Heat dissipation device and cooking utensil

Abstract

The invention discloses a heat dissipation device which comprises a heat conductor, a first part of the heat conductor exchanges heat with a first area, a second part of the heat conductor exchanges heat with a second area, and the temperature of the first area is higher than that of the second area; a first flow path along which a gas flows and passes through the first region; the second circulation path is communicated with the first circulation path and passes through the second area, and the gas flows along the first circulation path and flows to the second circulation path; the first circulation path and the second circulation path are independently arranged. The invention further discloses the cooking utensil with the heat dissipation device. The cooling device has the beneficial effects that the heat conductor exchanges heat with the gas flowing in the first circulation path to dissipate heat, the cooling medium in the second circulation path can forcibly cool the second part, and the first circulation path and the second circulation path are mutually independent, so that the second part of the heat conductor can effectively keep a good heat exchange state.

Description

Technical Field

[0001] The invention relates to a heat dissipation device and a cooking utensil, belonging to the technical field of kitchen appliances. Background Art

[0002] Currently, in the technical field of kitchen appliances, high-temperature steam is generated in the cavity of the cooking appliance to cook food. Usually, the cooker will be provided with an exhaust duct or exhaust pipeline to discharge the gas in the cavity, especially the high-temperature steam, for heat dissipation. However, this heat dissipation method depends on whether the gas path discharge is smooth, and the heat dissipation efficiency is low. Summary of the invention

[0003] The present invention provides a heat dissipation device and a cooking utensil to solve the above technical problems.

[0004] The present invention is achieved through the following technical solutions.

[0005] A heat dissipation device, comprising:

[0006] A heat conductor, wherein a first portion of the heat conductor exchanges heat with a first region, and a second portion of the heat conductor exchanges heat with a second region, and a temperature of the first region is greater than a temperature of the second region;

[0007] a first flow path along which the gas flows and passes through the first region;

[0008] a second flow path along which the cooling medium flows and passes through the second region;

[0009] a third flow path intersecting with the first flow path so that gas flows from the first flow path to the third flow path;

[0010] The first flow path and the second flow path are provided independently of each other.

[0011] As a further improvement of the present invention, a cooling medium guiding mechanism is provided on the second flow path for guiding the cooling medium to flow along the second flow path.

[0012] As a further improvement of the present invention, the humidity detection device also includes a cavity and a cooling channel outside the cavity, the first flow path is at least partially formed in the cavity, the second flow path is formed in the cooling channel, and the cooling medium guiding mechanism is arranged in the cooling channel.

[0013] As a further improvement of the present invention, the cooling channel includes a accommodating cavity and a flow pipe, the second part of the heat conductor is located in the accommodating cavity, the flow pipe is connected to the accommodating cavity, the cooling medium guiding mechanism is arranged in the flow pipe, and the accommodating cavity has a flow port allowing the cooling medium to flow in or out.

[0014] As a further improvement of the present invention, it also includes an outer shell structure, the space between the outer shell structure and the shell of the cavity constitutes the accommodating cavity, the flow pipe is connected to the outer shell structure, and the outer shell structure has an opening to form the flow port.

[0015] As a further improvement of the present invention, the heat conductor also includes a third part whose two ends respectively transfer heat with the first part and the second part. The third part of the heat conductor is wrapped with a thermal insulation member, and the thermal insulation member isolates the third part from the gas and / or cooling medium and / or heat conductor outside the heat conductor.

[0016] As a further improvement of the present invention, the second portion of the heat conductor is provided with a heat dissipation structure.

[0017] As a further improvement of the present invention, it also includes a first temperature sensor, a second temperature sensor, and a processor. The first temperature sensor is used to detect the temperature of the heat conductor, the second temperature sensor is used to detect the temperature of the first area, and the processor calculates the humidity of the first area based on the temperatures detected by the first temperature sensor and the second temperature sensor.

[0018] As a further improvement of the present invention, it also includes a first temperature sensor, a second temperature sensor, a third temperature sensor, and a processor. The first temperature sensor is used to detect the temperature of the heat conductor, the second temperature sensor is used to detect the temperature of the first area, and the third temperature sensor is used to detect the temperature of the second part or the temperature of the second area. The processor calculates the humidity of the first area based on the temperatures detected by the first temperature sensor, the second temperature sensor, and the third temperature sensor.

[0019] As a further improvement of the present invention, it also includes a first temperature sensor, a second temperature sensor, a third temperature sensor, a fourth temperature sensor, and a processor. The heat conductor also includes a third part whose two ends respectively transfer heat to the first part and the second part. The first temperature sensor is used to detect the temperature of the connection between the third part and the first part, the second temperature sensor is used to detect the temperature of the first area, the third temperature sensor is used to detect the temperature of the connection between the third part and the second part, and the fourth temperature sensor is used to detect the temperature of the first part. The processor calculates the humidity of the first area according to the temperatures detected by the first temperature sensor, the second temperature sensor, the third temperature sensor, and the fourth temperature sensor.

[0020] A cooking appliance comprises the heat dissipation device.

[0021] Beneficial effects of the present invention:

[0022] By setting up a heat conductor, the heat from the first area can be transferred to the second area, so that the gas flowing along the first flow path can be dissipated. The heat dissipation method through heat transfer is relatively stable and reliable. By setting up a second flow path, the cooling medium can forcefully cool the second part of the heat conductor, further improving the heat dissipation effect. The first flow path and the second flow path are independent of each other, so that the second part of the heat conductor can effectively maintain a good heat exchange state. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings to help understand the purpose and advantages of the present invention, wherein:

[0024] Figure 1 It is a schematic diagram of the heat dissipation state of the heat conductor;

[0025] Figure 2 is a schematic cross-sectional view of a heat conductor;

[0026] Figure 3 It is a schematic diagram of the explosion of the heat conductor;

[0027] Figure 4 A schematic diagram of a first implementation method of humidity detection;

[0028] Figure 5 is a schematic diagram of a second implementation method of humidity detection;

[0029] Figure 6 is a schematic diagram of a third implementation method of humidity detection;

[0030] Figure 7 A schematic diagram of the path setting for the heat dissipation device;

[0031] Figure 8 It is a schematic diagram of the structural composition of the heat dissipation device;

[0032] Fig. 9 A schematic diagram of the structure of the heat dissipation device at a viewing angle;

[0033] Fig.10 is a schematic diagram of a first heat dissipation structure of a heat conductor;

[0034] Fig.11 Schematic diagram of the second heat dissipation structure of the heat conductor. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below based on the accompanying drawings and implementation examples.

[0036] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. The words "inside" and "outside" refer to the direction toward or away from the geometric center of a specific component, respectively. They are relative concepts, and therefore may change accordingly according to different locations and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0037] A heat dissipation device, referring to Figure 1 , including a heat conductor 1 and a first flow path r1, a second flow path r2, and a third flow path r3, the first portion 11 of the heat conductor 1 exchanges heat with the first region p1, the second portion 12 of the heat conductor 1 exchanges heat with the second region p2, the temperature of the first region p1 is higher than that of the second region p2. The gas flows along the first flow path r1 and passes through the first region p1.

[0038] In the present embodiment, the temperature of the first area p1 is greater than that of the second area p2, that is, the heat transfer direction of the heat conductor 1 is from the first part 11 to the second part 12. Since the gas flows along the first flow path r1 and passes through the first area p1, when the gas flows through the first area p1, its heat is exchanged between the first area p1 and the first part 11 of the heat conductor 1, and then the heat is transferred to the second part 12 and heat exchanged with the second area p2, thereby achieving the purpose of dissipating the heat of the gas.

[0039] The second flow path r2 passes through the second area p2, and the cooling medium flows along the second flow path r2. The cooling medium flows through the second area p2 and cools the second part 12 of the heat conductor 1. The cooling medium can be a gas or a liquid, that is, the second flow path r2 can perform air cooling or water cooling on the second part 12 of the heat conductor 1. In this embodiment, the heat dissipation device relies on the first cooling guide structure, guides the cooling medium to cool the second part 12, and dissipates heat in a forced heat dissipation manner, thereby achieving a better heat dissipation effect.

[0040] The third flow path r3 intersects with the first flow path r1 , so that the gas flows from the first flow path r1 to the third flow path r3 . The third flow path r3 serves as a path for heat dissipation and discharge of the gas.

[0041] In this embodiment, the first flow path r1 and the second flow path r2 are independently provided, that is, the gas on the first flow path r1 will not flow into the second flow path r2 and contact the second portion 12 of the heat conductor 1 .

[0042] The heat dissipation device of this embodiment is mainly used in cooking appliances such as ovens. The gas flowing on the first flow path r1 of this embodiment is mainly high-temperature gas containing steam generated in the cavity of the cooking appliance according to cooking needs. Therefore, the gas usually contains grease during the cooking process. The first flow path r1 and the second flow path r2 are independent of each other, thereby preventing the grease in the cavity from adhering to the second part 12 of the heat conductor 1, keeping its surface clean, so that the second part 12 can maintain a good heat exchange state.

[0043] In this implementation case, refer to Figure 1 , Figure 7 , Figure 8 , Fig. 9 A cooling medium guiding mechanism c is provided on the second flow path r2 for guiding the cooling medium to flow along the second flow path r2. If air cooling is used for heat dissipation, the cooling medium guiding mechanism c is set as a fan. If water cooling is used for heat dissipation, the cooling medium guiding mechanism c is set as a pump.

[0044] The heat dissipation device of this embodiment case structurally comprises a cavity 2, a cooling channel 3 and a heat dissipation channel 4 located outside the cavity 2, wherein the first flow path r1 is at least partially formed in the cavity 2, the second flow path r2 is formed in the cooling channel 3, and the cooling medium guiding mechanism c is arranged in the cooling channel 3. When the first cooling medium guiding structure is started, it can guide the cooling medium to flow along the second flow path r2, and flow through the second area p2 to cool down the second part 12 of the heat conductor 1, so that the heat in the cavity 2 is transferred to the first heat dissipation channel through the heat conductor 1 for forced heat dissipation. A portion of the heat conductor 1 is in the cavity 2, and another portion is outside the cavity 2, and the first portion 11 of the heat conductor 1 is located in the cavity 2, the portion of the first flow path r1 located in the cavity 2 flows through the first area p1, so that the gas flowing through the first area p1 exchanges heat with the first portion 11 of the heat conductor 1, the portion of the first flow path r1 located outside the cavity 2 can discharge the gas in the cavity 2 and dissipate heat, and the second portion 12 of the heat conductor 1 is located in the cooling channel 3 outside the cavity 2 and exchanges heat with the second area p2. The cooling medium guiding mechanism c can be set at the upstream of the first heat dissipation air channel relative to the heat conductor 1, and can also be set at the downstream of the first heat dissipation air channel relative to the heat conductor 1. The third flow path r3 is formed in the heat dissipation channel 4, and the gas flows through the first flow path r1 in the cavity 2, and after heat exchange with the first portion 11 of the heat conductor 1, it flows into the heat dissipation channel 4, and flows along the third flow path r3 for discharge and heat dissipation.

[0045] In this embodiment, the cooling channel 3 includes a housing cavity 31 and a circulation pipe 32. The second part 12 of the heat conductor 1 is located in the housing cavity 31. One end of the circulation pipe 32 is connected to the housing cavity 31. The cooling medium guide mechanism c is arranged in the circulation pipe 32. The circulation pipe 32 is provided with a mounting frame 321. The cooling medium guide mechanism c is assembled on the mounting frame 321. If the heat dissipation method of air cooling is adopted, an opening is arranged at the other end of the circulation pipe 32 so that the cold air from the outside can flow into the circulation pipe 32 under the action of the cooling medium guide mechanism c, and the second part 12 of the heat conductor 1 is cooled and dissipated. If the heat dissipation method of water cooling is adopted, the other end of the circulation pipe 32 is connected to a water source or a water pipe so that the cold water can flow into the circulation pipe 32 under the action of the cooling medium guide mechanism c, and the second part 12 of the heat conductor 1 is cooled and dissipated. The housing cavity 31 has a circulation port that allows the cooling medium to flow in or out, so that the cooling medium in the cooling channel 3 can flow.

[0046] In this embodiment, a housing structure 33 is also included. The space between the housing structure 33 and the shell of the cavity 2 forms a receiving chamber 31. The circulation pipe 32 is connected to the housing structure 33. The housing structure 33 has an opening 331 and forms a circulation port. The housing structure 33 can be a part of the shell of the cooking utensil. By forming a space between the housing structure 33 and the shell of the cavity 2 and forming the receiving chamber 31, the overall structure can be simplified to achieve the purpose of cost saving, and the space occupied by the heat dissipation device can be reduced, which is beneficial to the spatial layout of other components.

[0047] In addition, the heat conductor 1 is arranged at the bending part of the shell of the cavity 2 and is arranged obliquely, so the surface of the first part 11 of the heat conductor 1 for heat exchange is inclined. When the first part 11 of the heat conductor 1 is performing heat exchange, cooling water droplets will form on the surface, and the cooling water droplets will drip from the first part 11 along the inclined surface, thereby ensuring that the first part 11 can effectively perform heat exchange.

[0048] In this embodiment, the third part 13 of the heat conductor 1 is wrapped with a heat insulating member 14, which isolates the third part 13 from the gas and / or cooling medium and / or heat conductor outside the heat conductor 1, so that no heat loss will occur during the heat transfer between the first area p1 and the second area p2 through the heat conductor 1, so as to ensure the accuracy of the calculated humidity. The heat insulating member 14 can be made of heat insulating materials such as heat insulating rubber.

[0049] The heat dissipation device of this embodiment can detect the humidity of the first area. In the first humidity detection implementation mode, refer to Figure 4 Combined with Figure 1, further comprising a first temperature sensor a1, a second temperature sensor a2, and a processor (not shown in the figure). The first temperature sensor a1 is used to detect the temperature of the heat conductor 1, and the second temperature sensor a2 is used to detect the temperature of the first area p1. The processor can calculate the humidity of the first area p1 according to the temperatures detected by the first temperature sensor a1 and the second temperature sensor a2.

[0050] The heat transferred between the first region p1 and the first portion 11 of the heat conductor 1 is the same as the heat transferred between the first portion 11 and the second portion 12 of the heat conductor 1, and the same as the heat transferred between the second portion 12 of the heat conductor 1 and the second region p2. When the temperature of the second region p2 can be determined and the heat transfer coefficient of the heat conductor 1 is known, the heat transfer coefficient of the first region p1 can be calculated. Since the steam-air heat transfer coefficient is determined by the proportion of steam, the air humidity of the first region p1 can be calculated.

[0051] In the first implementation of humidity monitoring, heat is transferred through a heat conductor and the law of conservation of heat is followed. The heat transfer coefficient of the gas is obtained by detecting the temperature, and then the steam ratio is obtained by the heat transfer coefficient to indirectly calculate the humidity. Compared with using a humidity sensor to directly detect humidity, it can be applied in a high temperature environment and ensure the accuracy of the detection results in a high temperature environment. In addition, compared with detecting humidity by infrared, ultrasonic, oxygen sensing and other methods, the detection element used in this implementation case is a temperature sensor, which is relatively low in cost and has more application value.

[0052] In practical application, the humidity of the first region p1 can be calculated using a humidity calculation function H=f(T1, T2), where H is the humidity of the first region p1, T1 is the temperature of the heat conductor 1, and T2 is the temperature of the first region p1.

[0053] In the second implementation method of humidity detection, refer to Figure 5 Combined with Figure 1 , based on the first humidity detection component, a third temperature sensor a3 is further included. The first temperature sensor a1 is used to detect the temperature of the heat conductor 1, the second temperature sensor a2 is used to detect the temperature of the first area p1, and the third temperature sensor a3 is used to detect the temperature of the second part 12 or the temperature of the second area p2.

[0054] Compared with the first implementation method of humidity detection, a third temperature sensor a3 is added to detect the temperature of the second part 12 or the second area p2. This implementation method is more suitable for situations where there are uncertainties in the ambient temperature of the second area p2, or the ambient temperature of the second area p2 changes in different application environments, different application time periods, etc. In addition, compared with the first implementation method, the deviation caused by the ambient temperature of the second area p2 is eliminated by direct detection, so that the detection result is more accurate.

[0055] In actual application, the humidity of the first area p1 can be calculated using the humidity calculation function H=f(T1, T2, T3), where H is the temperature of the first area p1, T1 is the temperature of the heat conductor 1, T2 is the temperature of the first area p1, and T3 is the temperature of the second area p2 or the second part 12.

[0056] In the third embodiment of humidity detection, refer to Figure 6 Combined with Figure 1 , based on the second humidity detection composition, a third temperature sensor a3 and a fourth temperature sensor a4 are further included, and the heat conductor 1 also includes a third part 13, and the two ends of the third part 13 are heat-transferred with the first part 11 and the second part 12 respectively. Among them, the first temperature sensor a1 is used to detect the temperature of the connection between the third part 13 and the first part 11, the third temperature sensor a3 is used to detect the temperature of the connection between the third part 13 and the second part 12, and the fourth temperature sensor a4 is used to detect the temperature of the first part 11.

[0057] Compared with the first two humidity detection implementations, the result of calculating humidity is more accurate. The calculation principle of this implementation is as follows:

[0058] When the temperatures of the first region p1 and the second region p2 are different, and the heat conductor 1 only exchanges heat with the first region p1 and the second region p2, heat is transferred from the first region p1 to the second region p2, or from the second region p2 to the first region p1, through the heat conductor 1. According to the law of conservation of energy, Q1=Q2, where Q1 is the heat transferred between the first region p1 and the first part 11, and Q2 is the heat transferred by the third part 13 of the heat conductor 1; that is, α×A1×(T2-T1)=λ×1 / L×A2×(T3-T4), where α is the heat transfer coefficient of the air in the first region p1 , λ is the thermal conductivity of the heat conductor 1, A1 is the area where heat exchange occurs between the first part 11 and the first region p1, A2 is the cross-sectional area of ​​the third part 13, L is the length of the third part 13, T1 is the temperature detected by the first temperature sensor a1, T2 is the temperature detected by the second temperature sensor a2, T3 is the temperature detected by the third temperature sensor a3, and T4 is the temperature detected by the fourth temperature sensor a4, wherein λ, A1, A2, and L are determined values, and α can be calculated by obtaining the (T3-T4) value and (T2-T1), thereby being able to calculate the humidity of the first region p1.

[0059] In actual application, the humidity of the first area p1 may be calculated using a humidity calculation function H=f(T1, T2, T3, T4).

[0060] In this embodiment, the temperature of the first area p1 is greater than the temperature of the second area p2, that is, heat is transferred from the first area p1 to the heat conductor 1, and then transferred from the heat conductor 1 to the second area p2. The humidity detection device of this embodiment is suitable for use in cooking utensils. The first area p1 can be set in the cavity of the cooking utensils, and the second area p2 can be set outside the cavity of the cooking utensils, such as in a heat dissipation environment. The humidity in the cavity can be calculated more accurately through the humidity detection device of this embodiment.

[0061] In this implementation case, refer to Figure 1-Figure 3 The heat conductor 1 is provided with a mounting hole 15, and the mounting hole 15 forms an opening 16 on the surface of the heat conductor 1. At least one temperature measuring resistor 17 is arranged in the mounting hole 15, and the temperature measuring resistor 17 is connected to a circuit 171, which is led out of the heat conductor 1 through the opening 16 of the mounting hole 15.

[0062] A protective housing 18 is provided outside the temperature measuring resistor 17, and the protective housing 18 plays a role of limiting protection for the temperature measuring resistor 17 to ensure its function of detecting temperature. The protective housing 18 includes at least two split structures 181, which are assembled to form a complete protective housing 18. At least one split structure 181 is provided with a receiving groove to form an assembly space for accommodating the temperature measuring resistor 17. During assembly, the temperature measuring resistor 17 is first embedded in the receiving groove, and then the split structures 181 are assembled into the protective housing 18, so that the assembly of the temperature measuring resistor 17 is more convenient.

[0063] The heat conductor 1 is provided with a buckle structure 191 passed by the circuit 171 at the opening 16 of the mounting hole 15, and an elastic member 192 is provided in the mounting hole 15. The two ends of the elastic member 192 are supported on the buckle structure 191 and the protective shell 18 respectively, which can prevent the protective shell 18 from axial displacement along the mounting hole 15, and play a good positioning role for the protective shell 18 and the temperature measuring resistor 17. In addition, the protective shell 18 can be made of a rigid material with good temperature resistance and heat conductivity, such as thermal conductive ceramics (silicon nitride, etc.). On the one hand, the protective shell 18 can play a good protective role for the temperature measuring resistor 17, and on the other hand, the sufficient rigidity prevents the protective shell 18 from being deformed under the elastic force of the elastic member 192. In addition, the elastic member 192 can be a spring, and is sleeved outside the circuit 171.

[0064] The heat conductor 1 is provided with a locking structure 131 on the surface of the third part 13, and the inner surface of the thermal insulation 14 is provided with a locking groove that is engaged with the locking structure 131, or the heat conductor 1 is provided with a locking groove on the surface of the third part 13, and the inner surface of the thermal insulation 14 is provided with a locking structure that is engaged with the locking groove, which can avoid relative misalignment between the thermal insulation 14 and the heat conductor 1, thereby ensuring that the thermal insulation 14 can completely wrap the third part 13, so as to prevent heat transfer damage and cause inaccurate detection results.

[0065] In the first implementation of humidity detection, one temperature measuring resistor 17 is provided to form a first temperature sensor a1.

[0066] In the second implementation mode of humidity detection, if the third temperature sensor a3 detects the temperature of the second part 12, two temperature measuring resistors 17 are set in the mounting hole 15, one of the temperature measuring resistors 17 corresponds to the second part 12 of the heat conductor 1 at the position of the mounting hole 15, that is, the third temperature sensor a3 is formed, and the other temperature measuring resistor 17 forms the first temperature sensor a1. If the third temperature sensor a3 detects the temperature of the second area p2, a temperature measuring resistor 17 is set in the mounting hole 15, that is, the first temperature sensor a1 is formed.

[0067] In the third implementation mode of humidity detection, three temperature measuring resistors 17 are arranged in the mounting hole 15, and the positions of the three temperature measuring resistors 17 in the mounting hole 15 correspond to the connection between the third part 13 and the first part 11, the connection between the third part 13 and the second part 12, and the first part 11, respectively. That is, the first temperature sensor a1, the third temperature sensor a3, and the fourth temperature sensor a4 are formed respectively.

[0068] The heat conductor 1 of this embodiment is provided with a heat dissipation structure in its second portion 12 , and the heat dissipation structure can increase the heat exchange area between the second portion 12 and the second region p2 of the heat conductor 1 , thereby enhancing the heat dissipation effect of the second portion 12 .

[0069] In the first embodiment of the heat dissipation structure, refer to Fig.10 The heat dissipation structure includes a plurality of heat dissipation fins 121 arranged at intervals from each other, and the heat dissipation fins 121 are connected to the heat conductor 1. In the second embodiment of the heat dissipation structure, refer to Fig.11 The heat dissipation structure includes a plurality of heat dissipation rings 122 spaced apart from each other, and the heat dissipation rings 122 are sleeved on the heat conductor 1. The heat dissipation fins 121 or the heat dissipation rings 122 can be fixedly connected to the heat conductor 1 by welding or fasteners, or can be set as an integral structure with the heat conductor 1.

[0070] Finally, it should be noted that the above implementation cases are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned implementation cases, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned implementation cases, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the implementation cases of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A heat conductor, wherein a first portion of the heat conductor exchanges heat with a first region, and a second portion of the heat conductor exchanges heat with a second region, and a temperature of the first region is greater than a temperature of the second region; a first flow path along which the gas flows and passes through the first region; a second flow path along which the cooling medium flows and passes through the second region; a third flow path intersecting with the first flow path so that gas flows from the first flow path to the third flow path; The first flow path and the second flow path are provided independently of each other.

2. The heat dissipation device according to claim 1, characterized in that: The second flow path is provided with a cooling medium guiding mechanism for guiding the cooling medium to flow along the second flow path.

3. The heat dissipation device according to claim 2, characterized in that: The humidity detection device also includes a cavity, a cooling channel and a heat dissipation channel located outside the cavity, the first flow path is at least partially formed in the cavity, the second flow path is formed in the cooling channel, the cooling medium guiding mechanism is arranged in the cooling channel, and the third flow path is formed in the heat dissipation channel.

4. The heat dissipation device according to claim 3, characterized in that: The cooling channel includes a receiving cavity and a flow pipe, the second part of the heat conductor is located in the receiving cavity, the flow pipe is connected to the receiving cavity, the cooling medium guiding mechanism is arranged in the flow pipe, and the receiving cavity has a flow port allowing the cooling medium to flow in or out.

5. The heat dissipation device according to claim 4, characterized in that: It also includes an outer shell structure, the space between the outer shell structure and the shell of the cavity constitutes the accommodating cavity, the flow pipe is connected to the outer shell structure, and the outer shell structure has an opening to form the flow port.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The heat conductor also includes a third part whose two ends respectively transfer heat with the first part and the second part. The third part of the heat conductor is wrapped with a heat insulating member, which isolates the third part from the gas and / or cooling medium and / or heat conductor outside the heat conductor.

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The second part of the heat conductor is provided with a heat dissipation structure.

8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: It also includes a first temperature sensor, a second temperature sensor, and a processor. The first temperature sensor is used to detect the temperature of the heat conductor, the second temperature sensor is used to detect the temperature of the first area, and the processor calculates the humidity of the first area based on the temperatures detected by the first temperature sensor and the second temperature sensor.

9. The heat dissipation device according to any one of claims 1 to 5, characterized in that: It also includes a first temperature sensor, a second temperature sensor, a third temperature sensor, and a processor. The first temperature sensor is used to detect the temperature of the heat conductor, the second temperature sensor is used to detect the temperature of the first area, the third temperature sensor is used to detect the temperature of the second part, or the temperature of the second area, and the processor calculates the humidity of the first area based on the temperatures detected by the first temperature sensor, the second temperature sensor, and the third temperature sensor.

10. The heat dissipation device according to any one of claims 1 to 5, characterized in that: It also includes a first temperature sensor, a second temperature sensor, a third temperature sensor, a fourth temperature sensor, and a processor. The heat conductor also includes a third part whose two ends respectively transfer heat to the first part and the second part. The first temperature sensor is used to detect the temperature of the connection between the third part and the first part, the second temperature sensor is used to detect the temperature of the first area, the third temperature sensor is used to detect the temperature of the connection between the third part and the second part, and the fourth temperature sensor is used to detect the temperature of the first part. The processor calculates the humidity of the first area based on the temperatures detected by the first temperature sensor, the second temperature sensor, the third temperature sensor, and the fourth temperature sensor.

11. A cooking utensil, characterized in that: Comprising the heat dissipation device as described in any one of claims 1-10.

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