Heat transfer structure and electronic equipment

CN119233522APending Publication Date: 2024-12-31INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202411195105.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-28
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

The lugs and installation holes of the heat transfer block in the existing server occupy the PCB layout space, affecting the layout and wiring of other components, resulting in a low PCB utilization rate.

Method used

Passively fitted heat transfer structure is adopted, and the heat transfer assembly is made close to the surface of the components by elastically pressing the assembly, canceling the connection structure and installation holes between the heat transfer block and the main board, and using a liquid-cooled plate for heat dissipation.

Benefits of technology

It reduces the space occupied by heat transfer components, improves the utilization rate of component layout and wiring space of the motherboard, simplifies the manufacturing and assembly process, and improves the assembly efficiency of the entire machine.

✦ Generated by Eureka AI based on patent content.

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    Figure CN119233522A_ABST
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Abstract

The invention discloses a heat transfer structure and electronic equipment, and the heat transfer structure comprises a first component which is disposed on a mainboard; the heat transfer assembly is located on the first component; a heat sink; one end of the heat transfer component is connected with the heat transfer assembly, and the other end of the heat transfer component is connected with the radiator; one end of the elastic pressing assembly is connected with the radiator, and the other end of the elastic pressing assembly presses the heat transfer assembly, so that the bottom of the heat transfer assembly is tightly attached to the surface of the first component. The heat transfer structure provided by the embodiment of the invention is a passive fitting heat transfer structure, the heat transfer assembly does not need to be connected with the main board through a connecting structure, and a corresponding mounting hole does not need to be formed in the main board, so that more space is provided for other components and wiring on the main board, more components can be arranged on the main board, and the heat transfer efficiency is improved. Therefore, the utilization rate of the mainboard is improved.
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