Ceramic substrate and preparation method thereof

Abstract

The invention provides a preparation method of a ceramic substrate, which comprises the steps that a ceramic plate body is clamped in a clamping area of a carrier plate, a plurality of mounting bulges and a plurality of elastic clamping pieces are arranged in the circumferential direction of the clamping area at intervals, each elastic clamping piece comprises an elastic piece and a cavity foam block, one end of the elastic piece is connected to the cavity foam block, and the other end of the elastic piece is connected to the carrier plate; the other ends of the elastic pieces are connected to the corresponding installation protrusions, and the cavity foam blocks are used for abutting against the outer side wall of the ceramic plate body. Carrying out micro-etching roughening treatment on the ceramic plate body; carrying out ABF pressing treatment operation on the ceramic plate to obtain a ceramic substrate semi-finished product; performing laser drilling operation on the ceramic substrate semi-finished product; and performing pattern manufacturing operation on the ceramic substrate semi-finished product. According to the preparation method, the problem that the periphery of the ceramic substrate is easily etched uncleanly is solved, and the etching uniformity and thoroughness of the ceramic substrate are effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a ceramic substrate and a preparation method thereof. Background Art

[0002] In the manufacturing process of printed circuit boards, ceramic substrates are widely used in high-power, high-frequency electronic products due to their excellent thermal conductivity, mechanical strength and stable electrical properties. The manufacturing process of ceramic substrates also faces many technical challenges, one of which is the problem of incomplete etching. The etching process is to remove excess metal copper through chemical solutions to form a precise circuit pattern.

[0003] The periphery of the ceramic substrate is clamped by a clamping area reserved in the FR4 substrate, that is, there are multiple clamping protrusions in the clamping area in the FR4 substrate, and the multiple clamping protrusions are clamped and fixed along the periphery of the ceramic substrate to perform the etching step. Figure 1 As shown, when etching is performed on a ceramic substrate, due to the chemical inertness and surface characteristics of the ceramic material itself, it is difficult for the etching solution to evenly penetrate all parts of the substrate, especially the periphery of the ceramic substrate and the clamping and fixing parts of the clamping protrusions (such as Figure 1 The circle shown in the figure makes it easy for the periphery of the ceramic substrate to be etched incompletely.

[0004] This incomplete etching phenomenon will cause the residual copper foil to affect the conductivity and signal integrity of the circuit, further causing electrical faults such as short circuits and impedance mismatches. Therefore, how to effectively improve the uniformity and thoroughness of etching of ceramic substrates has become an important issue that needs to be urgently solved in the current PCB manufacturing technology field. Summary of the invention

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a ceramic substrate and a preparation method thereof that can effectively improve the uniformity and thoroughness of etching of the ceramic substrate.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] A method for preparing a ceramic substrate, comprising:

[0008] Clamp the ceramic plate body in the clamping area of ​​the carrier plate, wherein the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at intervals in the circumferential direction, each of the elastic clamping members comprises an elastic member and a cavity foam block, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, and the cavity foam block is used to abut against the outer side wall of the ceramic plate body;

[0009] Performing micro-etching and roughening treatment on the ceramic plate;

[0010] Performing ABF pressing on the ceramic plate to obtain a semi-finished ceramic substrate;

[0011] Performing a laser drilling operation on the semi-finished ceramic substrate;

[0012] A pattern making operation is performed on the semi-finished ceramic substrate.

[0013] In one embodiment, the mounting protrusion is provided with a connected sliding groove and an opening groove, the cross-sectional area of ​​the sliding groove is larger than the cross-sectional area of ​​the opening groove, the elastic member is located in the sliding groove, one end of the elastic member is fixed to the inner wall of the sliding groove, the cavity foam block is located in the sliding groove and is slidably connected to the mounting protrusion, and a portion of the cavity foam block is used to abut against the outer wall of the ceramic plate body through the opening groove.

[0014] In one embodiment, the elastic member is sleeved on the mounting protrusion.

[0015] In one embodiment, after the step of performing micro-etching and roughening treatment on the ceramic plate body and before the step of performing ABF pressure treatment operation on the ceramic plate, the preparation method further includes:

[0016] The ceramic plate body is subjected to a baking operation.

[0017] In one embodiment, the step of performing ABF processing on the ceramic plate comprises:

[0018] Laminating the ABF layer on the surface of the ceramic plate by a vacuum laminator;

[0019] The ceramic plate component pressed with the ABF layer is baked and solidified.

[0020] In one embodiment, the curing temperature is 98°C to 200°C.

[0021] In one embodiment, the step of baking and curing the ceramic plate pressed with the ABF layer comprises:

[0022] Pre-baking and curing the ceramic plate pressed with the ABF layer at a first preset temperature;

[0023] The pre-baked and cured ceramic plate is subjected to secondary baking and curing at a second preset temperature.

[0024] In one embodiment, the first preset temperature is lower than the second preset temperature.

[0025] In one embodiment, the baking and curing time is 60 minutes to 70 minutes.

[0026] A ceramic substrate, characterized in that it is prepared by using the method for preparing the ceramic substrate described in any of the above embodiments.

[0027] Compared with the prior art, the present invention has at least the following advantages:

[0028] 1. The above-mentioned preparation method first clamps the ceramic plate body in the clamping area of ​​the carrier board. Since the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, so that the cavity foam block is elastically connected to the mounting protrusion through the elastic member, and then the outer wall of the ceramic plate body is clamped and fixed by the cavity foam block; then the ceramic plate body is subjected to micro-etching and roughening treatment, so that the subsequent ABF is better pressed to the surface of the ceramic plate; then the ceramic plate is subjected to ABF pressing treatment operation to obtain a semi-finished ceramic substrate; then the semi-finished ceramic substrate is subjected to laser drilling operation; then the semi-finished ceramic substrate is subjected to graphic production operation, because the cavity foam block has a good potion adsorption capacity, at the outer wall of the ceramic plate and the cavity foam block abutting, the potion can quickly flow into and act on the ABF above the outer wall of the ceramic plate body, so that in the process of graphic production, the potion can effectively act on the ABF at any position on the surface of the ceramic plate, so that a graphic circuit is formed on the ceramic substrate.

[0029] 2. The above-mentioned preparation method solves the problem that the periphery of the ceramic substrate is prone to incomplete etching, and effectively improves the uniformity and thoroughness of the etching of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of an existing ceramic substrate that is not etched cleanly;

[0032] Figure 2 is a flow chart of a method for preparing a ceramic substrate according to an embodiment;

[0033] Figure 3 for Figure 2 A schematic diagram of a carrier plate clamping a ceramic plate body in step S100 of the method for preparing a ceramic substrate;

[0034] Figure 3a for Figure 3 The shown schematic diagram is a partial enlargement of a carrier plate clamping a ceramic plate;

[0035] Figure 3b for Figure 3a A partial cross-sectional view of the carrier plate clamping the ceramic plate body;

[0036] Figure 4 for Figure 2 A schematic flow chart of step S200 of the method for preparing a ceramic substrate is shown;

[0037] Figure 5 for Figure 2 A schematic flow chart of step S300 of the method for preparing a ceramic substrate is shown;

[0038] Figure 6 Shown is the sputtering appearance of the coating on the ceramic substrate. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0042] The present disclosure relates to a method for preparing a ceramic substrate, comprising: clamping a ceramic plate body in a clamping area of ​​a carrier plate, wherein the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, wherein each of the elastic clamping members comprises an elastic member and a cavity foam block, wherein one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, and the cavity foam block is used to abut against the outer side wall of the ceramic plate body; performing micro-etching and roughening treatment on the ceramic plate body; performing ABF pressing treatment operation on the ceramic plate member to obtain a semi-finished ceramic substrate; performing laser drilling operation on the semi-finished ceramic substrate; and performing graphic production operation on the semi-finished ceramic substrate.

[0043] The above-mentioned preparation method first clamps the ceramic plate body in the clamping area of ​​the carrier board. Since the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, so that the cavity foam block is elastically connected to the mounting protrusion through the elastic member, and then the outer wall of the ceramic plate body is clamped and fixed by the cavity foam block; then the ceramic plate body is subjected to micro-etching and roughening treatment, so that the subsequent ABF is better pressed to the surface of the ceramic plate; then the ceramic plate is subjected to ABF pressing treatment operation to obtain a semi-finished ceramic substrate; then the semi-finished ceramic substrate is subjected to laser drilling operation; then the semi-finished ceramic substrate is subjected to graphic production operation, since the cavity foam block has a good potion adsorption capacity, at the place where the outer wall of the ceramic plate is abutted with the cavity foam block, the potion can quickly flow into and act on the ABF above the outer wall of the ceramic plate body, so that in the process of graphic production, the potion can effectively act on the ABF at any position on the surface of the ceramic plate, so that a graphic circuit is formed on the ceramic substrate. The above-mentioned preparation method solves the problem that the periphery of the ceramic substrate is prone to incomplete etching, and effectively improves the uniformity and thoroughness of the etching of the ceramic substrate.

[0044] See also Figure 2 , which is a flow chart of a method for preparing a ceramic substrate according to an embodiment of the present disclosure. The method for preparing a ceramic substrate includes all or part of the following steps.

[0045] S100, clamp the ceramic plate body in the clamping area of ​​the carrier plate, the clamping area is circumferentially spaced with a plurality of mounting protrusions and a plurality of elastic clamping members, each of the elastic clamping members includes an elastic member and a cavity foam block, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, and the cavity foam block is used to abut against the outer wall of the ceramic plate body.

[0046] See also Figure 3 to Figure 3bIn this embodiment, the ceramic plate 20 is clamped in the clamping area 12 of the carrier 10, and the clamping area 12 is provided with a plurality of mounting protrusions 122 and a plurality of elastic clamping members 124 at intervals in the circumferential direction. Each of the elastic clamping members 124 includes an elastic member 124a and a cavity foam block 124b, one end of the elastic member 124a is connected to the cavity foam block 124b, and the other end of the elastic member 124a is connected to the corresponding mounting protrusion 122, so that the cavity foam block is fixed to the mounting protrusion through the elastic member 124a. The cavity foam block 124b is used to abut against the outer wall of the ceramic plate 20.

[0047] Since the cavity foam block has good liquid conductivity, it can not only effectively transport the micro-etching solution to the outer wall of the ceramic plate body that abuts the cavity foam block in the micro-etching stage to achieve a better micro-etching effect, but also effectively transport the etching solution to the tiny gap between the ceramic plate and the copper surface in the graphic stage, thereby ensuring the uniformity and thoroughness of the etching.

[0048] In one embodiment, the cavity foam block 124b is a nano-scale cavity foam block, so that the cavity foam block not only has good liquid conductivity but also has excellent heat resistance, thereby improving the stability of use in high temperature environments.

[0049] In one embodiment, the mounting protrusion 122 is provided with a connected sliding groove 122a and an opening groove 122b, the cross-sectional area of ​​the sliding groove 122a is larger than the cross-sectional area of ​​the opening groove 122b, the elastic member 124a is located in the sliding groove 122a, one end of the elastic member 124a is fixed to the inner wall of the sliding groove 122a, the cavity foam block 124b is located in the sliding groove and is slidably connected to the mounting protrusion, and a portion of the cavity foam block is used to abut against the outer wall of the ceramic plate through the opening groove, so that the elastic member is reliably fixed to the mounting protrusion.

[0050] Furthermore, the elastic member 124a is glued to the cavity foam block 124b, so that the elastic member and the cavity foam block are firmly connected.

[0051] Furthermore, the mounting protrusion 122 includes a carrier boss 1221 and a sleeve 1223. The carrier boss 1221 protrudes from the inner wall of the clamping area 12. The sleeve 1223 is located in the clamping area 12 and sleeved on the carrier boss 1221. The carrier boss 1221 and the sleeve 1223 together form a sliding groove 122a. The opening groove 122b is opened at the end of the sleeve 1223 away from the carrier boss 1221. In this embodiment, the sleeve 1223 is an elastic silicone member, so that the sleeve 1223 has good elasticity and is not prone to the situation of ceramic substrate scraping. One end of the elastic member 124a is fixed to the end of the carrier boss 1221.

[0052] Further, the cavity foam block 124b includes a sliding portion 1242 and a resisting portion 1244 protruding from one side of the sliding portion, the sliding portion is located in the sliding groove and is slidably connected to the mounting protrusion, the end side of the sliding portion away from the resisting portion is connected to the elastic member, the resisting portion slides in the open groove, and part of the resisting portion protrudes out of the outer side of the open groove, so that the resisting portion and the outer side wall of the ceramic plate body are in conflict, and since the elastic member is retractable, the elastic member is first contracted by pressing the resisting portion, and then the ceramic plate body is installed or the ceramic substrate is removed. In this embodiment, the cross-sectional area of ​​the sliding portion is larger than the cross-sectional area of ​​the open groove, so that the cavity foam block can be reliably slidably limited in the sliding groove. Specifically, the cavity foam block is T-shaped. Further, the cavity foam block is an integrally formed structure, so that the sliding portion and the resisting portion are firmly connected, and at the same time, the structure of the cavity foam block is more compact. Of course, in other embodiments, the sliding portion and the resisting portion can also be formed separately and fixed by gluing.

[0053] It is understood that in other embodiments, the mounting protrusion is not limited to being provided with a sliding groove and an opening groove, that is, the elastic member and the cavity foam block are not limited to being arranged in the sliding groove. For example, the elastic member is sleeved on the mounting protrusion.

[0054] Further, the elastic member is a coil spring or elastic glue. In this embodiment, the elastic member is a coil spring.

[0055] Furthermore, a liquid inlet channel is formed at one end of the cavity foam block away from the elastic member, and the liquid inlet channel extends to the outer peripheral side of the cavity foam block, so that liquid such as etching solution can flow into and act on the ceramic plate through the liquid inlet channel.

[0056] S200, performing micro-etching and roughening treatment on the ceramic plate.

[0057] In this embodiment, the ceramic plate is subjected to micro-etching and roughening treatment, so that the subsequent ABF (Ajinomoto Build-up Film) has a larger contact area with the ceramic plate, thereby enabling the subsequent ABF to be better pressed onto the surface of the ceramic plate.

[0058] S300, performing ABF pressing on the ceramic plate to obtain a semi-finished ceramic substrate.

[0059] In this embodiment, the ceramic plate is subjected to ABF pressing. Since the surface of the ceramic plate is first subjected to micro-etching and roughening treatment, the contact area between the ceramic plate and the ABF pressing is larger, thereby making the ABF better bonded to the ceramic plate, thereby obtaining a semi-finished ceramic substrate.

[0060] S400, performing a laser drilling operation on the semi-finished ceramic substrate.

[0061] In this embodiment, the semi-finished ceramic substrate is subjected to laser drilling. Furthermore, an ultraviolet UV laser drill or a CO2 laser drill is used to perform laser drilling on the semi-finished ceramic substrate. Furthermore, the pulse width of the laser drilling operation on the semi-finished ceramic substrate is 2μs to 8μs, so as to better drill the semi-finished ceramic substrate.

[0062] S500, performing a pattern making operation on the semi-finished ceramic substrate.

[0063] In this embodiment, the ceramic substrate semi-finished product is subjected to a pattern making operation to form a pattern circuit on the surface of the ceramic substrate semi-finished product. Further, the step of performing a pattern making operation on the ceramic substrate semi-finished product includes: firstly cleaning the ceramic substrate semi-finished product; then applying a dry film to the ABF surface of the ceramic substrate semi-finished product; and then performing an exposure and development process on the ceramic substrate semi-finished product after the film is applied to obtain a pattern circuit.

[0064] The above-mentioned preparation method first clamps the ceramic plate body in the clamping area of ​​the carrier board. Since the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, so that the cavity foam block is elastically connected to the mounting protrusion through the elastic member, and then the outer wall of the ceramic plate body is clamped and fixed by the cavity foam block; then the ceramic plate body is subjected to micro-etching and roughening treatment, so that the subsequent ABF is better pressed to the surface of the ceramic plate; then the ceramic plate is subjected to ABF pressing treatment operation to obtain a semi-finished ceramic substrate; then the semi-finished ceramic substrate is subjected to laser drilling operation; then the semi-finished ceramic substrate is subjected to graphic production operation, since the cavity foam block has a good potion adsorption capacity, at the place where the outer wall of the ceramic plate is abutted with the cavity foam block, the potion can quickly flow into and act on the ABF above the outer wall of the ceramic plate body, so that in the process of graphic production, the potion can effectively act on the ABF at any position on the surface of the ceramic plate, so that a graphic circuit is formed on the ceramic substrate. The above-mentioned preparation method solves the problem that the periphery of the ceramic substrate is prone to incomplete etching, and effectively improves the uniformity and thoroughness of the etching of the ceramic substrate.

[0065] See also Figure 2 and Figure 4 In one embodiment, after the step S200 of performing micro-etching and roughening treatment on the ceramic plate body and before the step S300 of performing ABF pressure treatment operation on the ceramic plate, the preparation method further includes:

[0066] S210, baking the ceramic plate to remove moisture in the ceramic plate. In this embodiment, a nitrogen oven is used to bake the ceramic plate, which can not only effectively remove moisture in the ceramic plate, but also prevents oxidation during baking.

[0067] See also Figure 2 and Figure 5 In one embodiment, the step S300 of performing the ABF pressing operation on the ceramic plate comprises:

[0068] S302, laminating the ABF layer on the surface of the ceramic plate by a vacuum laminator.

[0069] In this embodiment, the ABF layer is pressed onto the surface of the ceramic plate by a vacuum laminator, so that the ABF layer is pressed onto the surface of the ceramic plate. Further, the step of pressing the ABF layer onto the surface of the ceramic plate by a vacuum laminator includes: firstly, vacuum hot pressing the ABF layer onto the surface of the ceramic plate by a vacuum laminator, so that the ABF layer is reliably pressed onto the surface of the ceramic plate; and then, the ceramic plate with the vacuum hot pressed ABF layer is flattened, so that the ABF layer is relatively flat after being pressed onto the surface of the ceramic plate.

[0070] Furthermore, the temperature of the ABF layer being vacuum hot-pressed on the surface of the ceramic plate by the vacuum laminator is 75°C-90°C, and the pressure of the hot-pressing is 3Mpa~8Mpa, so that the ABF layer can be better pressed to the surface of the ceramic plate. In the present embodiment, the temperature of the ABF layer being vacuum hot-pressed on the surface of the ceramic plate by the vacuum laminator is 80°C, and the pressure of the hot-pressing is 5Mpa. Furthermore, the time of vacuum hot-pressing the ABF layer on the surface of the ceramic plate by the vacuum laminator is 20s~40s, so that the ABF layer can be better pressed to the surface of the ceramic plate. In the present embodiment, the time of vacuum hot-pressing the ABF layer on the surface of the ceramic plate by the vacuum laminator is 35s.

[0071] Furthermore, the pressing temperature of the vacuum hot-pressed ABF layer ceramic plate for flattening operation is 100°C-130°C, and the pressing pressure is 3Mpa-8Mpa, so that the surface of the ABF layer is relatively flat. Furthermore, the pressing time of the vacuum hot-pressed ABF layer ceramic plate for flattening operation is 50s-70s. Specifically, the pressing time of the vacuum hot-pressed ABF layer ceramic plate for flattening operation is 60s, so that the surface of the ABF layer is relatively flat.

[0072] S304, baking and curing the ceramic plate pressed with the ABF layer.

[0073] In this embodiment, the ceramic plate to which the ABF layer is pressed is baked and cured, so that the ABF layer is reliably bonded to the surface of the ceramic plate.

[0074] In one embodiment, the baking and curing temperature is 98° C. to 200° C., so that the ABF layer is reliably bonded to the surface of the ceramic plate.

[0075] In one embodiment, the baking and curing time is 60 minutes to 70 minutes. In this embodiment, there are at least two time periods for baking and curing. In one embodiment, the step S304 of baking and curing the ceramic plate pressed with the ABF layer includes:

[0076] S304A, pre-baking and curing the ceramic plate pressed with the ABF layer at a first preset temperature.

[0077] In this embodiment, the ceramic plate laminated with the ABF layer is pre-baked and cured at a first preset temperature, wherein the first preset temperature is 98° C. to 110° C. Specifically, the first preset temperature is 100° C., so as to reliably pre-bake and cure the ceramic plate laminated with the ABF layer.

[0078] Furthermore, the pre-baking and curing time is 25 minutes to 35 minutes. In this embodiment, the pre-baking and curing time is 30 minutes, and the first preset temperature is 100° C., so as to reliably pre-bake and cure the ceramic plate with the ABF layer pressed, that is, reliably remove moisture from the ceramic plate.

[0079] S304B, performing secondary baking and curing on the pre-baked and cured ceramic plate at a second preset temperature.

[0080] In this embodiment, the ceramic plate after pre-baking and curing is subjected to secondary baking and curing at a second preset temperature. The second preset temperature is 170°C to 195°C. Specifically, the second preset temperature is 185°C, so as to achieve secondary baking and curing of the ceramic plate after pre-baking and curing, so that the ABF layer is tightly cured and formed on the ceramic plate. In one embodiment, the first preset temperature is less than the second preset temperature.

[0081] Furthermore, after the step of performing laser drilling operation on the ceramic substrate semi-finished product and before performing graphic production operation on the ceramic substrate semi-finished product, the preparation method also includes: performing plasma operation on the ceramic substrate semi-finished product to remove glue residue on the surface of the material and modify the surface activity of the material.

[0082] Furthermore, after the step of performing plasma operation on the semi-finished ceramic substrate and before performing pattern making operation on the semi-finished ceramic substrate, the preparation method further comprises: performing sputtering coating treatment on the semi-finished ceramic substrate to deposit a coating on the surface of the ceramic substrate, such as Figure 6 The sputtering surface diagram of the coating of the ceramic substrate is shown. Furthermore, the thickness of the coating is 480nm to 520nm. Furthermore, the sputtering speed of the sputtering coating process is 80mm / s to 100mm / s to better sputter the molecules, atoms or ions on the surface. In this embodiment, the coating is a titanium coating or a copper coating.

[0083] Furthermore, the step of performing sputtering coating treatment on the semi-finished ceramic substrate includes: first setting calibration points on the surface of the semi-finished ceramic substrate; then controlling the sputtering head to perform sputtering coating treatment on the semi-finished ceramic substrate; then performing image acquisition on the area of ​​the semi-finished ceramic substrate to be sputtered to obtain an actual sputtering image of the semi-finished ceramic substrate; then extracting the actual sputtering profile of the semi-finished ceramic substrate based on the actual sputtering image; then comparing the actual sputtering profile with the preset sputtering profile to obtain a sputtering defect area; finally controlling the sputtering head to perform secondary sputtering on the sputtering defect area to avoid the problem of sputtering blanks in the coating, so that the coating of the semi-finished ceramic substrate is smoother.

[0084] Furthermore, the step of performing a pattern making operation on the semi-finished ceramic substrate includes: first cleaning the surface of the semi-finished ceramic substrate; then attaching a dry film layer to the semi-finished ceramic substrate; and finally exposing and developing the semi-finished ceramic substrate to better form a pattern circuit.

[0085] Furthermore, the pressure of attaching the dry film layer to the semi-finished ceramic substrate is 3kg / cm2 to 8kg / cm2, so that the dry film layer is better attached to the ceramic substrate. In this embodiment, the temperature of attaching the dry film layer to the semi-finished ceramic substrate is 100°C to 120°C. Specifically, the temperature of attaching the dry film layer to the semi-finished ceramic substrate is 110°C.

[0086] Furthermore, after the step of performing a pattern making operation on the semi-finished ceramic substrate, the preparation method further includes: performing a pattern filling hole electroplating operation on the semi-finished ceramic substrate to better fill the blind holes and ensure the uniformity of the pattern copper thickness. Furthermore, the step of performing a pattern filling hole electroplating operation on the semi-finished ceramic substrate is specifically: performing a pattern filling hole electroplating operation on the semi-finished ceramic substrate using a vertical electroplating filling hole line. In this embodiment, the current of the filling hole electroplating operation is 1.1A / square decimeter to 1.8A / square decimeter to better fill the blind holes and ensure the uniformity of the pattern copper thickness.

[0087] Furthermore, before the step of performing a pattern filling and electroplating operation on the ceramic substrate semi-finished product and after the step of performing a pattern making operation on the ceramic substrate semi-finished product, the preparation method also includes: performing plasma treatment on the ceramic substrate semi-finished product to remove residual foreign matter after the pattern making operation, and modifying the surface of the ceramic substrate semi-finished product to facilitate the subsequent hole filling and electroplating operation.

[0088] Furthermore, after the step of performing a pattern-filling electroplating operation on the semi-finished ceramic substrate, the preparation method further comprises: performing a film stripping treatment on the semi-finished ceramic substrate to remove the dry film on the copper surface after electroplating cleanly to prevent poor etching caused by residual dry film or foreign matter.

[0089] Furthermore, after the step of stripping the semi-finished ceramic substrate, the preparation method further includes: baking the semi-finished ceramic substrate to prevent the electroplated copper from "self-toughening" when placed at room temperature, thereby causing changes in the physical, chemical and electrical properties of the electroplated copper. High-temperature baking can quickly change the phase of the copper plating layer until it is stable. Baking after stripping can improve the surface lattice of the electroplated copper and reduce the occurrence of pinholes.

[0090] Furthermore, after the step of baking the semi-finished ceramic substrate, the preparation method further comprises: performing solder resist treatment on the semi-finished ceramic substrate to form a solder resist layer on the semi-finished ceramic substrate.

[0091] The present application also provides a ceramic substrate, characterized in that it is prepared by the method for preparing a ceramic substrate described in any of the above embodiments. Furthermore, the method for preparing a ceramic substrate includes: clamping a ceramic plate body in a clamping area of ​​a carrier plate, wherein the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, each of the elastic clamping members includes an elastic member and a cavity foam block, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, and the cavity foam block is used to abut against the outer wall of the ceramic plate body; performing micro-etching and roughening treatment on the ceramic plate body; performing ABF pressing treatment on the ceramic plate to obtain a semi-finished ceramic substrate; performing laser drilling operation on the semi-finished ceramic substrate; and performing graphic production operation on the semi-finished ceramic substrate.

[0092] When preparing the above-mentioned ceramic substrate, the ceramic plate body is first clamped in the clamping area of ​​the carrier board. Since the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, so that the cavity foam block is elastically connected to the mounting protrusion through the elastic member, and then the outer wall of the ceramic plate body is clamped and fixed by the cavity foam block; then the ceramic plate body is subjected to micro-etching and roughening treatment, so that the subsequent ABF is better pressed to the surface of the ceramic plate; then the ceramic plate is subjected to ABF pressing treatment operation to obtain a semi-finished ceramic substrate; then the semi-finished ceramic substrate is subjected to laser drilling operation; then the semi-finished ceramic substrate is subjected to graphic production operation, because the cavity foam block has a good potion adsorption capacity, at the place where the outer wall of the ceramic plate is abutted with the cavity foam block, the potion can quickly flow into and act on the ABF above the outer wall of the ceramic plate body, so that in the process of graphic production, the potion can effectively act on the ABF at any position on the surface of the ceramic plate, so that a graphic circuit is formed on the ceramic substrate. The above-mentioned preparation method solves the problem that the periphery of the ceramic substrate is prone to incomplete etching, and effectively improves the uniformity and thoroughness of the etching of the ceramic substrate.

[0093] Compared with the prior art, the present invention has at least the following advantages:

[0094] 1. The above-mentioned preparation method first clamps the ceramic plate body in the clamping area of ​​the carrier board. Since the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at circumferential intervals, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, so that the cavity foam block is elastically connected to the mounting protrusion through the elastic member, and then the outer wall of the ceramic plate body is clamped and fixed by the cavity foam block; then the ceramic plate body is subjected to micro-etching and roughening treatment, so that the subsequent ABF is better pressed to the surface of the ceramic plate; then the ceramic plate is subjected to ABF pressing treatment operation to obtain a semi-finished ceramic substrate; then the semi-finished ceramic substrate is subjected to laser drilling operation; then the semi-finished ceramic substrate is subjected to graphic production operation, because the cavity foam block has a good potion adsorption capacity, at the outer wall of the ceramic plate and the cavity foam block abutting, the potion can quickly flow into and act on the ABF above the outer wall of the ceramic plate body, so that in the process of graphic production, the potion can effectively act on the ABF at any position on the surface of the ceramic plate, so that a graphic circuit is formed on the ceramic substrate.

[0095] 2. The above-mentioned preparation method solves the problem that the periphery of the ceramic substrate is prone to incomplete etching, and effectively improves the uniformity and thoroughness of the etching of the ceramic substrate.

[0096] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A method for preparing a ceramic substrate, characterized in that: include: Clamp the ceramic plate body in the clamping area of ​​the carrier plate, wherein the clamping area is provided with a plurality of mounting protrusions and a plurality of elastic clamping members at intervals in the circumferential direction, each of the elastic clamping members comprises an elastic member and a cavity foam block, one end of the elastic member is connected to the cavity foam block, and the other end of the elastic member is connected to the corresponding mounting protrusion, and the cavity foam block is used to abut against the outer side wall of the ceramic plate body; Performing micro-etching and roughening treatment on the ceramic plate; Performing ABF pressing on the ceramic plate to obtain a semi-finished ceramic substrate; Performing a laser drilling operation on the semi-finished ceramic substrate; A pattern making operation is performed on the semi-finished ceramic substrate.

2. The method for preparing a ceramic substrate according to claim 1, characterized in that: The cavity foam block is a nano-scale cavity foam block.

3. The method for preparing a ceramic substrate according to claim 1, characterized in that: The mounting protrusion is provided with a connected sliding groove and an opening groove, the cross-sectional area of ​​the sliding groove is larger than the cross-sectional area of ​​the opening groove, the elastic member is located in the sliding groove, one end of the elastic member is fixed to the inner wall of the sliding groove, the cavity foam block is located in the sliding groove and is slidably connected to the mounting protrusion, and a portion of the cavity foam block is used to abut against the outer wall of the ceramic plate body through the opening groove.

4. The method for preparing a ceramic substrate according to claim 1, characterized in that: After the step of performing micro-etching and roughening treatment on the ceramic plate body and before the step of performing ABF pressure treatment operation on the ceramic plate, the preparation method further includes: The ceramic plate body is subjected to a baking operation.

5. The method for preparing a ceramic substrate according to claim 1, characterized in that: The step of performing ABF pressing on the ceramic plate comprises: Laminating the ABF layer on the surface of the ceramic plate by a vacuum laminator; The ceramic plate component pressed with the ABF layer is baked and solidified.

6. The method for preparing a ceramic substrate according to claim 5, characterized in that: The baking and curing temperature is 98°C to 200°C.

7. The method for preparing a ceramic substrate according to claim 5, characterized in that: The step of baking and curing the ceramic plate pressed with the ABF layer comprises: Pre-baking and curing the ceramic plate pressed with the ABF layer at a first preset temperature; The pre-baked and cured ceramic plate is subjected to secondary baking and curing at a second preset temperature.

8. The method for preparing a ceramic substrate according to claim 7, characterized in that: The first preset temperature is lower than the second preset temperature.

9. The method for preparing a ceramic substrate according to claim 5, characterized in that: The baking and curing time is 60 minutes to 70 minutes.

10. A ceramic substrate, characterized in that: The ceramic substrate is prepared by the method for preparing the ceramic substrate according to any one of claims 1 to 9.

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