POP packaging structure

Abstract

The invention relates to a POP packaging structure, and the structure comprises a first packaging device which is provided with a transition plate at the top; the second packaging device is arranged at the top of the transition plate and is electrically connected with the first packaging device; and the external packaging device is sleeved outside the first packaging device and the second packaging device. After the first packaging device and the second packaging device are assembled, the first packaging device and the second packaging device are assembled in the external packaging device, a transition plate is arranged at the top of the first packaging device, the second packaging device is integrally located above the transition plate, electrical interconnection with the first packaging device is achieved through the transition plate, and signals are transmitted to the first packaging device. The first packaging device and the second packaging device can be independently assembled, are electrically connected with each other through the transition plate arranged at the top of the first packaging device, are electrically assembled into the external packaging device through one-time tin soldering after assembly, and can be normally cleaned after being electrically assembled, so that the internal cleanliness of the whole product meets the requirement; and meanwhile, only one temperature gradient exists, so that the reliability is higher.

Description

Technical Field

[0001] The present application relates to the field of POP packaging technology, and in particular to a POP packaging structure. Background Art

[0002] In handheld portable test instruments, especially those the size of a palm, the internal functional modules are required to be very small. For the RF receiving channel, the miniaturized products are mostly in 2D form. The more mature products are ceramic tube shells, and the internal devices are arranged on a plane.

[0003] At present, there are 3D ceramic shell forms. The main implementation method is to assemble the first layer of components inside the ceramic shell, and then place a printed board with BGA balls, and then assemble the second layer of components on this printed board. Although this form can solve the problem of small size and light weight of the product, the assembly process of the product is complicated, and the cleaning of subsequent processes will affect the reliability of the product. For example, after assembling the printed board with BGA balls, it cannot be cleaned due to the soldering process. If it is cleaned, it will contaminate the bare chips of the previous process, so the quality and reliability of the product are not high. At the same time, there are temperature gradient problems in several assembly processes. The assembly of the first layer of components uses one temperature gradient, the soldering of the BGA ball printed board is the second temperature gradient, and the assembly of the second layer of devices is the third temperature gradient. All three temperatures need to exceed the assembly temperature of the product, and too many temperature gradients will also lead to a decrease in the reliability of the product. Summary of the invention

[0004] In view of this, the present application proposes a POP packaging structure to solve the above problems.

[0005] According to one aspect of the present application, a POP packaging structure is provided, including:

[0006] A first packaged device, with a transition plate disposed on the top;

[0007] A second packaging device, disposed on the top of the transition plate and electrically interconnected with the first packaging device;

[0008] The external packaging device is sleeved outside the first packaging device and the second packaging device.

[0009] In a possible implementation, the first packaging device includes:

[0010] The ceramic body is hollow inside and has a first opening at the top;

[0011] A first component is disposed on the top of the bottom plate of the ceramic body;

[0012] A first BGA ball is disposed at the bottom of the base plate of the ceramic body;

[0013] The first cover plate is disposed above the first opening and is surrounded by the ceramic body to form a closed space, and the first cover plate is covered by the transition plate.

[0014] In a possible implementation, the second packaging device includes:

[0015] a first ceramic substrate;

[0016] A second BGA ball is disposed between the first ceramic substrate and the transition plate;

[0017] A first shell, which is covered on the top of the first ceramic substrate and is surrounded by the first ceramic substrate to form a first hollow accommodating space;

[0018] The second component is arranged inside the first accommodating space and located on the top of the first ceramic substrate.

[0019] In a possible implementation, the first housing includes:

[0020] A first side shell is circumferentially arranged on the top of the first ceramic substrate, and a second opening is arranged on the top of the first side shell;

[0021] The second cover plate is disposed above the second opening and encloses the first accommodating space together with the first side shell and the first ceramic substrate.

[0022] In a possible implementation, the external packaging device includes:

[0023] A second ceramic substrate, disposed at the bottom of the first BGA ball;

[0024] a third BGA ball, disposed at the bottom of the second ceramic substrate;

[0025] The second shell is covered on the top of the second ceramic substrate and forms a second hollow accommodating space with the second ceramic substrate. The first packaging device and the second packaging device are both arranged in the second accommodating space.

[0026] In a possible implementation, the second housing includes:

[0027] A second side shell is circumferentially arranged on the top of the second ceramic substrate, and a third opening is arranged on the top of the second side shell;

[0028] The third cover plate is arranged above the third opening, and is surrounded by the second side shell and the second ceramic substrate to form the second accommodating space.

[0029] In a possible implementation, the number of the first BGA balls is multiple, and the multiple first BGA balls are arranged between the bottom plate of the ceramic body and the second ceramic substrate at intervals.

[0030] In a possible implementation manner, the number of the second BGA balls is multiple, and the multiple second BGA balls are arranged between the first ceramic substrate and the transition plate at intervals.

[0031] In a possible implementation manner, the number of the third BGA balls is multiple, and the multiple third BGA balls are arranged at intervals on the bottom of the second ceramic substrate.

[0032] In a possible implementation manner, the transition plate is a ceramic transition plate.

[0033] Beneficial effects of this application:

[0034] The present application provides a POP packaging structure, including: a first packaging device, with a transition plate disposed on the top; a second packaging device, disposed on the top of the transition plate, and electrically interconnected with the first packaging device; and an external packaging device, which is sleeved on the outside of the first packaging device and the second packaging device. Specifically, after the first packaging device and the second packaging device are assembled, they are assembled inside the external packaging device, wherein a transition plate is disposed on the top of the first packaging device, the second packaging device is located above the transition plate as a whole, and is electrically interconnected with the first packaging device through the transition plate to transmit signals to the first packaging device. That is, the first packaging device and the second packaging device can be assembled separately, and are electrically interconnected through the transition plate disposed on the top of the first packaging device, and are electrically assembled to the inside of the external packaging device by soldering once after assembly, and can also be cleaned normally after electrical assembly, and the internal cleanliness of the entire product meets the requirements, and at the same time, there is only one temperature gradient, and the reliability is higher.

[0035] Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the present application and, together with the description, serve to explain the principles of the present application.

[0037] Figure 1 A main structural diagram of the POP packaging structure of an embodiment of the present application is shown;

[0038] Figure 2 A main structure diagram of a first packaging device according to an embodiment of the present application is shown;

[0039] Figure 3A main structure diagram of a second packaging device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0040] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0041] Among them, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0044] In addition, in order to better illustrate the present application, numerous specific details are provided in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0045] like Figure 1 and Figure 2 As shown, on the one hand, the present application provides a POP packaging structure, which includes: a first packaging device 100, with a transition plate 110 on the top; a second packaging device 200, which is arranged on the top of the transition plate 110 and is electrically interconnected with the first packaging device 100; and an external packaging device 300, which is sleeved on the outside of the first packaging device 100 and the second packaging device 200.

[0046] In this embodiment, after the first packaging device 100 and the second packaging device 200 are assembled, they are assembled inside the external packaging device 300. Among them, the second packaging device 200 is arranged on the top of the first packaging device 100. It should be noted that in this embodiment, a transition board 110 is arranged on the top of the first packaging device 100, and the second packaging device 200 is entirely located above the transition board 110 and realizes electrical interconnection with the first packaging device 100 through the transition board 110 to transmit signals to the first packaging device 100. Thus, the first packaging device 100 and the second packaging device 200 in this embodiment can be assembled separately, realize electrical interconnection through the transition board 110 arranged on the top of the first packaging device 100, and are electrically assembled into the external packaging device 300 at one time with solder at 183 °C after assembly. Moreover, normal cleaning can be carried out after electrical installation. The cleanliness inside the entire product meets the requirements, and there is only one temperature gradient, with higher reliability.

[0047] In a possible implementation manner, the first packaging device 100 includes: a ceramic body 120 with a hollow structure inside and a first opening arranged at the top; a first component 130 arranged on the top of the bottom plate of the ceramic body 120; a first BGA ball 150 arranged on the bottom of the bottom plate of the ceramic body 120; and a first cover plate 140 arranged above the first opening, enclosing a sealed space with the ceramic body 120, and a transition board 110 is covered on the first cover plate 140.

[0048] In this embodiment, as Figure 2 shown, the first packaging device 100 includes a ceramic body 120, a first component 130, a first BGA ball 150, and a first cover plate 140. Among them, the ceramic body 120 in this embodiment is hollow inside and has a first opening at the top, that is, it is in a "U" - shaped structure as a whole. The first component 130 is arranged on the bottom plate inside the ceramic body 120, and the number of the first components 130 is several, and several first components 130 are arranged at intervals. Moreover, a first cover plate 140 is arranged at the position of the first opening of the ceramic body 120, enclosing a sealed space with the first cover plate 140 and the ceramic body 120, and the transition board 110 is arranged on the top of the first cover plate 140, realizing electrical interconnection with the second packaging device 200 arranged on the top of the first packaging device 100 and simultaneously transmitting signals to the first BGA ball 150 arranged below the bottom plate of the ceramic body 120.

[0049] It should also be noted that the first cover plate 140 in the present embodiment is a metal cover plate. Specifically, the left and right ends of the first cover plate 140 are relatively provided with extensions, and the extensions are arranged vertically with the first cover plate 140 as a whole. In addition, the extensions at both ends are also extended in the side walls at the top of the ceramic body 120. After the first component 130 is assembled inside the ceramic body 120 of the first packaged device 100 according to actual needs, the first metal cover plate 140 is sampled to seal the first opening at the top of the ceramic body 120, so that the first sealed device has airtightness. Subsequently, the transition plate 110 is welded on the top of the metal first cover plate 140 for electrical interconnection with the second packaged device 200. In a possible implementation, the transition plate 110 is a ceramic transition plate 110. That is, the transition plate 110 is preferably a ceramic transition plate 110.

[0050] In a possible implementation, there are a plurality of first BGA balls 150 , and the plurality of first BGA balls 150 are disposed at intervals between the bottom plate of the ceramic body 120 and the second ceramic substrate 310 .

[0051] It should be noted that the first BGA ball 150 is preferably a high-temperature lead ball, specifically a 183 temperature ball planting, and the number is several, and the distance between two adjacent first BGA balls 150 is the same. After the first packaged device 100 is sealed, the ceramic transition plate 110 is welded on the metal first cover plate 140 to be electrically interconnected with the second packaged device 200, and at the same time transmit the signal of the second packaged device 200 to the several first BGA balls 150 at the bottom of the first packaged device 100.

[0052] In a possible implementation, the second packaged device 200 includes: a first ceramic substrate 210; a second BGA ball 240, disposed between the first ceramic substrate 210 and the transition plate 110; a first shell 230, which is disposed on the top of the first ceramic substrate 210 and is surrounded by the first ceramic substrate 210 to form a first hollow accommodating space; and a second component 220, which is disposed inside the first accommodating space and is located on the top of the first ceramic substrate 210.

[0053] In this embodiment, Figure 3As shown, the second package device 200 is arranged on the top of the first package device 100, and specifically includes a first ceramic substrate 210, a second BGA ball 240, a first shell 230 and a second component 220. Among them, the first shell 230 is covered on the top of the first ceramic substrate 210, and is surrounded by the first ceramic substrate 210 to form a first accommodating space. It should be noted that the second component 220 is arranged inside the first accommodating space, and the second component 220 is located on the top of the first ceramic substrate 210, that is, the bottom end of the second component 220 is in contact with the top end of the first ceramic substrate 210. It should also be noted that the number of the second components 220 in this embodiment is several, and several second components 220 are arranged at intervals. The second BGA ball 240 in this embodiment is arranged between the first ceramic substrate 210 and the transition plate 110. It should be noted that the size of the second package device 200 is smaller than that of the first package device 100, that is, the first ceramic substrate 210 is extended from both sides of the transition plate 110. It should also be noted that the first package device 100 and the second package device 200 can be assembled separately and then electrically assembled to the external package device 300 using 183 degrees Celsius soldering at one time. The overall assembly process is simple and can be cleaned up later without affecting product reliability.

[0054] In one possible implementation, the first shell 230 includes: a first shell side shell 231, which is circumferentially arranged on the top of the first ceramic substrate 210, and a second opening is provided on the top of the first shell side shell 231; a second cover plate 232, which is arranged above the second opening and encloses the first shell side shell 231 and the first ceramic substrate 210 to form a first accommodating space.

[0055] In this embodiment, the first shell 230 includes a first shell side shell 231 and a second cover plate 232, wherein the first shell 230 is provided with a bottom opening, and the cover is provided on the top of the first ceramic substrate 210, and the first ceramic substrate 210 is surrounded by a first accommodation space for placing the second component 220. It should be noted that the bottom of the first shell side shell 231 is circumferentially arranged on the top of the first ceramic substrate 210, and the size of the bottom of the first shell side shell 231 matches the size of the first ceramic substrate 210. Specifically, the first shell side shell 231 does not extend outside the first ceramic substrate 210. It should also be noted that the top of the first shell side shell 231 is relatively provided with a second opening, and the second cover plate 232 is covered on the second opening, and cooperates with the first ceramic substrate 210 to form a first accommodation space, and the second cover plate 232 is preferably a metal cover plate.

[0056] In a possible implementation, there are a plurality of second BGA balls 240 , and the plurality of second BGA balls 240 are disposed at intervals between the first ceramic substrate 210 and the transition plate 110 .

[0057] It should be noted that, in the present embodiment, the number of second BGA balls 240 is several, the distance between two adjacent second BGA balls 240 is the same, and the several second BGA balls 240 are all arranged between the first ceramic substrate 210 and the ceramic transition plate 110, wherein the size of the first ceramic substrate 210 is smaller than the ceramic transition plate 110, that is, the several second BGA balls 240 are not extended out of the first ceramic substrate 210.

[0058] In one possible implementation, the external packaging device 300 includes: a second ceramic substrate 310, which is arranged at the bottom of the first BGA ball 150; a third BGA ball 320, which is arranged at the bottom of the second ceramic substrate 310; a second shell 330, which is arranged at the top of the second ceramic substrate 310 and forms an internally hollow second accommodating space with the second ceramic substrate 310, and the first packaging device 100 and the second packaging device 200 are both arranged in the second accommodating space.

[0059] In this embodiment, after the first package device 100 and the second package device 200 are assembled, the external package device 300 is set on the whole external part, wherein the external package device 300 includes a second ceramic substrate 310, a third BGA ball 320 and a second shell 330. Specifically, the second shell 330 is set on the top of the second ceramic substrate 310, and forms a second accommodating space with the second ceramic substrate 310 for placing the assembled first package device 100 and the second package device 200. The third BGA ball 320 is set at the bottom of the second ceramic substrate 310, and both sides of the first package device 100 and the second package device 200 are not in contact with the inner wall of the external package device 300, and the top of the second package device 200 is not in contact with the inner side of the top of the external package device 300. It should be noted that a plurality of first BGA balls 150 are evenly spaced and arranged between the second ceramic substrate 310 and the bottom plate of the ceramic body 120 to receive the signal transmitted by the second package device 200.

[0060] In one possible implementation, the second shell 330 includes: a second side shell 331, which is circumferentially arranged on the top of the second ceramic substrate 310, and a third opening is arranged on the top of the second side shell 331; a third cover plate 332, which is arranged above the third opening and encloses the second side shell 331 and the second ceramic substrate 310 to form a second accommodating space.

[0061] It should be noted that the second housing 330 in this embodiment includes a second side housing 331 and a third cover plate 332. It should be noted that the second side housing 331 is located as a whole on the top of the second ceramic substrate 310, and the bottom opening size of the second side housing 331 matches the size of the second ceramic substrate 310, that is, the second side housing 331 does not extend out of the second ceramic substrate 310. In addition, a third opening is also provided on the top of the second side housing 331, and a third cover plate 332 is provided on the top of the third opening. The third cover plate 332, the second side housing 331 and the second ceramic substrate 310 enclose a second accommodation space for placing the first packaged device 100 and the second packaged device 200, and the third cover plate 332 is preferably a metal cover plate, that is, the first packaged device 100 and the second packaged device 200 are sealed and welded by the metal third cover plate 332 to ensure internal airtightness.

[0062] In a possible implementation, there are a plurality of third BGA balls 320 , and the plurality of third BGA balls 320 are disposed at intervals on the bottom of the second ceramic substrate 310 .

[0063] It should be noted that, in this embodiment, a plurality of third BGA balls 320 are disposed at the bottom of the second ceramic substrate 310, that is, the top of the third BGA ball 320 is in contact with the bottom of the second ceramic substrate 310. It should be noted that the distance between two adjacent third BGA balls 320 is the same, and they are evenly arranged at the bottom of the second ceramic substrate 310.

[0064] In summary, in order to solve the problem of the impact on product reliability during the subsequent cleaning process after the existing product is assembled, as well as the temperature gradient problem of multiple assembly processes, the present application provides a POP (packaged device formed by stacking packaged devices) packaging structure. After the first component 130 is assembled inside the ceramic body 120 of the first packaged device 100, the first metal cover plate 140 is sampled for sealing and welding, and the first sealed device has airtightness. Subsequently, the ceramic transition plate 110 is welded on the top of the metal first cover plate 140, and the second packaged device 200 is assembled in the same way. The second component 220 and the metal second cover plate 232 are sealed and welded, and the electrical interconnection between the first packaged device 100 and the second packaged device 200 is realized through the ceramic transition plate 110, and the signal of the second packaged device 200 is transmitted to the first BGA ball 150 at the bottom of the first packaged device 100. It should be noted that the first package device 100 and the second package device 200 can be assembled separately, and then electrically assembled to the external package device 300, that is, the inside of the external product, with 183 degrees Celsius solder at one time, and can be cleaned normally after electrical assembly. The entire product is very clean inside, and there is only one temperature gradient, which has high reliability.

[0065] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A POP packaging structure, characterized in that: include: A first packaged device, with a transition plate disposed on the top; A second packaging device, disposed on the top of the transition plate and electrically interconnected with the first packaging device; The external packaging device is sleeved outside the first packaging device and the second packaging device.

2. The POP packaging structure according to claim 1, characterized in that: The first packaging device comprises: The ceramic body is hollow inside and has a first opening at the top; A first component is disposed on the top of the bottom plate of the ceramic body; A first BGA ball is disposed at the bottom of the base plate of the ceramic body; The first cover plate is disposed above the first opening and is surrounded by the ceramic body to form a closed space, and the first cover plate is covered by the transition plate.

3. The POP packaging structure according to claim 1, characterized in that: The second packaged device comprises: a first ceramic substrate; A second BGA ball is disposed between the first ceramic substrate and the transition plate; A first shell, which is covered on the top of the first ceramic substrate and is surrounded by the first ceramic substrate to form a first hollow accommodating space; The second component is arranged inside the first accommodating space and located on the top of the first ceramic substrate.

4. The POP packaging structure according to claim 3, characterized in that: The first housing comprises: A first side shell is circumferentially arranged on the top of the first ceramic substrate, and a second opening is arranged on the top of the first side shell; The second cover plate is disposed above the second opening and encloses the first accommodating space together with the first side shell and the first ceramic substrate.

5. The POP packaging structure according to claim 2, characterized in that: The external packaging device comprises: A second ceramic substrate, disposed at the bottom of the first BGA ball; a third BGA ball, disposed at the bottom of the second ceramic substrate; The second shell is covered on the top of the second ceramic substrate and forms a second hollow accommodating space with the second ceramic substrate. The first packaging device and the second packaging device are both arranged in the second accommodating space.

6. The POP packaging structure according to claim 5, characterized in that: The second housing comprises: A second side shell is circumferentially arranged on the top of the second ceramic substrate, and a third opening is arranged on the top of the second side shell; The third cover plate is arranged above the third opening, and is surrounded by the second side shell and the second ceramic substrate to form the second accommodating space.

7. The POP packaging structure according to claim 5, characterized in that: The number of the first BGA balls is several, and the several first BGA balls are arranged between the bottom plate of the ceramic body and the second ceramic substrate at intervals.

8. The POP packaging structure according to claim 3, characterized in that: The number of the second BGA balls is multiple, and the multiple second BGA balls are arranged between the first ceramic substrate and the transition plate at intervals.

9. The POP packaging structure according to claim 5, characterized in that: The number of the third BGA balls is several, and the several third BGA balls are arranged at intervals on the bottom of the second ceramic substrate.

10. The POP packaging structure according to any one of claims 1 to 9, characterized in that: The transition plate is a ceramic transition plate.

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