Electronic equipment for separated hard disk storage

Abstract

The invention discloses electronic equipment for separated hard disk storage, and belongs to the technical field of electronics. The electronic equipment comprises a host mainboard, a CPU (Central Processing Unit), a solid state disk and a single board, the solid state disk comprises a hard disk controller and a hard disk memory; wherein the hard disk controller is separated from the hard disk memory; the CPU and the hard disk controller are arranged on the host mainboard, and the hard disk memory is arranged on the single board; and the single board is detachably connected with the host mainboard.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an electronic device with separate hard disk storage. Background Art

[0002] Currently, users generally use solid-state hard drives to store the data they need. Solid-state hard drives usually include a hard drive controller and a hard drive memory (such as a NAND chip).

[0003] In the related art, a solid state drive is usually set as a whole in an electronic device such as a laptop computer. That is, the hard disk controller and hard disk memory in the solid state drive are both set on the same small circuit board in the laptop computer. However, since the solid state drive in an electronic device such as a laptop computer generates heat during operation, not only the hard disk controller but also the hard disk memory generates heat, such a setting in the related art has the problem of poor heat dissipation effect. Summary of the invention

[0004] The embodiment of the present application provides an electronic device with separate hard disk storage, which can solve the problem of poor heat dissipation effect existing in the hard disk storage solution used in the related art.

[0005] An embodiment of the present application provides an electronic device with separate hard disk storage, which includes: a host motherboard, a CPU, a solid-state hard disk and a single board; the solid-state hard disk includes a hard disk controller and a hard disk memory; wherein the hard disk controller and the hard disk memory are separated; the CPU and the hard disk controller are arranged on the host motherboard, and the hard disk memory is arranged on the single board; the single board and the host motherboard are detachably connected.

[0006] The above technical solution provided by the embodiment of the present application can achieve the following technical effects: The electronic device with separate hard disk storage provided in the embodiment of the present application includes: a host motherboard, a CPU, a solid state hard disk and a single board; the solid state hard disk includes a hard disk controller and a hard disk memory; wherein the hard disk controller and the hard disk memory are separated; the CPU and the hard disk controller are arranged on the host motherboard, and the hard disk memory is arranged on the single board; the single board and the host motherboard are detachably connected. In this way, by separating the hard disk controller and the hard disk memory, a better heat dissipation effect can be ensured; moreover, by setting the hard disk controller on the host motherboard of the electronic device with separate hard disk storage, rather than on the single board where the hard disk memory is located, the host motherboard can provide a larger heat dissipation area for the hard disk controller, thereby providing a better heat dissipation effect, solving the problem of poor heat dissipation effect existing in the hard disk storage solution used in the related technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 It is a schematic diagram of an electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 2 It is a schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 3 It is a schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 4 It is a schematic diagram of the interior of a single board provided by the present application; Figure 5 It is a schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 6 It is a schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 7 It is a schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application; Figure 8 is a schematic diagram of a voltage switching circuit provided in an embodiment of the present application; Fig. 9 It is a complete schematic diagram of an electronic device with separate hard disk storage provided in an embodiment of the present application.

[0009] Description of reference numerals: Host motherboard-100; single board-200; connector-300; CPU-110; hard disk controller-120; host memory-130; power supply module 140; hard disk storage-210; flash memory chip-215; temperature sensor-220. DETAILED DESCRIPTION

[0010] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0011] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0012] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0013] At present, hard disk storage solutions used in electronic devices (such as laptops) mainly include the following two solutions: the first solution is to set the solid-state hard disk as a whole in the electronic device to provide storage space for the electronic device; the second solution is to seal the hard disk controller and hard disk memory of the solid-state hard disk into a chip, and then apply the chip to the electronic device to provide storage space for the electronic device.

[0014] However, all of the above solutions have heat dissipation problems. Specifically, for the first solution, as the SSD is iterated and upgraded, the power wattage of the SSD increases accordingly, which in turn causes the operating temperature of the SSD to soar. In order to avoid the SSD operating temperature being too high, a larger heat dissipation area is required, but the limitation of the space used by the SSD makes it difficult to provide a larger heat dissipation area. For the second solution, the hard disk controller and hard disk storage of the SSD are two heat sources. The hard disk controller and hard disk storage are sealed together, which makes the distance between the two heat sources closer, and there is a higher heat dissipation risk.

[0015] Based on this, the electronic device with separate hard disk storage provided in the embodiment of the present application sets the hard disk controller on the host motherboard of the electronic device, sets the hard disk storage on the single board of the electronic device, and the single board is detachably connected to the host motherboard. In this way, by separating the hard disk controller and the hard disk storage, and making full use of the advantage of the larger area of ​​the host motherboard compared to the single board, a larger heat dissipation area can be provided for the hard disk controller, solving the problem of poor heat dissipation effect in the related technology.

[0016] The electronic device with separate hard disk storage provided by the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0017] See also Figure 1 , Figure 1Schematic diagram of an electronic device with a separate hard disk storage provided by an embodiment of the present application. Figure 1 As shown, the electronic device with separate hard disk storage includes a host motherboard 100, a CPU 110, a solid state hard disk and a single board 200, wherein the solid state hard disk includes a hard disk controller 120 and a hard disk storage 210. The hard disk controller 120 and the hard disk storage 210 are separated; the CPU 110 and the hard disk controller 120 are arranged on the host motherboard 100, and the hard disk storage 210 is arranged on the single board 200; the single board 200 and the host motherboard 100 are detachably connected.

[0018] In the embodiment of the present application, the CPU and the hard disk controller may be welded on the host motherboard, and the hard disk controller may be a solid state hard disk controller for controlling the storage of the hard disk memory. Figure 1 As shown, the hard disk controller 120 and the hard disk storage 210 are respectively arranged on two detachably connected boards, so that the hard disk controller and the hard disk storage can be separated. Among them, the hard disk controller and the hard disk storage are two heat sources, and the heat generated by the hard disk controller will be higher than the heat generated by the hard disk storage. The hard disk controller with higher heat generation can be arranged on a larger host motherboard to provide a larger heat dissipation area, thereby providing a better heat dissipation effect.

[0019] In addition, the separation of the hard disk storage and the hard disk controller provides greater flexibility during the reliable data transfer (RDT) test. Specifically, only the hard disk storage needs to be tested for RDT, without the need for testing the entire device.

[0020] Moreover, compared with the hard disk controller, the hard disk storage has a higher probability of problems and usually has a shorter lifespan. By separating the hard disk storage from the hard disk controller, when a problem occurs, the hard disk storage can be replaced to effectively locate the problem, which can effectively reduce the time for after-sales maintenance. In addition, the detachable connection setting can make after-sales maintenance more convenient and quick.

[0021] In one embodiment of the present application, the hard disk controller is arranged in a direction away from the hard disk storage, and the hard disk storage is arranged in a direction away from the hard disk controller. For example, after the setting position of the hard disk storage or the setting position of the connector is determined, the position farthest from the setting position of the hard disk storage or the setting position of the connector can be selected from multiple available positions on the host motherboard as the setting position of the hard disk controller. Similarly, after the setting position of the hard disk controller is determined, the position farthest from the setting position of the hard disk controller can be selected from multiple available positions on the single board as the setting position of the hard disk storage.

[0022] In the embodiment of the present application, during the storage process of the electronic device, the hard disk controller and the hard disk storage are two heat sources, and the operating temperature of the two heat sources will rise. If the distance between the two heat sources is close, the heat dissipation risk of the hard disk storage will be high. By setting the hard disk controller and the hard disk storage on the host motherboard and the single board respectively, the distance between the hard disk controller and the hard disk storage can be increased, reducing the heat dissipation risk.

[0023] Furthermore, if Figure 1 As shown, in the process of setting the hard disk controller 120 on the host motherboard 100 and setting the hard disk storage 210 on the single board 200, the hard disk controller 120 is set in a direction away from the hard disk storage 210, and the hard disk storage 210 is set in a direction away from the hard disk controller 120. In this way, the hard disk controller and the hard disk storage are as far apart as possible, so that the two heat sources can be more dispersedly set in the electronic device, reducing the heat dissipation risk of the hard disk storage and improving the heat dissipation efficiency.

[0024] Wherein, the hard disk storage may include a flash memory (NAND) chip. Since the temperature control point of the NAND chip is relatively low, the temperature control of the NAND chip has a higher priority. In other words, it is possible to prioritize the operating temperature of the NAND chip not to exceed a preset temperature threshold. Based on this, by dispersing the hard disk controller and the NAND chip as much as possible, the temperature of the NAND chip will not be affected by the heat generated by the hard disk controller and rise.

[0025] The electronic device with separate hard disk storage provided in the embodiment of the present application includes: a host motherboard, a CPU, a solid state hard disk and a single board; the solid state hard disk includes a hard disk controller and a hard disk memory; wherein the hard disk controller and the hard disk memory are separated; the CPU and the hard disk controller are arranged on the host motherboard, and the hard disk memory is arranged on the single board; the single board and the host motherboard are detachably connected. In this way, by separating the hard disk controller and the hard disk memory, a better heat dissipation effect can be ensured; moreover, by setting the hard disk controller on the host motherboard of the electronic device with separate hard disk storage, rather than on the single board where the hard disk memory is located, the host motherboard can provide a larger heat dissipation area for the hard disk controller, thereby providing a better heat dissipation effect, solving the problem of poor heat dissipation effect existing in the hard disk storage solution used in the related technology.

[0026] exist Figure 1 The electronic device provided with a separate hard disk storage can be connected to the host motherboard through a connector. Figure 2 , Figure 2 Schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application. Figure 2 As shown, the electronic device further includes a connector 300, and the host motherboard 100 and the single board 200 are connected via the connector 300. It should be understood that although Figure 2 The connector 300 is not shown on the host motherboard 100, but it should be understood that Figure 2 The connection between the host motherboard 100 and the single board 200 through the connector 300 is only exemplified, and the setting position of the connector 300 is not limited. In one embodiment, the connector 300 can be set on the host motherboard 100 of the electronic device with separate hard disk storage, for example, the connector 300 is welded on the host motherboard 100.

[0027] In the embodiment of the present application, the connector may be a plug-in component for realizing a detachable connection between the host motherboard and the single board, such as a gold finger or a board-to-board (BTB) connector. By providing a connector between the host motherboard and the single board, the distance between the hard disk controller and the hard disk storage can be made longer, and the heat source of the hard disk controller can be further conducted, so as to avoid the heat generated by the hard disk controller affecting the working temperature of the hard disk storage as much as possible, and provide a better heat dissipation environment and heat dissipation efficiency.

[0028] exist Figure 2 Based on the electronic device with separate hard disk storage provided, the electronic device with separate hard disk storage provided in another embodiment of the present application may further include a temperature sensor disposed on a single board, and the temperature sensor is connected to the CPU via a connector. Figure 3 , Figure 3 Schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application. Figure 3 As shown, the electronic device further includes a temperature sensor 220 disposed on the single board 200 , and the temperature sensor 220 can be connected to the CPU 110 via the connector 300 .

[0029] In the embodiment of the present application, in order to further ensure that the working temperature of the hard disk storage on the single board of the electronic device is not too high, a temperature sensor can be set on the single board. The temperature sensor is connected to the CPU via a connector, and the temperature sensor can be controlled by the CPU on the host motherboard. The CPU can obtain the external environment temperature of the hard disk storage. When it is determined that the external environment temperature is not suitable for powering on the hard disk storage, the CPU can not power on the hard disk storage first, so as to avoid the working temperature of the hard disk storage being too high and causing the data in the hard disk storage to be damaged.

[0030] Figure 4 Schematic diagram of the interior of a single board provided in an embodiment of the present application. Figure 4As shown, a single board 200 of an electronic device with separate hard disk storage may be provided with a hard disk memory, and the hard disk memory may include a plurality of flash memory chips (such as Figure 4 The single board may be connected to the host motherboard through a connector, such as a high-speed connector, which may support low-loss transmission of 8 GHz frequency signals. The NAND card may transmit NAND IO signals to the host motherboard through a connector (such as a high-speed connector).

[0031] In addition, if Figure 4 As shown, the single board 200 may also be provided with a temperature sensor 220, and the temperature sensor 220 may be interconnected with the CPU on the host motherboard via an Inter-Integrated Circuit (IIC) bus interface or in the form of analog voltage. The CPU on the host motherboard may obtain the external environment temperature of the NAND card via the temperature sensor. If the current operating temperature of the NAND card exceeds the ambient temperature requirement for the NAND chip, the CPU may control the power supply module such as the power supply not to power on the NAND chip first, so as to avoid data damage to the NAND chip.

[0032] In addition, in the related art, the hard disk controller and the hard disk storage are usually set close to each other, and the temperature sensor is connected to the hard disk controller, and the temperature sensor is started by starting the hard disk controller. However, this method has the following disadvantages: when the hard disk controller is not started, if the working temperature of the hard disk storage is already very high, starting the hard disk controller will bring about a higher working temperature, further increasing the working temperature of the hard disk storage, and in this case the hard disk storage may be directly damaged.

[0033] Based on this, in order to avoid the above situation, the temperature sensor in the embodiment of the present application can be started and controlled by the CPU on the host board without being started by the hard disk controller. This can avoid the situation where the hard disk controller startup causes the operating temperature of the hard disk storage to rise, thereby avoiding the disadvantage of the related technology that it affects the hard disk storage.

[0034] In one embodiment of the present application, the temperature sensor is used to sense the temperature of the hard disk storage. The temperature sensor may be adjacent to the location where the hard disk storage is set to accurately determine the temperature of the hard disk storage. The temperature of the hard disk storage may be the temperature of the environment where the hard disk storage is located sensed by the temperature sensor.

[0035] In the embodiment of the present application, since the hard disk storage has high temperature requirements, the temperature sensor is used to sense the temperature of the hard disk storage to ensure that the hard disk storage can operate at a suitable operating temperature. This can extend the service life of the hard disk storage while avoiding data damage to the hard disk storage.

[0036] exist Figures 1 to 3 Based on the electronic device with separate hard disk storage shown in any figure, the hard disk controller can be directly connected to the CPU via the printed circuit board (PCB) wiring. Figure 5 , Figure 5 Schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application. Figure 5 As shown, the CPU 110 on the host motherboard 100 of the electronic device is directly connected to the hard disk controller 120 via PCB wiring.

[0037] In the embodiment of the present application, data can be transmitted between the hard disk controller and the CPU via a high-speed peripheral component interconnect express (PCIe). Figure 5 As shown, since the hard disk controller 120 and the CPU 110 are both arranged on the host motherboard 100, the PCIe data transmission between the hard disk controller 120 and the CPU 110 on the host motherboard 100 can be realized directly through PCB routing, without routing through an additional connector, thereby avoiding the attenuation and crosstalk of the PCIe signal on the connector. In this way, the signal quality of PCIe transmission can be better guaranteed while saving the cost of high-performance connectors.

[0038] The electronic device with separate hard disk storage provided in any embodiment of the present application may further include: a host memory arranged on the host motherboard, the host memory is connected to the CPU, and the CPU is connected to the hard disk storage. Figure 6 , Figure 6 Schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application. Figure 6 As shown, the host motherboard 100 of the electronic device is provided with a CPU 110, a hard disk controller 120 and a host memory 130, wherein the host memory 130 is connected to the CPU 110, and the host motherboard 100 is detachably connected to the single board 200, and thus the CPU 110 on the host motherboard 100 is coupled to the hard disk memory 210 on the single board 200.

[0039] The host memory is the memory of the electronic device with the separated hard disk storage, and is set on the host motherboard. The host memory is connected to the CPU of the electronic device with the separated hard disk storage, and is used to provide a storage space for data cache for the CPU. The host memory can be, for example, a double data rate synchronous dynamic random access memory (Double Data Rate Synchronous Dynamic Random Access Memory, DDR SDRAM), as follows Fig. 9 DDR shown in .

[0040] The electronic device with separate hard disk storage provided in the embodiment of the present application may further include: a power supply module arranged on the host motherboard, the power supply module is connected to the hard disk controller, and is connected or coupled to the hard disk storage. Figure 7 , Figure 7 Schematic diagram of another electronic device with separate hard disk storage provided by an embodiment of the present application. Figure 7 As shown, the host motherboard 100 of the electronic device is provided with a CPU 110, a hard disk controller 120 and a power supply module 140, the power supply module 140 is connected to the hard disk controller 120, and the power supply module 140 on the host motherboard 100 can also be connected to the hard disk storage 210 on the single board 200. When the host motherboard 100 is connected to the single board 200 through the connector 300, the power supply module 140 can be connected to the hard disk storage 210 via the connector 300 to provide power to the hard disk storage 210.

[0041] In the embodiment of the present application, the power supply module on the host motherboard is connected to the hard disk storage on the single board. Therefore, the hard disk storage on the single board can reuse the power supply module on the host motherboard. In other words, the power supply module on the host motherboard can supply power to the hard disk storage on the single board, without the need to set up a power supply module for the hard disk storage on the single board, thus saving the hardware cost of setting up a separate power supply module.

[0042] In one embodiment of the present application, the hard disk storage may include a flash memory chip, and the single board may have different types or specifications. Single boards of different types or specifications can be used to adapt to flash memory chips in different packaging forms.

[0043] In the embodiment of the present application, a variety of single boards can be designed, and these multiple single boards can provide external compatible interfaces. The single board can transmit a voltage selection signal (voltage select) to the power supply module on the host motherboard through a connector, and the power supply module on the host motherboard can supply power to the flash memory chip on the single board through the connector. The single board in the embodiment of the present application can have the following single board examples.

[0044] Single board example 1, the single board supports compatible package design, and can simultaneously place several (for example, one, two, four or eight) flash memory (NAND) particles of different package types (for example, BGA178, BGA154 or BGA146). The NAND IO signal emitted by the single board can be transmitted to the CPU on the host motherboard through a connector, and the connector can be, for example, a gold finger or BTB connector. In addition, the single board supports notifying the power supply module of the voltage domain of the NAND chip by means of pull-up and pull-down resistors, so that the power supply module can switch to the corresponding voltage domain to be compatible with NAND chips in different power domains.

[0045] Single board example 2, the single board supports compatible package design, and can simultaneously place several flash memory (NAND) particles of different package types (such as BGA152 or BGA132). The NAND IO signal emitted by the single board can be transmitted to the CPU on the host motherboard through a connector, and the connector can be, for example, a gold finger or BTB connector. In addition, the single board supports notifying the power supply module of the voltage domain of the NAND chip by means of pull-up and pull-down resistors, so that the power supply module can switch to the corresponding voltage domain to be compatible with NAND chips in different power domains.

[0046] Single board example 3, the single board supports compatible package design, and can simultaneously place several flash memory (NAND) particles of different package types (such as BGA272, BGA252 or BGA316). The NAND IO signal emitted by the single board can be transmitted to the CPU on the host motherboard through a connector, and the connector can be, for example, a gold finger or BTB connector. In addition, the single board supports notifying the power supply module of the voltage domain of the NAND chip by means of pull-up and pull-down resistors, so that the power supply module can switch to the corresponding voltage domain to be compatible with NAND chips in different power domains.

[0047] Among them, the ball grid array (BGA) package is a packaging technology that can be welded using special welding equipment. For example, the BGA152 particle is a flash memory particle using BGA packaging technology, which has the characteristics of high-speed reading and writing, low power consumption and high reliability, and is usually used in the production of solid-state drives. For the different types of flash memory particles mentioned in the above examples, BGA152 particles and BGA132 particles are currently the more mainstream NAND flash memory particles, generally supporting speeds of 2400 and below; BGA178 particles, BGA154 particles and BGA146 particles are relatively high-speed NAND flash memory particles, generally supporting speeds of 3600 and above; the single-particle capacity of BGA272 particles is generally twice the single-particle capacity of BGA132 particles or BGA 154 particles.

[0048] like Figure 4As shown, the single board 200 is connected to the host motherboard 100 through the connector 300, and the connector 300 can be a high-speed connector that supports low-loss transmission of 8GHz frequency signals. The single board 200 transmits NAND IO signals to the host motherboard 100 through the connector 300, and the single board 200 can transmit voltage selection signals to the power supply module 140 on the host motherboard 100 through the connector 300. The power supply module 140 on the host motherboard 100 can supply power to the flash memory chip 215 on the single board 200 through the connector 300.

[0049] In the embodiment of the present application, different single boards can be manufactured to adapt to NAND chips in different packaging forms while ensuring consistency with the host motherboard interface. The manufacturing cost of the single board is low, and as the speed of the NAND chip increases, its packaging form will also change accordingly. The single board can be configured in a low-cost manner according to the iteration of the NAND packaging form.

[0050] In one embodiment of the present application, the hard disk storage may have a first state and a second state. When the hard disk storage is in the first state, the power supply module provides a first voltage to the hard disk storage; when the hard disk storage is in the second state, the power supply module provides a second voltage to the hard disk storage. The first voltage and the second voltage are different, and the hard disk storage includes a flash memory chip.

[0051] In an embodiment of the present application, in order to adapt to flash memory chips in different voltage domains, a power supply module is provided on the host mainboard. The power supply module may include a power supply and a voltage switching circuit. After receiving the voltage selection signal transmitted from the single board, the power supply module on the host mainboard can determine the current state of the hard disk storage based on the voltage selection signal, and based on the current state of the hard disk storage, it can determine whether to provide the first voltage or the second voltage to the hard disk storage.

[0052] Please refer to Figure 8 , Figure 8 is a schematic diagram of a voltage switching circuit provided in an embodiment of the present application. Figure 8 As shown, two resistors R1 and R2 are reserved on the single board 200, and one of the resistors can be selected by pulling up and down. If connected to resistor R1, signal 1 is sent to the host motherboard 100, and signal 1 is used to indicate that the current single board supports the first voltage (for example, 3.3V and 1.8V voltage) for power supply; if connected to resistor R2, signal 0 is sent to the host motherboard, and signal 0 is used to indicate that the current single board supports the second voltage (for example, 2.5V and 1.2V voltage) for power supply.

[0053] When the host mainboard receives signal 1, it can be determined that the hard disk storage on the single board is currently in the first state, and the first voltage can be provided to the hard disk storage; when the host mainboard receives signal 0, it can be determined that the hard disk storage on the single board is currently in the second state, and the second voltage can be provided to the hard disk storage.

[0054] Specifically, Figure 8 As shown, the host motherboard 100 is provided with different power supplies (power supply A and power supply B) and different MOS voltage switching circuits (MOS voltage switching circuit Q1 and MOS voltage switching circuit Q2), which can adaptively switch to the corresponding power supply voltage according to the received voltage selection signal.

[0055] Specifically, after the host motherboard 100 receives the voltage selection signal (including signal 1 and signal 0) transmitted by the single board, the voltage selection signal is transmitted to the MOS voltage switching circuit Q1 and the MOS voltage switching circuit Q2. The MOS voltage switching circuit Q1 is not turned on when receiving the signal 0, and the MOS voltage switching circuit Q1 is turned on when receiving the signal 1. The MOS voltage switching circuit Q2 is not turned on when receiving the signal 0, and the MOS voltage switching circuit Q2 is turned on when receiving the signal 1.

[0056] like Figure 8 As shown, a resistor R5 is provided on the branch where the MOS voltage switching circuit Q1 is located, and a resistor R8 is provided on the branch where the MOS voltage switching circuit Q2 is located. When the MOS voltage switching circuit Q1 is not conducting and conducting, the power supply A can output different voltages. When the MOS voltage switching circuit Q2 is not conducting and conducting, the power supply B can output different voltages.

[0057] Specifically, when the MOS voltage switching circuit Q1 receives the signal 0, the MOS voltage switching circuit Q1 is not turned on, and the output voltage of the power supply A is as follows: ; Where VoutA is the output voltage of power supply A, Vfb is the voltage feedback (VFB) pin (such as Figure 8 The output voltage of the FB pin of the power supply A) is as follows: R3 and R4 are Figure 8 The resistors R3 and R4 are shown in FIG.

[0058] When the MOS voltage switching circuit Q1 receives signal 1, the MOS voltage switching circuit Q1 is turned on, and the output voltage of the power supply A is as follows: ; Where VoutA is the output voltage of power supply A, Vfb is the VFB pin (such as Figure 8The output voltage of the FB pin of the power supply A in the middle, R3, R4 and R5 are as follows Figure 8 The resistors R3, R4 and R5 are shown in FIG.

[0059] From the above content, it can be known that different resistors can be connected according to different voltage selection signals, so that power supply A can output different voltages. The resistors in the above process can be adjusted. For example, by selecting reasonable resistors, power supply A can output a voltage of 2.5V or 3.3V to power the single board.

[0060] When the MOS voltage switching circuit Q2 receives the signal 0, the MOS voltage switching circuit Q2 is not turned on, and the output voltage of the power supply B is as follows: ; Where VoutB is the output voltage of power supply B, Vfb is the VFB pin (such as Figure 8 The output voltage of the FB pin of the power supply B) is as follows: R6 and R7 are Figure 8 The resistors R6 and R7 are shown in FIG.

[0061] When the MOS voltage switching circuit Q2 receives the signal 1, the MOS voltage switching circuit Q2 is turned on, and the output voltage of the power supply B is as follows: ; Where VoutB is the output voltage of power supply B, Vfb is the VFB pin (such as Figure 8 The output voltage of the FB pin of the power supply B in the middle, R6, R7 and R8 are as follows Figure 8 The resistors R6, R7 and R8 are shown in FIG.

[0062] From the above content, it can be known that different resistors can be connected according to different voltage selection signals, so that power supply B can output different voltages. The resistors in the above process can be adjusted. For example, by selecting reasonable resistors, power supply B can output a voltage of 1.8V or 1.2V to power the single board.

[0063] In the embodiment of the present application, the hard disk storage has a first state and a second state; when the hard disk storage is in the first state, the power supply module provides a first voltage to the hard disk storage; when the hard disk storage is in the second state, the power supply module provides a second voltage to the hard disk storage; wherein the first voltage and the second voltage are different, and the hard disk storage includes a flash memory chip. In this way, the function of adaptively switching voltage can be realized according to the current state of the hard disk storage, and the power supply module on the host motherboard can support power supply to single boards in different voltage domains.

[0064] See also Fig. 9 , Fig. 91 is a complete schematic diagram of an electronic device with a separate hard disk storage provided by an embodiment of the present application. Fig. 9 As shown, the electronic device includes a host motherboard 100, a CPU 110, a solid state hard disk, a host memory 130, a power supply module 140, a single board 200, a temperature sensor 220 and a connector 300. The solid state hard disk includes a hard disk controller 120 and a hard disk memory 210, the CPU 110, the hard disk controller 120, the host memory 130 and the power supply module 140 are arranged on the host motherboard 100, the host memory 130 includes DDR, the hard disk memory 210 and the temperature sensor 220 are arranged on the single board 200, the hard disk memory 210 includes a flash memory chip 215, and the host motherboard 100 and the single board 200 are detachably connected through the connector 300.

[0065] In the embodiment of the present application, the electronic device with the separate hard disk storage may be a laptop computer, and the host motherboard may be a host motherboard on the laptop computer. Fig. 9 As shown, the hard disk controller 120 and the hard disk storage 210 are separable, and the hard disk controller 120 and the hard disk storage 210 form a separate storage system. The connector 300 may be a high-speed connector, the hard disk controller 120 is arranged in a direction away from the hard disk storage 210, and the hard disk storage 210 is arranged in a direction away from the hard disk controller 120. The temperature sensor 220 is connected to the CPU 110 on the host motherboard 100 via the connector 300, and the temperature sensor 220 is used to sense the temperature of the hard disk storage 210, and can be controlled by the CPU 110.

[0066] The hard disk controller 120 is directly connected to the CPU 110 via PCB wiring, and PCIe data is transmitted between the hard disk controller 120 and the CPU 110. The host memory 130 on the host motherboard 100 is connected to the CPU 110, and the CPU 110 on the host motherboard 100 is connected to the hard disk storage 210 on the single board 200 via a connector 300.

[0067] The power supply module 140 is connected to the hard disk controller 120, and is connected to the hard disk storage 210 on the single board 200 through the connector 300. The hard disk storage 210 has a first state and a second state. When the hard disk storage 210 is in the first state, the power supply module 140 provides a first voltage to the hard disk storage 210; when the hard disk storage 210 is in the second state, the power supply module 140 provides a second voltage to the hard disk storage 210; wherein the first voltage and the second voltage are different.

[0068] The electronic device with separate hard disk storage provided in the embodiment of the present application includes: a host motherboard, a CPU, a solid state hard disk and a single board; the solid state hard disk includes a hard disk controller and a hard disk memory; wherein the hard disk controller and the hard disk memory are separated; the CPU and the hard disk controller are arranged on the host motherboard, and the hard disk memory is arranged on the single board; the single board and the host motherboard are detachably connected. In this way, by separating the hard disk controller and the hard disk memory, a better heat dissipation effect can be ensured; moreover, by arranging the hard disk controller on the host motherboard of the electronic device with separate hard disk storage, rather than on the single board where the hard disk memory is located, the host motherboard can provide a larger heat dissipation area for the hard disk controller, thereby providing a better heat dissipation effect, solving the problem of poor heat dissipation effect existing in the hard disk storage solution used in the related technology.

[0069] At the same time, it should be understood that the electronic device with separate hard disk storage provided by the embodiment of the present application can have the following beneficial effects: First, the hard disk controller is directly connected to the CPU through PCB routing (PCIe direct connection), without the need to use an additional connector. Since the signal rate of PCIe GEN5 is very high, reaching a base frequency of 16GHz, not using a connector can avoid the attenuation and crosstalk of the PCIe signal on the connector, and also save the cost of high-performance connectors. Second, the power consumption of a large-capacity hard disk storage (NAND chip) is usually higher than that of the hard disk controller. At the same time, the temperature control point of the NAND chip is low, and it is necessary to prioritize the NAND chip from overheating. The related technology usually sets the hard disk controller, NAND chip and power supply module on a single M.2 single board. The embodiment of the present application transfers the hard disk controller and the power supply module from a single M.2 single board to the main board, so that the heat dissipation area of ​​the hard disk controller is greatly improved. At the same time, the distance between the hard disk controller, the NAND chip and the power supply module is also farther, so that the heat source is more dispersed, which can better solve the heat dissipation problem of hard disk storage. Third, in the related art, if the hard disk storage needs to be expanded, the entire solid-state hard disk needs to be replaced. In the embodiment of the present application, the hard disk storage and the hard disk controller are separable, and the expansion of the hard disk storage only requires the replacement of a single board, which reduces the cost of expansion. In addition, NAND chips have strong reusability, and single boards can be recycled and reused, which can save costs and avoid waste. Fourth, the use of a method of separating a single board from a hard disk controller has higher flexibility in RDT testing, and only a single board needs to be RDT tested, without the need for whole machine testing. Fifth, since the life of NAND chips is lower than that of hard disk controllers, the probability of NAND chips having problems is higher, and problems can be effectively located by directly replacing single boards, further shortening the time for after-sales maintenance, making after-sales maintenance more convenient and quick. Therefore, the solution proposed in this application is suitable for products such as laptops that require low heat dissipation and low cost.

[0070] It should be noted that, in this article, the term "comprises", "includes" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0071] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0072] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device with separate hard disk storage, characterized in that: include: Host motherboard, CPU, solid state hard disk and single board; the solid state hard disk includes a hard disk controller and a hard disk memory; Among them, the hard disk controller and the hard disk storage are separated; the CPU and the hard disk controller are arranged on the host motherboard, and the hard disk storage is arranged on the single board; the single board and the host motherboard are detachably connected.

2. The electronic device according to claim 1, characterized in that: The hard disk controller is arranged in a direction away from the hard disk storage, and the hard disk storage is arranged in a direction away from the hard disk controller.

3. The electronic device according to claim 1, characterized in that: The electronic device further comprises: a connector arranged on the host motherboard, and the single board is connected to the host motherboard via the connector.

4. The electronic device according to claim 3, characterized in that: The electronic device further includes: a temperature sensor disposed on the single board; the temperature sensor is connected to the CPU via the connector.

5. The electronic device according to claim 4, characterized in that: The temperature sensor is used to sense the temperature of the hard disk storage.

6. The electronic device according to claim 1, characterized in that: The hard disk controller is directly connected to the CPU via printed circuit board (PCB) wiring.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further comprises: a host memory arranged on the host mainboard, the host memory being connected to the CPU; and the CPU being connected to the hard disk storage.

8. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further comprises: a power supply module arranged on the host mainboard; the power supply module is connected to the hard disk controller and to the hard disk storage.

9. The electronic device according to claim 8, characterized in that: The hard disk storage has a first state and a second state; when the hard disk storage is in the first state, the power supply module provides a first voltage to the hard disk storage; when the hard disk storage is in the second state, the power supply module provides a second voltage to the hard disk storage; wherein the first voltage and the second voltage are different; Wherein, the hard disk storage includes a flash memory chip.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device is a notebook computer.

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