; the second power divider is connected to the first switching matrix switch and the second switching matrix switch; the output end of the first matrix switch is connected to the first power division driving module; the output end of the second matrix switch is connected to the second power division driving module.

[0022] In some embodiments, the first power division driving module and the second power division driving module each include a bandpass filter, a directional coupler, a limiter, a first amplifier, a temperature compensated attenuator, a second amplifier, an attenuator, and a third power divider connected in sequence.

[0023] In some embodiments, the first power division adapter module and the second power division adapter module both include a first preset number of fourth power dividers; the fourth power dividers are used to divide the received signal into multiple signals and input them into subsequent circuits.

[0024] In some embodiments, the first T component module and the second T component module both include a second preset number of T components and relay switches; each T component is connected to a relay switch; the T component outputs the received signal to multiple horizontal antenna ports and vertical antenna ports through the relay switch. In some embodiments, the T component is controlled by FPGA.

[0025] In some embodiments, the T component includes a first T component attenuator, a first phase shifter, an equalizer, a switch, a digitally controlled attenuator, a first T component amplifier, a T component temperature compensated attenuator, a second T component amplifier, a second T component attenuator, a third T component amplifier, a fourth T component amplifier, an isolator, and a T component directional coupler connected in sequence.

[0026] In this embodiment, the S-band phased array RF front-end transmitting component contains multiple miniaturized S-band T components, each module realizes specific electrical performance indicators and is debugged separately; under the premise of meeting technical indicators, the circuit is simplified as much as possible to enhance reliability. The output power of the power amplifier chip or power amplifier tube is reasonably selected, and the working point of each stage of the amplifier is optimized to achieve the optimal linearity of the entire amplification link, ensuring that the output power of the amplifier meets the indicator requirements.

[0027] In some embodiments, the T assembly is integrated on a liquid cooling plate.

[0028] In this embodiment, the T component is integrated with the liquid cooling plate, and eight miniaturized S-band T components are closely mounted on both sides of the liquid cooling plate flow channel, thereby minimizing the product size while ensuring heat dissipation and facilitating disassembly and assembly.

[0029] In some embodiments, the first cabinet subsystem is also connected to a cooling liquid supply module.

[0030] In some embodiments, the active devices in the first power division driving module, the second power division driving module, the first T component module, and the second T component module are all gallium nitride power devices; the gallium nitride power device is a copper-molybdenum-copper-copper structure with a thickness ratio of 1:4:1.

[0031] In this embodiment, the T-component (the relay switches in the first T-component module and the second T-component module are passive devices) and the active devices of the driving module are all GaN power devices, and the heat sink material of the GaN power device is a "sandwich" structure of copper-molybdenum-copper-copper (CPC), with a thickness ratio of 1:4:1, a mass density of 9.43±0.1g / cm3, a thermal expansion coefficient of ≤7.8ppm / ℃ in the horizontal direction and ≤9.3ppm / ℃ in the vertical direction, and a thermal conductivity of ≥340W / m.℃ in the horizontal direction and ≥208W / m.℃ in the vertical direction. The CPC heat sink can reduce the junction temperature compared with the tungsten copper heat sink (thermal expansion coefficient of 6.3ppm / ℃~7.0ppm / ℃, thermal conductivity of 200W / m.℃~210W / m.℃) and the molybdenum copper heat sink (thermal expansion coefficient of 7.6ppm / ℃~7.8ppm / ℃, thermal conductivity of 190W / m.℃~200W / m.℃). The CPC heat sink has good coating wettability. The bottom surface is filled with indium sheet installation or eutectic sintering. After installation, the void rate at the bottom of the device is no more than 3%, meeting the heat dissipation requirements of high-power chips.

[0032] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.

Claims

1. An S-band phased array radio frequency front-end transmitting component, characterized in that: It includes a first cabinet subsystem, which is connected to a second cabinet subsystem, a power module, and a wave control module; the first cabinet subsystem includes a power division switch selection network, a first power division drive module, a first power division transfer module, and a first T component module, and the second cabinet subsystem includes a first power division drive module, a first power division transfer module, and a first T component module; the power division switch selection network connects the first power division drive module and the second power division drive module, the first power division drive module is connected to the first power division transfer module, and the first power division transfer module is connected to the first T component module; The second power division driving module is connected to the second power division switching module, and the second power division switching module is connected to the second T component module; When two RF signals are input externally, the two RF signals enter the first power division driving module and the second power division driving module through the power division switch selection network and are respectively divided into a first preset number of signals and enter the first power division switching module and the second power division switching module respectively. The first power division switching module and the second power division switching module each divide the received signal into a second preset number of signals, and each send them to the first T component module and the second T component module, and finally obtain a third preset number of transmission signals.

2. The S-band phased array RF front-end transmitting assembly according to claim 1, characterized in that: The power splitter switch selection network includes a first power splitter, a second power splitter, a first switching matrix switch, and a second switching matrix switch; the first power splitter is connected to the first switching matrix switch and the second switching matrix switch; the second power splitter is connected to the first switching matrix switch and the second switching matrix switch; The output end of the first matrix switch is connected to a first power division driving module; The output end of the second matrix switch is connected to the second power division driving module.

3. The S-band phased array RF front-end transmitting assembly according to claim 1, characterized in that: The first power division driving module and the second power division driving module both include a bandpass filter, a directional coupler, a limiter, a first amplifier, a temperature compensated attenuator, a second amplifier, an attenuator, and a third power divider which are connected in sequence.

4. The S-band phased array RF front-end transmitting assembly according to claim 1, characterized in that: The first power division switching module and the second power division switching module both include a first preset number of fourth power dividers; the fourth power dividers are used to divide the received signal into multiple signals and input them into the subsequent circuit.

5. The S-band phased array RF front-end transmitting assembly according to claim 1, characterized in that: The first T component module and the second T component module both include a second preset number of T components and relay switches; each T component is connected to a relay switch; the T component outputs the received signal to multiple horizontal antenna ports and vertical antenna ports through the relay switch.

6. The S-band phased array RF front-end transmitting assembly according to claim 5, characterized in that: The T component is controlled by FPGA.

7. The S-band phased array RF front-end transmitting assembly according to claim 5, characterized in that: The T component includes a first T component attenuator, a first phase shifter, an equalizer, a switch, a digitally controlled attenuator, a first T component amplifier, a T component temperature compensated attenuator, a second T component amplifier, a second T component attenuator, a third T component amplifier, a fourth T component amplifier, an isolator, and a T component directional coupler connected in sequence.

8. The S-band phased array RF front-end transmitting assembly according to claim 5, characterized in that: The T component is integrated on the liquid cooling plate.

9. The S-band phased array RF front-end transmitting assembly according to any one of claims 1 to 8, characterized in that: The first cabinet subsystem is also connected to a cooling liquid supply module.

10. The S-band phased array RF front-end transmitting assembly according to any one of claims 1 to 8, characterized in that: The active devices in the first power division driving module, the second power division driving module, the first T component module, and the second T component module are all gallium nitride power devices; the gallium nitride power device is a copper-molybdenum-copper-copper structure with a thickness ratio of 1:4:1.

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