Adhesive tape cutting-off equipment for lead frame
By introducing flattening structures, stamping parts, feeding devices and offset detection devices into the tape cutting equipment, the problems of tape offset and looseness during the tape pasting process are solved, and the tape is firmly fitted and efficiently cut is achieved. Improves the strap quality and production efficiency of the lead frame.
Patent Information
- Application Number
- CN202411598146.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-01-03
AI Technical Summary
Existing tape cutting equipment can easily lead to tape offset and looseness during tape attaching, affecting the fitting quality of the lead frame.
A tape cutting device including a flattened structure, stamping parts, feeding devices and offset detection devices is designed. The tape is softened by heating components, the structure is flattened with the lead frame, the stamping parts are cut through the tape, and the tape is fed through the supply. The material device automatically separates the protective film, and the offset detection device monitors and alarms in real time.
Ensure the tape is firmly attached to the lead frame, reducing waste, improving tape efficiency and production quality, and preventing tape offset and looseness.
Smart Images
Figure CN119252772A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of lead frame production, and in particular to a lead frame tape cutting device. Background Art
[0002] As the chip carrier of the integrated circuit, the lead frame is a key structural component that uses bonding materials to achieve electrical connection between the internal circuit lead-out terminals of the chip and the external leads to form an electrical circuit. The lead frame needs to be taped after production, but the current taping and cutting equipment needs to use a mold to punch and cut the tape and then stick it to the lead frame during the lead frame taping process. However, when the mold sticks the tape to the lead frame, it is easy for the tape to not stick tightly due to too short a bonding time, causing the taping position to loosen and shift. Summary of the invention
[0003] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution in which the mold will not be offset or loosened after the adhesive tape is taped.
[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a lead frame taping and cutting device, comprising a machine platform, a frame is provided on one side of the machine platform, a discharge device for feeding out the lead frame is arranged inside the frame, a flattening structure for flattening the lead frame is provided above the frame at the output end of the discharge device, a taping mold for taping the lead frame output by the discharge device is detachably connected to the machine platform, a stamping part for stamping and cutting the tape is provided in the taping mold, a feeding device for supplying tape to the taping mold is also provided above the machine platform, a stamping table for stamping and cutting the taped lead frame is provided on the machine platform, a feeding mechanism for driving the lead frame to move is provided on the machine platform, and the feeding mechanism includes an offset detection device for detecting the offset amount of the lead frame.
[0005] As a further solution of the present invention: the flattening structure includes multiple bases located on the frame, a movable plate arranged above the base for flattening the lead frame, multiple lower flattening convex rollers are arranged at intervals in the base, and multiple upper flattening convex rollers are arranged at intervals in the movable plate, a flattening gap is formed between the lower flattening convex rollers and the upper flattening convex rollers through which the lead frame will be flattened when passing through, the multiple lower flattening convex rollers and the multiple upper flattening convex rollers are staggered, and an adjustment structure for adjusting the distance between the movable plate and the base is provided above the movable plate.
[0006] As a further solution of the present invention: the adjustment structure includes a guide rod located on the base, one end of the guide rod is connected to the movable plate and protrudes through the movable plate and is coupled with a pressure block through a thread, the lower side of the pressure block abuts against the movable plate, and the guide rod is provided with a spring at a position between the base and the movable plate.
[0007] As a further solution of the present invention: the stamping part includes a cutting plate and a stamping head cooperating with the cutting plate, the cutting plate is provided with a cutting area, the inside of the stamping head is provided with adsorption holes for allowing the stamping head to adsorb tape, one side of the cutting plate is provided with a tape feeding channel for conveying the tape to the cutting area, the tape feeding channels are divided into multiple groups, and the tape feeding channels are distributed on the outer peripheral side of the cutting plate, the taping mold is also provided with a heating component, the heating component includes a lower pressing block and a heating element provided below the lower pressing block for heating the lower pressing block, and the lead frame is placed on the lower pressing block.
[0008] As a further solution of the present invention: the feeding device includes a feeding tray for placing and feeding the tape and a winding tray for winding up the tape protective film. The feeding device also includes a feeder located outside the taping mold and used to feed the tape in the feeding tray into the taping mold. The feeder includes a first motor, one side of the first motor drives a rotating shaft. The feeder also includes a flat plate, which is located on one side of the rotating shaft, and the top surface is parallel to the top of the rotating shaft. A movable block is provided inside the flat plate.
[0009] As a further solution of the present invention: the stamping table includes an upper stamping table and a lower stamping table, the upper stamping table is provided with a tool assembly and a stamping head for stamping the lead frame, the tool assembly includes a tool cylinder and a tool, the tool cylinder is used to push out the tool to cut the lead frame.
[0010] As a further solution of the present invention: the offset detection device is a fiber optic sensor, and the fiber optic sensor detects the offset by detecting the position of the hole on the lead frame.
[0011] As a further solution of the present invention: the feeding mechanism includes a pressing cylinder and a power device for providing power for the lead frame transportation, the power device includes a motor and a power guide wheel, the pressing cylinder is provided with a pressing guide wheel, and the pressing guide wheel is used to clamp and fix the lead frame with the power wheel when the lead frame is suspended.
[0012] As a further solution of the present invention: the feeding mechanism includes two oppositely arranged feeding guides for limiting the deviation of the lead frame, two groups of feeding guide wheels are provided on the side walls of the feeding guides, and a guiding gap is formed between the two groups of feeding guide wheels, and the guiding gap is used for guiding the lead frame.
[0013] As a further solution of the present invention: a CCD inspection station for inspecting the lead frame after tape bonding is provided above the machine, and a pressurizing station for reinforcing the bonding between the lead frame and the tape is provided above the machine.
[0014] Compared with the prior art, the beneficial effects of the present technical solution are as follows: the lead frame can be heated by the heating component, so that when the adhesive tape contacts the lead frame, it will soften due to the temperature of the lead frame, so that the adhesive tape can be firmly attached to the lead frame; The flattening structure can flatten the bent lead frame delivered by the unloading device, so that the lead frame will not be offset by the tape during taping; The stamping part allows the tape to contact the lead frame, and the tape is stamped and cut, so there will be no waste, and it can also ensure that the tape can be attached to the lead frame instead of the stamping part; At the same time, the feeding device can automatically supply tape to the taping mold, and can also automatically separate the RT tape body and the tape protective film. There is no need to manually separate the protective film on the RT tape, which speeds up the taping efficiency of the taping mold on the lead frame. Furthermore, by adopting the offset detection device arranged on the feeding structure, the offset device can detect the offset of the lead frame and alarm for the non-compliant lead frame, so that the cut lead frame has better quality and higher production efficiency.
[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0017] Figure 1 It is a stereogram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the machine structure of the present invention; Figure 3 It is a schematic diagram of the structure of the taping mold of the present invention; Figure 4 is a schematic diagram of a front view of the upper half of the taping mold of the present invention; Figure 5 yes Figure 5 A side cross-sectional schematic diagram of ; Figure 6 It is a schematic diagram of the structure of the stamping part of the present invention; Figure 7 It is a schematic diagram of the structure of the cutting board of the present invention; Figure 8The frame structure of the present invention is shown in FIG. Figure 1 ; Fig. 9 The frame structure of the present invention is schematically shown in FIG. Figure 2 ; Fig.10 is a schematic front view of the flattened structure of the present invention; Fig.11 The feeding device structure of the present invention is schematically shown in FIG. Figure 1 ; Fig.12 The feeding device structure of the present invention is schematically shown in FIG. Figure 2 ; Fig.13 It is a front view schematic diagram of the feeding device of the present invention; Fig.14 It is a schematic diagram of the structure of the punching table of the present invention; Fig.15 It is a front view schematic diagram of the punching table structure of the present invention; Fig.16 yes Fig.14 A schematic diagram of the enlarged local structure at center A; The corresponding reference numerals in the accompanying drawings are described as follows: 1. Machine; 11. Tape sticking mold; 111. Stamping part; 112. Cutting board; 113. Stamping head; 114. Cutting area; 115. Adsorption hole; 116. Tape feeding channel; 117. Heating assembly; 118. Lower pressing block; 119. Heating element; 2. Feeding device; 21. Feeding tray; 22. Reel; 23. Feeder; 24. First motor; 25. Rotating shaft; 26. Flat plate; 27. Stopper; 3. Base plate; 4. Stamping table; 41. Feeding mechanism; 411. Pressing air pipe; 412. Power device; 413. Second motor ;414, power guide wheel;415, pressure guide wheel;416, feed guide plate;417, feed guide wheel;418, guide gap;42, offset detection device;43, upper punching table;44, lower punching table;45, driving device;451, driving motor;452, eccentric wheel;453, bottom plate;5, frame;51, discharge device;52, flattening structure;521, base;522, movable plate;523, lower flattening convex roller;524, upper flattening convex roller;525, adjustment structure;526, guide rod;527, pressure block;528, spring. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0019] See also Figure 1-16 A lead frame taping and cutting device comprises a machine platform 1, a frame 5 is provided on one side of the machine platform 1, a feeding device 51 for feeding out the lead frame is arranged inside the frame 5, a flattening structure 52 for flattening the lead frame is arranged above the frame 5 at the output end of the feeding device 51, a taping die 11 detachably connected to the machine platform 1 for taping the tape to the lead frame output by the feeding device 51, a stamping part 111 for stamping and cutting the tape is arranged in the taping die 11, a feeding device 2 for supplying tape to the taping die 11 is also arranged above the machine platform 1, a stamping table 4 for stamping and cutting the taped lead frame is arranged on the machine platform 1, a feeding mechanism 41 for driving the lead frame to move is arranged on the machine platform 1, the feeding mechanism 41 comprises an offset detection device 42 for detecting the offset of the lead frame, and the flattening structure can be used to detect the offset of the lead frame. The bent lead frame delivered by the discharge device is flattened so that the lead frame will not have tape offset during taping. The stamping part allows the tape to contact the lead frame and punch and cut the tape, so that no waste will occur. It can also ensure that the tape can be attached to the lead frame instead of the stamping part. At the same time, the feeding device can automatically supply tape to the taping mold while automatically separating the RT tape body and the tape protective film. There is no need to manually separate the protective film on the RT tape, which speeds up the taping efficiency of the taping mold on the lead frame. In addition, by adopting the offset detection device set on the feeding structure, the offset device can detect the offset of the lead frame and alarm for the non-compliant lead frame, so that the cut lead frame has better quality and higher production efficiency.
[0020] In some embodiments, the flattening structure 52 includes a plurality of bases 521 located on the frame 5, a movable plate 522 disposed above the base 521 for flattening the lead frame, a plurality of lower flattening convex rollers 523 are disposed at intervals in the base 521, a plurality of upper flattening convex rollers 524 are disposed at intervals in the movable plate 522, a flattening gap is formed between the lower flattening convex rollers 523 and the upper flattening convex rollers 524 through which the lead frame will be flattened when passing through, the plurality of lower flattening convex rollers 523 and the plurality of upper flattening convex rollers 524 are disposed in staggered positions, an adjusting structure 525 for adjusting the distance between the movable plate 522 and the base 521 is disposed above the movable plate 522, and the adjusting structure 525 includes a position A guide rod 526 on the base 521, one end of the guide rod 526 penetrates and protrudes from the movable plate 522 and is coupled with a pressure block 527 through a thread, and the lower part of the pressure block 527 abuts against the movable plate 522, and a spring 528 is sleeved on the guide rod 526 at a position between the base 521 and the movable plate 522, and the offset setting between the lower flattening convex roller 523 and the upper flattening convex roller 524 can flatten the bent lead frame, and the threaded coupling between the guide rod 526 and the pressure block 527 can adjust the distance between the movable plate 522 and the base 521, so that the lower flattening convex roller 523 and the upper flattening convex roller 524 can flatten lead frames of different thicknesses; The specific flattening process is as follows: the lead frame will pass through the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 when moving. The flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 matches the thickness of the lead frame, so that the bent lead frame can be flattened. When facing a thin lead frame, the pressing block 527 can be rotated in the positive direction to move the pressing block 527 toward the base 521. When the pressing block 527 moves, it will drive the movable plate 522 to move together, so as to reduce the distance between the pressing block 527 and the base 521, so that In order to reduce the distance between the lower flattening convex roller 523 and the upper flattening convex roller 524, the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 is adapted to the thickness of the lead frame to achieve the flattening effect. When facing a thicker lead frame, the pressing block 527 is rotated in the opposite direction to release the pressure on the movable plate 522 by the pressing block 527, so that the spring 528 can recover. When the spring 528 recovers, it will push the movable plate 522 to the bottom of the pressing block 527, so that the flattening gap between the lower flattening convex roller 523 and the upper flattening convex roller 524 is increased, thereby adapting to the thickness of the lead frame.
[0021] In some embodiments, the taping mold 11 includes an upper mold and a lower mold, a stamping part 111 is located in the upper mold, and a heating component 117 is located in the lower mold, the stamping part 111 includes a cutting plate 112 and a stamping head 113 matched with the cutting plate 112, a cutting area 114 is provided on the cutting plate 112, and an adsorption hole 115 is provided inside the stamping head 113 for allowing the stamping head 113 to adsorb the tape, and a tape feeding channel 116 for conveying the tape to the cutting area 114 is provided on one side of the cutting plate 112, and the tape feeding channels 116 are multiple groups, and the tape feeding channels 116 are distributed on the cutting plate 112. On the outer peripheral side of 12, a heating component 117 is also provided in the taping mold 11. The heating component 117 includes a lower pressing block 118 and a heating element 119 arranged under the lower pressing block 118 for heating the lower pressing block 118. The lead frame is placed on the lower pressing block 118. The cooperation between the punching head 113 and the cutting area 114 ensures that the punching head 113 will not generate waste when cutting the tape, and there is no need to consider the waste collection process. The cooperation between the lower pressing block 118 and the heating element 119 can heat the lead frame, so that the tape is softened after contacting the lead frame, thereby ensuring the taping effect.
[0022] The specific process of cutting and taping is as follows: after the adhesive tape moves to the cutting area 131 through the adhesive tape feeding channel 116, the upper die of the taping die 11 starts to move through the cylinder, and the stamping part of the taping die 11 moves with the stamping head 113, and the stamping head 113 passes through the cutting area 114 when moving, so as to cut the adhesive tape inside the cutting area 114, and when the stamping head 113 starts to move, the external vacuum pump starts to work, and after the external vacuum pump starts to work, the bottom of the stamping head 113 is pressed through the suction hole 115. The stamping head 113 is in a vacuum state, so that the cut tape can be adsorbed on the bottom of the stamping head 113, so that the tape at the bottom of the stamping head 113 will not be offset in position during the movement of the stamping head 113, and when the upper mold of the taping mold 11 starts to move, the heating element 119 in the lower mold of the taping mold 11 starts to heat up, and the heating element 119 transfers the heat to the lead frame through the lower pressing block 118 after heating, so that the tape on the stamping head 113 will be heated and softened when it contacts the lead frame, ensuring that the tape can be well attached to the lead frame In some embodiments: the feeding device 2 includes a feeding tray 21 for placing the tape and feeding the tape out, and a winding tray 22 for winding up the tape protective film. The feeding device 2 also includes a feeder 23 located outside the taping mold 11 and used to feed the tape in the feeding tray 21 into the taping mold 11. The feeder 23 includes a first motor 24. A rotating shaft 25 is driven on one side of the first motor 24. The feeder 23 also includes a flat plate 26. The flat plate 26 is located on one side of the rotating shaft 25, and the top surface is parallel to the top of the rotating shaft 25. A movable stopper 27 is provided inside the flat plate 26. The cooperation between the feeding tray 21 and the winding tray 22 can collect the protective film in the tape while feeding the tape, thereby eliminating the step of tearing off the protective film when the feeding tray is feeding the tape. The specific process of supplying the tape is as follows: start the first motor 24. After the first motor 24 is started, it will drive the rotating shaft 25 to rotate. After the rotating shaft 25 rotates, the tape will be fed into the direction of the taping mold 11 due to the adhesion between the tape and the rotating shaft 25. While the rotating shaft 25 rotates, the supply tray 21 will also start to rotate. After the supply tray 21 rotates, the tape inside will be transported in the direction of the path of the taping mold 11. Before being transported to the position of the rotating shaft 25, the tape will first pass through the area of the flat plate 26. The block 27 on the flat plate 26 can ensure that the tape will not deviate from the path during the transportation process. At the same time, The blocks 27 are movably arranged so that the spacing between the blocks 27 is adjustable, thereby being able to accommodate tapes of different widths. When the tape enters the taping mold 11, the taping mold 11 will start to cut the tape. At the same time, the take-up reel 22 is connected to the supply reel 21 by a belt drive, so that when the supply reel 21 rotates, the take-up reel 22 will also rotate together, and the tape and protective film in the supply reel 21 will be separated, and the protective film will be wound on the take-up reel 22, so that the tape can be fed into the taping mold 11 when the supply reel 21 is feeding, and the protective film is collected by the take-up reel 22 for easy recycling.
[0023] In some embodiments: the stamping table 4 includes an upper stamping table 43 and a lower stamping table 44, the upper stamping table 43 is provided with a tool assembly 431 and a stamping head 432 for stamping the lead frame, the tool assembly 431 includes a tool cylinder and a tool, the tool cylinder is used to push out the tool to cut the lead frame, the lower surface of the lower stamping table 44 is provided with a driving device 45, the driving device 45 includes a driving motor 451, the driving motor 451 is connected to an eccentric wheel 452, the lower surface of the eccentric wheel 452 is provided with a bottom plate 453, the bottom plate 453 is connected to the upper stamping table 43 through a guide column, and the eccentric wheel 452 drives the bottom plate 453 so that the upper stamping table 43 can move relatively close to the lower stamping table 44; The specific cutting process is as follows: when the driving motor 451 is started, the eccentric wheel 452 connected to the driving motor 451 will cause the bottom plate 453 to move downward and then cause the upper punching table 43 to move closer to the lower punching table 44. The upper punching table 43 and the lower punching table 44 cooperate with each other so that the punching table 43 punches the lead frame. The tool cylinder is used to push out the tool to cut the lead frame. When the punching table 43 completes the punching of the lead frame and needs to cut it, the tool cylinder pushes out the tool, and the upper punching table 43 moves closer to the lower punching table 44 so that the tool can cut the lead frame.
[0024] In some embodiments: In order to enable the system to detect the offset of the lead frame, the offset detection device 42 is a fiber optic sensor. The fiber optic sensor detects the offset by detecting the position of the hole on the lead frame. The fiber optic sensor can emit fine infrared rays. When detecting the hole on the lead frame, it can more accurately detect the offset of the hole on the lead frame. When the offset is too large, the system will shut down and alarm, waiting for workers to handle it, which can effectively solve the problem of uneven quality of lead frame production.
[0025] In some embodiments: the feeding mechanism 41 includes a pressing cylinder 411 and a power device 412 for providing power for the lead frame conveying, the power device 412 includes a second motor 413 and a power guide wheel 414, the pressing cylinder 411 is provided with a pressing guide wheel 415, the pressing guide wheel 415 is used to clamp the lead frame with the power wheel 414 when the lead frame is suspended, the feeding mechanism 41 includes two oppositely arranged feeding guide plates 416 for limiting the deviation of the lead frame, two groups of feeding guide wheels 417 are provided on the side walls of the feeding guide plate 416, and a guiding gap 418 is formed between the two groups of feeding guide wheels 416, and the guiding gap 418 is used for guiding the lead frame.
[0026] The specific conveying process is as follows: the lead frame is conveyed to the stamping table 4 through the feeding mechanism. When the lead frame needs to be stamped, a short pause is required to achieve stamping. In order to prevent the lead frame from continuing to move forward due to inertia during the pause, the power device 412 is paused during the pause, and the pressing cylinder 411 presses down the pressing guide wheel to cooperate with the power wheel 414 to clamp the lead frame to prevent the lead frame from continuing to move. The two oppositely arranged feeding guide plates 416 can limit the deviation of the lead frame, and the feeding guide gap 418 formed by the feeding guide wheel 417 on the feeding guide plate 416 can well guide the lead frame to the stamping table 4, which can reduce the friction of the lead frame on the plate and is not easy to wear the lead frame. In some embodiments: a CCD inspection station 12 for inspecting the lead frame after taping is provided above the machine 1, a pressurizing station 13 for reinforcing the fit between the lead frame and the tape is provided above the machine 1, a substrate 3 is provided above the machine 1, the substrate 3 and the machine 1 can move relative to each other, and the feeding device 2 and the substrate 3 are movably connected and can move relative to each other.
[0027] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
Claims
1. A lead frame tape cutting device, characterized in that: The invention comprises a machine platform (1), wherein a frame (5) is provided on one side of the machine platform (1), a material discharge device (51) for delivering a lead frame is provided inside the frame (5), a flattening structure (52) for flattening the lead frame is provided above the frame (5) at a position located at the output end of the material discharge device (51), a taping die (11) is provided on the machine platform (1), a stamping part (111) for stamping and cutting adhesive tape is provided in the taping die (11), and a heating component (117) for heating the lead frame is also provided in the taping die (111).
2. The lead frame tape cutting device according to claim 1, characterized in that: The flattening structure (52) comprises a plurality of bases (521) located on a frame (5), a movable plate (522) disposed above the bases (521) for flattening the lead frame, a plurality of lower flattening convex rollers (523) disposed at intervals in the bases (521), a plurality of upper flattening convex rollers (524) disposed at intervals in the movable plate (522), a flattening gap formed between the lower flattening convex rollers (523) and the upper flattening convex rollers (524) through which the lead frame will be flattened when passing through, the plurality of lower flattening convex rollers (523) and the plurality of upper flattening convex rollers (524) being disposed in a staggered manner, and an adjustment structure (525) for adjusting the distance between the movable plate (522) and the base (521) is disposed above the movable plate (522).
3. The lead frame tape cutting device according to claim 2, characterized in that: The adjustment structure (525) comprises a guide rod (526) located on the base (521), one end of the guide rod (526) penetrates and protrudes from the movable plate (522) and is coupled to a pressure block (527) via a thread, the lower part of the pressure block (527) abuts against the movable plate (522), and a spring (528) is sleeved on the guide rod (526) at a position between the base (521) and the movable plate (522).
4. The lead frame tape cutting device according to claim 1, characterized in that: The punching part (111) comprises a cutting plate (112) and a punching head (113) matched with the cutting plate (112); a cutting area (114) is provided on the cutting plate (112); an adsorption hole (115) is provided inside the punching head (113) for allowing the punching head (113) to adsorb tape; a tape feeding channel (116) for conveying the tape to the cutting area (114) is provided on one side of the cutting plate (112); the tape feeding channels (116) are multiple groups, and the tape feeding channels (116) are distributed on the outer peripheral side of the cutting plate (112); the heating component (117) comprises a lower pressing block (118) and a heating element (119) provided below the lower pressing block (118) for heating the lower pressing block (118); and the lead frame is placed on the lower pressing block (118).
5. The lead frame tape cutting device according to claim 1, characterized in that: A feeding device (2) for supplying tape to the taping mold (11) is also provided above the machine platform (1). The feeding device (2) includes a feeding tray (21) for placing the tape and feeding the tape out, and a winding tray (22) for winding up the tape protective film. The feeding device (2) also includes a feeder (23) located outside the taping mold (11) for feeding the tape in the feeding tray (21) into the taping mold (11). The feeder (23) includes a first motor (24). A rotating shaft (25) is driven on one side of the first motor (24). The feeder (23) also includes a flat plate (26). The flat plate (26) is located on one side of the rotating shaft (25), and the top surface is parallel to the top of the rotating shaft (25). A movable stopper (27) is provided inside the flat plate (26).
6. The lead frame tape cutting device according to claim 1, characterized in that: The machine platform (1) is provided with a punching table (4) for punching and cutting the taped lead frame, the punching table (4) comprising an upper punching table (43) and a lower punching table (44), the upper punching table (43) being provided with a tool assembly (431) and a punching head (432) for punching the lead frame, the tool assembly (431) comprising a tool cylinder and a tool, the tool cylinder being used to push out the tool to cut the lead frame.
7. The lead frame tape cutting device according to claim 1, characterized in that: The feeding mechanism (41) comprises an offset detection device (42) for detecting the offset of the lead frame. The offset detection device (42) is an optical fiber sensor. The optical fiber sensor detects the offset by detecting the position of a hole on the lead frame.
8. The lead frame tape cutting device according to claim 1, characterized in that: The machine platform (1) is provided with a feeding mechanism (41) for driving the lead frame to move, the feeding mechanism (41) comprising a material pressing cylinder (411) and a power device (412) for providing power for the lead frame conveyance, the power device (412) comprising a second motor (413) and a power guide wheel (414), the material pressing cylinder (411) is provided with a material pressing guide wheel (415), the material pressing guide wheel (415) being used to clamp and fix the lead frame together with the power wheel (414) when the lead frame conveyance is paused.
9. The lead frame tape cutting device according to claim 8, characterized in that: The feeding mechanism (41) comprises two oppositely arranged feeding guide plates (416) for limiting deviation of the lead frame, two groups of feeding guide wheels (417) are provided on the side walls of the feeding guide plates (416), a material guiding gap (418) is formed between the two groups of feeding guide wheels (416), and the material guiding gap (418) is used for guiding the lead frame.
10. The lead frame tape cutting device according to claim 6, characterized in that: A driving device (45) is provided on the lower surface of the lower punching platform (44), and the driving device (45) comprises a driving motor (451). The driving motor (451) is connected to an eccentric wheel (452). A bottom plate (453) is provided on the lower surface of the eccentric wheel (452). The bottom plate (453) is connected to the upper punching platform (43) via a guide column. The eccentric wheel (452) drives the bottom plate (453) so that the upper punching platform (43) can move relatively close to the lower punching platform (44).