Production process of multi-coil series-parallel integrated inductor

Abstract

The invention relates to the technical field of electronic components, and discloses a multi-coil series-parallel integrated inductor production process which comprises the following steps: S1, coil design and material selection: selecting a material with good conductivity; s2, coil winding and T-core pressing: winding the designed coil on a T-shaped magnetic core, and fixing the coil on the T-shaped magnetic core to form an independent structure; s3, forming mold arrangement and coil arrangement: arranging a plurality of coils in a forming mold according to a preset series or parallel connection mode; s4, coating and hot press molding of the magnetic material: coating the magnetic material in the mold; s5, carrying out a surface treatment and electroplating process: carrying out insulating coating treatment on the surface of the inductor, and carrying out electroplating; and S6, performance detection and quality control. The inductance value and the current bearing capacity are flexibly adjusted in a series-parallel connection mode, the inductor is made to adapt to different application scenes, for example, a high-inductance-value filter and a high-current power management system, and more design choices are provided.

Description

Technical Field

[0001] The invention relates to the technical field of electronic components, and in particular to a production process of a multi-coil series-parallel integrated inductor. Background Art

[0002] With the miniaturization and high performance of electronic devices, the market's performance requirements for inductors are gradually increasing, especially in terms of power density, frequency characteristics, and anti-interference capabilities. In traditional inductor manufacturing processes, the required inductance value is usually achieved by winding a single coil. However, with the increase in the complexity of circuit design, it is difficult for an inductor with a single coil to meet the requirements of high current and high inductance. Therefore, it is often necessary to connect multiple coils in series or in parallel through external wiring to improve the performance of the inductor.

[0003] However, the existing multi-coil series-parallel connection method has some obvious shortcomings. First, the external connection not only increases the complexity of circuit integration, but also easily leads to an increase in the size of the inductor, which is not conducive to the miniaturization design of electronic equipment. Secondly, the reliability of the external connection is low, and it is easy to cause the connection to fail due to vibration, thermal expansion and contraction during long-term use. In addition, the presence of external connections also increases the parasitic resistance and parasitic inductance of the inductor, thereby affecting its overall performance, especially in high-frequency application scenarios. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a production process for a multi-coil series-parallel integrated inductor, which solves the problems of single inductor production structure and limited performance in the prior art.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A multi-coil series-parallel integrated inductor production process, comprising the following steps:

[0006] S1: Coil design and material selection: According to the application requirements of the inductor, select materials with good conductivity, design the inductance value, number of winding turns, wire diameter and arrangement of the coil for a single coil;

[0007] S2: Coil winding and T-core pressing: Use automatic winding equipment to wind the designed coil on the T-core, and use mechanical pressing equipment to fix the coil on the T-core to form an independent structure;

[0008] S3: Forming die layout and coil arrangement: Arrange multiple coils in the forming die according to the preset series or parallel connection mode, and ensure that the electrical connection and spatial layout between the coils meet the design requirements;

[0009] S4: Magnetic material coating and hot pressing: The magnetic material is coated in the mold, and the coil and the magnetic material are integrally formed through a hot pressing process to form an integrally packaged inductor structure;

[0010] S5: Surface treatment and electroplating process: The surface of the inductor is treated with an insulating coating, and electroplating is performed at multiple terminals of the inductor. The electroplating materials include metal layers such as copper, nickel and tin.

[0011] S6: Performance testing and quality control: The key parameters of the formed inductor, including inductance, resistance, Q value, and operating current, are tested to ensure that it meets the design requirements.

[0012] Preferably, the conductive material of the coil is copper or aluminum, and the outer diameter and wire diameter of the coil are selected and designed according to the required current carrying capacity.

[0013] Preferably, the T-shaped magnetic core is made of one or more of the following high magnetic permeability materials:

[0014] a) Ferrite;

[0015] b) nanocrystalline alloys;

[0016] c) Ultra-microcrystalline magnetic core;

[0017] d) Amorphous metal materials.

[0018] Preferably, when the magnetic material is used to cover the coil, one or more of the following materials are preferred:

[0019] a) Soft ferrite materials;

[0020] b) Metal powder magnetic materials;

[0021] c) Sendust aluminum alloy powder.

[0022] Preferably, the temperature and pressure parameters of the hot pressing molding are set according to the characteristics of the selected magnetic material, and the specific parameters are:

[0023] a) The temperature range is 100℃ to 250℃, which is suitable for ferrite materials; 300℃ to 450℃, which is suitable for nanocrystalline alloys or amorphous metal materials;

[0024] b) The pressure range is 1MPa to 10MPa.

[0025] Preferably, the insulating coating material for the surface treatment is one of the following:

[0026] a) Polyimide paint;

[0027] b) Epoxy resin;

[0028] c) Silicone rubber coating.

[0029] Preferably, a vibration resistance test and a heat resistance test are performed after the inductor is formed.

[0030] Preferably, the performance detection of the inductor also includes a long-term durability evaluation through an accelerated aging test to simulate the working condition of the inductor in an extreme environment.

[0031] Preferably, the inductor is further subjected to high temperature adhesive packaging after molding, and the specific steps include:

[0032] Packaging material selection: The high temperature adhesive material is preferably a material with high temperature resistance, chemical corrosion resistance and good mechanical properties, including but not limited to:

[0033] Silicone glue, epoxy resin glue, polyurethane glue;

[0034] Glue packaging process parameter setting:

[0035] Coating method: Use glue injection equipment to evenly coat the high-temperature glue on the outside of the inductor, and the coating thickness is controlled between 0.05mm and 0.3mm;

[0036] Curing temperature and time control: Set the curing temperature and time according to the characteristics of the packaging material. The curing temperature of silicone glue is 100℃ to 150℃, and the curing time is 2 hours to 4 hours; the curing temperature of epoxy resin glue is 80℃ to 120℃, and the curing time is 1 hour to 3 hours; the curing temperature of polyurethane glue is 60℃ to 100℃, and the curing time is 3 hours to 5 hours.

[0037] The present invention provides a production process for a multi-coil series-parallel integrated inductor. It has the following beneficial effects:

[0038] 1. The present invention flexibly adjusts the inductance value and current carrying capacity through series-parallel mode, so that the inductor can adapt to different application scenarios, such as high-inductance filters and high-current power management systems, providing more design options.

[0039] 2. The one-piece molding of the present invention not only improves the mechanical strength of the inductor, enabling it to withstand high vibration and impact, but also realizes electromagnetic shielding through the outer layer of magnetic material, enhances anti-interference ability, and is suitable for applications with high frequency and high stability requirements.

[0040] 3. The present invention does not require external wiring, simplifies the production process, reduces materials and processes, reduces production costs, and improves the long-term reliability of the product. It is particularly suitable for mass production and applications with high stability requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1It is a schematic diagram of a circuit for applying multiple inductors L1, L2, L3 and L4 connected in series according to the present invention;

[0042] Figure 2 A schematic diagram of an application circuit for integrating multiple coils in series into a single inductor L1 of the present invention;

[0043] Figure 3 This is a schematic diagram of a circuit for parallel application of multiple inductors L1, L2, and L3 of the present invention;

[0044] Figure 4 A schematic diagram of an application circuit of the present invention for integrating multiple coils in parallel into a single inductor L1;

[0045] Figure 5 It is a schematic diagram of integrating multiple coils in series into a single inductor of the present invention, the upper left is a formal diagram, the lower left is a top view, and the lower right is a side view;

[0046] Figure 6 It is a schematic diagram of integrating multiple coils in series and parallel into a single inductor of the present invention, the upper left is a formal diagram, the lower left is a top view, and the lower right is a side view;

[0047] Figure 7 It is a schematic diagram of the U-core mold of the present invention;

[0048] Figure 8 This is a schematic diagram of the U-core die punch of the present invention, with the left side being a top view and the right side being a front view;

[0049] Fig. 9 This is a schematic diagram of the U-core mold upper punch of the present invention, with the left side being a top view and the right side being a front view;

[0050] Fig.10 It is a schematic diagram of the middle mold module of the present invention;

[0051] Fig.11 This is a schematic diagram of the punch of the middle die assembly of the present invention, with the left side being a top view and the right side being a front view;

[0052] Fig.12 This is a schematic diagram of the middle mold gasket of the present invention, in which the groove on the B side has a double groove width. DETAILED DESCRIPTION

[0053] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] Please see attached Figure 1 - Attachment Fig.12 The present invention provides a multi-coil series-parallel integrated inductor production process, comprising the following steps:

[0055] S1: Coil design and material selection

[0056] Choice of conductive material:

[0057] Copper: Copper is a material with excellent conductivity and low resistivity (approximately 1.68×10^-8Ω·m). It can carry large currents and has good thermal conductivity, making it suitable for high current and high frequency application scenarios.

[0058] Aluminum: The resistivity of aluminum is slightly higher than that of copper (about 2.82×10^-8Ω·m), but its density is lower than that of copper, about 1 / 3 of that of copper, and is suitable for applications requiring lighter weight. The application of aluminum materials can effectively reduce the overall weight of the inductor, especially in aerospace or portable devices.

[0059] Electrical design of the coil:

[0060] Inductance: Depending on the application requirements, the designed inductance determines the number of turns and wire diameter of the coil. For example, for high-frequency applications, a lower inductance value is usually required, while for filtering applications, a higher inductance value is required.

[0061] Number of winding turns: The number of turns directly determines the inductance value. The more turns, the greater the inductance value. However, an increase in the number of turns will also increase the resistance of the coil, so it is necessary to balance the relationship between the number of turns and resistance.

[0062] Wire diameter: The choice of wire diameter is primarily determined by the required current carrying capacity. Larger currents require thicker wires, while high-frequency applications typically use thinner wires to reduce the skin effect (the phenomenon whereby current flows on the surface of the wire).

[0063] Coil arrangement:

[0064] Series arrangement: Multiple coils connected in series can effectively increase the total inductance, but the series coils will increase the overall resistance. It is suitable for applications that require higher inductance, such as filters.

[0065] Parallel arrangement: Multiple coils in parallel can increase current carrying capacity and reduce total resistance, making them suitable for high current applications such as power management systems.

[0066] S2: Coil winding and T-core pressing

[0067] Automatic winding equipment: Automatic winding equipment can ensure the winding accuracy of the coil, keep the tension between turns uniform, avoid the spacing between coils being too large or too small, and thus ensure the stability of the inductance value.

[0068] T-type core material selection:

[0069] Ferrite: Ferrite has high resistivity and low loss, and is suitable for high-frequency circuits, especially in the MHz range. Its disadvantage is that the saturation magnetic induction intensity is low, which makes it suitable for low-power applications.

[0070] Nanocrystalline alloy: This material has a higher saturation magnetic induction intensity (usually higher than ferrite) and has lower losses, and is suitable for high power density applications, such as switching power supplies. Its disadvantage is that it is more expensive.

[0071] Ultra-microcrystalline cores: This material combines the low loss of ferrites with the high permeability of nanocrystalline alloys, making it suitable for medium-frequency applications such as smart grid equipment and new energy vehicle chargers.

[0072] Amorphous metal materials: This material is known for its high magnetic permeability and low losses, making it particularly suitable for high-efficiency power conversion applications such as transformers and power inductors.

[0073] S3: Forming die layout and coil arrangement

[0074] Molding mold design: The design of the mold requires precise slot design according to the arrangement of the coils to ensure the stability of the position of each coil in the mold to prevent position deviation during the subsequent hot pressing process.

[0075] Series arrangement: When multiple coils are arranged in series, it is necessary to ensure that the electrical connection of each coil is stable to prevent the electrical performance at the connection point from degrading.

[0076] Parallel arrangement: When connecting in parallel, you need to consider the current distribution of each coil and ensure that the resistance of each parallel coil is equal so that the current is evenly distributed.

[0077] S4: Magnetic material coating and hot pressing

[0078] Selection of magnetic materials:

[0079] Soft ferrite materials: suitable for high-frequency applications, with high resistivity and low hysteresis loss, commonly used in power transformers and filters. The disadvantage of this type of material is that the operating frequency limit is high, suitable for applications below 1MHz.

[0080] Metal powder magnetic material: This material has high magnetic permeability and low loss, suitable for high power density applications, commonly used in inductors and transformers. Metal powder materials are usually more expensive and are mainly used in situations where high performance is required.

[0081] Iron-silicon-aluminum alloy powder: It has low loss and good high-frequency stability. It is suitable for occasions requiring high efficiency such as switching power supplies. The operating frequency is usually between 10kHz and 500kHz.

[0082] Hot pressing process parameters:

[0083] Temperature setting: For ferrite materials, the hot pressing temperature usually ranges from 100℃ to 250℃ to prevent the magnetic material from being damaged due to excessive temperature; for nanocrystalline alloys or amorphous metal materials, the hot pressing temperature can be set to 300℃ to 450℃ to ensure full bonding of the materials.

[0084] Pressure setting: During hot pressing, a pressure of 1MPa to 10MPa needs to be applied to ensure a tight bond between the magnetic material and the coil. Too low a pressure will result in loose bonding of the materials and affect the performance of the inductor, while too high a pressure may damage the coil.

[0085] S5: Surface treatment and electroplating process

[0086] Insulation coating material selection:

[0087] Polyimide (PI) paint: It has high temperature resistance, radiation resistance and excellent insulation performance, and is suitable for inductors in high temperature environments with a temperature range of -100℃ to 300℃.

[0088] Epoxy resin: Commonly used in electrical equipment in industrial environments, it has strong mechanical properties and chemical corrosion resistance, and is suitable for working in the range of room temperature to -40℃ to 200℃.

[0089] Silicone rubber coating: It has high flexibility and moisture resistance, especially suitable for working in environments that require waterproofing or shock resistance, with a temperature range of -60℃ to 250℃.

[0090] Electroplating process: Copper, nickel and tin are electroplated at the terminals. Copper is used to improve conductivity, nickel is used for corrosion protection, and tin can enhance welding performance.

[0091] S6: Performance testing and quality control

[0092] Electrical performance test: Test the inductance, resistance, Q value and operating current to ensure that the electrical performance of the inductor meets the design requirements. It should be noted that the greater the operating current, the smaller the resistance and the higher the Q value.

[0093] Environmental adaptability test:

[0094] Vibration resistance test: Vibration test is used to test whether the inductor maintains stable electrical performance under vibration environment.

[0095] Heat resistance test: The inductor needs to work for a long time under high temperature conditions to test the changes in its electrical performance at different temperatures.

[0096] Aging test: Through accelerated aging experiments, the long-term use of inductors in extreme environments is simulated to ensure the long-term stability of the inductors.

[0097] High temperature glue packaging treatment

[0098] Selection of packaging materials:

[0099] Silicone adhesive: The temperature resistance range is -60℃ to 300℃, it has excellent flexibility and insulation properties, and is suitable for high temperature and high humidity environments.

[0100] Epoxy resin glue: The temperature range is -40℃ to 200℃, with excellent impact resistance and chemical corrosion resistance.

[0101] Polyurethane glue: suitable for humid and vibrating environments, temperature resistance range is -40℃ to 150℃, with good mechanical properties and chemical resistance.

[0102] Glue packaging process parameter setting:

[0103] Coating method: Use glue injection equipment to evenly apply the high-temperature glue, ensuring that the coating thickness is 0.05mm to 0.3mm, ensuring that the packaged inductor has good mechanical and environmental protection.

[0104] Curing temperature and time: Set the curing temperature and time according to the selected packaging material to ensure that the packaging material is tightly bonded to the inductor and has high temperature and moisture resistance.

[0105] The following is an introduction in conjunction with specific embodiments:

[0106] Embodiment 1: Production process of multi-coil series integrated inductor

[0107] Coil Design and Material Selection

[0108] Application requirements: This inductor is designed for power management systems, which require higher inductance values ​​and larger current carrying capacity.

[0109] Selection of conductive material: Copper wire with a diameter of 1.5 mm was selected as the conductive material. Copper wire has good conductivity and large current carrying capacity.

[0110] Inductor design: The inductance of each coil is designed to be 10μH, and the number of turns is 100. According to the requirements of the circuit, 4 such coils are selected to be connected in series to achieve a total inductance of 40μH.

[0111] Coil arrangement: Since it is a series application, the coils are arranged in a straight line to ensure good electrical connection between each coil.

[0112] Coil Winding and T-core Pressing

[0113] Using automatic winding equipment, each coil is wound on a T-shaped ferrite core according to the designed number of turns. The T-shaped core is made of high permeability ferrite material with high magnetic flux density, which is suitable for the power supply system to work in the operating frequency range of 50kHz.

[0114] Each wound coil is combined with a T-core magnetic core, and the coil is fixed to the magnetic core through a pressing device to form an independent inductor unit.

[0115] Forming die layout and coil arrangement

[0116] A mold was designed to arrange the four wound coils in series inside the mold, and ensure the electrical connection between the coils is stable. Each coil is connected in series through a copper wire with a diameter of 1.5mm to ensure sufficient current carrying capacity.

[0117] Magnetic material coating and hot pressing

[0118] Soft ferrite material is selected to cover the entire coil structure to ensure that the inductor has reduced magnetic losses when working at high frequencies.

[0119] Hot pressing parameters: Place the mold coated with magnetic material in the hot pressing equipment for hot pressing. Set the hot pressing temperature to 150℃ and the pressure to 2.5MPa. Set the hot pressing time to 3 hours to ensure that the magnetic material and the coil structure are tightly combined to form an integrated inductor.

[0120] Surface treatment and electroplating process

[0121] The surface of the inductor is evenly coated with a layer of polyimide insulating varnish with a thickness of 0.15mm to ensure that it maintains good insulation performance in high temperature and high voltage working environment.

[0122] The terminal area of ​​the inductor is plated with multiple layers of copper, nickel, and tin. The copper layer is used for conductivity, the nickel layer is used for corrosion protection, and the tin layer is used to improve solderability.

[0123] Performance testing and quality control

[0124] Inductance value: Using an LCR tester to test, the total inductance value is 40μH, which meets the design requirements.

[0125] Resistance value: Detected by a DC resistance tester, the total DC resistance is 0.15Ω, which meets the low resistance standard required by the design.

[0126] Q value: tested at 50kHz frequency, the Q value is 120, which meets the requirements of high-frequency applications.

[0127] Operating Current: The inductor is capable of carrying currents up to 10A, ensuring reliable operation in the power system.

[0128] Vibration and heat resistance tests

[0129] Vibration resistance test: The inductor is placed on a vibration test bench for a vibration test, with the vibration frequency set at 20Hz to 2000Hz, and the vibration lasts for 2 hours. The electrical performance of the inductor does not change after the test, indicating that the inductor has good vibration resistance.

[0130] Heat resistance test: The inductor was placed in an environment with a temperature of 150°C and operated continuously for 100 hours. The electrical performance of the inductor was stable, indicating that it has good heat resistance.

[0131] Aging test

[0132] In a high temperature (120°C) and high humidity (95%) environment, after 500 hours of aging testing, the change rate of the inductance and Q value of the inductor was less than 3%, indicating its long-term reliability in extreme environments.

[0133] High temperature glue packaging treatment

[0134] Packaging material selection: Silicone adhesive is selected as the high-temperature packaging material. Silicone adhesive has high temperature resistance, corrosion resistance and excellent flexibility, ensuring that the inductor can maintain structural integrity under high temperature working conditions.

[0135] Coating method: Use fully automatic roller spray equipment to evenly coat the silicone adhesive on the outside of the inductor with a coating thickness of 0.2mm to ensure that all parts of the inductor are evenly protected.

[0136] Curing temperature and time control: Place the inductor in a curing oven, set the curing temperature to 120°C, and the curing time to 3 hours to ensure that the encapsulation layer is tightly bonded to the inductor to form a solid protective layer.

[0137] Example 2: Production process of multi-coil parallel integrated inductor

[0138] Coil Design and Material Selection

[0139] Application requirements: This inductor is designed for high current applications such as industrial power supply equipment, which require larger current carrying capacity and lower inductance value.

[0140] Conductive material selection: Aluminum wire with a diameter of 2mm was selected. The aluminum wire reduces the overall weight of the inductor while having sufficient current carrying capacity.

[0141] Inductor design: The inductance of each coil is designed to be 2μH, the number of winding turns is 50, and three such coils are designed to be connected in parallel to achieve an increase in the total current carrying capacity.

[0142] Coil arrangement: Since it is a parallel application, the three coils are arranged in parallel to ensure that the current is evenly distributed between each coil.

[0143] Coil Winding and T-core Pressing

[0144] Each coil is wound on a T-shaped nanocrystalline alloy core using an automatic winding device. The nanocrystalline alloy core has a high saturation magnetic induction intensity and is suitable for high power and high current applications.

[0145] Forming die layout and coil arrangement

[0146] A mold was designed to arrange the three wound coils in parallel and connect them in parallel through aluminum wires with a diameter of 2.5 mm to carry a larger current.

[0147] Magnetic material coating and hot pressing

[0148] The entire coil structure is coated with metal powder magnetic material. Metal powder has high magnetic permeability and low loss, which is suitable for high current applications.

[0149] Hot pressing parameters: The hot pressing temperature was set to 350°C, the pressure was 6MPa, and the time was 4 hours to ensure that the metal powder was tightly combined with the coil.

[0150] Surface treatment and electroplating process

[0151] The surface treatment adopts epoxy resin coating with a coating thickness of 0.1mm. Epoxy resin can maintain good mechanical strength and insulation properties in a wide temperature range.

[0152] The terminal area is plated with multiple layers of copper, nickel and tin to ensure high electrical conductivity and corrosion resistance at the terminals.

[0153] Performance testing and quality control

[0154] Inductance value: The inductance value after parallel connection is 0.67μH, which meets the design requirements.

[0155] Resistor Value: Total DC resistance is 0.05Ω, ensuring low resistance for high current applications.

[0156] Working current: The inductor can carry a current of 30A, meeting the needs of high current occasions.

[0157] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A production process for a multi-coil series-parallel integrated inductor, characterized in that: The following steps are involved: S1: Coil design and material selection: According to the application requirements of the inductor, select materials with good conductivity, design the inductance value, number of winding turns, wire diameter and arrangement of the coil for a single coil; S2: Coil winding and T-core pressing: Use automatic winding equipment to wind the designed coil on the T-core, and use mechanical pressing equipment to fix the coil on the T-core to form an independent structure; S3: Forming die layout and coil arrangement: Arrange multiple coils in the forming die according to the preset series or parallel connection mode, and ensure that the electrical connection and spatial layout between the coils meet the design requirements; S4: Magnetic material coating and hot pressing: The magnetic material is coated in the mold, and the coil and the magnetic material are integrally formed through a hot pressing process to form an integrally packaged inductor structure; S5: Surface treatment and electroplating process: The surface of the inductor is treated with an insulating coating, and electroplating is performed at multiple terminals of the inductor. The electroplating materials include metal layers such as copper, nickel and tin. S6: Performance testing and quality control: The key parameters of the formed inductor, including inductance, resistance, Q value, and operating current, are tested to ensure that it meets the design requirements.

2. The multi-coil series-parallel integrated inductor production process according to claim 1, characterized in that: The conductive material of the coil is copper or aluminum, and the outer diameter and wire diameter of the coil are selected and designed according to the required current carrying capacity.

3. The production process of a multi-coil series-parallel integrated inductor according to claim 1, characterized in that: The T-shaped magnetic core is made of one or more of the following high magnetic permeability materials: a) Ferrite; b) nanocrystalline alloys; c) Ultra-microcrystalline magnetic core; d) Amorphous metal materials.

4. The multi-coil series-parallel integrated inductor production process according to claim 1, characterized in that: When the magnetic material is used to cover the coil, one or more of the following materials are preferred: a) Soft ferrite materials; b) Metal powder magnetic materials; c) Sendust aluminum alloy powder.

5. The multi-coil series-parallel integrated inductor production process according to claim 1, characterized in that: The temperature and pressure parameters of the hot pressing molding are set according to the characteristics of the selected magnetic material, and the specific parameters are: a) The temperature range is 100℃ to 250℃, which is suitable for ferrite materials; 300℃ to 450℃, which is suitable for nanocrystalline alloys or amorphous metal materials; b) The pressure range is 1MPa to 10MPa.

6. The production process of a multi-coil series-parallel integrated inductor according to claim 1, characterized in that: The insulating coating material of the surface treatment is one of the following: a) Polyimide paint; b) Epoxy resin; c) Silicone rubber coating.

7. The production process of a multi-coil series-parallel integrated inductor according to claim 1, characterized in that: Vibration resistance test and heat resistance test are performed after the inductor is molded.

8. The production process of a multi-coil series-parallel integrated inductor according to claim 1, characterized in that: The performance testing of the inductor also includes long-term durability evaluation through accelerated aging testing to simulate the working conditions of the inductor in extreme environments.

9. The multi-coil series-parallel integrated inductor production process according to claim 1, characterized in that: After the inductor is formed, it is further subjected to high temperature glue packaging treatment, and the specific steps include: Packaging material selection: The high temperature adhesive material is preferably a material with high temperature resistance, chemical corrosion resistance and good mechanical properties, including but not limited to: Silicone glue, epoxy resin glue, polyurethane glue; Glue packaging process parameter setting: Coating method: Use glue injection equipment to evenly coat the high-temperature glue on the outside of the inductor, and the coating thickness is controlled between 0.05mm and 0.3mm; Curing temperature and time control: Set the curing temperature and time according to the characteristics of the packaging material. The curing temperature of silicone glue is 100℃ to 150℃, and the curing time is 2 hours to 4 hours; the curing temperature of epoxy resin glue is 80℃ to 120℃, and the curing time is 1 hour to 3 hours; the curing temperature of polyurethane glue is 60℃ to 100℃, and the curing time is 3 hours to 5 hours.

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