Clean processing technology method for heat sink material product
Through technical means such as consolidation grinding, vacuum suction cup fixation and laser cutting, the appearance defects caused by pollutant residues in heat sink material processing are solved, efficient and clean processing is achieved, and the yield rate is improved and production costs are reduced.
Patent Information
- Application Number
- CN202411642241.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-01-03
AI Technical Summary
In the existing heat sink material processing technology, pollutant residues cause the appearance of the non-compliance before electroplating, and defects such as bubbles, oil stains, and black spots appear after electroplating, which has low yield and high production cost.
Clean processing technology adopts consolidation grinding, vacuum suction cup fixation, air-cooled cooling, double-sided thermal decomposition adhesive film fixation, laser cutting, film detachment, vibration grinding and ultrasonic cleaning to ensure that there are few pollutants, easy cleaning, and before electroplating Standard appearance.
It effectively reduces pollutant residues, improves yield, reduces production costs, and ensures that the appearance pass rate after nickel plating reaches more than 92%.
Smart Images

Figure CN119238055A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of heat sink material processing, and in particular to a clean processing method for a heat sink material product. Background Art
[0002] With the rapid development of heat sink material products, not only the performance requirements of heat sink materials are getting higher and higher, but also the requirements for product appearance quality are getting higher and higher. In order to achieve weldability with its chip, nickel and gold plating are usually performed on the surface of the heat sink material to improve its weldability. If the product surface does not reach the required state before electroplating, it is very easy to have appearance defects such as blistering, oil stains, black spots, etc. after electroplating.
[0003] At present, the processing technology of products before electroplating is to cut the shape with electric spark discharge and then mill and bond to process bosses, holes and other structures. Since the heat sink material is prepared by powder metallurgy, there are usually tiny pores. During the whole processing process, there will be pollutants remaining in the tiny pores of the product, which are difficult to clean. As a result, after nickel and gold plating, the appearance defects are prominent, the qualified rate of finished products is extremely low, and the production cost is greatly increased.
[0004] In the existing scheme, free grinding is first used to ensure the thickness of the product, and then the shape is cut by electric spark erosion of circulating liquid cooling medium, and then the boss, hole and other structures are processed by CNC milling. Among them, the CNC milling method is to fix the product by glue and use circulating oily liquid cooling medium to cool the product to complete the processing.
[0005] However, the free grinding method can easily embed abrasives into the surface of the material, causing product contamination and ultimately affecting the quality of electroplating. In addition, the wire cutting method has a high degree of corrosion and liquid cooling medium pollution. In addition, the CNC milling method uses glue for bonding and fixing. Glue is an organic substance that is difficult to degrade and is very easy to remain. In addition, the oily liquid cooling medium currently used in CNC milling is also highly polluted and easy to remain. It is difficult to meet the appearance standard requirements before electroplating, resulting in obvious appearance defects after nickel and gold plating, extremely low yield rate, and high production cost.
[0006] CN116475693A discloses a method for processing a heat sink material, comprising the following steps: S1: grinding the heat sink material with a double-sided grinder, with the upper plate rotating forward, the lower plate rotating reversely, and the central axis rotating reversely to obtain a semi-finished product 1; S2: placing the semi-finished product 1 in a CNC engraving machine, clamping it with a vise, and first rough milling and then fine milling to obtain a semi-finished product 2; S3: applying an acid-resistant corrosion agent on the surface of the semi-finished product 2 to obtain a semi-finished product 3; S4: corroding the semi-finished product 3 with a strong acid, cleaning it, and obtaining a semi-finished product 4; S5: placing the semi-finished product 4 in a weak acid corrosion to obtain a semi-finished product 5; S6: vibrating and polishing the semi-finished product 5 with zirconium oxide to remove burrs, and grinding the corroded surface with sandpaper to obtain a finished product. Summary of the invention
[0007] The purpose of the present invention is to solve the existing problems that due to processing pollution, the product cannot reach the appearance state before electroplating, the proportion of appearance defects after electroplating is high, and the yield rate is extremely high.
[0008] In order to achieve the above-mentioned object, a first aspect of the present invention provides a heat sink material product clean processing method, the method comprising the following steps:
[0009] (1) placing the heat sink material in a fixed grinding disc and sequentially performing coarse grinding and fine grinding to obtain an intermediate I;
[0010] (2) placing the intermediate I in a vacuum chuck, clamping it by vacuum fixture adsorption, fixing it by adsorption, performing clean fine carving processing, and cooling it by air cooling with filtered gas to obtain an intermediate II having a non-outer shape area and a positioning pin hole;
[0011] (3) fixing the intermediate II with a double-sided pyrolytic adhesive film, limiting the position with a positioning pin hole, and performing a clean laser cutting process to obtain an intermediate III;
[0012] (4) placing the intermediate III in an oven for film release treatment to obtain intermediate IV;
[0013] (5) performing vibration grinding treatment on the intermediate IV to remove burrs to obtain intermediate V;
[0014] (6) The intermediate V is cleaned to obtain a clean product.
[0015] Preferably, in step (1), the conditions for the coarse grinding treatment are as follows: the mesh number of the coarse grinding disc is 100-400 meshes, and the rotation speed of the coarse grinding is 1000-1100 r / min; the conditions for the fine grinding treatment are as follows: the mesh number of the fine grinding disc is 3000 meshes, and the rotation speed of the fine grinding is 600-700 r / min.
[0016] Further preferably, in step (2), the adsorption area of the intermediate I is 70% of the adsorption surface of the vacuum chuck.
[0017] Preferably, in step (2), the conditions for the clean fine carving processing are satisfied: the rotation speed of rough machining is 10000r / min, the feed F of rough machining is 3000mm / min, the cutting depth of rough machining is 0.5mm / layer, the rotation speed of fine machining is 20000r / min, the feed F of fine machining is 500mm / min, and the fine milling allowance is 0.05mm.
[0018] Preferably, in step (3), the conditions of the clean laser cutting process meet the following requirements: nitrogen atmosphere, cutting focal length of 50 mm, and cutting speed of 0.5 mm / s.
[0019] More preferably, in step (4), the film release treatment conditions meet the following conditions: the baking temperature is 120 to 150° C., and the baking time is 5 to 8 min.
[0020] Preferably, in step (5), the abrasive for the vibration grinding treatment is zirconium oxide, and the diameter of the grinding disc is 0.5-1 mm.
[0021] Preferably, in step (5), the vibration grinding treatment conditions meet the following conditions: the vibration frequency is 40 Hz and the time is 30 to 60 min.
[0022] Preferably, in step (6), the cleaning treatment is to first remove oil by electrolytic degreasing, then perform pickling with sulfuric acid having a concentration of 5 wt%, and finally perform ultrasonic cleaning by ultrasonic wave.
[0023] The method provided by the present invention also has at least the following beneficial effects:
[0024] (1) The present invention provides a clean processing method that is easy to implement, ensuring that less pollutants are generated during the processing.
[0025] (2) The method provided by the present invention involves few pollution sources in the processing process, and no difficult cleaning is required after the processing is completed. The product can be cleaned by conventional cleaning methods.
[0026] (3) The product obtained by the method provided by the present invention meets the appearance standard requirements of the product before electroplating, greatly improves the yield rate, and reduces the production cost.
[0027] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a flow chart of the clean processing method of the heat sink material product of the present invention. DETAILED DESCRIPTION
[0029] The endpoints and any values of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of each range, the endpoint values of each range and the individual point values, and the individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.
[0030] The present invention will be described in detail below by way of examples. In the following examples, unless otherwise specified, the raw materials are all commercially available.
[0031] In the following examples, unless otherwise specified, the material of the bonded grinding disc is silicon carbide.
[0032] In the following examples, unless otherwise specified, the pyrolysis temperature of the double-sided pyrolytic adhesive film is 120°C.
[0033] Example 1
[0034] This example provides a process method for clean processing of heat sink material products, which includes the following steps:
[0035] (1) Placing the W85Cu heat sink material in a fixed grinding disc and sequentially performing coarse grinding and fine grinding to obtain an intermediate I with no scratches on the surface; the conditions for the coarse grinding treatment are as follows: the mesh number of the coarse grinding disc is 100 meshes and the coarse grinding speed is 1000 r / min; the conditions for the fine grinding treatment are as follows: the mesh number of the fine grinding disc is 3000 meshes and the fine grinding speed is 600 r / min.
[0036] (2) The intermediate I is placed in a vacuum suction cup and clamped by vacuum fixture adsorption to fix it by adsorption (the adsorption area of the intermediate I is 70% of the adsorption surface of the vacuum suction cup), and clean fine carving is performed, and the intermediate II is cooled by air cooling with filtered gas to obtain an intermediate II having a non-outer shape area and a positioning pin hole; the conditions for the clean fine carving are as follows: the speed of rough machining is 10000r / min, the feed F of rough machining is 3000mm / min, the cutting depth of rough machining is 0.5mm / layer, the speed of fine machining is 20000r / min, the feed F of fine machining is 500mm / min, and the fine milling allowance is 0.05mm.
[0037] (3) The intermediate II is fixed with a double-sided pyrolytic adhesive film and limited by positioning pin holes, and clean laser cutting is performed to obtain intermediate III; the conditions for the clean laser cutting process are: nitrogen atmosphere, cutting focal length of 50 mm, power of 70% of the rated power, and cutting speed of 0.5 mm / s.
[0038] (4) placing the intermediate III in an oven for film release treatment to obtain an intermediate IV (the double-sided thermal decomposition adhesive film can be completely vaporized during the film release treatment, and no residue remains on the surface of the intermediate IV); the conditions for the film release treatment are as follows: the baking temperature is 120° C. and the baking time is 5 min.
[0039] (5) The intermediate IV is subjected to vibration grinding treatment to remove burrs, thereby obtaining an intermediate V; the abrasive used in the vibration grinding treatment is zirconium oxide, the diameter of the grinding disc is 1 mm, and the conditions of the vibration grinding treatment are as follows: the vibration frequency is 40 Hz and the time is 30 min.
[0040] (6) The intermediate V is cleaned to obtain a clean product; the cleaning process is to first remove oil by electrolytic degreasing, then pickle with 5 wt% sulfuric acid, and finally ultrasonically clean.
[0041] Example 2
[0042] This example is carried out according to the method of Example 1, except that:
[0043] In step (4), the film release treatment conditions are as follows: the baking temperature is 150° C. and the baking time is 8 min;
[0044] In step (5), the diameter of the grinding disc is 0.5 mm, and the vibration grinding treatment time is 60 min. The remaining steps and parameters are the same as those in Example 1.
[0045] Test Case
[0046] The product prepared in the above example was tested and nickel-plated. The results are shown in Table 1.
[0047] Table 1
[0048] Appearance Detection method Example 1 Example 2 Oil pollution Dyne pen Eligible scope Eligible scope Dirty Optical Microscope none none glitch Optical Microscope none none Nickel plating pass rate Optical Microscope 92% 95%
[0049] It can be seen from the results in Table 1 that the heat sink material in the embodiment of the present invention can meet the appearance requirements of the incoming material before electroplating through clean processing, oil stains, dirt and burrs, and after nickel plating, the appearance inspection pass rate of the nickel-plated product obtained in Example 1 is 92%, and the appearance inspection pass rate of the nickel-plated product obtained in Example 2 is 95%, and the pass rate is ≥ 90%. It can be seen that the clean processing method of the present invention has good consistency and is suitable for mass production.
[0050] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.
Claims
1. A clean processing method for heat sink material products, characterized in that: The method comprises the following steps: (1) placing the heat sink material in a fixed grinding disc and sequentially performing coarse grinding and fine grinding to obtain an intermediate I; (2) placing the intermediate I in a vacuum chuck, clamping it by vacuum fixture adsorption, fixing it by adsorption, performing clean fine carving processing, and cooling it by air cooling with filtered gas to obtain an intermediate II having a non-outer shape area and a positioning pin hole; (3) fixing the intermediate II with a double-sided pyrolytic adhesive film, limiting the position with a positioning pin hole, and performing a clean laser cutting process to obtain an intermediate III; (4) placing the intermediate III in an oven for film release treatment to obtain intermediate IV; (5) performing vibration grinding treatment on the intermediate IV to remove burrs to obtain intermediate V; (6) The intermediate V is cleaned to obtain a clean product.
2. The method according to claim 1, wherein: In step (1), the conditions for the coarse grinding treatment are as follows: the mesh number of the coarse grinding disc is 100-400 meshes, and the rotation speed of the coarse grinding is 1000-1100 r / min; the conditions for the fine grinding treatment are as follows: the mesh number of the fine grinding disc is 3000 meshes, and the rotation speed of the fine grinding is 600-700 r / min.
3. The method according to claim 1 or 2, wherein: In step (2), the adsorption area of the intermediate I is 70% of the adsorption surface of the vacuum chuck.
4. The method according to claim 1 or 2, wherein: In step (2), the conditions for the clean fine carving processing are as follows: the rotation speed of rough machining is 10000r / min, the feed F of rough machining is 3000mm / min, the cutting depth of rough machining is 0.5mm / layer, the rotation speed of fine machining is 20000r / min, the feed F of fine machining is 500mm / min, and the fine milling allowance is 0.05mm.
5. The method according to claim 1 or 2, wherein: In step (3), the clean laser cutting process conditions are as follows: nitrogen atmosphere, cutting focal length of 50 mm, and cutting speed of 0.5 mm / s.
6. The method according to claim 1 or 2, wherein: In step (4), the film release treatment conditions are as follows: the baking temperature is 120 to 150° C., and the baking time is 5 to 8 minutes.
7. The method according to claim 1 or 2, wherein: In step (5), the abrasive used in the vibration grinding process is zirconium oxide, and the diameter of the grinding disc is 0.5 to 1 mm.
8. The method according to claim 1 or 2, wherein: In step (5), the vibration grinding treatment conditions are as follows: the vibration frequency is 40 Hz and the time is 30 to 60 minutes.
9. The method according to claim 1 or 2, wherein: In step (6), the cleaning treatment is to first remove oil by electrolytic degreasing, then use sulfuric acid with a concentration of 5wt% for pickling, and finally use ultrasonic cleaning.
Citation Information
Patent Citations
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