Thermal infrared imager thermal protection device applied to high temperature

Abstract

The invention discloses a thermal infrared imager thermal protection device applied to a high temperature. The thermal infrared imager thermal protection device comprises an outer shell, an infrared thermal imager assembly is installed in the outer shell, the infrared thermal imager assembly comprises an inner shell installed in the outer shell, and an infrared thermal imager is assembled and connected in the inner shell; an air cooling structure is fixedly assembled and connected to the outer shell; the air cooling structure comprises a plurality of plate-penetrating sealing air inlet connectors assembled on the outer shell, and air outlets of the plate-penetrating sealing air inlet connectors are located in the outer shell. An air diffuser is assembled and connected to an air outlet of the penetrating plate sealing air inlet joint; the air cooling structure further comprises a plurality of partition plate sealing air outlet connectors installed on the outer shell. The air diffuser comprises a diffuser cover of a conical structure, and the diffuser cover is installed on the penetrating plate sealing air inlet connector through a connecting piece. According to the device structure, thermal imaging equipment can work for a long time under the high-temperature condition, the steady-state temperature in the structure can be stably kept in a low-temperature state, and then it is ensured that the thermal infrared imager can work normally.

Description

Technical Field

[0001] The invention belongs to the technical field of infrared thermal imagers, and in particular relates to a thermal protection device for infrared thermal imagers used under high temperatures. Background Art

[0002] High-temperature drying of tobacco shreds is an important and critical process in the production of tobacco shreds. It not only improves the tobacco leaves’ outer texture and quality, but also enables the tobacco leaves’ moisture content, temperature and other process parameters to meet the production requirements of subsequent processes.

[0003] At present, the high-temperature drying process in industrial production is mostly in a black box state, or thermocouple temperature sensors are mostly used to measure point temperatures, and the overall temperature field cannot be observed. Specifically, thermocouple temperature sensors can only accurately reflect the temperature in a specific area in the drying box, but cannot accurately reflect the temperature of the overall temperature field in the drying box.

[0004] Infrared thermal imagers are temperature measuring devices that convert the heat signals generated by objects into image signals. They can accurately measure the overall temperature in a specific area. Therefore, infrared thermal imagers are widely used in production and life.

[0005] For example, the Chinese patent publication number is: CN211317532U, which discloses an infrared thermal imager with a protective cover. The main structure of the infrared thermal imager includes a hatch on one side above the infrared thermal imager housing, and two hatches are provided. A control display is provided on the other side above the infrared thermal imager housing. A rotating disk is provided on the lower end surface of the infrared thermal imager housing, and a connecting rod is provided on the lower end surface of the rotating disk. A first track is provided at one end of the connecting rod, and a second track is provided at the other end of the connecting rod. An infrared thermal imager is provided on one side inside the infrared thermal imager housing, and a sponge layer is provided between the infrared thermal imager and the infrared thermal imager housing. A motor is provided on the other side inside the infrared thermal imager housing, and a battery compartment is provided on one side of the motor.

[0006] The infrared thermal imager disclosed in the above patent can automatically move to areas that cannot be reached by human power for detection.

[0007] However, although the infrared thermal imagers disclosed in the prior art all have protective measures for the infrared thermal imagers (such as the installation and setting of a protective housing), the infrared thermal imagers cannot work in a high temperature environment.

[0008] Specifically, infrared thermal imagers are high-precision instruments with an operating temperature range of -20-60 degrees Celsius. Obviously, in high-temperature environments, such as high-temperature tobacco drying ovens, the operating temperature in the oven is often higher than 100 degrees Celsius, and infrared thermal imagers cannot work at all in such high-temperature environments.

[0009] Therefore, the infrared thermal imager is not resistant to high temperatures during operation, which leads to great limitations in its application. Summary of the invention

[0010] Based on the above background, an object of the present invention is to provide a thermal protection device for an infrared thermal imager used under high temperature.

[0011] To achieve the above objectives, the present invention adopts the following technical solutions:

[0012] A thermal protection device for an infrared thermal imager used under high temperature, comprising an outer shell;

[0013] An infrared thermal imager assembly is installed in the outer shell, and the infrared thermal imager assembly includes an inner shell installed in the outer shell, and an infrared thermal imager is assembled and connected in the inner shell;

[0014] The outer shell is fixedly assembled with an air cooling structure;

[0015] The air cooling structure comprises a plurality of through-plate sealed air inlet joints mounted on the outer shell, and the air outlet of the through-plate sealed air inlet joints is located in the outer shell;

[0016] The air outlet of the through-plate sealed air inlet joint is equipped with an air diffuser;

[0017] The air cooling structure also includes a plurality of baffle-sealed air outlet joints mounted on the outer shell;

[0018] The air diffuser comprises a diffuser cover of a conical structure, and the diffuser cover is installed on the through-plate sealing air inlet joint through a connecting piece.

[0019] Preferably, a first cover plate and a second cover plate are respectively installed at the left and right ends of the outer shell;

[0020] The first cover plate and the second cover plate are fastened to the outer shell by a plurality of bolts respectively.

[0021] Preferably, gasket grooves are respectively formed on the side walls of the second cover plate and the outer shell that face each other, and sealing gaskets are clamped between the gasket grooves.

[0022] Preferably, a lens mounting opening is provided at the left end of the outer shell, and a through hole structure corresponding to the lens mounting opening is provided on the first cover plate;

[0023] A zinc selenide window is installed in the lens installation opening.

[0024] Preferably, a sealing gasket is installed between the zinc selenide window and the lens mounting opening.

[0025] Preferably, the diffuser is connected to the through-plate sealed air inlet joint by means of a flange assembly;

[0026] The air inlet of the through-plate sealed air inlet joint is connected to an external high-pressure air circuit;

[0027] The air inlet of the through-plate sealed air inlet joint passes through the second cover plate.

[0028] Preferably, the partition plate sealing outlet joint passes through the second cover plate;

[0029] Both ends of the partition plate sealing air outlet joint are threadedly connected with nuts positioned on both sides of the second cover plate.

[0030] Preferably, the infrared thermal imager is mounted with a thermal imager mounting plate;

[0031] The thermal imager mounting plate is fixedly mounted on the inner housing;

[0032] The thermal imager mounting plate is fixedly assembled on the second cover plate by a plurality of screws.

[0033] Preferably, a plurality of cable sealing joints are installed on the second cover plate; and the working cables of the infrared thermal imager pass through the cable sealing joints.

[0034] Preferably, the outer shell is made of polytetrafluoroethylene.

[0035] The present invention has the following beneficial effects:

[0036] 1. The present invention can enable the thermal imaging device to work under the condition that the ambient temperature exceeds 100°C, and can work continuously for a long time during the working process through the air-cooling structure, and can make the internal steady-state temperature of the structure lower than 40°C, meeting the working temperature range of the thermal imager (-20°C ~ 60°C).

[0037] 2. The shell made of polytetrafluoroethylene not only meets the assembly accuracy and sealing performance, but also further hinders the conduction of heat.

[0038] 3. The high-pressure gas source in the industrial production environment is used as the cooling fluid, so that the interior of the structure can be kept in the target temperature range for a long time, with low energy consumption, environmental protection and stability.

[0039] 4. The design of the diffuser further enhances the heat exchange performance inside the structure and improves the temperature uniformity inside the structure.

[0040] 5. The infrared thermal imager assembly is installed in the outer shell in a suspended manner. The suspended manner facilitates subsequent air cooling. At the same time, the suspended installation method can protect the infrared thermal imager assembly. At the same time, the internal shell can protect the thermal imager from the impact of high-speed airflow.

[0041] 6. The air diffuser adopts a conical structure design, specifically including a conical diffuser, which is installed on the through-plate sealed air inlet joint through a connector. The conical diffuser is used to quickly diffuse the high-pressure airflow, and then the high-pressure airflow is quickly diffused into the shell under the action of the conical diffuser, and the suspended infrared thermal imager component is quickly "immersed" to quickly carry away the heat on the infrared thermal imager component. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0043] Figure 1 Schematic diagram of the three-dimensional structure of the thermal protection device of the infrared thermal imager in the embodiment of the present invention;

[0044] Figure 2 This is one of the planar structural schematic diagrams of the thermal protection device for an infrared thermal imager in an embodiment of the present invention;

[0045] Figure 3 This is the second schematic diagram of the planar structure of the thermal protection device for an infrared thermal imager in an embodiment of the present invention.

[0046] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0050] Example 1

[0051] like Figure 1-3 As shown, a thermal protection device for an infrared thermal imager used under high temperature includes an outer shell 4; the outer shell 4 is made of high temperature resistant polytetrafluoroethylene material.

[0052] The first cover plate 1 and the second cover plate 5 are detachably mounted on the left and right ends of the outer shell 4 by bolts. In order to improve the sealing performance, the second cover plate 5 and the outer shell 4 are provided with gasket grooves on the side walls facing each other, and the gasket grooves are clamped with sealing gaskets 6. The sealing gasket 6 is a pan seal.

[0053] Meanwhile, an infrared thermal imager assembly is installed in the outer shell 4 , and the infrared thermal imager assembly includes an inner shell 11 installed in the outer shell 4 , and the infrared thermal imager 3 is assembled and connected in the inner shell 11 .

[0054] The specific installation method is: the infrared thermal imager 3 is fixedly mounted with a thermal imager mounting plate 12; the thermal imager mounting plate 12 is fixedly mounted on the inner housing 11. At the same time, the thermal imager mounting plate 12 is fixedly mounted on the inner side wall of the second cover plate 5 by a plurality of screws.

[0055] The above method realizes that the infrared thermal imager assembly is installed in the outer shell 4 in a suspended manner. The suspended manner facilitates subsequent air cooling. At the same time, the suspended installation method can protect the infrared thermal imager assembly.

[0056] At the same time, the inner housing protects the thermal imager from the impact of high-speed airflow (cooling process described below).

[0057] Example 2

[0058] like Figure 1-3 As shown, based on the structure of Example 1, this embodiment is fixedly assembled and connected with an air cooling structure on the outer shell 4; the air cooling structure is used to pump a high-temperature air cooling airflow into the shell cavity of the outer shell 4 to cool the infrared thermal imager components. After air cooling, the temperature of the infrared thermal imager components can be reduced to below 40 degrees Celsius. After cooling, the hot airflow is discharged from the outer shell 4.

[0059] The specific structure of the air-cooled structure is:

[0060] The air cooling structure includes two through-plate sealed air inlet connectors 9 assembled on the outer shell 4 (the through-plate sealed air inlet connector 9 passes through the second cover plate 5, is fixed on the second cover plate 5 by a nut, and in order to increase the sealing, a gasket is installed between the nut and the cover plate), and the air outlet of the through-plate sealed air inlet connector 9 is located inside the outer shell 4.

[0061] At the same time, the air outlet of the through-plate sealed air inlet joint 9 is connected with an air diffuser 10; during the working process, the air inlet of the through-plate sealed air inlet joint 9 is connected and installed to the external high-pressure air path, and the high-pressure cooling airflow is pumped into the through-plate sealed air inlet joint 9, and then distributed from the air diffuser 10 to the shell cavity of the outer shell 4 in a dispersed manner. In this process, the speed of the dispersed cooling airflow reaching different points on the inner wall of the shell cavity is relatively consistent, which can enhance the heat exchange efficiency of the structure, reduce the flow resistance, and improve the uniformity of the temperature distribution inside the structure. Then, the cooling effect is increased.

[0062] Specifically, the air diffuser 10 includes a diffuser cover of a conical structure, and the diffuser cover is installed on the through-plate sealed air inlet joint 9 through a connector. The diffuser cover of the conical structure can quickly diffuse the high-pressure airflow.

[0063] The specific installation method of the air diffuser 10 is:

[0064] The diffuser is connected to the through-plate sealed air inlet joint 9 through a flange assembly. Specifically, the diffuser is mounted to one side of the flange by means of screws, and the through-plate sealed air inlet joint 9 is mounted on the other side of the flange.

[0065] Example 3

[0066] like Figure 1-3 As shown, this embodiment is based on the structure of embodiment 2. During operation, when high-pressure airflow is pumped in to cool the infrared thermal imager assembly, the heated high-temperature airflow is discharged from the shell cavity of the outer shell 4.

[0067] Specifically, the air cooling structure further includes two partition plate sealed air outlet joints 7 installed on the outer shell 4; the partition plate sealed air outlet joints 7 penetrate the second cover plate 5; both ends of the partition plate sealed air outlet joints 7 are threadedly connected with nuts positioned on both sides of the second cover plate 5. At the same time, in order to increase the sealing performance, a gasket is installed between the nut and the second cover plate 5.

[0068] During operation, the hot air flow generated after the high-pressure air flow is cooled is discharged from the position of the partition plate sealed air outlet joint 7.

[0069] In this process, the infrared thermal imager assembly in the suspended installation state is fully cooled by the pumped cooling airflow in an "immersion manner" after the high-temperature airflow is pumped in, and the high-temperature airflow generated after cooling is discharged externally from the partition plate sealed air outlet connector 7. This method not only has a fast heat dissipation speed, but also has a high heat dissipation efficiency.

[0070] Example 4

[0071] like Figure 1-3 As shown, based on the structure of Example 3, the left end of the outer shell 4 is provided with a lens mounting opening, and the first cover plate 1 is provided with a through hole structure corresponding to the lens mounting opening; a zinc selenide window 2 is installed in the lens mounting opening. The zinc selenide window 2 has a high transmittance for signals in the 8-14 micron band, and the signals in the 8-14 micron band are the signal band range accepted by the infrared thermal imager. In this way, the signal receiving effect of the infrared thermal imager is increased.

[0072] At the same time, in order to improve the sealing performance, a sealing gasket is installed between the zinc selenide window 2 and the lens installation port.

[0073] Example 5

[0074] like Figure 1-3 As shown, in this embodiment, based on the structure of embodiment 4, two cable sealing joints are installed on the second cover plate 5; the working cable of the infrared thermal imager passes through the cable sealing joint. Specifically, the cable sealing joint passes through the second cover plate 5 in the same way and is fixed on the second cover plate 5 by a nut fixing method. A sealing gasket is installed between the nut and the cover plate. During operation, when the cable passes through the cable sealing joint, according to the existing sealing method, the sealing between the cable and the cable sealing joint is further increased by tightening the radial sealing ring.

[0075] Of course, the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by technicians in this technical field within the essential scope of the present invention should also fall within the protection scope of the present invention.

Claims

1. A thermal protection device for an infrared thermal imager used under high temperature, characterized in that: including an outer shell; An infrared thermal imager assembly is installed in the outer shell, and the infrared thermal imager assembly includes an inner shell installed in the outer shell, and an infrared thermal imager is assembled and connected in the inner shell; The outer shell is fixedly assembled with an air cooling structure; The air cooling structure comprises a plurality of through-plate sealed air inlet joints mounted on the outer shell, and the air outlet of the through-plate sealed air inlet joints is located in the outer shell; The air outlet of the through-plate sealed air inlet joint is equipped with an air diffuser; The air cooling structure also includes a plurality of baffle-sealed air outlet joints mounted on the outer shell; The air diffuser comprises a diffuser cover of a conical structure, and the diffuser cover is installed on the through-plate sealing air inlet joint through a connecting piece.

2. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 1, characterized in that: The left and right ends of the outer shell are respectively installed with a first cover plate and a second cover plate; The first cover plate and the second cover plate are fastened to the outer shell by a plurality of bolts respectively.

3. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: Gasket grooves are respectively formed on the side walls of the second cover plate and the outer shell that face each other, and sealing gaskets are clamped between the gasket grooves.

4. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: A lens mounting opening is provided at the left end of the outer shell, and a through hole structure corresponding to the lens mounting opening is provided on the first cover plate; A zinc selenide window is installed in the lens installation opening.

5. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 4, characterized in that: A sealing gasket is installed between the zinc selenide window and the lens installation opening.

6. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: The diffuser is connected to the through-plate sealed air inlet joint by means of a flange assembly; The air inlet of the through-plate sealed air inlet joint is connected to an external high-pressure air circuit; The air inlet of the through-plate sealed air inlet joint passes through the second cover plate.

7. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: The partition plate sealing outlet joint passes through the second cover plate; Both ends of the partition plate sealing air outlet joint are threadedly connected with nuts positioned on both sides of the second cover plate.

8. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: The infrared thermal imager is equipped with a thermal imager mounting plate; The thermal imager mounting plate is fixedly mounted on the inner housing; The thermal imager mounting plate is fixedly assembled on the second cover plate by a plurality of screws.

9. The thermal protection device for infrared thermal imagers used at high temperatures according to claim 2, characterized in that: A plurality of cable sealing joints are installed on the second cover plate; the working cables of the infrared thermal imager pass through the cable sealing joints.

10. The thermal protection device for infrared thermal imager used at high temperature according to claim 1, characterized in that: The outer shell is made of polytetrafluoroethylene.

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