Antenna structure and electronic device

Abstract

The invention discloses an antenna structure and an electronic device. The electronic device comprises a shell and an antenna structure arranged in the shell. The antenna structure comprises a carrier plate, a switching circuit, a first radiation part and a second radiation part, the carrier plate comprises a first bearing part and a second bearing part which are connected, the thickness of the first bearing part is larger than that of the second bearing part, the second bearing part comprises a circuit layer and a grounding layer, and the circuit layer and the grounding layer are formed on the surfaces of the two opposite sides of the second bearing part respectively; the switching circuit is positioned on the circuit layer on the second bearing part; the first radiation part is arranged on the carrier plate and is electrically connected to a feed-in part; the second radiation member is disposed on the carrier plate, the second radiation member is electrically connected to the switching circuit, and the second radiation member and the first radiation member are separated from each other and coupled to each other. The carrier plate provided by the invention is provided with areas with different thicknesses, and the circuit layer and the grounding layer can be formed on the second bearing part with relatively thin thickness, so that the capacitance between layers is reduced, and the frequency offset amplitude and the antenna bandwidth are increased.

Description

Technical Field

[0001] The present invention relates to an antenna structure and an electronic device, and in particular to an antenna structure capable of increasing bandwidth and an electronic device having the antenna structure. Background Art

[0002] In the prior art, antenna structures are generally made using multi-layer high-density interconnect (HDI) circuit boards as substrates. The manufacturing process of HDI PCB uses traditional double-sided boards as core boards and is formed by continuous lamination. This type of circuit board with a continuous lamination process is also called a build-up multilayer (BUM). However, the antenna structure made of HDI PCB has a complex manufacturing process, high manufacturing cost and long manufacturing time, and the antenna produced is slightly insufficient in terms of the generated bandwidth.

[0003] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become one of the problems to be solved in this field.

[0004] Therefore, it is necessary to provide an antenna structure and an electronic device to solve the above problems. Summary of the invention

[0005] The present invention mainly provides an antenna structure and an electronic device having the antenna structure to solve the technical problems of the existing antenna structure having a complicated manufacturing process and insufficient antenna bandwidth.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an antenna structure, which includes a carrier, a switching circuit, a first radiating element and a second radiating element. The carrier includes a first bearing part and a second bearing part connected to each other. The thickness of the first bearing part is greater than the thickness of the second bearing part, and the second bearing part has a circuit layer and a ground layer. The circuit layer and the ground layer are respectively formed on the surfaces on opposite sides of the second bearing part. The switching circuit is located on the circuit layer on the second bearing part. The first radiating element is arranged on the carrier, and the first radiating element is electrically connected to a feeding element. The second radiating element is arranged on the carrier, and the second radiating element is electrically connected to the switching circuit, and the second radiating element and the first radiating element are separated from each other and coupled with each other.

[0007] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an electronic device, which includes a shell and an antenna structure arranged in the shell. The antenna structure includes a carrier, a switching circuit, a first radiating element and a second radiating element. The carrier includes a first bearing part and a second bearing part connected to each other. The thickness of the first bearing part is greater than the thickness of the second bearing part, and the second bearing part has a circuit layer and a ground layer. The circuit layer and the ground layer are respectively formed on the surfaces on opposite sides of the second bearing part. The switching circuit is located on the circuit layer on the second bearing part. The first radiating element is arranged on the carrier, and the first radiating element is electrically connected to a feeding element. The second radiating element is arranged on the carrier, and the second radiating element is electrically connected to the switching circuit, and the second radiating element and the first radiating element are separated from each other and coupled with each other.

[0008] One of the beneficial effects of the present invention is that the antenna structure and electronic device provided by the present invention can simplify the manufacturing process by directly placing the switching circuit, the first radiation element and the second radiation element on the carrier. In addition, the carrier provided by the present invention has different thickness areas, and the circuit layer and the ground layer can be formed on the second carrier portion with a thinner thickness to reduce the capacitance between the layers and increase the frequency deviation amplitude and the antenna bandwidth.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of an electronic device of the present invention.

[0011] Figure 2 FIG. 4 is a first stereoscopic schematic diagram of an antenna structure according to a first embodiment of the present invention.

[0012] Figure 3 It is a second stereoscopic schematic diagram of the antenna structure according to the first embodiment of the present invention.

[0013] Figure 4 for Figure 2 A partially enlarged schematic diagram of .

[0014] Figure 5 It is a side view schematic diagram of the antenna structure of the present invention.

[0015] Figure 6 FIG. 1 is a schematic diagram of an antenna structure according to a first embodiment of the present invention.

[0016] Figure 7 FIG. 4 is a schematic diagram of an antenna structure according to a second embodiment of the present invention.

[0017] Figure 8FIG. 4 is a schematic diagram of an antenna structure according to a third embodiment of the present invention.

[0018] Fig. 9 FIG. 4 is a graph showing the return loss of the antenna structure of the present invention in different operation modes.

[0019] Main component symbols:

[0020] D Electronic Devices

[0021] H Housing

[0022] M Antenna Structure

[0023] 1 Carrier board

[0024] 11. First bearing part

[0025] 12 Second bearing part

[0026] 121 First Surface

[0027] 122 Second Surface

[0028] 13 Circuit layer

[0029] 131 First Branch Road

[0030] 132 Second Branch Road

[0031] 14 Ground plane

[0032] 2 Switching circuit

[0033] 3. First radiating element

[0034] 31 First Radiation

[0035] 32 Grounding

[0036] 33 Feeding section

[0037] 34 Second Radiation

[0038] 4 Second radiator

[0039] 5 Proximity sensing circuit

[0040] 6 Control Circuit

[0041] 7 Floating radiator

[0042] P1 First conduction path

[0043] P2 Second conduction path

[0044] P3 The third conduction path

[0045] E1 First Passive Component

[0046] E2 Second passive component

[0047] E3 Third Passive Component

[0048] F Feedthrough

[0049] V Conductive via

[0050] R Resistor element

[0051] SW1 First switch

[0052] SW2 Second switch

[0053] SW3 The third switch

[0054] T1, T2 thickness

[0055] L1 First inductor element

[0056] L2 Second inductor element

[0057] C1 First capacitor element

[0058] CP1 First contact

[0059] CP2 Second contact

[0060] GP Coupling Gap DETAILED DESCRIPTION

[0061] The following is a specific embodiment to illustrate the implementation of the "antenna structure and electronic device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations, not depictions based on actual dimensions, and it is stated in advance. The following implementations will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, it should be understood that although the terms "first", "second", "third" and the like may be used in this article to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this article should include any one or more combinations of the associated listed items depending on the actual situation. In addition, the term “connect” in the present invention means that there is a physical connection between two elements and it can be a direct connection or an indirect connection, and the term “couple” in the present invention means that two elements are separated from each other and have no physical connection, but the electric field energy generated by the current of one element excites the electric field energy of another element.

[0062] [Example]

[0063] See also Figure 1 As shown, Figure 1 Schematic diagram of an electronic device of the present invention. The present invention provides an electronic device D, which includes a housing H and an antenna structure M disposed in the housing H. The electronic device D can be a smart phone, a tablet computer, or a laptop computer, but the present invention is not limited thereto. The present invention takes the electronic device D as an example of a laptop computer. In addition, the present invention is not limited to the number and position of the antenna structure M in the electronic device D.

[0064] See also Figure 2 , Figure 3 as well as Figure 5 As shown, the antenna structure M includes a carrier 1, a switching circuit 2, a first radiating element 3 and a second radiating element 4. The switching circuit 2, the first radiating element 3 and the second radiating element 4 are arranged on the carrier 1. In the present invention, the carrier 1 is not a substrate with a single thickness. The carrier 1 includes a first carrier portion 11 and a second carrier portion 12 connected to each other, and the thickness T1 of the first carrier portion 11 is greater than the thickness T2 of the second carrier portion 12. Preferably, the thickness T2 of the second carrier portion is between 0.6 mm and 1.6 mm.

[0065] See also Figure 4 and Figure 5 As shown, the second carrier 12 has a first surface 121 and a second surface 122 located on opposite sides. A circuit layer 13 is provided on the first surface 121, and a ground layer 14 is provided on the second surface 122. The second carrier 12 also has a plurality of conductive vias V, and the circuit layer 13 and the ground layer 14 are electrically connected through the plurality of conductive vias V. The specific number of the conductive vias V is at least 2, and the present invention is not limited to the specific number of the conductive vias V. Preferably, the minimum distance between two adjacent conductive vias is greater than or equal to 1.7 mm. The switching circuit 2 is disposed on the first surface 121 and located on the circuit layer 13. Specifically, the switching circuit 2 is composed of a portion of the circuit layer 13 and a plurality of circuit elements located thereon. For example, the switching circuit 2 may be a tuner (tuner IC), which preferably has at least 4 pins (not shown) to be electrically connected to the circuit layer 13. In addition, the present invention is not limited to the specific type of the first radiating element 3. For example, the first radiating element 3 may be a monopole antenna or a planar inverted F-type antenna. The first radiation element 3 is electrically connected to a feeding element F (the feeding element F can be referred to in detail in Figure 6 The second radiating element 4 is electrically connected to the switching circuit 2. A coupling gap GP of 0.2 mm to 0.4 mm is provided between the second radiating element 4 and the first radiating element 3, so that the second radiating element 4 and the first radiating element 3 are separated from each other and coupled to each other to generate at least one operating frequency.

[0066] It is also worth mentioning that, compared to the antenna carrier of the prior art which is a multi-layer circuit board (e.g., HDIPCB), the carrier 1 of the present invention is a single-layer board structure, and the circuit layer 13, the ground layer 14, the first radiating element 3 and the second radiating element 4 are formed on the carrier 1 by laser direct structuring (LDS). Laser direct structuring is to use a laser beam to carve out a circuit on the plastic surface, and then electroplating after the laser. After the circuit surface is metallized, a conductive circuit is formed. The specific manufacturing steps are: Step 1: First, the carrier 1 is formed by injection molding technology; Step 2: The circuit layer 13, the ground layer 14, the first radiating element 3 and the second radiating element 4 are formed on the surface of the carrier 1 by laser direct molding; Step 3: The circuit elements are soldered to the circuit layer 13 by reflow by surface mount technology (SMT); Step 4: The antenna structure M is formed by packaging molding.

[0067] The present invention uses a single-layer board as the carrier board 1 of the antenna, and forms the antenna structure M by laser direct forming technology. The overall manufacturing process can be further simplified compared with the prior art, thereby reducing the manufacturing cost. In addition, since the carrier board 1 is a single-layer board structure, the thickness of the carrier board 1 can be controlled to form a non-single thickness substrate. Therefore, the present invention can form a conductive through hole (thinner thickness, easier to form a through hole) in a thinner area of ​​the carrier board 1, that is, the second carrier part 12, and configure the switching circuit 2 in the second carrier part 12.

[0068] In addition, since the antenna carriers of the prior art are mostly multi-layer circuit board structures, and the distance between the ground layer and the circuit layer of the multi-layer circuit board structure is quite close, there is a higher capacitance between the two layers. In contrast, the present invention further controls the thickness T2 of the second carrier portion 12 in the range of 0.6mm to 1.6mm to increase the distance between the ground layer 14 and the circuit layer 13 to reduce the capacitance, thereby increasing the frequency deviation amplitude of the operating frequency generated by the antenna structure M, so that the operating frequency reaches a lower frequency (as low as 500MHz) mode, and at the same time improves the bandwidth.

[0069] See also Figure 6 As shown, Figure 6 FIG. 1 is a schematic diagram of the antenna structure of the first embodiment of the present invention. Figure 6 In the figure, the first radiating element 3 is a planar inverted-F antenna (PIFA). The first radiating element 3 includes a first radiating portion 31, a grounding portion 32 and a feeding portion 33. The grounding portion 32 is used for grounding, and the feeding portion 33 is electrically connected to the feeding element F. The first radiating portion 31 and the second radiating element 4 are separated from each other and coupled with each other. Further, the second radiating element 4 is electrically connected to the switching circuit 2, and the switching circuit 2 includes multiple conduction paths, each of which has a switching switch and a passive element. Therefore, the switching circuit 2 switches to different operating modes according to the switching states of different switching switches to adjust the bandwidth of the operating frequency band generated by the mutual coupling of the first radiating element 3 and the second radiating element 4.

[0070] For example, the switching circuit 2 includes a first conductive path P1, a second conductive path P2, and a third conductive path P3. The first conductive path P1 is connected in series with a first switch SW1 and a first passive element E1, the second conductive path P2 is connected in series with a second switch SW2 and a second passive element E2, and the third conductive path P3 is connected in series with a third switch SW3 and a third passive element E3. The first passive element E1, the second passive element E2, and the third passive element E3 can be resistors, capacitors, or inductors, respectively, but the present invention is not limited thereto. The electronic device D can adjust the operating frequency band, impedance matching, and / or radiation efficiency of the antenna structure M by using the configuration of the first passive element E1, the second passive element E2, and the third passive element E3.

[0071] Continue reading Figure 6 , the switching circuit 2 may include three operation modes, namely, a first mode, a second mode, and a third mode. The electronic device D may further include a control circuit 6. The control circuit 6 may control the switching circuit 2 to switch to one of the multiple modes to adjust the operating frequency band of the antenna structure M. Specifically, the first mode is that the first switching switch SW1 located on the first conductive path P1 is in a conductive state, while the second switching switch SW2 and the third switching switch SW3 located on the second conductive path P2 and the third conductive path P3 are in a non-conductive state; the second mode is that the second switching switch SW2 located on the second conductive path P2 is in a conductive state, while the first switching switch SW1 and the third switching switch SW3 located on the first conductive path P1 and the third conductive path P3 are in a non-conductive state; the third mode is that the third switching switch SW3 located on the third conductive path P3 is in a conductive state, while the first switching switch SW1 and the second switching switch SW2 located on the first conductive path P1 and the second conductive path P2 are in a non-conductive state.

[0072] See also Figure 7 and Figure 8 As shown, Figure 7 and Figure 8 Schematic diagrams of antenna structures according to the second embodiment and the third embodiment of the present invention respectively. Figure 7 and Figure 8 Different implementations of the first radiation element 3 are disclosed. Figure 7 In the embodiment, the first radiation element 3 is a monopole antenna, which includes a first radiation portion 31, a feeding portion 33 and a second radiation portion 34. Figure 8 In the embodiment, the first radiation element 3 is a monopole antenna, and further, the antenna structure further includes a floating radiation element 7. One end of the floating radiation element 7 extends between the second radiation portion 34 and the second radiation element 4.

[0073] See also Fig. 9 As shown, Fig. 9 is a graph of the return loss of the antenna structure of the present invention in different operating modes. For example, when the switching circuit 2 is switched to the first mode (Mode 1), the operating frequency band generated by the antenna structure M has a first center frequency. When the switching circuit 2 is switched to the second mode (Mode 2), the operating frequency band generated by the antenna structure M has a second center frequency. When the switching circuit 2 is switched to the third mode (Mode 3), the operating frequency band generated by the antenna structure M has a third center frequency. Fig. 9As shown, in the structural configuration where the switching circuit 2 is located on the second carrier portion 12, the present invention can adjust the center frequency of the operating frequency band by switching the switching circuit 2 to switch different transmission paths with different passive components, which can not only increase the bandwidth of the operating frequency band, but also increase the frequency deviation amplitude of the operating frequency band, so that the operating frequency band can reach a lower frequency mode (as low as 500MHz).

[0074] See also Figure 4 and Figure 6 , the circuit layer 13 includes a first branch 131 and a second branch 132. The first branch 131 has a first capacitor element C1 and a first inductor element L1 connected in series with each other. One end of the first branch 131 is connected to the second radiation element 4 at a first contact CP1, and the other end of the first branch 131 is a ground terminal G. The first branch 131 is connected to the switching circuit 2 at a second contact CP2, the first capacitor element C1 is connected in series between the first contact CP1 and the second contact CP2, and the first inductor element L1 is connected in series between the second contact CP2 and the ground terminal G. The electronic device D may also include a proximity sensing circuit 5, and the proximity sensing circuit 5 is electrically connected to the second branch 132. The second branch 132 has a second inductor element L2 and a resistor element R connected in series with each other, one end of the second branch 132 is connected to the first contact CP1, and the other end of the second branch 132 is connected to the proximity sensing circuit 5.

[0075] The present invention regards the second radiating element 4 as a sensing electrode (Sensorpad) through the setting of the proximity sensing circuit 5, so that the proximity sensing circuit 5 can measure the distance between the object (such as the user's legs or other parts) and the antenna structure M. In this way, the electronic device D can have the function of sensing whether the human body is close to the antenna structure M, and then adjust the radiation power of the antenna structure M to avoid the problem of excessive specific absorption rate (SAR) of electromagnetic wave energy per unit mass of the biological body. Further, when the second radiating element 4 is used as a sensing electrode in conjunction with the proximity sensing circuit 5, the combination of the first capacitor element C1 and the first inductor element L1 can be used as an isolator to isolate the proximity sensing circuit 5 from the switching circuit 2 to prevent the proximity sensing circuit 5 and the switching circuit 2 from interfering with each other during operation, and the combination of the second inductor element L2 and the resistor element R can be used as an RF choke to prevent the RF signal from flowing into the proximity sensing circuit 5.

[0076] [Beneficial Effects of Embodiments]

[0077] The antenna structure M and the electronic device D provided by the present invention can directly set the switching circuit 2, the first radiation element 3 and the second radiation element 4 on the carrier 1 by laser direct forming, so as to simplify the manufacturing process and reduce the manufacturing cost. In addition, the carrier 1 provided by the present invention is a single-layer board structure, which has different thickness areas, so the circuit layer 13 and the ground layer 14 of the present invention can be formed on the second carrier portion 12 with a thinner thickness to reduce the capacitance between the layers.

[0078] Furthermore, since the antenna carriers of the prior art are mostly multi-layer circuit board structures, and the spacing between the ground layer and the circuit layer of the multi-layer circuit board structure is quite close, there is a higher capacitance between the two layers. In contrast, the present invention further reduces the capacitance by controlling the thickness T2 of the second carrier portion 12 in the range of 0.6mm to 1.6mm to increase the distance between the ground layer 14 and the circuit layer 13. Thereby, in the structural configuration where the switching circuit 2 is located on the second carrier portion 12, the present invention can adjust the center frequency of the operating frequency band by switching the switching circuit 2 to switch different transmission paths with different passive components, which can not only increase the bandwidth of the operating frequency band, but also increase the frequency deviation amplitude of the operating frequency band, so that the operating frequency band can reach a lower frequency (as low as 500MHz) mode.

[0079] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the claims of the present invention.

Claims

1. An antenna structure, comprising: A carrier board, the carrier board includes a first carrier part and a second carrier part connected to each other, the thickness of the first carrier part is greater than the thickness of the second carrier part, the second carrier part includes a circuit layer and a ground layer, the circuit layer and the ground layer are respectively formed on surfaces of opposite sides of the second carrier part; a switching circuit, the switching circuit being located on the circuit layer on the second carrying portion; a first radiation element, the first radiation element being disposed on the carrier board and electrically connected to a feeding element; as well as A second radiation element is disposed on the carrier board and is electrically connected to the switching circuit. The second radiation element and the first radiation element are separated from each other and coupled to each other.

2. The antenna structure according to claim 1, wherein: The carrier board is a single-layer board structure, and the circuit layer, the ground layer, the first radiation element and the second radiation element are formed on the carrier board by laser direct forming.

3. The antenna structure according to claim 1, wherein: The thickness of the second supporting portion is between 0.6 mm and 1.6 mm.

4. The antenna structure according to claim 1, wherein: The second carrying portion has a plurality of conductive through holes for electrically connecting the circuit layer and the ground layer.

5. The antenna structure according to claim 4, wherein: The minimum distance between two adjacent conductive through holes is greater than or equal to 1.7 mm.

6. The antenna structure according to claim 1, wherein: The first radiating element is a planar inverted-F antenna.

7. The antenna structure according to claim 1, wherein: The switching circuit includes multiple conduction paths, each of which has a switching switch and a passive element; wherein the switching circuit is used to switch to different operating modes according to the switching states of the multiple switching switches to adjust the bandwidth of the operating frequency band generated by the mutual coupling of the first radiating element and the second radiating element.

8. The antenna structure according to claim 7, wherein: The operating band is in the low frequency range down to 500 MHz.

9. The antenna structure according to claim 1, wherein: The circuit layer includes a first branch, which has a first capacitor element and a first inductor element connected in series. One end of the first branch is connected to the second radiating element at a first contact, and the other end of the first branch is a ground end. The first branch is connected to the switching circuit at a second contact, the first capacitor element is connected in series between the first contact and the second contact, and the first inductor element is connected in series between the second contact and the ground end.

10. The antenna structure according to claim 9, wherein: The circuit layer also includes a second branch, which is electrically connected to a proximity sensing circuit. The second branch has a second inductor and a resistor connected in series. One end of the second branch is connected to the first contact, and the other end of the second branch is connected to the proximity sensing circuit.

11. An electronic device, comprising: a housing; as well as An antenna structure is disposed in the housing, and includes: A carrier board, the carrier board includes a first carrier part and a second carrier part connected to each other, the thickness of the first carrier part is greater than the thickness of the second carrier part, the second carrier part has a circuit layer and a ground layer, the circuit layer and the ground layer are respectively formed on surfaces of opposite sides of the second carrier part; a switching circuit, the switching circuit being located in the circuit layer; a first radiation element, the first radiation element is disposed on the carrier, and the first radiation element is electrically connected to a feeding element; and A second radiation element is disposed on the carrier board and is electrically connected to the switching circuit. The second radiation element and the first radiation element are separated from each other and coupled to each other.

12. The electronic device according to claim 11, wherein: The carrier board is a single-layer board structure, and the circuit layer, the ground layer, the first radiation element and the second radiation element are formed on the carrier board by laser direct forming.

13. The electronic device according to claim 11, wherein: The thickness of the second supporting portion is between 0.6 mm and 1.6 mm.

14. The electronic device according to claim 11, wherein: The second carrying portion has a plurality of conductive through holes for electrically connecting the circuit layer and the ground layer.

15. The electronic device according to claim 11, wherein: The first radiating element is a planar inverted-F antenna.

16. The electronic device according to claim 11, wherein: The switching circuit includes multiple conduction paths, each of which has a switching switch and a passive element; wherein the switching circuit is used to switch to different operating modes according to the switching states of the multiple switching switches to adjust the bandwidth of the operating frequency band generated by the mutual coupling of the first radiating element and the second radiating element.

17. The electronic device as claimed in claim 16, wherein: The operating band is in the low frequency range down to 500 MHz.

18. The electronic device according to claim 11, wherein: The circuit layer includes a first branch, which has a first capacitor element and a first inductor element connected in series. One end of the first branch is connected to the second radiating element at a first contact, and the other end of the first branch is a ground end. The first branch is connected to the switching circuit at a second contact, the first capacitor element is connected in series between the first contact and the second contact, and the first inductor element is connected in series between the second contact and the ground end.

19. The electronic device as described in claim 18 further includes a proximity sensing circuit, the circuit layer further includes a second branch, the proximity sensing circuit is electrically connected to the second branch, the second branch has a second inductor element and a resistor element connected in series, one end of the second branch is connected to the first contact, and the other end of the second branch is connected to the proximity sensing circuit.

Images