Repair process of solder bridge for PCB (Printed Circuit Board) production

Abstract

The invention discloses a solder resist bridge repairing process for PCB production. The solder resist bridge repairing process comprises the following steps: S1, obtaining a PCB to obtain a repairing position; S2, forming an ink layer at the repairing position; s3, obtaining a shielding piece, wherein an exposure hole is formed in the position, corresponding to the ink layer, of the shielding piece; inducing the cured part of the ink layer through the exposure hole to form a solder resist bridge; the copper leakage area can be repaired only by exposing the ink layer through the shielding piece and independently performing curing treatment, so that the experience requirement of manual repair is reduced, the treatment time is greatly shortened, unnecessary scrapping is reduced, the production cost and the supply delivery time can be effectively controlled, and the product competitive advantage of a PCB enterprise is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing, and more particularly to a process for repairing solder bridges in PCB manufacturing. Background Technology

[0002] In PCB manufacturing, adding solder mask bridges has become an indispensable solution. The purpose of solder mask bridges is to prevent solder flow during soldering from causing bridging between the pads or the intended area, ultimately leading to a short circuit. Generally, during production, due to poor exposure or other reasons, it is found that the solder mask bridge has not formed in the expected position or has detached. In this case, it needs to be repaired manually by technicians. During the repair process, technicians need to use a microscope to print on the target area to repair the solder mask bridge. This method has high labor costs, requires a high level of experience from technicians, and has a high barrier to entry for repair. Therefore, there is an urgent need for a reasonable solution to solve the above-mentioned technical problems. Summary of the Invention

[0003] To address the technical challenges of repairing weld bridges using existing technologies, which require highly experienced technicians and present significant difficulties, this invention provides a solution.

[0004] To achieve the above objectives, the present invention provides a process for repairing solder mask bridges in PCB manufacturing, comprising the following steps: S1. Obtain the PCB board to locate the repair area: S2. Form an ink layer at the repair location; S3. Obtain a masking component, wherein the masking component has an exposure hole at the position corresponding to the ink layer; the portion of the ink layer that is induced to solidify through the exposure hole forms a solder resist bridge.

[0005] As an improvement to this application, in step S1, obtaining the repair location specifically involves: S11. Obtain the pad positions of the PCB board and measure the first area of ​​the rectangle formed between the pads; S12. Obtain the second area of ​​the rectangle formed by the standard solder mask bridge; determine if the difference between the first area and the second area is less than the expected value, and if so, determine the area between the solder pads as the repair position.

[0006] As an improvement to this application, in step S2, the ink layer is formed by printing.

[0007] As an improvement to this application, in step S2, the ink layer is formed by dot-matrix printing.

[0008] As an improvement to this application, in step S2, the edge of the area formed by the ink layer is 2 mil larger than the edge of the rectangle formed by the standard pad.

[0009] As an improvement to this application, in step S4, the ink layer is induced to cure by ultraviolet irradiation.

[0010] As an improvement to this application, in step S4, the width of the exposure hole is 3 mil.

[0011] As an improvement to this application, in step S3, the blocking element is an exposure film.

[0012] As an improvement to this application, after step S3, the method further includes: S4, cleaning away the remaining uncured ink layer with a cleaning agent.

[0013] The beneficial effects of this invention are as follows: Compared with the prior art, the present invention provides a solder mask bridge repair process for PCB board production, comprising the following steps: S1, obtaining a PCB board and the obtained repair location; S2, forming an ink layer at the repair location; S3, obtaining a shielding component, wherein the shielding component has an exposure hole corresponding to the position of the ink layer; the portion of the ink layer that is induced to solidify through the exposure hole forms a solder mask bridge; by exposing only the ink layer through the shielding component and performing solidification treatment separately, the repair of the copper leakage area can be completed, reducing the experience required for manual repair, greatly shortening the processing time, thereby reducing unnecessary scrap, effectively controlling production costs and delivery time, and improving the product competitiveness of PCB board manufacturers. Attached Figure Description

[0014] Figure 1 This is a process flow diagram of the present invention. Detailed Implementation

[0015] To more clearly illustrate the present invention, the invention will be further described below with reference to the accompanying drawings.

[0016] In the following description, specific examples are given to provide a more in-depth understanding of the invention. It is obvious that the described embodiments are merely some, not all, of the embodiments of the invention. It should be understood that the specific embodiments described are for illustrative purposes only and are not intended to limit the scope of the invention.

[0017] It should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of the said feature, integral, step, operation, element, or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0018] In PCB manufacturing, adding solder mask bridges has become an indispensable solution. The purpose of solder mask bridges is to prevent solder flow during soldering from causing bridging between the pads or the intended area, ultimately leading to a short circuit. Generally, during production, due to poor exposure or other reasons, it is found that the solder mask bridge has not formed in the expected position or has detached. In this case, it needs to be repaired manually by technicians. During the repair process, technicians need to use a microscope to print on the target area to repair the solder mask bridge. This method has high labor costs, requires a high level of experience from technicians, and has a high barrier to entry for repair. Therefore, there is an urgent need for a reasonable solution to solve the above-mentioned technical problems.

[0019] To address the aforementioned technical problems, this application provides a solder mask bridge repair process for PCB manufacturing. Please refer to the attached document. Figure 1 The process includes the following steps: S1, obtaining a PCB board to identify the repair location; S2, forming an ink layer at the repair location; S3, obtaining a shielding component, wherein the shielding component has an exposure hole corresponding to the position of the ink layer; and inducing the curing of the ink layer through the exposure hole to form a solder mask bridge. By using a shielding component to expose only the ink layer and cure it separately, the copper leakage area can be repaired. This reduces the need for manual repair experience, greatly shortens the processing time, thereby reducing unnecessary scrap. Production costs and delivery time can be effectively controlled, enhancing the PCB board's competitive advantage in the company's products.

[0020] As an improvement to this application, in step S1, the specific steps for obtaining the repair location are as follows: S11. Obtain the pad positions on the PCB board and measure the first area of ​​the rectangle formed between the pads; S12. Obtain the second area of ​​the rectangle formed by the standard solder mask bridge; determine if the difference between the first area and the second area is less than the expected value. If so, determine the area between the solder pads as the repair location.

[0021] In actual production, setting expected values ​​is used to assess whether there are repair locations and to determine whether repairs should be carried out. It is understandable that if the difference between the first area and the second area is greater than the expected value, it will not affect subsequent use, so no repair is needed. Conversely, if the difference between the first area and the second area is less than the expected value, there is a suspicion of electrical continuity. Therefore, this location needs to be identified as a repair location and repaired to ultimately avoid erroneous electrical continuity and ensure the stability of the PCB board. It can be seen that judging whether exposed copper areas need repair by setting predetermined expected values ​​can effectively save resources.

[0022] In specific embodiments, the ink layer can be formed by chemical plating solution, electroplating, or other methods. In a preferred embodiment, in step S2, the ink layer is formed by printing. Printing is a simpler operation and can effectively reduce the experience threshold for technicians. In a further embodiment, the ink layer is formed by dot-matrix printing. Dot-matrix printing can ensure the uniformity of ink usage and the uniformity of the resulting thickness, so that the curing of the ink layer can be well predicted and controlled by technicians, further eliminating the rigor of experience. In a specific solution, in step S2, the edge of the area formed by the ink layer is 2 mil larger than the edge of the rectangle formed by the standard solder pad. With this design width, it can be ensured that the area of ​​the solder mask bridge after forming is larger than the standard area, thus ensuring the quality of the repair. In a further solution, and even more preferred solution, the width of the exposure hole is 3 mil, so that the repair position is fully exposed for repair, ensuring that the area of ​​the repaired solder mask bridge can be adapted for use.

[0023] In this embodiment, in step S3, the shielding element is an exposure film. The exposure film has a good light-blocking effect and is simple to process, which is more in line with the solution of this application.

[0024] In this embodiment, in step S4, the ink layer is induced to cure by ultraviolet irradiation. A photoinitiator can be added to the formula for forming the ink layer. When irradiated with light of a suitable wavelength, the photoinitiator absorbs light energy and cures the entire ink layer. The specific material of the shielding component needs to be replaced with a material that can absorb the wavelength of the photoinitiator to prevent other unintended parts from being irradiated by light and thus causing an impact.

[0025] In this embodiment, after step S3, the process further includes: S4, cleaning away the remaining uncured ink layer with a cleaning agent to obtain a PCB board with the desired cleanliness level, so as to proceed to subsequent processing steps.

[0026] The advantages of this invention are: 1. By using a shielding component to expose only the ink layer and cure it separately, the copper leakage area can be repaired. This reduces the need for experience in manual repair, greatly shortens the processing time, thereby reducing unnecessary scrap. Production costs and delivery time can be effectively controlled, enhancing the PCB board's competitive advantage in the company's products. 2. By using predetermined expected values ​​to determine whether exposed copper areas need repair, resources can be effectively saved.

[0027] The above-disclosed embodiments are merely a few specific examples of the present invention, but the present invention is not limited thereto. Any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A solder bridge repair process for PCB production, characterized in that: The following steps are involved: S1. Get the PCB board to get the repair position: S2, forming an ink layer at the repairing position; S3, obtaining a shielding member, wherein the shielding member is provided with an exposure hole at a position corresponding to the ink layer; and inducing a solidified portion of the ink layer through the exposure hole to form a solder resist bridge.

2. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S1, the patching position is obtained by: S11, obtaining the pad positions of the PCB board, and measuring the first area of ​​a rectangle formed between the pads; S12, obtaining a second area of ​​the rectangle formed by the standard solder resist bridge; determining whether a difference between the first area and the second area is smaller than an expected value, and if so, determining the area between the pads as the repair position.

3. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S2, the ink layer is formed by printing.

4. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S2, the ink layer is formed by dot screen printing.

5. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S2, the edge of the area formed by the ink layer is 2 mil larger than the edge of the rectangle formed by the standard pad.

6. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S4, the ink layer is induced to solidify by ultraviolet irradiation.

7. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S4, the width of the exposure hole is 3 mil.

8. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: In step S3, the shielding member is an exposure film.

9. The solder resist bridge repair process for PCB production according to claim 1, characterized in that: After step S3, the method further includes: S4, washing away the remaining uncured ink layer with a cleaning agent.

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