Adjustable chip aging baking device

Abstract

The invention discloses an adjustable chip aging and baking device which comprises a bottom plate and a plurality of fixing assemblies installed on the bottom plate. The top surface of the bottom plate is provided with a plurality of supporting bosses used for supporting chips, and the supporting bosses are parallel to one another and are arranged at intervals; a plurality of adjusting screw holes which are linearly distributed at intervals are formed in the top surface of the bottom plate, and the adjusting screw holes are located in the intervals of the supporting bosses; the fixing assembly is detachably connected with the bottom plate through the adjusting screw hole, and the fixing assembly is in butt joint with the top face of the chip to limit the chip. According to the adjustable chip aging baking device, chips of different structures can be installed and fixed at the same time, the requirement for the types of baking jigs is reduced, the model selection time is shortened, the baking operation efficiency is improved, meanwhile, the number of the stored baking jigs can be reduced, and the storage space and the storage cost are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip calibration, and more precisely to an adjustable chip aging baking device. Background Art

[0002] The principle of chip production is to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, make them on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then package them in a tube shell to become a microstructure with the required circuit function. Chips are often in a high temperature environment when in use. In order to ensure the reliability of the chip after long-term use, aging baking tests are required.

[0003] The aging baking test can evaluate the reliability and stability of the chip after long-term use, and detect the working life of the chip under different conditions. Its basic principle is to simulate the environmental impact of the chip in actual use for a long time by conducting accelerated aging tests on the chip under high temperature, constant voltage, constant current and other conditions, so as to find out the cause and mechanism of chip failure and ensure the reliability and stability of the chip.

[0004] During the chip aging baking test, a fixture is required to fix the chip. Currently, the commonly used fixtures are fixed plates with mounting slots or metal tubes with mounting cavities. The chip is installed in the mounting slots or mounting cavities, and the chip is clamped and fixed by the mounting slots or mounting cavities. Due to the variety of chip product structures and sizes, each fixture can only install one chip. Different types of fixtures are required for different chips. It is impossible to bake multiple chips with one fixture. In addition, there are many requirements for the types of fixtures, and many fixtures need to be stored for a long time. The baking operation is not convenient enough and the cost is high.

[0005] In summary, there is a need in the art for a device that can perform a fixed aging baking test on a variety of chips to simplify the baking operation while saving the cost of the fixture and the space for storing the fixture. Summary of the invention

[0006] In view of this, the purpose of the present invention is to provide an adjustable chip aging and baking device, which can adapt to different types of chips by adjusting the installation position of the fixing component on the base plate. One device can simultaneously meet the aging and baking requirements of multiple chips.

[0007] In order to achieve the above-mentioned purpose, the present invention provides an adjustable chip aging and baking device, including a base plate and a plurality of fixing components installed on the base plate; the top surface of the base plate has a plurality of supporting bosses for supporting the chip, the supporting bosses are parallel to each other, and the supporting bosses are arranged at intervals; the top surface of the base plate has a plurality of adjusting screw holes arranged in a straight line at intervals, and the adjusting screw holes are located in the intervals between the supporting bosses; the fixing components are detachably connected to the base plate through the adjusting screw holes, and the fixing components are connected to the top surface of the chip to form a limit thereon.

[0008] Preferably, the fixing assembly comprises a baffle and a connecting assembly, the connecting assembly is detachably connected to the adjusting screw hole, the baffle is mounted on the top of the connecting assembly, and the baffle is connected to the top surface of the chip.

[0009] Preferably, the connecting assembly includes a bolt and a spring, the bolt is threadedly connected to the adjusting screw hole, the baffle is installed on the lower side of the head of the bolt, the spring is sleeved on the outside of the bolt, and the two ends of the spring are respectively abutted against the baffle and the bottom plate.

[0010] Preferably, the bottom of the baffle has a protrusion extending downward.

[0011] Preferably, the top surface end of the supporting boss has an end stop shaft fixing hole for mounting the end stop shaft.

[0012] Compared with the prior art, the advantage of the adjustable chip aging and baking device disclosed in the present invention is that the adjustable chip aging and baking device can simultaneously install and fix multiple chips with different structures, reducing the requirements for the types of baking jigs, reducing the selection time, and improving the baking operation efficiency. At the same time, it can reduce the number of stored baking jigs, reducing storage space and storage costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 Shown is a schematic structural diagram of an adjustable chip aging and baking device according to the present invention.

[0015] Figure 2 Shown are schematic diagrams of the structures of three chips with different structures.

[0016] Figure 3Shown is a top view of an adjustable chip aging baking device of the present invention.

[0017] Figure 4 Shown Figure 3 Enlarged schematic diagram of part A.

[0018] Figure 5 Shown is a front view of an adjustable chip aging baking device of the present invention.

[0019] Figure 6 The figure shows a front view of an adjustable chip aging baking device of the present invention when fixing a chip.

[0020] Figure 7 The figure shows a front view of an adjustable chip aging baking device of the present invention when fixing a chip. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figure 1 As shown, the present application discloses an adjustable chip aging baking device, which includes a base plate 1 and a plurality of fixing components 2 installed on the base plate 1. The top surface of the base plate 1 has a plurality of supporting bosses 10 for supporting the chip, and the supporting bosses 10 are parallel to each other and arranged at intervals. The top surface of the base plate 1 has a plurality of adjusting screw holes 11 arranged at intervals in a straight line, and the adjusting screw holes 11 are located in the intervals between the supporting bosses 10. The fixing component 2 is detachably connected to the base plate 1 through the adjusting screw holes 11, and the fixing component 2 is connected to the top surface of the chip to form a limit to it. By changing the adjusting screw holes 11 installed on the fixing component 2, the relative position of the fixing component 2 and the supporting boss 10 can be changed, thereby realizing the clamping of chips of different lengths and widths; by changing the installation depth of the fixing component 2 in the adjusting screw holes 11, the clamping of chips of different heights can be realized. The adjustable chip aging baking device can simultaneously install and fix multiple chips with different structures, reducing the requirements for the types of baking jigs, reducing the selection time, and improving the baking operation efficiency. At the same time, it can reduce the number of baking jigs to be stored, reducing storage space and storage costs.

[0023] See also Figure 2, are examples of existing chips with different structures. The first chip 31 is larger in length and width than the third chip 33, and the second chip 32 is larger in height than the third chip 33. The adjustable chip aging and baking device can clamp the above three chips at the same time. It is worth noting that the above three chips are only examples, and the adjustable chip aging and baking device can clamp conventional chips of other sizes and structures.

[0024] See also Figure 1 , Figure 3 and Figure 4 The fixing component 2 includes a baffle 21 and a connecting component 22. The connecting component 22 is detachably connected to the adjusting screw hole 11. The baffle 21 is installed on the top of the connecting component 22, and the baffle 22 is connected to the top surface of the chip.

[0025] Preferably, the top end of the supporting boss 10 has an end stop shaft fixing hole 101 for installing an end stop shaft, and the end stop shaft forms a limit for the chip placed on the supporting boss 10 to prevent the chip from slipping.

[0026] like Figure 5 As shown, the connecting assembly 22 includes a bolt 221 and a spring 222. The bolt 221 is threadedly connected to the adjusting screw hole 11. The baffle 21 is installed on the lower side of the head of the bolt 221. The spring 222 is sleeved outside the bolt 221, and the two ends of the spring 222 are respectively in contact with the baffle 21 and the bottom plate 10. The height of the baffle 21 can be changed by rotating the bolt 221, and the baffle 21 is limited by the spring 222.

[0027] For further information, see Figure 6 and Figure 7 The bottom of the baffle 21 has a protrusion 211 extending downward, and the protrusion 211 forms a limit from the side of the chip to prevent the chip from sliding sideways.

[0028] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An adjustable chip aging baking device, characterized in that: It includes a base plate and a plurality of fixing components installed on the base plate; the top surface of the base plate has a plurality of supporting bosses for supporting the chip, the supporting bosses are parallel to each other, and the supporting bosses are arranged at intervals; the top surface of the base plate has a plurality of adjusting screw holes arranged at intervals in a straight line, and the adjusting screw holes are located in the intervals between the supporting bosses; the fixing components are detachably connected to the base plate through the adjusting screw holes, and the fixing components are butted against the top surface of the chip to limit it.

2. The adjustable chip aging baking device according to claim 1, characterized in that: The fixing assembly includes a baffle and a connecting assembly, the connecting assembly is detachably connected to the adjusting screw hole, the baffle is installed on the top of the connecting assembly, and the baffle is connected to the top surface of the chip.

3. The adjustable chip aging baking device according to claim 2, characterized in that: The connecting assembly includes a bolt and a spring, the bolt is threadedly connected to the adjusting screw hole, the baffle is installed on the lower side of the head of the bolt, the spring is sleeved outside the bolt, and the two ends of the spring are respectively abutted against the baffle and the bottom plate.

4. The adjustable chip aging baking device according to claim 2, characterized in that: The bottom of the baffle is provided with a protrusion extending downward.

5. The adjustable chip aging baking device according to claim 1, characterized in that: The top end of the supporting boss is provided with an end stop shaft fixing hole for mounting the end stop shaft.

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