Cooling system

By introducing cold plates, radiators and heat exchangers into the cooling system and using heat exchangers for heat exchange, the problem of insufficient cooling performance of the existing cooling system is solved, and a more efficient heat source cooling effect is achieved.

CN119233593APending Publication Date: 2024-12-31NIDEC CORP(JP)
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Patent Information

Application Number
CN202410834736.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-06-30
Filing Date
2024-06-26
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

The existing cooling system lacks cooling performance when cooling the heat source, making it difficult to effectively improve the cooling efficiency of the heat source.

Method used

A cooling system is adopted, including a cold plate, a radiator and a heat exchanger. The cold plate is in heat contact with the heat source. The first refrigerant flows inside the cold plate, the radiator comes into contact with the air in the frame, and the second refrigerant is in heat dissipation. The device flows inside, and heat exchanges between the first refrigerant flowing out of the cold plate and the second refrigerant flowing out of the radiator through the heat exchanger to improve cooling efficiency.

Benefits of technology

Through this system, cooling performance is significantly improved, and heat sources can be cooled more effectively and air cooling performance in the rack can be improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The cooling system cools a heat source within the rack. The cooling system is provided with: a cold plate which is in thermal contact with a heat source and through which a first refrigerant flows; a radiator which is in contact with air in the rack and in which a second refrigerant different from the first refrigerant flows; and a heat exchanger that exchanges heat between the first refrigerant flowing out from the cold plate and the second refrigerant.
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Description

Technical Field

[0001] The present disclosure relates to a cooling system. Background Art

[0002] In a rack of the background art, a system for cooling electronic equipment as a heat source is provided. The system includes a radiator in the rear door of the rack. A plurality of fans are provided on the exhaust side of the radiator. In addition, a plurality of heat pipes are provided on the intake side of the radiator. Since the heat distribution is smoothed by the heat pipe, the reduction in cooling capacity caused by local heat concentration is suppressed (for example, see Patent Document 1).

[0003] Patent Literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2012-118781 Summary of the invention

[0005] Such systems require further improvement in cooling performance (ie, performance of cooling a heat source).

[0006] An object of the present disclosure is to provide a cooling system with improved cooling performance.

[0007] One aspect of the present disclosure relates to a cooling system for cooling a heat source in a rack. The cooling system includes a cold plate, a radiator, and a heat exchanger. The cold plate is in thermal contact with the heat source. A first refrigerant flows inside the cold plate. The radiator is in contact with air in the rack. A second refrigerant different from the first refrigerant flows inside the radiator. The system includes a radiator and a heat exchanger, and the heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant.

[0008] Another aspect of the present disclosure relates to a cooling system for cooling a heat source in a rack. The cooling system includes a cold plate and a radiator. The cold plate is in thermal contact with the heat source. A first refrigerant flows inside the cold plate. The radiator is in contact with air in the rack. The first refrigerant flowing out of the cold plate flows inside the radiator.

[0009] According to the present disclosure, the cooling performance of the cooling system is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a diagram showing a cooling system and a cooling device according to the first embodiment. Figure 2 Observed from the first direction Figure 1 A plan view of the cooling system and racks is shown. Figure 3 It is shown Figure 1A diagram showing the detailed structure of the rear door and radiator. Figure 4 It is shown Figure 1 The detailed structure of the cooling system is shown in the figure. Figure 5 It is a diagram showing a detailed configuration of a cooling system according to a modified example of the first embodiment. Figure 6 It is a diagram showing a detailed configuration of a cooling system according to a second embodiment. Figure 7 It is a diagram showing a detailed configuration of a cooling system according to a modified example of the second embodiment. Figure 8 It is a diagram showing a detailed configuration of a cooling system according to another modified example of the second embodiment. Fig. 9 It is a diagram showing a first configuration example of a first flow path connecting a radiator and a heat exchanger. Fig.10 It is a diagram showing a second configuration example of the first flow path connecting the radiator and the heat exchanger. DETAILED DESCRIPTION

[0011] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the drawings, the same reference numerals are given to the same or corresponding parts, and the description thereof will not be repeated.

[0012] In each embodiment, for easy understanding, the mutually intersecting first direction Z, second direction X, and third direction Y are appropriately used. In each embodiment, the term "intersecting" includes lines, planes, or lines and planes intersecting at right angles, and intersecting at non-right angles within a range of slight differences including tolerances and errors.

[0013] The first direction Z, the second direction X, and the third direction Y are arranged in a direction of the rack 300 (see Figure 1 ) is defined with reference to a state in which the rack 300 is set on the setting surface P01 in a usable manner (hereinafter referred to as the "use state"). In detail, the first direction Z is a direction intersecting the setting surface P01, and is the up-down direction of the rack 300 in the use state. The second direction X is a direction intersecting the front opening 314 and the rear opening 315 formed in the rack 300, and is the front-to-back direction of the rack 300. The third direction Y is a direction intersecting each of the first direction Z and the second direction X, and is the left-right direction when facing the front opening 314. However, the first direction Z, the second direction X, and the third direction Y are defined only for the convenience of explanation.

[0014] In addition, one side and the other side of the first direction Z are respectively recorded as the first direction one side Z1 and the first direction other side Z2. In detail, the first direction one side Z1 is the top, and the first direction other side Z2 is the bottom. One side and the other side of the second direction X are respectively recorded as the second direction one side X1 and the second direction other side X2. The second direction one side X1 is the front, and the second direction other side X2 is the rear. One side and the other side of the third direction Y are respectively recorded as the third direction one side Y1 and the third direction other side Y2. The third direction one side Y1 is the left, and the third direction other side Y2 is the right.

[0015] Figure 1 1 is a diagram showing a cooling system 100 and a cooling device 200 according to the first embodiment. Figure 2 is observed from the first direction Z1 Figure 1 The top view of the cooling system 100 and the rack 300 is shown. In addition, for ease of understanding, Figure 2 Only a portion of the cooling system 100 is shown.

[0016] like Figure 1 and 2 As shown, the cooling system 100 is usually installed in a space A01 such as a server room. Specifically, the cooling system 100 is set in a rack 300. The rack 300 has at least a frame 310 and a rear door 320. The frame 310 defines a space A02. A plurality of heat sources 400 (see Figure 1 ). In detail, the plurality of heat sources 400 are stored in the space A02 in a manner of being arranged along the first direction Z. However, this is not limited to this, and the plurality of heat sources 400 may also be stored in a manner of being arranged in the third direction Y. In addition, the number of heat sources 400 is not limited to a plurality, and may also be one.

[0017] The heat source 400 is an electronic device such as a rack server or a blade server, and includes at least one of a first heat source 401 and a second heat source 402. In an embodiment, the heat source 400 includes both the first heat source 401 and the second heat source 402. The first heat source 401 and the second heat source 402 are respectively operated by power supply and generate heat. The first heat source 401 generates more heat than the second heat source 402, and is, for example, a central processing unit (so-called CPU), an electrolytic capacitor, or a power semiconductor module. The second heat source 402 is, for example, a transistor or a diode. In addition, the electronic device may also be a projector, a personal computer, or a display.

[0018] In the present embodiment, the frame body 310 has, for example, a bottom wall 311, a top wall 312, and a pair of side walls 313A and 313B. The outer shapes of the bottom wall 311 and the top wall 312 are identical rectangles when viewed from above in the first direction Z. The bottom wall 311 and the top wall 312 are separated from each other in the first direction Z. The side wall 313A is located between the end of the bottom wall 311 on one side Y1 in the third direction and the end of the top wall 312 on one side Y1 in the third direction, connecting the bottom wall 311 and the top wall 312 to each other. The side wall 313B is located between the end of the bottom wall 311 on the other side Y2 in the third direction and the end of the top wall 312 on the other side Y2 in the third direction, connecting the bottom wall 311 and the top wall 312 to each other. In addition, in Figure 1 In order to illustrate the interior of the space A02, only a portion of the side wall 313B is shown.

[0019] like Figure 1 and 2 As shown, the frame 310 has a front opening 314 and a rear opening 315. The front opening 314 and the rear opening 315 are spaces surrounded by the front end 316 and the rear end 317 of the frame 310, respectively. The space A02 is opened toward one side X1 of the second direction and the other side X2 of the second direction through the front opening 314 and the rear opening 315, respectively. In addition, the rear opening 315 is an example of an "opening" disclosed in the present invention.

[0020] The rear door 320 is provided with the radiator 11. The rear door 320 rotates around the rotation axis 321 in the circumferential direction θ of the rotation axis 321 (see Figure 2 ). Thus, the rear door 320 opens and closes the rear opening 315. In the embodiment, the rotation axis 321 extends along the first direction Z. However, not limited thereto, the rotation axis 321 may extend along the second direction X. Specifically, the rear door 320 is installed at or near the rear end 317 so that the rear door 320 can be in the closed position P11 (refer to Figure 2 ) rotates along the circumferential direction θ between the open position P12.

[0021] exist Figure 2 , the rear door 320 in the closed position P11 is shown by a solid line. On the other hand, the rear door 320 in the open position P12 is shown by a dotted line. When in the closed position P11, the front end 322 of the rear door 320 abuts against the rear end 317. The front end 322 is the front end of the rear door 320 from the rotating shaft 321 to the centrifugal direction φ1 of the rotating shaft 321. The centrifugal direction φ1 is a direction away from the rotating shaft 321 in the radial direction φ of the rotating shaft 321. In addition, the centripetal direction φ2 is opposite to the centrifugal direction φ1. When in the open position P12, the front end 322 of the rear door 320 is away from the rear end 317 on one side of the circumferential direction θ, that is, on the one circumferential side θ1. The other circumferential direction θ2 is opposite to the one circumferential side θ1.

[0022] Cooling device 200 (see Figure 1) is set outside the space A01, for example. In addition, the cooling device 200 can be set either indoors or inside the house. The cooling device 200 is, for example, a cooler or a cooling tower. The cooling device 200 includes ports 210 and 220 for the primary refrigerant, a cooling unit 240, and a pump 250.

[0023] The primary refrigerant is, for example, a cooling liquid. Examples of the cooling liquid include antifreeze liquid and pure water. Typical examples of antifreeze liquid are ethylene glycol aqueous solution or propylene glycol aqueous solution. In addition, the primary refrigerant may also be a gas refrigerant. In addition, the primary refrigerant is an example of the "second refrigerant" of the present disclosure.

[0024] In the present embodiment, ports 210 and 220 are the inlet and outlet of the primary refrigerant. The primary refrigerant flowing into port 210 flows into cooling section 240 through the flow path. Cooling section 240 cools the primary refrigerant flowing into cooling section 240. The cooling method in cooling section 240 may be either air cooling or water cooling. The primary refrigerant flowing out of cooling section 240 flows into pump 250 through the flow path. Pump 250 presses the primary refrigerant flowing into pump 250 to port 220. Figure 1 In the embodiment, the pump 250 is located between the cooling portion 240 and the port 220 in the flow path of the primary refrigerant. However, the pump 250 may be located between the port 210 and the cooling portion 240 in the flow path of the primary refrigerant.

[0025] The cooling system 100 cools the heat source 400 in the rack 300. The cooling system 100 includes a radiator 11, a fan 12, a CDU 13, a distribution manifold 14, a collection manifold 15, and a cold plate 16. The radiator 11 and the fan 12 are mounted on the rear door 320. The CDU 13, the distribution manifold 14, and the collection manifold 15 are preferably disposed in the frame 310 of the rack 300. However, the present invention is not limited thereto, and the CDU 13, the distribution manifold 14, and the collection manifold 15 may also be disposed outside the frame 310. The cold plate 16 is disposed so as to be in thermal contact with the first heat source 401.

[0026] Figure 3 It is shown Figure 1 The detailed structure of the rear door 320 and the radiator 11 is shown in FIG. Figure 3 As shown, the radiator 11 is built in the rear door 320. Specifically, the rear door 320 is provided with a hole 323 that penetrates the rear door 320 in a direction D01 intersecting the radial direction φ (hereinafter referred to as “intersecting direction”).

[0027] The radiator 11 is in contact with the air (high temperature) in the rack 300. A primary refrigerant (low temperature) different from a secondary refrigerant flows inside the radiator 11. Thus, the radiator 11 cools the air in the rack 300. Here, the air in the rack 300 also includes the air exhausted from the rack 300 by the operation of the fan 12 (described in detail later).

[0028] Specifically, the radiator 11 includes ports 111 and 112 for the primary refrigerant, a flow path 113 , and a plurality of fins 114 .

[0029] In this embodiment, the ports 111 and 112 are the inlet and outlet of the primary refrigerant. The port 111 is connected to the port 220 (see Figure 1 ) is connected. Port 112 is connected to port 131 through a flow path. Flow path 113 is a pipe provided in hole 323. Flow path 113 is made of a material having a relatively high thermal conductivity (e.g., copper or aluminum). Flow path 113 connects ports 111 and 112 to each other to allow primary refrigerant to flow therebetween. In detail, flow path 113 has common flow paths 1131, 1132 and a plurality of branch flow paths 1133.

[0030] The common flow path 1131 extends, for example, along an end portion of one direction Z1 of the first direction of the rear door 320. The common flow path 1132 extends, for example, along an end portion of the other direction Z2 of the first direction of the rear door 320. The plurality of branch flow paths 1133 extend along the first direction Z between the common flow paths 1131 and 1132, respectively. In addition, two branch flow paths 1133 adjacent to each other in the radial direction φ among the plurality of branch flow paths 1133 are arranged at intervals in the radial direction φ.

[0031] The plurality of fins 114 are each made of a thin metal plate or the like into a corrugated shape, for example. The plurality of fins 114 are arranged at intervals in the first direction Z and are in physical contact with the plurality of branch flow paths 1133. In addition, each fin 114 and the plurality of branch flow paths 1133 define a ventilation path 115 that passes through in the intersecting direction D01. Air flows through the plurality of ventilation paths 115.

[0032] In addition, Figure 3 In the diagram, only two branch flow paths are labeled with reference symbol "1133". Only one fin is labeled with reference symbol "114". Only one ventilation path is labeled with reference symbol "115".

[0033] The primary refrigerant flowing into the port 111 flows through the common flow path 1131 . Then, the primary refrigerant flows through each branch flow path 1133 and flows into the common flow path 1132 . Then, the primary refrigerant flows through the common flow path 1132 and flows out from the port 112 .

[0034] The fan 12 is, for example, an axial flow fan, and is installed on the rear door 320. The fan 12 rotates the impeller of the fan 12 under the control of the control unit 139. As a result, the fan 12 generates an airflow through the ventilation path 115 (i.e., the radiator 11). That is, the fan 12 discharges the air in the frame 310 to the outside of the frame 310 through the ventilation path 115. As a result, the heat filled in the frame 310 due to the first heat source 401 and the second heat source 402 moves to the outside of the frame 310. As a result, the first heat source 401 and the second heat source 402 are air-cooled. The performance of the radiator 11 in cooling the air in the rack 300 by the fan 12 is improved compared to the case where there is no fan 12. In detail, the airflow passes through a plurality of branch flow paths 1133 of the radiator 11. That is, through the action of the fan 12, the air (high temperature) in the rack 300 contacts the radiator 11.

[0035] In addition, the fan 12 may be installed in a portion other than the rear door 320 of the housing 310. The fan 12 may be installed in the housing 310. By installing the fan 12 in multiple locations of the housing 310, the first heat source 401 and the second heat source 402 are well cooled by air.

[0036] Figure 4 It is shown Figure 1 FIG. 1 is a diagram showing a detailed structure of the cooling system 100. Figure 4 In addition to the cooling system 100, a cooling device 200 is also shown. Figure 4 In the figure, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0037] like Figure 4 As shown, the CDU 13 cools the secondary refrigerant and circulates the cooled secondary refrigerant in the cooling system 100. The CDU 13 includes a housing 130, four ports 131 to 134, a heat exchanger 137, a pump 138, and a control unit 139 as components.

[0038] The housing 130 accommodates the heat exchanger 137, the pump 138, and the control unit 139. Since the heat exchanger 137, the pump 138, and the control unit 139 are collectively accommodated in the housing 130, the cooling system 100 can be easily installed.

[0039] In this embodiment, ports 131 and 132 are an inlet and an outlet of the primary refrigerant, and are provided in housing 130. Port 131 is connected to port 112 of radiator 11 via a flow path. Port 132 is connected to port 210 of cooling device 200 via a flow path.

[0040] The primary refrigerant flowing out of the port 112 flows into the port 131. The primary refrigerant flows into the flow path 1375 of the heat exchanger 137 from the port 1371 of the heat exchanger 137 through the flow path. Then, the primary refrigerant flows in the flow path 1375 and flows out of the port 1372 of the heat exchanger 137. The primary refrigerant also flows out of the port 132 through the flow path.

[0041] In this embodiment, ports 133 and 134 are the inlet and outlet of the secondary refrigerant, and are provided in the frame 130. The secondary refrigerant may be the same type of refrigerant as the primary refrigerant. In addition, the secondary refrigerant may also be different from the primary refrigerant. In addition, the secondary refrigerant is an example of the "first refrigerant" of the present disclosure.

[0042] Port 133 is connected to the outflow port of the collection manifold 15. Port 134 is connected to the cold plate 16 through the distribution manifold 14.

[0043] The secondary refrigerant with a higher temperature flows into port 133 from the outflow port of collecting manifold 15. The secondary refrigerant flows through the flow path from port 133 and flows into port 1373 of heat exchanger 137. The secondary refrigerant flows through flow path 1376 from port 1373 and flows out from port 1374 of heat exchanger 137.

[0044] The heat exchanger 137 performs heat exchange between the secondary refrigerant and the primary refrigerant flowing out of the cold plate 16. Therefore, the ability to cool the first heat source 401 is improved.

[0045] Specifically, the heat exchanger 137 performs heat exchange between the secondary refrigerant flowing out of the cold plate 16 and the primary refrigerant flowing out of the radiator 11. In other words, the primary refrigerant with a relatively low temperature flows in the radiator 11. Therefore, the air in the rack 300 is cooled to a relatively low temperature by the primary refrigerant and discharged.

[0046] Specifically, the heat exchanger 137 is, for example, a plate heat exchanger, and is provided in the housing 130. The heat exchanger 137 includes a plurality of heat transfer plates 1377 in addition to the ports 1371 to 1374 and the flow paths 1375 and 1376.

[0047] In the present embodiment, ports 1371 and 1372 are the inlet and outlet of the primary refrigerant. Flow path 1375 is a pipe provided inside heat exchanger 137. Flow path 1375 connects ports 1371 and 1372 to each other so that the primary refrigerant of medium temperature can flow between them. Therefore, in the present embodiment, the primary refrigerant (medium temperature) flowing out of radiator 11 flows in flow path 1375.

[0048] In the present embodiment, ports 1373 and 1374 are an inlet and an outlet of the secondary refrigerant. Flow path 1376 is a pipe provided inside heat exchanger 137. Flow path 1376 connects ports 1373 and 1374 to each other so that the primary refrigerant (high temperature) can flow between them. Therefore, in the present embodiment, the secondary refrigerant (high temperature) flowing out of each cold plate 16 flows in flow path 1376.

[0049] The plurality of heat transfer plates 1377 are arranged at intervals from each other in the heat exchanger 137. The flow paths 1375 and 1376 are inserted through the through holes formed in the plurality of heat transfer plates 1377 in a state of being physically isolated from each other in the heat exchanger 137. Therefore, heat exchange is performed between the primary refrigerant (medium temperature) flowing through the flow path 1375 and the secondary refrigerant (high temperature) flowing through the flow path 1376 through the plurality of heat transfer plates 1377. As a result, the secondary refrigerant is cooled to a lower temperature when it flows out from the port 1374 than when it flows into the port 1373. On the other hand, the primary refrigerant is heated to a higher temperature when it flows out from the port 1372 than when it flows into the port 1371.

[0050] The secondary refrigerant (low temperature) flowing out of the port 1374 flows into the pump 138. The pump 138, under the control of the control unit 139, pressurizes the secondary refrigerant flowing into the pump 138 to the port 134. Therefore, the secondary refrigerant circulates in the cooling system 100. Figure 1 In the embodiment, the pump 138 is located between the heat exchanger 137 and the port 134 in the flow path of the secondary refrigerant. However, the pump 138 may be located between the port 133 and the heat exchanger 137 in the flow path of the secondary refrigerant.

[0051] The distribution manifold 14 has a common flow path 141 and a plurality of individual flow paths 142 (see Figure 1 ). In addition, Figure 1 In order to facilitate understanding of the diagram, only two individual flow paths are marked with reference symbol "142". The secondary refrigerant can flow through the common flow path 141 and each of the plurality of individual flow paths 142. One end of each individual flow path 142 is connected to the common flow path 141 in a manner that the secondary refrigerant can flow. The other end of one of the plurality of individual flow paths 142 is used as an inlet for the secondary refrigerant in the distribution manifold 14 and is connected to the port 134 (see Figure 4 The other ends of the remaining individual flow paths 142 are used as outflow outlets for the secondary refrigerant in the distribution manifold 14 and are connected to the cold plates 16 (see Figure 4 ). Therefore, the secondary refrigerant (low temperature) flowing into the inlet flows from one of all the individual flow paths 142 to the common flow path 141, and after being branched by the remaining individual flow paths 142, flows out from each outlet.

[0052] The collecting manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. The secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow (see Figure 4 ). The other end of one of the individual flow paths 151 is used as the outflow outlet of the secondary refrigerant in the collecting manifold 15, and is connected to the port 133. The other ends of the remaining individual flow paths 151 are used as the inflow inlets of the secondary refrigerant in the collecting manifold 15, and are respectively connected to the cold plate 16. Therefore, the secondary refrigerant flowing into each inflow inlet of the individual flow path 151 from the cold plate 16 merges in the common flow path 152, and flows out from the outflow outlet of the individual flow path 151 toward the port 133.

[0053] Each cold plate 16 is in thermal contact with at least one first heat source 401. Each cold plate 16 may be in thermal contact with a plurality of first heat sources 401. In addition, each cold plate 16 may be in thermal contact with a first heat source 401 and a second heat source 402. In each cold plate 16, a secondary refrigerant flows inside. Specifically, each cold plate 16 is configured to be in direct thermal contact with the first heat source 401 (see Figure 1 ). Each cold plate 16 may be configured to be in thermal contact with the first heat source 401 via a heat conductive sheet (not shown). That is, the term "thermal contact" includes the meanings of "direct thermal contact" and "indirect thermal contact".

[0054] Each cold plate 16 has an inlet and an outlet for the secondary refrigerant. A refrigerant flow path (not shown) from the inlet to the outlet is provided inside the cold plate 16. The secondary refrigerant (low temperature) flows into the inlet from a separate flow path 142 connected to the outlet. The secondary refrigerant flows in the flow path toward the outlet in the cold plate 16. Therefore, the heat generated in the first heat source 401 is transferred to the secondary refrigerant flowing in the cold plate 16 in thermal contact with the first heat source 401. As a result, the first heat source 401 is cooled and the secondary refrigerant becomes high temperature. The secondary refrigerant (high temperature) flows out from the outlet to the separate flow path 151 of the collecting manifold 15.

[0055] In the embodiment, the first heat source 401, which generates more heat than the second heat source 402, is cooled by the cold plate 16. The airflow generated by the fan 12 discharges the heat in the rack 300 to the outside of the rack 300. Thus, both the first heat source 401 and the second heat source 402 are air-cooled. That is, the first heat source 401, which is difficult to be sufficiently cooled only by the fan 12, is cooled by the cold plate 16. Therefore, according to the embodiment, a cooling system 100 with improved cooling performance can be provided.

[0056] The control unit 139 includes a microcomputer and a memory. In the control unit 139, the microcomputer operates according to the program stored in the memory. Thus, the control unit 139 controls the operations of the pump 138 and the fan 12. Therefore, compared with the case where a control unit for controlling the operation of the pump 138 and a control unit for controlling the operation of the fan 12 are separately provided, the structure of the cooling system 100 becomes simple.

[0057] The cooling system 100 and the cooling device 200 may be provided with a temperature sensor (not shown) for detecting the temperature of the primary refrigerant and the secondary refrigerant. In addition, another temperature sensor (not shown) for detecting the temperature inside the rack 300 may be provided. The control unit 139 controls the operation of at least one of the pump 138 and the fan 12 based on each temperature detected by the temperature sensor. Thus, the cooling system 100 can easily adjust the cooling capacity.

[0058] Figure 5 1 is a diagram showing a detailed configuration of a cooling system 100 according to a modified example of the first embodiment (hereinafter referred to as a “first modified example”). Figure 5 In the figure, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0059] like Figure 5 As shown in FIG. 1 , the components of the CDU 13 of the first modified example are the same as those of the CDU 13 of the first embodiment. Figure 5 In addition to the cooling system 100 , a cooling device 200 is also shown.

[0060] In the present modification, ports 131 and 132 of CDU 13 are the outflow and inflow of the primary refrigerant. Port 132 is connected to port 220 of cooling device 200 via a flow path. Port 131 is connected to port 111 of radiator 11 via a flow path.

[0061] The primary refrigerant flowing out of the port 220 flows into the port 132. The primary refrigerant flows into the flow path 1375 of the heat exchanger 137 from the port 1372 of the heat exchanger 137 through the flow path. Then, the primary refrigerant flows in the flow path 1375 and flows out of the port 1371 of the heat exchanger 137. The primary refrigerant then flows out of the port 131 through the flow path.

[0062] The heat exchanger 137 performs heat exchange between the secondary refrigerant flowing out of the cold plate 16 and the primary refrigerant. In detail, the heat exchanger 137 performs heat exchange between the secondary refrigerant flowing out of the cold plate 16 and the primary refrigerant flowing out of the cooling device 200. In other words, the primary refrigerant with a relatively low temperature flows in the flow path 1375 of the heat exchanger 137. Therefore, the secondary refrigerant flowing out of the cold plate 16 and flowing in the flow path 1376 is cooled to a relatively low temperature by the primary refrigerant and is discharged. As a result, the ability of the cooling system 100 to cool the first heat source 401 in thermal contact with the cold plate 16 is improved.

[0063] In the present embodiment, ports 111 and 112 are the inlet and outlet of the primary refrigerant. Port 111 is connected to port 131 of CDU 13 through a flow path. Port 112 is connected to port 210 of cooling device 200 through a flow path. The primary refrigerant flowing into port 111 flows in the common flow path 1131 of radiator 11. After that, the primary refrigerant flows in each branch flow path 1133 and flows into the common flow path 1132. After that, the primary refrigerant flows in the common flow path 1132 and then flows out from port 112.

[0064] The fan 12 generates airflow through the ventilation passages 115 (i.e., the radiator 11) in the plurality of ventilation passages 115. Here, the primary refrigerant circulating in the radiator 11 is cooled or heated by the air in the rack 300. When the temperature of the primary refrigerant is increased, the cooled air is discharged to the outside of the rack 300. Therefore, the temperature rise of the space A01 can be suppressed. On the other hand, when the primary refrigerant is cooled, the primary refrigerant is cooled more efficiently in the cooling device 200.

[0065] The air in the rack 310 is discharged to the outside of the rack 310 together with the heat in the rack 310 by the fan 12. As a result, both the first heat source 401 and the second heat source 402 are air-cooled. The first heat source 401, which is difficult to be sufficiently cooled only by the fan 12, is cooled by the cold plate 16. Therefore, the combination of the fan 12 and the cold plate 16 can provide a cooling system 100 with improved cooling performance.

[0066] Figure 6 2 is a diagram showing a detailed structure of a cooling system 100 according to a second embodiment. Figure 6 In the figure, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0067] like Figure 6 As shown, the cooling system 100 of the second embodiment is different from the cooling system 100 of the first embodiment in that the cooling system 100 does not include the cooling device 200 and the heat exchanger 137 is not included in the CDU 13 .

[0068] Ports 133 and 134 are also the inlet and outlet of the secondary refrigerant in this embodiment, similarly to the first embodiment. Port 133 is connected to port 112 of radiator 11 via a flow path. Port 134 is connected to the inlet of distribution manifold 14.

[0069] The collecting manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. The secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow (see Figure 4 ). The other end of one of the individual flow paths 151 is used as the outflow outlet of the secondary refrigerant in the collecting manifold 15, and is connected to the port 111 of the radiator 11. The other ends of the remaining individual flow paths 151 are used as inflow inlets of the secondary refrigerant in the collecting manifold 15, and are respectively connected to the cold plate 16. Therefore, the secondary refrigerant flowing into each inflow inlet of the individual flow path 151 from the cold plate 16 merges in the common flow path 152, and flows out from the outflow outlet of the individual flow path 151 toward the port 111.

[0070] The pump 138, under the control of the control unit 139, pressurizes the secondary refrigerant (low temperature) cooled by the radiator 11 to the port 134 (i.e., the cold plate 16). Therefore, the secondary refrigerant of relatively low temperature flows through the cold plate 16, and thus the cooling system 100 provides a relatively low temperature to the first heat source 401 (see Figure 1 )The cooling capacity is improved.

[0071] Figure 7 1 is a diagram showing a detailed configuration of a cooling system 100 according to a modified example of the second embodiment (hereinafter referred to as a “second modified example”). Figure 7 In addition to the cooling system 100, a cooling device 200 is also shown. Figure 7 In the figure, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0072] like Figure 7 As shown, the components of the CDU 13 of the second modification are the same as those of the CDU 13 of the first embodiment.

[0073] In the present embodiment, the ports 131 and 132 are the inlet and outlet of the primary refrigerant and are connected to the ports 220 and 210 of the cooling device 200 through flow paths, respectively.

[0074] The primary refrigerant flowing out of the port 220 flows into the port 131. The primary refrigerant flows into the flow path 1375 of the heat exchanger 137 from the port 1371 of the heat exchanger 137 through the flow path. Then, the primary refrigerant flows in the flow path 1375 and flows out of the port 1372 of the heat exchanger 137. The primary refrigerant then flows out of the port 132 through the flow path.

[0075] Ports 133 and 134 are also the inlet and outlet of the secondary refrigerant in the second modification as in the first embodiment. Port 133 is connected to port 112 of the radiator 11 through a flow path. Port 134 is connected to the inlet of the distribution manifold 14. Therefore, in the heat exchanger 137, the secondary refrigerant flows as in the first embodiment.

[0076] The collecting manifold 15 has a plurality of individual flow paths 151 and a common flow path 152. The secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. One end of each individual flow path 151 is connected to the common flow path 152 so that the secondary refrigerant can flow (see Figure 4 ). The other end of one of the individual flow paths 151 is connected to the port 111 of the radiator 11 as the outflow outlet of the secondary refrigerant in the collecting manifold 15. The other ends of the remaining individual flow paths 151 are connected to the cold plate 16 as the inflow inlets of the secondary refrigerant in the collecting manifold 15. Therefore, the secondary refrigerant flowing into each inlet of the individual flow path 151 from the cold plate 16 merges in the common flow path 152 and flows out from the outflow outlet of the individual flow path 151 toward the port 111.

[0077] The heat exchanger 137 is located downstream of the radiator 11 and upstream of the cold plate 16 in the flow path of the secondary refrigerant. The heat exchanger 137 performs heat exchange between the secondary refrigerant (high temperature) flowing out of the radiator 11 and the primary refrigerant different from the secondary refrigerant. In the present embodiment, the primary refrigerant flows out of the cooling device 200. Therefore, in the heat exchanger 137, the secondary refrigerant from the radiator 11 is cooled to a relatively low temperature by the primary refrigerant. The secondary refrigerant with a relatively low temperature flows through the cold plate 16, and therefore, the ability of the cooling system 100 to cool the first heat source 401 is improved.

[0078] The pump 138 presses the secondary refrigerant (low temperature) flowing out of the heat exchanger 137 to the port 134 (i.e., the cold plate 16) under the control of the control unit 139. Therefore, the secondary refrigerant with a relatively low temperature flows through the cold plate 16, and the cooling system 100 improves the ability to cool the first heat source 401.

[0079] Figure 8 1 is a diagram showing a detailed configuration of a cooling system 100 according to another modified example (hereinafter referred to as a “third modified example”) of the second embodiment. Figure 8 In addition to the cooling system 100, a cooling device 200 is also shown. Figure 8 In the figure, for ease of understanding, only one cold plate 16 is shown, and the heat source 400 is not shown.

[0080] like Figure 8 As shown, the components of the CDU 13 of the second modification are the same as those of the CDU 13 of the first embodiment.

[0081] In this modification, ports 131 and 132 are an inlet and an outlet of the primary refrigerant and are connected to ports 220 and 210 of cooling device 200 through flow paths, respectively.

[0082] The primary refrigerant flowing out of the port 220 flows into the port 131. The primary refrigerant flows into the flow path 1375 of the heat exchanger 137 from the port 1371 of the heat exchanger 137 through the flow path. Then, the primary refrigerant flows in the flow path 1375 and flows out of the port 1372 of the heat exchanger 137. The primary refrigerant then flows out of the port 132 through the flow path.

[0083] Ports 133 and 134 are the inlet and outlet of the secondary refrigerant as in the first embodiment. Port 133 is connected to the inlet of the distribution manifold 14. Port 134 is connected to port 112 of the radiator 11 through a flow path. Therefore, in the heat exchanger 137, the secondary refrigerant flows as in the first embodiment.

[0084] In the distribution manifold 14, the secondary refrigerant can flow through the common flow path 141 and each of the plurality of individual flow paths 142. Figure 7 In the figure, for the sake of clarity, only two individual flow paths 142 are shown. One end of each individual flow path 142 is connected to the common flow path 141 in a manner that the secondary refrigerant can flow. The other end of one of the multiple individual flow paths 142 is used as an inlet for the secondary refrigerant in the distribution manifold 14, and is connected to the port 112 of the radiator 11. The other ends of the remaining individual flow paths 142 are used as outlets for the secondary refrigerant in the distribution manifold 14, and are respectively connected to the cold plates 16. Therefore, the secondary refrigerant (low temperature) flowing into the inlet flows from one of all the individual flow paths 142 to the common flow path 141, and after being diverted by the remaining individual flow paths 142, flows out from each outlet.

[0085] In the collecting manifold 15, the secondary refrigerant can flow through each of the plurality of individual flow paths 151 and the common flow path 152. Figure 7In the figure, for the sake of clarity, only two individual flow paths 151 are shown. One end of each individual flow path 151 is connected to the common flow path 152 in a manner that the secondary refrigerant can flow. The other end of one individual flow path among all the individual flow paths 151 is used as an outflow outlet of the secondary coolant in the collecting manifold 15, and is connected to the port 133 of the CDU 13. The other ends of the remaining individual flow paths 151 are connected to the cold plates 16 as inflow inlets of the secondary refrigerant in the collecting manifold 15. Therefore, the secondary refrigerants flowing from the cold plate 16 into the respective inflow inlets of the individual flow paths 151 merge in the common flow path 152, and flow out from the outflow outlets of the individual flow paths 151 toward the port 133.

[0086] The heat exchanger 137 is located downstream of the cold plate 16 and upstream of the radiator 11 in the flow path of the secondary refrigerant. The heat exchanger 137 performs heat exchange between the secondary refrigerant (high temperature) flowing out of the cold plate 16 and the primary refrigerant different from the secondary refrigerant. In this modification, the primary refrigerant flows out of the cooling device 200. Therefore, in the heat exchanger 137, the secondary refrigerant from the cold plate 16 is cooled to a relatively low temperature by the primary refrigerant. As a result, since the primary refrigerant (low temperature) flows through the radiator 11, the high-temperature air is suppressed from being discharged outside the rack 300.

[0087] Fig. 9 It shows the connection Figure 4 FIG. 1 is a diagram of a first configuration example of the radiator 11 and the first flow path 17 of the heat exchanger 137 shown.

[0088] like Fig. 9 As shown, the cooling system 100 also has a first flow path 17. The first flow path 17 is connected to the radiator 11. In the first flow path 17, a primary refrigerant flows. The first flow path 17 has an upstream portion 171 and a downstream portion 172. The upstream portion 171 and the downstream portion 172 are an example of a "portion" in the present disclosure. The upstream portion 171 and the downstream portion 172 are made of a hard resin or a metal. One end of the upstream portion 171 and the downstream portion 172 are connected to the common flow path 1131 and the common flow path 1132 of the radiator 11 so that the radiator 11 can rotate around the rotation axis 321. The other end of the upstream portion 171 is connected to the port 220 of the cooling device 200. The other end of the downstream portion 172 is connected to the port 131 of the CDU 13. The upstream portion 171 and the downstream portion 172 are realized, for example, by a swivel joint. By utilizing the upstream portion 171 and the downstream portion 172 , the primary refrigerant can circulate among the cooling device 200 , the radiator 11 , and the heat exchanger 137 .

[0089] Fig.10 It shows the connection Figure 4 FIG. 1 is a diagram of a second configuration example of the radiator 11 and the first flow path 17 of the heat exchanger 137 shown.

[0090] like Fig.10 As shown, the cooling system 100 further includes a first flow path 17. The first flow path 17 is connected to the radiator 11. In the first flow path 17, the primary refrigerant flows. The first flow path 17 has an upstream portion 171 and a downstream portion 172. The upstream portion 171 and the downstream portion 172 are other examples of the "portion" of the present disclosure. The upstream portion 171 and the downstream portion 172 are made of a resin or metal having flexibility, and are portions that bend according to the opening and closing of the rear door 320. One end of the upstream portion 171 and the downstream portion 172 are connected to the common flow path 1131 and the common flow path 1132 of the radiator 11. The other end of the upstream portion 171 is connected to the port 220 of the cooling device 200. The other end of the downstream portion 172 is connected to the port 131 of the CDU 13. The upstream portion 171 and the downstream portion 172 enable the primary refrigerant to circulate between the cooling device 200, the radiator 11, and the heat exchanger 137.

[0091] In addition, in the first structural example and the second structural example, assuming that the primary refrigerant leaks from the upstream portion 171 and the downstream portion 172 and condensation occurs in the upstream portion 171 and the downstream portion 172, it is preferred to configure a receiving component such as a tray-shaped component at a position Z2 in the other direction of the first direction of the upstream portion 171 and the downstream portion 172.

[0092] In addition, in order to facilitate the understanding of the present disclosure, the drawings are schematically shown with each component as the main body. For the convenience of making the drawings, the thickness, length, number, spacing, etc. of each component shown in the drawings are sometimes different from the actual ones. In addition, the structure of each component shown in the above embodiment is an example and is not particularly limited. Various changes can be made within the scope that does not substantially deviate from the effect of the present disclosure.

[0093] In each embodiment and each modification, the heat sink 11 is provided at the rear door 320 . However, the present invention is not limited thereto, and the heat sink 11 only needs to be provided at the frame 310 .

[0094] Note that the present technology can also adopt the following configurations.

[0095] (1) A cooling system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source, wherein a first refrigerant flows inside the cold plate; a radiator in contact with air in the rack, a second refrigerant different from the first refrigerant flowing inside the radiator; and A heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant.

[0096] (2) The cooling system according to (1), wherein the heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant flowing out of the radiator.

[0097] (3) The cooling system according to (1), wherein: The heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant. The radiator allows the second refrigerant flowing out of the heat exchanger to flow therein.

[0098] (4) The cooling system according to any one of (1) to (3), wherein: The frame has: a frame having an opening; and a door provided with the radiator and opening and closing the opening by rotating about a rotation axis, further comprising a first flow path connecting the radiator and the heat exchanger and through which the second refrigerant flows, The first flow path has a portion connecting the radiator and the heat exchanger so that the radiator is rotatable around the rotation axis.

[0099] (5) The cooling system according to any one of (1) to (3), wherein: The frame has: a frame having an opening; and a door provided with the radiator and opening and closing the opening by rotating about a rotation axis, further comprising a first flow path connecting the radiator and the heat exchanger and through which the second refrigerant flows, The first flow path includes a portion between the radiator and the heat exchanger that is bent according to opening and closing of the door.

[0100] (6) A cooling system for cooling a heat source in a rack, comprising: a cold plate in thermal contact with the heat source, a first refrigerant flowing inside the cold plate; and A heat sink contacts the air in the rack, and the first refrigerant flowing out of the cold plate flows inside the heat sink.

[0101] (7) The cooling system according to (6), wherein: A heat exchanger is further provided, which is located downstream of the radiator and upstream of the cold plate in the flow path of the first refrigerant and exchanges heat between the first refrigerant flowing out of the radiator and a second refrigerant different from the first refrigerant.

[0102] (8) The cooling system according to (7), wherein: A pump is further provided for pressure-feeding the first refrigerant flowing out of the heat exchanger to the cold plate.

[0103] (9) The cooling system according to (6), wherein: A heat exchanger is further provided, which is located downstream of the cold plate and upstream of the radiator in the flow path of the first refrigerant and exchanges heat between the first refrigerant flowing out of the cold plate and a second refrigerant flowing inside the cold plate.

[0104] (10) The cooling system according to any one of (1) to (9), further comprising: a pump configured to pump the first refrigerant under pressure; and A frame accommodates the pump and the heat exchanger. (11) The cooling system according to any one of (1) to (10), wherein: A fan is also provided to generate airflow through the heat sink.

[0105] (12) The cooling system according to any one of (1) to (12), further comprising: a pump configured to pressurize and deliver the first refrigerant; a fan that generates airflow through the heat sink; and A control unit controls the operations of the pump and the fan.

[0106] The cooling system disclosed in the present invention can cool a heat source and has industrial applicability. Explanation of symbols

[0107] 100: cooling system; 11: radiator; 12: fan; 13: CDU; 130: housing; 137: heat exchanger; 138: pump; 139: control unit; 16: cold plate; 300: rack; 310: housing; 311: bottom wall; 312: top wall; 313A: side wall; 313B: side wall; 314: front opening; 315: rear opening; 320: rear door; 321: rotation axis; 322: front end; 323: hole; 400: heat source.

Claims

1. A cooling system for cooling a heat source in a rack, characterized in that: have: a cold plate in thermal contact with the heat source and allowing a first refrigerant to flow inside the cold plate; a radiator that contacts air in the rack and allows a second refrigerant different from the first refrigerant to flow therein; as well as A heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant.

2. The cooling system according to claim 1, characterized in that: The heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant flowing out of the radiator.

3. The cooling system according to claim 1, characterized in that: The heat exchanger performs heat exchange between the first refrigerant flowing out of the cold plate and the second refrigerant. The radiator allows the second refrigerant flowing out of the heat exchanger to flow therein.

4. The cooling system according to any one of claims 1 to 3, characterized in that: The frame has: a frame having an opening; and a door provided with the radiator and opening and closing the opening by rotating about a rotation axis, The cooling system further includes a first flow path connected to the radiator and through which the second refrigerant flows. The first flow path includes a portion to which the heat sink is connected so as to be rotatable about the rotation axis.

5. The cooling system according to any one of claims 1 to 3, characterized in that: The frame has: a frame having an opening; and a door provided with the radiator and opening and closing the opening by rotating about a rotation axis, The cooling system further includes a first flow path connected to the radiator and through which the second refrigerant flows. The first flow path includes a portion that bends according to opening and closing of the door.

6. A cooling system for cooling a heat source in a rack, characterized in that: have: a cold plate in thermal contact with the heat source and allowing a first refrigerant to flow therein; and A heat sink is in contact with air in the rack and allows the first refrigerant flowing out of the cold plate to flow inside the heat sink.

7. The cooling system according to claim 6, characterized in that: A heat exchanger is further provided, the heat exchanger being located downstream of the radiator and upstream of the cold plate in the flow path of the first refrigerant and performing heat exchange between the first refrigerant flowing out of the radiator and a second refrigerant different from the first refrigerant.

8. The cooling system according to claim 7, characterized in that: A pump is further provided for pressure-feeding the first refrigerant flowing out of the heat exchanger to the cold plate.

9. The cooling system according to claim 6, characterized in that: A heat exchanger is further provided, the heat exchanger being located downstream of the cold plate and upstream of the radiator in the flow path of the first refrigerant and performing heat exchange between the first refrigerant flowing out of the cold plate and a second refrigerant different from the first refrigerant.

10. The cooling system according to any one of claims 1 to 3, 6 and 7, characterized in that Also available: a pump that pumps the first refrigerant; and A frame accommodates the pump and the heat exchanger.

11. The cooling system according to any one of claims 1 to 3, 6 and 7, characterized in that A fan is further provided, the fan generating an airflow passing through the heat sink.

12. The cooling system according to any one of claims 1 to 3, 6 and 7, characterized in that Also available: a pump configured to pump the first refrigerant under pressure; a fan that generates airflow through the heat sink; and A control unit controls the operations of the pump and the fan.