Heating mechanism, coating equipment and preparation method of conductive film

Abstract

The invention discloses a heating mechanism, coating equipment and a preparation method of a conductive film. The heating mechanism comprises a heating body and a heating container. A plurality of heating grooves are formed in the heating main body at intervals, one part of the heating grooves form a first heating area, and the other part of the heating grooves form a second heating area; the multiple heating containers are arranged in the multiple heating grooves in a one-to-one correspondence mode. Wherein the temperature of the heating container in the first heating area is T1, the temperature of the heating container in the second heating area is T2, and T1 and T2 meet the relational expression that T1-T2 is larger than or equal to 100 DEG C. The problem that in the prior art, an evaporation source cannot heat and evaporate different evaporation materials at the same time can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film processing, and in particular to a heating mechanism, a coating device and a method for preparing a conductive film. Background Art

[0002] Conductive film is a polymer material with metal plated on the surface. It is widely used in lithium-ion batteries and is mainly used as a current collector in lithium-ion batteries. The coating on the conductive film can be obtained by vacuum evaporation coating process and / or magnetron sputtering process. Among them, vacuum evaporation coating refers to the process of heating the film-forming material in a vacuum environment to evaporate or sublimate it, and then condensing or depositing it on the surface of the conductive film to form a coating. After the film-forming material is heated and evaporated or sublimated inside the evaporation crucible, it rises and is emitted through the evaporation outlet above the evaporation crucible. The evaporated film-forming material gradually cools down after leaving the evaporation crucible, and finally deposits on the surface of the conductive film to form a film layer.

[0003] In the existing vacuum evaporation coating technology, doping evaporation is usually used to evaporate the same film layer, that is, at least two evaporation sources with different evaporation materials are used to evaporate the surface of the conductive film at the same time. Due to the different melting points of different evaporation materials, for evaporation materials with higher melting points, the evaporation source needs to provide a higher thermal evaporation temperature to the evaporation material, and for evaporation materials with lower melting points, the evaporation source needs to provide a lower thermal evaporation temperature to the evaporation material.

[0004] However, the heating temperature at each location on the evaporation source in the prior art is the same, and different evaporation sources are required to perform separate heating and evaporation for evaporation materials with different melting points, resulting in high energy consumption of the evaporation source and high coating costs. Summary of the invention

[0005] The main purpose of the present invention is to provide a heating mechanism, a coating device and a method for preparing a conductive film, so as to solve the problem in the prior art that the evaporation source cannot heat and evaporate different evaporation materials at the same time.

[0006] According to one aspect of the present invention, there is provided a heating mechanism, comprising:

[0007] A heating body, wherein the heating body has a plurality of heating grooves arranged at intervals, a part of the heating grooves forming a first heating area, and another part of the heating grooves forming a second heating area;

[0008] A heating container, wherein the heating container comprises a plurality of heating containers, and the plurality of heating containers are disposed in the plurality of heating tanks in a one-to-one correspondence;

[0009] The temperature of the heating container in the first heating area is T1, the temperature of the heating container in the second heating area is T2, and T1 and T2 satisfy the relationship: |T1-T2|≥100°C.

[0010] Furthermore, a contact area between the heating grooves in the first heating region and the heating container is smaller than a contact area between the heating grooves in the second heating region and the heating container.

[0011] Further, a cross-sectional area of ​​the heating groove of the first heating region is smaller than a cross-sectional area of ​​the heating groove of the second heating region.

[0012] Furthermore, the cross-section of the heating tank includes a circle, a triangle, a square or a trapezoid.

[0013] Furthermore, along the thickness direction of the heating body, the cross-sectional area of ​​the heating groove gradually decreases or remains unchanged from top to bottom.

[0014] Further, along the thickness direction of the heating body, the depth of the heating groove of the first heating area is smaller than the depth of the heating groove of the second heating area.

[0015] Further, there is a first gap between the bottom of the heating tank of the first heating area and the bottom of the heating container; and / or,

[0016] A second gap is provided between the side wall of the heating groove of the first heating region and the side wall of the heating container.

[0017] Further, a first protrusion is provided at the bottom of the heating groove of the first heating area, so that the first gap exists between the bottom of the heating groove of the first heating area and the bottom of the heating container; and / or,

[0018] The side wall of the heating groove of the first heating area is provided with a second protrusion, so that the second gap is formed between the side wall of the heating groove of the first heating area and the side wall of the heating container.

[0019] Furthermore, a heat insulating element is arranged in the first gap and / or in the second gap.

[0020] Further, the thermal conductivity of the heating container in the first heating zone is lower than the thermal conductivity of the heating container in the second heating zone.

[0021] On the other hand, the present invention further provides a coating device, which includes the above-mentioned heating mechanism.

[0022] In another aspect, the present invention further provides a method for preparing a conductive film, wherein the method for preparing a conductive film is performed using the above-mentioned coating device, and the method for preparing a conductive film comprises:

[0023] Step S1: transferring the base film layer to the heating body of the heating mechanism;

[0024] Step S2: The first metal target material in the heating container within the first heating area and the second metal target material in the heating container within the second heating area are simultaneously heated and evaporated by the heating body, so that the first metal target material and the second metal target material are deposited on the surface of the base film layer to form a mixed metal layer.

[0025] Further, in step S2, the melting point of the first metal target is Q1, and the melting point of the second metal target is Q2, wherein Q1 and Q2 satisfy the relationship |Q1-Q2|≥250°C; or,

[0026] In step S2, when the contact area between the heating groove of the first heating zone and the heating container is smaller than the contact area between the heating groove of the second heating zone and the heating container, the temperature T1 of the heating container of the first heating zone and the temperature T2 of the heating container of the second heating zone satisfy the relationship: |T1-T2|≥100°C.

[0027] In the present invention, compared with the heating mechanism in the prior art, the present invention makes the temperature of the heating container in the first heating area lower than or higher than the temperature of the heating container in the second heating area, so that the temperature T1 of the heating container in the first heating area and the temperature T2 of the heating container in the second heating area satisfy the relationship: |T1-T2|≥100°C. In this way, it can be ensured that the temperature of the heating container in the first heating area is lower than or higher than the temperature of the heating container in the second heating area, so that it can be ensured that there are heating areas with different temperatures on the same heating body, and then the targets or impurities with different melting points can be heated and evaporated at the same time, saving the energy consumption of the heating mechanism and reducing the coating cost. In addition, the purpose of forming the mixed film layer is to modify the surface of the base film layer to avoid the problem of sticking film due to the surface characteristics of the metal layers on both sides of the polymer base film layer being close or considered to be the same. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0029] Figure 1It is a structural schematic diagram of a heating mechanism with a first protrusion disclosed in an embodiment of the present invention;

[0030] Figure 2 It is a schematic structural diagram of a heating mechanism with a second protrusion disclosed in an embodiment of the present invention;

[0031] Figure 3 A top view of the heating body disclosed in an embodiment of the present invention;

[0032] Figure 4 The attached embodiment disclosed in the present invention Figure 3 AA section view in;

[0033] Figure 5 The attached embodiment disclosed in the present invention Figure 3 BB section view in;

[0034] Figure 6 This is a schematic structural diagram of a first heating body with different heating areas disclosed in an embodiment of the present invention;

[0035] Figure 7 A schematic structural diagram of a second heating body with different heating areas disclosed in an embodiment of the present invention;

[0036] Figure 8 A schematic structural diagram of a third heating body with different heating areas disclosed in an embodiment of the present invention;

[0037] Fig. 9 A cross-sectional view of a first heating body disclosed in an embodiment of the present invention;

[0038] Fig.10 A cross-sectional view of a second heating body disclosed in an embodiment of the present invention;

[0039] Fig.11 The present invention is a flowchart of a method for preparing a conductive film disclosed in an embodiment of the present invention.

[0040] The above drawings include the following reference numerals:

[0041] 10. Heating body; 11. Heating tank; 20. Heating container; 30. First protrusion; 40. Second protrusion; 60. First heating area; 70. Second heating area. DETAILED DESCRIPTION

[0042] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0043] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0044] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0045] As mentioned in the background technology, since the heating temperature of each location on the evaporation source in the prior art is the same, different evaporation sources need to be used for separate heating and evaporation of evaporation materials with different melting points, resulting in high energy consumption of the evaporation source and high coating cost. To this end, the inventor of the present invention has designed a new heating mechanism, which can solve the problem that the evaporation source in the prior art cannot heat and evaporate different evaporation materials at the same time. The heating mechanism of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0046] It should be noted that the "thickness direction of the heating body 10" in the present invention is the thickness direction of the heating body 10. Fig.10 The direction indicated by the letter X.

[0047] See also Figures 1 to 10 As shown, the present invention provides a heating mechanism, which includes a heating body 10 and a heating container 20.

[0048] Specifically, the heating body 10 has a plurality of heating slots 11 arranged at intervals, a portion of the heating slots 11 forms a first heating region 60, and another portion of the heating slots 11 forms a second heating region 70; the heating container 20 includes a plurality of heating containers 20, and the plurality of heating containers 20 are arranged in the plurality of heating slots 11 in a one-to-one correspondence. The temperature of the heating container 20 in the first heating region 60 is T1, and the temperature of the heating container 20 in the second heating region 70 is T2, and the relationship between T1 and T2 satisfies the following equation: |T1-T2|≥100°C.

[0049] In this embodiment, when the heating mechanism is actually processed, a plurality of heating slots 11 can be provided on the heating body 10, and the plurality of heating slots 11 are arranged at intervals, and then each heating container 20 is installed in each heating slot 11 in a one-to-one correspondence. Since the temperature T1 of the heating container 20 of the first heating area 60 and the temperature T2 of the heating container 20 of the second heating area 70 in this embodiment satisfy the relationship: |T1-T2|≥100°C, during the heating process of the heating mechanism, the temperature of the heating container 20 in the heating slot 11 of the first heating area 60 will be lower or higher than the temperature of the heating container 20 in the heating slot 11 of the second heating area 70. When it is necessary to heat metal targets or impurities with different melting points, it is only necessary to put the metal target or other material with a low melting point into the heating container 20 with a relatively low temperature, and put the metal target or impurity with a high melting point into the heating container 20 with a relatively high temperature. In this way, it is possible to ensure that there are heating areas with different temperatures on the same heating body 10, so that metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing the coating cost. It can be understood that the value of |T1-T2| in this embodiment can be 100°C, 150°C, 200°C, 250°C, 300°C, 350°C, 400°C, 450°C, 500°C, etc.

[0050] That is to say, compared with the heating mechanism in the prior art, this embodiment makes the temperature of the heating container 20 in the first heating area 60 lower than or higher than the temperature of the heating container 20 in the second heating area 70, so that the temperature T1 of the heating container 20 in the first heating area 60 and the temperature T2 of the heating container 20 in the second heating area 70 satisfy the relationship: |T1-T2|≥100°C. In this way, it can be ensured that the temperature of the heating container 20 in the first heating area 60 is lower than or higher than the temperature of the heating container 20 in the second heating area 70, so that it can be ensured that there are heating areas with different temperatures on the same heating body 10, and then the targets or impurities with different melting points can be heated and evaporated at the same time, saving the energy consumption of the heating mechanism and reducing the coating cost. In addition, the purpose of forming the mixed film layer is to modify the surface of the base film layer to avoid the problem of sticking film due to the surface characteristics of the metal layers on both sides of the polymer base film layer being close or considered to be the same.

[0051] It is understandable that the first heating area 60 and the second heating area 70 in the present invention can be set in any area of ​​the heating body 10, and are not limited to the following. Figures 6 to 8 The situation shown.

[0052] Optionally, the “heating tank 11 ” and the “heating container 20 ” in this embodiment may include two, three, four or more than four respectively, and the present invention is not specifically limited here.

[0053] It can be understood that the "heating body 10" in this embodiment is an electrode, and the metal target material or impurities in the heating container 20 of the first heating area 60 and the heating container 20 of the second heating area 70 are heated simultaneously by the same electrode to achieve thermal evaporation of the metal target material or impurities; the "heating container 20" in this embodiment includes a graphite crucible or a high-temperature resistant metal crucible, wherein the metal crucible may specifically include one of a tungsten crucible, a molybdenum crucible, and an alloy crucible containing one of the elements.

[0054] Furthermore, the contact area between the heating groove 11 of the first heating region 60 and the heating container 20 in the present embodiment is smaller than the contact area between the heating groove 11 of the second heating region 70 and the heating container 20. Specifically, since the contact area between the heating groove 11 of the first heating region 60 and the heating container 20 in the present embodiment is smaller than the contact area between the heating groove 11 of the second heating region 70 and the heating container 20, during the heating process of the heating mechanism, the temperature of the heating container 20 of the first heating region 60 will be lower than the temperature of the heating container 20 of the second heating region 70. When it is necessary to heat metal targets or impurities with different melting points, it is only necessary to put the metal target or other material with a low melting point into the heating container 20 of the first heating region 60, and put the metal target or impurity with a high melting point into the heating container 20 of the second heating region 70. In this way, it is possible to ensure that there are heating regions with different temperatures on the same heating body 10, so that metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing the coating cost.

[0055] In some embodiments of the present invention, since the contact area between the heating tank 11 of the first heating zone 60 and the heating container 20 in this embodiment is smaller than the contact area between the heating tank 11 of the second heating zone 70 and the heating container 20, after the copper layer is plated on the base film layer of the conductive film, a functional film layer with a melting point lower than that of the copper layer needs to be plated on the surface of the copper layer, and the functional film layer includes an anti-sticking layer for preventing the copper layers on the opposite sides of the conductive film from sticking to each other, such as at least one of a zinc layer and a tin layer. In the above-mentioned coating process, the heating container 20 of the first heating zone 60 contains a material with a melting point lower than that of copper, such as at least one of zinc and tin, and the heating container 20 of the second heating zone 70 contains a copper material.

[0056] In other embodiments of the present invention, the contact area between the heating tank 11 of the first heating zone 60 and the heating container 20 in this embodiment is smaller than the contact area between the heating tank 11 of the second heating zone 70 and the heating container 20. After the copper layer is plated on the base film layer of the conductive film, a functional film layer with a melting point higher than that of the copper layer is plated on the surface of the copper layer. The functional film layer includes an anti-sticking layer, such as a nickel layer, for preventing the copper layers on opposite sides of the conductive film from sticking to each other. In the above-mentioned coating process, the heating container 20 of the first heating zone 60 contains copper material, and the heating container of the second heating zone 70 contains a material with a higher melting point than copper, such as nickel.

[0057] It can be understood that the “cross-sectional area of ​​the heating groove 11 ” in the present invention refers to the area of ​​the cross section obtained by cutting the heating groove 11 along a direction perpendicular to the thickness of the heating body 10 .

[0058] Further, see Fig. 9 As shown, the cross-sectional area of ​​the heating groove 11 of the first heating region 60 in this embodiment is smaller than the cross-sectional area of ​​the heating groove 11 of the second heating region 70. That is to say, the cross-sectional area of ​​a part of the heating groove 11 in this embodiment is smaller than the cross-sectional area of ​​another part of the heating groove 11, so that the contact area between the heating groove 11 with a small cross-sectional area and the heating container 20 is smaller than the contact area between the heating groove 11 with a large cross-sectional area and the heating container 20. In this way, when the heating body 10 starts to heat, the temperature of the heating container 20 in the heating groove 11 with a small cross-sectional area will be lower than the temperature of the heating container 20 in the heating groove 11 with a large cross-sectional area, so that heating areas with different temperatures can be formed on the same heating body 10, and then metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing the coating cost.

[0059] Specifically, the cross section of the heating tank 11 in this embodiment includes a circle, a triangle, a square or a trapezoid, and the structure is simple and easy to process. Of course, in other embodiments of the present invention, the cross section of the heating tank 11 may also include other polygonal structures or special-shaped structures. As long as it is other deformation methods under the concept of the present invention, it is within the protection scope of the present invention. It should be noted that the "cross section of the heating tank 11" in this embodiment refers to the cross section obtained by cutting the heating tank 11 along a direction perpendicular to the thickness of the heating body 10.

[0060] Further, see Figures 9 and 10 As shown, along the thickness direction of the heating body 10, the cross-sectional area of ​​the heating groove 11 in this embodiment (i.e., the cross-sectional area obtained by cutting the heating groove 11 along the direction perpendicular to the thickness direction of the heating body 10) gradually decreases from top to bottom or remains unchanged. Specifically, when it is necessary to make the temperature of the heating container 20 of the first heating area 60 lower than the temperature of the heating container 20 of the second heating area 70, it is only necessary to gradually reduce the cross-sectional area of ​​the heating groove 11 of the first heating area 60 along the thickness direction of the heating body 10, and keep the cross-sectional area of ​​the heating groove 11 of the second heating area 70 along the thickness direction of the heating body 10 unchanged, so that the contact area between the heating groove 11 of the first heating area 60 and the heating container 20 is smaller than the contact area between the heating groove 11 in the second heating area 70 and the heating container 20 (i.e., the temperature of the heating container 20 of the first heating area 60 is lower than the temperature of the heating container 20 of the second heating area 70), thereby ensuring that the same heating body 10 has heating areas with different temperatures, so as to heat and evaporate targets or impurities with different melting points at the same time, saving energy consumption of the heating mechanism and reducing the coating cost.

[0061] Further, see Figures 4 to 5As shown, along the thickness direction of the heating body 10, the depth of the heating groove 11 of the first heating area 60 in this embodiment is less than the depth of the heating groove 11 of the second heating area 70. Specifically, in this embodiment, the contact area between the heating container 20 and the heating groove 11 can be controlled by controlling the different depths of the heating groove 11, so that the temperature of the heating container 20 in the heating groove 11 with a shallower depth is low, which is suitable for evaporating a metal target material or impurity material with a low melting point, and the temperature of the heating container 20 in the heating groove 11 with a deeper depth is high, which is suitable for evaporating a metal target material or impurity material with a high melting point. That is to say, since the depth of the heating groove 11 of the first heating area 60 in this embodiment is less than the depth of the heating groove 11 of the second heating area 70, when the heating body 10 starts to heat, the temperature of the heating container 20 in the heating groove 11 of the first heating area 60 is low, which can evaporate metal targets or impurity materials with low melting points, and the temperature of the heating container 20 in the heating groove 11 of the second heating area 70 is high, which can evaporate metal targets or impurity materials with high melting points, ultimately achieving heating areas with different temperatures on the same heating body 10, so that metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing coating costs.

[0062] Further, see Figure 1 As shown, in this embodiment, there is a first gap between the bottom of the heating groove 11 of the first heating area 60 and the bottom of the heating container 20. Specifically, the provision of the first gap can reduce the contact area between the heating groove 11 of the first heating area 60 and the heating container 20 or make the bottom of the heating groove 11 of the first heating area 60 not in contact with the bottom of the heating container 20, thereby reducing the temperature of the heating container 20 of the first heating area 60, and then heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated.

[0063] Further, see Figure 2 As shown, in this embodiment, there is a second gap between the side wall of the heating groove 11 of the first heating area 60 and the side wall of the heating container 20. Specifically, the provision of the second gap can reduce the contact area between the heating groove 11 of the first heating area 60 and the heating container 20 or make the side wall of the heating groove 11 of the first heating area 60 not contact the side wall of the heating container 20, thereby reducing the temperature of the heating container 20 of the first heating area 60, and then heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated.

[0064] Further, see Figure 1 As shown, the bottom of the heating groove 11 of the first heating area 60 in this embodiment is provided with a first protrusion 30, so that there is a first gap between the bottom of the heating groove 11 of the first heating area 60 and the bottom of the heating container 20. Specifically, in this embodiment, by providing the first protrusion 30 at the bottom of the heating groove 11, the contact area between the bottom of the heating groove 11 of the first heating area 60 and the bottom of the heating container 20 can be reduced, thereby reducing the heat conduction between the heating container 20 and the heating body 10, and reducing the temperature of the heating container 20 of the first heating area 60, so that the temperature of the heating container 20 of the first heating area 60 is lower than the temperature of the heating container 20 of the second heating area 70, and then heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated, saving the energy consumption of the heating mechanism and reducing the coating cost.

[0065] Further, see Figure 2 As shown, the side wall of the heating groove 11 of the first heating area 60 in this embodiment is provided with a second protrusion 40, so that there is a second gap between the side wall of the heating groove 11 of the first heating area 60 and the side wall of the heating container 20. Specifically, in this embodiment, by providing the second protrusion 40 at the bottom of the heating groove 11, the contact area between the side wall of the heating groove 11 of the first heating area 60 and the side wall of the heating container 20 can be reduced, thereby reducing the heat conduction between the heating container 20 and the heating body 10, reducing the temperature of the heating container 20 of the first heating area 60, and making the temperature of the heating container 20 of the first heating area 60 lower than the temperature of the heating container 20 of the second heating area 70, and then heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated, saving the energy consumption of the heating mechanism and reducing the coating cost.

[0066] Specifically, the first protrusion 30 and the second protrusion 40 in this embodiment both include an annular convex hull, annular convex ridge or conical convex ridge.

[0067] Furthermore, in the present embodiment, a heat insulating member is provided in the first gap and / or the second gap (not shown in the drawings). That is to say, in the present embodiment, a heat insulating member may be provided only in the first gap, or only in the second gap, or both in the first gap and the second gap. With such a configuration, when the heating body 10 starts to heat, the configuration of the heat insulating member can effectively block the heat of the heating body 10 from being transferred from the heating tank 11 toward the heating container 20, further reducing the temperature of the heating container 20 of the first heating area 60, so that the temperature of the heating container 20 of the first heating area 60 is lower than the temperature of the heating container 20 of the second heating area 70, and then heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can simultaneously heat and evaporate metal targets or impurities with different melting points, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated, saving the energy consumption of the heating mechanism and reducing the coating cost.

[0068] Optionally, the thermal insulation member in this embodiment includes one or more of graphite felt, ceramic fiber blanket, silicate board, aerogel felt and silicon carbide fiber board.

[0069] Furthermore, in the present embodiment, the maximum width of the heating groove 11 of the first heating region 60 is greater than the maximum width of the heating container 20. That is to say, when the heating container 20 is installed in the heating groove 11 of the first heating region 60, the side wall of the heating groove 11 does not contact the side wall of the heating container 20, thereby reducing the heat conduction between the heating container 20 and the heating body 10, lowering the temperature of the heating container 20 of the first heating region 60, so that the temperature of the heating container 20 of the first heating region 60 is lower than the temperature of the heating container 20 of the second heating region 70, and then heating regions with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and finally a mixed metal layer can be formed on the surface of the base film layer to be plated, saving the energy consumption of the heating mechanism and reducing the coating cost.

[0070] Furthermore, in this embodiment, the thermal conductivity of the heating container 20 of the first heating area 60 is lower than the thermal conductivity of the heating container 20 of the second heating area 70. Such a configuration can ensure that the temperature of the heating container 20 of the first heating area 60 is lower than the temperature of the heating container 20 of the second heating area 70, so that heating areas with different temperatures can be formed on the same heating body 10, so that the same heating body 10 can heat and evaporate metal targets or impurities with different melting points at the same time, and then a mixed metal layer can be formed on the surface of the base film layer to be plated, saving energy consumption of the heating mechanism and reducing the coating cost.

[0071] Optionally, the heating container 20 of the second heating area 70 in this embodiment includes an aluminum nitride crucible, a tungsten crucible or a molybdenum crucible, and an alloy crucible containing at least one of tungsten and molybdenum.

[0072] From the above-mentioned embodiments, it can be known that in the present invention, a plurality of spaced-apart heating grooves 11 are arranged on the heating body 10. By making the contact area between a part of the heating grooves 11 and the heating container 20 smaller than the contact area between another part of the heating grooves 11 and the heating container 20, the temperature of the heating container 20 with a small contact area can be reduced, thereby ensuring heating areas with different temperatures on the same heating body 10, and then metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing the coating cost.

[0073] On the other hand, the embodiment of the present invention further provides a coating device, which includes the above-mentioned heating mechanism, and thus the coating device includes all the technical effects of the above-mentioned heating mechanism. Since the technical effects of the heating mechanism have been described in detail above, they will not be repeated here.

[0074] On the other hand, see Fig.11 As shown, the embodiment of the present invention also provides a method for preparing a conductive film, and the method for preparing a conductive film is performed using the above-mentioned coating device, so the method for preparing a conductive film includes all the technical effects of the above-mentioned coating device. Since the technical effects of coating hot standby have been described in detail above, they will not be repeated here.

[0075] Further, see Fig.11 As shown, the method for preparing the conductive film in this embodiment includes:

[0076] Step S1: transferring the base film layer to the heating body 10 of the heating mechanism;

[0077] Step S2: The first metal target material in the heating container 20 in the first heating area 60 and the second metal target material in the heating container 20 in the second heating area 70 are simultaneously heated and evaporated by the heating main body 10, so that the first metal target material and the second metal target material are deposited on the surface of the base film layer to form a mixed metal layer.

[0078] In one embodiment of the present invention, since the contact area between the heating groove 11 in the first heating zone 60 and the heating container 20 is smaller than the contact area between the heating groove 11 in the second heating zone 70 and the heating container 20, during the heating process of the heating mechanism, the temperature of the heating container 20 in the heating groove 11 of the first heating zone 60 will be lower than the temperature of the heating container 20 in the heating groove 11 of the second heating zone 70. When it is necessary to heat metal targets or impurities with different melting points, it is only necessary to place the metal target or other material with a low melting point into the heating container 20 of the first heating zone 60, and place the metal target or impurity with a high melting point into the heating container 20 of the second heating zone 70. In this way, it is possible to ensure that the same heating body 10 has heating zones with different temperatures, so that metal targets or impurities with different melting points can be heated and evaporated at the same time, saving energy consumption of the heating mechanism and reducing coating costs.

[0079] Further, in step S2, the melting point of the first metal target is Q1, and the melting point of the second metal target is Q2, wherein Q1 and Q2 satisfy the relationship: |Q1-Q2|≥250°C, such as 250°C, 350°C, 450°C, 550°C, 650°C, 750°C, 850°C, 950°C, etc. That is to say, the melting point of the first metal target in this embodiment may be lower than the melting point of the second metal target, or may be higher than the melting point of the second metal target.

[0080] Specifically, in one embodiment of the present invention, when the contact area between the heating groove 11 and the heating container 20 in the first heating zone 60 is smaller than the contact area between the heating groove 11 and the heating container 20 in the second heating zone 70, the temperature of the heating container 20 in the first heating zone 60 will be lower than the temperature of the heating container 20 in the second heating zone 70, so that the melting point Q1 of the first metal target material will be lower than the melting point Q2 of the second metal target material. At this time, the relationship between Q1 and Q2 satisfies: Q2-Q1≥250℃, for example, 250℃, 350℃, 450℃, 550℃, 650℃, 750℃, 850℃, 950℃, etc.

[0081] Further, in step S2, when the contact area between the heating groove 11 of the first heating zone 60 and the heating container 20 is smaller than the contact area between the heating groove 11 of the second heating zone 70 and the heating container 20, the temperature T1 of the heating container 20 of the first heating zone 60 and the temperature T2 of the heating container 20 of the second heating zone 70 satisfy the relationship: |T1-T2|≥100℃, for example, 100℃, 200℃, 300℃, 400℃, 500℃, etc.

[0082] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0083] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0084] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heating mechanism, characterized in that: include: A heating body (10), wherein the heating body (10) has a plurality of heating grooves (11) arranged at intervals, a portion of the heating grooves (11) forming a first heating area (60), and another portion of the heating grooves (11) forming a second heating area (70); A heating container (20), the heating container (20) comprising a plurality of heating containers (20), the plurality of heating containers (20) being arranged in a one-to-one correspondence in the plurality of heating tanks (11); The temperature of the heating container (20) of the first heating zone (60) is T1, the temperature of the heating container (20) of the second heating zone (70) is T2, and the relationship between T1 and T2 is: |T1-T2|≥100°C.

2. The heating mechanism according to claim 1, characterized in that: The contact area between the heating groove (11) and the heating container (20) of the first heating region (60) is smaller than the contact area between the heating groove (11) and the heating container (20) of the second heating region (70).

3. The heating mechanism according to claim 2, characterized in that: The cross-sectional area of ​​the heating groove (11) of the first heating region (60) is smaller than the cross-sectional area of ​​the heating groove (11) of the second heating region (70).

4. The heating mechanism according to claim 2, characterized in that: The cross section of the heating tank (11) includes a circle, a triangle, a square or a trapezoid.

5. The heating mechanism according to claim 2, characterized in that: Along the thickness direction of the heating body (10), the cross-sectional area of ​​the heating groove (11) gradually decreases from top to bottom or remains unchanged.

6. The heating mechanism according to claim 2, characterized in that: Along the thickness direction of the heating body (10), the depth of the heating groove (11) of the first heating area (60) is smaller than the depth of the heating groove (11) of the second heating area (70).

7. The heating mechanism according to claim 2, characterized in that: There is a first gap between the bottom of the heating tank (11) of the first heating area (60) and the bottom of the heating container (20); and / or, A second gap is provided between the side wall of the heating groove (11) of the first heating area (60) and the side wall of the heating container (20).

8. The heating mechanism according to claim 7, characterized in that: The bottom of the heating groove (11) of the first heating area (60) is provided with a first protrusion (30), so that the first gap exists between the bottom of the heating groove (11) of the first heating area (60) and the bottom of the heating container (20); and / or, The side wall of the heating groove (11) of the first heating area (60) is provided with a second protrusion (40) so that the second gap is provided between the side wall of the heating groove (11) of the first heating area (60) and the side wall of the heating container (20).

9. The heating mechanism according to claim 7, characterized in that: A heat insulating element is arranged in the first gap and / or in the second gap.

10. The heating mechanism according to any one of claims 1 to 9, characterized in that: The thermal conductivity of the heating container (20) of the first heating region (60) is lower than the thermal conductivity of the heating container (20) of the second heating region (70).

11. A coating device, characterized in that: The coating equipment comprises the heating mechanism according to any one of claims 1 to 10.

12. A method for preparing a conductive film, characterized in that: The method for preparing the conductive film is performed using the coating device of claim 11, and the method for preparing the conductive film comprises: Step S1: transferring the base film layer to the heating body (10) of the heating mechanism; Step S2: The first metal target material in the heating container (20) in the first heating area (60) and the second metal target material in the heating container (20) in the second heating area (70) are simultaneously heated and evaporated by the heating body (10), so that the first metal target material and the second metal target material are deposited on the surface of the base film layer to form a mixed metal layer.

13. The method for preparing a conductive film according to claim 12, characterized in that: In the step S2, the melting point of the first metal target is Q1, and the melting point of the second metal target is Q2, wherein Q1 and Q2 satisfy the relationship: |Q1-Q2|≥250°C; or, In step S2, when the contact area between the heating groove (11) of the first heating zone (60) and the heating container (20) is smaller than the contact area between the heating groove (11) of the second heating zone (70) and the heating container (20), the temperature T1 of the heating container (20) of the first heating zone (60) and the temperature T2 of the heating container (20) of the second heating zone (70) satisfy the relationship: |T1-T2|≥100°C.

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