High-precision laser cutting equipment suitable for complex circuit board

Abstract

The invention discloses high-precision laser cutting equipment suitable for a complex circuit board, and relates to the technical field of circuit board cutting, the high-precision laser cutting equipment comprises a ceramic table top, a base, a cooling assembly and a waste collecting assembly, the ceramic table top is fixedly mounted at the top end of the outer wall of the base; a cooling assembly and a waste collecting assembly are fixedly installed on the side face of the base through a conveying mechanism. The cooling assembly comprises a nozzle, a liquid box and a radiator, the nozzle is fixedly installed on the side face of the top end of the outer wall of the base through a supporting piece, the liquid box is fixedly installed on the side face of the outer wall of the base, the radiator is fixedly installed on the side face of the inner wall of the base, an impeller is fixedly installed at the bottom of the inner wall of the radiator, and a ventilation opening is formed below the impeller. And a dustproof net is fixedly mounted at the ventilation opening through a bolt. By installing the cooling assembly, the cutting temperature is reduced, the problem of material deformation caused by the heat effect is solved, and it is helpful for guaranteeing the flatness and smoothness of the cutting face and the overall integrity of the circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board cutting, and in particular to high-precision laser cutting equipment suitable for complex circuit boards. Background Art

[0002] Nowadays, electronic products are constantly developing towards miniaturization, high performance and multi-functions, such as smart phones, tablet computers, wearable devices, etc., which has led to an increasing demand for complex circuit boards. These circuit boards usually have higher line density, finer line spacing and more complex shapes. Traditional cutting methods can no longer meet their precision requirements, and high-precision laser cutting equipment has emerged.

[0003] Traditional cutting methods, such as mechanical cutting and chemical etching, often produce a lot of dust, waste and harmful gases, causing environmental pollution. In addition, laser cutting equipment is prone to reflect laser when processing high-reflectivity metal materials such as aluminum and copper, affecting efficiency and quality. For thicker materials, the cutting speed is slow and the accuracy is difficult to guarantee. The thermal effect generated during laser cutting may cause thermal deformation of the material, thereby affecting the cutting accuracy.

[0004] Therefore, it is necessary for the present application to propose a high-precision laser cutting device suitable for complex circuit boards to solve the problems in the background.

[0005] Patent document CN114101929B discloses an aluminum-based circuit board laser cutting device. The above patent realizes that the aluminum-based circuit board laser cutting process only needs two cutting steps, namely, carbon dioxide laser cutting and optical fiber laser cutting, and the entire aluminum-based circuit board laser cutting process can be completed by the aluminum-based circuit board laser cutting device to achieve fully automatic cutting, thereby improving the cutting accuracy and efficiency of the aluminum-based circuit board. However, the above patent cannot reduce the cutting temperature.

[0006] Patent document CN112276373B discloses a circuit board laser cutting machine. The above patent solves the problem that the existing cutting machine cannot adapt to the fixation of different circuit boards and the fixing effect is not good, but the above patent cannot achieve the function of reducing laser reflection.

[0007] Patent document CN117400327B discloses an intelligent cutting device for circuit board manufacturing. The above patent realizes uniform force on the circuit board stack and effectively avoids damage to the circuit board, but the above patent cannot achieve clear separation of working areas.

[0008] Patent document CN107901103B discloses an automatic circuit board cutting device and method. The above patent realizes the mechanical automatic cutting of multi-piece circuit boards, thereby improving the cutting efficiency of the circuit boards, saving labor costs, and ensuring the consistency of the cutting depth of the circuit boards. However, the above patent cannot realize the collection and storage of waste dust.

[0009] In summary, the above patents cannot achieve the functions of lowering cutting temperature, reducing laser reflection, clearly separating working areas, and collecting and storing waste dust, which results in the deformation of materials at high temperatures, frequent disorderly failures caused by many integrated devices, and the emission of laser cutting waste to produce hazardous substances. Metal materials such as aluminum and copper are prone to reflect lasers, affecting efficiency and quality. To this end, the present application proposes a high-precision laser cutting device suitable for complex circuit boards that can achieve the functions of lowering cutting temperature, reducing laser reflection, clearly separating working areas, and collecting and storing waste dust. Summary of the invention

[0010] The purpose of the present invention is to provide an antibacterial medical wound dressing package with a dressing change function and a method of using the same, so as to solve the technical problems proposed in the above-mentioned background technology that the functions of lowering the cutting temperature and reducing laser reflection cannot be achieved, the working area cannot be clearly separated, and waste dust cannot be collected and stored, resulting in the material being easily deformed at high temperature, the large number of integrated devices causing disorderly and frequent failures, laser cutting waste scattering to produce harmful substances, and metal materials such as aluminum and copper are easily reflected by lasers, affecting efficiency and quality.

[0011] To achieve the above object, the present invention provides the following technical solution: a high-precision laser cutting device suitable for complex circuit boards, comprising a ceramic table, a base, a cooling assembly and a waste collection assembly, wherein the ceramic table is fixedly mounted on the top of the outer wall of the base, and the cooling assembly and the waste collection assembly are fixedly mounted on the side of the base through a transmission mechanism; The cooling assembly comprises a nozzle, a liquid tank and a radiator, wherein the nozzle is fixedly mounted on the top side of the outer wall of the base through a support, the liquid tank is fixedly mounted on the side of the outer wall of the base, the radiator is fixedly mounted on the side of the inner wall of the base, an impeller is fixedly mounted on the bottom of the inner wall of the radiator, a vent is opened below the impeller, and a dustproof net is fixedly mounted on the vent by bolts; The bottom end of the nozzle is connected to the liquid tank through a cooling pipe, a flip cover plate is fixedly installed on the bottom end of the outer wall of the liquid tank through a connecting rod mechanism, a liquid exchange port is provided at the bottom of the inner wall of the liquid tank, and the liquid exchange port is connected to an external liquid supply source through a delivery pipe, the radiator contacts the outer shell of the base through thermal conductive silicone grease, the nozzle is provided with three nozzles, a swirl core is fixedly installed inside each nozzle of the nozzle, a swirl joint is fixedly installed on the bottom end of the outer wall of the nozzle, and a positioning ring is fixedly installed on the top end of the outer wall of the swivel joint.

[0012] Preferably, a laser generator is fixedly mounted on one side of the top of the outer wall of the base, a return pipe is wrapped around the inner wall side of the laser generator, silicone oil is arranged inside the return pipe, the silicone oil absorbs heat and evaporates at the hot end of the return pipe, a heat sink is arranged at the cold end of the return pipe, the heat sink contacts the silicone oil gas state and circulates as liquid to flow back to the hot end of the return pipe, and the inside of the return pipe is in a vacuum state; A position sensor is fixedly installed on the inner side of the laser generator.

[0013] Preferably, an auxiliary workbench is fixedly installed on the front end of the outer wall of the base, a hollow mesh plate is fixedly installed on the top of the outer wall of the auxiliary workbench, an interlayer plate is fixedly installed on the bottom of the outer wall of the hollow mesh plate, and low-temperature gas is stored inside the interlayer plate, front and rear limit elements are fixedly installed on both sides of the outer wall of the hollow mesh plate, and upper and lower limit elements are fixedly installed on the bottom of the front and rear ends of the outer wall of the hollow mesh plate; A connecting port is provided at the bottom end of the outer wall of the partition board, and the connecting port of the partition board is connected to the liquid tank through a conveying pipe. A supporting base is fixedly installed on the bottom of the outer wall of the liquid tank by bolts, and a liquid level sensor is fixedly installed on the side of the inner wall of the liquid tank. The liquid level sensor is connected to the control system through an internally arranged ultrasonic transmitting circuit and receiving circuit to feedback the liquid level signal. An electromagnetic valve is provided at the connecting port of the partition board, and a motor is fixedly installed at the bottom end of the auxiliary workbench.

[0014] Preferably, the waste collection assembly comprises a waste conveying pipe, a punched mesh plate and a waste box, a waste collecting groove is provided on the top side of the outer wall of the base, a waste conveying pipe is fixedly installed on the bottom end of the outer wall of the waste collecting groove, the waste collecting groove is arranged as a whole to be inclined 15° toward the rear end waste outlet, a waste collection inlet is provided at the front end of the waste collecting groove, an air suction port is provided at the bottom of the rear end of the outer wall of the waste collecting groove, blades are fixedly installed on the side of the air suction port, the centers of the blades are connected through a base column, and the base column is connected to a power supply through a data cable; The waste box is provided with three layers of partition plates and two storage bins. The surface of the first layer of the partition plates is provided with dense circular holes. An electromagnet is fixedly installed on the side of one of the inner walls of the storage bin. When the internal power supply of the electromagnet is energized, the direction in which the metal waste falls is guided. A micro-vibrator is fixedly installed on the bottom of the outer wall of the third layer of the partition plate. The aperture of the third layer of the partition plate is smaller than that of the first and second layers. The partition plate is embedded in the groove provided on the inner wall of the waste box. The partition plate is designed to be detachable.

[0015] Preferably, a laser cutting machine is fixedly installed at the front end of the top of the outer wall of the base, a second slider is fixedly installed at the bottom of the outer wall of the laser cutting machine, the second slider is fixedly installed on the outer wall of the slide rail through a nut of the transmission mechanism, and the slide rail is embedded in the top of the outer wall of the base; Guide rails are embedded at both ends of the top side of the base outer wall, a slider No. 1 is installed on the top of the guide rail outer wall, a ball screw pair is fixedly installed on the top of the guide rail outer wall, the ball screw pair is fixedly connected to the slider No. 1 through a nut, and sound-absorbing foam is added to the groove below the ball screw pair.

[0016] Preferably, an electric field generator is fixedly installed on the top of the outer wall of the No. 1 slider, and the electric field generator is composed of four groups of electrode plates. The electrode plates are made of conductive ceramic material and have a segmented layout. The edges of the electrode plates are wrapped with insulating materials. The electric field generator is connected to the output end of the voltage regulator through a wire, and the input end of the voltage regulator is connected to an independent power supply through a wire. The independent power supply is connected to the control system through a data cable, and the electrode plates are adjusted through the voltage regulator to assist in positioning the cutting path of the laser cutting machine.

[0017] Preferably, a suction nozzle is fixedly installed on the side of the outer wall of the laser generator, and the tail of the suction nozzle is connected to a vacuum pump through a transmission pipe, and the vacuum pump is fixedly installed on the side of the outer wall of the motor, and an air flow channel is arranged on the top of the outer wall of the ceramic table, and the bottom of the air flow channel penetrates into the waste box, and the transmission pipe branch at the tail of the suction nozzle is connected to the outlet of the waste conveying pipe; Two sliders are installed on both sides of the bottom of the outer wall of the punching mesh plate. The sliders are connected through nuts of the transmission mechanism. A guide base is fixedly installed at the bottom of the outer wall of the slider. The punching mesh plate moves to the bottom of the ceramic table through the guide base.

[0018] Preferably, a polarization control component is fixedly mounted on the front end of the top of the outer wall of the base; The polarization control component includes a polarizer array and an electrically controlled rotating bracket. The polarizer array is composed of five layers of polarizers. The top of the electrically controlled rotating bracket branches out into five brackets. Each independent branch of the electrically controlled rotating bracket is installed with a layer of polarizer. A circulating circuit is integrated inside the electrically controlled rotating bracket. An angle sensor is embedded inside the central pillar of the electrically controlled rotating bracket. The bottom of the polarization control component is connected to a motor through a data line to adjust the angle of each layer of polarizer.

[0019] Preferably, the auxiliary workbench is connected to the side of the outer wall of the base through an electric push rod fixedly installed on the side of the outer wall, a punching screen is fixedly installed on the top of the outer wall of the electric push rod, a nut of the ball screw pair is fixedly connected to the second slider, and the transmission mechanism uses the electric push rod and the ball screw pair; an optical shutter is fixedly installed on the inner side of the laser generator, and the optical shutter uses the linear electro-optical effect of the internal crystal to sense the voltage of the voltage regulator, and the optical anisotropy of the crystal adjusts the propagation of the laser; A transparent observation window is fixedly installed on the top side of the outer wall of the base, a light shield is embedded in the lower half of the inner side of the transparent observation window, a brake rod is fixedly installed on the bottom of one side of the outer wall of the base, a micro switch is connected to the bottom end of the brake rod, and the electric contact of the micro switch is connected to the control circuit of the power supply.

[0020] Preferably, the front and rear limiting elements and the upper and lower limiting elements are fixedly mounted with buffer elements at the bottom of the outer walls, the front and rear limiting elements are connected by cooperating with the slots on both sides of the punching mesh plate, and the upper and lower limiting elements are connected by cooperating with the protrusions at the bottom of the front and rear ends of the punching mesh plate; The wiring terminals of the radiator are connected to the motor through a data cable, and the radiator is connected to the heat exchange pipe and the cooling pipe through a connection port opened on the side. The ceramic table top and the punched mesh plate are coated with light-absorbing material, and foot pads are fixedly installed around the bottom of the outer wall of the base.

[0021] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention reduces the cutting temperature by cooling the components, solves the problem of material deformation caused by thermal effects, and helps to ensure a smooth cutting surface and overall integrity of the circuit board; 2. The present invention achieves the function of reducing laser reflection through the polarization control component, and solves the problem that metal materials such as aluminum and copper are prone to reflect laser and affect efficiency and quality, so as to cope with circuit boards with various special shapes and complex process requirements; 3. The present invention uses an auxiliary workbench to achieve clear separation of work areas, solves the problem of frequent failures caused by a large number of integrated devices, improves work efficiency, and facilitates maintenance and management; 4. The present invention collects and stores waste dust through a waste collection component, solves the problem of harmful substances generated by laser cutting waste, and ensures production safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall front view structure of the laser cutting equipment of the present invention; Figure 2 It is a front structural schematic diagram of the laser cutting equipment of the present invention; Figure 3 It is a schematic diagram of the structure of the waste collection assembly of the present invention; Figure 4 It is a partial structural schematic diagram of the cooling assembly of the present invention; Figure 5 It is a partial structural schematic diagram of the cooling assembly of the present invention; Figure 6 It is a schematic diagram of the nozzle structure of the present invention; In the figure: 1. Ceramic table; 2. Slider No. 1; 3. Guide rail; 4. Ball screw pair; 5. Waste box; 6. Punch screen; 7. Nozzle; 8. Upper and lower limit elements; 9. Buffer element; 10. Front and rear limit elements; 11. Rotary joint; 12. Positioning ring; 13. Cyclone core; 14. Base; 15. Cooling pipe; 16. Liquid box; 17. Waste conveying pipe; 18. Auxiliary workbench; 19. Waste collection tank; 20. Slider No. 2; 21. Interlayer plate; 22. Suction nozzle; 23. Radiator; 24. Polarization control component ; 25. Electric push rod; 26. Foot pad; 27. Transparent observation window; 28. Light shutter; 29. ​​Light shield; 30. Position sensor; 31. Flip cover; 32. Liquid change port; 33. Brake lever; 34. Impeller; 35. Ventilation port; 36. Dust net; 37. Return pipe; 38. Laser generator; 39. Electric field generator; 40. Liquid level sensor; 41. Partition plate; 42. Storage bin; 43. Electromagnet; 44. Microvibrator; 45. Voltage regulator; 46. Support base; 47. Slide rail; 48. Electric control rotating bracket. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1, Figure 2 and Figure 5 The present invention provides an embodiment: a high-precision laser cutting device suitable for complex circuit boards, comprising a ceramic table 1, a base 14, a cooling component and a waste collection component, wherein the ceramic table 1 is fixedly mounted on the top of the outer wall of the base 14, and the cooling component and the waste collection component are fixedly mounted on the side of the base 14 through a transmission mechanism; the cooling component comprises a nozzle 7, a liquid tank 16 and a radiator 23, wherein the nozzle 7 is fixedly mounted on the top side of the outer wall of the base 14 through a support, the liquid tank 16 is fixedly mounted on the side of the outer wall of the base 14, the radiator 23 is fixedly mounted on the side of the inner wall of the base 14, the impeller 34 is fixedly mounted on the bottom of the inner wall of the radiator 23, and the impeller 34 A vent 35 is provided at the bottom, and a dustproof net 36 is fixedly installed on the vent 35 by bolts; the bottom end of the nozzle 7 is connected to the liquid tank 16 through a cooling pipe 15, and a flip cover plate 31 is fixedly installed on the bottom end of the outer wall of the liquid tank 16 through a connecting rod mechanism, and a liquid exchange port 32 is provided at the bottom of the inner wall of the liquid tank 16, and the liquid exchange port 32 is connected to an external liquid supply source through a delivery pipe, and the radiator 23 contacts the shell of the base 14 through thermal conductive silicone grease, and the nozzle 7 is provided with three nozzles, and a swirl core 13 is fixedly installed inside each nozzle of the nozzle 7, and a swirl joint 11 is fixedly installed on the bottom end of the outer wall of the nozzle 7, and a positioning ring 12 is fixedly installed on the top end of the outer wall of the swivel joint 11; An auxiliary workbench 18 is fixedly installed on the front end of the outer wall of the base 14, a hollow mesh plate 6 is fixedly installed on the top of the outer wall of the auxiliary workbench 18, an interlayer plate 21 is fixedly installed on the bottom end of the outer wall of the hollow mesh plate 6, and low-temperature gas is stored inside the interlayer plate 21. Front and rear limit elements 10 are fixedly installed on both sides of the outer wall of the hollow mesh plate 6, and upper and lower limit elements 8 are fixedly installed on the bottom of the front and rear ends of the outer wall of the hollow mesh plate 6; a connecting port is provided at the bottom end of the outer wall of the interlayer plate 21, and the connecting port of the interlayer plate 21 is connected to the liquid tank 16 through a conveying pipeline, and a supporting base 46 is fixedly installed on the bottom of the outer wall of the liquid tank 16 by bolts, and a liquid level sensor 40 is fixedly installed on the side of the inner wall of the liquid tank 16, and the liquid level sensor 40 is connected to the control system through an ultrasonic transmitting circuit and a receiving circuit arranged inside to feedback a liquid level signal, an electromagnetic valve is provided at the connecting port of the interlayer plate 21, and a motor is fixedly installed at the bottom end of the auxiliary workbench 18; Furthermore, before laser cutting, the circuit board is pre-cooled, and low-temperature gas is used to blow on the circuit board, and coolant is used to reduce the initial temperature of the material.

[0027] Place the complex circuit board at a suitable position on the ceramic table 1 and start the equipment. The laser cutting machine starts working and cuts the circuit board along the preset cutting path. During the cutting process, the second slide 20 moves on the guide rail 3 on the top of the base 14, driving the laser cutting machine to move precisely; At the same time, the No. 1 slider 2 drives the nozzle 7 to move synchronously on the guide rail 3. The coolant in the liquid tank 16 flows to the nozzle 7 through the cooling pipe 15, and forms a flow state conducive to cooling under the action of the swirl core 13, and is sprayed to the cutting area to cool the cutting point. The water mist spray angle is adjusted to form a certain angle with the laser light path, 30°-60°. When cutting a larger area of ​​the circuit board or having high requirements for the cutting speed, the large angle of 60-80° to spray the coolant can effectively remove these debris. Vertical spraying is used in the center of the cutting area to ensure uniform cooling and prevent splashing. An inclined spraying is used at the edge of the cutting area or along the cutting direction to improve the heat removal efficiency and debris removal effect. After absorbing the heat, the coolant returns to the liquid tank 16 through the cooling pipe 15. In this process, heat exchange is carried out through the radiator 23. The radiator 23 dissipates the heat carried by the coolant to ensure the cooling performance of the coolant, thereby maintaining a stable cooling effect, preventing the circuit board from being damaged due to overheating, and ensuring cutting accuracy. During laser cutting, the suction nozzle 22 on the side of the cutting head generates negative pressure, and the airflow loop formed with the airflow channel on the ceramic table 1 starts to work. This airflow loop sucks away the smoke and dust generated by cutting in time to prevent them from accumulating in the cutting area and affecting the line of sight and cutting quality. In addition, the flow of air also helps to take away the heat in the cutting area, further assisting the cooling process and improving the precision and quality of cutting.

[0028] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , an embodiment provided by the present invention: a high-precision laser cutting device suitable for complex circuit boards, wherein a laser generator 38 is fixedly installed on one side of the top end of the outer wall of the base 14, a return pipe 37 is wrapped around the inner wall side of the laser generator 38, silicone oil is arranged inside the return pipe 37, the silicone oil absorbs heat and evaporates at the hot end of the return pipe 37, a heat sink is arranged at the cold end of the return pipe 37, the heat sink contacts the silicone oil gas state and circulates as liquid to the hot end of the return pipe 37, and the inside of the return pipe 37 is in a vacuum state; a position sensor 30 is fixedly installed on the inner side of the laser generator 38; The auxiliary workbench 18 is connected to the outer wall side of the base 14 through an electric push rod 25 fixedly installed on the outer wall side, a punching screen 6 is fixedly installed on the top of the outer wall of the electric push rod 25, a nut of the ball screw pair 4 is fixedly connected to the second slider 20, and the transmission mechanism uses the electric push rod 25 and the ball screw pair 4; an optical shutter 28 is fixedly installed on the inner side of the laser generator 38, and the optical shutter 28 uses the linear electro-optical effect of the internal crystal to sense the voltage of the voltage regulator 45, and the optical anisotropy of the crystal adjusts the propagation of the laser; A transparent observation window 27 is fixedly installed on the top side of the outer wall of the base 14, and a light shield 29 is embedded in the lower half of the inner side of the transparent observation window 27. A brake rod 33 is fixedly installed on the bottom of one side of the outer wall of the base 14, and a micro switch is connected to the bottom end of the brake rod 33. The contact of the micro switch is connected to the control circuit of the power supply; Furthermore, when the laser cutting machine cuts a complex circuit board, the waste generated enters the waste collection tank 19 from the waste inlet under the action of the airflow generated by the small fan, and then is transported through the waste conveying pipe 17; The waste generated during the cutting process falls on the punched mesh plate 6, and the vibration of the punched mesh plate 6 helps to move the waste toward the waste inlet of the waste collection tank 19, thereby improving the waste collection efficiency; the low-temperature gas reduces the temperature of the punched mesh plate 6 and its surrounding environment to a certain extent, reduces the heat accumulation caused by laser cutting, and also helps to prevent the waste from sticking due to high temperature; The buffer element 9 is made of rubber material. When the punching screen plate 6 vibrates under the drive of the motor or is disturbed by the outside world, the buffer element 9 can absorb the impact force through its own elastic deformation, avoiding rigid collision between the limiting element and the punching screen plate 6 or other components, thereby ensuring the stable operation of the punching screen plate 6 and further ensuring the smooth progress of the waste collection process; During the laser cutting process, light-absorbing materials can effectively absorb the scattered light generated by laser irradiation, reducing the interference of light reflection on the cutting operation. At the same time, by reasonably adjusting the polarization direction, the interaction between the laser and the circuit board material can be optimized. During the cutting process, the operator observes the cutting situation through the transparent observation window 27, and the light shield 29 can reduce light interference for clearer observation. If an emergency occurs, the brake lever 33 is touched, and the brake lever 33 triggers the micro switch to cut off the power control line, so that the equipment stops running immediately to ensure safety.

[0029] See also Figure 1 , Figure 3 and Figure 4 , an embodiment provided by the present invention: a high-precision laser cutting device suitable for complex circuit boards, the waste collection component comprises a waste conveying pipe 17, a punched mesh plate 6 and a waste box 5, a waste collecting groove 19 is provided on the top side of the outer wall of the base 14, a waste conveying pipe 17 is fixedly installed on the bottom end of the outer wall of the waste collecting groove 19, the waste collecting groove 19 is overall arranged to be inclined 15° toward the rear end waste output port, a waste collection inlet is provided at the front end of the waste collecting groove 19, an air suction port is provided at the bottom of the rear end of the outer wall of the waste collecting groove 19, a blade is fixedly installed on the side of the air suction port, the center of the blade is connected through a base column, and the base column is connected to the power supply through a data cable; A laser cutting machine is fixedly installed at the front end of the top of the outer wall of the base 14, and a second slider 20 is fixedly installed at the bottom of the outer wall of the laser cutting machine. The second slider 20 is fixedly installed on the outer wall of the slide rail 47 through the nut of the transmission mechanism, and the slide rail 47 is embedded in the top of the outer wall of the base 14; guide rails 3 are embedded at both ends of the side surface of the top of the outer wall of the base 14, and a first slider 2 is installed on the top of the outer wall of the guide rail 3. A ball screw pair 4 is fixedly installed on the top of the outer wall of the guide rail 3, and the ball screw pair 4 is fixedly connected to the first slider 2 through a nut, and sound-absorbing foam is added to the groove below the ball screw pair 4; Furthermore, when the laser cutting machine starts to cut the complex circuit board, the waste generated during the cutting process will first fall into the waste collecting trough 19 opened on the top side of the outer wall of the base 14. Since the waste collecting trough 19 is tilted 15° toward the waste output port at the rear end, the waste will naturally slide toward the output port under the action of gravity. At the same time, the blades connected to the base column at the suction port at the bottom of the rear end of the outer wall of the waste collecting trough 19 begin to rotate under power supply, generating suction. This suction further assists the waste to smoothly enter the rear end of the waste collecting trough 19 and be sucked into the waste conveying pipe 17. The waste is finally transported into the waste box 5 by the waste conveying pipe 17. The three-layer partition plate 41 is arranged inside the waste box 5. The dense circular holes on the surface of the first layer can preliminarily filter larger particles of waste. The aperture design of different layers and the cooperation of the electromagnet 43 and the microvibrator 44 can effectively classify and store the waste.

[0030] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , an embodiment provided by the present invention: a high-precision laser cutting device suitable for complex circuit boards, wherein a suction nozzle 22 is fixedly installed on the side of the outer wall of the laser generator 38, the tail of the suction nozzle 22 is connected to a vacuum pump through a transmission pipe, the vacuum pump is fixedly installed on the side of the outer wall of the motor, an air flow channel is arranged on the top of the outer wall of the ceramic table 1, the bottom of the air flow channel penetrates into the waste box 5, and the transmission pipe branch at the tail of the suction nozzle 22 is connected to the outlet of the waste conveying pipe 17; An electric field generator 39 is fixedly installed on the top of the outer wall of the first slider 2. The electric field generator 39 is composed of four groups of electrode plates. The electrode plates are made of conductive ceramic materials and are arranged in a segmented manner. The edges of the electrode plates are wrapped with insulating materials. The electric field generator 39 is connected to the output end of the voltage regulator 45 through a wire. The input end of the voltage regulator 45 is connected to an independent power supply through a wire. The independent power supply is connected to the control system through a data line. The electrode plates adjust the cutting path of the auxiliary positioning laser cutting machine through the voltage regulator 45; The waste box 5 is provided with three layers of partition plates 41 and two storage bins 42. The surface of the first layer of the partition plate 41 is provided with dense circular holes. An electromagnet 43 is fixedly installed on the side of one of the inner walls of the storage bin 42. The internal power supply of the electromagnet 43 is energized to guide the falling direction of the metal waste. A micro-vibrator 44 is fixedly installed on the bottom of the outer wall of the third layer of the partition plate 41. The aperture of the third layer of the partition plate 41 is smaller than that of the first and second layers. The partition plate 41 is embedded in the groove provided on the inner wall of the waste box 5. The partition plate 41 is designed to be detachable. Furthermore, during the laser cutting process, the cooling assembly is continuously operated, and the coolant in the liquid tank 16 is transported to the nozzle 7 through the cooling pipe 15 under pressure. The swirl core 13 in the nozzle 7 forms a high-density atomized and high-flow cooling gas, which is evenly sprayed on the cutting area to quickly take away the heat generated by the cutting and prevent the circuit board from being damaged due to overheating. At the same time, the impeller 34 in the radiator 23 rotates at a high speed to accelerate the air flow, and dissipates the heat through heat exchange with the coolant and its own heat dissipation structure, further improving the cooling effect; The waste generated by cutting first falls into the waste collection trough 19 under the action of gravity. The waste collection trough 19 is designed to be tilted 15° toward the rear end waste outlet, so that the waste can slide smoothly to the outlet. The air suction port at the bottom of the rear end of the waste collection trough 19 rotates to generate suction after the blades are energized, which helps the waste to quickly enter the waste conveying pipe 17. Finally, the waste is transported to the waste box 5. The three-layer partition plate 41 in the waste box 5 performs preliminary screening and layered storage according to the size and characteristics of the waste. The electromagnet 43 is energized to guide the falling direction of the metal waste. The micro-vibrator 44 generates slight vibrations every 30 seconds to ensure that the waste can smoothly fall into the corresponding storage bin 42. The detachable design of the partition plate 41 facilitates the cleaning and maintenance of the waste box 5 in the later stage.

[0031] See also Figure 1 , Figure 2 and Figure 4 , an embodiment provided by the present invention: a high-precision laser cutting device suitable for complex circuit boards, wherein a polarization control component 24 is fixedly installed at the front end of the top of the outer wall of the base 14; the polarization control component 24 comprises a polarizer array and an electrically controlled rotating bracket 48, the polarizer array is composed of five layers of polarizers, the top of the electrically controlled rotating bracket 48 branches out five brackets, each independent branch of the electrically controlled rotating bracket 48 is installed with a layer of polarizer, a circulating circuit is integrated inside the electrically controlled rotating bracket 48, an angle sensor is embedded inside the central pillar of the electrically controlled rotating bracket 48, and a data line runs through the bottom of the polarization control component 24 to connect to a motor to adjust the angle of each layer of polarizer; Two sliders are installed on both sides of the bottom of the outer wall of the punching mesh plate 6, and the sliders are connected by nuts of the transmission mechanism. A guide base is fixedly installed at the bottom of the outer wall of the slider, and the punching mesh plate 6 moves to the bottom of the ceramic table 1 through the guide base; The front and rear limiting elements 10 and the upper and lower limiting elements 8 are fixedly installed with buffer elements 9 at the bottom of the outer wall, and the front and rear limiting elements 10 are connected by matching with the slots on both sides of the hollow mesh plate 6, and the upper and lower limiting elements 8 are connected by matching with the protrusions at the bottom of the front and rear ends of the hollow mesh plate 6; the connection terminals of the radiator 23 are connected to the motor through the data line, and the radiator 23 is connected to the heat exchange pipe and the cooling pipe 15 through the connection port opened on the side, the ceramic table 1 and the hollow mesh plate 6 are coated with light-absorbing material, and the bottom of the outer wall of the base 14 is fixedly installed with foot pads 26; Furthermore, after starting the equipment, the staff sends a command to the polarization control component 24 through the control system, and the motor drives the electrically controlled rotating bracket 48 to rotate according to the signal transmitted from the data line at the bottom of the polarization control component 24, and the angle sensor monitors the angle change of each layer of polarizer in real time and feeds back to the control system until the angle of the five layers of polarizer is adjusted to the preset optimal state to optimize the polarization characteristics of the laser; The laser cutting machine is accurately moved to the starting position of the complex circuit board to be cut by using the transmission mechanism composed of the electric push rod 25 and the ball screw pair 4. The electric push rod 25 pushes the punching screen 6 and the auxiliary workbench 18 to move, and at the same time, the nut of the ball screw pair 4 drives the first slider 2 and the second slider 20 to slide smoothly on the guide rail 3 and the slide rail 47, so that the laser cutting machine reaches the specified position. In this process, the punching screen 6 maintains a stable and accurate position state under the coordinated action of the front and rear limit elements 10 and the upper and lower limit elements 8 and the buffer element 9, avoiding deviation or shaking during the movement; The laser generator 38 starts to work and generates a high-energy laser beam. At the optical gate 28, the laser beam adjusts the propagation path and intensity of the laser through the linear electro-optical effect of the crystal according to the voltage set by the voltage regulator 45, ensuring that the laser is emitted to the complex circuit board in the best state.

[0032] Working principle: The laser cutting machine, driven by the guide rail 3 and the ball screw pair 4, cuts the circuit board placed on the ceramic table 1 along the preset cutting path. During the cutting process, the silicone oil in the return pipe 37 inside the laser generator 38 absorbs heat and evaporates at the hot end, and is cooled back to liquid and refluxed at the cold end through the heat sink. The liquid tank 16 in the cooling assembly supplies coolant to the nozzle 7 through the cooling pipe 15. The nozzle 7 moves synchronously with the laser cutting machine under the drive of the No. 1 slider 2 on the guide rail 3 to cool the cutting area. At the same time, the suction nozzle 22 on the side of the cutting head of the laser cutting machine works in coordination with the air flow channel on the ceramic table 1 to absorb the smoke and heat generated by cutting. The hollow mesh plate 6 in the waste collection assembly vibrates under the drive of the auxiliary workbench 18 motor, and the waste generated by cutting is shaken off to the waste collection tank 19, and is sent to the waste box 5 through the waste conveying pipe 17 under the action of the suction force generated by the blade being connected to the power. The front and rear limiting elements 10 and the upper and lower limiting elements 8 ensure the stable operation of the punching screen 6 through the buffer element 9. The polarization control component 24 controls the polarization direction of the laser. The various components of the entire device cooperate closely to achieve high-precision laser cutting of complex circuit boards.

[0033] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A high-precision laser cutting device suitable for complex circuit boards, characterized by: It comprises a ceramic tabletop (1), a base (14), a cooling assembly and a waste collection assembly, wherein the ceramic tabletop (1) is fixedly mounted on the top of the outer wall of the base (14), and the cooling assembly and the waste collection assembly are fixedly mounted on the side of the base (14) via a transmission mechanism; The cooling assembly comprises a nozzle (7), a liquid tank (16) and a radiator (23); the nozzle (7) is fixedly mounted on the top side of the outer wall of the base (14) via a support; the liquid tank (16) is fixedly mounted on the side of the outer wall of the base (14); the radiator (23) is fixedly mounted on the side of the inner wall of the base (14); an impeller (34) is fixedly mounted on the bottom of the inner wall of the radiator (23); a vent (35) is provided below the impeller (34); a dust screen (36) is fixedly mounted on the vent (35) via bolts; The bottom end of the nozzle (7) is connected to the liquid tank (16) via a cooling pipe (15); a flap plate (31) is fixedly mounted on the bottom end of the outer wall of the liquid tank (16) via a connecting rod mechanism; a liquid exchange port (32) is provided at the bottom of the inner wall of the liquid tank (16); the liquid exchange port (32) is connected to an external liquid supply source via a delivery pipe; the radiator (23) contacts the outer shell of the base (14) via thermal conductive silicone grease; the nozzle (7) is provided with three nozzles; a swirl core (13) is fixedly mounted inside each nozzle of the nozzle (7); a swirl joint (11) is fixedly mounted on the bottom end of the outer wall of the nozzle (7); and a positioning ring (12) is fixedly mounted on the top end of the outer wall of the swivel joint (11).

2. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 1, characterized in that: A laser generator (38) is fixedly mounted on one side of the top end of the outer wall of the base (14); a return pipe (37) is wrapped around the inner wall side of the laser generator (38); silicone oil is arranged inside the return pipe (37); the silicone oil absorbs heat and evaporates at the hot end of the return pipe (37); a heat sink is arranged at the cold end of the return pipe (37); the heat sink contacts the silicone oil gas state and circulates as liquid to flow back to the hot end of the return pipe (37); the interior of the return pipe (37) is in a vacuum state; A position sensor (30) is fixedly mounted on the inner side of the laser generator (38).

3. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 1, characterized in that: An auxiliary workbench (18) is fixedly mounted on the front end of the outer wall of the base (14); a hollow mesh plate (6) is fixedly mounted on the top of the outer wall of the auxiliary workbench (18); an interlayer plate (21) is fixedly mounted on the bottom end of the outer wall of the hollow mesh plate (6); low-temperature gas is stored inside the interlayer plate (21); front and rear limit elements (10) are fixedly mounted on both sides of the outer wall of the hollow mesh plate (6); and upper and lower limit elements (8) are fixedly mounted on the bottom of the front and rear ends of the outer wall of the hollow mesh plate (6); A connection port is provided at the bottom end of the outer wall of the partition plate (21), and the connection port of the partition plate (21) is connected to the liquid box (16) through a delivery pipeline. A support base (46) is fixedly installed at the bottom of the outer wall of the liquid box (16) by bolts. A liquid level sensor (40) is fixedly installed on the side of the inner wall of the liquid box (16). The liquid level sensor (40) is connected to the control system through an ultrasonic transmitting circuit and a receiving circuit provided inside to feed back a liquid level signal. A solenoid valve is provided at the connection port of the partition plate (21), and a motor is fixedly installed at the bottom end of the auxiliary workbench (18).

4. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 1, characterized in that: The waste collection assembly comprises a waste conveying pipe (17), a punched mesh plate (6) and a waste box (5); a waste collecting groove (19) is provided on the top side of the outer wall of the base (14); a waste conveying pipe (17) is fixedly installed on the bottom end of the outer wall of the waste collecting groove (19); the waste collecting groove (19) is arranged as a whole to be inclined 15 degrees toward the rear end waste outlet; a waste collection inlet is provided at the front end of the waste collecting groove (19); an air suction port is provided at the bottom of the rear end of the outer wall of the waste collecting groove (19); blades are fixedly installed on the side of the air suction port; the centers of the blades are connected through a base column; and the base column is connected to a power supply through a data cable; A waste box (5) is provided with three layers of partition plates (41) and two storage bins (42). The surface of the first layer of the partition plates (41) is provided with dense circular holes. An electromagnet (43) is fixedly mounted on the side surface of one of the inner walls of the storage bin (42). When the internal power supply of the electromagnet (43) is energized, the direction in which the metal waste falls is guided. A micro-vibrator (44) is fixedly mounted on the bottom of the outer wall of the third layer of the partition plates (41). The aperture of the third layer of the partition plates (41) is smaller than that of the first layer and the second layer. The partition plates (41) are embedded in a groove provided on the inner wall of the waste box (5). The partition plates (41) are designed to be detachable.

5. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 1, characterized in that: A laser cutting machine is fixedly mounted on the front end of the top of the outer wall of the base (14); a second slider (20) is fixedly mounted on the bottom of the outer wall of the laser cutting machine; the second slider (20) is fixedly mounted on the outer wall of the slide rail (47) via a nut of a transmission mechanism; and the slide rail (47) is embedded in the top of the outer wall of the base (14); Guide rails (3) are embedded and installed at both ends of the side surface of the top of the outer wall of the base (14), a slider (2) is installed on the top of the outer wall of the guide rail (3), a ball screw pair (4) is fixedly installed on the top of the outer wall of the guide rail (3), the ball screw pair (4) is fixedly connected to the slider (2) via a nut, and sound-absorbing foam is added to the groove below the ball screw pair (4).

6. The high-precision laser cutting device suitable for complex circuit boards according to claim 5, characterized in that: An electric field generator (39) is fixedly mounted on the top of the outer wall of the first slider (2). The electric field generator (39) is composed of four groups of electrode plates. The electrode plates are made of conductive ceramic material and are arranged in a segmented manner. The edges of the electrode plates are wrapped with insulating material. The electric field generator (39) is connected to the output end of the voltage regulator (45) through a wire. The input end of the voltage regulator (45) is connected to an independent power supply through a wire. The independent power supply is connected to a control system through a data line. The electrode plates adjust the cutting path of the auxiliary positioning laser cutting machine through the voltage regulator (45).

7. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 2, characterized in that: A suction nozzle (22) is fixedly mounted on the side of the outer wall of the laser generator (38); the tail of the suction nozzle (22) is connected to a vacuum pump via a transmission pipe; the vacuum pump is fixedly mounted on the side of the outer wall of the motor; an air flow channel is arranged on the top of the outer wall of the ceramic table (1); the bottom of the air flow channel penetrates into the waste box (5); a transmission pipe branch at the tail of the suction nozzle (22) is connected to the outlet of the waste conveying pipe (17); Two slide blocks are respectively installed on both sides of the bottom of the outer wall of the punching screen plate (6), and the slide blocks are connected through nuts of a transmission mechanism. A guide base is fixedly installed at the bottom of the outer wall of the slide block, and the punching screen plate (6) moves to the bottom of the ceramic table top (1) through the guide base.

8. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 1, characterized in that: A polarization control component (24) is fixedly mounted on the front end of the top of the outer wall of the base (14); The polarization control component (24) comprises a polarizer array and an electrically controlled rotating bracket (48), wherein the polarizer array is composed of five layers of polarizers, the electrically controlled rotating bracket (48) has five branches at the top, each independent branch of the electrically controlled rotating bracket (48) is equipped with a layer of polarizer, a circulating circuit is integrated inside the electrically controlled rotating bracket (48), an angle sensor is embedded inside the central pillar of the electrically controlled rotating bracket (48), and a data line is passed through the bottom of the polarization control component (24) to connect to a motor to adjust the angle of each layer of polarizer.

9. The high-precision laser cutting device suitable for complex circuit boards according to claim 3, characterized in that: The auxiliary workbench (18) is connected to the outer wall side of the base (14) via an electric push rod (25) fixedly installed on the outer wall side, a punching screen (6) is fixedly installed on the top of the outer wall of the electric push rod (25), a nut of the ball screw pair (4) is fixedly connected to the second slider (20), and the transmission mechanism uses the electric push rod (25) and the ball screw pair (4); an optical shutter (28) is fixedly installed on the inner side of the laser generator (38), and the optical shutter (28) uses the linear electro-optical effect of the internal crystal to sense the voltage of the voltage regulator (45), and the optical anisotropy of the crystal adjusts the propagation of the laser; A transparent observation window (27) is fixedly mounted on the top side of the outer wall of the base (14), a light shield (29) is embedded in the lower half of the inner side of the transparent observation window (27), a brake rod (33) is fixedly mounted on the bottom of one side of the outer wall of the base (14), the bottom end of the brake rod (33) is connected to a micro switch, and the contact of the micro switch is connected to the control circuit of the power supply.

10. The high-precision laser cutting equipment suitable for complex circuit boards according to claim 3, characterized in that: The front and rear limiting elements (10) and the upper and lower limiting elements (8) are fixedly mounted with buffer elements (9) at the bottom of the outer walls. The front and rear limiting elements (10) are connected by cooperating with the slots on both sides of the punching mesh plate (6), and the upper and lower limiting elements (8) are connected by cooperating with the protrusions at the bottom of the front and rear ends of the punching mesh plate (6). The connection terminals of the heat sink (23) are connected to the motor via a data cable. The heat sink (23) is connected to the heat exchange pipe and the cooling pipe (15) via a connection port provided on the side. The ceramic tabletop (1) and the punched mesh plate (6) are coated with a light-absorbing material. Foot pads (26) are fixedly mounted around the bottom of the outer wall of the base (14).

Images