Wafer chamfer surface inspection equipment

Abstract

The invention relates to the technical field of wafer processing quality inspection, and discloses wafer chamfering surface inspection equipment, which comprises a base and a support column vertically arranged on the base, and is characterized in that one end, far away from the base, of the support column is rotatably connected with an observation mirror through a rotating shaft, and the observation mirror can rotate relative to the support column along a plane perpendicular to the base; the rotating shaft is connected with an angle gauge, and the angle gauge is used for measuring and displaying the inclination angle of the observation mirror. Through the arrangement of the observation mirror capable of rotating along the plane perpendicular to the base and the angle gauge used for measuring and displaying the rotation angle of the observation mirror, accurate adjustment of the specific angle of the observation mirror can be realized according to the inclination angle of the wafer chamfering surface, the time of the debugging process is rapidly, conveniently and effectively reduced, the inspection efficiency of the wafer chamfering surface is improved, and the production efficiency is improved. The consistency of wafer chamfer surface inspection is improved, and the stability of inspection quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer quality inspection, and in particular to a wafer chamfer surface inspection device. Background Art

[0002] Wafer chamfering is a key technology in the semiconductor manufacturing process. It rounds the sharp corners of the wafer edge through mechanical grinding or chemical etching to form an arc with a certain radius. Wafer chamfering can change the shape and structure of the wafer edge, effectively alleviate the residual stress generated in the chip manufacturing process, reduce the risk of performance degradation and chip failure, thereby improving the reliability and stability of the chip, reducing the edge collapse, cracks and other undesirable conditions during the manufacturing, packaging and testing process, and improving the mechanical strength of the wafer. By precisely controlling the angle and edge shape of the chamfer, the electric field distribution inside the chip can be changed, thereby affecting the current characteristics and power consumption, improving the electrical performance of the chip, reducing round edge damage, reducing the scrap rate in the production process, and improving the yield rate of the chip.

[0003] When the edge of the wafer is chamfered, there are many factors that affect the quality of the wafer chamfer. The accuracy of the chamfering equipment itself, such as spindle accuracy, Y-axis end jump, grinding wheel quality, etc., and some processing parameters will also have a great impact on the edge of the wafer, such as cutting amount, contact speed, grinding wheel speed, suction cup speed, etc. These process parameters affect the wafer edge chamfering process in different ways. The edge collapse and roughness after the wafer edge is an important parameter to measure the possible damage of the wafer in the subsequent process. It largely determines whether the ground wafer can be used in the subsequent process. Therefore, it is necessary to inspect and confirm the quality of the wafer chamfer by using inspection and observation equipment.

[0004] The chamfered surface of the wafer is an inclined surface. In the prior art, a microscope is often used to observe the chamfered surface. However, due to the limitations of the microscope, the eyepiece cannot conveniently observe the chamfered surface vertically, and the quality of the chamfered surface cannot be accurately determined, resulting in unstable inspection quality. Summary of the invention

[0005] The object of the present invention is to provide a wafer chamfer surface inspection device, which can adjust the observation mirror to a specific angle, has a simple structure, is easy to use, and can vertically observe the chamfer surface, thereby increasing the stability of the chamfer surface inspection quality.

[0006] In order to solve the above technical problems, the embodiments of the present invention provide a technical solution as follows:

[0007] A wafer chamfer surface inspection device comprises a base and a pillar vertically arranged on the base, wherein an end of the pillar away from the base is rotatably connected to an observation mirror via a rotating shaft, and the observation mirror can rotate relative to the pillar along a plane perpendicular to the base; an inclinometer is connected to the rotating shaft, and the inclinometer is used to measure and display the inclination angle of the observation mirror.

[0008] Furthermore, the rotation range of the observation mirror relative to the support pillar is 0°-90°.

[0009] Furthermore, it comprises a loading platform, the top of which is provided with a loading surface, the loading surface is provided with a shading plate, the shading plate is an open arc-shaped structure, and the shading plate is extended around the edge of the loading surface.

[0010] Furthermore, the loading platform is provided with a left-right moving mechanism and an up-down adjusting mechanism.

[0011] Furthermore, a supplementary light source is provided at one end of the observation mirror facing the base.

[0012] In order to solve the above technical problems, an embodiment of the present invention provides another wafer chamfer surface inspection device, including a base and a pillar vertically arranged on the base, wherein the pillar has a support rod extending horizontally at one end away from the base, and the support rod is rotatably connected to an observation mirror via a rotating shaft, and the observation mirror can rotate relative to the support rod along a plane perpendicular to the base; the rotating shaft is connected to an inclinometer, and the inclinometer is used to measure and display the inclination angle of the observation mirror.

[0013] Furthermore, the pillar is provided with an up and down telescopic adjustment mechanism, and the support rod is provided with a horizontal telescopic adjustment mechanism.

[0014] Furthermore, it includes a loading platform which is separately arranged from the base, a loading surface is arranged on the top of the loading platform, and the height of the loading surface can be adjusted vertically up and down.

[0015] Furthermore, a shading plate is provided on the loading surface, and the shading plate is an open arc-shaped structure, and the shading plate is extended around the edge of the loading surface.

[0016] Furthermore, a supplementary light source is provided at one end of the observation mirror facing the base.

[0017] Compared with the prior art, the wafer chamfer surface inspection equipment provided by the present invention can realize precise adjustment of the specific angle of the observation mirror according to the inclination angle of the wafer chamfer surface through the arrangement of an observation mirror that can rotate along a plane perpendicular to the base and an incline meter for measuring and displaying the rotation angle of the observation mirror. It is fast and convenient, effectively reduces the time of the debugging process, improves the inspection efficiency of the wafer chamfer surface, increases the consistency of the wafer chamfer surface inspection, and improves the stability of the inspection quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 is an overall schematic diagram of a wafer chamfer surface inspection device in one embodiment of the present invention;

[0020] Figure 2 is an overall schematic diagram of a wafer chamfer surface inspection device in another embodiment of the present invention;

[0021] Figure 3 is a schematic diagram of the rotation trajectory of the observation mirror in one embodiment of the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of the sample carrier in one embodiment of the present invention.

[0023] Explanation of the reference numerals: 1. base; 2. pillar; 3. support rod; 4. observation mirror; 40. supplementary light source; 41. first position; 42. second position; 5. stage; 51. shading plate; 52. main body; 53. loading surface; 6. wafer; 61. chamfered surface; 7. inclinometer; 8. rotating shaft. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the present invention clearer, the following will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the various embodiments of the present invention, many technical details are provided in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed for protection in the claims of the present application can be implemented.

[0025] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0026] like Figure 1As shown. In one embodiment of the present invention, it relates to a wafer 6 chamfer surface 61 inspection device, including a base 1 and a pillar 2 vertically arranged on the base 1, the pillar 2 is rotatably connected to an observation mirror 4 at one end away from the base 1 through a rotating shaft 8, and the observation mirror 4 can rotate relative to the pillar 2 along a plane perpendicular to the base 1; the rotating shaft 8 is connected with an inclinometer 7, and the inclinometer 7 is used to measure and display the inclination angle of the observation mirror 4. The inclinometer 7 is arranged at one end of the rotating shaft 8 and is arranged on the outside of the observation mirror 4 to facilitate the reading of the rotation angle of the observation mirror 4; the other side of the observation mirror 4 relative to the inclinometer 7 is connected with an angle adjustment mechanism (not shown in the drawings), and the angle adjustment mechanism can drive the observation mirror 4 to rotate around the rotating shaft 8, and the rotatable angle range is 0°-90°. The angle adjustment structure can be implemented in various ways such as gear meshing in the prior art, which will not be repeated here.

[0027] like Figure 3 As shown, when the observation mirror 4 is perpendicular to the base 1, it is in the first position 41, at which the rotation angle of the observation mirror 4 is 0°, and when the observation mirror 4 is horizontal to the base 1, it is in the second position 42, at which the rotation angle of the observation mirror 4 is 90°. The observation mirror 4 can be rotated to any position between the first position 41 and the second position 42, so as to adapt to different inclined surfaces and keep the observation mirror 4 perpendicular to the inclined surface to be observed.

[0028] like Figure 2-4 As shown, in one embodiment, it involves a device for inspecting the chamfered surface 61 of a wafer 6, comprising a stage 5, the stage 5 comprising a main body 52, a loading surface 53 being provided at the top of the main body 52, a supplementary light source 40 being provided at one end of the observation mirror 4 facing the loading surface 53, preferably, the supplementary light source 40 is arranged in a ring on the inner side of the end of the observation mirror 4; a shading plate 51 is provided on the loading surface 53, the shading plate 51 is an open arc structure, the shading plate 51 is extended around the edge of the loading surface 53, preferably, the shading plate 51 is extended vertically along the edge of the loading surface 53; by the arrangement of the shading plate 51, the interference of external light sources on the observation effect of the observation mirror 4 can be effectively reduced, and the influence of the reflection of external light sources on the chamfered surface 61 of the wafer 6 on the observation result can be reduced; by the arrangement of the supplementary light source 40, the uniformity of the light source on the chamfered surface 61 of the wafer 6 can be effectively increased, and the clarity of the observation effect of the observation mirror 4 can be increased.

[0029] In one embodiment, the loading platform 5 is provided with a left-right movement and an up-and-down adjustment mechanism. The left-right movement mechanism can be implemented by the sliding cooperation of the slide rail and the slider in the prior art, or by the threaded cooperation of the lead screw and the nut. The up-and-down adjustment mechanism of the loading platform 5 can be implemented in a variety of ways such as threaded adjustment and gear meshing commonly used in the prior art.

[0030] like Figure 2 As shown, in one implementation, it relates to a wafer 6 chamfer surface 61 inspection device, including a base 1 and a support 2 vertically arranged on the base 1, wherein the support 2 is horizontally extended at one end away from the base 1 and provided with a support rod 3, wherein the support rod 3 is rotatably connected to an observation mirror 4 via a rotating shaft 8, and the observation mirror 4 can rotate relative to the support rod 3 along a plane perpendicular to the base 1; the rotating shaft 8 is connected to an inclinometer 7, and the inclinometer 7 is used to measure and display the inclination angle of the observation mirror 4. The inclinometer 7 is arranged at one end of the rotating shaft 8 and is arranged outside the observation mirror 4 to facilitate the reading of the rotation angle of the observation mirror 4; the observation mirror 4 is connected to an angle adjustment structure (not shown in the drawings) on the other side of the inclinometer 7, and the angle adjustment structure can drive the observation mirror 4 to rotate around the rotating shaft 8, and the rotatable angle range is 0°-90°. The angle adjustment structure can be implemented in various ways such as gear meshing in the prior art, which will not be repeated here.

[0031] In one embodiment, a device for inspecting the chamfered surface 61 of a wafer 6 is provided, comprising a base 1 and a pillar 2 arranged perpendicular to the base 1, wherein the pillar 2 is provided with an up and down telescopic adjustment mechanism (not shown in the drawings), and an end of the pillar 2 away from the base 1 is provided with a horizontally extending support rod 3, wherein the support rod 3 is provided with a horizontal telescopic adjustment mechanism (not shown in the drawings); the up and down telescopic adjustment mechanism and the horizontal telescopic adjustment mechanism can be realized by meshing transmission or threaded transmission in the prior art.

[0032] In one embodiment, a device for inspecting the chamfered surface 61 of a wafer 6 is provided, wherein the stage 5 is separately arranged from the base 1, and a loading surface 53 is provided on the top of the stage 5, and a user can hold the stage 5 and move the stage 5 at any angle in the horizontal direction; preferably, the stage 5 is also provided with an up and down vertical adjustment mechanism to adjust the height of the loading surface 53, and the up and down vertical adjustment mechanism can be implemented by meshing transmission or threaded transmission in the prior art.

[0033] In an exemplary embodiment, a device for inspecting the chamfered surface 61 of a wafer 6 is provided, wherein a light shielding plate 51 is provided on the object-carrying surface 53, wherein the light shielding plate 51 is an open arc-shaped structure, and the light shielding plate 51 is extended around the edge of the object-carrying surface 53, and the light shielding plate 51 is extended around the edge of the object-carrying surface 53, which can effectively reduce the interference of the external light source on the observation effect of the observation mirror 4, and avoid the external light source from reflecting on the chamfered surface 61 of the wafer 6. Preferably, a supplementary light source 40 is provided at one end of the observation mirror 4 facing the base 1, which can effectively increase the uniformity of the light source on the chamfered surface 61 of the wafer 6, and increase the clarity of the observation effect of the observation mirror 4.

[0034] When observing the quality of the chamfer of the wafer 6, the degree of edge collapse is generally measured by using an inspection and observation device to inspect the size of the irregular bright spots formed after the edge of the wafer is ground, and the roughness is inspected by the optical probe on the observation mirror 4. During the observation, it is necessary to ensure that the observation mirror 4 is perpendicular to the chamfered surface 61 as much as possible. When using the inspection device for the chamfered surface 61 of the wafer 6 provided by the present invention, first, according to the process specification, the inclination of the chamfered surface 61 of the wafer 6 is confirmed, and then, in combination with the inclinometer 7, the observation mirror 4 is rotated to the corresponding rotation angle so that the observation mirror 4 can be perpendicular to the chamfered surface 61. Finally, the relative position between the observation mirror 4 and the stage 5 is adjusted to present a clear observation field of view for inspection and recording.

[0035] The wafer chamfer surface inspection equipment provided by the present invention can realize precise adjustment of the specific angle of the observation mirror according to the inclination angle of the wafer chamfer surface through the arrangement of an observation mirror that can rotate along a plane perpendicular to the base and an incline meter for measuring and displaying the rotation angle of the observation mirror. This is fast and convenient, effectively reduces the time of the debugging process, improves the inspection efficiency of the wafer chamfer surface, increases the consistency of the wafer chamfer surface inspection, and improves the stability of the inspection quality.

[0036] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present invention, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A wafer chamfer surface inspection device, characterized in that: The invention comprises a base (1) and a support (2) vertically arranged on the base (1); an end of the support (2) away from the base (1) is rotatably connected to an observation mirror (4) via a rotating shaft (8); the observation mirror (4) can rotate relative to the support (2) along a plane perpendicular to the base (1); and an inclinometer (7) is connected to the rotating shaft (8); the inclinometer (7) is used to measure and display the inclination angle of the observation mirror (4).

2. The wafer chamfer surface inspection equipment according to claim 1, characterized in that: The rotation range of the observation mirror (4) relative to the support (2) is 0°-90°.

3. The wafer chamfer surface inspection equipment according to claim 1, characterized in that: It comprises a loading platform (5), the top of which is provided with a loading surface (53), the loading surface (53) is provided with a shading plate (51), the shading plate (51) is an open arc-shaped structure, and the shading plate (51) is extended around the edge of the loading surface (53).

4. The wafer chamfer surface inspection equipment according to claim 3, characterized in that: The loading platform (5) is provided with a left-right moving mechanism and an up-down adjusting mechanism.

5. The wafer chamfer surface inspection device according to any one of claims 1 to 4, characterized in that: A supplementary light source (40) is provided at one end of the observation mirror (4) facing the base (1).

6. A wafer chamfer surface inspection device, characterized in that: The invention comprises a base (1) and a support (2) vertically arranged on the base (1); a support rod (3) is horizontally extended from one end of the support rod (2) away from the base (1); the support rod (3) is rotatably connected to an observation mirror (4) via a rotating shaft (8); the observation mirror (4) can rotate relative to the support rod (3) along a plane perpendicular to the base (1); and an inclinometer (7) is connected to the rotating shaft (8); the inclinometer (7) is used to measure and display the inclination angle of the observation mirror (4).

7. The wafer chamfer surface inspection equipment according to claim 6, characterized in that: The support column (2) is provided with an up-and-down telescopic adjustment mechanism, and the support rod (3) is provided with a horizontal telescopic adjustment mechanism.

8. The wafer chamfer surface inspection equipment according to claim 6, characterized in that: It comprises a loading platform (5) which is arranged separately from the base (1); a loading surface (53) is arranged at the top of the loading platform (5); and the loading platform (5) can adjust the height of the loading surface (53) vertically up and down.

9. The wafer chamfer surface inspection equipment according to claim 8, characterized in that: A shading plate (51) is provided on the object loading surface (53); the shading plate (51) is an open arc-shaped structure; the shading plate (51) is extended around the edge of the object loading surface (53).

10. The wafer chamfer surface inspection device according to any one of claims 6 to 9, characterized in that: A supplementary light source (40) is provided at one end of the observation mirror (4) facing the base (1).

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