Display panel, manufacturing method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, relates to the technical field of display, and is used for effectively improving the high-temperature color cast problem of the display panel. The display panel comprises a first substrate and a second substrate which are opposite to each other, and the first substrate comprises a driving back plate and a light-emitting element; the frame glue is located between the first substrate and the second substrate; the liquid packaging layer is located on the side, away from the driving backboard, of the light-emitting element and covers the light-emitting element.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Among many types of light-emitting elements, light-emitting diodes (LEDs) stand out for their advantages such as high efficiency, energy saving, and long life. However, LEDs are semiconductor devices, and the carrier concentration in their semiconductor materials is easily affected by temperature changes. When the temperature rises, the LED light efficiency decreases, which in turn causes high-temperature color shift in the display panel. Summary of the invention

[0003] Embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device, which are used to effectively improve the high-temperature color shift problem of the display panel.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0005] A first substrate and a second substrate opposite to each other, wherein the first substrate includes a driving backplane and a light-emitting element;

[0006] Frame glue, located between the first substrate and the second substrate;

[0007] A liquid encapsulation layer is located on a side of the light emitting element away from the driving backplane and covers the light emitting element.

[0008] In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0009] forming a first substrate, wherein the first substrate comprises a driving backplane and a light-emitting element;

[0010] A liquid encapsulation layer and a frame glue are formed, and the second substrate is aligned with the first substrate. After the process is completed, the frame glue is located between the first substrate and the second substrate, and the liquid encapsulation layer is located on the side of the light-emitting element away from the driving backplane and covers the light-emitting element.

[0011] In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, comprising the above-mentioned display panel.

[0012] The above technical solution provided by the embodiment of the present invention has the following beneficial effects:

[0013] Different from the traditional solid encapsulation layer, the embodiment of the present invention adopts a liquid encapsulation layer to encapsulate the light-emitting element, and the liquid encapsulation layer has a certain fluidity. In this regard, the embodiment of the present invention also provides a sealant, so that a closed space capable of accommodating the liquid encapsulation layer is formed between the first substrate, the second substrate and the sealant, so that the liquid encapsulation layer flows in the closed space.

[0014] When a liquid encapsulation layer is used for encapsulation, on the one hand, the liquid encapsulation layer has good fluidity and can accelerate the transfer of heat. The heat generated by the light-emitting element when it emits light can be conducted more quickly in the liquid encapsulation layer, avoiding heat accumulation in the light-emitting element and causing the temperature of the light-emitting element to rise and affect its light efficiency; on the other hand, liquid materials usually have a higher thermal expansion coefficient and can better buffer thermal stress when the temperature changes, reduce the impact of thermal stress on the light-emitting element, and improve chip reliability; on the other hand, the thermal conductivity of air is very low, which is not conducive to the transfer of heat. When a liquid encapsulation layer is used, during the encapsulation process, the liquid encapsulation material can better fill the tiny gaps between the light-emitting elements, thereby reducing air residue, reducing contact thermal resistance, and improving heat transfer efficiency.

[0015] Moreover, the liquid packaging material can flow freely according to the device shape and structure of the light-emitting element, and can achieve all-round heat dissipation contact for light-emitting elements of various complex shapes, helping to ensure that heat can be evenly transferred from the light-emitting element and avoid the formation of local hot spots.

[0016] In summary, by adopting the technical solution provided in the embodiment of the present invention, the liquid encapsulation layer can be used to achieve effective heat dissipation, balance the temperature differences of pixels under different brightness, promote uniform temperature inside the screen, and effectively solve the problem of reduced light efficiency of light-emitting elements caused by temperature, thereby improving the high-temperature color cast phenomenon of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment of the present invention;

[0019] Figure 2 Another schematic diagram of the structure of a display panel provided by an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of another structure of a display panel provided by an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of another structure of a display panel provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of another structure of a display panel provided by an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of another structure of a display panel provided by an embodiment of the present invention;

[0024] Figure 7 A top view of a display panel provided by an embodiment of the present invention;

[0025] Figure 8 Another top view of the display panel provided by the embodiment of the present invention;

[0026] Fig. 9 Another top view of the display panel provided by the embodiment of the present invention;

[0027] Fig.10 Another top view of the display panel provided by the embodiment of the present invention;

[0028] Fig.11 A schematic diagram of another structure of a display panel provided by an embodiment of the present invention;

[0029] Fig.12 A flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0030] Fig.13 Another flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0031] Fig.14 Another flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0032] Fig.15 Another flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0033] Fig.16 Another flow chart of the method for manufacturing a display panel provided by an embodiment of the present invention;

[0034] Fig.17 A schematic diagram of the structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] It should be clear that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0038] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0039] An embodiment of the present invention provides a display panel, such as Figure 1 As shown, Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present invention, the display panel comprises a first substrate 1 and a second substrate 2 relative to each other. The first substrate 1 comprises a driving backplane 3 and a light-emitting element 4; the driving backplane 3 comprises a substrate 5 and an array layer 6, and the array layer 6 is provided with a pixel circuit (not shown in the figure) and a signal line (not shown in the figure) and other structures; the light-emitting element 4 can be an LED, such as a Mini LED, a MicroLED, etc. The second substrate 2 can be a cover plate, such as a glass cover plate, etc.

[0040] The display panel further includes a sealant 7, which is located between the first substrate 1 and the second substrate 2, and can be specifically arranged in the frame area around the display area. A closed space is formed between the first substrate 1, the second substrate 2 and the sealant 7.

[0041] The display panel further includes a liquid encapsulation layer 8 , which is located on a side of the light emitting element 4 away from the driving backplane 3 and covers the light emitting element 4 .

[0042] Different from the traditional solid encapsulation layer, the embodiment of the present invention adopts a liquid encapsulation layer 8 to encapsulate the light emitting element 4. Since the liquid encapsulation layer 8 has a certain fluidity, the embodiment of the present invention further provides a sealant 7, so that a closed space capable of accommodating the liquid encapsulation layer 8 is formed between the first substrate 1, the second substrate 2 and the sealant 7, so that the liquid encapsulation layer 8 flows in the closed space.

[0043] The liquid encapsulation layer 8 is used for encapsulation. On the one hand, the liquid encapsulation layer 8 has good fluidity, which can accelerate the transfer of heat. The heat generated by the light-emitting element 4 when emitting light can be conducted more quickly in the liquid encapsulation layer 8, thereby avoiding heat accumulation in the light-emitting element 4 and causing the temperature of the light-emitting element 4 to rise and affect its light efficiency. On the other hand, liquid materials usually have a higher thermal expansion coefficient, which can better buffer thermal stress when the temperature changes, reduce the impact of thermal stress on the light-emitting element 4, and improve chip reliability. On the other hand, the thermal conductivity of air is very low, which is not conducive to the transfer of heat. When a liquid encapsulation layer is used, during the encapsulation process, the liquid encapsulation material can better fill the tiny gaps between the light-emitting elements 4, thereby reducing air residue, reducing contact thermal resistance, and improving heat transfer efficiency.

[0044] Moreover, the liquid packaging material can flow freely according to the device shape and structure of the light-emitting element 4, and can achieve all-round heat dissipation contact for light-emitting elements 4 of various complex shapes, which helps to ensure that heat can be evenly transferred from the light-emitting element 4 and avoid the formation of local hot spots.

[0045] In summary, by adopting the technical solution provided in the embodiment of the present invention, the liquid encapsulation layer 8 can be used to achieve effective heat dissipation, balance the temperature differences of pixels under different brightness, promote uniform temperature inside the screen, and effectively solve the problem of reduced light efficiency of the light-emitting element 4 caused by temperature, thereby improving the high-temperature color cast phenomenon of the display panel.

[0046] In an embodiment of the present invention, the liquid encapsulation material selected for the liquid encapsulation layer 8 may include liquid organic silicone, epoxy resin, metal composite material, etc., all of which have high transmittance, high resistivity, good thermal stability and good chemical stability. Among them, the transmittance of the liquid encapsulation layer 8 can be greater than or equal to 90%, so that the light emitted by the light-emitting element 4 can be emitted through the liquid encapsulation layer 8 as much as possible, thereby improving the light extraction efficiency. Moreover, the liquid encapsulation layer 8 is a highly transparent material, and when it is used in a transparent display panel, it also helps to improve the light transmission performance of the transparent display panel.

[0047] In a possible implementation, Figure 2 As shown, Figure 2 This is another schematic diagram of the structure of a display panel provided by an embodiment of the present invention. The display panel further includes a support column 9 . The support column 9 is located in the liquid encapsulation layer 8 and between the first substrate 1 and the second substrate 2 .

[0048] The support column 9 can achieve a stable and uniform cell thickness between the first substrate 1 and the second substrate 2, thereby ensuring that the liquid encapsulation material flows normally in the closed space. In addition, the support column 9 can also improve the mechanical strength of the display panel to prevent the display panel from being deformed under the action of external forces.

[0049] In a possible implementation, Figure 3 As shown, Figure 3 This is another structural schematic diagram of a display panel provided in an embodiment of the present invention. The display panel also includes a dimming structure 10. The dimming structure 10 is located in the liquid encapsulation layer 8. In a direction perpendicular to the plane where the second substrate 2 is located, at least part of the dimming structure 10 is located in the interval between adjacent light-emitting elements 4.

[0050] It should be noted that “in the direction perpendicular to the plane where the second substrate 2 is located, at least part of the dimming structure 10 is located in the interval between adjacent light-emitting elements 4” can also be understood as “at least part of the adjacent light-emitting elements 4 are separated by the orthographic projection of the dimming structure 10 on the second substrate 2”.

[0051] For the light-emitting element 4, especially the LED, its light pattern is relatively divergent, and the utilization rate of the light at a large viewing angle is low, resulting in high power consumption. For this reason, the embodiment of the present invention further sets a dimming structure 10 in the closed space, so that the dimming structure 10 is used to adjust the large-angle light emitted by the light-emitting element 4, and convert it into small-angle light, so as to emit the second substrate 2 in the direction of the normal viewing angle. In this way, the utilization rate of the light at a large viewing angle can be effectively improved, the central brightness of the light-emitting element 4 can be improved, the cross-color problem can be significantly improved, and the power consumption can be reduced.

[0052] In a feasible implementation, the refractive index of the dimming structure 10 is less than the refractive index of the liquid encapsulation layer 8, so that when a portion of the large-angle light emitted by the light-emitting element 4 is emitted toward the dimming structure 10, it will be fully reflected at the interface where the dimming structure 10 and the liquid encapsulation layer 8 intersect, and the reflected light will tend to be emitted at a positive angle, thereby helping to improve the central brightness of the light-emitting element 4. Moreover, by using the dimming structure 10 to perform such regulation on the light, the color crossover problem of adjacent light-emitting elements 4 can also be effectively prevented.

[0053] Furthermore, the refractive index of the dimming structure 10 is n1, 1.0≤n1≤1.35, and the refractive index of the liquid encapsulation layer 8 is n2, 1.4≤n2≤1.6.

[0054] The second substrate 2 in the display panel is usually a glass cover plate, and the refractive index of the glass cover plate is about 1.5. The above-mentioned design of the refractive index of the dimming structure 10 and the liquid encapsulation layer 8 can make the refractive index of the liquid encapsulation layer 8 and the refractive index of the second substrate 2 closer while achieving total reflection, thereby avoiding further refraction of the light at the interface between the liquid encapsulation layer 8 and the second substrate 2, and allowing the light to be emitted along the direction after reflection as much as possible.

[0055] Or, in another feasible implementation, as Figure 4 As shown, Figure 4This is another structural schematic diagram of a display panel provided by an embodiment of the present invention. The dimming structure 10 includes a main body 11 and a reflective layer 12 . The reflective layer 12 is located on the surface of the main body 11 .

[0056] This structure uses the reflective layer 12 to reflect the light emitted by the light-emitting element 4, thereby converting the large-angle light emitted by the light-emitting element 4 into small-angle light, which can not only effectively improve the central brightness of the light-emitting element 4, but also effectively prevent the cross-color problem of adjacent light-emitting elements 4. In addition, under this setting, the refractive index of the dimming structure 10 and the liquid encapsulation layer 8 does not need to meet some restrictions, and the optional range of materials selected for the two structures may be larger.

[0057] In a possible implementation, Figure 5 and Figure 6 As shown, Figure 5 This is another structural schematic diagram of a display panel provided by an embodiment of the present invention. Figure 6 This is another structural schematic diagram of a display panel provided by an embodiment of the present invention, in which the liquid encapsulation layer 8 includes a first surface 13 close to the second substrate 2 and a second surface 14 away from the second substrate 2. That is, the first surface 13 is the upper surface of the liquid encapsulation layer 8, and the second surface 14 is the lower surface of the liquid encapsulation layer 8.

[0058] Among them, see Figure 5 , at least part of the dimming structure 10 is spaced from the first surface 13, and / or, see Figure 6 , there is a gap between at least part of the dimming structure 10 and the second surface 14 .

[0059] In the embodiment of the present invention, in the direction perpendicular to the plane where the second substrate 2 is located, the height of the dimming structure 10 is less than the box thickness between the first substrate 1 and the second substrate 2. There is a gap between the top of at least part of the dimming structure 10 and the upper surface of the liquid encapsulation layer 8, so that the liquid encapsulation material can flow above this part of the dimming structure 10, and / or there is a gap between the bottom of at least part of the dimming structure 10 and the lower surface of the liquid encapsulation layer 8, so that the liquid encapsulation material can flow below this part of the dimming structure 10. In this way, the liquid encapsulation material can flow throughout the entire surface of the screen, thereby achieving better heat dissipation and making the temperature inside the screen more uniform.

[0060] Further, see again Figure 5 For the dimming structure 10 spaced apart from the second surface 14 , a distance k1 between the dimming structure 10 and the second surface 14 is smaller than a distance k2 between a surface of the light emitting element 4 close to the second substrate 2 and the second surface 14 .

[0061] That is, the bottom of this part of the dimming structure 10 extends into between adjacent light-emitting elements 4, which means that the height of this part of the dimming structure 10 will not be too small while satisfying the condition of being less than the box thickness. On the one hand, more large-angle light emitted by the light-emitting element 4 can reach the dimming structure 10, and total reflection or reflection occurs on the surface of the dimming structure 10, thereby greatly improving the utilization rate of large-angle light. On the other hand, under the premise of ensuring that the liquid encapsulation material can flow on the entire surface of the bottom of the dimming structure 10, when the display panel is slightly deformed by external force, this part of the dimming structure 10 can also serve as a supporting structure to stabilize the box thickness.

[0062] In the embodiment of the present invention, for the dimming structure 10 having a gap with the second surface 14, this part of the dimming structure 10 can be pre-formed on the second substrate 2, and then placed in the closed space as the second substrate 2 is aligned with the first substrate 1. For the dimming structure 10 having a gap with the first surface 13, after the first substrate 1 is formed, this part of the dimming structure 10 can be formed on one side of the first substrate 1, and then the filling of the liquid encapsulation material, the alignment of the first substrate 1 and the second substrate 2, and other processes can be performed.

[0063] As for the support column 9, the support column 9 can be pre-formed on the second substrate 2 and placed in the closed space as the second substrate 2 is aligned with the first substrate 1, or can be formed on one side of the first substrate 1, which is not specifically limited in the embodiment of the present invention.

[0064] In one possible implementation, see Figure 3 The display panel further includes a support column 9 , which is located in the liquid encapsulation layer 8 and between the first substrate 1 and the second substrate 2 .

[0065] Along the direction perpendicular to the plane where the second substrate 2 is located, the height of the support column 9 is h1, the height of the dimming structure 10 is h2, and 3 μm≤h1-h2≤10 μm.

[0066] Setting the minimum height difference between the support column 9 and the dimming structure 10 to 3μm can avoid the dimming structure 10 and the upper or lower surface of the liquid encapsulation layer 8 being too small to affect the entire surface flow of the liquid encapsulation material. Setting the maximum height difference between the support column 9 and the dimming structure 10 to 10μm can ensure that the dimming structure 10 has a sufficient height. On the one hand, more large-angle light emitted by the light-emitting element 4 can be injected into the dimming structure 10, thereby improving the utilization rate of large-angle light. On the other hand, under the premise of ensuring that the liquid encapsulation material can flow through the entire surface of the bottom of the dimming structure 10, when the display panel is slightly deformed by external force, this part of the dimming structure 10 can also play a stable supporting role.

[0067] In an optional implementation, h1 and h2 may satisfy: 10 μm≤h1≤500 μm, 10 μm≤h2≤500 μm, and specific values ​​of h1 and h2 may be set according to the box thickness of the first substrate 1 and the second substrate 2 .

[0068] In one possible implementation, see Figure 7 to Figure 10 , the orthographic projection of the dimming structure 10 on the first substrate 1 surrounds the orthographic projection of at least one light emitting element 4 on the first substrate 1. The dimming structure 10 under this structure is a closed ring, which can adjust the large-angle light emitted by the light emitting element 4 in multiple directions to increase the central brightness to a greater extent.

[0069] Furthermore, if Figure 7 and Figure 8 As shown, Figure 7 A top view of a display panel provided by an embodiment of the present invention, Figure 8 Another top view of the display panel provided by the embodiment of the present invention, the dimming structure 10 includes a first type of dimming structure 15, the orthographic projection of the first type of dimming structure 15 on the first substrate 1 surrounds the orthographic projection of a light emitting element 4 on the first substrate 1, wherein two adjacent first type of dimming structures 15 can be as follows Figure 7 As shown, they are interconnected, and can also be Figure 8 In this structure, for a single light emitting element 4 , the large-angle light emitted by the light emitting element 4 in all directions can be controlled by the first type dimming structure 15 .

[0070] and / or, if Fig. 9 and Fig.10 As shown, Fig. 9 Another top view of a display panel provided by an embodiment of the present invention is shown in the figure. The display panel includes a light-emitting unit 16, and the light-emitting unit 16 includes at least two light-emitting elements 4. For example, the light-emitting unit 16 includes a red light-emitting element, a green light-emitting element, and a blue light-emitting element. The dimming structure 10 includes a second type of dimming structure 17, and the orthographic projection of the second type of dimming structure 17 on the first substrate 1 surrounds the orthographic projection of at least one light-emitting unit 16 on the first substrate 1, wherein two adjacent second type of dimming structures 17 can be as shown in FIG. Fig. 9 As shown, they are interconnected, and can also be Fig.10 In this structure, the dimming structures 10 do not need to be spaced between adjacent light emitting units 16 within the light emitting unit 16, so the arrangement can be more compact, which helps to improve the pixel density.

[0071] In one possible implementation, see Figure 3The angle between the surface of the dimming structure 10 away from the second substrate 2 and the side surface intersecting therewith is A, 60°≤A≤80°. When the minimum value of A is set to 60° and the maximum value is set to 80°, the side inclination of the dimming structure 10 is more reasonable, the regulation of the incident light is better, and the light after total reflection or reflection can be more inclined to be emitted along the normal angle.

[0072] In addition, when the display panel includes the support column 9 , the angle between the surface of the support column 9 away from the second substrate 2 and the side surface intersecting therewith is B, and 60°≤B≤80°.

[0073] In an optional structure, the dimming structure 10 includes a sub-section, the sub-section is located between adjacent light-emitting elements 4, the sub-section has a first cross-section, and the shape of the first cross-section can be a trapezoid. The first cross-section is perpendicular to the plane where the second substrate 2 is located and parallel to the arrangement direction of the light-emitting elements 4 on both sides of the sub-section.

[0074] In an optional structure, the side wall of the dimming structure 10 may be a flat surface or a non-flat surface, such as a wavy surface, a folded line surface, etc.

[0075] In an optional structure, the dimming structure 10 may include a light-transmitting material or an opaque material. For example, when the refractive index of the dimming structure 10 is less than the refractive index of the liquid encapsulation layer 8, the dimming structure 10 may be made of a light-transmitting material. When the dimming structure 10 includes a main body 11 and a reflective layer 12, the main body 11 may be made of an opaque material.

[0076] In an optional structure, the alignment accuracy of the first substrate 1 and the second substrate 2 is less than or equal to 5 μm, that is, the distance between the orthographic projection of the edge of the first substrate 1 on the first plane and the orthographic projection of the edge of the second substrate 2 on the first plane is less than or equal to 5 μm, and the first plane is parallel to the plane where the second substrate 2 is located.

[0077] In the embodiment of the present invention, the support column 9 can have various shapes, such as a closed ring structure, a strip structure, a block structure, etc. Moreover, the embodiment of the present invention does not specifically limit the arrangement density of the support column 9, as long as a better support effect can be achieved.

[0078] In a possible implementation, Fig.11 As shown, Fig.11 This is another structural schematic diagram of a display panel provided in an embodiment of the present invention. The first substrate 1 also includes a light-shielding layer 18. The light-shielding layer 18 covers the driving backplane 3 and exposes the light-emitting surface of the light-emitting element 4. The light-shielding layer 18 may include a black light-absorbing material for shielding the metal wiring in the array layer 6 to reduce panel reflection.

[0079] Based on the same inventive concept, the embodiment of the present invention further provides a method for manufacturing a display panel, Figure 1 ,like Fig.12 As shown, Fig.12 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present invention, the manufacturing method comprising:

[0080] Step S1: forming a first substrate 1, the first substrate 1 comprising a driving backplane 3 and a light emitting element 4. After the driving backplane 3 is formed, the light emitting element 4 can be transferred and bound to the driving backplane 3 by mass transfer.

[0081] Step S2: forming a liquid encapsulation layer 8, a sealant 7, and aligning the second substrate 2 with the first substrate 1. After the process is completed, the sealant 7 is located between the first substrate 1 and the second substrate 2, and the liquid encapsulation layer 8 is located on the side of the light-emitting element 4 away from the driving backplane 3 and covers the light-emitting element 4.

[0082] Combined with the above analysis, the display panel manufactured by this manufacturing method is encapsulated by a liquid encapsulation layer 8, which can achieve effective heat dissipation, effectively solve the problem of reduced light efficiency of the light-emitting element 4 caused by temperature, and improve the high-temperature color shift phenomenon of the display panel.

[0083] In a possible implementation, combining Figure 3 and Figure 4 ,like Fig.13 As shown, Fig.13 Another flow chart of the method for manufacturing a display panel provided in an embodiment of the present invention, the manufacturing method further includes step S1': forming a dimming structure 10 on one side of the second substrate 2, for example, by a nanoimprinting process. The refractive index of the dimming structure 10 is less than the refractive index of the liquid encapsulation layer 8, or the dimming structure 10 includes a main body 11 and a reflective layer 12, and the reflective layer 12 is located on the surface of the main body 11. It should be noted that step S1 and step S1' are not limited in order.

[0084] After the process of forming the liquid encapsulation layer 8, the frame glue 7, and aligning the second substrate 2 with the first substrate 1 is completed, the dimming structure 10 is located in the liquid encapsulation layer 8, and in the direction perpendicular to the plane where the second substrate 2 is located, at least part of the dimming structure 10 is located in the interval between adjacent light-emitting elements 4, and there is a gap between the dimming structure 10 and the surface of the liquid encapsulation layer 8 away from the second substrate 2.

[0085] The dimming structure 10 can regulate a portion of the large-angle light emitted by the light-emitting element 4, so that it is converted into small-angle light to emit from the panel. For example, when the refractive index of the dimming structure 10 is less than the refractive index of the liquid encapsulation layer 8, when a portion of the large-angle light emitted by the light-emitting element 4 is emitted toward the dimming structure 10, full emission will occur at the interface where the dimming structure 10 and the liquid encapsulation layer 8 intersect, so that the reflected light tends to be emitted at a normal viewing angle. When the dimming structure 10 includes a main body 11 and a reflective layer 12, the reflective layer 12 can be used to reflect the light emitted from the light-emitting element 4, thereby converting the large-angle light emitted by the light-emitting element 4 into small-angle light and emitting it in the direction of the normal viewing angle. The dimming result can then be used to effectively improve the light efficiency utilization rate of the large viewing angle, increase the center brightness, and thereby effectively improve cross-color and reduce power consumption.

[0086] Furthermore, there is a gap between the dimming structure 10 and the surface of the liquid encapsulation layer 8 away from the second substrate 2, so that the liquid encapsulation material can flow over the entire surface of the screen, thereby achieving better heat dissipation and making the temperature inside the screen more uniform.

[0087] When it is necessary to have a gap between the dimming structure 10 in the display panel and the surface of the liquid encapsulation layer 8 away from the second substrate 2, the dimming structure 10 can be formed on the second substrate 2 and then placed in a closed space as the second substrate 2 is aligned with the first substrate 1. In this way, the process of the dimming structure 10 will be simpler.

[0088] In addition, when the display panel further includes a support column 9 , the support column 9 may also be formed on one side of the second substrate 2 and placed in the closed space as the second substrate 2 is aligned.

[0089] In a possible implementation, Fig.14 As shown, Fig.14 This is another flow chart of the method for manufacturing a display panel provided in an embodiment of the present invention. Step S2 may specifically include: disposing a liquid encapsulation material on one side of the first substrate 1 to form a liquid encapsulation layer 8, and applying a frame glue 7 on the second substrate 2, and then aligning the second substrate 2 with the first substrate 1.

[0090] This manufacturing method is more suitable for liquid packaging materials with higher viscosity. The viscosity of this liquid packaging material is slightly higher, and even without the restriction of the frame glue 7, it will not overflow after coating. Therefore, the liquid packaging material can be coated first, and then the frame glue 7 can be placed between the first substrate 1 and the second substrate 2 as the second substrate 2 is aligned.

[0091] Or, if Fig.15 As shown, Fig.15This is another flow chart of the method for manufacturing a display panel provided in an embodiment of the present invention. Step S2 may specifically include: applying a sealant 7 on the first substrate 1, and filling a liquid encapsulation material in the area defined by the sealant 7 to form a liquid encapsulation layer 8, and then aligning the second substrate 2 with the first substrate 1.

[0092] This manufacturing method is to first apply the frame glue 7, the frame glue 7 surrounds to form a closed filling area, and then fill the filling area with liquid packaging material. Due to the limitation of the frame glue 7, even if the viscosity of the liquid packaging material is relatively low, it will not overflow. Whether the liquid packaging material with a higher viscosity or the liquid packaging material with a lower viscosity is selected, this method can be applied, and the range of liquid packaging materials available will be larger.

[0093] It should be noted that when a support column 9 or a dimming structure 10 is formed on one side of the second substrate 2, when the liquid packaging material is filled in the area defined by the frame glue 7, the upper surface of the liquid packaging material (the surface away from the first substrate 1) can be made lower than the upper surface of the frame glue 7 (the surface away from the first substrate 1). Therefore, when the first substrate 1 and the second substrate 2 are subsequently aligned and the support column 9 or the dimming structure 10 is placed in the liquid packaging layer 8, the liquid packaging material can be prevented from overflowing.

[0094] Or, if Fig.16 As shown, Fig.16 This is another flow chart of the method for manufacturing a display panel provided in an embodiment of the present invention, wherein step S2 may specifically include: applying a sealant 7 on the first substrate 1 or the second substrate 2, the sealant 7 having an injection port 19, aligning the second substrate 2 with the first substrate 1, and then filling the liquid encapsulation material into the area defined by the sealant 7 through the injection port 19 to form a liquid encapsulation layer 8, and after the injection is completed, sealing the injection port 19.

[0095] This manufacturing method is to fill the liquid packaging material after the first substrate 1 and the second substrate 2 are aligned, so that the liquid packaging material can be filled more fully, for example, it can be completely filled in the closed space formed by the first substrate 1, the second substrate 2 and the frame glue 7, and no air will remain, and the packaging effect will be better. Moreover, the liquid packaging material is directly filled in the closed space, and the liquid packaging material will not overflow.

[0096] Based on the same inventive concept, an embodiment of the present invention further provides a display device, such as Fig.17 As shown, Fig.17 1 is a schematic diagram of a structure of a display device provided by an embodiment of the present invention, and the display device includes the above-mentioned display panel 100. Of course, Fig.17The display device shown is for illustration only, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a laptop computer, an e-reader or a television.

[0097] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that: include: A first substrate and a second substrate opposite to each other, wherein the first substrate includes a driving backplane and a light-emitting element; Frame glue, located between the first substrate and the second substrate; The liquid encapsulation layer is located on a side of the light emitting element away from the driving backplane and covers the light emitting element.

2. The display panel according to claim 1, characterized in that: The display panel further includes a supporting column, wherein the supporting column is located in the liquid encapsulation layer and between the first substrate and the second substrate.

3. The display panel according to claim 1, characterized in that: The display panel further includes a dimming structure, which is located in the liquid encapsulation layer. In a direction perpendicular to the plane where the second substrate is located, at least a portion of the dimming structure is located between adjacent light-emitting elements.

4. The display panel according to claim 3, characterized in that: The refractive index of the dimming structure is smaller than the refractive index of the liquid encapsulation layer.

5. The display panel according to claim 4, characterized in that: The refractive index of the dimming structure is n1, 1.0≤n1≤1.35, and the refractive index of the liquid encapsulation layer is n2, 1.4≤n2≤1.

6.

6. The display panel according to claim 3, characterized in that: The dimming structure includes a main body and a reflective layer, and the reflective layer is located on a surface of the main body.

7. The display panel according to claim 3, characterized in that: The liquid encapsulation layer comprises a first surface close to the second substrate and a second surface away from the second substrate; There is a gap between at least part of the dimming structure and the first surface, and / or there is a gap between at least part of the dimming structure and the second surface.

8. The display panel according to claim 7, characterized in that: For the dimming structure spaced apart from the second surface, the distance between the dimming structure and the second surface is smaller than the distance between a surface of the light-emitting element close to the second substrate and the second surface.

9. The display panel according to claim 3, characterized in that: The display panel further includes a support column, wherein the support column is located in the liquid encapsulation layer and between the first substrate and the second substrate; Along a direction perpendicular to the plane where the second substrate is located, the height of the support column is h1, the height of the dimming structure is h2, and 3μm≤h1-h2≤10μm.

10. The display panel according to claim 3, characterized in that: The orthographic projection of the dimming structure on the first substrate surrounds the orthographic projection of at least one of the light-emitting elements on the first substrate.

11. The display panel according to claim 10, characterized in that: The dimming structure includes a first type of dimming structure, and the orthographic projection of the first type of dimming structure on the first substrate surrounds the orthographic projection of one of the light-emitting elements on the first substrate; And / or, the display panel includes a light-emitting unit, the light-emitting unit includes at least two of the light-emitting elements, the dimming structure includes a second type of dimming structure, and the second type of dimming structure has an orthographic projection on the first substrate surrounding an orthographic projection of at least one of the light-emitting units on the first substrate.

12. The display panel according to claim 3, characterized in that: The angle between the surface of the dimming structure away from the second substrate and the side surface intersecting with the surface is A, and 60°≤A≤80°.

13. The display panel according to claim 1, characterized in that: The first substrate further includes a light shielding layer, which covers the driving backplane and exposes the light emitting surface of the light emitting element.

14. A method for manufacturing a display panel, characterized in that: include: forming a first substrate, wherein the first substrate comprises a driving backplane and a light-emitting element; A liquid encapsulation layer and a frame glue are formed, and the second substrate is aligned with the first substrate. After the process is completed, the frame glue is located between the first substrate and the second substrate, and the liquid encapsulation layer is located on the side of the light-emitting element away from the driving backplane and covers the light-emitting element.

15. The manufacturing method according to claim 14, characterized in that: The manufacturing method further includes: forming a dimming structure on one side of the second substrate, wherein the refractive index of the dimming structure is smaller than the refractive index of the liquid encapsulation layer, or the dimming structure includes a main body and a reflective layer, and the reflective layer is located on the surface of the main body; After the process of forming the liquid encapsulation layer, the frame glue, and aligning the second substrate with the first substrate is completed, the dimming structure is located in the liquid encapsulation layer, and in a direction perpendicular to the plane where the second substrate is located, at least part of the dimming structure is located in the interval between adjacent light-emitting elements, and there is a gap between the dimming structure and the surface of the liquid encapsulation layer away from the second substrate.

16. The manufacturing method according to claim 14, characterized in that: The process of forming the liquid encapsulation layer, the frame glue, and aligning the second substrate with the first substrate includes: Disposing a liquid encapsulation material on one side of the first substrate to form the liquid encapsulation layer, and coating the sealant on the second substrate, thereby aligning the second substrate with the first substrate; Alternatively, the sealant is coated on the first substrate, and a liquid encapsulation material is filled in the area defined by the sealant to form the liquid encapsulation layer, and then the second substrate is aligned with the first substrate; Alternatively, the frame glue is coated on the first substrate or the second substrate, and an injection port is left in the frame glue. The second substrate is aligned with the first substrate, and then liquid packaging material is filled into the area defined by the frame glue through the injection port to form the liquid packaging layer. After the injection is completed, the injection port is sealed.

17. A display device, characterized in that: It comprises the display panel as claimed in any one of claims 1 to 13.

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