LDI photosensitive solder resist ink

Abstract

The invention discloses an LDI photosensitive solder resist ink, which comprises the following steps: maintaining equipment, grinding solid materials, detecting the temperature, detecting the fineness of the ink, mixing and stirring main materials, standing, detecting the viscosity of the ink, pre-baking the ink, exposing, baking and packaging, firstly opening processing equipment for detection, and then maintaining the equipment. The preparation method comprises the following steps: grinding epoxy acrylate resin and phenolic resin in a three-roller grinding machine for 3 minutes; according to the preparation method of the LDI photosensitive solder resist ink, the ink prepared by the preparation method can accelerate the processing speed, facilitates processing of inks with different viscosities, can effectively avoid the phenomenon of insufficient processing viscosity, prevents waste of a large amount of resources in the processing process, can save a large amount of working time and labor force, and improves the processing efficiency. The processing is more convenient, and the application range of the LDI photosensitive solder resist ink is widened.

Description

Technical Field

[0001] The invention relates to the technical field of calcium emulsion, in particular to an LDI photosensitive solder resist ink. Background Art

[0002] Liquid photosensitive solder resist ink forms a permanent protective film that can prevent oxidation of the PCB copper surface, prevent water vapor erosion, prevent solvent corrosion and foreign object abrasions, and improve the electrical insulation performance between circuits and the entire board surface.

[0003] However, the existing ink processing method cannot achieve the required viscosity, which will affect the subsequent use of the ink and easily lead to poor ink use effects. The printed matter dries too slowly and requires a lot of time to dry.

[0004] Therefore, there is an urgent need for a preparation method that can speed up the processing, facilitate the processing of inks with different viscosities, effectively avoid the phenomenon of insufficient viscosity during processing, and prevent a large amount of resource waste during the processing. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] The purpose of the present invention is to provide an LDI photosensitive solder mask ink to solve the problem in the above background technology that the specified viscosity cannot be reached, which will affect the subsequent use of the ink, easily lead to poor ink use effect, and the printed product dries too slowly and requires a lot of time to dry.

[0007] (II) Technical solution

[0008] To achieve the above object, the present invention provides the following technical solution: an LDI photosensitive solder resist ink, including equipment maintenance, grinding of solid materials, temperature detection, ink fineness detection, mixing and stirring of main materials, static, dilute detection of ink viscosity, ink pre-baking, exposure, baking, and packaging, including the following steps:

[0009] Step 1: First open the processing equipment for inspection, and then maintain the equipment. Place the epoxy acrylate resin and phenolic resin in the three-roller grinder for grinding. Grind for 3 minutes and grind the epoxy acrylate resin and phenolic resin into powder. Then use the temperature detector to detect the temperature of the equipment and control the temperature between 18℃~25℃. Then use the fineness meter to detect the fineness of the ink. Place the materials in the processing equipment. Place the main agent and curing agent in the ratio of 2~4:0.5~1.5 in the processing equipment. Start the drive motor to drive the agitator to stir, mix the main agent and curing agent, let it stand for 5-10 minutes before use. The viscosity of the mixed ink is about 150±20PS (25℃);

[0010] Step 2: When diluting, add the hydroxyl molar ratio of the heated epoxy acrylate intermediate product to (0.45-0.85): (0.80-1.20) for feeding, 20-50 parts of phenolic resin, 150-400 parts of photosensitive resin and 20-30 parts of high-photosensitive monomer are placed inside the processing equipment, start the agitator to stir for 10 minutes, mix and dilute, take out a little ink from the equipment with a sampler, immerse the viscosity cup in the sample ink, and then take it out at a uniform speed. When the viscosity cup is just pulled out of the surface of the ink, press the stopwatch to time, observe the ink outflow, and stop the stopwatch when the ink just has a breakpoint. The time on the stopwatch is the viscosity value of the ink. The higher the viscosity, the more seconds, and vice versa.

[0011] Step 3: Then place the ink in the pre-oven, adjust the pre-oven to 70-80°C, pre-bake the first side at 75°C for 20-25 minutes, and the second side at 75°C for 20-25 minutes. After pre-bake, let it stand for 10-15 minutes to cool the plate to room temperature before exposure. Use a 7KW cooling exposure machine for exposure, adjust the exposure table temperature to 25+2°C, and the exposure energy is generally set at 300-500mj / cm2. Test the number of grids after imaging with a 21-grid stage exposure table to 10-12 grids. Finally, place it in the baking oven, adjust the baking oven temperature to 150-160°C, and bake for 60 minutes to complete the production.

[0012] Step 4: Place the processed ink inside the packaging machine, use a vacuum machine to suck out the oxygen inside the packaging box, then seal it, and finally clean the table.

[0013] Preferably, the maintenance time of the detection equipment should not be less than 10 minutes and not more than 30 minutes, otherwise the equipment body may be easily damaged.

[0014] Preferably, the epoxy acrylate resin and phenolic resin materials are solid materials, which are ground into powders for processing and mixing, so that the mixing is more uniform and the reaction is faster.

[0015] Preferably, dilution can reprocess the ink, adjust the ink viscosity, and use it for different needs.

[0016] Preferably, when detecting the viscosity, it is prevented that the ink does not have the required viscosity, so as to avoid the ink having insufficient viscosity and being unable to be used normally.

[0017] Preferably, the ink is placed in a pre-baking oven for pre-baking. The main function of pre-baking is to volatilize the solvent in the ink through hot air, so that the ink on the board surface is dry enough to meet the operational requirements of the registration exposure.

[0018] Compared with the prior art, the beneficial effects of the present invention are: the ink prepared by the preparation method can speed up the processing speed, facilitate the processing of inks with different viscosities, effectively avoid the phenomenon of insufficient viscosity during processing, prevent a large amount of resource waste during the processing process, save a lot of working time and labor, make processing more convenient, and improve the use range of LDI photosensitive solder mask ink. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the process structure of the preparation method of the present invention. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1 The present invention provides a technical solution: an LDI photosensitive solder resist ink, including equipment maintenance, grinding of solid materials, temperature detection, ink fineness detection, mixing and stirring of main materials, static, dilute detection of ink viscosity, ink pre-baking, exposure, baking, and packaging, including the following steps:

[0022] Step 1: First open the processing equipment for inspection, then maintain the equipment, place the epoxy acrylate resin and phenolic resin in the three-roller grinder for grinding, grind for 3 minutes, grind the epoxy acrylate resin and phenolic resin into powder, then use the temperature detector to detect the temperature of the equipment, control the temperature between 18℃~25℃, and then use the fineness meter to detect the fineness of the ink, place the materials in the processing equipment, and place the main agent and curing agent in the processing equipment at a ratio of 2~4:0.5~1.5. Start the drive motor to drive the agitator to stir, mix the main agent and curing agent, let it stand for 5-10 minutes before use, the viscosity of the mixed ink is about 150±20PS (25);

[0023] Step 2: When diluting, add the hydroxyl molar ratio of the heated epoxy acrylate intermediate product to (0.45-0.85): (0.80-1.20) for feeding, 20-50 parts of phenolic resin, 150-400 parts of photosensitive resin and 20-30 parts of high-photosensitive monomer are placed inside the processing equipment, start the agitator to stir for 10 minutes, mix and dilute, take out a little ink from the equipment with a sampler, immerse the viscosity cup in the sample ink, and then take it out at a uniform speed. When the viscosity cup is just pulled out of the surface of the ink, press the stopwatch to time, observe the ink outflow, and stop the stopwatch when the ink just has a breakpoint. The time on the stopwatch is the viscosity value of the ink. The higher the viscosity, the more seconds, and vice versa.

[0024] Step 3: Then place the ink in the pre-oven, adjust the pre-oven to 70-80°C, pre-bake the first side at 75°C for 20-25 minutes, and the second side at 75°C for 20-25 minutes. After pre-bake, let it stand for 10-15 minutes to cool the plate to room temperature before exposure. Use a 7KW cooling exposure machine for exposure, adjust the exposure table temperature to 25+2°C, and the exposure energy is generally set at 300-500mj / cm2. Test the number of grids after imaging with a 21-grid stage exposure table to 10-12 grids. Finally, place it in the baking oven, adjust the baking oven temperature to 150-160°C, and bake for 60 minutes to complete the production.

[0025] Step 4: Place the processed ink inside the packaging machine, use a vacuum machine to suck out the oxygen inside the packaging box, then seal it, and finally clean the table.

[0026] Furthermore, the maintenance time of the testing equipment should not be less than 10 minutes and not more than 30 minutes, otherwise the equipment body may be easily damaged.

[0027] Furthermore, the epoxy acrylate resin and the phenolic resin are solid materials, and they are ground into powder for processing and mixing, so that the mixing is more uniform and the reaction is faster.

[0028] Furthermore, dilution can process the ink again, and the viscosity of the ink can be adjusted so that it can be used for different needs.

[0029] Furthermore, when testing the viscosity, it is possible to prevent the ink from not meeting the required viscosity, thereby preventing the ink from having insufficient viscosity and being unable to be used normally.

[0030] Furthermore, the ink is placed in a pre-baking oven for pre-baking. The main function of pre-baking is to volatilize the solvent in the ink through hot air, so that the ink on the board surface is dry enough to meet the operational requirements of the registration exposure.

[0031] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Simple modifications or equivalent substitutions of the technical solution of the present invention by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the present invention.

Claims

1. An LDI photosensitive solder resist ink, including equipment maintenance, grinding of solid materials, temperature detection, ink fineness detection, mixing and stirring of main materials, static, dilute detection of ink viscosity, ink pre-baking, exposure, baking, and packaging, characterized in that: The steps include: Step 1: First open the processing equipment for inspection, and then maintain the equipment. Place the epoxy acrylate resin and phenolic resin in the three-roller grinder for grinding. Grind for 3 minutes and grind the epoxy acrylate resin and phenolic resin into powder. Then use the temperature detector to detect the temperature of the equipment and control the temperature between 18℃~25℃. Then use the fineness meter to detect the fineness of the ink. Place the materials in the processing equipment. Place the main agent and curing agent in the ratio of 2~4:0.5~1.5 in the processing equipment. Start the drive motor to drive the agitator to stir, mix the main agent and curing agent, let it stand for 5-10 minutes before use. The viscosity of the mixed ink is about 150±20PS (25℃); Step 2: When diluting, add the hydroxyl molar ratio of the heated epoxy acrylate intermediate product to (0.45-0.85): (0.80-1.20) for feeding, 20-50 parts of phenolic resin, 150-400 parts of photosensitive resin and 20-30 parts of high-photosensitive monomer are placed inside the processing equipment, start the agitator to stir for 10 minutes, mix and dilute, take out a little ink from the equipment with a sampler, immerse the viscosity cup in the sample ink, and then take it out at a uniform speed. When the viscosity cup is just pulled out of the surface of the ink, press the stopwatch to time, observe the ink outflow, and stop the stopwatch when the ink just has a breakpoint. The time on the stopwatch is the viscosity value of the ink. The higher the viscosity, the more seconds, and vice versa. Step 3: Then place the ink in the pre-oven, adjust the pre-oven to 70-80°C, pre-bake the first side at 75°C for 20-25 minutes, and the second side at 75°C for 20-25 minutes. After pre-bake, let it stand for 10-15 minutes to cool the plate to room temperature before exposure. Use a 7KW cooling exposure machine for exposure, adjust the exposure table temperature to 25+2°C, and the exposure energy is generally set at 300-500mj / cm2. Test the number of grids after imaging with a 21-grid stage exposure table to 10-12 grids. Finally, place it in the baking oven, adjust the baking oven temperature to 150-160°C, and bake for 60 minutes to complete the production. Step 4: Place the processed ink inside the packaging machine, use a vacuum machine to suck out the oxygen inside the packaging box, then seal it, and finally clean the table.

2. According to claim 1, a LDI photosensitive solder resist ink, characterized in that: The maintenance time of the detection equipment cannot be less than 10 minutes and cannot be more than 30 minutes, otherwise the equipment body may be easily damaged.

3. A LDI photosensitive solder resist ink according to claim 2, characterized in that: The epoxy acrylate resin and phenolic resin materials are solid materials, and are ground into powder for processing and mixing, so that the mixing is more uniform and the reaction is faster.

4. A LDI photosensitive solder resist ink according to claim 3, characterized in that: Dilution can process the ink again, adjust the ink viscosity, and use it for different needs.

5. A LDI photosensitive solder resist ink according to claim 4, characterized in that: When testing the viscosity, prevent the ink from not meeting the required viscosity, which may result in the ink not being of sufficient viscosity and unable to be used normally.

6. A LDI photosensitive solder resist ink according to claim 5, characterized in that: The ink is placed in a pre-baking oven for pre-baking. The main function of pre-baking is to volatilize the solvent in the ink through hot air, so that the ink on the board surface is dry enough to meet the requirements of the registration exposure operation.

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