Packaging structure, laser and optical element

Abstract

The embodiment of the invention discloses a packaging structure, a laser and an optical element, the packaging structure comprises a PCB and at least one light-emitting module, the light-emitting module comprises at least two electrode blocks, and the electrode blocks are directly connected with the PCB; the light-emitting module comprises two electrode blocks and at least one chip, the chip is arranged between the two electrode blocks, the two sides of the chip are kept by the electrode blocks so as to fix the chip, and the light-emitting module is constructed in the mode that the electrode blocks keep the chip in the mode that an included angle is formed between the chip and the plane where the PCB is located. Therefore, the light emitting direction of the chip is not parallel to the plane where the PCB is located. Through the packaging structure, the parasitic inductance can be reduced, the heat dissipation capability can be enhanced, the chip deformation risk can be reduced, and in addition, the mechanical assembly difficulty can be improved, so that the assembly flexibility is enhanced.

Description

Technical Field

[0001] The present invention relates to the field of lasers, and in particular to a packaging structure, a laser and an optical element. Background Art

[0002] In terms of chip design and development, optoelectronic modules need to meet the growing demand for data communications, including the rapid development of the Internet of Things, big data and cloud computing. In order to achieve high bandwidth, high speed and large data transmission, chip design needs to adopt advanced high-speed circuit design technology. Technical measures such as optimizing signal transmission paths, reducing signal loss and reducing crosstalk are adopted to ensure fast transmission and accurate reception of signals at high frequencies.

[0003] The packaging of optoelectronic devices is crucial to the performance of optoelectronic modules. The packaging design needs to consider high-frequency response characteristics, low loss and high stability. During the packaging process, high-quality material selection and precise packaging technology can minimize the impact of electrical parasitic phenomena such as resistance, capacitance and inductance. At the same time, reasonable thermal management and protection measures also need to be considered to ensure the long-term stability and reliability of the optoelectronic module. In addition, module assembly technology also plays an important role in the performance of optoelectronic modules. High-density and high-integration module assembly can achieve optoelectronic modules with smaller size, higher performance and lower power consumption. The use of advanced micro-nano processing technology and micro-assembly technology, such as chip-level packaging, fiber alignment and micro-welding, can achieve high integration and efficient connection of optoelectronic modules, and improve overall performance and reliability.

[0004] In summary, the optimization and development of optoelectronic modules requires continuous efforts in chip design and development, optoelectronic device packaging and module assembly. By adopting advanced technologies and processes and continuously improving the design and manufacturing process, optoelectronic modules can better meet the growing demand for data communications and promote high-speed, efficient and reliable information transmission. Summary of the invention

[0005] The embodiments of the present invention are intended to provide a packaging structure, a laser, and an optical element, which can reduce parasitic inductance, enhance heat dissipation capability, reduce the risk of chip deformation, reduce micro-deformation between the light source and the optical shaping device, and improve the difficulty of mechanical assembly, thereby enhancing assembly flexibility.

[0006] The technical solution of the present invention is achieved in this way:

[0007] In a first aspect, an embodiment of the present invention provides a packaging structure, which includes a PCB board and at least one light-emitting module, wherein the light-emitting module includes: at least two electrode blocks, which are directly connected to the PCB board; at least one chip, which is arranged between the two electrode blocks, and both sides of the chip are held by the electrode blocks to fix the chip, and the light-emitting module is constructed so that the electrode blocks hold the chip at an angle to the plane where the PCB board is located, so that the light-emitting direction of the chip is not parallel to the plane where the PCB board is located.

[0008] Preferably, the light emitting module is constructed such that a single electrode block and a single chip are arranged at intervals.

[0009] Preferably, the electrode block and the chip are fixed by welding, bonding with conductive adhesive, or directly abutting.

[0010] Preferably, the electrode block is fixed to the PCB board by welding or bonding with conductive adhesive.

[0011] Preferably, the electrode block is fixed to the PCB board in a manner perpendicular to the plane where the PCB board is located.

[0012] Preferably, the packaging structure further comprises a protection module, which at least partially covers the light emitting module in the light emitting direction. The protection module can prevent the light emitting module from being damaged by dust and / or water vapor and oxidation of solder.

[0013] Preferably, the protection module is composed of transparent glue, and the transparent glue at least partially isolates the light-emitting module from the outside world in a wrapping manner. The transparent glue can meet high reliability requirements, reduce packaging costs, simplify the packaging process flow, and form any geometric shape after the transparent glue is cured to perform optical shaping on the light-emitting module.

[0014] Preferably, the protection module is constructed as an arc surface on the light-emitting surface of the light-emitting module. Under the above configuration, the transparent glue forms an arc surface protruding along the light-emitting direction on the light-emitting surface of the light-emitting module after solidification, and the light-emitting module is shaped by the arc surface.

[0015] In a second aspect, an embodiment of the present invention provides a laser, wherein the laser includes the above-mentioned packaging structure.

[0016] In a third aspect, an embodiment of the present invention provides an optical element, which includes the above-mentioned laser, and the optical element is used in fields such as automotive radar and optical communications.

[0017] The packaging structure reduces parasitic inductance by directly packaging the light-emitting module on the PCB board, and realizes the electrical performance of narrow pulse width and high peak power. At the same time, the electrode block inside the light-emitting module fixes the chip in a way of maintaining the two sides of the chip, and keeps the chip at an angle with the plane where the PCB board is located, so that the light-emitting direction is not parallel to the PCB board, so that the propagation direction of light can be better controlled, and a better light output effect can be provided, and the possibility of PCB board surface arrangement can be enriched. When the chip is perpendicular to the plane where the PCB board is located, the influence of the deformation of the circuit board on the chip can be avoided, and the optical pointing accuracy of the chip can be prevented from being affected by the deformation of the PCB board. In addition, the packaging structure can include multiple light-emitting modules, and a single light-emitting module can connect multiple chips in series, thereby improving the integration of the optoelectronic module, reducing the size and reducing the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of a COB packaging structure in the prior art;

[0019] Figure 2 A top view of a packaging structure according to an embodiment of the present invention;

[0020] Figure 3 is a top view of a packaging structure in another embodiment of the present invention, wherein the packaging structure includes three light-emitting modules;

[0021] Figure 4 A top view of the structure of a light emitting module in another embodiment of the present invention;

[0022] Figure 5 This is a top view of another packaging structure in another embodiment of the present invention, wherein the light emitting module and the PCB board form an angle of 60°;

[0023] Figure 6 This is a schematic diagram of a protection module covering a light-emitting module in an embodiment of the present invention;

[0024] Figure 7 A schematic diagram of another embodiment of the present invention in which a protection module is formed with an arc surface;

[0025] Figure 8 It is a schematic diagram of transparent glue filling the space where the laser beam travels in another embodiment of the present invention. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0027] In the prior art, in the field of optoelectronic modules, especially for optical element transmitting modules and optical communication active modules, the packaging of light-emitting chips often adopts COB (Chip-on-Board) packaging technology. Figure 1 , this packaging method directly sticks the chip on the substrate and connects the chip to the pins of the substrate through gold wire bonding. However, there is a problem with this packaging method, namely the generation of parasitic inductance. Parasitic inductance is generated due to the coil-like structure formed by the gold wire between the chip and the substrate. This will cause inductance loss and crosstalk during signal transmission, thereby affecting the high-frequency response and signal quality of the module. In order to reduce parasitic inductance, a series of process optimization measures have been taken in the prior art. One common method is to wire as much as possible or use ribbon leads for wire bonding during the packaging process of optoelectronic devices. By increasing the number of gold wires or using ribbon leads for connection, the length of the gold wire can be effectively reduced, thereby reducing the impact of parasitic inductance. Another common method is that the chip can first be connected to the ceramic board by welding or bonding technology, and then the ceramic board is connected to the substrate. This method can effectively reduce the length of the gold wire between the chip and the substrate, thereby reducing the impact of parasitic inductance.

[0028] It should be noted that although the above process can reduce parasitic inductance to a certain extent, the benefits are limited, and the process is complex, requiring higher manufacturing precision and cost investment. In addition, due to the limitations and restrictions of the packaging process itself, parasitic inductance cannot be completely eliminated. Theoretical calculations from the following formulas 1 to 2 show that in optoelectronic device packaging, even if the inductance is reduced by multiple wire bonding, there are certain limitations. Suppose we use the multiple wire bonding method to connect the chip and the substrate through 16 gold wires.

[0029] In optoelectronic module packaging, the gold wires usually used have a small diameter and a long length, which will introduce relatively high inductance. Even if the number of gold wires is increased to 16 by multi-wire bonding, the total inductance is still large. This is because in optoelectronic modules, the requirements for high-frequency signal transmission and fast signal response are very strict, and the impact of inductance is more sensitive.

[0030]

[0031]

[0032] Among them, this formula is used to calculate the approximate formula of hollow cylindrical inductance. Conventional packaging is wire bonding, and electrical connection is made by wire bonding. Therefore, Formula 1 establishes a wire inductance model, where L represents the value of inductance, d represents the length of the gold wire, and r represents the diameter of the gold wire. Another method is to reduce the length of the wire bonding by using a ceramic plate transition.

[0033] Secondly, see Appendix Figure 1 Due to the characteristics of edge-emitting light, in order to avoid the edge-emitting light being blocked by the PCB or causing a blocking effect, the laser chip usually needs to be mounted on the edge area of ​​the PCB so that the light can be transmitted along the adjacent Figure 1 The light is emitted in the direction indicated by the arrow in . This limitation of edge mounting leads to some problems. First, this layout method limits the two-dimensional integration capability of the chip. In the COB packaging method, each chip needs to occupy a certain space, and an edge area needs to be reserved to ensure the free propagation of the emitted light. Therefore, it is impossible to achieve a compact layout of multiple chips on the surface of the PCB board, which limits the integration and further reduction of the size of the optoelectronic module. In addition, edge mounting also has an adverse effect on the flexibility of subsequent optical and mechanical assembly. Since the chip is located in the edge area, the spatial relationship with other components or assemblies is limited, which makes the layout and adjustment of subsequent optical shaping devices (such as lenses, polarizers, etc.) complicated. At the same time, during the mechanical assembly process, edge-mounted chips are easily affected by external physical forces and environmental conditions, which may increase the difficulty and risk of assembly.

[0034] In the COB packaging method, another thing to consider is the heat dissipation of the chip. Since the laser chip generates a lot of heat during operation, as the heat accumulates, the relative deformation sensitivity of the edge-mounted chip and the optical shaping device will increase. The chip set at the edge emits light along the PCB. The emitted light needs to be aligned with the optical shaping device to obtain the desired shaping. Due to the arrangement position of the chip, the higher the heat, the greater the deformation of the PCB board. The PCB board will be affected by the heat, causing the board to expand and contract, which is the so-called thermal deformation. The chip is affected by the thermal deformation of the PCB board, and stretching, compression or bending, etc., which is reflected in the effect of the deflection of the light emission angle of the chip. It becomes more and more obvious, resulting in the inability to align the chip with the optical shaping device or damage to the metal wires and transistors. Among them, the limiting factors of the heat dissipation path include the contact area between the chip and the PCB board and the thermal conductivity of the heat dissipation medium. These limitations lead to relatively low heat dissipation efficiency. Inefficient heat dissipation may cause the junction temperature of the chip to increase, thereby reducing the photoelectric conversion efficiency and shortening the working life of the chip. In addition, current technology often uses heat sinks, radiators and other devices to improve the heat dissipation problem, but their effects are mixed and still cannot improve the problem of chip shape deformation and position deformation caused by heating of the PCB board.

[0035] In the first aspect, based on the above technical problem, an embodiment of the present invention provides a packaging structure 10, see the attached Figure 2The packaging structure 10 includes a PCB board 1 and a light-emitting module 2. The PCB board 1 is made of insulating material and has a conductive path printed on the surface for supporting and connecting electronic components. The light-emitting module 2 is directly mounted on the PCB board 1 and electrically connected to the conductive path to excite itself to generate laser. The light-emitting module 2 effectively reduces electrical parasitics by being directly mounted on the PCB board 1. The light-emitting module 2 can be modularly manufactured into a plurality of modules arranged on the PCB board 1 to improve the design and simple scalability of the packaging structure 10. The plurality of light-emitting modules 2 on the PCB board 1 can be independently controlled or integratedly controlled, thereby realizing flexible adjustment and expansion of system functions and performances. For example, see the attached Figure 3 The number of the light emitting modules 2 is three, and three light emitting modules 2 are arranged on the PCB board 1. Each of the light emitting modules 2 can be independently controlled. In another embodiment of the present invention, the three light emitting modules 2 can be uniformly controlled by the circuit control element on the PCB board 1.

[0036] Specifically, see Appendix Figure 2 To Attachment Figure 5 The light emitting module 2 includes at least two electrode blocks 21 and at least one chip 22, see the attached Figure 2 , which shows a top view of the package structure 10, the number of the electrode blocks 21 is two, and the number of the chip 22 is one. The chip 22 is arranged between the two electrode blocks 21, and at the same time, the electrode block 21 is fixedly connected to the side of the chip 22, so that the chip 22 is clamped and fixed by the two electrode blocks 21, and the electrode block 21 is directly connected to the circuit on the PCB board 1 to form a current path. Under the above configuration, the electrode blocks 21 arranged on both sides of the chip 22 serve as the positive and negative electrodes of the chip 22, and excite the chip 22 to generate laser. See the attached Figure 2 To Attachment Figure 5 , the electrode block 21 holds the chip 22 by clamping, so that the plane where the chip 22 is located is at an angle to the plane where the PCB board 1 is located. It should be noted that, here, "at an angle" means that the plane where the chip 22 is located and the plane where the PCB board 1 is located have an angle of 0°-180° (excluding 0° and 180°). It can be understood that the purpose of the above "the plane where the chip 22 is located is at an angle to the plane where the PCB board 1 is located" is to make the light emitting direction of the chip 22 non-parallel to the plane where the PCB board 1 is located, see the attached Figure 2 , in the attached Figure 2In the configuration of the light-emitting module 2 shown, the emitting light direction of the light-emitting module 2 is shown as the direction P in the figure, wherein the two electrode blocks 21 are perpendicular to the PCB board 1, and the chip 22 is maintained perpendicular to the PCB board 1 so that the emitting light direction of the chip 22 is perpendicular to the plane where the PCB board 1 is located.

[0037] For example, see the attached Figure 5 , which shows a front view of the packaging structure 10 in another embodiment of the present invention, wherein the two sides of the chip 22 are still clamped by the electrode blocks 21, and the plane where the chip 22 is located and the plane where the PCB board 1 is located are at an angle α, see the attached Figure 5 , the angle α is 60°. In this configuration, the angle between the light emission direction of the chip 22 and the plane where the PCB board 1 is located is 60°.

[0038] In the above configuration, the chip 22 is clamped by the electrode block 21, and the clamped chip 22 has an angle with the plane where the PCB board 1 is located, so that the light-emitting surface of the chip 22 is not perpendicular to the PCB board 1, and the light-emitting direction of the chip 22 is not parallel to the PCB board 1. The chip 22 is fixed and held by the electrode block 21 directly connected to the PCB board 1, and is also electrically connected to the PCB board 1 through the electrode block 21. The structure packaged in the above manner can effectively reduce electrical parasitics. See Formula 2. Since two electrode blocks are used in the above packaging configuration, it is closer to the inductance calculation model of the PCB board wiring. Therefore, Formula 2 uses the calculation model of the circuit board wiring inductance, where L is the length of the electrode block and W is the width of the electrode block. It can be seen that the parasitic inductance introduced in this embodiment is reduced by nearly 14% compared with the ordinary COB package, thereby obtaining a narrower pulse width, smaller rise and fall time, and a higher peak power in the pulse for the same average power.

[0039]

[0040] Through the above configuration, the light emitting direction of the chip 22 is not parallel to the plane where the PCB board 1 is located, and there is no need to worry about the components on the PCB board 1 affecting the light path. Therefore, the light emitting module 2 does not need to be set in the edge area of ​​the PCB board 1. The light emitting module 2 can emit light in a manner that is not parallel to the plane where the PCB board 1 is located, and the emitted light is not affected by the components on the PCB board 1. Therefore, the light emitting module 2 can be set at any position on the PCB board 1 so that a compact layout of multiple chips 22 can be achieved on the PCB board 1. Further, the size of the optoelectronic module can also be reduced. In addition, since the light emitting module 2 can be set at any position on the PCB board 1 without restriction, other optical devices on the PCB board 1 for receiving and processing light can also be flexibly arranged, reducing the difficulty of layout and assembly.

[0041] Through the above configuration, both sides of the chip 22 can dissipate heat to enhance the heat dissipation effect of the package structure 10, thereby improving the reliability and service life of the chip 22. Compared with the package structure of the parallel patch light source structure, the package structure 10 makes the relative deformation between the chip 22 and the optical shaping device smaller, reducing the sensitivity of the deformation between the chip 22 and the light source.

[0042] In another embodiment of the present invention, a single light emitting module 2 includes at least one chip 22 and at least two electrode blocks 21. Figure 4 The number of the chips 22 is three, the number of the electrode blocks 21 is four, the chips 22 and the electrode blocks 21 are arranged at intervals, and the series connection of multiple chips 22 is achieved through the above configuration, wherein a common electrode block 21 is arranged between two adjacent chips 22, and the common electrode block 21 is used to provide current to the above two adjacent chips 22 at the same time.

[0043] In a preferred embodiment of the present invention, the chip 22 emits light in a manner perpendicular to the plane where the PCB board 1 is located. Figure 2 To Attachment Figure 4 The electrode block 21 is fixed on the upper surface of the PCB board 1 in a manner perpendicular to the plane where the PCB board 1 is located. The two electrode blocks 21 clamp the chip 22 so that the plane where the chip 22 is located is parallel to the clamping surface of the electrode block 21, and thus perpendicular to the plane where the PCB board 1 is located. The light emitting surface of the chip 22 is parallel to the PCB, and the emitted light of the chip 22 is perpendicular to the PCB board 1. By making the light emitting direction of the chip 22 perpendicular to the plane of the PCB board 1, the propagation direction of the light can be better controlled and a better light output effect can be provided. The clamping of the electrode block 21 on the chip 22 enables both surfaces of the chip 22 to be firmly clamped, ensuring the stability of current transmission.

[0044] In addition, the electrical connection between the electrode block 21 and the PCB board 1 can be established by conductive adhesive bonding or welding. The above method can ensure a more stable and reliable packaging structure 10, and can also achieve electrical connection. Similarly, the electrode block 21 and the chip 22 are also electrically connected by the above conductive adhesive bonding or welding. In another embodiment of the present invention, the electrode block 21 and the chip 22 can also be fixed and electrically connected by directly clamping, using two electrode blocks 21 to abut the two sides of the chip 22. The method of directly abutting the two sides of the chip 22 is conducive to assembly, can simplify the difficulty of assembly, and also helps to excite the laser.

[0045] In an embodiment of a packaging structure disclosed in the present invention, a PCB board 1 and a light-emitting module 2 are included. The light-emitting module 2 includes two electrode blocks 21 and a chip 22. The two electrode blocks 21 hold the chip 22 by clamping the two side surfaces of the chip 22. Under the above configuration, the two electrode blocks 21 arranged on both sides of the chip 22 serve as the positive and negative electrodes of the light-emitting module 2. In order to reduce parasitic inductance, the chip 22 is a bare photon chip, and the two electrode blocks 21 directly clamp the bare photon chip. By directly clamping the bare photon chip, the parasitic inductance and thermal resistance can be effectively reduced. However, the bare chip is exposed to the external environment and is easily affected by impurities such as dust and water vapor and fails in a short period of time. Moreover, the solder between the electrode block 21 and the chip 22 will also be oxidized by air, resulting in reduced reliability of the packaging structure. Based on this, the packaging structure disclosed in the present invention also includes a protection module 3, which isolates the light-emitting module 2 from the outside world by wrapping the light-emitting module 2. By setting the protection module 3 to partially cover the light-emitting module 2, the setting process of the protection module 3 can be simplified. The protection module 3 can also wrap a part of the light-emitting module 2 to reduce the packaging cost and improve the ability of the packaging module to adapt to harsh working environments.

[0046] See attached Figure 6, which shows a schematic diagram of a protective module 3 covering a light-emitting module 2 in an embodiment of the present invention, wherein the light-emitting module 2 includes two electrode blocks 21 and a chip 22, and the light-emitting module 2 is vertically arranged on a PCB board 1 to form a packaging structure, and the light-emitting module 2 is isolated from the outside world under the cover of the protective module 3, wherein the transparent glue constituting the protective structure completely covers the light-emitting module 2, and the light-emitting module 2 is completely immersed in the transparent glue to achieve good air tightness, and has waterproof, moisture-proof and dust-proof effects. It should be noted that when the protective module 3 partially covers the light-emitting module 2, the protective module 3 can only cover the upper half of the light-emitting module 2 to well protect the bare photon chip, and can also save costs and simplify the process flow. In other embodiments, the protective module 3 can also only wrap the lower half of the light-emitting module 2, thereby protecting the side of the bare photon chip and ensuring the light-emitting effect of the chip 22. In another embodiment of the present invention, when the angle between the light emitting module 2 and the PCB board 1 is between 0-180° and is not 90°, when the protection module 3 partially or completely wraps the light emitting module 2, the direction of attachment is the light emitting direction of the light emitting module.

[0047] Preferably, the protection module 3 is formed by pouring unsolidified, flowable transparent glue over the top of the light emitting module 2 and then solidifying. The protection module 3 can provide good protection for the light emitting module 2 to protect it from external impurities such as dust and water vapor. The transparent glue is an insulating glue with high thermal conductivity, high transmittance, and high temperature resistance. It can adapt to different output powers and working environments at various temperatures. It can play a certain role in heat conduction and cooling the light emitting module 2 to prevent the light emitting module 2 from heating up under high power. Among them, the transparent glue is preferably made of one of epoxy resin, silicone and thermosetting plastic, and the transparent glue preferably has a light transmittance greater than 95%.

[0048] In a preferred embodiment of a packaging structure disclosed in the present invention, the transparent glue can form an optical window for light to pass through after solidification, and the transparent glue can be formed into any geometric shape through a mold, thereby optically shaping the laser beam emitted by the light emitting module 2. Figure 7 The protection module 3 still completely wraps the light emitting module 2. The protection module 3 forms a circular arc surface protruding along the light emitting direction on the light emitting surface of the light emitting module 2. The circular arc surface is formed after the transparent glue solidifies with the assistance of a corresponding mold. Through the corresponding mold design, a circular arc surface for shaping different laser beams can be obtained. Figure 7In the embodiment shown, the light emitting module 2 is perpendicular to the PCB board 1. When the angle between the light emitting module 2 and the PCB board 1 is between 0-180° and is not 90°, the arc surface is not formed in a horizontal plane, but is formed on the light emitting surface of the light emitting module 2 and bulges along the light emitting direction. It should be noted that in other embodiments, the transparent glue can be configured to only wrap the light emitting end of the light emitting module 2. Preferably, the transparent glue completely wraps the entire length of the chip 22 along the length direction of the light emitting module 2.

[0049] Preferably, see Appendix Figure 8 , which shows a schematic diagram of when the transparent glue fills the space between the light-emitting module and the optical shaping device 4. When the transparent glue fills the space between the light-emitting surface of the light-emitting module 2 and the next optical shaping device 4 for processing the laser beam, there is no air intervention in the space, which can effectively reduce the loss of laser emission.

[0050] In a second aspect, an embodiment of the present invention further provides a laser, which includes the packaging structure 10 according to the first aspect.

[0051] In a third aspect, an embodiment of the present invention further provides an optical element, comprising the laser according to the second aspect.

[0052] It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict.

[0053] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A packaging structure, comprising a PCB board and at least one light-emitting module, characterized in that: The light emitting module comprises: At least two electrode blocks, wherein the electrode blocks are directly connected to the PCB board; At least one chip is arranged between the two electrode blocks, and both sides of the chip are held by the electrode blocks to fix the chip, and the light-emitting module is constructed so that the electrode blocks hold the chip at an angle to the plane where the PCB board is located, so that the light emitting direction of the chip is not parallel to the plane where the PCB board is located.

2. The packaging structure according to claim 1, characterized in that: The light emitting module is constructed such that a single electrode block and a single chip are arranged at intervals.

3. The packaging structure according to claim 1, characterized in that: The electrode block and the chip are fixed by welding, bonding with conductive adhesive or directly abutting.

4. The packaging structure according to claim 1, characterized in that: The electrode block is fixed to the PCB board by welding or conductive adhesive bonding.

5. The packaging structure according to claim 1, characterized in that: The electrode block is fixed to the PCB in a manner perpendicular to the plane where the PCB is located.

6. The packaging structure according to claim 1, characterized in that: The packaging structure further includes a protection module, which at least partially covers the light emitting module in the light emitting direction.

7. The packaging structure according to claim 6, characterized in that: The protection module is made of transparent glue, and the transparent glue at least partially isolates the light-emitting module from the outside in a wrapping manner.

8. The packaging structure according to claim 6, characterized in that: The protection module is configured as an arc surface on the light emitting surface of the light emitting module.

9. A laser, characterized in that: The laser comprises the packaging structure according to any one of claims 1 to 8.

10. An optical element, characterized in that: The optical element comprises the laser of claim 9.

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