Liquid cooling device and server
By setting up an injection mechanism and a temperature sensor in the liquid cooling server, targeted cooling is achieved, and the problem of difficulty in targeted cooling in the prior art is solved, and the performance and service life of the components are improved.
Patent Information
- Application Number
- CN202411365413.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2044-09-27
AI Technical Summary
Existing liquid-cooled servers are difficult to achieve targeted cooling during cooling, resulting in reduced performance and shortened service life of a single component.
A liquid cooling device is designed. By setting up multiple injection mechanisms and temperature sensors in the chassis, the central controller is used to monitor the temperature of each working component in real time, and automatically control the opening of the electronic control valve, selectively spraying insulating coolant to specific components. Achieve targeted cooling.
It improves the cooling efficiency and service life of a single component, improves the overall performance and user experience, and ensures the normal operation of each component.
Smart Images

Figure CN119248086A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of servers, and in particular to a liquid cooling device and a server. Background Art
[0002] The server will emit a lot of heat during operation. Common heat dissipation methods include air cooling and liquid cooling. Liquid-cooled servers have the characteristics of good heat dissipation effect, low noise and high space utilization. In a liquid-cooled server, the heat absorber receives the heat from the heat dissipated components and transfers it to the coolant in the heat absorber. The coolant is driven by a pump to flow and transfer the heat to the heat sink for dissipation. This cycle of operation achieves the purpose of heat dissipation.
[0003] In some typical liquid cooling solutions, coolant circulation is used to achieve overall cooling, which can achieve overall heat dissipation. However, each heat-generating component in the server often has different heat generation, and once the local heat generation is too large, it will affect the performance and service life of a single component, thereby limiting the overall performance. Summary of the invention
[0004] The present invention provides a liquid cooling device and a server, which are used to solve the defects in the prior art that the liquid cooling effect in a chassis is poor and each single heat-generating component is difficult to achieve targeted cooling.
[0005] A first aspect of the present invention provides a liquid cooling device, comprising: A box body, wherein the box body is formed with a receiving chamber for receiving the insulating coolant, wherein a plurality of working parts are arranged in the receiving chamber, and wherein the working parts are immersed in the insulating coolant; A circulation system, the circulation system is connected to the accommodating chamber, the circulation system is used to drive the circulation of the insulating coolant and remove the heat generated by the working parts during the circulation process; Among them, a plurality of injection mechanisms are connected to the circulation system, and the injection ports of the plurality of injection mechanisms are all arranged in the insulating coolant in the accommodating chamber, and are arranged one-to-one corresponding to the plurality of working parts, so as to selectively spray the insulating coolant toward the corresponding working parts.
[0006] According to the liquid cooling device provided by the present invention, the circulation system includes a liquid conveying device and a liquid cooling device, the liquid conveying device is connected to the accommodating chamber through an output pipeline, the input port of the liquid cooling device is connected to the liquid conveying device through a connecting pipeline, and the output port of the liquid cooling device is connected to the accommodating chamber through a liquid inlet pipeline; wherein the injection mechanism is connected to the liquid inlet pipeline.
[0007] According to the liquid cooling device provided by the present invention, a pre-cooling component is provided on the output pipeline, and the pre-cooling component is used for preliminarily cooling the insulating coolant.
[0008] According to the liquid cooling device provided by the present invention, the pre-cooling component includes a pre-cooling pipeline with a spiral structure.
[0009] According to the liquid cooling device provided by the present invention, the injection mechanism comprises an injection pipe and an injection assembly, one end of the injection pipe is connected to the circulation system, and the injection port at the other end of the injection pipe is provided with the injection assembly; The spray assembly comprises a fixed part, a rotating shaft and a pipe cover, wherein the fixed part is fixedly arranged in the spray pipe, the rotating shaft is rotatably arranged on the fixed part, one end of the rotating shaft is provided with a vortex impeller and is located in the spray pipe; the other end of the rotating shaft is connected to the pipe cover and is located outside the pipe opening of the spray pipe; The tube cover comprises a turntable and a fixed ring, wherein the fixed ring is fixedly arranged on the bottom surface of the turntable, a rotation gap is arranged between the inner wall surface of the fixed ring and the outer wall surface of the injection tube, and a first annular groove is arranged on the inner wall surface of the fixed ring, and a second annular groove is arranged on the outer wall surface of the injection tube, and the first annular groove and the second annular groove cooperate to form a rotating annular groove; a ball is arranged in the rotating annular groove, and a plurality of spray holes are arranged on the turntable, and the plurality of spray holes are arranged directly opposite to the working component.
[0010] According to the liquid cooling device provided by the present invention, the plurality of spray holes are evenly arranged along the circumference of the turntable to form a circular spray hole array.
[0011] According to the liquid cooling device provided by the present invention, the injection pipe includes a transmission pipe section and a circulation pipe section, the transmission pipe section is connected to the circulation system, and the circulation pipe section is connected to the box; Wherein, the injection assembly is arranged at the injection port position of the circulation pipe section, the circulation pipe section is arranged to be inclined downward, and the injection port of the circulation pipe section extends into the accommodating chamber.
[0012] According to the liquid cooling device provided by the present invention, both the transmission pipe section and the circulation system are provided with electric control valves.
[0013] The liquid cooling device provided according to the present invention further comprises a central controller, wherein the central controller is arranged on a side wall outside the box body; A temperature sensor is provided on each working component, and the temperature sensor is used to collect the temperature of the working component in real time. The temperature sensor and the electric control valve are both electrically connected to the central controller to selectively open the electric control valve based on the temperature sensor.
[0014] A second aspect of the present invention provides a server, comprising a liquid cooling device as described in any one of the above items.
[0015] The present invention provides a liquid cooling device and server, wherein the working parts are the main heat generating parts, and by immersing the working parts in insulating coolant, the heat generated by the working parts can be promptly removed, thereby improving the cooling effect. Furthermore, by setting up a spray mechanism, the insulating coolant can be sprayed in a targeted manner during cooling, thereby achieving effective cooling of a single part, thus solving the problem of difficulty in targeted cooling. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 This is one of the internal structure schematic diagrams of the liquid cooling device provided by the present invention.
[0018] Figure 2 This is the second schematic diagram of the internal structure of the liquid cooling device provided by the present invention.
[0019] Figure 3 It is a schematic diagram of the internal structure of the injection assembly in the liquid cooling device provided by the present invention.
[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the injection assembly in the liquid cooling device provided by the present invention.
[0021] Figure 5 It is a schematic diagram of the top structure of the liquid cooling device provided by the present invention.
[0022] Figure 6 It is a schematic diagram of the connection structure of the central controller in the liquid cooling device provided by the present invention.
[0023] Reference numerals: 10. Box body; 11. Accommodating chamber; 20. Working part; 21. Mainboard; 22. CPU; 23. Graphics card; 24. Hard disk; 25. First temperature sensor; 26. Second temperature sensor; 27. Third temperature sensor; 30. Insulation coolant; 40. Circulation system; 41. Output pipeline; 42. Pre-cooling component; 43. Liquid delivery device; 44. Connecting pipeline; 45. Liquid cooling device; 46. Liquid inlet pipeline; 47. Fourth electric control valve; 50. injection mechanism; 51. injection pipe; 511. first injection pipe; 512. second injection pipe; 513. third injection pipe; 514. first electric control valve; 515. second electric control valve; 516. third electric control valve; 517. transmission pipe section; 518. circulation pipe section; 52. injection assembly; 521. vortex impeller; 522. fixing part; 523. rotating shaft; 524. rotating disk; 5241. injection hole; 525. fixing ring; 526. ball; 527. first annular groove; 528. second annular groove; 60. Central controller. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0025] The features of the terms "first" and "second" in the specification and claims of the present invention may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.
[0026] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0028] In the early days when computers did not generate much heat, passive cooling technology was widely used. Passive cooling mainly achieves the purpose of heat dissipation by adding metal heat sinks in contact with the heating elements to increase the heat dissipation surface area, and the heat is directly transferred to the air. Traditional air cooling mainly involves adding fans to passive radiators to speed up the air flow on the surface of the heat sink to enhance the heat dissipation effect. This cooling method is also called air cooling. However, due to the poor heat exchange efficiency and low heat flux density of air, air-cooled servers have congenital defects such as high cooling energy consumption, high noise, low equipment density, and easy dust accumulation, which has become a bottleneck in the development of server cooling technology. In particular, with the development of high-performance computers, the layout density of servers is getting higher and higher, and the requirements for cooling technology are becoming more and more stringent. The role played by traditional air cooling technology is becoming increasingly inadequate.
[0029] In this context, liquid cooling technology came into being and has gradually become the main trend of server cooling technology. Liquid cooling is a quiet and efficient heat dissipation method. Due to its efficient heat dissipation performance, it is widely used in scenarios with high fan heat requirements.
[0030] In the related technology, more coolant pipes are built inside the chassis to quickly remove the overall heat inside the chassis and achieve efficient heat dissipation. This solution has a good overall heat dissipation effect, but in the actual cooling process, due to the switching of data processing scenarios and the different characteristics of various components, the heat generated by each component is different, and it takes a certain amount of time for the heat to be transferred to the whole process, which results in the heat of the individual component not being removed in time, thereby affecting the performance of the single component, and the service life is low due to the untimely removal of heat from the single component, affecting the overall user experience.
[0031] In the diagram, Figure 1 It is a schematic diagram of the cross-sectional structure of the liquid cooling device in the forward direction; Figure 2 It is a schematic diagram of the cross-sectional structure of the liquid cooling device from the side; Figure 3 A schematic diagram of the structure of the injection assembly assembly; Figure 4 It is a schematic diagram of the three-dimensional structure of the injection assembly; Figure 6 1 is a schematic diagram of the structure of the liquid cooling device from above. The proportions of the components in the figure are not limited, and the proportions of the components in the figure should not be understood as limiting the size.
[0032] Regarding the problems in related technologies, such as Figure 1 , Figure 2As shown, this embodiment provides a liquid cooling device, including a box 10 and a circulation system 40, wherein the box 10 is formed with a receiving chamber 11 for receiving an insulating coolant 30, wherein a plurality of working parts 20 are arranged in the receiving chamber 11, and the working parts 20 are immersed in the insulating coolant 30; the circulation system 40 is connected to the receiving chamber 11, and the circulation system 40 is used to drive the insulating coolant 30 to circulate, and take away the heat generated by the working parts 20 during the circulation process; wherein, a plurality of injection mechanisms 50 are connected to the circulation system 40, and the injection ports of the plurality of injection mechanisms 50 are all arranged in the insulating coolant 30 in the receiving chamber 11, and are arranged one by one corresponding to the plurality of working parts 20, so as to selectively spray the insulating coolant 30 toward the corresponding working parts 20. In the liquid cooling system, the coolant needs to flow continuously to take away the continuously generated heat. In this embodiment, by immersing the working component 20 as a whole in the insulating coolant 30, the heat is removed in time, and further through the setting of the injection mechanism 50, targeted cooling can be achieved, thereby realizing the cooling of a single component, solving the problem of difficulty in efficiently cooling a single component, and improving the overall performance and usage experience.
[0033] Specifically, the accommodating chamber 11 in the box body 10 is a relatively closed chamber structure, into which a certain amount of insulating coolant 30 is injected. The working component 20 is arranged in the accommodating chamber 11 and is located below the liquid level of the insulating coolant 30, so that the whole is immersed in the insulating coolant 30, so that the coolant is in direct contact with the working component 20 and can increase the contact area with the working component 20, so as to quickly take away heat during the circulation of the insulating coolant 30 and achieve efficient cooling.
[0034] At the same time, a plurality of injection mechanisms 50 are provided on the circulation system 40, and each injection mechanism 50 can be provided with an injection port, and each injection port is located in the insulating coolant 30 and is directly facing a single working component 20, so that when a single component needs targeted cooling, the coolant is sprayed to achieve efficient cooling of the single component.
[0035] It is understandable that the working component 20 is used to realize the basic functions of the server. In the working state, due to the difference in processing data and the difference in the functions of each component, the heat generation of each component is different, which makes it difficult for the traditional overall liquid cooling to achieve effective targeted cooling treatment, thereby causing the performance and service life of a single component to decrease. In this embodiment, through the setting of the injection mechanism 50, a spray port is provided corresponding to a single working component 20, and the insulating coolant 30 sprayed from the spray port can increase the liquid flow rate at the location of the single component, so that the heat can be taken away more quickly, and targeted cooling of the single working component 20 is achieved, so that each single component can have a more suitable working environment, improve the performance and service life of the single component, and enhance the overall user experience.
[0036] It should be known that when the working component 20 is immersed in some conventional coolants, the normal operation of the working component 20 will be affected by the coolant. In this embodiment, the working component 20 is immersed in an insulating coolant 30, so that the coolant will not affect the specific operation of the working component 20 during the circulation process.
[0037] In some embodiments, the insulating coolant 30 may be a synthetic oil or a fluorinated solution. Specifically, the synthetic oil may be polyetheretherketone (PEEK) and polyester oil, so as to avoid affecting the normal operation of the working part 20 during the circulation process. The fluorinated solution may be a Novec series coolant produced by 3M. Of course, it may also be a water-based insulating coolant 30, that is, a treated water-based liquid with insulation and preservatives added to achieve its insulation and ensure the insulating properties of the coolant.
[0038] In some embodiments, the surface of the working component 20 is coated with an insulating layer to achieve insulation of the working component 20 itself, which can further enhance the insulation effect between the working component 20 and the insulating coolant 30 and ensure the normal operation of the working component 20.
[0039] In a specific configuration, the working component 20 includes a mainboard 21, and a CPU 22, a graphics card 23, and a hard disk 24 disposed on the mainboard 21. An insulating layer is coated on the mainboard 21, the CPU 22, the graphics card 23, and the hard disk 24. The insulating layer can improve the insulation effect between the working component 20 and the insulating coolant 30, thereby preventing the insulating coolant 30 from affecting the working component 20.
[0040] For example, the insulating layer may be one or more combinations of polyester coating, polyurethane coating and epoxy coating. The insulating layer coated with the insulating layer can prevent the insulating coolant 30 from affecting the normal operation of the working part 20 .
[0041] like Figure 1 As shown, the working component 20 is arranged at the bottom of the accommodating chamber 11, specifically, the mainboard 21 is arranged at the bottom of the accommodating chamber 11, and a CPU 22, a graphics card 23 and a hard disk 24 are arranged on the mainboard 21. Three injection mechanisms 50 are provided, and the injection ports on the three injection mechanisms 50 are arranged in a one-to-one correspondence with the CPU 22, the graphics card 23 and the hard disk 24, so that when separate cooling is required, the insulating coolant 30 is sprayed through the injection port to achieve efficient cooling of a single component.
[0042] In the specific setting, the box body 10 is a rectangular box body 10, and the accommodating chamber 11 formed inside the box body 10 is a rectangular closed chamber structure. The working component 20 is arranged at the bottom of the accommodating chamber 11, which enables the working component 20 to be immersed in less insulating solution, thereby saving the use of insulating coolant 30.
[0043] In some embodiments, the circulation system 40 includes a liquid delivery device 43 and a liquid cooling device 45, the liquid delivery device 43 is connected to the accommodating chamber 11 through an output pipeline 41, the input port of the liquid cooling device 45 is connected to the liquid delivery device 43 through a connecting pipeline 44, and the output port of the liquid cooling device 45 is connected to the accommodating chamber 11 through a liquid inlet pipeline 46; wherein, the injection mechanism 50 is connected to the liquid inlet pipeline 46. The circulation system 40 needs to drive the coolant to circulate, and realize the cooling of the coolant during the circulation process, that is, the cooling of the coolant, so as to continuously realize the exchange of the internal temperature. In this embodiment, by arranging the liquid cooling device 45 in the circulation system 40, the cooling of the insulating coolant 30 in the circulation system 40 can be realized, so that the insulating coolant 30 can quickly take away the heat generated by the internal working parts 20.
[0044] Generally speaking, the circulation system 40 of the liquid cooling system will output cooling with heat, and can dissipate or exchange heat during the circulation process, thereby cooling the coolant and maintaining the continuity of the entire circulation system 40. For example, by placing the circulation pipeline in the circulation system 40 externally, the heat in the pipeline is exchanged with the external environment to achieve cooling of the coolant. In this embodiment, by providing a liquid cooling device 45 in the circulation system 40, the insulation coolant 30 can be cooled more quickly, thereby increasing the flow rate of the insulation coolant 30 in the circulation system 40, and then achieving efficient internal cooling.
[0045] Specifically, the liquid cooling device 45 is a condenser. The insulating coolant 30 input by the liquid delivery device 43 has a certain temperature. After passing through the condenser, the insulating coolant 30 is cooled, so that the insulating coolant 30 input through the liquid inlet pipeline 46 is in a low-temperature state, thereby continuously achieving internal cooling.
[0046] like Figure 1 As shown, in some embodiments, an output connecting hole is opened on the side wall of the box body 10, and the output pipeline 41 is connected with the accommodating chamber 11 through the output connecting hole, and the output connecting hole is located below the liquid level of the insulating coolant 30 and close to the working part 20; an input connecting hole is opened on the side wall of the box body 10 opposite to the output connecting hole, and the liquid inlet pipeline 46 is connected with the accommodating chamber 11 through the input connecting hole, and the input connecting hole is located at the upper part of the accommodating chamber 11.
[0047] Specifically, the connection position between the output pipeline 41 and the box body 10 is located at the lower part of the box body 10 , which is close to the working component 20 , so that the generated heat can be taken away in time to avoid heat accumulation inside the accommodating chamber 11 .
[0048] like Figure 1As shown, the liquid inlet pipe 46 is located above the liquid surface, so that the injected coolant has a certain fluidity inside, maintaining the uniformity of the overall cooling. In addition, this method can effectively prevent bubbles from being sucked into the system and reduce air resistance.
[0049] In specific configuration, the liquid delivery device 43 includes a water pump, which can generate negative pressure to quickly absorb the insulating coolant 30 and achieve efficient circulation of the insulating coolant 30. Of course, peristaltic pumps, gear pumps and other devices can also be used for pumping operations.
[0050] In some embodiments, a pre-cooling component 42 is provided on the output pipeline 41, and the pre-cooling component 42 is used to preliminarily cool the insulating coolant 30. When the insulating coolant 30 is cooled, the cooling efficiency can be improved through two-stage cooling, thereby enhancing the overall cooling effect.
[0051] Generally speaking, the insulating coolant 30 can be cooled by introducing it into the liquid cooling device 45. In this embodiment, by providing a pre-cooling component 42 before the liquid cooling device 45, the insulating coolant 30 can be initially cooled, thereby improving the overall cooling efficiency and reducing the workload of the liquid cooling device 45.
[0052] In a specific implementation, the pre-cooling component 42 includes a pre-cooling pipeline with a spiral structure. During pre-cooling, the high-temperature insulating coolant 30 is mainly cooled initially.
[0053] In this embodiment, the spiral pipeline structure can increase the contact area with the external environment, thereby achieving efficient heat exchange, reducing the temperature of the insulating coolant 30 in the pre-cooling pipeline, and achieving preliminary cooling. The preliminarily cooled insulating coolant 30 is then input into the liquid cooling device 45 through the liquid conveying device 43 for cooling, which can improve the cooling efficiency and cooling effect of the system.
[0054] It can be understood that, through the spiral pre-cooling pipeline setting, the unnecessary pre-cooling component 42 is cooled, thereby achieving energy saving of the overall system, and being able to effectively cool the insulating coolant 30 in the pipe, thereby improving the cooling effect and cooling efficiency.
[0055] When setting up specifically, one or more sets of spiral precooling pipelines can be set up. When setting up one set, such as Figure 1 As shown, the inlet end of the precooling pipeline is connected to the output pipeline 41, and the outlet end of the precooling pipeline is connected to the inlet of the liquid delivery device 43. When multiple groups are provided, multiple groups of precooling pipelines can be arranged side by side, and multiple precooling pipelines can be connected in series to achieve a better precooling effect, further improving the cooling efficiency and cooling effect of the coolant.
[0056] According to the embodiment provided by the present invention, each injection mechanism 50 includes an injection pipe 51 and an injection assembly 52, one end of the injection pipe 51 is connected to the circulation system 40, and the injection assembly 52 is provided at the injection port of the other end of the injection pipe 51; wherein the injection assembly 52 includes a fixed portion 522, a rotating shaft 523 and a pipe cover, the fixed portion 522 is fixedly arranged in the injection pipe 51, the rotating shaft 523 is rotatably arranged on the fixed portion 522, one end of the rotating shaft 523 is provided with a vortex impeller 521, and is located in the injection pipe 51; the other end of the rotating shaft 523 is connected to the pipe cover and is located in the injection pipe 5 1; the pipe cover includes a rotating disk 524 and a fixing ring 525, the fixing ring 525 is fixed on the bottom surface of the rotating disk 524, the inner wall surface of the fixing ring 525 and the outer wall surface of the injection tube 51 are provided with a rotation gap, and the inner wall surface of the fixing ring 525 is provided with a first annular groove 527, and the outer wall surface of the injection tube 51 is provided with a second annular groove 528, the first annular groove 527 and the second annular groove 528 cooperate to form a rotating annular groove; a ball 526 is provided in the rotating annular groove, and a plurality of spray holes 5241 are provided on the rotating disk 524, and the plurality of spray holes 5241 are arranged directly opposite to the working part 20. The fluidity of the insulating coolant 30 inside the accommodating chamber 11 will affect the overall cooling effect and the uniformity of the cooling. In this embodiment, the injection assembly 52 can spray the insulating coolant 30 toward the corresponding working component 20. During the injection process, the local flow rate can be increased, thereby achieving efficient cooling of a single component on the one hand, and increasing the flow rate of the internal insulating coolant 30 on the other hand, thereby achieving uniform cooling of the entire interior and improving cooling efficiency.
[0057] Specifically, the vortex impeller 521 is arranged in the injection pipe 51. When the flowing liquid is injected into the injection pipe 51, it can drive the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 drives the rotation of the shaft. The rotation of the shaft drives the tube cover to rotate. The multiple spray holes 5241 on the tube cover form vortices during the rotation process, so that the external flow rate of the workpiece part facing the spray port can be increased, the cooling effect can be improved, and targeted cooling can be achieved. In this way, the flow of the insulating coolant 30 in the accommodating chamber 11 is also accelerated, and the uniformity of the overall cooling is improved.
[0058] like Figure 2-Figure 4 As shown, the fixing part 522 includes a fixing rod, both ends of which are fixedly arranged in the injection pipe 51, and the rotating shaft 523 passes through the fixing rod and is rotatably connected to the fixing rod. After the insulating coolant 30 is injected, the liquid impacts the vortex impeller 521 to rotate the vortex impeller 521, thereby driving the rotating shaft 523 to rotate relative to the fixing part 522.
[0059] In the specific configuration, a rotation hole is opened on the fixed rod, a rotation shaft 523 bearing is arranged in the rotation hole, and the rotation shaft 523 is arranged on the fixed rod through the rotation shaft 523 bearing, so that the vortex impeller 521 rotates under the thrust of the liquid.
[0060] It is understandable that the tube cover can rotate relative to the spray tube 51 under the drive of the rotating shaft 523, and specifically, the rotation of the tube cover is more stable through the cooperation of the rotating annular groove and the ball 526. The spray hole 5241 forms a vortex in the process of rotation, thereby increasing the flow speed and accelerating the cooling.
[0061] In some embodiments, Figure 3 , Figure 4 As shown, multiple spray holes 5241 are evenly arranged along the circumference of the rotating disk 524 to form a circular array of spray holes 5241. The arrangement of the spray hole 5241 array can improve the uniformity of the sprayed liquid and facilitate the formation of vortices, thereby improving the targeted cooling effect and the uniformity of the overall cooling.
[0062] Specifically, the rotating shaft 523 is connected to the middle of the rotating disk 524, and the spray hole 5241 array is located on a circle around the rotating shaft 523. This arrangement can ensure the overall structural strength of the rotating disk 524, making the overall stability of the tube cover higher.
[0063] In some embodiments, the injection pipe 51 includes a transmission pipe section 517 and a circulation pipe section 518, wherein the transmission pipe section is connected to the circulation system 40, and the circulation pipe section 518 is connected to the housing 10; wherein the injection assembly 52 is arranged at the injection port position of the circulation pipe section 518, the circulation pipe section 518 is arranged obliquely downward, and the injection port of the circulation pipe section 518 extends into the accommodating chamber 11. The injection pipe 51 needs to be connected to the cooled insulating coolant 30. In this embodiment, the transmission pipe section is connected to the circulation system 40, so as to input the coolant into the injection pipe 51. The circulation pipe section 518 can realize the rapid flow of the insulating coolant 30, and drive the injection assembly 52 to realize the injection of the insulating coolant 30.
[0064] Specifically, the port of the circulation pipe section 518 is the injection port, and the injection assembly 52 is arranged in the injection port. Since the circulation pipe section 518 is inclined downward, the flow rate of the liquid passing through the circulation pipe section 518 is increased, thereby effectively driving the vortex impeller 521 to rotate, and realizing the injection of the insulating coolant 30 through the spray hole 5241.
[0065] It can be understood that the injection port in this embodiment is located in the insulating coolant 30 and is close to the working part 20. The injection assembly 52 is arranged at the injection port, and the tube cover is located outside the injection port. The tube cover can rotate under the drive of the injected liquid, thereby driving the insulating coolant 30 at the tube cover position to rotate, thereby realizing the flow speed of the insulating liquid in the accommodating chamber 11 to improve the cooling efficiency and cooling effect.
[0066] like Figure 1 , Figure 2 As shown, a spray port is provided above each working component 20, and the axis of the spray port spray direction forms a spray angle with the working component 20. The spray assembly 52 is provided at the spray port, and the spray angle setting can increase the coverage of the spray with the working component 20 and improve the cooling effect.
[0067] Specifically, a connecting hole is provided on the side wall of the box body 10, and part of the circulation pipe section 518 is located in the connecting hole to realize the connection between the circulation pipe section 518 and the box body 10. The circulation pipe section 518 is connected to the transmission pipe section, so that the insulating coolant 30 is input into the circulation pipe section 518 through the transmission pipe section.
[0068] like Figure 2 As shown, an obtuse angle is formed between the flow pipe section 518 and the transmission pipe section, so that the flow pipe section 518 is arranged to be inclined downward to achieve high-speed flow of the insulating coolant 30.
[0069] In some embodiments, electric control valves are provided on both the transmission pipe section and the circulation system 40. The provision of electric control valves facilitates the access of the automatic control system, realizes overall automatic control, and improves the degree of automation.
[0070] Specifically, an electrically controlled valve is provided on the liquid inlet pipeline 46 in the circulation system 40, and an electrically controlled valve is also provided on each transmission pipe section. The electrically controlled valve can be connected to the control system to achieve control of each electrically controlled valve.
[0071] In some specific implementations, the flow pipe section 518 may be made of stainless steel. The flow pipe section 518 made of stainless steel can have corrosion resistance and high structural strength to improve overall stability and durability.
[0072] like Figure 2 , Figure 5As shown, the specific configuration includes a first injection pipe 51151, a second injection pipe 51251 and a third injection pipe 51351. The first injection pipe 51151 includes a first transmission pipe section and a first circulation pipe section 518, and the first injection port of the first circulation pipe section 518 is arranged opposite to the CPU 22 on the motherboard 21; the second injection pipe 51251 includes a second transmission pipe section and a second circulation pipe section 518, and the second injection port of the second circulation pipe section 518 is arranged opposite to the graphics card 23 on the motherboard 21; the third injection pipe 51351 includes a third transmission pipe section and a third circulation pipe section 518, and the third injection port of the third circulation pipe section 518 is arranged opposite to the hard disk 24 on the motherboard 21.
[0073] Among them, a first electrically controlled valve 514 is provided on the first transmission pipe section, a second electrically controlled valve 515 is provided on the second transmission pipe section, a third electrically controlled valve 516 is provided on the third transmission pipe section, and a fourth electrically controlled valve 47 is provided on the liquid inlet pipeline 46 in the circulation system 40. The four electrically controlled valves can control the on-off of their respective pipelines.
[0074] In the control system, the first electrically controlled valve 514 , the second electrically controlled valve 515 , the third electrically controlled valve 516 and the fourth electrically controlled valve 47 are all connected to the control system, so that each electrically controlled valve can be controlled to achieve cooling operations for different working parts 20 .
[0075] For example, when it is detected that the temperature of CPU22 is too high, it is necessary to cool down CPU22. At this time, the first electrically controlled valve 514 is controlled to be opened, and the second electrically controlled valve 515, the third electrically controlled valve 516 and the fourth electrically controlled valve 47 are controlled to be closed, so that the insulating coolant 30 passes through the first transmission pipe section and the first circulation pipe section 518, and the insulating coolant 30 is sprayed onto CPU22 by the spray assembly 52 at the first spray port, thereby achieving targeted cooling of CPU22. Specifically, the insulating coolant 30 flows out from the first circulation pipe section 518, and the insulating coolant 30 can drive the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 can drive the turntable 524 to rotate through the rotating shaft 523. At this time, when the coolant flows out from the spray hole 5241 on the rotating turntable 524, the insulating coolant 30 will be sprayed onto CPU22 in the form of a rotating vortex, and will be more fully in contact with CPU22, which can accelerate the reduction of the temperature of CPU22. Similarly, the temperature of the graphics card 23 and the hard disk 24 can also be quickly reduced. The device is reasonably designed and ingeniously conceived, and can effectively perform targeted cooling on different working accessories in the server, ensuring the cooling effect of all working accessories and increasing the service life of all accessories. While achieving targeted cooling of the CPU 22, it can also drive the flow speed of the internal insulating liquid to accelerate, thereby achieving more efficient cooling.
[0076] It should be noted that the CPU 22, graphics card 23 and hard disk 24 listed in the above embodiment are only exemplary and should not be understood as limiting the working component 20. After knowing this solution, those skilled in the art can use similar solutions to arrange other components, and no exhaustive description is given for this.
[0077] According to the embodiment provided by the present invention, a central controller 60 is also included, and the central controller 60 is arranged on the side wall outside the box body 10; each working component 20 is provided with a temperature sensor, and the temperature sensor is used to collect the temperature of the working component 20 in real time; the temperature sensor and the electric control valve are both electrically connected to the central controller 60, so as to selectively open the electric control valve based on the temperature sensor. The central controller 60 can realize data collection and output of control instructions, and the setting of the central controller 60 can improve the overall automation level and realize automated operation.
[0078] Specifically, a temperature sensor is provided on the side wall or top wall of each working component 20, and the temperature sensor is used to sense the temperature of the current working component 20. A temperature threshold is provided for each working component 20 in the central controller 60. When the sensed temperature exceeds the threshold, a control instruction is output to open the corresponding electric control valve to realize automatic control of the liquid cooling system.
[0079] In the specific configuration, a first temperature sensor 25 is provided on the side wall of the CPU 22, a second temperature sensor 26 is provided on the graphics card 23, and a third temperature sensor 27 is provided on the hard disk 24. Each temperature sensor is electrically connected to the central controller 60 in one direction, that is, the three temperature sensors are only used to transmit the sensed temperature data. Similarly, the first electric control valve 514, the second electric control valve 515, the third electric control valve 516 and the fourth electric control valve 47 are all electrically connected to the central controller 60 in one direction, so as to send the control instruction to each electric control valve.
[0080] During specific operation: the first temperature sensor 25, the second temperature sensor 26 and the third temperature sensor 27 respectively detect the real-time surface temperature data of the CPU 22, the graphics card 23 and the hard disk 24 on the mainboard 21, and send the real-time surface temperatures of the CPU 22, the graphics card 23 and the hard disk 24 to the central controller 60.
[0081] When cooling the mainboard 21 as a whole, the first, second and third electrically controlled valves 514, 515 and 516 are first closed to prevent the insulating coolant 30 from being ejected from the injection pipe 51, and the fourth electrically controlled valve 47 is opened. Then, the liquid delivery device 43 is started to allow the insulating coolant 30 in the housing 10 to enter the pre-cooling component 42 from the output pipeline 41 for preliminary heat dissipation. After the preliminary heat dissipation, the insulating coolant 30 enters the liquid cooling device 45 through the connecting pipeline 44 to further cool the insulating coolant 30. After the deep cooling, since the fourth electrically controlled valve 47 is opened and the other three electrically controlled valves are closed, the cooled insulating coolant 30 can enter the containing chamber 11 from the liquid inlet pipeline 46. After that, the insulating coolant 30 circulates back and forth to continuously take away the heat from the mainboard 21 as a whole.
[0082] When the temperature of one of the working components 20 of the CPU 22, the graphics card 23 and the hard disk 24 rises, targeted cooling is required. For example, when the central controller 60 detects that the surface temperature of the CPU 22 exceeds a preset threshold, the first electrically controlled valve 514 on the first transmission pipe section above the CPU 22 can be opened, and the second electrically controlled valve 515, the third electrically controlled valve 516 and the fourth electrically controlled valve 47 can be closed, so that the low-temperature insulating coolant 30 enters the first circulation pipe section 518 from the first transmission pipe section, and finally is sprayed from the spray port of the first circulation pipe section 518 by the spray assembly 52 to the CPU 22, so as to perform targeted cooling on the CPU 22. The insulating coolant 30 flows out from the first circulation pipe, and the insulating coolant 30 can drive the vortex impeller 521 to rotate. The rotation of the vortex impeller 521 can drive the turntable 524 to rotate through the rotating shaft 523. At this time, when the insulating coolant 30 flows out from the spray hole 5241 on the rotating turntable 524, the insulating coolant 30 will be sprayed onto the CPU 22 in a rotating vortex shape, and will be in more complete contact with the CPU 22, which can accelerate the reduction of the temperature of the CPU 22. Similarly, the temperatures of the graphics card 23 and the hard disk 24 can also be quickly reduced.
[0083] In the specific setting, the central controller 60 includes an MSP430 microcontroller or a PLC controller of the model OMRON CP1E-N20DR-D. The MSP430 microcontroller has low power consumption, an efficient 16-bit RISC architecture, fast processing speed, is suitable for real-time applications, and provides a variety of peripheral options, such as ADC, timer and communication interface, to meet different application requirements. In addition, the MSP430 microcontroller is widely used, mature in technology and low in cost, and is suitable for large-scale mass production.
[0084] The OMRON CP1E-N20DR-D PLC controller is used, which has high performance, 20 input / output points, fast response speed, suitable for various automation tasks, and can be miniaturized to save space, suitable for applications with limited space. It supports multiple programming languages, such as ladder diagram and structured text, which is easy for users to get started.
[0085] The present invention also provides a server, which includes the liquid cooling device as described above.
[0086] In a specific embodiment, the server includes a chassis, a motherboard 21, a central processing unit, a memory and a storage device; the chassis has a box body 10, and the box body 10 forms a accommodating chamber 11, and a large amount of insulating coolant 30 is injected into the accommodating chamber 11. The motherboard 21, the central processing unit, the memory and the storage device are arranged below the liquid surface of the insulating coolant 30, so that the motherboard 21, the central processing unit, the memory and the storage device are all immersed in the insulating coolant 30.
[0087] In this embodiment, the specific structure of the server should not be limited. As long as the server is equipped with the above-mentioned liquid cooling device, it should fall within the description scope of this embodiment; the server should have all the beneficial effects of the above-mentioned liquid cooling device, which will not be repeated here.
[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A liquid cooling device, characterized in that: include: A box body, wherein the box body is formed with a receiving chamber for receiving the insulating coolant, wherein a plurality of working parts are arranged in the receiving chamber, and wherein the working parts are immersed in the insulating coolant; A circulation system, the circulation system is connected to the accommodating chamber, the circulation system is used to drive the circulation of the insulating coolant and remove the heat generated by the working parts during the circulation process; Among them, a plurality of injection mechanisms are connected to the circulation system, and the injection ports of the plurality of injection mechanisms are all arranged in the insulating coolant in the accommodating chamber, and are arranged one-to-one corresponding to the plurality of working parts, so as to selectively spray the insulating coolant toward the corresponding working parts.
2. The liquid cooling device according to claim 1, characterized in that: The circulation system comprises a liquid conveying device and a liquid cooling device, wherein the liquid conveying device is connected to the accommodating chamber via an output pipeline, the input port of the liquid cooling device is connected to the liquid conveying device via a connecting pipeline, and the output port of the liquid cooling device is connected to the accommodating chamber via a liquid inlet pipeline; Wherein, the injection mechanism is connected to the liquid inlet pipeline.
3. The liquid cooling device according to claim 2, characterized in that: The output pipeline is provided with a pre-cooling component, and the pre-cooling component is used for preliminarily cooling the insulating coolant.
4. The liquid cooling device according to claim 3, characterized in that: The pre-cooling component comprises a pre-cooling pipeline with a spiral structure.
5. The liquid cooling device according to claim 1, characterized in that: The injection mechanism comprises an injection pipe and an injection assembly, one end of the injection pipe is connected to the circulation system, and the injection port at the other end of the injection pipe is provided with the injection assembly; The spray assembly comprises a fixed part, a rotating shaft and a pipe cover, wherein the fixed part is fixedly arranged in the spray pipe, the rotating shaft is rotatably arranged on the fixed part, one end of the rotating shaft is provided with a vortex impeller and is located in the spray pipe; the other end of the rotating shaft is connected to the pipe cover and is located outside the pipe opening of the spray pipe; The tube cover comprises a turntable and a fixed ring, wherein the fixed ring is fixedly arranged on the bottom surface of the turntable, a rotation gap is arranged between the inner wall surface of the fixed ring and the outer wall surface of the injection tube, and a first annular groove is arranged on the inner wall surface of the fixed ring, and a second annular groove is arranged on the outer wall surface of the injection tube, and the first annular groove and the second annular groove cooperate to form a rotating annular groove; a ball is arranged in the rotating annular groove, and a plurality of spray holes are arranged on the turntable, and the plurality of spray holes are arranged directly opposite to the working component.
6. The liquid cooling device according to claim 5, characterized in that: The plurality of spray holes are evenly arranged along the circumference of the rotating disk to form a circular spray hole array.
7. The liquid cooling device according to claim 5, characterized in that: The injection pipe includes a transmission pipe section and a circulation pipe section, the transmission pipe section is connected to the circulation system, and the circulation pipe section is connected to the box; Wherein, the injection assembly is arranged at the injection port position of the circulation pipe section, the circulation pipe section is arranged to be inclined downward, and the injection port of the circulation pipe section extends into the accommodating chamber.
8. The liquid cooling device according to claim 7, characterized in that: The transmission pipe section and the circulation system are both provided with electric control valves.
9. The liquid cooling device according to claim 8, characterized in that: It also includes a central controller, which is arranged on the side wall outside the box; A temperature sensor is provided on each working component, and the temperature sensor is used to collect the temperature of the working component in real time. The temperature sensor and the electric control valve are both electrically connected to the central controller to selectively open the electric control valve based on the temperature sensor.
10. A server, characterized in that: The server comprises the liquid cooling device according to any one of claims 1-9.
Citation Information
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