Laser radar
By setting optical components and electronic components in the lidar and isolating them with electromagnetic shields, the problem of poor performance of lidar EMC is solved, better electromagnetic shielding and optical path compatibility is achieved, and the perception capability of autonomous driving is improved.
Patent Information
- Application Number
- CN202310799565.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-30
- Publication Date
- 2024-12-31
AI Technical Summary
The poor electromagnetic compatibility (EMC) performance of lidar results in poor electromagnetic shielding protection of electronic components and cannot meet the technical requirements of autonomous driving perception.
By setting up an electromagnetic shield in the lidar, the optical components and electronic components are separated in an independent cavity to isolate the physical level, and the electromagnetic shielding cavity and the optical transmission and reception cavity are separated on both sides of the electromagnetic shielding device, and the electromagnetic shielding device is used to use the electromagnetic shielding device. Barrier the penetration of electromagnetic signals and improve EMC design performance.
It effectively improves the EMC design performance of lidar, avoids the conflict between the smooth optical path requirements and the circuit shielding requirements, enhances the electromagnetic shielding protection of electronic components, and meets the large field of view requirements of optical components.
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Figure CN119224734A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser radar technology, and in particular to a laser radar. Background Art
[0002] LiDAR is one of the core sensing devices in the field of autonomous driving. It can sense the surrounding environment in real time and has centimeter-level resolution accuracy at long distances, which can meet the technical requirements of autonomous driving perception. In order to meet the needs of the LiDAR optical structure to receive and emit light, a window must be set for light to pass through. However, the existence of the window will destroy the shielding performance required by electromagnetic compatibility (EMC), resulting in poor electromagnetic shielding protection of the electronic components inside the LiDAR. Summary of the invention
[0003] The embodiment of the present application provides a laser radar that can solve the problem of poor EMC performance of the laser radar.
[0004] In a first aspect, an embodiment of the present application provides a laser radar, including a housing, an optical element, and an electronic element;
[0005] The shell comprises a first shell, a second shell and an electromagnetic shielding member; the first shell is connected to the electromagnetic shielding member, and the first shell and the electromagnetic shielding member define an optical transceiver cavity, and the first shell has a light-through opening communicated with the optical transceiver cavity; the second shell is connected to the electromagnetic shielding member, and the second shell and the electromagnetic shielding member define an electromagnetic shielding cavity; the electromagnetic shielding cavity and the optical transceiver cavity are arranged on opposite sides of the electromagnetic shielding member; the electromagnetic shielding member has electromagnetic shielding properties;
[0006] An optical element is disposed in the light transceiver cavity, and the light-through opening is disposed corresponding to the optical element;
[0007] The electronic components are arranged in the electromagnetic shielding cavity.
[0008] In some exemplary embodiments, the electronic component includes a main circuit board, at least one transmitting module and at least one receiving module; the receiving module is arranged in a one-to-one correspondence with the transmitting module; in a direction perpendicular to the surface of the main circuit board, the optical element, the transmitting module and the receiving module are located on the same side of the main circuit board.
[0009] In some exemplary embodiments, the optical element includes at least one optical transceiver component and an optical scanning component; the optical transceiver component is arranged in a one-to-one correspondence with the transmitting module, and the optical transceiver component is also arranged in a one-to-one correspondence with the receiving module; in a direction perpendicular to the surface of the main circuit board, the optical scanning component is arranged on a side of the optical transceiver component away from the main circuit board; or, in a direction parallel to the surface of the main circuit board, the optical scanning component is arranged on one side of the optical transceiver component; the light-through opening is arranged corresponding to the optical scanning component.
[0010] In some exemplary embodiments, a first shielding groove is formed on the surface of the electromagnetic shielding component facing away from the optical transceiver cavity, and the main circuit board is arranged in the first shielding groove; a transmission shielding groove is formed on the bottom wall of the first shielding groove, and the transmission module is arranged in the transmission shielding groove.
[0011] In some exemplary embodiments, at least one emitting protrusion is formed on a surface of the electromagnetic shielding component facing away from the main circuit board, and each of the emitting protrusions defines one of the emitting shielding slots.
[0012] In some exemplary embodiments, a first mounting groove connected to the electromagnetic shielding cavity is formed on a surface of the electromagnetic shielding component facing away from the optical transceiver cavity; the electronic component includes an external connector, which is disposed in the first mounting groove and is electrically connected to the main circuit board.
[0013] In some exemplary embodiments, the electromagnetic shielding component is formed with a mounting protrusion on the surface facing the main circuit board; the mounting protrusion defines the first mounting groove; or, the electromagnetic shielding component is provided with a shielding flange protruding from the surface facing away from the main circuit board, the shielding flange is arranged corresponding to the mounting protrusion, and the mounting protrusion and the shielding flange jointly define the first mounting groove.
[0014] In some exemplary embodiments, the electromagnetic shielding component includes a shielding body and a mounting bracket; the first shell and the second shell are respectively installed on the shielding body; the second shell and the shielding body define the electromagnetic shielding cavity; the mounting bracket is arranged on a side of the shielding body away from the electromagnetic shielding cavity, and at least a part of the optical element is arranged on the mounting bracket.
[0015] In some exemplary embodiments, the electronic component includes a main circuit board and a high-frequency electronic device disposed on the main circuit board; the laser radar also includes a shielding cover, which is disposed on the high-frequency electronic device and installed on the main circuit board.
[0016] In some exemplary embodiments, the first shell is disposed on one side of the electromagnetic shielding component and is sealed to the electromagnetic shielding component; the second shell is disposed on a side of the electromagnetic shielding component facing away from the first shell and is sealed to the electromagnetic shielding component; or, a first shielding groove is provided on a surface of the electromagnetic shielding component facing away from the optical transceiver cavity, and the second shell is disposed in the first shielding groove and seals the groove of the first shielding groove.
[0017] In some exemplary embodiments, the electromagnetic shielding component is a metal electromagnetic shielding component; and / or the second shell is a metal shell; and / or the first shell is an electromagnetic transparent shell.
[0018] The laser radar according to the embodiment of the present application has at least the following beneficial effects:
[0019] In the embodiment of the present application, the optical components and the electronic components are separated in independent cavities, and the optical components and the electronic components are physically isolated by providing electromagnetic shielding components, so as to facilitate the effective EMC standard design of the electronic components. At the same time, the optical components can also meet the light path requirements as much as possible. Therefore, the present application avoids the conflict between the smooth light path requirement and the circuit shielding requirement caused by the same cavity of the optical components and the electronic components in the traditional laser radar optoelectronic design, and can effectively improve the EMC design performance of the laser radar. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 A schematic diagram of the three-dimensional structure of a laser radar according to an embodiment of the present application;
[0022] Figure 2 This is a schematic diagram of the explosion structure of a laser radar according to an embodiment of the present application;
[0023] Figure 3 A schematic cross-sectional structure diagram of a laser radar according to an embodiment of the present application;
[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of an electromagnetic shielding component according to an embodiment of the present application;
[0025] Figure 5 A schematic diagram of the three-dimensional structure of a transmitting module according to an embodiment of the present application;
[0026] Figure 6This is a schematic diagram of a three-dimensional structure in which an optical component and an electronic component are installed on an electromagnetic shielding component according to an embodiment of the present application.
[0027] Reference numerals:
[0028] 10. LiDAR;
[0029] 100, housing; 101, light-through opening; 102, electromagnetic shielding cavity; 103, optical transceiver cavity;
[0030] 110, first housing; 120, second housing; 140, light-transmitting plate; 150, auxiliary shielding member; 160, auxiliary bracket;
[0031] 130, electromagnetic shielding member; 131, transmitting protrusion; 133, mounting protrusion; 1301, transmitting opening; 1302, receiving opening; 1303, first shielding slot; 1304, transmitting shielding slot; 1305, receiving shielding slot; 1306, first mounting slot; 134, shielding body; 135, mounting bracket; 136, shielding flange;
[0032] 200, optical element; 210, optical transceiver assembly; 220, optical scanning assembly;
[0033] 300, electronic components; 310, transmitting module; 320, receiving module; 330, main circuit board; 340, sub-electronic device; 341, high-frequency electronic device; 301, shielding shell; 3011, first shielding cover; 3012, second shielding cover; 302, transmitting circuit board; 303, optical transmitter;
[0034] 400, shielding cover; 500, external connector; 700, protective cover;
[0035] A. First direction; B. Second direction; C. Third direction. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0037] LiDAR is one of the core sensing devices in the field of autonomous driving. It can sense the surrounding environment in real time and has centimeter-level resolution accuracy at long distances, which can meet the technical requirements of autonomous driving perception. In order to meet the development requirements of autonomous driving, the industry has developed a semi-solid-state LiDAR that keeps the transmitting and receiving optical systems of the LiDAR stationary and can achieve spatial scanning of the light beam only by controlling the rotation of the optical scanning component. The semi-solid-state LiDAR has the advantages of both mechanical and solid-state scanning.
[0038] The inventors found that due to the physical limitations of optical structures such as optical scanning components, the scanning window surface of the semi-solid laser radar generally uses a large window to increase the viewing angle of the semi-solid laser radar, and the large window will destroy the shielding performance required by electromagnetic compatibility (EMC), resulting in poor electromagnetic shielding protection measures for electronic components inside the semi-solid laser radar. Based on this, the embodiment of the present application provides a laser radar.
[0039] like Figures 1 to 3 , which is a schematic diagram of the structure of a laser radar 10 provided by an embodiment of the present application, the laser radar 10 includes a housing 100, an optical element 200 and an electronic element 300, the electronic element 300 includes a transmitting module 310 for transmitting light and a receiving module 320 for receiving light, the optical element 200 is used to change the propagation direction of the light emitted by the transmitting module 310 and project the light to the target object, and the optical element 200 is also used to change the propagation direction of the echo light reflected back by the target object and project the light to the receiving module 320. The optical element 200 and the electronic element 300 are both arranged in the internal space of the housing 100, and the housing 100 has a light-through opening 101 corresponding to the optical element 200, and the light enters and exits the optical element 200 through the light-through opening 101.
[0040] The housing 100 includes a first housing 110, a second housing 120 and an electromagnetic shielding member 130. Figure 3 As shown, the first shell 110 is disposed on the electromagnetic shielding member 130, and the first shell 110 and the electromagnetic shielding member 130 define an optical transceiver cavity 103, and the second shell 120 is disposed on the electromagnetic shielding member 130, and the first shell 110 and the electromagnetic shielding member 130 define an electromagnetic shielding cavity 102. The electromagnetic shielding cavity 102 and the optical transceiver cavity 103 are independent of each other, and the electromagnetic shielding member 130 has an electromagnetic shielding performance, which blocks the electromagnetic signal in the optical transceiver cavity 103 from passing through the electromagnetic shielding member 130 to enter the electromagnetic shielding cavity 102, and blocks the electromagnetic signal in the electromagnetic shielding cavity 102 from passing through the electromagnetic shielding member 130 to enter the optical transceiver cavity 103.
[0041] The first housing 110 is provided with a light-through opening 101, which is in communication with the light-transmitting and receiving cavity 103. The optical element 200 is disposed in the light-transmitting and receiving cavity 103, and the optical element 200 is disposed corresponding to the light-through opening 101, so that the optical element 200 can smoothly receive and receive light through the light-through opening 101. The electronic element 300 is disposed in the electromagnetic shielding cavity 102.
[0042] The electromagnetic shielding member 130 includes a shielding body 134, which is connected to the first shell 110 and the second shell 120 respectively, and the shielding body 134 and the second shell 120 define an electromagnetic shielding cavity 102, and the electromagnetic shielding cavity 102 and the optical transceiver cavity 103 are respectively arranged on two opposite sides of the shielding body 134, and the shielding body 134 has electromagnetic shielding properties to prevent electromagnetic signals from interfering in the electromagnetic shielding cavity 102 and the optical transceiver cavity 103. The electronic component 300 is arranged in the electromagnetic shielding cavity 102, and the electronic component 300 can be installed in at least one of the shielding body 134 and the second shell 120. The electromagnetic shielding member 130 also includes a mounting bracket 135, which is arranged on a side of the shielding body 134 away from the electromagnetic shielding cavity 102, and the optical transceiver cavity 103 is defined by the mounting bracket 135, the shielding body 134 and the first shell 110. The optical element 200 is disposed in the optical transceiver cavity 103 , and the optical element 200 is mounted on at least one of the mounting bracket 135 and the first housing 110 .
[0043] The mounting bracket 135 is convexly arranged on the surface of the shielding body 134 away from the electromagnetic shielding cavity 102, so as to facilitate the design of the structure of the mounting bracket 135, so that the optical path of the optical element 200 mounted on the mounting bracket 135 is smooth. The mounting bracket 135 can also have electromagnetic shielding properties, and the mounting bracket 135 can shield electromagnetic signals together with the shielding body 134 to prevent electromagnetic signals from flowing between the optical transceiver cavity 103 and the electromagnetic shielding cavity 102.
[0044] The mounting bracket 135 can be separately provided from the shielding body 134, and the mounting bracket 135 can be fixed to the shielding body 134 by screw locking, bonding, etc., wherein the mounting bracket 135 can also include a plurality of sub-brackets. When the optical element 200 includes a plurality of devices, each device of the optical element 200 can be installed on a corresponding sub-bracket, and the relative position between each device of the optical element 200 can be flexibly adjusted by adjusting the position of the sub-bracket on the shielding body 134. Alternatively, the mounting bracket 135 can also be integrally formed with the shielding body 134. When the optical element 200 is installed on the mounting bracket 135, the mounting bracket 135 can directly locate the relative position of each device of the optical element 200, and the materials involved in the assembly are few, which is convenient for improving the assembly efficiency. The embodiment of the present application does not limit the installation method of the mounting bracket 135 on the shielding body 134, and the specific method can be selected according to actual needs.
[0045] In the laser radar 10 of the embodiment of the present application, due to the presence of the electromagnetic shielding member 130, even when the first shell 110 is provided with a light-through opening 101, the electromagnetic signal passing through the light-through opening 101 can be shielded by the electromagnetic shielding member 130, thereby reducing the interference of the electromagnetic signal in the optical transceiver cavity 103 with the electronic component 300 in the electromagnetic shielding cavity 102. In this way, it is convenient to set the first shell 110 with a larger light-through opening 101 according to the needs, so as to facilitate the optical element 200 to obtain a larger viewing angle and improve the detection performance of the laser radar 10.
[0046] The embodiment of the present application physically isolates the optical component 200 from the electronic component 300 by providing an electromagnetic shielding component 130, which facilitates the effective EMC standard design of the electronic component 300. At the same time, the optical component 200 can also meet the light path requirements as much as possible. Therefore, the present application avoids the conflict between the smooth light path requirement and the circuit shielding requirement caused by the same cavity of the optical component 200 and the electronic component 300 in the optoelectronic design of the traditional laser radar 10, and can effectively improve the EMC design performance of the laser radar 10.
[0047] It is understandable that, in order to meet the large field of view requirement of the optical element 200, the light-through opening 101 corresponding to the optical element 200 should be opened in a relatively open area of the housing 100. At the same time, in order to take into account the light path requirement of the optical element 200 and the electromagnetic shielding requirement of the electronic element 300, in the thickness direction of the electromagnetic shielding member 130 (i.e., the thickness direction of the shielding body 134), the electromagnetic shielding cavity 102 and the optical transceiver cavity 103 are arranged on opposite sides of the electromagnetic shielding member 130, so that the first housing 110 has more areas for opening the light-through opening 101, thereby better meeting the large field of view requirement of the optical element 200.
[0048] The electronic component 300 further includes a main circuit board 330 and at least one sub-electronic device 340. The receiving module 320 and the sub-electronic device 340 are respectively mounted on the main circuit board 330 and electrically connected to the main circuit board 330. For example, the receiving module 320 is arranged on the surface of the main circuit board 330, or a part of the circuit of the main circuit board 330 forms the receiving module 320. The board surface of the main circuit board 330 is perpendicular to the thickness direction of the electromagnetic shielding member 130 (i.e., the thickness direction of the shielding body 134), which is convenient for designing the arrangement of the sub-electronic device 340 on the main circuit board 330, and for more effectively performing EMC standard design on the main circuit board 330 and the sub-electronic device 340.
[0049] When the receiving module 320 is disposed on the surface of the main circuit board 330, the transmitting module 310, the receiving module 320 and the optical element 200 are installed on the same side of the main circuit board 330, so that the transmitting module 310 and the receiving module 320 are respectively connected to the optical element 200, so that the optical path transmission is smooth. When there are multiple sub-electronic devices 340 disposed on the main circuit board 330, in the direction perpendicular to the surface of the main circuit board 330, some of the sub-electronic devices 340 and the receiving module 320 are disposed on one side of the main circuit board 330, and another part of the sub-electronic devices 340 are disposed on the other side opposite to the main circuit board 330.
[0050] like Figure 3 As shown, the electronic component 300 further includes a high-frequency electronic device 341, and the laser radar 10 further includes a shielding cover 400. The shielding cover 400 is provided on the high-frequency electronic device 341 and is installed on the main circuit board 330. The shielding cover 400 has electromagnetic shielding properties and is used to shield the electromagnetic signal of the high-frequency electronic device 341 to prevent the high-frequency electromagnetic leakage generated by the high-frequency electronic device 341 from affecting other sub-electronic devices 340. Optionally, a part of the electronic devices of the sub-electronic device 340 is a high-frequency electronic device 341, for example, the high-frequency electronic device 341 includes a chip and a sub-circuit board with a high-frequency circuit, etc., the chip and the sub-circuit board are both installed on the main circuit board 330, and the shielding cover 400 is provided on the chip and the sub-circuit board for electromagnetic shielding; or, the main circuit board 330 has a high-frequency circuit, and the shielding cover 400 is directly provided on the area of the main circuit board 330 with the high-frequency circuit for electromagnetic shielding.
[0051] When a part of the electronic devices of the sub-electronic devices 340 is a high-frequency electronic device 341, optionally, the part of the sub-electronic devices 340 is mounted on the surface of the main circuit board 330 away from the receiving module 320. For example, in a direction perpendicular to the board surface of the main circuit board 330, the main circuit board 330 has a first surface and a second surface that are arranged opposite to each other, the second surface faces the second housing 120, the receiving module 320 is arranged on the first surface, the high-frequency electronic device 341 is arranged on the second surface, and the shielding cover 400 is installed on the second surface of the main circuit board 330 and covers the high-frequency electronic device 341, and the high-frequency electronic device 341 is electromagnetically shielded by the shielding cover 400 and the electromagnetic shielding member 130 together.
[0052] The electronic component 300 includes at least one transmitting module 310, and the at least one transmitting module 310 is disposed on one side of the main circuit board 330. The electromagnetic shielding member 130 is provided with at least one transmitting opening 1301, and the at least one transmitting opening 1301 corresponds to the at least one transmitting module 310 one by one, and light passes through the transmitting opening 1301 and propagates between the transmitting module 310 and the optical component 200. The opening direction of the transmitting opening 1301 is parallel to the surface direction of the main circuit board 330 or is at an angle to the surface direction of the main circuit board 330. For example, Figure 3 As shown, the electronic component 300 includes two emission modules 310, which are arranged on the same side of the main circuit board 330 and arranged side by side in a first direction A, and the first direction A is a direction parallel to the surface of the main circuit board 330. In a second direction B perpendicular to the first direction A (i.e., the thickness direction of the shielding body 134), the optical element 200 and the two groups of emission modules 310 are located on the same side of the main circuit board 330. The electromagnetic shielding member 130 is provided with two emission openings 1301 corresponding to the two groups of emission modules 310.
[0053] Furthermore, when there are multiple transmitting modules 310, in the first direction A, at least part of the optical element 200 is disposed between the multiple transmitting modules 310, making full use of the space, making the entire laser radar 10 compact, facilitating the connection between the transmitting module 310 and the optical element 200, and enabling the light generated by the transmitting module 310 to be smoothly transmitted to the optical element 200. At this time, the opening direction of the transmitting opening 1301 can be set to be parallel to the board surface direction of the main circuit board 330.
[0054] The electronic component 300 also includes at least one receiving module 320 corresponding to at least one transmitting module 310, and at least one receiving module 320 is disposed on the main circuit board 330 and electrically connected to the main circuit board 330. The electromagnetic shielding member 130 is provided with at least one receiving opening 1302, and at least one receiving opening 1302 corresponds to at least one receiving module 320. Light passes through the receiving opening 1302 and propagates between the receiving module 320 and the optical element 200. The opening direction of the receiving opening 1302 is at an angle to the board surface of the main circuit board 330. The present application does not limit the opening direction of the receiving opening 1302, and it can be specifically selected according to the direction in which the optical element 200 projects light to the receiving module 320. For example, if the optical element 200 projects light to the receiving module 320 along the second direction B, the receiving opening 1302 is opened along the second direction B.
[0055] The receiving module 320 further includes an optical receiver and a receiving circuit board, wherein the optical receiver is used to process the optical signal of the received optical element and convert the optical signal into a receiving electrical signal, and the receiving circuit board is connected to the optical receiver and receives the receiving electrical signal transmitted by the optical receiver and transmits the receiving electrical signal to the main circuit board 330. The receiving circuit board is electrically connected to the ground terminal of the main circuit board 330 to filter the electromagnetic interference signal transmitted to the electromagnetic shielding cavity 102 through the receiving opening 1302.
[0056] The optical element 200 includes an optical scanning component 220 and at least one optical transceiver component 210. The optical transceiver component 210 is used to change the propagation direction of the light emitted by the transmitting module 310, to change the propagation direction of the light reflected back by the target object and to project the light to the receiving module 320. For example, the optical transceiver component 210 includes at least one of a lens having a refracting force on the light, a reflector capable of reflecting the light, and a collimating mirror capable of collimating the light. The optical scanning component 220 is used to adjust the viewing angle of the laser radar 10 receiving and receiving the light. For example, the optical scanning component 220 includes a micro-electro mechanical system (MEMS) galvanometer. The first housing 110 has a light-through opening 101 corresponding to the MEMS galvanometer, and the number of MEMS micromirrors is at least one.
[0057] Optionally, the optical transceiver assembly 210 of the optical element 200 is arranged on the mounting bracket 135 of the electromagnetic shielding member 130, and the optical scanning assembly 220 is arranged on the first shell 110, or the laser radar further includes an auxiliary bracket 160, the optical scanning assembly 220 is mounted on the auxiliary bracket 160, and the auxiliary bracket 160 is mounted on the shielding body 134. The laser radar may also include a protective cover 700. When the optical transceiver assembly 210 is mounted on the mounting bracket 135, the protective cover 700 is arranged on the optical transceiver assembly 210 and avoids the optical path of the optical transceiver assembly 210. The protective cover 700 provides protection for the optical transceiver assembly 210 to prevent external impurities such as dust from entering the optical transceiver assembly 210 to interfere with the scanning effect of the laser radar 10.
[0058] When the electronic component 300 includes multiple groups of transceiver modules (each transceiver module includes a transmitting module 310 and a receiving module 320), the optical component 200 may include a group of optical transceiver components 210 and a group of optical scanning components 220, and the multiple groups of transceiver modules share one group of optical transceiver components 210 and one group of optical scanning components 220; or, the optical component 200 may include multiple groups of optical transceiver components 210 and a group of optical scanning components 220, and the multiple groups of transceiver modules are arranged in a one-to-one correspondence with the multiple groups of optical transceiver components 210 to form multiple optical transceiver paths, and the multiple optical transceiver paths share one group of optical scanning components 220.
[0059] Optionally, the optical scanning assembly 220 includes a driving member and a scanning mirror for facing the target object. The scanning mirror is arranged corresponding to the light-through opening 101. A light-transmitting plate 140 is encapsulated at the light-through opening 101 to protect the optical element 200 in the optical transceiver cavity 103. The driving member is used to drive the scanning mirror to rotate to adjust the angle of the scanning mirror, and then adjust the scanning field of view of the scanning mirror. By expanding the size of the light-through opening 101, the scanning mirror can still have a good scanning viewing angle at multiple rotation angles. The embodiment of the present application does not limit the structure of the optical transceiver assembly 210 and the optical scanning assembly 220. Any optical transceiver assembly 210 and optical scanning assembly 220 applicable to the field can be applicable to the present application, and can be selected according to actual needs.
[0060] In the embodiment of the present application, the opening direction of the light-through opening 101 is selected according to the actual scanning angle of the scanning mirror of the optical scanning assembly 220, and the electromagnetic shielding component 130 is provided to physically isolate the optical element 200 from the electronic element 300, so that the opening direction and opening size of the light-through opening 101 in the first shell 110 are more flexible.
[0061] The opening direction of the light-through opening 101 corresponds to the scanning angle setting of the scanning mirror of the optical scanning component 220, and the scanning angle of the scanning mirror varies based on the position of the optical scanning component 220 relative to the optical transceiver component 210. For example, Figure 3 As shown, in the second direction B (a direction perpendicular to the surface of the main circuit board 330), the optical scanning component 220 is disposed on the side of the optical transceiver component 210 away from the main circuit board 330; or, in the third direction C (a direction parallel to the surface of the main circuit board 330), the optical scanning component 220 is disposed on one side of the optical transceiver component 210, and the first direction A, the second direction B and the third direction C are perpendicular to each other. The opening direction of the light-through opening 101 can be selected according to the above-mentioned two arrangements of the optical scanning component 220 and the optical transceiver component 210, and the specific opening direction of the light-through opening 101 is opened according to the scanning angle requirement of the scanning mirror.
[0062] Combination Figure 3 and Figure 4 , a first shielding slot 1303 is provided on the surface of the electromagnetic shielding member 130 away from the optical transceiver cavity 103, and specifically, the shielding body 134 defines the first shielding slot 1303. The main circuit board 330 is provided in the first shielding slot 1303, and the first shielding slot 1303 is a part of the electromagnetic shielding cavity 102. Optionally, the main circuit board 330 is installed in at least one of the electromagnetic shielding member 130 and the second housing 120. At this time, a receiving opening 1302 is provided on the bottom wall of the first shielding slot 1303.
[0063] The bottom wall of the first shielding slot 1303 is provided with an emission shielding slot 1304 , and the emission module 310 is arranged in the emission shielding slot 1304 , so as to improve the installation stability of the emission module 310 .
[0064] Furthermore, an emitting protrusion 131 is formed on the surface of the electromagnetic shielding component 130 away from the main circuit board 330, and the emitting protrusion 131 defines an emitting shielding groove 1304, so that more space is reserved on the surface of the electromagnetic shielding component 130 away from the main circuit board 330 for installing the optical element 200.
[0065] Optionally, when the optical element 200 includes multiple groups of emission modules 310, correspondingly, multiple groups of emission protrusions 131 are formed on the surface of the electromagnetic shielding member 130 facing away from the main circuit board 330, and the multiple groups of emission modules 310 are arranged one by one in the emission shielding grooves 1304 of the multiple groups of emission protrusions 131. At least part of the optical element 200 is arranged between the multiple groups of emission protrusions 131, for example, the optical transceiver assembly 210 of the optical element 200 is arranged between the multiple groups of emission protrusions 131, at this time, the emission protrusion 131 defines that the wall surface of the emission shielding groove 1304 is provided with an emission opening 1301, and the emission opening 1301 extends to the outer surface of the emission protrusion 131 in a direction parallel to the board surface of the main circuit board 330.
[0066] Among them, due to the existence of the transmitting opening 1301, the optical transceiver cavity 103 is connected to the electromagnetic shielding cavity 102, and the electromagnetic signal may pass through the transmitting opening 1301 and the transmitting opening 1301. Therefore, the electromagnetic signal of the transmitting opening 1301 needs to be shielded. Optionally, the transmitting module 310 is set to close the transmitting opening 1301 or close the slot of the transmitting shielding slot 1304 for electromagnetic shielding.
[0067] Specifically, Figure 5 As shown, the transmitting module 310 includes a shielding shell 301, a transmitting circuit board 302 disposed in the shielding shell 301, and a light emitter 303 disposed in the transmitting circuit board 302. The shielding shell 301 includes a first shielding cover 3011 and a second shielding cover 3012, the transmitting circuit board 302 is sandwiched between the first shielding cover 3011 and the second shielding cover 3012, and the light emitter 303 is accommodated in a cavity defined by the first shielding cover 3011 and the second shielding cover 3012. The first shielding cover 3011 and the second shielding cover 3012 both have electromagnetic shielding properties, and can electromagnetically shield the circuit of the transmitting circuit board 302 and the light emitter 303, and at least one of the first shielding cover 3011 and the second shielding cover 3012 is used to correspondingly close the notch of the transmitting opening 1301 or the transmitting shielding slot 1304.
[0068] The electronic component 300 further includes an external connector 500, which is mounted on the main circuit board 330 and electrically connected to the main circuit board 330, and is also used to connect to an external circuit to transmit electrical signals between the external circuit and the main circuit board 330. The external connector 500 is mounted on the electromagnetic shielding member 130, and further, the electromagnetic shielding member 130 has a first mounting groove 1306, and the external connector 500 is mounted in the first mounting groove 1306, so that the external connector 500 can be stably mounted on the electromagnetic shielding member 130.
[0069] Optionally, a portion of the electromagnetic shielding cavity 102 forms a first mounting groove 1306; or, a first mounting groove 1306 is provided on a surface of the electromagnetic shielding component 130 facing away from the main circuit board 330, and the first mounting groove 1306 is connected to the electromagnetic shielding cavity 102. At this time, the external connector 500 and the transmitting module 310 are on the same side of the main circuit board 330, and further, the external connector 500 has electromagnetic shielding properties.
[0070] Optionally, combined Figure 2 and Figure 6 The electromagnetic shielding member 130 (specifically, the shielding body 134) is provided with a mounting protrusion 133 on the surface facing away from the main circuit board 330, and the mounting protrusion 133 defines a first mounting groove 1306; or, the electromagnetic shielding member 130 (specifically, the shielding body 134) is provided with a shielding flange 136 on the surface facing the main circuit board 330, and the shielding flange 136 is provided corresponding to the mounting protrusion 133, and the mounting protrusion 133 and the shielding flange 136 jointly define the first mounting groove 1306. The shielding flange 136 has electromagnetic shielding properties, and the shielding flange 136 extends toward the main circuit board 330, and the electromagnetic shielding effect at the external connector 500 is enhanced by the shielding flange 136. Further, the end of the shielding flange 136 contacts the surface of the main circuit board 330. Optionally, the housing 100 further includes an auxiliary shielding member 150, which is mounted on the mounting protrusion 133. The auxiliary shielding member 150 and the mounting protrusion 133 jointly define a first mounting groove 1306, or, when the electromagnetic shielding member 130 also has a shielding flange 136, the shielding flange 136, the auxiliary shielding member 150 and the mounting protrusion 133 jointly define the first mounting groove 1306. The auxiliary shielding member 150 is detachably connected to the mounting protrusion 133 to facilitate the installation of the external connector 500. The auxiliary shielding member 150 also has an electromagnetic shielding function, further preventing electromagnetic signals from entering and exiting the electromagnetic shielding cavity 102 from the first mounting groove 1306.
[0071] In the third direction C, the mounting protrusion 133 is disposed on one side of the transmitting module 310. Furthermore, in the third direction C, the transmitting module 310 and the mounting protrusion 133 at least partially overlap, so that the laser radar 10 has a compact structure.
[0072] Optionally, the electromagnetic shielding component 130 is disposed in a cavity defined by the first shell 110 and the second shell 120, and the electromagnetic shielding component 130 divides the cavity inside the first shell 110 and the second shell 120 into an electromagnetic shielding and an optical transceiver cavity 103. Alternatively, the first shell 110 is disposed on one side of the electromagnetic shielding component 130 and is sealed to the electromagnetic shielding component 130, and the optical transceiver cavity 103 is defined by the first shell 110 and the electromagnetic shielding component 130; the second shell 120 is disposed on a side of the electromagnetic shielding component 130 away from the first shell 110 and is sealed to the electromagnetic shielding component 130, and the electromagnetic shielding cavity 102 is defined by the second shell 120 and the electromagnetic shielding component 130. Alternatively, the first shell 110 is disposed on one side of the electromagnetic shielding component 130 and is sealed to the electromagnetic shielding component 130, the second shell 120 is disposed in the first shielding slot 1303, and the second shell 120 encapsulates the slot of the first shielding slot 1303.
[0073] Optionally, the second shell 120 also has electromagnetic shielding properties. For example, the second shell 120 is a metal shell 100 . The second shell 120 and the electromagnetic shielding member 130 together provide a more comprehensive electromagnetic shielding effect for the electronic component 300 installed in the electromagnetic shielding cavity 102 .
[0074] Optionally, the electromagnetic shielding component 130 is a metal electromagnetic shielding component 130. When the second shell 120 is a metal shell 100, the overlap between the second shell 120 and the electromagnetic shielding component 130 is laser engraved and exposed to the white, so that the structural connection stability is good and has a good sealing effect.
[0075] Optionally, the first housing 110 is an electromagnetic transparent housing 100, for example, the first housing 110 is a plastic housing 100. The first housing 110 may be fixed to at least one of the electromagnetic shielding member 130 and the second housing 120 by screws.
[0076] During assembly, the electronic device can be installed on the electromagnetic shielding component 130, and then the second shell 120 can be installed on the electromagnetic shielding component 130, and then the optical element 200 can be installed on the electromagnetic shielding component 130 and the first shell 110 accordingly, and finally the first shell 110 can be fixed to the electromagnetic shielding component 130. The assembly is convenient, and the assembled laser radar 10 has good EMC performance.
[0077] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0078] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A laser radar, characterized in that: include: A shell, comprising a first shell, a second shell and an electromagnetic shielding component; the first shell is connected to the electromagnetic shielding component, and the first shell and the electromagnetic shielding component define an optical transceiver cavity, and the first shell has a light-through opening communicated with the optical transceiver cavity; the second shell is connected to the electromagnetic shielding component, and the second shell and the electromagnetic shielding component define an electromagnetic shielding cavity; the electromagnetic shielding cavity and the optical transceiver cavity are arranged on opposite sides of the electromagnetic shielding component; the electromagnetic shielding component has electromagnetic shielding properties; An optical element is disposed in the light transceiver cavity, and the light-through opening is disposed corresponding to the optical element; and The electronic component is arranged in the electromagnetic shielding cavity.
2. The laser radar according to claim 1, characterized in that: The electronic components include: Main circuit board; at least one transmitting module; and At least one receiving module, the receiving module and the transmitting module are arranged one by one; in a direction perpendicular to the surface of the main circuit board, the optical element, the transmitting module and the receiving module are located on the same side of the main circuit board.
3. The laser radar according to claim 2, characterized in that: The optical element comprises: At least one optical transceiver assembly, wherein the optical transceiver assembly is arranged in a one-to-one correspondence with the transmitting module, and the optical transceiver assembly is also arranged in a one-to-one correspondence with the receiving module; An optical scanning component is disposed on a side of the optical transceiver component away from the main circuit board in a direction perpendicular to the surface of the main circuit board; or, in a direction parallel to the surface of the main circuit board, the optical scanning component is disposed on a side of the optical transceiver component; the light-through opening is disposed corresponding to the optical scanning component.
4. The laser radar according to claim 2, characterized in that: A first shielding groove is formed on the surface of the electromagnetic shielding member facing away from the optical transceiver cavity, and the main circuit board is arranged in the first shielding groove; The bottom wall of the first shielding groove is provided with an emission shielding groove, and the emission module is arranged in the emission shielding groove.
5. The laser radar according to claim 4, characterized in that: At least one emitting protrusion is formed on the surface of the electromagnetic shielding component facing away from the main circuit board, and each of the emitting protrusions defines one of the emitting shielding grooves.
6. The laser radar according to claim 2, characterized in that: The surface of the electromagnetic shielding component facing away from the optical transceiver cavity is provided with a first installation groove communicating with the electromagnetic shielding cavity; The electronic component includes an external connector, which is arranged in the first mounting groove and is electrically connected to the main circuit board.
7. The laser radar according to claim 6, characterized in that: A mounting protrusion is formed on the surface of the electromagnetic shielding member facing away from the main circuit board; The mounting protrusion defines the first mounting groove; or, A shielding flange is protruded from the surface of the electromagnetic shielding component facing the main circuit board. The shielding flange is arranged corresponding to the mounting protrusion, and the mounting protrusion and the shielding flange jointly define the first mounting groove.
8. The laser radar according to claim 1, characterized in that: The electromagnetic shielding component comprises a shielding body and a mounting bracket; the first shell and the second shell are respectively mounted on the shielding body; The second shell and the shielding body define the electromagnetic shielding cavity; The mounting bracket is arranged on a side of the shielding body away from the electromagnetic shielding cavity, and at least a part of the optical element is arranged on the mounting bracket.
9. The laser radar according to claim 1, characterized in that: The electronic component includes a main circuit board and a high-frequency electronic device arranged on the main circuit board; the laser radar also includes: A shielding cover is provided on the high-frequency electronic device and installed on the main circuit board.
10. The laser radar according to claim 1, characterized in that: The first shell is disposed on one side of the electromagnetic shielding component and is sealed and connected to the electromagnetic shielding component; The second shell is arranged on a side of the electromagnetic shielding component away from the first shell and is sealed and connected to the electromagnetic shielding component; or, A first shielding groove is formed on the surface of the electromagnetic shielding component facing away from the optical transceiver cavity, and the second shell is arranged in the first shielding groove and seals the notch of the first shielding groove.
11. The laser radar according to any one of claims 1 to 10, characterized in that: The electromagnetic shielding component is a metal electromagnetic shielding component; and / or, The second shell is a metal shell; and / or, The first shell is an electromagnetically transparent shell.