Transistor assembly, inverter assembly and vehicle
By designing the segmented hole structures of the first and second sections on the substrate, a gap is formed to extend the arc extension distance, the problem of short circuit of the transistor assembly in high humidity environment is solved, and the normal operation of the assembly is ensured.
Patent Information
- Application Number
- CN202310802524.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-30
- Publication Date
- 2024-12-31
AI Technical Summary
In high humidity environments, transistor components are prone to creepage, causing water-grained arcs to be generated by charged metal sheets to extend along the surface of the substrate, which may cause short circuits and damage to the transistor components.
A first hole on the substrate for contacting the connecting member is designed, including the first section and the second section, and a gap is formed between the inner peripheral surface of the first section and the connecting member to extend the extension distance of the arc and reduce the Short circuit caused by creepage phenomenon.
It effectively reduces the creepage phenomenon, extends the extension distance of the arc, reduces the frequency of short circuits of transistor components, and ensures the normal use of transistor components.
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Figure CN119230531A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of vehicle technology, and in particular to a transistor component, an inverter assembly and a vehicle. Background Art
[0002] Transistor assemblies are used in various locations in vehicles, such as inverter assemblies, etc. The transistor assembly mainly includes a plurality of transistors and a substrate, and each transistor is mounted on the substrate by bolts penetrating the transistors.
[0003] Since there is a charged metal sheet on the side where the transistor is connected to the substrate, although there is insulation protection between the bolt and the transistor, creepage may occur when the substrate performance deteriorates or the humidity in the application environment is high. This will cause the charged metal sheet to generate a water-ripple-like arc that extends along the surface of the substrate and even reaches the bolt, causing short circuit damage to the transistor component. Summary of the invention
[0004] The embodiments of the present application provide a transistor component, an inverter assembly and a vehicle, which can effectively reduce creepage and ensure the normal use of the transistor component.
[0005] An embodiment of the present application provides a transistor component, wherein the transistor component includes:
[0006] Multiple transistors;
[0007] A substrate, wherein a plurality of first holes are provided on the substrate, each of the transistors is connected to one of the first holes via a connecting member, and the connecting member is insulated from the transistor;
[0008] Along the direction from the transistor to the substrate, the first hole includes a first section and a second section that are connected, the connecting member passes through the first section and is connected to the second section, the inner diameter of the first section is larger than the inner diameter of the second section, and there is a gap between the inner circumference of the first section and the connecting member.
[0009] The transistor component as described above, wherein the first section is a tapered hole section, and the inner diameter of the first section gradually decreases along the direction from the transistor to the substrate; and the second section is a straight hole section.
[0010] In the transistor component as described above, the first section and the second section are both straight hole sections, and a step surface facing the transistor is formed between the first section and the second section.
[0011] In the transistor assembly as described above, a second hole is opened on the transistor, the connecting member passes through the second hole, and the connecting member is insulated from the hole wall of the second hole.
[0012] The transistor assembly as described above, wherein an insulating thermal pad is provided between each transistor and the substrate, a plurality of third holes are provided on the insulating thermal pad, each of the third holes is connected to a corresponding first hole, the connecting member passes through the third hole, and the connecting member and the third hole are insulated.
[0013] In the transistor assembly as described above, the connecting member comprises a connecting bolt and an insulating sleeve, the insulating sleeve is sleeved on a screw rod of the connecting bolt, and the insulating sleeve passes through the second hole and the third hole.
[0014] The transistor assembly as described above, wherein a heat dissipation component is provided on the side of the substrate facing away from the transistor, the heat dissipation component forms a mounting plane, and the substrate is mounted on the mounting plane; a cooling channel is provided inside the heat dissipation component, and along a direction perpendicular to the substrate, the projection of the cooling channel at least partially overlaps with the projection of the mounting plane.
[0015] In the transistor assembly as described above, a side of the substrate facing away from the transistor is covered with a thermally conductive adhesive layer, and the substrate is bonded and fixed to the mounting plane through the thermally conductive adhesive layer.
[0016] An embodiment of the present application also provides an inverter assembly, wherein the inverter assembly includes the transistor component as described above.
[0017] An embodiment of the present application also provides a vehicle, wherein the vehicle includes the transistor component or inverter assembly as described above.
[0018] The transistor assembly, inverter assembly and vehicle provided in the embodiments of the present application are configured such that the first hole on the substrate for connecting with the connecting member includes a first section and a second section, and a gap is formed between the inner circumference of the first section and the connecting member. When creepage occurs, a water-ripple-like arc will extend along the inner circumference of the first section, thereby increasing the distance the arc needs to extend from the charged metal sheet to the connecting member, reducing the short circuit of the transistor assembly caused by creepage, and ensuring the normal use of the transistor assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A schematic diagram of the three-dimensional structure of a transistor assembly provided in an embodiment of the present application;
[0020] Figure 2 An exploded view of a transistor assembly provided in an embodiment of the present application;
[0021] Figure 3 A partial cross-sectional view of a transistor assembly provided in an embodiment of the present application;
[0022] Figure 4A schematic diagram of a partial structure of a transistor assembly provided in an embodiment of the present application;
[0023] Figure 5 A schematic diagram of the installation status of the transistor assembly provided in an embodiment of the present application.
[0024] Description of Figure Numbers:
[0025] 1. transistor; 11. second hole; 2. substrate; 21. first hole; 211. first section; 212. second section; 3. connecting member; 31. connecting bolt; 32. insulating sleeve; 4. insulating thermal pad; 41. third hole; 5. heat dissipation component; 51. cooling channel; 52. mounting plane; 6. thermal conductive adhesive layer. DETAILED DESCRIPTION
[0026] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present application, rather than all of the embodiments.
[0028] like Figures 1 to 3 As shown, the embodiment of the present application provides a transistor assembly, wherein the transistor assembly includes a plurality of transistors 1 and a substrate 2. Transistor 1 refers to a single element based on semiconductor material, and transistor 1 has multiple functions such as detection, rectification, amplification, switching, voltage regulation, and signal modulation. Transistor 1 can be used for various digital and analog functions, such as MOS tube, Metal-Oxide-Semiconductor Field-Effect Transistor. MOSFET is a metal oxide semiconductor field effect transistor, referred to as metal oxide semiconductor field effect transistor.
[0029] The substrate 2 may be a plate made of insulating material to ensure insulation between the transistors 1 .
[0030] A plurality of first holes 21 are provided on the substrate 2 , and each transistor 1 is connected to a first hole 21 via a connecting member 3 . The connecting member 3 passes through the transistor 1 , and the connecting member 3 and the transistor 1 are insulated from each other.
[0031] Along the direction from the transistor 1 to the substrate 2, the first hole 21 includes a first section 211 and a second section 212 that are connected, the connecting member 3 passes through the first section 211 and is connected to the second section 212, the inner diameter of the first section 211 is greater than the inner diameter of the second section 212, and there is a gap between the inner circumference of the first section 211 and the connecting member 3. The first section 211 and the second section 212 are formed on the substrate 2 in a segmented processing manner.
[0032] The transistor assembly provided in the embodiment of the present application is configured such that the first hole 21 on the substrate 2 for connecting with the connecting member 3 includes a first section 211 and a second section 212, and a gap is formed between the inner circumference of the first section 211 and the connecting member 3. When creepage occurs, a water-ripple-like arc will extend along the inner circumference of the first section 211, thereby increasing the distance the arc needs to extend from the charged metal sheet to the connecting member 3, reducing the short circuit of the transistor assembly caused by creepage, and ensuring the normal use of the transistor assembly.
[0033] Optionally, the first section 211 is coaxial with the second section 212, and the connecting member 3 is connected to the second section 212 to ensure that a uniform gap is formed between the inner circumference of the first section 211 and the connecting member 3, so that the arc can extend the same distance from the charged metal sheet to each position of the connecting member 3, thereby reducing the short circuit of the transistor component caused by creepage.
[0034] Alternatively, if Figure 3 As shown, the first section 211 is a tapered hole section, and the inner diameter of the first section 211 gradually decreases along the direction from the transistor 1 to the substrate 2; the second section 212 is a straight hole section.
[0035] Optionally, the first section 211 and the second section 212 may both be straight hole sections, and a step surface facing the transistor 1 is formed between the first section 211 and the second section 212 , that is, the first hole 21 is a countersunk hole.
[0036] It should be noted that the specific shapes of the first section 211 and the second section 212 are not limited to the above two, as long as the connection function between the second section 212 and the connecting member 3 and a gap between the first section 211 and the connecting member 3 can be achieved.
[0037] like Figures 1 to 3 As shown, the transistor assembly provided by the embodiment of the present application, wherein a second hole 11 is opened on the transistor 1, and the connecting member 3 passes through the second hole 11. When the transistor 1 is installed, the second hole 11 is coaxially connected with the first hole 21 to ensure that the connecting member 3 is smoothly passed through.
[0038] The connection member 3 is insulated from the hole wall of the second hole 11 to prevent the charged metal sheet of the transistor 1 from being electrically connected to the connection member 3 and causing a short circuit of the transistor 1 , thereby ensuring the normal operation of the transistor 1 .
[0039] like Figure 1 and Figure 5 As shown, a transistor assembly is provided in an embodiment of the present application, wherein an insulating thermal pad 4 is provided between each transistor 1 and the substrate 2, a plurality of third holes 41 are provided on the insulating thermal pad 4, each third hole 41 is connected to a corresponding first hole 21, and a connecting member 3 passes through the third hole 41. When the transistor 1 is set, the first hole 21 of the transistor 1 is connected to the second hole 11 and the third hole 41 coaxially and correspondingly to ensure that the connecting member 3 is smoothly passed through.
[0040] When the insulating thermal pad 4 is provided, the substrate 2 can be made of a metal material, such as aluminum, which has good structural strength and thermal conductivity. By providing the insulating thermal pad 4, the transistor 1 and the substrate 2 can be insulated, and the heat generated during the operation of the transistor 1 can be conducted to the substrate 2 through the insulating thermal pad 4 and dissipated, which is beneficial to the heat dissipation of the transistor 1.
[0041] The connection member 3 and the third hole 41 are insulated to prevent the charged metal sheet from creeping toward the connection member 3 through the insulating thermal pad 4 .
[0042] like Figure 3 As shown, the transistor assembly provided by the embodiment of the present application, wherein the connecting member 3 includes a connecting bolt 31 and an insulating sleeve 32 , the insulating sleeve 32 is sleeved on the screw of the connecting bolt 31 , and the insulating sleeve 32 passes through the second hole 11 and the third hole 41 .
[0043] Optionally, the insulating sleeve 32 may be fixed to the screw rod of the connecting bolt 31 , or directly fixedly connected to the second hole 11 and the third hole 41 .
[0044] like Figure 4 and Figure 5 As shown, a transistor assembly provided by an embodiment of the present application, wherein a heat dissipation component 5 is provided on the side of the substrate 2 facing away from the transistor 1, the heat dissipation component 5 is formed with a mounting plane 52, and the substrate 2 is mounted on the mounting plane 52; the heat dissipation component 5 can be used as a part of the transistor assembly, or the heat dissipation component 5 can also be the installation base of the transistor assembly. For example, when the transistor assembly is applied to an inverter assembly, the heat dissipation component 5 can be fixedly formed inside the shell of the inverter assembly.
[0045] Optionally, a cooling channel 51 is provided inside the heat dissipation component 5, and along a direction perpendicular to the substrate 2, the projection of the cooling channel 51 at least partially overlaps with the projection of the mounting plane 52, so as to shorten the heat dissipation path between the cooling channel 51 and the substrate 2 as much as possible and improve the heat dissipation efficiency.
[0046] like Figure 5As shown, in the transistor assembly provided by the embodiment of the present application, a thermally conductive adhesive layer 6 is provided on the side of the substrate 2 facing away from the transistor 1, and the substrate 2 is bonded and fixed to the mounting plane 52 by the thermally conductive adhesive layer 6. By providing the thermally conductive adhesive layer 6, the fixed installation of the entire transistor assembly can be conveniently achieved, and the thermally conductive adhesive layer 6 has good thermal conductivity to ensure the heat dissipation effect of the heat dissipation component 5 on the transistor assembly.
[0047] An embodiment of the present application also provides an inverter assembly, wherein the inverter assembly includes the transistor component as described above.
[0048] The inverter assembly provided in the embodiment of the present application has a transistor component arranged inside thereof. The first hole on the substrate for connecting with the connecting member includes a first section and a second section, and a gap is formed between the inner circumference of the first section and the connecting member. When creepage occurs, a water-ripple-like arc will extend along the inner circumference of the first section, thereby increasing the distance the arc needs to extend from the charged metal sheet to the connecting member, reducing the short circuit of the transistor component caused by creepage, and ensuring the normal use of the transistor component.
[0049] An embodiment of the present application also provides a vehicle, wherein the vehicle includes the transistor component or inverter assembly as described above.
[0050] The vehicle provided in the embodiment of the present application has a transistor component used in its inverter assembly. The first hole on the substrate for connecting with the connecting member includes a first section and a second section, and a gap is formed between the inner circumference of the first section and the connecting member. When creepage occurs, a water-ripple-like arc will extend along the inner circumference of the first section, thereby increasing the distance the arc needs to extend from the charged metal sheet to the connecting member, reducing the short circuit of the transistor component caused by creepage, and ensuring the normal use of the transistor component.
[0051] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
Claims
1. A transistor component, characterized in that: The transistor assembly comprises: Multiple transistors; A substrate, wherein a plurality of first holes are provided on the substrate, each of the transistors is connected to one of the first holes via a connecting member, and the connecting member is insulated from the transistor; Along the direction from the transistor to the substrate, the first hole includes a first section and a second section that are connected, the connecting member passes through the first section and is connected to the second section, the inner diameter of the first section is larger than the inner diameter of the second section, and there is a gap between the inner circumference of the first section and the connecting member.
2. The transistor assembly according to claim 1, characterized in that The first section is a tapered hole section, and the inner diameter of the first section gradually decreases along the direction from the transistor to the substrate; the second section is a straight hole section.
3. The transistor assembly according to claim 1, characterized in that The first section and the second section are both straight hole sections, and a step surface facing the transistor is formed between the first section and the second section.
4. The transistor assembly according to claim 1, characterized in that A second hole is opened on the transistor, the connecting member passes through the second hole, and the connecting member is insulated from the hole wall of the second hole.
5. The transistor assembly according to claim 4, characterized in that An insulating thermal pad is provided between each transistor and the substrate, a plurality of third holes are provided on the insulating thermal pad, each of the third holes is connected to a corresponding first hole, the connecting member passes through the third hole, and the connecting member and the third hole are insulated.
6. The transistor assembly according to claim 5, characterized in that The connecting component includes a connecting bolt and an insulating sleeve. The insulating sleeve is sleeved on a screw rod of the connecting bolt, and the insulating sleeve passes through the second hole and the third hole.
7. The transistor assembly according to claim 1, characterized in that A heat dissipation component is provided on the side of the substrate facing away from the transistor, the heat dissipation component forms a mounting plane, and the substrate is mounted on the mounting plane; a cooling channel is provided inside the heat dissipation component, and along a direction perpendicular to the substrate, the projection of the cooling channel at least partially overlaps with the projection of the mounting plane.
8. The transistor assembly according to claim 7, characterized in that A side of the substrate facing away from the transistor is covered with a heat-conducting adhesive layer, and the substrate is bonded and fixed to the mounting plane through the heat-conducting adhesive layer.
9. An inverter assembly, characterized in that: The inverter assembly comprises the transistor assembly according to any one of claims 1 to 8.
10. A vehicle, characterized in that: The vehicle comprises the transistor assembly according to any one of claims 1 to 8 or the inverter assembly according to claim 9.