High-voltage probe card capable of adjusting height of nitrogen ring

Abstract

The invention provides a high-voltage probe card capable of adjusting the height of a nitrogen ring, and the high-voltage probe card comprises the nitrogen ring which comprises a nitrogen inner ring and a nitrogen outer ring, and the nitrogen inner ring and the nitrogen outer ring are connected in a sleeving and sliding manner. A guide mechanism and a fixing mechanism are arranged between the nitrogen inner ring and the nitrogen outer ring, and the guide mechanism is used for guiding sliding between the nitrogen inner ring and the nitrogen outer ring; and the fixing mechanism is used for fixing the nitrogen inner ring and the nitrogen outer ring after the relative position between the nitrogen inner ring and the nitrogen outer ring is adjusted. According to the technical scheme, the height of the nitrogen ring can be adjusted according to the actual situation, and the situation that the distance between the clamped position of the nitrogen ring and a PCB is too large, so that the nitrogen density is not enough, and consequently the ignition problem is caused and a wafer is damaged is avoided; and the nitrogen ring is prevented from being stuck and being too low away from the PCB to crush the wafer.

Description

Background Art

[0002] The current third-generation semiconductor products such as gallium nitride and silicon carbide high-voltage power devices require wafer-level electrical screening and testing due to their high-voltage and high-current product characteristics, as well as high-voltage and high-current testing. The high voltage is generally above 650V, and the high current is generally from several amperes to tens of amperes. Among them, high voltage is prone to arc discharge or even breakdown, affecting the test quality and reliability of the wafer, and even causing damage to the wafer itself.

[0003] In order to prevent arc discharge in high-voltage test environment, a nitrogen blowing device is generally used on the test probe card test machine surface, and a nitrogen ring device is generally used on the probe card wafer surface. When blowing nitrogen during the test, when the needle tip approaches the wafer, the nitrogen pressure rises due to the blocked outlet, and the nitrogen ring is lifted by the airflow and raised to 50um from the wafer. However, at this time, the nitrogen density has met the high-voltage insulation conditions, and no sparks will be generated during the test, so the wafer will not be damaged by arc discharge.

[0004] However, this method has certain defects. As the number of tests increases, the nitrogen ring is easily stuck due to external factors and cannot move up and down freely. When the nitrogen ring is stuck, it is easy to cause three problems. First, it is easy to crush the surface of the wafer; second, if the position of the stuck is too high, the nitrogen density is not enough, causing arc discharge to break through the chip (Die) on the wafer; third, even if the nitrogen ring is not stuck, due to the lifting height of only 50um, some wafers will splash some metal particles onto the nitrogen ring during avalanche testing, which is easy to crush the wafer during the test.

[0005] At present, there are devices that do not use nitrogen rings. They use a square frame or a barrel device to cover the probe. The probe is about 200um higher than the barrel / square frame. When the needle pressure is 50-70um during testing, the wafer is about 130-150um away from the bottom of the square frame or barrel. However, this device has another defect. First, if the needle length is shortened, the barrel / square frame is easy to damage the wafer. Second, if the needle pressure is input too high by mistake, it is also easy to cause needle jam or wafer damage. Summary of the invention

[0006] The present application provides a high-voltage probe card with adjustable nitrogen ring height, which is used to solve the problem of wafer damage in integrated circuit wafer testing.

[0007] The present application provides a high voltage probe card with adjustable nitrogen ring height, comprising: a nitrogen ring, wherein:

[0008] The nitrogen ring comprises a nitrogen inner ring and a nitrogen outer ring, the nitrogen inner ring and the nitrogen outer ring are sleeved and slidably connected, and a guiding mechanism and a fixing mechanism are arranged between the nitrogen inner ring and the nitrogen outer ring.

[0009] The guide mechanism is used to guide the sliding between the nitrogen inner ring and the nitrogen outer ring;

[0010] The fixing mechanism is used to fix the nitrogen inner ring and the nitrogen outer ring after adjusting the relative position between the nitrogen inner ring and the nitrogen outer ring.

[0011] In the above technical scheme, a guiding mechanism and a fixing mechanism are arranged between the nitrogen inner ring and the nitrogen outer ring, wherein the guiding mechanism is used to guide the sliding between the nitrogen inner ring and the nitrogen outer ring; the fixing mechanism is used to fix the nitrogen inner ring and the nitrogen outer ring after adjusting the relative position between the nitrogen inner ring and the nitrogen outer ring; the height of the nitrogen ring can be adjusted according to actual conditions to avoid the nitrogen ring being stuck at a position too high from the PCB, thereby causing insufficient nitrogen density and causing spark problems to damage the wafer; to avoid the nitrogen ring being stuck and the position being too low from the PCB and crushing the wafer; to avoid metal particles on the nitrogen ring (some metal particles will splash onto the nitrogen ring during avalanche testing) and crushing the wafer; the needle card life can be improved, and if the needle is short, the height of the nitrogen ring can be manually adjusted.

[0012] In a specific implementation manner, the guide mechanism is a guide surface provided on the nitrogen inner ring and the nitrogen outer ring.

[0013] In a specific embodiment, the guide surface is a flat surface or a convex surface.

[0014] In a specific implementation manner, the fixing mechanism is a fixing column arranged between the nitrogen inner ring and the nitrogen outer ring.

[0015] In a specific implementation manner, the fixed column passes through the nitrogen outer ring and abuts against the nitrogen inner ring.

[0016] In a specific implementation manner, the fixing column is a bolt or a positioning pin.

[0017] In a specific embodiment, there are multiple fixed columns.

[0018] In a specific implementation manner, the nitrogen inner ring and the nitrogen outer ring are both made of special engineering plastics.

[0019] In a specific embodiment, the special engineering plastic includes polyetheretherketone resin.

[0020] In a specific implementation scheme, it also includes a pin card PCB board, wherein:

[0021] One end of the nitrogen inner ring is fixedly connected to the needle card PCB board, the probe of the needle card PCB board is installed on the nitrogen inner ring, and the end of the probe of the needle card PCB board passes through the nitrogen inner ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a nitrogen ring provided in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the structure of a high voltage probe card with adjustable nitrogen ring height provided in an embodiment of the present application.

[0024] Among them, 1-nitrogen inner ring, 2-nitrogen outer ring, 3-guiding mechanism, 4-fixing mechanism, 5-needle card PCB board, 6-nitrogen inlet, 7-probe. DETAILED DESCRIPTION

[0025] The present application is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present application will become clearer and more specific.

[0026] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise noted.

[0027] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0028] To facilitate understanding of the high-voltage probe card with adjustable nitrogen ring height provided in the embodiment of the present application, its application scenario is first explained. The high-voltage probe card with adjustable nitrogen ring height provided in the embodiment of the present application is used to solve the problem of wafer damage in integrated circuit wafer testing. The current third-generation semiconductor high-voltage power device products such as gallium nitride and silicon carbide, due to their high-voltage and high-current product characteristics, require wafer-level wafer (chip) electrical screening and detection, and high-voltage and high-current detection. The high voltage is generally above 650v, and the high current is generally several amperes to tens of amperes. Among them, high voltage is prone to arc discharge or even breakdown, affecting the test quality and reliability of the wafer, and even causing damage to the wafer itself. In order to prevent the phenomenon of arc discharge that is prone to occur in the high-voltage test environment, a device for blowing nitrogen on the test probe card tester surface is generally used, and a nitrogen ring device is generally used on the probe card wafer surface. During the test, nitrogen is blown. When the needle tip approaches the wafer, the nitrogen outlet is blocked, the pressure increases, and the nitrogen ring is lifted by the airflow and lifted 50um away from the wafer. However, at this time, the nitrogen density has met the high-voltage insulation conditions, and no sparks will be generated during the test, so the wafer will not be damaged by arc discharge. However, this method has certain defects. As the number of tests increases, the nitrogen ring is easily stuck due to external factors and cannot move up and down freely. When the nitrogen ring is stuck, it is easy to cause three problems. First, it is easy to crush the surface of the wafer; second, if the stuck position is too high, the nitrogen density is not enough at this time, causing arc discharge to break through the chip (Die) on the wafer; third, even if the nitrogen ring is not stuck, because the lifting height is only 50um, some wafers will splash some metal particles onto the nitrogen ring during avalanche testing, which is easy to crush the wafer during testing. At present, there are devices that do not use nitrogen rings. They use a square frame or barrel device to cover the probe. The probe is about 200um higher than the barrel / square frame. When the needle pressure is 50-70um during testing, the wafer is about 130-150um away from the bottom of the square frame or barrel. However, this device has another defect. First, if the needle length becomes shorter, the barrel / square frame is likely to damage the wafer. Second, if the needle pressure is mistakenly input too high, it is also easy to cause needle jam or wafer damage. For this reason, the embodiment of the present application provides a high-voltage probe card with adjustable nitrogen ring height to solve the problem of wafer damage during integrated circuit wafer testing. The following is a detailed description of this with specific drawings and examples.

[0029] refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a nitrogen ring provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of a high voltage probe card with adjustable nitrogen ring height provided in an embodiment of the present application.

[0030] exist Figure 1 and Figure 2The present application provides a high voltage probe card with adjustable nitrogen ring height, comprising: a nitrogen ring, wherein:

[0031] The nitrogen ring comprises a nitrogen inner ring 1 and a nitrogen outer ring 2, the nitrogen inner ring and the nitrogen outer ring are sleeve-slidably connected, and a guide mechanism 3 and a fixing mechanism 4 are arranged between the nitrogen inner ring and the nitrogen outer ring.

[0032] The guide mechanism is used to guide the sliding between the nitrogen inner ring and the nitrogen outer ring;

[0033] The fixing mechanism is used to fix the nitrogen inner ring and the nitrogen outer ring after adjusting the relative position between the nitrogen inner ring and the nitrogen outer ring.

[0034] In the above technical scheme, a guiding mechanism and a fixing mechanism are arranged between the nitrogen inner ring and the nitrogen outer ring, wherein the guiding mechanism is used to guide the sliding between the nitrogen inner ring and the nitrogen outer ring; the fixing mechanism is used to fix the nitrogen inner ring and the nitrogen outer ring after adjusting the relative position between the nitrogen inner ring and the nitrogen outer ring; the height of the nitrogen ring can be adjusted according to actual conditions to avoid the nitrogen ring being stuck at a position too high from the PCB, thereby causing insufficient nitrogen density and causing spark problems to damage the wafer; to avoid the nitrogen ring being stuck and the position being too low from the PCB and crushing the wafer; to avoid metal particles on the nitrogen ring (some metal particles will splash onto the nitrogen ring during avalanche testing) and crushing the wafer; the needle card life can be improved, and if the needle is short, the height of the nitrogen ring can be manually adjusted.

[0035] In a specific implementation manner, the guide mechanism is a guide surface provided on the nitrogen inner ring and the nitrogen outer ring.

[0036] In a specific embodiment, the guide surface is a flat surface or a convex surface.

[0037] In a specific implementation manner, the fixing mechanism is a fixing column arranged between the nitrogen inner ring and the nitrogen outer ring.

[0038] In a specific implementation manner, the fixed column passes through the nitrogen outer ring and abuts against the nitrogen inner ring.

[0039] In a specific implementation manner, the fixing column is a bolt or a positioning pin.

[0040] In this embodiment, the high voltage probe card with adjustable nitrogen ring height provides a probe card for preventing sparks during high voltage testing of silicon carbide (SIC) wafers. The high voltage probe card is characterized in that the height of the nitrogen ring can be adjusted according to actual conditions:

[0041] 1. Avoid the nitrogen ring being stuck too high from the PCB, which may cause insufficient nitrogen density and spark damage to the wafer.

[0042] 2. Avoid the nitrogen ring from getting stuck and being too low from the PCB to crush the wafer.

[0043] 3. Avoid metal particles on the nitrogen ring (some metal particles will splash onto the nitrogen ring during avalanche testing) and damage the wafer.

[0044] 4. It can improve the life of the needle card. If the needle is too short, the height of the nitrogen ring can be adjusted manually.

[0045] In a specific implementation manner, the number of the fixing columns is multiple (two or more), such as two, three, or other different numbers.

[0046] In this embodiment, the following modifications are made to the nitrogen ring of the probe card: first, a guiding device is added to the nitrogen ring (not limited to a plane, a convex surface can also be used for guidance) to prevent the nitrogen ring from being lifted non-parallel; second, two or three fixing screws are added (not limited to screws) to fix and adjust the height of the nitrogen ring.

[0047] In a specific implementation manner, the nitrogen inner ring and the nitrogen outer ring are both made of special engineering plastics.

[0048] In a specific embodiment, the special engineering plastic includes polyetheretherketone resin.

[0049] In a specific implementation scheme, it also includes a pin card PCB board 5, wherein:

[0050] One end of the nitrogen inner ring is fixedly connected to the needle card PCB board, the probe of the needle card PCB board is installed on the nitrogen inner ring, and the end of the probe 7 of the needle card PCB board passes through the nitrogen inner ring; the nitrogen introduced by the nitrogen inlet 6 is connected to the internal space of the nitrogen inner ring for providing nitrogen.

[0051] In this embodiment, the high-voltage probe card with adjustable nitrogen ring height provides a new type of probe card with adjustable nitrogen ring height: first, the height is adjusted according to the density requirement of nitrogen; second, if the needle is worn, the height can be adjusted at any time; third, the fixing device has a certain amount of sliding property. If the needle pressure is too large or large particles are stuck on it, the nitrogen ring can slide upwards under the drive of external force, avoiding the hidden danger of crushing the wafer.

[0052] refer to Figure 1 and Figure 2The material of the nitrogen ring can be PEEK (polyetheretherketone resin), which is a special engineering plastic with excellent performance. Compared with other special engineering plastics, it has many significant advantages, such as high temperature resistance, excellent mechanical properties, good self-lubrication, and chemical corrosion resistance. It should be noted that the pressure inside the needle clamp ring is generally greater than 3 kg. If it is lower, it is easy to cause sparks during the test due to insufficient nitrogen density.

[0053] Those skilled in the art will appreciate that the present application may be implemented as a system, method or computer program product.

[0054] Therefore, the present disclosure may be specifically implemented in the following forms, namely: it may be completely hardware, it may be completely software (including firmware, resident software, microcode, etc.), or it may be a combination of hardware and software, generally referred to herein as a "circuit", "module" or "system". In addition, in some embodiments, the present application may also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium may contain computer-readable program code.

[0055] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, computer-readable storage media can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0056] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art can change, modify, replace and modify the above embodiments within the scope of the present application. On this basis, a variety of replacements and improvements can be made to the present application, all of which fall within the scope of protection of the present application.

Claims

1. A high voltage probe card with adjustable nitrogen ring height, characterized in that: include: Nitrogen ring, where The nitrogen ring comprises a nitrogen inner ring and a nitrogen outer ring, the nitrogen inner ring and the nitrogen outer ring are sleeved and slidably connected, and a guiding mechanism and a fixing mechanism are arranged between the nitrogen inner ring and the nitrogen outer ring. The guide mechanism is used to guide the sliding between the nitrogen inner ring and the nitrogen outer ring; The fixing mechanism is used to fix the nitrogen inner ring and the nitrogen outer ring after adjusting the relative position between the nitrogen inner ring and the nitrogen outer ring.

2. The high voltage probe card with adjustable nitrogen ring height according to claim 1, characterized in that: The guide mechanism is a guide surface arranged on the nitrogen inner ring and the nitrogen outer ring.

3. The high voltage probe card with adjustable nitrogen ring height according to claim 2, characterized in that: The guide surface is a flat surface or a convex surface.

4. The high voltage probe card with adjustable nitrogen ring height according to claim 3, characterized in that: The fixing mechanism is a fixing column arranged between the nitrogen inner ring and the nitrogen outer ring.

5. The high voltage probe card with adjustable nitrogen ring height according to claim 4, characterized in that: The fixing column passes through the nitrogen outer ring and abuts against the nitrogen inner ring.

6. The high voltage probe card with adjustable nitrogen ring height according to claim 5, characterized in that: The fixing column is a bolt or a positioning pin.

7. The high voltage probe card with adjustable nitrogen ring height according to claim 6, characterized in that: The number of the fixing columns is multiple.

8. The high voltage probe card with adjustable nitrogen ring height according to claim 7, characterized in that: The nitrogen inner ring and the nitrogen outer ring are both made of special engineering plastics.

9. The high voltage probe card with adjustable nitrogen ring height according to claim 8, characterized in that: The special engineering plastics include polyetheretherketone resin.

10. The high voltage probe card with adjustable nitrogen ring height according to claim 9, characterized in that: It also includes a pin card PCB board, which One end of the nitrogen inner ring is fixedly connected to the needle card PCB board, the probe of the needle card PCB board is installed on the nitrogen inner ring, and the end of the probe of the needle card PCB board passes through the nitrogen inner ring.

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