A terahertz waveguide micro square hole integral processing device

Abstract

The present invention relates to a terahertz waveguide micro square hole integral processing device, and relates to the technical field of waveguide micro hole forming equipment. The transmission component, pre-punching component, electrolytic hole expansion component, punching and trimming component and cleaning component arranged on the bottom plate platform can cooperate with each other to process micro square holes on the surface of the waveguide workpiece, and the clamping component is installed at intervals on the high-precision stepping guide rail defined by the transmission component; the pre-punching component, electrolytic hole expansion component, punching and trimming component and cleaning component are installed on the bottom plate platform in the same distribution as the adjacent four clamping components, so that the waveguide workpiece clamped by the clamping component completes the forming processing of the micro square hole by following the transmission component to perform intermittent stepping movement. The present invention combines multiple hole forming mechanisms to perform micro square hole processing with clear sharp angles and high shape accuracy, thereby reducing the disassembly and assembly operations of the waveguide workpiece and improving the overall processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of waveguide micro-hole forming equipment, and in particular to a terahertz waveguide micro square hole integral processing device. Background Art

[0002] Terahertz (THz) waves refer to electromagnetic waves with a wavelength of 3mm-30μm and a frequency of 0.1-10THz, between the millimeter wave electrical band and the infrared optical band. Terahertz waves have the advantages of wide bandwidth, moderate beam, strong penetration and high confidentiality. Due to the strong atmospheric attenuation characteristics of terahertz waves, in order to minimize the electromagnetic loss of terahertz waves during propagation, waveguides (WG) as structures for directional guidance of electromagnetic waves can effectively transmit terahertz signals with low loss, and are an important key core component in terahertz wave applications. Waveguides are difficult to manufacture due to their tiny structure and high dimensional precision, especially when it is necessary to open a number of micro square holes on their surface to form microwave rectangular waveguide products. The difficulty and complexity of micro square hole processing seriously limit the production efficiency and quality of waveguide structures.

[0003] At present, the processing technologies used for micro holes include mechanical drilling, focused ion beam, EDM, electrolytic machining, etc. Among micro holes, circular holes are the most deeply studied, while the exploration of square hole processing technology is relatively small. Mechanical processing usually uses Leroy triangle tools to drill square holes, but due to the limited size of the tool, it is difficult to process micro-sized square holes, and there are defects such as processing stress and workpiece deformation. In addition, there are problems such as easy wear of the tool and difficulty in processing high-hardness materials; laser processing and EDM both remove materials through thermal effects, and there are defects such as heat-affected zones and recast layers during processing, which affect the life and reliability of the workpiece. It is difficult to directly apply them in the fields of high-precision instruments and aerospace; electrolytic machining can process any conductive material without considering the mechanical properties of the material itself, and there are no defects such as heat-affected zones and recast layers during processing, and there is no electrode loss. However, electrolytic machining is mainly used for circular hole processing, and there is little research on electrolytic machining of square holes. In addition, there is a processing gap in electrolytic machining, and it is difficult to process micro square holes with sharp angles. Among the existing square hole processing methods, although single precision mold punching processing is a commonly used non-circular hole cavity processing method, it has requirements on the ratio of the minimum hole size to the material thickness. It is impossible to effectively punch workpieces with too small a ratio, which can easily lead to damage to the punch. The single electrolytic processing method has the problem of excessive accumulation of products in the processing area and short circuit of the electrode being wrapped by the product, which makes the existing electrolytic punching equipment unable to operate continuously and stably, and the sharp angle of the square hole formed by the processing cannot be guaranteed, and the shape accuracy is poor. In addition, the existing combined micro-hole forming processing equipment needs to change the processing position of the workpiece by disassembling and assembling the workpiece multiple times, which can easily cause positioning errors, and the secondary clamping operation will also cause defects such as pinching and scratching, which is not conducive to the efficient production of waveguide workpieces in batches. Summary of the invention

[0004] The present invention aims to provide a terahertz waveguide micro square hole overall processing device which can reduce the disassembly and assembly operations of waveguide workpieces and improve the comprehensive processing efficiency by combining multiple hole-forming mechanisms to process micro square holes with clear sharp angles and high shape accuracy, and at the same time build a continuous feeding structure, thereby solving the problems of the existing single micro square hole processing method, such as high processing difficulty and high cost, inability to ensure the sharp angle of the processed square hole, and poor shape accuracy, and the existing processing equipment needs to complete multiple process processing by manually performing multiple workpiece disassembly and assembly operations, and has the defects of long processing cycle, large disassembly and assembly errors, and large workpiece wear, and cannot meet the growing demand for batch processing and production.

[0005] The technical solution adopted by the present invention is: a terahertz waveguide micro square hole integrated processing device, including a base plate platform capable of accommodating a plurality of functional components, wherein the functional components process a micro square hole structure on the surface of a waveguide workpiece in a manner capable of cooperating with each other to perform continuous multi-process processing on a plurality of waveguide workpieces, wherein the functional components include a transmission component, a pre-punching component, an electrolytic hole expansion component, a punching and trimming component and a cleaning component, wherein clamping components are installed at intervals on the high-precision stepping guide rail of the transmission component in a manner capable of positioning a plurality of equally spaced workstations on the cyclic transmission path defined by the transmission component; the pre-punching component, the electrolytic hole expansion component, the punching and trimming component and the cleaning component are installed on the base plate platform in a manner of being distributed in the same manner as the four adjacent clamping components, so that the waveguide workpiece clamped by the clamping component completes the forming processing of the micro square hole by following the transmission component in an intermittent stepping movement. The advantage is that the multiple clamping components synchronously driven by the transmission component of the present application can simultaneously drive multiple waveguide workpieces to be positioned at different processing stations corresponding to the pre-punching component, electrolytic hole expansion component, blanking and trimming component and cleaning component, so that multiple waveguide workpieces can complete different processing in an orderly manner during the synchronous intermittent movement process, avoiding the problem that a single station needs to be frequently shut down for disassembly and assembly, a single processing cycle time is long, the processing efficiency is low, and the secondary disassembly and assembly is very likely to damage the waveguide workpiece. The pre-punching component, electrolytic hole expansion component, blanking and trimming component and cleaning component set in the present application can work synchronously, greatly improving the overall production efficiency and realizing the continuity of batch processing.

[0006] According to a preferred embodiment, the electrolytic hole expanding assembly includes a secondary lifting electrolytic hole expanding mechanism, an electrolytic support platform and an electrolytic cell, wherein the electrolytic support platform is detachably mounted on the base plate platform, and the lower surface of the electrolytic support platform is connected to the secondary lifting electrolytic hole expanding mechanism capable of defining an electrolytic hole expanding station, and the electrolytic cell on the base plate platform is arranged directly below the secondary lifting electrolytic hole expanding mechanism; the secondary lifting electrolytic hole expanding mechanism can adjustably drive the clamping assembly at the electrolytic hole expanding station to rise and fall, so that the waveguide workpiece clamped by the clamping assembly is immersed in the electrolytic cell under the push of the secondary lifting electrolytic hole expanding mechanism, and the secondary lifting electrolytic hole expanding mechanism can complete the hole expanding process by synchronously controlling the slight vibration of the waveguide workpiece and the progressive reciprocating displacement of the hole expanding electrode. The advantage is that the electrolytic hole expansion component provided in the present application can electrolytically expand the pre-punched holes processed by the pre-punching component, so that it can continuously and effectively complete the effective expansion of the pre-punched pre-punched holes, and because of the presence of the pre-punched holes, it can ensure the timely and sufficient discharge of the electrolysis products, so that the electrolyte in the hole cavity can be updated in time and flow quickly, realizing the applicability of electrolytic processing for deep micro-hole processing, solving the problems of difficulty in discharging electrolysis products and difficulty in updating electrolyte in existing electrolytic punching methods, effectively improving processing efficiency, and reducing the risk of passivation layer generation and electrode short circuit.

[0007] According to a preferred embodiment, the first mounting plate of the two-stage lifting electrolytic hole expanding mechanism is installed on the electrolytic support platform through a first lifting rod, and a push plate is provided on the lower surface of the first mounting plate, and a mechanical vibration unit is installed on the lower edge of the push plate, which can abut against the surface of the clamping assembly and drive the clamping assembly and the waveguide workpiece clamped therein to vibrate vertically slightly; a coaxially connected feed telescopic part, a high-frequency reciprocating displacement unit and a hole expanding electrode are also provided on the lower surface of the first mounting plate. The advantage is that the mechanical vibration unit and the high-frequency reciprocating displacement unit provided in the present application can respectively realize the vertical micro-vibration of the positive electrode and the jumping movement of the negative electrode, so that the continuous relative insertion movement of the waveguide workpiece and the hole-expanding electrode can accelerate the discharge of the electrolytic products in the hole cavity and the renewal of the electrolyte, and further enhance the discharge effect of the electrolytic products and the renewal effect of the electrolyte on the basis of the pre-constructed conductive pre-punching, further improve the forming quality, quality and processing stability of the electrolytic processing, ensure the efficiency and quality of continuous electrolytic processing, and avoid the disadvantages of the existing electrolytic drilling structure, such as the difficulty in discharging the electrolytic products and the poor flow of the electrolyte in the micropores.

[0008] According to a preferred embodiment, a supporting cylinder capable of supporting the clamping assembly pushed down by the secondary lifting electrolytic hole expanding mechanism is arranged in the cell body of the electrolytic cell, and an elastic silicone ring plate capable of contacting the clamping assembly and buffering the vertical micro-vibration of the clamping assembly is arranged on the upper end surface of the supporting cylinder, and an intermittent liquid guiding turbine capable of periodically driving the electrolyte in the cell body into its cylinder cavity is also embedded in the side surface of the supporting cylinder.

[0009] According to a preferred embodiment, the transmission component includes an elliptical ring plate, a support column and a high-precision stepping guide rail, wherein the elliptical ring plate is supported on the base plate platform by the support column, and the high-precision stepping guide rail is arranged on the outer surface of the elliptical ring plate; and a plurality of the clamping components corresponding to the moving ends thereof are arranged at intervals on the high-precision stepping guide rail.

[0010] According to a preferred embodiment, the two vertical sleeves of the clamping assembly are connected to the same movable end of the high-precision stepping guide rail, a sliding rod is slidably inserted in the vertical sleeve, and a first limit spring that can limit the initial axial relative position of the two is arranged between the sliding rod and the vertical sleeve; the axial lower end of the sliding rod is connected to a clamping plate that carries a waveguide workpiece, and two positioning pressure plates that assist in limiting the position of the waveguide workpiece on the clamping plate are arranged on the clamping plate.

[0011] According to a preferred embodiment, the laser punching unit of the pre-punching assembly is installed on the base plate platform via a multi-directional bracket that can drive the laser punching unit to move in multiple directions.

[0012] According to a preferred embodiment, the punching head of the punching and corner trimming assembly is installed on the first support frame through a punching lifting column, and a U-shaped limit platform is also provided under the punching head for limiting and supporting the clamping assembly moved to the punching and corner trimming station.

[0013] According to a preferred embodiment, two opposing side wall surfaces of the U-shaped limiting platform are provided with alignment through-strip grooves capable of providing limiting support for the clamping plate, and a slag collecting groove is also provided on the inner bottom surface of the U-shaped limiting platform.

[0014] According to a preferred embodiment, a positioning lifting column is provided on the second support frame of the cleaning assembly, so that the positioning lifting column can immerse the waveguide workpiece into the cleaning tank by pushing down the clamping assembly; and a purge cleaning mechanism capable of blowing and dehumidifying the waveguide workpiece moved back out of the cleaning tank is also installed on the positioning lifting column.

[0015] The beneficial effects of the present invention are:

[0016] The transmission component provided in the present application can drive several clamping components to move synchronously and equidistantly, so that the waveguide workpieces respectively clamped by several clamping components can continuously pass through multiple processing stations while simultaneously performing different processing, so as to realize high-quality and high-efficiency processing of micro square holes of waveguide workpieces. Compared with the punching equipment of a single station, the transmission component provided in the present application greatly improves the processing efficiency and solves the problem of frequent disassembly and assembly of waveguide workpieces for multi-process processing, so that the waveguide workpiece can follow the clamping component for intermittent movement, thereby continuously completing multiple processing, improving the efficiency and quality of batch processing. The pre-punching component provided in the present application can pre-process pre-punched holes on the surface of the waveguide workpiece according to the needs, so that the electrolytic products generated by the electrolytic hole expansion component in the process of processing the micro square holes can be timely and fully discharged through the pre-punched holes, so as to ensure the electrolytic processing quality of the electrolytic hole expansion component, promote the forming effect and continuous processing stability of the electrolytic hole expansion treatment, avoid the electrolytic products from causing obstruction and short circuit to the electrolytic process, and improve the electrolytic processing efficiency. The electrolytic hole expansion component provided in the present application can perform electrolytic hole expansion on the pre-punched hole processed by the pre-punching component, so that it can continuously and effectively complete the effective expansion of the pre-punched pre-punched hole, and because the existence of the pre-punched hole can ensure the timely and sufficient discharge of the electrolytic product, the electrolyte in the hole cavity can be updated in time and flow quickly, realizing the applicability of electrolytic processing for deep micro-hole processing, solving the problems of difficulty in discharging electrolytic products and difficulty in updating electrolyte in the existing electrolytic punching method, effectively improving the processing efficiency, and reducing the risk of passivation layer generation and electrode short circuit. The punching and trimming component provided in the present application can efficiently and accurately punch and trim the micro square hole of the waveguide workpiece after the electrolytic hole expansion processing, so that it can compensate for the forming defects of the square hole sharp angle that cannot be guaranteed and the poor shape accuracy when the electrolytic hole expansion component is electrolytically processed, effectively obtaining micro square holes with high shape accuracy and good square hole corner quality, and further improving the processing quality of the micro square holes of the waveguide workpiece. The cleaning component provided in the present application can clean the waveguide workpiece that has completed the micro square hole processing and is in the cleaning station by liquid cleaning and air blowing cleaning, effectively improving the cleanliness of the waveguide workpiece, avoiding the falling of processing debris and residues, and greatly improving the output quality. The clamping component provided in the present application can change the processing position of the waveguide workpiece in coordination with different functional components at different stations, so that the waveguide workpiece can obtain a micro square hole with high shape accuracy and good square hole corner quality through a multi-process combined processing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention;

[0018] Figure 2It is a schematic plan view of the structure of a transmission component of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention;

[0019] Figure 3 It is a schematic diagram of the lateral structure of an electrolytic hole expansion component of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention;

[0020] Figure 4 It is a schematic diagram of the lateral structure of a punching and trimming component of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention;

[0021] Figure 5 It is a structural schematic diagram of a clamping assembly of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention;

[0022] Figure 6 The diagram is a planar structural diagram of a clamping plate of a preferred terahertz waveguide micro square hole integral processing device proposed by the present invention.

[0023] Reference numerals list

[0024] 1: bottom plate; 2: transmission component; 3: pre-punching component; 4: electrolytic hole expansion component; 5: blanking and trimming component; 6: cleaning component; 7: clamping component; 21: elliptical ring plate; 22: support column; 23: high-precision stepping guide rail; 31: laser punching unit; 32: multi-directional bracket; 41: secondary lifting electrolytic hole expansion mechanism; 42: electrolytic support table; 43: electrolytic cell; 51: U-shaped limit table; 52: first support frame; 53: blanking lifting column; 54: blanking head; 61: second support frame; 62: positioning lifting column; 63: purge cleaning mechanism; 64: cleaning cell; 71: vertical sleeve; 72: slide bar; 73 : The first limit spring; 74: Clamping plate; 75: Alignment pressure plate; 76: Sliding rod; 77: Positioning vertical plate; 78: The second limit spring; 321: Lifting main rod; 322: Deflection unit; 323: Transverse plate; 324: Translation guide rail; 411: The first mounting table; 412: The first lifting rod; 413: Pushing plate; 414: Mechanical vibration unit; 415: Feed telescopic member; 416: High-frequency reciprocating displacement unit; 417: Hole expansion electrode; 431: Pool body; 432: Carrying tube; 433: Elastic silicone ring plate; 434: Intermittent liquid guide turbine; 511: Alignment through-strip groove; 512: Slag collecting groove. DETAILED DESCRIPTION

[0025] The following is a detailed description with reference to the accompanying drawings.

[0026] The present application provides a terahertz waveguide micro square hole integrated processing device, which includes a base plate platform 1, a transmission component 2, a pre-punching component 3, an electrolytic hole expansion component 4, a punching and trimming component 5, a cleaning component 6 and a clamping component 7.

[0027] according to Figure 1A specific embodiment is shown, in which several functional components that can work together are arranged in partitions on the bottom plate 1. The functional components process a micro square hole structure on the surface of the waveguide workpiece in a manner that can cooperate with each other to perform continuous multi-process processing on several waveguide workpieces. The functional components include a transmission component 2, a pre-punching component 3, an electrolytic hole expansion component 4, a punching and trimming component 5 and a cleaning component 6. On the high-precision stepping guide rail 23 of the transmission component 2, a plurality of clamping components 7 are installed at intervals in a manner that can locate a plurality of equally spaced workstations on the elliptical cyclic transmission path defined by it. The pre-punching component 3, the electrolytic hole expansion component 4, the punching and trimming component 5 and the cleaning component 6 are installed on the bottom plate 1 in a manner that is distributed in the same manner as the four adjacent clamping components 7, so that the waveguide workpiece clamped by the clamping component 7 completes the forming process of the micro square hole by following the transmission component 2 in an intermittent stepping movement. The transmission component 2 provided in the present application can drive several clamping components 7 to move synchronously and equidistantly, so that the waveguide workpieces respectively clamped by several clamping components 7 can continuously pass through multiple processing stations while simultaneously performing different processing, so as to realize high-quality and high-efficiency processing of the micro square holes of the waveguide workpiece. Compared with the punching equipment of a single station, the transmission component 2 provided in the present application greatly improves the processing efficiency and solves the problem of frequent disassembly and assembly of the waveguide workpiece for multi-process processing, so that the waveguide workpiece can follow the clamping component 7 for intermittent movement, thereby continuously completing multiple processing, improving the efficiency and quality of batch processing. The pre-punching component 3 provided in the present application can pre-process pre-punched holes on the surface of the waveguide workpiece according to the needs, so that the electrolytic products generated by the electrolytic hole expansion component 4 in the process of processing the micro square holes can be timely and fully discharged through the pre-punched holes, so as to ensure the electrolytic processing quality of the electrolytic hole expansion component 4, promote the forming effect and continuous processing stability of the electrolytic hole expansion treatment, avoid the electrolytic products from causing obstruction and short circuit to the electrolytic process, and improve the electrolytic processing efficiency. The electrolytic hole expansion component 4 provided in the present application can perform electrolytic hole expansion on the pre-punched hole processed by the pre-punching component 3, so that it can continuously and effectively complete the effective expansion of the pre-punched pre-punched hole, and because the existence of the pre-punched hole can ensure the timely and sufficient discharge of the electrolytic product, the electrolyte in the hole cavity can be updated in time and flow quickly, realizing the applicability of electrolytic processing for deep micro-hole processing, solving the problems of difficulty in discharging electrolytic products and difficulty in updating electrolyte in the existing electrolytic punching method, effectively improving the processing efficiency, and reducing the risk of passivation layer generation and electrode short circuit. The punching and trimming component 5 provided in the present application can efficiently and accurately punch and trim the micro square hole of the waveguide workpiece after the electrolytic hole expansion processing is completed, so that it can compensate for the forming defects of the square hole sharp angle that cannot be guaranteed and the poor shape accuracy when the electrolytic hole expansion component 4 is electrolytically processed, effectively obtaining micro square holes with high shape accuracy and good square hole corner quality, and further improving the processing quality of the micro square holes of the waveguide workpiece.The present application can effectively improve the forming quality and punching efficiency of micro square holes through the mutual cooperation of the pre-punching component 3, the electrolytic hole expansion component 4, and the punching and trimming component 5, wherein the pre-punching component 3 can improve the continuous working stability and effect of the electrolytic hole expansion component 4 by pre-drilling pre-punched holes, and the micro square holes processed by the electrolytic hole expansion component 4 reduce the cross-sectional size that needs to be punched and removed by the punching and trimming component 5. The punching and trimming component 5 only needs to complete the square hole corner cleaning, so that the punching and trimming component 5 can be effectively used in the punching processing of deep micro holes, so that the coordinated processing method of the three can greatly improve the processing quality and effect of the micro square holes.

[0028] like Figure 1 and Figure 2 As shown, the transmission assembly 2 includes an elliptical ring plate 21, a support column 22 and a high-precision stepping guide rail 23. Preferably, the elliptical ring plate 21 is supported on the base plate 1 by the support column 22. Further preferably, a high-precision stepping guide rail 23 capable of driving the clamping assembly 7 to intermittently translate at a fixed distance on the elliptical circular transmission path is provided on the outer surface of the elliptical ring plate 21. Preferably, a plurality of clamping assemblies 7 are arranged at intervals on the moving end of the high-precision stepping guide rail 23. Specifically, a plurality of moving blocks capable of directional movement in the track cavity are arranged at equal intervals in the track of the high-precision stepping guide rail 23, and the clamping assemblies 7 are installed on the moving blocks. The moving block sliding rail is connected to the track cavity, and can intermittently step along the circular closed track defined by the track cavity under the action of electric drive. The surface of the moving block is provided with a connecting side plate, so that the two vertical sleeves 71 of the clamping assembly 7 can be installed on the connecting side plate. Preferably, multiple moving blocks are arranged at equal intervals in the track cavity, and multiple moving blocks are intermittently stepped at the same frequency, so that several clamping assemblies 7 are synchronously intermittently stepped at equal intervals, realizing synchronous displacement of several clamping assemblies 7, and realizing that a single clamping assembly 7 passes through the pre-punching station, electrolytic hole expansion station, punching and corner cleaning station and cleaning station in sequence in a manner with intermittent stagnation periods, and the clamping assembly 7 can further follow the moving block back to the initial disassembly and assembly station, so as to facilitate the operator to dismantle the waveguide workpiece after the micro square hole forming process and load the waveguide workpiece to be processed, and then the moving block again pulls the clamping assembly 7 to pass through the aforementioned stations in sequence, realizing reciprocating connection processing, improving the continuity of processing and the overall processing efficiency, eliminating the time consumption of existing equipment that needs to be stopped to disassemble and assemble waveguide workpieces, and avoiding the problem that the existing equipment can only complete the processing of a single waveguide workpiece at a time and has a large amount of downtime. In particular, multiple waveguide workpieces are processed synchronously and classified to achieve batch continuous drilling processing. The simultaneous phased implementation of multiple processes effectively shortens the overall processing cycle and achieves uninterrupted processing of batch waveguide workpieces.

[0029] Preferably, the laser drilling unit 31 of the pre-drilling assembly 3 arranged upstream of the electrolytic hole expansion assembly 4 is installed on the bottom plate platform 1 through a multi-directional bracket 32 ​​that can drive it to move in multiple directions. Preferably, the multi-directional bracket 32 ​​can adjust the relative position between the laser drilling unit 31 and the waveguide workpiece in the pre-drilling station, so as to facilitate the drilling of different points of different waveguide workpieces. Further preferably, the multi-directional bracket 32 ​​includes a lifting main rod 321 supported on the bottom plate platform 1, a deflection unit 322 installed at the axial upper end of the lifting main rod 321, a transverse plate 323 connected to the output end of the deflection unit 322, and a translation guide rail 324 installed on the transverse plate 323. Specifically, the lower surface of the translation guide rail 324 is connected to the laser drilling unit 31. Preferably, a first residue collection tank below the pre-drilling station is also provided on the bottom plate platform 1. Preferably, a balancing weight is also provided on the side of the transverse plate 323 away from the translation guide rail 324. The multi-directional bracket 32 ​​provided in the present application can drive the laser drilling unit 31 to perform three-dimensional positioning above the waveguide workpiece at the pre-drilling station, so that the laser drilling unit 31 composed of multiple laser modules can simultaneously emit multiple groups of high-energy beams, so that the high-energy beams melt and evaporate the material at specific points of the waveguide workpiece through the photothermal effect, so that the surface of the waveguide workpiece is processed with pre-punched holes that are convenient for subsequent square hole forming processing.

[0030] like Figure 3As shown, the electrolytic hole expansion assembly 4 includes a secondary lifting electrolytic hole expansion mechanism 41, an electrolytic support platform 42 and an electrolytic cell 43. Preferably, the electrolytic support platform 42 is detachably mounted on the bottom plate platform 1. Further preferably, the lower surface of the electrolytic support platform 42 is connected with a secondary lifting electrolytic hole expansion mechanism 41 capable of defining an electrolytic hole expansion station. Further preferably, an electrolytic cell 43 located on the bottom plate platform 1 is provided directly below the secondary lifting electrolytic hole expansion mechanism 41. Specifically, the secondary lifting electrolytic hole expansion mechanism 41 can adjustably drive the clamping assembly 7 at the electrolytic hole expansion station to rise and fall, so that the waveguide workpiece clamped by the clamping assembly 7 is immersed in the electrolytic cell 43 under the push of the secondary lifting electrolytic hole expansion mechanism 41, and the secondary lifting electrolytic hole expansion mechanism 41 can complete the hole expansion processing of the waveguide workpiece that has been pre-drilled by synchronously controlling the micro-vibration of the waveguide workpiece and the progressive reciprocating displacement of the hole expansion electrode 417. The secondary lifting electrolytic hole expansion mechanism 41 provided in the present application can controllably position the waveguide workpiece clamped by the clamping assembly 7 in the electrolyte of the electrolytic cell 43, so that the negative electrode array defined by the secondary lifting electrolytic hole expansion mechanism 41 can cooperate with the anode formed by the waveguide workpiece to perform pre-perforated hole expansion processing in the electrolyte, so that the cylindrical pre-perforated hole can form a micro square hole by electrolytic hole expansion. The secondary lifting electrolytic hole expansion mechanism 41 can also control the clamping assembly 7 and the waveguide workpiece to vibrate continuously while pushing down the clamping assembly 7, so that the vertical micro-vibration of the waveguide workpiece can cooperate with the progressive reciprocating displacement of the hole expansion electrode 417 to promote the discharge of the electrolytic product, thereby ensuring the continuous workability and efficiency of the electrolytic hole expansion. Compared with other processing methods, the electrolytic hole expansion assembly 4 provided in the present application has the advantages of good surface quality, no tool electrode loss, no processing stress, etc., and can process micro square holes of specific specifications.

[0031] Preferably, the first mounting plate 411 of the secondary lifting electrolytic hole expansion mechanism 41 is installed on the electrolytic support platform 42 through the first lifting rod 412. Further preferably, a push plate 413 is provided on the lower surface of the first mounting plate 411. Preferably, a mechanical vibration unit 414 is installed on the lower edge of the push plate 413, which can abut against the surface of the clamping assembly 7 and drive the clamping assembly 7 and the waveguide workpiece clamped therein to vibrate vertically slightly. Preferably, a coaxially connected feed telescopic member 415, a high-frequency reciprocating displacement unit 416 and a hole expansion electrode 417 are also provided on the lower surface of the first mounting plate 411. Specifically, the feed telescopic member 415 is connected to the lower surface of the first mounting plate 411 in such a way that its axis is parallel to the first lifting rod 412. Preferably, the axial lower end of the feed telescopic member 415 is provided with a high-frequency reciprocating displacement unit 416 capable of driving the hole expansion electrode 417 to perform vertical reciprocating lifting and lowering movement, so as to realize the progressive reciprocating displacement of the hole expansion electrode 417 during the continuous downward extension of the feed telescopic member 415, so as to realize the periodic insertion of the hole expansion electrode 417 into the pre-punched hole of the waveguide workpiece, and to penetrate into the pre-punched hole by gradually increasing the insertion length, thereby completing the hole expansion processing of the pre-punched hole. Preferably, the feed telescopic member 415 can adopt the existing high-precision translation rails, high-precision hydraulic rods, high-precision threaded telescopic rods and other translation positioning structures with a small unit translation amount. Preferably, the high-frequency reciprocating displacement unit 416 can adopt a reciprocating translation screw slider structure or a cam push rod module involved in a cam piston pump. The first lifting rod 412 provided in the present application can push down the clamping assembly 7 through the push plate 413 installed on the first mounting plate 411, so that the clamping plate 74 of the stretched clamping assembly 7 and the waveguide workpiece can be immersed in the electrolyte in the electrolytic cell 43. The secondary lifting electrolytic hole expansion mechanism 41 is in contact with the clamping plate 74 through the mechanical vibration unit 414, so that the secondary lifting electrolytic hole expansion mechanism 41 can drive the mechanical vibration unit 414 to work according to demand, so as to realize the vertical micro-vibration of the clamping plate 74 and the waveguide workpiece. At the same time, the hole expansion electrode 417 with an array of square cylindrical electrodes is against the upper surface of the waveguide workpiece under the displacement adjustment of the feeding telescopic member 415, and is coaxial with the pre-punched hole, so that the hole expansion electrode 417 can be reciprocated and lifted under the drive of the high-frequency reciprocating displacement unit 416, so that the hole expansion electrode 417 can form an electrolytic pulse through jumping motion, thereby expanding the pre-punched hole. While the hole-expanding electrode 417 is driven by the high-frequency reciprocating displacement unit 416 to reciprocate and rise, the feeding telescopic member 415 can continue to extend, so that the hole-expanding electrode 417 can gradually penetrate into the pre-punched hole during the electrolytic hole-expanding process, thereby realizing progressive hole-expanding processing of deep microporous pre-punched holes.The mechanical vibration unit 414 and the high-frequency reciprocating displacement unit 416 provided in the present application can respectively realize the vertical micro-vibration of the positive electrode and the jumping movement of the negative electrode, so that the continuous relative insertion movement of the waveguide workpiece and the hole expansion electrode 417 can accelerate the discharge of the electrolytic products in the hole cavity and the renewal of the electrolyte, and further enhance the discharge effect of the electrolytic products and the renewal effect of the electrolyte on the basis of the pre-constructed conductive pre-punching, further improve the forming quality, quality and processing stability of the electrolytic processing, ensure the efficiency and quality of continuous electrolytic processing, and avoid the disadvantages of the existing electrolytic drilling structure, such as the difficulty in discharging the electrolytic products and the poor flow of the electrolyte in the micropores.

[0032] Preferably, the electrolysis support platform 42 may be an inverted L-shaped plate structure, which is fixedly mounted on the base platform 1 so as to define a mounting plane above the conveying assembly 2 .

[0033] Preferably, a bearing cylinder 432 capable of supporting the clamping assembly 7 pushed down by the secondary lifting electrolytic hole-expanding mechanism 41 is provided in the cell body 431 of the electrolytic cell 43. Preferably, an elastic silicone ring plate 433 capable of contacting with the clamping assembly 7 and buffering the vertical micro-vibration forced to occur by the clamping assembly 7 is provided on the upper end surface of the bearing cylinder 432. Preferably, an intermittent liquid-guiding turbine 434 capable of periodically driving the electrolyte in the cell body 431 into its cylinder cavity is also embedded on the side of the bearing cylinder 432, so that the electrolyte entering the cylinder cavity can overflow from the pre-punched hole of the waveguide workpiece clamped by the clamping assembly 7 against the elastic silicone ring plate 433 and be discharged, thereby effectively and timely discharging the electrolytic products generated when the pre-punched hole is expanded, further improving the discharge of the electrolytic products and the renewal of the electrolyte, and avoiding the clogging of the pre-punched hole by the electrolytic products.

[0034] like Figure 4As shown, the blanking and trimming assembly 5 includes a U-shaped limit platform 51, a first support frame 52, a blanking lifting column 53 and a blanking head 54. Preferably, the blanking head 54 is mounted on the first support frame 52 through the blanking lifting column 53. Further preferably, a U-shaped limit platform 51 capable of providing position-limiting support for the clamping assembly 7 moved to the blanking and trimming station is also provided below the blanking head 54. Specifically, the first support frame 52 and the U-shaped limit platform 51 are both installed on the base plate 1. Preferably, a positioning through-strip groove 511 capable of providing position-limiting support for the clamping plate 74 is provided on the two facing side wall surfaces of the U-shaped limit platform 51. Further preferably, a slag collecting groove 512 is also provided on the inner bottom surface of the U-shaped limit platform 51. The U-shaped limit platform 51 provided in the present application can provide effective support force for the clamping plate 74 by means of limit support, so as to ensure that the punching head 54 can accurately locate the micro square hole of the waveguide workpiece, and realize effective and high-quality corner clearing punching processing of the micro square hole. The punching head 54 provided in the present application has a punching column arranged in an array, which is convenient for synchronous corner clearing processing of a plurality of micro square holes arranged in an array on the waveguide workpiece.

[0035] Preferably, a positioning lifting column 62 is provided on the second support frame 61 of the cleaning assembly 6, so that the positioning lifting column 62 can immerse the waveguide workpiece into the cleaning tank 64 by pushing down the clamping assembly 7. Preferably, a purge cleaning mechanism 63 capable of blowing and dehumidifying the waveguide workpiece that is returned from the cleaning tank 64 is also installed on the positioning lifting column 62. Preferably, the second support frame 61 and the cleaning tank 64 are both installed on the base plate 1. Specifically, the cleaning tank 64 is located directly below the second support frame 61, so as to receive the descending clamping assembly 7 and the waveguide workpiece to be cleaned. Preferably, the purge cleaning mechanism 63 can be an inert gas purge device with a planar exhaust structure, which can controllably spray inert gas in a directional manner according to demand, thereby removing the cleaning liquid on the surface of the waveguide workpiece. The cleaning component 6 provided in the present application can clean the waveguide workpiece that has completed the micro square hole processing and is in the cleaning station by liquid cleaning and air blowing cleaning, which effectively improves the cleanliness of the waveguide workpiece, avoids processing debris and residues from falling everywhere, and greatly improves the output quality.

[0036] like Figure 5 and Figure 6As shown, the vertical sleeve 71 of the clamping assembly 7 is connected to the same moving end of the high-precision stepping guide rail 23. Preferably, a slide bar 72 is slidably inserted in the vertical sleeve 71. Further preferably, a first limit spring 73 capable of limiting the initial axial relative position of the two is provided between the slide bar 72 and the vertical sleeve 71. Preferably, a clamping plate 74 carrying a waveguide workpiece is connected to the axial lower end of the slide bar 72. Further preferably, two alignment pressure plates 75 are provided on the clamping plate 74 to assist in limiting the position of the waveguide workpiece on the clamping plate 74. Preferably, a sliding pull rod 76 is connected to the opposite sides of the two alignment pressure plates 75. The sliding pull rod 76 is slidably inserted on the positioning vertical plate 77. Specifically, the positioning vertical plate 77 is supported on the clamping plate 74. Preferably, a second limit spring 78 capable of limiting the position of the alignment pressure plate 75 on the clamping plate 74 is also sleeved on the sliding pull rod 76. Preferably, the plate body of the clamping plate 74 is provided with a step-through groove that can position and place the waveguide workpiece and can expose part of the lower surface of the waveguide workpiece. Preferably, the top surface of the plate body of the clamping plate 74 is provided with two sliding rail grooves that can slide and connect the positioning pressure plate 75. Further preferably, the clamping plate 74 can be replaced according to the size specifications of the waveguide workpiece actually processed, and the clamping plate 74 with step-through grooves of different specifications is adaptively selected. Preferably, the positioning pressure plate 75 includes a slider head and a limit pressure plate inserted in the sliding rail groove. Further preferably, the two limit pressure plates are provided with downward positioning inclined surfaces on the opposite sides, that is, the cross-section of the limit pressure plate is trapezoidal. The present application sets a vertical sleeve 71, a slide rod 72 and a first limit spring 73, so that the clamping plate 74 can be passively moved downward at different processing stations, so that the waveguide workpiece can effectively complete the forming processing of the micro square hole at different positions, thereby improving the processing efficiency and quality.

[0037] The present invention is not limited to the above optional implementation modes. Anyone can derive other various forms of products under the enlightenment of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that fall within the scope of the claims of the present invention fall within the protection scope of the present invention. Those skilled in the art should understand that the specification of the present invention and its drawings are illustrative and do not constitute limitations on the claims. The scope of protection of the present invention is defined by the claims and their equivalents. Throughout the text, the features guided by "preferably" are only an optional method and should not be understood as having to be set. Therefore, the applicant reserves the right to abandon or delete the relevant preferred features at any time.

Claims

1. A terahertz waveguide micro square hole integral processing device, comprising a base plate (1) capable of accommodating a plurality of functional components, characterized in that: The functional components process micro square holes on the surface of the waveguide workpiece in a manner that can cooperate with each other to perform continuous multi-step processing on a plurality of waveguide workpieces. The functional components include a transmission component (2), a pre-punching component (3), an electrolytic hole expansion component (4), a punching and trimming component (5) and a cleaning component (6), wherein: Clamping assemblies (7) are installed at intervals on the high-precision stepping guide rail (23) of the conveying assembly (2) in such a manner that a plurality of equally spaced workstations can be positioned on the cyclic conveying path defined by the clamping assemblies (7); The punching and corner trimming component (5) is capable of punching and corner trimming the micro square hole of the waveguide workpiece after the electrolytic hole expansion process, so as to compensate for the forming defects existing when the electrolytic hole expansion component (4) is subjected to electrolytic processing; The pre-punching assembly (3), the electrolytic hole expansion assembly (4), the punching and trimming assembly (5) and the cleaning assembly (6) are installed on the base plate platform (1) in a manner of being distributed in the same manner as the four adjacent clamping assemblies (7), so that the waveguide workpiece clamped by the clamping assembly (7) can complete the micro square hole forming process by following the transmission assembly (2) in an intermittent stepping movement; The punching head (54) of the punching and trimming assembly (5) is mounted on the first support frame (52) via a punching lifting column (53), and the punching head (54) has punching columns arranged in an array and capable of synchronously trimming the corners of a plurality of micro square holes on a waveguide workpiece, and a U-shaped limiting platform (51) capable of providing limiting support for the clamping assembly (7) moved to a punching and trimming station is also provided below the punching head (54); Two opposing side wall surfaces of the U-shaped limiting platform (51) are provided with alignment through-strip grooves (511) capable of providing limiting support for the clamping plate (74), and a slag collecting groove (512) is also provided on the inner bottom surface of the U-shaped limiting platform (51).

2. The terahertz waveguide micro square hole integral processing device according to claim 1, characterized in that: The electrolytic hole expansion assembly (4) comprises a two-stage lifting electrolytic hole expansion mechanism (41), an electrolytic support platform (42) and an electrolytic cell (43), wherein: The electrolysis support platform (42) is detachably mounted on the bottom plate platform (1), and the lower surface of the electrolysis support platform (42) is connected to the secondary lifting electrolysis hole expansion mechanism (41) capable of defining an electrolysis hole expansion station, and the electrolysis cell (43) located on the bottom plate platform (1) is arranged directly below the secondary lifting electrolysis hole expansion mechanism (41); The secondary lifting electrolytic hole expansion mechanism (41) can adjustably drive the clamping assembly (7) at the electrolytic hole expansion station to rise and fall, so that the waveguide workpiece clamped by the clamping assembly (7) is immersed in the electrolytic cell (43) under the push of the secondary lifting electrolytic hole expansion mechanism (41), and the secondary lifting electrolytic hole expansion mechanism (41) can complete the hole expansion process by synchronously controlling the micro-vibration of the waveguide workpiece and the progressive reciprocating displacement of the hole expansion electrode (417).

3. The terahertz waveguide micro square hole integral processing device according to claim 2, characterized in that: The first mounting plate (411) of the secondary lifting electrolytic hole expansion mechanism (41) is mounted on the electrolytic support platform (42) via a first lifting rod (412), and a push plate (413) is provided on the lower surface of the first mounting plate (411), and a mechanical vibration unit (414) is installed on the lower edge of the push plate (413) that can abut against the surface of the clamping assembly (7) and drive the clamping assembly (7) and the waveguide workpiece clamped therein to vibrate vertically in a slight amplitude; A coaxially connected feeding telescopic member (415), a high-frequency reciprocating displacement unit (416) and a hole-expanding electrode (417) are also provided on the lower surface of the first mounting platform (411).

4. The terahertz waveguide micro square hole integral processing device according to claim 3, characterized in that: A supporting cylinder (432) capable of supporting the clamping assembly (7) pushed down by the secondary lifting electrolytic hole expansion mechanism (41) is arranged in the cell body (431) of the electrolytic cell (43). An elastic silicone ring plate (433) is provided on the upper end surface of the supporting tube (432) and is capable of contacting the clamping assembly (7) and buffering the vertical micro-vibration of the clamping assembly (7). An intermittent liquid-conducting turbine (434) is also embedded on the side of the supporting tube (432) and is capable of periodically driving the electrolyte in the cell body (431) to enter its tube cavity.

5. The terahertz waveguide micro square hole integral processing device according to claim 4, characterized in that: The transmission assembly (2) comprises an elliptical ring plate (21), a support column (22) and a high-precision stepping guide rail (23), wherein: The elliptical ring plate (21) is supported on the base plate platform (1) via a support column (22), and the high-precision stepping guide rail (23) is provided on the outer side surface of the elliptical ring plate (21); a plurality of the clamping assemblies (7) corresponding to the moving ends thereof are arranged at intervals on the high-precision stepping guide rail (23).

6. The terahertz waveguide micro square hole integral processing device according to claim 5, characterized in that: The two vertical sleeves (71) of the clamping assembly (7) are connected to the same movable end of the high-precision stepping guide rail (23), a sliding rod (72) is slidably inserted in the vertical sleeve (71), and a first limit spring (73) capable of limiting the initial axial relative position of the two is provided between the sliding rod (72) and the vertical sleeve (71); The axial lower end of the slide rod (72) is connected to a clamping plate (74) that carries a waveguide workpiece, and the clamping plate (74) is provided with two alignment pressing plates (75) that assist in limiting the position of the waveguide workpiece on the clamping plate (74).

7. The terahertz waveguide micro square hole integral processing device according to claim 6, characterized in that: The laser punching unit (31) of the pre-punching assembly (3) is mounted on the base plate platform (1) via a multi-directional bracket (32) capable of driving the laser punching unit to move in multiple directions.

8. The terahertz waveguide micro square hole integral processing device according to claim 7, characterized in that: A positioning lifting column (62) is arranged on the second support frame (61) of the cleaning component (6), so that the positioning lifting column (62) can immerse the waveguide workpiece into the cleaning tank (64) by pushing down the clamping component (7); and a blowing and cleaning mechanism (63) is also installed on the positioning lifting column (62) for blowing and dehumidifying the waveguide workpiece that is moved upward out of the cleaning tank (64).

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