Manufacturing process of flexible circuit board with any length

Abstract

The invention discloses a manufacturing process of a flexible circuit board with any length, and relates to the technical field of flexible circuit boards. Comprising the steps that punching operation is conducted on a roll material base material to obtain reference holes, and the reference holes comprise a punching positioning hole and a reference exposure punching positioning hole; symmetrically punching first exposure punching positioning holes backwards based on the reference exposure punching positioning hole and a set distance; symmetrically punching an Nth exposure punching positioning hole backwards based on an (N-1) th exposure punching positioning hole and a set distance; carrying out dry film pressing-film exposure operation on the punched coiled material base material; developing the exposed coiled material base material, and removing the dry film of the exposed part through film stripping operation to form a required circuit; and after the etched circuit is subjected to chemical tinning surface treatment, positioning by using a punching positioning hole, and sequentially punching by using a die to obtain the ultra-long flexible printed circuit (FPC) with the required width. According to the process, the flexible circuit board with any length can be manufactured according to specific requirements of customers, and the production convenience and efficiency are improved.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit boards, and in particular to a manufacturing process for a flexible circuit board of any length. Background Art

[0002] Ultra-long flexible circuit boards are made of polymer materials such as polyimide (PI) and polyester (PET) as substrates, combining conductive circuits, insulating layers and components to form electronic connection devices with specific functions. The length can be customized according to actual needs, usually far exceeding the length of ordinary flexible circuit boards.

[0003] With the continuous advancement of science and technology and the increasing demand for the portability and aesthetics of electronic products, the market prospects of ultra-long flexible circuit boards are very broad. Especially driven by emerging technologies such as 5G, Internet of Things, and artificial intelligence, the demand for flexible circuit boards in various electronic devices will continue to grow. At the same time, in high-end fields such as new energy vehicles and aerospace, the market demand for ultra-long flexible circuit boards will also continue to grow.

[0004] Although the market prospects for ultra-long flexible circuit boards are broad, they also face some challenges. For example, flexible circuit boards are usually manufactured using an intermittent process, which is limited by the size of the production equipment. Therefore, when making ultra-long flexible circuit boards, you may encounter the problem that the production equipment cannot meet the requirements, thereby limiting the length and width of their production. The existing ultra-long flexible circuit boards on the market generally have the characteristics of wide line width (usually above 0.5mm) and relatively simple design graphics (mainly limited to straight line routing). The manufacturing process of existing ultra-long flexible circuit boards is relatively complicated and requires high-precision equipment and processes, which leads to relatively low production efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a manufacturing process for a flexible circuit board of any length, which allows a flexible circuit board of any length to be obtained according to actual needs, and the circuit has no gaps, thereby realizing automated production, improving production efficiency and reducing production costs.

[0006] To achieve the above objectives, the present application proposes a manufacturing process for a flexible circuit board of any length, comprising:

[0007] Punching the coil substrate to obtain reference holes, the reference holes including punching positioning holes and reference exposure punching positioning holes;

[0008] Punching the first exposure punching positioning hole symmetrically backwards based on the reference exposure punching positioning hole and the set distance, and then pulling the coil substrate forwards;

[0009] Punching a second exposure punch-shaped positioning hole symmetrically backward based on the first exposure punch-shaped positioning hole and the set distance, and then pulling the coil substrate forward;

[0010] Punching a third exposure punch-shaped positioning hole symmetrically backward based on the second exposure punch-shaped positioning hole and the set distance, and then pulling the coil substrate forward;

[0011] …

[0012] Punch the Nth exposure punching positioning hole symmetrically backward based on the N-1th exposure punching positioning hole and the set distance, and then pull the coil substrate forward;

[0013] Perform dry film pressing and film exposure operations on the perforated coil substrate;

[0014] The exposed coil substrate is developed to remove the unexposed dry film, and then the copper foil without dry film protection is etched away. Then, the exposed dry film is removed by stripping to form the required circuit.

[0015] After the etched circuit is subjected to chemical tin plating surface treatment, it is positioned using punching positioning holes and punched out in sequence through a mold to obtain an ultra-long flexible circuit board FPC of the required width.

[0016] In one embodiment, the reference hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, the third exposure punch-shaped positioning hole, ..., the Nth exposure punch-shaped positioning hole are symmetrically arranged on both sides of the coil substrate.

[0017] In one embodiment, the film is provided with a non-exposure area and an exposure area, and the pattern of the exposure area matches the desired circuit shape.

[0018] In one embodiment, the reference holes are obtained by punching holes in the coil substrate using a roll-to-roll laser machine.

[0019] In one embodiment, the circuit includes a plurality of sections, each section has the same shape and is formed by the same film.

[0020] In one embodiment, an overlapping film exposure area is formed between two adjacent film exposures.

[0021] In one embodiment, when performing the dry film pressing-film exposure operation, the exposure identification hole and the exposure punch positioning hole of the film are used to perform alignment exposure.

[0022] In one embodiment, the punching positioning hole is located at the head end of the coil substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole.

[0023] In one embodiment, the distances between adjacent exposure punch-shaped positioning holes are the same.

[0024] In one embodiment, the reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each line segment.

[0025] Compared with the prior art, the above technical solution adopted by the present invention has the following advantages:

[0026] 1) This process can produce flexible circuit boards of any length according to the specific needs of customers, improving the convenience and efficiency of production.

[0027] 2) The circuit obtained by this process is gap-free, ensuring that users can cut it into any required length for use without affecting the integrity and performance of the circuit.

[0028] 3) The line width spacing of the circuit can be adjusted according to actual needs, and the width can even reach a level of precision of about 0.1 mm, allowing the product to meet a variety of application scenarios and performance requirements.

[0029] 4) It can correspond to any complex routing shape, further broadening the application scope of coil substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the coil substrate structure;

[0031] Figure 2 It is a schematic diagram of the film structure;

[0032] Figure 3 It is a schematic diagram of the coil substrate after exposure;

[0033] Figure 4 This is a schematic diagram of an ultra-long flexible circuit board;

[0034] Among them: 1. reference hole, 2. first exposure punch-shaped positioning hole, 3. second exposure punch-shaped positioning hole, 4. exposure identification hole, 5. non-exposure area, 6. exposure area, 7. film exposure overlapping area. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0038] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] Example 1

[0041] See also Figure 1 This embodiment provides a flexible circuit board obtained by the above-mentioned manufacturing process, which specifically includes:

[0042] The reference holes are used for positioning and drilling identification, and are symmetrically arranged on both sides of the head end of the coil substrate; the reference holes include a punching positioning hole and a reference exposure punching positioning hole, wherein the punching positioning hole is located at the head end of the coil substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole;

[0043] The first exposure punch-shaped positioning hole is used for positioning and drilling identification, which is located behind the reference hole and symmetrically arranged on both sides of the coil substrate;

[0044] The second exposure punch-shaped positioning hole is used for positioning and drilling identification, and is located behind the first exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0045] The third exposure punch-shaped positioning hole is used for positioning and drilling identification, which is located behind the second exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0046] …

[0047] The Nth exposure punch-shaped positioning hole is used for positioning and drilling identification, which is located behind the N-1th exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0048] The distances between the adjacent exposure punch-shaped positioning holes are the same;

[0049] The circuit is formed by pressing a dry film, exposing a film, and etching on a coil substrate; the circuit includes several sections, each section has the same shape and is formed by the same film, such as Figure 2 As shown, the film is provided with a non-exposure area and an exposure area, the pattern of the exposure area matches the required line shape, and the pattern of the exposure area is not limited by line width and line shape.

[0050] As a preferred implementation provided in this embodiment, Figure 3 As shown, a film exposure overlap area is formed between adjacent circuits, and the overlap size may be about 0.1 mm to ensure the continuity of the circuits.

[0051] As a preferred implementation mode provided in this embodiment, exposure identification holes are symmetrically arranged on both sides of the film, and when the coil substrate is exposed, they are concentrically aligned with each exposure punch-shaped positioning hole.

[0052] As a preferred implementation manner provided in this embodiment, the reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each line segment.

[0053] Example 2

[0054] This embodiment provides a manufacturing process of a flexible circuit board of any length, including:

[0055] First, a roll-to-roll laser machine is used to punch holes in a roll material substrate to obtain reference holes, wherein the reference holes include a punching positioning hole and a reference exposure punching positioning hole;

[0056] Punching two first exposure punching holes backwards based on the reference exposure punching holes and the set distance, and then pulling the coil substrate forwards;

[0057] Punching two second exposure punching positioning holes backwards based on the first exposure punching positioning hole and the set distance, and then pulling the coil substrate forward;

[0058] Punching two third exposure punching holes backwards based on the second exposure punching holes and the set distance, and then pulling the coil substrate forwards;

[0059] …

[0060] Punching two Nth exposure punching positioning holes backward based on the N-1th exposure punching positioning hole and the set distance, and then pulling the coil substrate forward;

[0061] The perforated coil substrate is pressed dry and exposed to film. The exposure identification hole and the exposure punch positioning hole of the film are used for alignment exposure. The overlap between two adjacent exposures of the film is 0.1mm to ensure the continuity of the final circuit.

[0062] The exposed coil substrate is developed to remove the unexposed dry film, and then the copper foil without dry film protection is etched away. Then, the exposed dry film is removed by stripping to form the required circuit.

[0063] After the etched circuit is treated with chemical tin plating, the positioning holes are used for positioning and the mold is used for punching and cutting in sequence to obtain the ultra-long flexible circuit board FPC of the required width, such as Figure 4 shown.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A process for manufacturing a flexible circuit board of any length, characterized in that: include: Punching the coil substrate to obtain reference holes, the reference holes including punching positioning holes and reference exposure punching positioning holes; Punching the first exposure punching positioning hole symmetrically backwards based on the reference exposure punching positioning hole and the set distance, and then pulling the coil substrate forwards; Punching a second exposure punch-shaped positioning hole symmetrically backward based on the first exposure punch-shaped positioning hole and the set distance, and then pulling the coil substrate forward; Punching a third exposure punch-shaped positioning hole symmetrically backward based on the second exposure punch-shaped positioning hole and the set distance, and then pulling the coil substrate forward; …… Punch the Nth exposure punching positioning hole symmetrically backward based on the N-1th exposure punching positioning hole and the set distance, and then pull the coil substrate forward; Perform dry film pressing and film exposure operations on the perforated coil substrate; The exposed coil substrate is developed to remove the unexposed dry film, and then the copper foil without dry film protection is etched away. Then, the exposed dry film is removed by stripping to form the required circuit. After the etched circuit is subjected to chemical tin plating surface treatment, it is positioned using punching positioning holes and punched out in sequence through a mold to obtain an ultra-long flexible circuit board FPC of the required width.

2. A process for manufacturing a flexible circuit board of any length according to claim 1, characterized in that: The reference hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, the third exposure punch-shaped positioning hole, ..., the Nth exposure punch-shaped positioning hole are symmetrically arranged on both sides of the coil substrate.

3. The manufacturing process of a flexible circuit board of any length according to claim 1, characterized in that: The film is provided with a non-exposure area and an exposure area, and the pattern of the exposure area matches the required circuit shape.

4. The manufacturing process of a flexible circuit board of any length according to claim 1, characterized in that: The reference holes are obtained by punching holes in the coil base material using a roll-to-roll laser machine.

5. The manufacturing process of a flexible circuit board of any length according to claim 1, characterized in that: The circuit includes several sections, each section has the same shape and is formed by the same film.

6. The manufacturing process of a flexible circuit board of any length according to claim 1, characterized in that: An overlapping film exposure area is formed between two adjacent film exposures.

7. The process for manufacturing a flexible circuit board of any length according to claim 1, characterized in that: When performing the dry film pressing and film exposure operation, the exposure identification hole and the exposure punch positioning hole of the film are used for registration exposure.

8. The process for manufacturing a flexible circuit board of any length according to claim 1, characterized in that: The punching positioning hole is located at the head end of the coiled material substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole.

9. The process for manufacturing a flexible circuit board of any length according to claim 1, characterized in that: The distances between adjacent exposure punch-shaped positioning holes are the same.

10. The process for manufacturing a flexible circuit board of any length according to claim 1, characterized in that: The reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each circuit segment.

Images