A PCB laser window opening method

Abstract

The present application discloses a PCB laser windowing method, which is applied to a PCB laser windowing device. The PCB laser windowing device includes a plurality of laser galvanometer modules, a positioning module, and a workbench, including: obtaining image error parameters of the image information to be marked by the plurality of laser galvanometer modules; determining the mechanical error parameters of the PCB laser windowing device; determining the working area of ​​each laser galvanometer module in the plurality of laser galvanometer modules; and controlling the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area according to the image error parameters and the mechanical error parameters. Thus, when each laser galvanometer module marks the corresponding information in the image information to be marked into the corresponding working area, it performs comprehensive compensation according to the image error parameters and the mechanical error parameters, so that each laser galvanometer module marks the corresponding information in the image information to be marked at the ideal position of the PCB board, so as to improve the accuracy of the marking operation of the PCB laser windowing device.

Description

Technical Field

[0001] The present application relates to the technical field of PCB board processing, and more specifically, to a PCB laser window opening method. Background Art

[0002] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. The PCB board is provided with a solder mask to prevent the pins of SMD components from short-circuiting during the PCB board mounting process.

[0003] Solder mask windowing is to peel off the solder mask layer of the corresponding area on the PCB board to expose the copper part on the PCB board so that the corresponding area is not covered with ink. PCB laser windowing equipment is a device that peels off the solder mask layer of the corresponding area on the PCB board, or in other words, PCB laser windowing equipment is a device that marks the corresponding area on the PCB board to peel off the solder mask layer in the area. However, due to the error in the actual position of the PCB board determined by the PCB laser windowing equipment, the PCB laser windowing equipment marks the wrong area of ​​the PCB board, thereby affecting the accuracy of the PCB laser windowing equipment marking the corresponding area. Summary of the invention

[0004] In view of the above problems, the present application proposes a PCB laser window opening method, which can effectively improve the marking accuracy of PCB laser window opening equipment.

[0005] The embodiment of the present application provides a PCB laser window opening method, which is applied to a PCB laser window opening device. The PCB laser window opening device includes multiple laser galvanometer modules, a positioning module and a workbench. The multiple laser galvanometer modules are used to mark the PCB board, the positioning module is used to determine the position information, and the workbench is used to carry the PCB board for marking. The PCB laser window opening method includes: obtaining image error parameters of the image information to be marked by the multiple laser galvanometer modules; wherein the image information to be marked is an image input by a user for marking on the PCB board; determining the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench; determining the working area of ​​each laser galvanometer module in the multiple laser galvanometer modules according to the position information of each laser galvanometer module in the multiple laser galvanometer modules; and controlling the multiple laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area according to the image error parameters and the mechanical error parameters.

[0006] The technical solution provided by the present application, the PCB laser window opening method, is applied to a PCB laser window opening device, the PCB laser window opening device includes a plurality of laser galvanometer modules, a positioning module and a workbench, the plurality of laser galvanometer modules are used to perform marking operations on the PCB board, the positioning module is used to determine position information, and the workbench is used to carry the PCB board for marking operations, including: obtaining image error parameters of the image information to be marked by the plurality of laser galvanometer modules; wherein the image information to be marked is an image input by a user for marking on the PCB board; determining the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench; determining the working area of ​​each laser galvanometer module in the plurality of laser galvanometer modules according to the position information of each laser galvanometer module in the plurality of laser galvanometer modules; and controlling the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area according to the image error parameters and the mechanical error parameters. Therefore, when each laser galvanometer module marks the corresponding information in the image information to be marked into its corresponding working area, comprehensive compensation is performed based on the image error parameters and the mechanical error parameters, so that each laser galvanometer module can mark the corresponding information in the image information to be marked at the ideal position of the PCB board, thereby improving the accuracy of the marking operation of the PCB laser window opening equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, not all embodiments. Based on the embodiments of the present application, all other embodiments and drawings obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0008] Figure 1 A schematic diagram of the structure of an AR device provided in an embodiment of the present application is shown.

[0009] Figure 2 A schematic flow chart of a PCB laser window opening method provided in an embodiment of the present application is shown.

[0010] Figure 3 A schematic structural diagram of a preset array pattern provided in an embodiment of the present application is shown.

[0011] Figure 4 A schematic diagram of the structure of a preset array pattern engraved on a PCB board provided in an embodiment of the present application is shown.

[0012] Figure 5 A schematic diagram of the structure of another preset array pattern engraved on a PCB board provided in an embodiment of the present application is shown.

[0013] Figure 6 A schematic structural diagram of a workbench provided in an embodiment of the present application is shown.

[0014] Figure 7 A schematic structural diagram of a PCB laser window opening device provided in an embodiment of the present application is shown.

[0015] Figure 8 A schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of the present application is shown.

[0016] Fig. 9 A schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The described embodiments should not be regarded as limiting the present application. All other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0018] In the following description, reference is made to "some embodiments", which describes a subset of all possible embodiments, but it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict. In the following description, reference is made to the term "multiple" to mean at least two.

[0019] In the following description, the terms "first\second" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first\second" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0021] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. The PCB board is provided with a solder mask to prevent the pins of SMD components from short-circuiting during the PCB board mounting process.

[0022] Solder mask windowing is to peel off the solder mask layer of the corresponding area on the PCB board to expose the copper part on the PCB board so that the corresponding area is not covered with ink. PCB laser windowing equipment is a device that peels off the solder mask layer of the corresponding area on the PCB board, or in other words, PCB laser windowing equipment is a device that marks the corresponding area on the PCB board to peel off the solder mask layer in the area. However, due to the error in the actual position of the PCB board determined by the PCB laser windowing equipment, the PCB laser windowing equipment marks the wrong area of ​​the PCB board, thereby affecting the accuracy of the PCB laser windowing equipment marking the corresponding area.

[0023] In order to improve the above-mentioned problems, the present application provides a PCB laser window opening method, which is applied to a PCB laser window opening device. The PCB laser window opening device includes multiple laser galvanometer modules, a positioning module and a workbench. The multiple laser galvanometer modules are used to mark the PCB board, the positioning module is used to determine the position information, and the workbench is used to carry the PCB board for marking. The PCB laser window opening method includes determining, according to a preset graphic correction model, image error parameters for marking image information to be marked by any laser galvanometer module among the multiple laser galvanometer modules; the image information to be marked is an image input by a user for marking on the PCB board; the mechanical error parameters of the PCB laser window opening device are determined according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench; the working area of ​​any laser galvanometer module among the multiple laser galvanometer modules is determined according to the position information of the multiple laser galvanometer modules; according to the image error parameters and the mechanical error parameters, any laser galvanometer module among the multiple laser galvanometer modules is controlled to mark the information corresponding to the image information to be marked to the working area.

[0024] Therefore, when each laser galvanometer module marks the corresponding information in the image information to be marked into its corresponding working area, comprehensive compensation is performed based on the image error parameters and the mechanical error parameters, so that each laser galvanometer module can mark the corresponding information in the image information to be marked at the ideal position of the PCB board, thereby improving the accuracy of the marking operation of the PCB laser window opening equipment.

[0025] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0026] See also Figure 1 , Figure 1 The schematic diagram of the structure of a PCB laser window opening device provided in an embodiment of the present application is shown. Figure 1 As shown, the PCB laser window opening device 100 includes a plurality of laser galvanometer modules 110, a positioning module 120 and a workbench 130, specifically:

[0027] The plurality of laser galvanometer modules 110 are used to perform marking operations on the PCB board, which is essentially to peel off the solder mask layer of the corresponding area on the PCB board by laser.

[0028] In some embodiments, the laser galvanometer module 110 may be a laser galvanometer. In other embodiments, the laser galvanometer module 110 may also be a dynamic focusing mirror or a field mirror. It is understandable that the present application does not limit the specific device of the laser galvanometer module 110. Similarly, the present application does not limit the specific number of laser galvanometer modules 110. The user can flexibly adjust the number of laser galvanometer modules 110 according to the area of ​​the PCB board to be marked and the size of the laser galvanometer working area.

[0029] The positioning module 120 is used to determine the position information. Specifically, the positioning module 120 can be used to determine the position information of a certain point or a certain area of ​​the PCB board. The positioning module 120 can also be used to determine the position information of a certain laser galvanometer module 110.

[0030] In some embodiments, the positioning module 120 may be a charge coupled device (CCD) camera. In other embodiments, the positioning module 120 may also be a complementary metal oxide semiconductor (CMOS) camera. It is understood that the present application does not limit the specific device of the positioning module 120. Similarly, the present application does not limit the specific number of the positioning modules 120.

[0031] Exemplarily, the laser galvanometer module 110 is controlled to emit a light beam to point A on the PCB board, the positioning module 120 moves to the bottom of the laser galvanometer module 110 to obtain the light beam, and the current position information of the positioning module 120 is determined as the position information of point A. It is understandable that the position information of several points in a certain area on the PCB board can also be obtained in this way, and then the position information of a certain area on the PCB board can be determined.

[0032] Exemplarily, the positioning module 120 is controlled to move below multiple laser galvanometer modules 110. When the positioning module 120 moves below a certain laser galvanometer module 110, the laser galvanometer module 110 is controlled to send a light beam. The positioning module 120 obtains the light beam and determines the current position of the positioning module 120 as the position information of the laser galvanometer module 110, thereby determining the position information of any laser galvanometer module 110.

[0033] In a specific embodiment, the positioning module 120 includes a first positioning unit and a second positioning unit. The first positioning unit is used to determine the position information of certain points or certain areas of the PCB board. The second positioning unit is used for the position information of multiple laser galvanometer modules 110.

[0034] Since the points or areas to be detected on the PCB board are large, the workload of the first positioning unit is large, and the first positioning unit can only detect one point or one area at a time. The PCB laser window opening device 100 may have a low efficiency in marking the PCB board due to the slow working efficiency of the first positioning unit. Based on the above situation, in another specific embodiment, the number of the first positioning units is two, and the mutual cooperation between the two first positioning units accelerates the completion of the detection of the position information of the points or areas on the PCB board, thereby improving the detection efficiency and further improving the processing efficiency. For example, the two first positioning units are responsible for the detection of the points or areas in the left half area and the right half area of ​​the PCB board respectively.

[0035] The workbench 130 is used to carry the PCB board, and carry the PCB board to the bottom of the multiple laser galvanometer modules, so as to perform marking operations on the PCB board through the multiple laser galvanometer modules. For example, the PCB board to be marked is placed on the workbench 130, and the PCB board is carried to the bottom of the multiple laser galvanometer modules by the workbench 130, and then the current posture information of the PCB board is determined by the positioning module 120, and the working areas of the multiple laser galvanometer modules 110 are adjusted according to the current posture information of the PCB board, so that the multiple laser galvanometer modules 110 can mark the image information to be marked in their respective corresponding working areas, thereby completing the marking of the PCB board.

[0036] For more details, please refer to Figure 1 The workbench 130 is used to drive the PCB to move along a first direction and a second direction, the first direction intersecting with the second direction (for example, the first direction is perpendicular to the second direction), so as to carry the PCB to the bottom of the plurality of laser galvanometer modules, so as to perform a marking operation on the PCB through the plurality of laser galvanometer modules 110. In some embodiments, the first direction may be determined as the X-axis, and the second direction may be determined as the Y-axis.

[0037] The first positioning unit is used to move along the third direction to determine the position information of a certain point or a certain area. The third direction intersects with the first direction (for example, the first direction is perpendicular to the third direction). The coordinate information of the first positioning unit in the second direction and the third direction can be used to represent the current position information of the first positioning unit. In some embodiments, the third direction can be determined as the positive direction of the K1 axis.

[0038] Exemplarily, when determining the position information of point A on the PCB board, a circle is emitted to the position of point A through the laser galvanometer module 110, and then the center position of the circle is captured by the first positioning unit (for example, the first positioning unit is moved to the bottom of the laser galvanometer module 110 to project the circle into the first positioning unit, and then the position information of the center of the circle is determined), and the position information of point A is determined based on the current position information of the first positioning unit.

[0039] Exemplarily, with the first direction being the X-axis, the second direction being the Y-axis, and the third direction being the K1-axis, when the first positioning unit determines the position information of point A on the PCB board, a circle is emitted to point A through the laser galvanometer module 110, and then the center position of the circle is captured by the first positioning unit (for example, the first positioning unit is moved to the bottom of the laser galvanometer module 110 to project the circle into the first positioning unit, and then determine the position information of the center of the circle). The current position coordinates of the first positioning unit are (K1, Y), and the position coordinates of point A are (K1, Y).

[0040] In one embodiment, the number of the first positioning units 121 is two, and the fixed axes (the fixed axis is used to fix the first positioning unit 121, and the first positioning unit 121 can move on the fixed axis) of the two first positioning units 121 can be different. The fixed axis of one of the first positioning units 121 can be the K1 axis, and the fixed axis of the other first positioning unit 121 can be the K2 axis. The K1 axis is parallel to the K2 axis.

[0041] Exemplarily, one of the first positioning units 121 has a fixed axis of K1 and the other has a fixed axis of K2. When the position information of a certain point or a certain area is detected by the first positioning unit 121 with the fixed axis of K1 and Y axis, the position information of the certain point or a certain area is determined by the current position information (K1, Y) of the first positioning unit 121; when the position information of a certain point or a certain area is detected by the first positioning unit 121 with the fixed axis of K2 and Y axis, the position information of the certain point or a certain area is determined by the current position information (K2, Y) of the first positioning unit 121.

[0042] Furthermore, the second positioning unit is used to move along the first direction, the second direction and the fourth direction to determine the position information of any laser galvanometer module. The fourth direction intersects with the third direction (for example, the third direction is perpendicular to the fourth direction). The coordinate information of the second positioning unit in the first direction and the second direction can be used to represent the current position information of the second positioning unit. In some embodiments, the fourth direction can be determined as the T axis.

[0043] Exemplarily, assume that the first direction is the X-axis, the second direction is the Y-axis, and the fourth direction is the T-axis. The second positioning unit stays at a suitable position on the T-axis (ensuring that the second positioning unit can move under multiple laser galvanometer modules to determine the position information of any laser galvanometer module). After the second positioning unit stays at a suitable specific position on the T-axis, the second positioning unit moves along the X-axis and the Y-axis to stay under a certain laser galvanometer module 110. The control system of the PCB laser window opening device 100 controls the laser galvanometer module 110 to send a circular indication graphic to the workbench 130, and the second positioning unit obtains the center of the circle of the indication graphic, and determines the current center position (X1, Y1) as the position of the current laser galvanometer module 110, and so on, until the positions of all laser galvanometer modules 110 are determined.

[0044] After determining the position information of multiple laser galvanometer modules 110, the position distribution of each laser galvanometer module 110 can be obtained, and then the image information to be marked is divided according to the position distribution of each laser galvanometer module 110, so that each laser galvanometer module 110 determines which part of the image information to be marked.

[0045] In some embodiments, the second positioning unit is further provided with a calibration reminder component.

[0046] Among them, the calibration reminder component can be moved along the X-axis and Y-axis on the second positioning unit, and the calibration reminder component and the second positioning unit body together constitute a sliding rheostat. The resistance wire and metal rod of the sliding rheostat are arranged on the second positioning unit body, and the slider of the sliding rheostat is arranged on the calibration reminder component. When the resistance value of the sliding rheostat changes, the current or voltage received by the control module arranged on the PCB laser window opening device 100 changes, thereby detecting the resistance value of the sliding rheostat.

[0047] Furthermore, the calibration reminder component and the second positioning unit are located at different vertical positions, for example, the calibration reminder component is located above the second positioning unit body or the calibration reminder component is located below the second positioning unit body.

[0048] Furthermore, because the sliding distance of the slider on the metal rod is limited, and the present application does not need to accurately measure the sliding distance of the slider, because the sliding distance can only reflect the offset distance but not the offset direction, and therefore only measuring the sliding distance cannot achieve offset correction. Therefore, the present application can set the length of the moving area for the calibration reminder component to move in the second positioning unit to be less than or equal to 4 cm, and a limit sensor, such as an infrared sensor or a pressure sensor, is set at the edge of the moving area. When the calibration reminder component moves to the edge, it automatically stops sliding, thereby achieving only measuring whether the resistance value of the sliding rheostat has changed through a moving area with a smaller length. In addition, the smaller length of the moving area also facilitates setting the moving area on the second positioning unit, which facilitates the miniaturization of the second positioning unit.

[0049] Optionally, the calibration reminder component and the second positioning unit body together constitute a first sliding rheostat and a second sliding rheostat, the first sliding rheostat can be moved along the X axis, and the second sliding rheostat can be moved along the Y axis. Optionally, the resistance wire on the second positioning unit body can be selected to be a cross resistance wire, so that the slide can move along the X axis and the Y axis.

[0050] The coordinate difference between the calibration reminder component and the second positioning unit is calibrated in the initial state before use, and the coordinate difference is added to the target coordinate of each movement of the calibration reminder component. Therefore, if the calibration reminder component and the second positioning unit are controlled to move to the same coordinate, the calibration reminder component will still be in the initial state on the second positioning unit after the movement is completed.

[0051] As an example, the coordinates of the calibration reminder component in the initial state are (0,1), and the coordinates of the second positioning unit are (0,0). If you want to control the second positioning unit to move to (1,1), then control the calibration reminder component to move to (1,2), so that after the movement is completed, the calibration reminder component is still in the initial state on the second positioning unit.

[0052] Furthermore, when controlling the second positioning unit to calibrate a laser galvanometer module 110, the laser galvanometer module 110 is controlled to emit a laser beam vertically downward, and the second positioning unit is controlled to move as a whole to below the laser galvanometer module 110, so that the second positioning unit body is located at the actual position of the laser galvanometer module 110, and the current coordinates of the laser galvanometer module 110 in the current coordinate system are obtained as the target coordinates, and then the calibration reminder component is controlled to move to the target coordinates. If the laser galvanometer module 110 has not been displaced or the laser emitted by the laser galvanometer module 110 has not been deflected, then after the calibration reminder component moves to the target coordinates, the resistance value of the sliding rheostat formed by the second positioning unit body and the calibration reminder component is still in the initial state, otherwise the slider on the calibration reminder component will slide on the metal rod, changing the resistance value of the sliding rheostat connected to the circuit, so that the control module determines that the laser galvanometer module 110 needs to be recalibrated. Therefore, the calibration reminder component can be used to determine whether it is necessary to calibrate the laser galvanometer module 110 when the second positioning component is performing a positioning operation. There is no need to perform a calibration operation every time a new PCB board is engraved, which saves time and energy and improves the intelligence level of the PCB laser window opening equipment 100.

[0053] It is understandable that as the use time of the PCB laser window opening device 100 increases, the fixed axis of the positioning module 120 and the workbench 130 will deviate in a certain direction, thereby affecting the accuracy of the PCB laser window opening device 100 in marking the PCB board. Therefore, in some embodiments, the PCB laser window opening device 100 further includes an interferometer (not shown in the figure), through which the offset value of the fixed axis of the positioning module 120 and the workbench 130 in a certain direction can be directly obtained.

[0054] When subsequently marking the image information to be marked, compensation is performed based on the offset value of the fixed axis of the positioning module 120 and the workbench 130 in a certain direction to avoid reducing the accuracy of marking the PCB board by the PCB laser window opening device 100 due to mechanical errors.

[0055] Since the image information to be marked is marked by multiple laser galvanometer modules in corresponding areas respectively, the marking operation of the entire PCB board is completed. However, since the working parameters of multiple laser galvanometer modules may be different, the final product effect of the PCB board may be affected. For example, the glossiness of different areas of the PCB board may be different.

[0056] Based on the above situation, the PCB laser window opening device 100 also includes an energy meter. The PCB laser window opening device 100 can control the energy meter to move under the multiple laser galvanometer modules 110 to determine the working energy parameters of each laser galvanometer module 110 through the energy meter. By ensuring that the working energy parameters of each laser galvanometer module 110 are the same, the marking effects of different areas on the PCB board are relatively uniform, so as to improve the final product effect of the PCB board.

[0057] Furthermore, during the process of the PCB laser window opening device 100 marking the PCB board located on the workbench 130, if there is foreign matter under the PCB board (i.e., the side of the PCB board close to the workbench 130), the flatness of the PCB board on the workbench 130 will be affected, thereby affecting the marking effect of the PCB board.

[0058] Based on the above situation, the PCB laser window opening device 100 also includes a position detection module, which is used to detect the flatness of the PCB board on the workbench 130, so that the PCB laser window opening device 100 adjusts the flatness of the surface of the workbench 130 according to the flatness of the PCB board on the workbench 130, so as to determine that the distance between the surface of the PCB board and the multiple laser galvanometer modules 110 is the same, thereby improving the marking effect of the PCB board.

[0059] In some embodiments, the position detection module may be a laser sensor. In other embodiments, the position detection module may also be an ultrasonic sensor.

[0060] See also Figure 2 , Figure 2 The schematic diagram of the process of a PCB laser window opening method provided by an embodiment of the present application is shown. The PCB laser window opening method is applied to the above-mentioned PCB laser window opening device. Figure 1 As shown, the PCB laser window opening method includes steps 210 to 240, specifically:

[0061] In step 210, image error parameters of each laser galvanometer module in marking image information to be marked are obtained.

[0062] The image information to be marked may include pattern information to be marked on the PCB board (eg, information of the area to be peeled off and specification information such as the shape and size of the area to be peeled off).

[0063] Determine the deviation between the image information to be marked on the PCB board by each laser galvanometer module among the multiple laser galvanometer modules and the theoretical image information of the image information to be marked, so as to determine the image error parameter of the image information to be marked by each laser galvanometer module among the multiple laser galvanometer modules.

[0064] The multiple laser galvanometer modules respectively mark a part of the image information to be marked according to their own marking ranges, and the marking information of the multiple laser galvanometer modules in their respective corresponding marking ranges together constitutes the complete information of the image information to be marked.

[0065] The image error parameter refers to the error value between the theoretical position of the image information to be marked on the PCB board and the actual position actually marked on the PCB board by the laser galvanometer module. The image error parameter may include one or more of the translation value, rotation value, and expansion / contraction value between the theoretical position of the image information to be marked on the PCB board and the actual position actually marked on the PCB board by the laser galvanometer module.

[0066] In the subsequent steps, after the user inputs the image information to be marked, the image information to be marked is adjusted according to the image error parameter between the theoretical position of the image information to be marked on the PCB board and the actual position actually marked on the PCB board by the laser galvanometer module, so that the actual position corresponding to the image information to be marked actually marked on the PCB board by the laser galvanometer module is closer to the theoretical position of the image information to be marked on the PCB board, so as to improve the accuracy of the marking operation of the PCB laser window opening equipment.

[0067] Furthermore, in some embodiments, the step of obtaining image error parameters of the image information to be marked by the multiple laser galvanometer modules may include the following steps:

[0068] (1) Controlling the plurality of laser galvanometer modules to respectively mark a preset array pattern onto the PCB board; wherein the preset array pattern includes a plurality of dots, and the plurality of dots are arranged in a matrix.

[0069] (2) Determining actual position information of a plurality of first dots on a preset array pattern respectively marked on the PCB by the plurality of laser galvanometer modules and theoretical position information on the preset array pattern; wherein the first dots are dots included in the preset array pattern respectively marked by the plurality of laser galvanometer modules.

[0070] (3) Determine image error parameters corresponding to the plurality of laser galvanometer modules respectively according to the actual position information and the theoretical position information.

[0071] In some embodiments, the preset array pattern may further include a plurality of irregularly arranged dots. It is worth noting that the number of dots included in the preset array pattern is not less than two.

[0072] In a specific embodiment, the distribution of dots in the preset array pattern is set according to the maximum size and step distance that can be marked by each laser galvanometer module.

[0073] The control system of the PCB laser window opening equipment controls each laser galvanometer module to engrave the preset array pattern into its corresponding working area, that is, N laser galvanometer modules will get N Figure 2 The preset array pattern shown. After the laser galvanometer module has marked the preset array pattern, the control system of the PCB laser window opening device controls the second positioning unit to stop at a suitable position in the fourth direction (T axis), and controls the second positioning unit to move in the first direction (X axis) and the second direction (Y axis), so as to obtain the actual position information of the dots in the working area through the second positioning unit, so as to determine the actual position information of each dot in the working area marked on the PCB board. Alternatively, the actual position information of each dot in the working area marked on the PCB board is directly obtained by taking pictures through the camera of the PCB laser window opening device.

[0074] Then, according to the theoretical position information and the actual position information of each dot, the image error parameter between the theoretical position of the preset array pattern on the PCB board and the actual position of the preset array pattern actually marked on the PCB board is determined. In the subsequent steps, the image error parameter between the theoretical position of the pattern to be marked on the PCB board input by the user and the actual position of the pattern to be marked on the PCB board is determined.

[0075] More specifically, in some embodiments, the step of determining the image error parameters corresponding to the plurality of laser galvanometer modules respectively according to the actual position information and the theoretical position information may include the following steps:

[0076] (1) The preset array circular patterns of the plurality of laser galvanometer modules respectively engraved on the PCB board are divided into a plurality of sub-areas; any of the plurality of sub-areas contains at least three dots.

[0077] (2) Determine the image error matrices corresponding to the multiple sub-regions according to the actual position information of the dots included in the multiple sub-regions marked on the PCB board and the theoretical position information of the dots on the preset array circle pattern.

[0078] (3) According to the image error matrices corresponding to the multiple sub-regions, the image error parameters corresponding to the multiple laser galvanometer modules are determined respectively.

[0079] Among them, any sub-area of ​​the multiple sub-areas contains at least three dots. In some embodiments, the preset array circular figure can be evenly divided into multiple sub-areas, and the area of ​​each sub-area is equal. For example, the control system can evenly divide the preset array circular figure into multiple square areas or rectangular areas. In other embodiments, the control system can also determine multiple arbitrary areas in the preset array circular figure, and the areas of any areas can be different. For example, a square area A and a rectangular area B are arbitrarily determined in the preset array circular figure.

[0080] In the examples of this application, please refer to Figure 3 , Figure 3 FIG. 1 shows a schematic diagram of a structure of a preset array pattern provided in an embodiment of the present application. Figure 3 As shown, the preset array circular figure is evenly divided into areas as shown in the figure, that is, the preset array circular figure is evenly divided into areas including four reference points.

[0081] After the preset array circular pattern is divided into a plurality of sub-regions, the image error matrix corresponding to each sub-region is determined according to the theoretical positions of the dots contained in the sub-region and the corresponding actual positions.

[0082] In a specific embodiment, the step of determining the image error matrix of any sub-region in the plurality of sub-regions according to the theoretical position information and the actual position information corresponding to the dots contained in any sub-region in the plurality of sub-regions may include the following steps:

[0083] In any sub-area, determine the theoretical distance between two adjacent dots. Determine the actual distance between two adjacent dots. Determine the image error parameter based on the theoretical distance and the actual distance. Exemplarily, the two adjacent dots include dot A and dot B, the theoretical position of dot A is K1, the actual position of dot A is k1, the theoretical position of dot B is K2, and the actual position of dot B is k2. Then, the theoretical distance between dot A and dot B is D=|K1-K2|, and the actual distance between dot A and dot B is d=|k1-k2|. The error value between dot A and dot B can be determined based on the theoretical distance D and the actual distance d.

[0084] By counting the error values ​​between each pair of adjacent dots in the area, the overall error distribution information in the area can be determined, and then the image error matrix corresponding to the area can be determined based on these error values. Then, based on the image error matrix corresponding to each sub-area, the image error parameters between the theoretical position of the preset array pattern corresponding to the laser galvanometer module on the PCB board and the actual position of the preset array pattern actually marked on the PCB board can be determined, and then the image error parameters corresponding to the laser galvanometer module can be determined.

[0085] In the subsequent steps, after the user inputs the pattern to be marked, the area corresponding to a certain laser galvanometer module in the pattern to be marked is determined, and the area corresponding to the laser galvanometer module in the pattern to be marked is compensated according to the image error parameters corresponding to the laser galvanometer module, so that the laser galvanometer module can draw the corresponding area more accurately on the PCB board.

[0086] In another specific embodiment, the step of determining the image error matrix of any sub-region in the plurality of sub-regions according to the theoretical position information and the actual position information corresponding to the dots included in any sub-region in the plurality of sub-regions may include the following steps:

[0087] Determine the translation parameter between the theoretical position information and the actual position information of any point. Determine the rotation parameter between the theoretical position information and the actual position information of any point. Determine the expansion and contraction parameter between the theoretical position information and the actual position information of any point. Determine the image error matrix based on the translation parameter, the rotation parameter and the expansion and contraction parameter. Exemplarily, the theoretical position of a point in a certain area is P, and the actual position of the point is p. The translation parameter of the point can be represented by a translation vector T, and the position of the point after transformation is P1=P+T.

[0088] For example, after the theoretical position P is rotated to the actual position p, the rotation angle can be represented by an angle α, and the conversion relationship between the two positions can be represented by the following transformation formula:

[0089] P = )p;

[0090] Exemplarily, the dot position is adjusted by the scale factor s to achieve a scaling effect. For example, after the theoretical position P is expanded and contracted by the scale factor s, the actual position p (p=s*P) can be obtained.

[0091] Then, the least squares fitting method is used to determine the translation vector T, the rotation angle α, and the scale factor s. Specifically, the loss function can be set as the difference between the actual position p and the position after compensation according to the image error matrix. The sum of squared errors between:

[0092] L(T,α,s)=

[0093] By minimizing the loss function, the optimal translation vector T, rotation angle α, and scale factor s can be obtained.

[0094] Finally, the image error matrix is ​​determined according to the translation parameter T, the rotation parameter α and the expansion parameter s. The image error matrix M can be expressed as the following formula:

[0095] M=

[0096] Wherein, T1 is the translation value of the dot in the first direction (X axis); T2 is the translation value of the dot in the second direction (Y axis).

[0097] Assume that the image information to be marked input by the user includes reference point A, and the theoretical position of reference point A is P. Then after adjusting reference point A according to the image error matrix, the marking position of reference point A on the PCB board is finally determined according to p (=M*P).

[0098] Determine the image error matrix M of a certain area, and then determine the image error parameter M (= M0, M1, M2, ..., Mn, where M0, M1, M2, ..., Mn are the image error parameters corresponding to a single area respectively) between the theoretical position of the preset array pattern corresponding to the laser galvanometer module on the PCB board and the actual position of the preset array pattern actually marked on the PCB board according to the image error matrix M corresponding to each area, and then determine the final image error parameter of the laser galvanometer module.

[0099] The image error parameters of each laser galvanometer module are determined by dividing the preset array circular figure marked by each laser galvanometer module into multiple sub-areas, solving the image error parameters corresponding to each sub-area, and then determining the image error parameters corresponding to the entire preset array circular figure according to the image error parameters corresponding to each sub-area. This makes the actual position corresponding to the image information to be marked on the PCB board actually marked by each laser galvanometer module closer to the theoretical position of the image information to be marked on the PCB board, so as to improve the accuracy of the marking operation of the PCB laser window opening equipment.

[0100] The above image error matrix can correct errors in most cases by translation, rotation, and expansion and contraction. However, it is found in practice that there are still cases where the above image error matrix cannot correct errors in actual use. The most common one is local expansion and contraction. Please refer to Figure 4 , Figure 4 A schematic diagram of a structure in which a preset array pattern is engraved on a PCB board provided in an embodiment of the present application is shown. Figure 4 The originally regular rectangular figure in the figure finally becomes irregular in shape after being marked. At this time, the image error matrix is ​​divided into the first image error matrix and the second image error matrix. The first image error matrix is ​​composed of translation parameters and rotation parameters, and the second image error matrix is ​​composed of expansion and contraction parameters.

[0101] Taking the area corresponding to M0 as an example, the correction object of the first image error matrix can be the coordinates of each pixel point in the area, that is, the coordinates of each pixel point in the area can be multiplied by the corresponding translation parameters and rotation parameters in the first image error matrix to obtain the corrected coordinates.

[0102] However, because the pixel points are too small in the PCB board, it is impossible to accurately calculate the expansion and contraction degree of each row / column of pixels when calculating the expansion and contraction parameters. Therefore, the area is divided into L equal parts along the X-axis direction and the Y-axis direction (L is a positive integer and L is usually greater than or equal to 4 and less than or equal to 10) to obtain 2L sub-areas. At this time, the first expansion and contraction sub-parameter and the second expansion and contraction sub-parameter are calculated first. The first expansion and contraction sub-parameter corresponds to the expansion and contraction in the X-axis direction, and the second expansion and contraction sub-parameter corresponds to the expansion and contraction in the Y-axis direction. The first expansion and contraction sub-parameter of the L sub-areas divided into L equal parts along the X-axis direction and the second expansion and contraction sub-parameter of the L sub-areas divided into L equal parts along the Y-axis direction are calculated respectively. Finally, the final expansion and contraction parameters of each overlapping area between the L sub-areas divided into L equal parts along the X-axis direction and the L sub-areas divided into L equal parts along the Y-axis direction are determined according to the L first expansion and contraction sub-parameters and the L second expansion and contraction sub-parameters. Subsequently, the final expansion and contraction parameters of the overlapping area are called according to the overlapping area where each pixel point in the area is located to calculate the corrected coordinates, thereby realizing the correction of local expansion and contraction.

[0103] The final expansion and contraction parameters of the overlapped area are composed of a first expansion and contraction sub-parameter of the sub-area in the X-axis direction where the overlapped area is located and a second expansion and contraction sub-parameter of the sub-area in the Y-axis direction where the overlapped area is located.

[0104] The corrected coordinate of each pixel point = (the original X coordinate multiplied by the first expansion and contraction sub-parameter corresponding to the overlapped area, and the original Y coordinate multiplied by the second expansion and contraction sub-parameter corresponding to the overlapped area).

[0105] As an example, see Figure 5 , Figure 5 A schematic diagram of another structure of a preset array pattern engraved on a PCB board provided in an embodiment of the present application is shown. Figure 4 Where L is equal to 2, Figure 5 The regions in include regions 1 to 4. Figure 5 It can be regarded as being divided into two equal parts along the X-axis direction, region 1 and region 2 constitute the first sub-region in the X-axis direction, region 3 and region 4 constitute the second sub-region in the X-axis direction, and the Y-axis can be obtained similarly, region 1 and region 3 constitute the first sub-region in the Y-axis direction, and region 2 and region 4 constitute the second sub-region in the Y-axis direction, and then the first expansion and contraction parameters of the first sub-region and the second sub-region in the X-axis direction are calculated, and the second expansion and contraction parameters of the first sub-region and the second sub-region in the Y-axis direction are calculated. Finally, the final expansion and contraction parameters corresponding to region 1 are composed of the first expansion and contraction parameters of the first sub-region in the X-axis direction and the second expansion and contraction parameters of the first sub-region in the Y-axis direction. When correcting, the coordinates of the pixel points located in region 1 = (X multiplied by the first expansion and contraction parameter, Y multiplied by the second expansion and contraction parameter), and the remaining regions are deduced and will not be repeated, thereby realizing the correction of local expansion and contraction.

[0106] As the PCB laser window opening equipment is used for a longer time, the positioning module on the PCB laser window opening equipment and the fixed axis corresponding to the workbench will be offset, causing the PCB laser window opening equipment to mark the image information to be marked input by the user. There will be errors in the marking position of the image information on the PCB board, thereby affecting the accuracy of the PCB board.

[0107] For example, the positioning module may be offset in the second direction and the third direction. When the number of the first positioning unit is one, the fixed axis corresponding to the first positioning unit may be offset, that is, the Y axis and the K1 axis may be offset to varying degrees. It is understandable that when the number of the first positioning units is two, the fixed axes corresponding to the two first positioning units may also be offset, that is, the Y axis, the K1 axis, and the K2 axis may be offset to varying degrees.

[0108] For another example, the workbench may be offset in the first direction and the second direction, that is, the X-axis and the Y-axis may be offset to varying degrees.

[0109] If the offset value generated by the positioning module and the fixed axis of the workbench is not compensated or revised, the specific position of the image to be marked on the PCB board will be affected, thereby reducing the marking accuracy of the PCB laser window opening equipment, thereby affecting the yield of the PCB board. Based on the above situation, specifically:

[0110] In step 220, the mechanical error parameters of the PCB laser window opening device are determined according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench.

[0111] The fixed axis of the positioning module includes a fixed axis corresponding to the third direction, namely, the K1 axis. It can be understood that when the PCB laser window opening device includes two first positioning units, the fixed axis of the positioning module includes a fixed axis corresponding to the third direction, namely, the K1 axis and the K2 axis. The fixed axis of the workbench can be a fixed axis corresponding to the first direction and the second direction, namely, the X axis and the Y axis.

[0112] The performance indicator parameters may include one or more of linearity, straightness, and orthogonality.

[0113] By determining the performance index parameters corresponding to the positioning module and the fixed axis of the workbench, the mechanical accuracy of the PCB laser window opening equipment is compensated according to the determined performance index parameters to ensure that the image to be marked is marked at the ideal position on the PCB board, so as to avoid the presence of offset values ​​when marking the image to be marked on the X-axis, Y-axis and K1 axis (K2 axis).

[0114] Specifically, in some embodiments, the step of determining the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench may include the following steps:

[0115] (1) Determine the performance index parameters corresponding to the workbench in the first direction and the second direction.

[0116] (2) Determine the performance index parameters corresponding to the first positioning unit in the third direction.

[0117] (3) Determine the mechanical error parameters of the PCB laser window opening equipment based on the performance index parameters.

[0118] The interferometer can be used to obtain the performance index parameters of the positioning module in the third direction and the performance index parameters of the workbench in the first direction and the second direction, that is, the performance index parameters corresponding to the X-axis and the Y-axis. And the performance index parameters of the first positioning unit in the third direction can be obtained through the interferometer. That is, the performance index parameters corresponding to the K1 axis, or the performance index parameters corresponding to the K1 axis and the K2 axis.

[0119] The control system compares the performance index parameters corresponding to the X-axis, Y-axis and K1-axis, or the performance index parameters corresponding to the X-axis, Y-axis, K1-axis and K2-axis with the preset performance index parameters to obtain the mechanical error parameters of the PCB laser window opening device in the first direction, the second direction and the third direction. In the subsequent steps, the PCB laser window opening device marks the PCB board according to the image information to be marked input by the user, and compensates the workbench and the positioning module according to the mechanical error parameters of the PCB laser window opening device in the first direction, the second direction and the third direction, so that the image to be marked is marked at the ideal position on the PCB board.

[0120] Among them, the preset performance index parameters refer to the performance index parameters corresponding to the workbench in the first direction and the second direction, and the first positioning unit in the third direction when the PCB laser window opening equipment marks the image information to be marked under ideal conditions.

[0121] When the PCB laser window opening device marks the image information to be marked, compensation is performed based on the image error parameters and mechanical error parameters, so that multiple laser galvanometer modules can mark the image information to be marked at the ideal position on the PCB board. Specifically:

[0122] In step 230 , the working area of ​​each laser galvanometer module in the plurality of laser galvanometer modules is determined according to the position information of each laser galvanometer module in the plurality of laser galvanometer modules.

[0123] As can be seen from the above, the second positioning unit can move along the X-axis, Y-axis and T-axis. The second positioning unit is stopped at a suitable T-axis to ensure that the second positioning unit can move unimpeded on the X-axis and Y-axis, and then move to the bottom of each laser galvanometer module.

[0124] The control system of the PCB laser window opening equipment controls the second positioning unit to move on the X-axis and the Y-axis. When the second positioning unit moves to the bottom of any laser galvanometer module, the control system controls the center of the laser galvanometer module to emit an indication pattern (for example, the laser galvanometer module emits the center of a circle to the PCB board). The second positioning unit obtains the indication pattern and determines the current position information of the second positioning unit in the first direction and the second direction as the position information of the laser galvanometer module.

[0125] For example, when the second positioning unit moves to the bottom of the laser galvanometer module A, the center of the laser galvanometer module A emits the center of the circle, and the second positioning unit obtains the center of the circle emitted by the laser galvanometer module A. At this time, the coordinates of the second positioning unit are (X1, Y1), and the coordinates of the laser galvanometer module A are determined to be (X1, Y1).

[0126] The control system of the PCB laser window opening device controls the second positioning unit to move in the first direction and the second direction to obtain the indication pattern emitted by the center of each laser galvanometer module, so as to determine the position information of each laser galvanometer module. According to the position information of each laser galvanometer module, the position distribution of each laser galvanometer module is determined, and then the corresponding area of ​​each laser galvanometer module in the image information to be marked and the working area on the PCB board are determined according to the position distribution of each laser galvanometer module, so as to mark the corresponding area in the image information to be marked on the corresponding working area on the PCB board on the basis of compensating the image error parameters and the mechanical error parameters, and then complete the marking of the PCB board by multiple laser galvanometer modules.

[0127] Specifically, in some embodiments, the step of determining the working area of ​​each laser galvanometer module in the plurality of laser galvanometer modules according to the position information of each laser galvanometer module in the plurality of laser galvanometer modules may include the following steps:

[0128] (1) Control multiple laser galvanometer modules to emit preset patterns separately.

[0129] (2) Determine the position information of the preset pattern by the second positioning unit, and determine the distance information between the reference galvanometer module and other laser galvanometer modules; wherein the reference galvanometer module is any laser galvanometer module among the multiple laser galvanometer modules; and the other laser galvanometer modules are laser galvanometer modules other than the reference galvanometer module.

[0130] (3) Determine the working area corresponding to each laser galvanometer module in the plurality of laser galvanometer modules according to the distance information between the reference galvanometer module and other laser galvanometer modules.

[0131] The reference galvanometer module is any one of the multiple laser galvanometer modules. The reference galvanometer module can be the laser galvanometer module arranged at the edge. For example, please continue to refer to Figure 1 , the reference galvanometer module can be arranged in the upper left corner of the laser galvanometer module. The reference galvanometer module can also be a laser galvanometer module arranged in the center. It is understandable that the present application can determine any laser galvanometer module as a reference galvanometer module among multiple laser galvanometer modules. The user can flexibly determine which laser galvanometer module to use as the reference galvanometer module among multiple laser galvanometer modules according to actual needs.

[0132] When the PCB laser window opening equipment is marking the PCB board, it takes the reference galvanometer module as the starting point, first determines the corresponding working area of ​​the reference galvanometer module on the PCB board, that is, determines the marking area of ​​the reference galvanometer module corresponding to the image information to be marked, and marks the corresponding marking area to the specific position on the PCB board. Then, according to the position between the reference galvanometer module and other laser galvanometer modules, it determines the marking area of ​​other laser galvanometer modules corresponding to the image information to be marked, and marks the corresponding marking area to the specific position on the PCB board.

[0133] That is to say, the second positioning unit stays at a suitable position on the T axis and moves along the X axis and the Y axis. When the second positioning unit moves to the bottom of any laser galvanometer module, the laser galvanometer module emits a preset pattern. After the second positioning unit obtains the preset pattern emitted by the laser galvanometer module, the current position information of the second positioning unit on the X axis and the Y axis is determined as the position information of the laser galvanometer module to determine the position information of each laser galvanometer module, and then determine the position distribution information between the reference galvanometer module and other laser galvanometer modules, and then determine the marking area and working area of ​​each laser galvanometer module according to the position distribution information between the reference galvanometer module and other laser galvanometer modules.

[0134] Exemplarily, the position of the reference galvanometer module is (X0, Y0), the position of the laser galvanometer module A relative to the reference galvanometer is (X1, Y1), and the position of the nth laser galvanometer module A relative to the reference galvanometer module is (Xn, Yn). In this way, the minimum Ymin and maximum Ymax of the positions of all laser galvanometer modules in the second direction can be obtained. Then, according to the marking length LB of each laser galvanometer module (the marking length is generally a fixed value), the starting Y position marked on the Y axis can be obtained as Ymin, the position marked to (Ymin+LB), and the end position on the Y axis is set to Ymax+LB. The marking range of each laser galvanometer module on the X axis can be determined by the above method. In this way, the marking range corresponding to each laser galvanometer module is determined, and the working area of ​​each laser galvanometer module on the PCB board is determined.

[0135] By determining the positional relationship between the reference galvanometer module and other laser galvanometer modules, the corresponding working area of ​​each laser galvanometer module on the PCB board is determined. In the subsequent steps, the corresponding marking area of ​​each laser galvanometer module in the image information to be marked input by the user is determined according to the positional relationship between the reference galvanometer module and other laser galvanometer modules, so as to mark the image information corresponding to the corresponding marking area on the corresponding working area on the PCB board, thereby completing the marking operation of the PCB board.

[0136] It can be seen that the image error parameters corresponding to each laser galvanometer module and the mechanical error parameters of the PCB laser window opening equipment are determined by the preset graphic correction model, so as to compensate for the marking operation of each laser galvanometer module on the corresponding working area on the PCB board, so that the image information to be marked input by the user can be more accurately marked at the ideal position on the PCB board, thereby improving the accuracy of marking the PCB board.

[0137] However, in the process of the PCB laser window opening device marking the PCB board through multiple laser galvanometer modules, due to the different working parameters of each laser galvanometer module, the image information marked on the PCB board is uneven, and the surface glossiness of the processed PCB board may be inconsistent, and even the PCB board may be damaged or the surface may be blackened, which will affect the quality of the PCB board. Based on the above situation, in some embodiments, the PCB laser window opening method can also include the following steps:

[0138] (1) Determine the relationship between the current and power of each laser galvanometer module in the plurality of laser galvanometer modules.

[0139] (2) According to the relationship between the current and power of each laser galvanometer module, determine the operating current corresponding to the target energy parameters generated by each laser galvanometer module.

[0140] By controlling any laser galvanometer module to work at different working currents, reading the working power corresponding to the laser galvanometer module when working at different working currents, and then obtaining multiple sets of working current and working power data, fitting processing is performed based on the multiple sets of working current and working power data to obtain the relationship between the current and power corresponding to any laser galvanometer module.

[0141] The target energy parameter can be the working power corresponding to each laser galvanometer module during the process of marking the PCB board. After determining the target energy parameter (i.e., working power) of each laser galvanometer module, the working current corresponding to each laser galvanometer module can be determined according to the relationship between the current and power corresponding to each laser galvanometer module, and then each laser galvanometer module is controlled to work at the determined working current, thereby improving the uniformity of the image information marked on the PCB board, making the surface gloss of the PCB board relatively consistent, and reducing the copper damage or blackening of the surface of the PCB board, thereby improving the quality of the finished PCB board.

[0142] It is understandable that the present application does not limit the specific value of the target energy parameter, and the user can flexibly determine the specific value of the target energy parameter according to actual conditions.

[0143] In the embodiment of the present application, the energy meter is controlled to move along the X-axis and the Y-axis so that the energy meter moves to each laser galvanometer module, thereby determining the working energy of each laser galvanometer module.

[0144] How to directly read the working energy of each laser galvanometer module through an energy meter. Specifically, in a specific embodiment, assuming that the working current range that can be set by the configured light source energy of the laser galvanometer module A is [0, N] mA (N ≥ 0), M mA is the initial value of the working current of the laser galvanometer module A, and step mA is the step interval, then the working current range [0, N] of the laser galvanometer module A can be divided into multiple small step intervals, and each time the current is set to m, m+step... and so on, and then marked on the energy meter, that is, each different working current is matched with the scale on the energy meter, and then the working energy corresponding to each current is read, that is, the milliwatt energy values ​​W1, W2,...Wn marked on the energy meter. Thereby, it is possible to obtain multiple sets of working current and working power data, and then perform fitting processing based on the multiple sets of working current and working power data to obtain the relationship between the current and power of any laser galvanometer module.

[0145] According to the relationship between the current and power of any laser galvanometer module and the target energy parameter, the working current corresponding to the target energy parameter generated by any laser galvanometer module can be determined. In the subsequent steps, when the PCB laser window opening equipment performs marking operations on the PCB board, each laser galvanometer module is controlled to operate with the working current corresponding to the target energy parameter, so that the image information marked on the PCB board is uniform, thereby improving the quality of the PCB board.

[0146] By adjusting the working current used by multiple laser galvanometer modules when marking PCB boards, the uniformity of the image information marked on the PCB boards can be ensured. However, since the size information corresponding to the image in the image information to be marked is different from the working parameters of the laser galvanometer module, the accuracy of the graphics marked on the PCB boards will be affected to a certain extent.

[0147] For example, the image information to be marked includes the laser spot parameters to draw an M*N rectangle with a size of 1mm. The current laser spot parameters are 2mm. Obviously, there is a deviation between the rectangle drawn by the current laser spot parameters and the rectangle required by the image information to be marked, which in turn affects the accuracy of the PCB laser window opening equipment in marking the PCB board.

[0148] In order to avoid the above situation, in some embodiments, the PCB laser window opening method may further include the following steps:

[0149] (1) Determine the theoretical spot parameters corresponding to the image information to be marked.

[0150] (2) According to the theoretical spot parameters, the actual spot parameters corresponding to the operation of each laser galvanometer module in the multiple laser galvanometer modules are determined.

[0151] The theoretical spot parameters corresponding to the multiple laser galvanometer modules are determined according to the image information to be marked, and the focal length corresponding to any laser galvanometer module among the multiple laser galvanometer modules is adjusted so that the actual spot parameters corresponding to any laser galvanometer module among the multiple laser galvanometer modules are as close as possible to the theoretical spot parameters, so that the actual spot size emitted by any laser galvanometer module is the same as the theoretical spot size, so that the pattern marked on the PCB board is closer to the image information to be marked, thereby further improving the accuracy of PCB laser window opening equipment in marking PCB boards.

[0152] The user places the PCB board on the workbench, and the workbench moves in the first direction and the second direction to carry the PCB board to the bottom of multiple laser galvanometer modules. By controlling the multiple laser galvanometer modules with corresponding working current and adjusted actual spot parameters, the image information to be marked is compensated according to the image error parameters and the mechanical error parameters, so that the image information to be marked can be marked at the theoretical position on the PCB board.

[0153] However, when the user places the PCB board on the workbench, the PCB board may be placed on the workbench in various postures. At this time, it is necessary to correspond the image information to be marked with the posture of the current PCB board, so that multiple laser galvanometer modules can mark the image information to be marked at the theoretical position on the PCB board. Specifically, in some embodiments, the PCB laser window opening method can also include the following steps:

[0154] (1) Get the current image information of the PCB board.

[0155] (2) Determining adjustment parameters between the current image information and the image information to be marked according to the position information of the preset area in the image information to be marked and the area corresponding to the preset area in the image information.

[0156] (3) Adjust the image information to be marked according to the adjustment parameters so that the current image information corresponds to the image information to be marked.

[0157] The user can input the completed image information to be marked into the PCB laser window opening equipment. The image information to be marked can be a DXF file or a Gerber file.

[0158] The adjustment parameters include the rotation value, expansion value and translation value of the current PCB board relative to the image information to be marked.

[0159] The preset area includes multiple preset positions. By determining the theoretical positions of multiple preset positions on the image information to be marked, and the actual positions of multiple preset positions marked on the current PCB board, the deviation between the preset area on the image information to be marked and the preset area on the current PCB board is determined according to the theoretical position and the actual position.

[0160] The rotation value, expansion value and translation value of the current PCB board relative to the image information to be marked are determined by the deviations corresponding to each preset area. After the image information to be marked is adjusted according to the adjustment parameters, the adjusted image information to be marked is compensated according to the image error parameters and the mechanical error parameters, so that the adjusted image information to be marked is marked at the theoretical position on the PCB board.

[0161] By determining the position information of the preset area in the image information to be marked and the area corresponding to the preset area in the current image information of the PCB board, the adjustment parameter between the current image information and the image information to be marked is determined according to the deviation between the position information of the preset area in the image information to be marked and the position information of the area corresponding to the preset area in the current image information of the PCB board.

[0162] The image information to be marked is adjusted by adjusting parameters so that the image information to be marked corresponds to the current image information of the PCB board, so as to better mark the image information to be marked to the specified position of the PCB board through the laser galvanometer module.

[0163] That is to say, by dividing the image information to be marked into multiple areas and then determining the positions of the multiple areas on the current PCB board, the rotation value, expansion and contraction value and translation value of the current PCB board relative to the image information to be marked can be determined more accurately, and then the image information to be marked can be adjusted according to the determined rotation value, expansion and contraction value and translation value, which can improve the correspondence between the image information to be marked and the position and posture of the current PCB board, thereby improving the accuracy of PCB laser window opening equipment marking PCB boards.

[0164] The user places the PCB board on the workbench, and the workbench moves along the X-axis and / or Y-axis direction to move the PCB board below the multiple laser galvanometer modules, and then the PCB board is marked by the multiple laser galvanometer modules. Specifically, in some embodiments, the PCB laser window opening method may also include the following steps:

[0165] (1) Determine the standard position information of the target positioning point on the image information to be marked.

[0166] (2) Determine the movement value based on the current position information and the standard position information.

[0167] (3) According to the movement value, the PCB is controlled to move along the first direction and / or the second direction so that the target positioning point on the PCB moves to the standard position information.

[0168] The target positioning point may be the center of the PCB (i.e., the center of the image information to be marked). In other embodiments, the target positioning point may also be the upper left corner, lower left corner, upper right corner, or lower right corner of the PCB.

[0169] The current position information of the target positioning point on the PCB board is determined by the position detection module, and then the current position information of the target positioning point on the PCB board is adjusted according to the standard position information of the target positioning point in the image information to be marked, that is, the PCB board is controlled to move along the X-axis and Y-axis directions, so that the PCB board moves to the bottom of multiple laser galvanometer modules.

[0170] The position of the PCB board in the X-axis and Y-axis directions is roughly adjusted through the target positioning points, so that the PCB board is moved to the bottom of multiple laser galvanometer modules, and then the image information to be marked is compensated through the determined image error parameters and mechanical error parameters, so that the image information to be marked is marked at the theoretical position on the PCB board, so as to improve the accuracy of PCB laser window opening equipment in marking PCB boards.

[0171] In the actual production process, there may be other foreign objects on the workbench due to operator error. In other words, there may be multiple PCB boards stacked. Due to foreign objects or devices set on the PCB board, the PCB board or the top PCB board to be marked may be placed unevenly. In other words, the marking quality on the PCB board is affected because the distance between the marking position on the PCB board surface and the laser galvanometer module is not equal.

[0172] Based on the above situation, in some embodiments, the PCB laser window opening method may further include the following steps:

[0173] (1) Obtain the horizontal values ​​of the four endpoints on the PCB board through the position detection module.

[0174] (2) According to the horizontal values ​​of the four endpoints, adjust the position information of the multiple movable bearing blocks in the fourth direction so that the distance values ​​between the four endpoints and the workbench are equal.

[0175] Wherein, the horizontal value is the distance value between any of the four endpoints and the multiple laser galvanometer modules. The four endpoints are the upper left corner, lower left corner, upper right corner and lower right corner of the PCB board. It is understandable that the number of endpoints can be flexibly determined according to the shape of the PCB board. For example, when the PCB board is a triangle, the number of endpoints can be three, that is, the three corners of the triangle are respectively determined as three endpoints.

[0176] The horizontal values ​​of the four endpoints are obtained in sequence through the position detection module set on the PCB laser window opening device. For example, lasers are emitted to the four endpoints through four position detection modules, and the distances between the four endpoints and the laser galvanometer module are determined according to the time of reflecting the laser back.

[0177] In some embodiments, when the distance between the four endpoints and the laser galvanometer module is greater than a preset threshold, the plurality of movable bearing blocks are adjusted so that the distance between the four endpoints and the laser galvanometer module is less than or equal to the preset threshold.

[0178] The marking is performed according to the different inclinations of the PCB board, that is, the distance between a certain end point of the PCB board and the laser galvanometer module is different from the distance between the other end points and the laser galvanometer module. Then the laser galvanometer module is controlled to mark the tilted PCB board, and by detecting the marking condition of the PCB board, it is determined whether the inclination will affect the marking effect of the PCB board, and then the specific value of the preset threshold is determined.

[0179] The workbench includes a plurality of movable bearing blocks, and the plurality of movable bearing blocks are respectively movable along the fourth direction. That is, after the PCB board is placed on the workbench, the distance between the four end points of the PCB board and the laser galvanometer module can be roughly adjusted by controlling the plurality of movable bearing blocks to move in the T-axis direction.

[0180] For example, please refer to Figure 6 , Figure 6 FIG. 1 shows a schematic diagram of the structure of a workbench provided in an embodiment of the present application. Figure 6 As shown, the workbench includes four movable supporting blocks. Assuming that endpoint A corresponds to the movable supporting block in the upper left corner, when the horizontal value of endpoint A is greater than the preset threshold, that is, the distance between endpoint A and the laser galvanometer module is close, the movable supporting block in the upper left corner is controlled to move along the T-axis direction so that the horizontal value of endpoint A is adjusted to within the preset threshold.

[0181] It is understandable that when the range of the movable bearing block in the upper left corner is adjusted on the T axis is too large or the moving speed is too fast, the PCB board is prone to slip off the workbench, thereby affecting the working efficiency of the PCB laser window opening equipment. Based on this, when the difference between the horizontal values ​​of the four endpoints is large, the alarm light on the PCB laser window opening equipment lights up to notify the operator to manually adjust the PCB board. For example, remove foreign objects or remove other overlapping PCB boards.

[0182] In step 240 , according to the image error parameter and the mechanical error parameter, a plurality of laser galvanometer modules are controlled to mark the corresponding information in the image information to be marked to the corresponding working area respectively.

[0183] After ensuring that the PCB board is placed on the workbench in a relatively horizontal posture, the control system compensates the image information to be marked according to the image error parameters and mechanical error parameters, and controls each laser galvanometer module to mark the corresponding image in the compensated image information to be marked on the corresponding working area of ​​the PCB board, so as to accurately complete the marking of the PCB board.

[0184] As the PCB laser window opening equipment is used for a longer period of time, the performance index parameters corresponding to the positioning module and the workbench fixed axis will change, and the position information of each laser galvanometer module may also change (the laser galvanometer module will undergo a small displacement change due to the influence of the thermal expansion environment). At this time, after the determined image error parameters and mechanical error parameters are used to compensate for the image information to be marked, the position of the mark on the PCB board may deviate from the ideal position to a certain extent, thereby affecting the marking accuracy of the PCB board.

[0185] Therefore, the control system determines the latest image error parameters through a preset graphic correction model within a preset time period, and determines the latest mechanical error parameters through an interferometer, so as to compensate the image information to be marked according to the latest image error parameters and the latest mechanical error parameters.

[0186] In some embodiments, when the control system determines through the second positioning unit that the distance between any adjacent laser galvanometer modules is greater than a preset value, another alarm light of the PCB laser window opening device is controlled to light up to notify the user to manually adjust the position of the laser galvanometer module.

[0187] See also Figure 7 , Figure 7 The schematic diagram of the structure of a PCB laser window opening device provided by an embodiment of the present application is shown, which is applied to a PCB laser window opening device. The PCB laser window opening device includes multiple laser galvanometer modules, a positioning module and a workbench. The multiple laser galvanometer modules are used to mark the PCB board, the positioning module is used to determine the position information, and the workbench is used to carry the PCB board for marking. The PCB laser window opening device 300 includes: a first determination module 310, a second determination module 320, a third determination module 330 and an execution module 340. Specifically:

[0188] The first determination module 310 is used to obtain image error parameters for marking image information to be marked by each laser galvanometer module among multiple laser galvanometer modules; wherein the image information to be marked is an image input by a user for marking on a PCB board.

[0189] The second determination module 320 is used to determine the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench.

[0190] The third determination module 330 is used to determine the working area of ​​each laser galvanometer module among the multiple laser galvanometer modules according to the position information of each laser galvanometer module among the multiple laser galvanometer modules.

[0191] The execution module 340 is used to control the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area according to the image error parameter and the mechanical error parameter.

[0192] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0193] In several embodiments provided in the present application, the coupling or direct coupling or communication connection between the modules shown or discussed may be an indirect coupling or communication connection through some interfaces, devices or modules, which may be electrical, mechanical or other forms.

[0194] In addition, each functional module in each embodiment of the present application can be integrated into a processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or software functional modules.

[0195] See also Figure 8 , Figure 8 A schematic structural diagram of a PCB laser window opening device provided in an embodiment of the present application is shown. The PCB laser window opening device 400 in the present application may include one or more of the following components: a processor 410, a memory 420, and one or more application programs, wherein the one or more application programs may be stored in the memory 420 and configured to be executed by one or more processors 410, and the one or more programs are configured to execute the anti-light leakage method as described in the aforementioned method embodiment.

[0196] The processor 410 may include one or more processing cores. The processor 410 uses various interfaces and lines to connect various parts of the entire terminal device 400, and executes various functions and processes data of the terminal device 400 by running or executing instructions, programs, code sets or instruction sets stored in the memory 420, and calling data stored in the memory 420. Optionally, the processor 410 can be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 410 can integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), and a modem. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 410, but may be implemented separately through a communication chip.

[0197] The memory 420 may include a random access memory (RAM) or a read-only memory (ROM). The memory 420 may be used to store instructions, programs, codes, code sets, or instruction sets. The memory 420 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function, instructions for implementing the following various method embodiments, etc. The data storage area may also store data created by the terminal device 400 during use.

[0198] See also Fig. 9 , Fig. 9 A schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of the present application is shown, wherein the computer-readable medium 500 stores program code, and the program code can be called by a processor to execute the cooking control method described in the above method embodiment.

[0199] The computer-readable storage medium 500 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM, a hard disk or a ROM. Optionally, the computer-readable storage medium 400 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 500 has storage space for program code 510 for executing any method steps in the above method. These program codes can be read from or written to one or more computer program devices. The program code 510 can be compressed, for example, in a suitable form.

[0200] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A PCB laser window opening method, characterized in that: Applied to PCB laser window opening equipment, the PCB laser window opening equipment includes multiple laser galvanometer modules, a positioning module and a workbench, the multiple laser galvanometer modules are used to mark the PCB board, the positioning module is used to determine the position information, and the workbench is used to carry the PCB board for marking operation. The method includes: Obtaining image error parameters for marking image information to be marked by each laser galvanometer module among the multiple laser galvanometer modules; wherein the image information to be marked is an image input by a user for marking on the PCB board; The step of obtaining image error parameters of each laser galvanometer module in the plurality of laser galvanometer modules for marking image information to be marked includes: Controlling the plurality of laser galvanometer modules to respectively mark a preset array pattern on the PCB board; wherein the preset array pattern comprises a plurality of dots, and the plurality of dots are arranged in a matrix; Determine the actual position information of a plurality of first dots on the preset array pattern respectively marked on the PCB board by the plurality of laser galvanometer modules and the theoretical position information on the preset array pattern; wherein the first dots are dots included in the preset array pattern respectively marked by the plurality of laser galvanometer modules; The preset array circular figures of the plurality of laser galvanometer modules respectively engraved on the PCB board are divided into a plurality of sub-areas; any of the plurality of sub-areas contains at least three dots; Determine the image error matrices corresponding to the multiple sub-areas respectively according to the actual position information of the dots respectively included in the multiple sub-areas marked on the PCB board and the theoretical position information on the preset array circle pattern; Determining image error parameters corresponding to the plurality of laser galvanometer modules respectively according to image error matrices corresponding to the plurality of sub-regions respectively; Determine the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench; Determine a working area of ​​each laser galvanometer module among the plurality of laser galvanometer modules according to position information of each laser galvanometer module among the plurality of laser galvanometer modules; According to the image error parameter and the mechanical error parameter, the plurality of laser galvanometer modules are controlled to mark the corresponding information in the image information to be marked to the corresponding working area respectively.

2. The PCB laser window opening method according to claim 1, characterized in that: The workbench is used to drive the PCB to move along a first direction and a second direction, the positioning module includes a first positioning unit, the first positioning unit is used to move along a third direction for positioning, the first direction intersects with the second direction, and the third direction intersects with the first direction; Determining the mechanical error parameters of the PCB laser window opening device according to the performance index parameters corresponding to the positioning module and the fixed axis of the workbench includes: Determine the performance index parameters corresponding to the workbench in the first direction and the second direction; Determine a performance indicator parameter corresponding to the first positioning unit in the third direction; According to the performance index parameters, the mechanical error parameters of the PCB laser window opening device are determined.

3. The PCB laser window opening method according to claim 1, characterized in that: The positioning module includes a second positioning unit, the second positioning unit is used to move along a first direction, a second direction and a fourth direction to determine the position information, the first direction intersects with the second direction, and the second direction intersects with the fourth direction; The step of determining the working area of ​​each laser galvanometer module among the plurality of laser galvanometer modules according to the position information of each laser galvanometer module among the plurality of laser galvanometer modules comprises: Controlling the plurality of laser galvanometer modules to emit preset patterns respectively; The position information of the preset pattern is determined respectively by the second positioning unit, and the distance information between the reference galvanometer module and other laser galvanometer modules is determined; wherein the reference galvanometer module is any laser galvanometer module among the multiple laser galvanometer modules; and the other laser galvanometer modules are laser galvanometer modules other than the reference galvanometer module; According to the distance information between the reference galvanometer module and the other laser galvanometer modules, the working area corresponding to each laser galvanometer module in the plurality of laser galvanometer modules is determined.

4. The PCB laser window opening method according to claim 1, characterized in that: Before controlling the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area respectively according to the image error parameter and the mechanical error parameter, the method further includes: Obtaining current image information of the PCB board; Determining adjustment parameters between the current image information and the image information to be marked according to the preset area in the image information to be marked and the position information of the area corresponding to the preset area in the image information; The image information to be marked is adjusted according to the adjustment parameters so that the current image information corresponds to the image information to be marked.

5. The PCB laser window opening method according to claim 1, characterized in that: The method further comprises: Determine a relationship between current and power of each laser galvanometer module in the plurality of laser galvanometer modules; According to the relationship between the current and power of each laser galvanometer module, determine the working current corresponding to the target energy parameter generated by each laser galvanometer module; According to the image error parameter and the mechanical error parameter, controlling the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area respectively includes: According to the image error parameter and the mechanical error parameter, each of the plurality of laser galvanometer modules is controlled to operate with a corresponding operating current, and the corresponding information of the image information to be marked is marked corresponding to the working area.

6. The PCB laser window opening method according to claim 1, characterized in that: The method further comprises: Determine theoretical spot parameters corresponding to the image information to be marked; Determine, according to the theoretical spot parameters, actual spot parameters corresponding to the operation of each laser galvanometer module in the plurality of laser galvanometer modules; According to the image error parameter and the mechanical error parameter, controlling the plurality of laser galvanometer modules to mark the corresponding information in the image information to be marked to the corresponding working area respectively includes: According to the image error parameters and the mechanical error parameters, each of the multiple laser galvanometer modules is controlled to mark the image information to be marked corresponding to the working area with the corresponding actual spot parameters, so that the marked pattern on the PCB board is closer to the image information to be marked.

7. The PCB laser window opening method according to any one of claims 1 to 6, characterized in that: The PCB laser window opening device includes a position detection module; the position detection module is used to detect the current position information of the target positioning point of the PCB board; Before obtaining the image error parameter of each laser galvanometer module in the plurality of laser galvanometer modules for marking the image information to be marked, the method further includes: Determine the standard position information of the target positioning point on the image information to be marked; Determine a movement value according to the current position information and the standard position information; According to the movement value, the PCB board is controlled to move along the first direction and / or the second direction, so that the target positioning point on the PCB board moves to the standard position information.

8. The PCB laser window opening method according to claim 7, characterized in that: The workbench includes a plurality of movable bearing blocks, and the plurality of movable bearing blocks are respectively moved along a fourth direction, and the method further includes: The horizontal values ​​of the four endpoints on the PCB are obtained by the position detection module; the horizontal values ​​are the distance values ​​between any of the four endpoints and the multiple laser galvanometer modules; According to the horizontal values ​​of the four endpoints, the position information of the plurality of movable bearing blocks in the fourth direction is adjusted so that the distance values ​​between the four endpoints and the workbench are equal.

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