Graph confirmation method, laser processing method, device, equipment and storage medium

Abstract

The invention is suitable for the technical field of laser processing, provides a graph confirmation method, a laser processing method, a device, equipment and a storage medium, and aims to reduce the probability that a target plate becomes black in a boundary area where a laser galvanometer executes a cleaning graph. Performing laser cleaning on the to-be-processed plate according to the cleaning pattern; the number of the cleaning patterns is at least two, the at least two cleaning patterns are arranged at intervals in the first direction, each cleaning pattern comprises a plurality of lines distributed at intervals in the second direction, and the lines of the cleaning patterns are in one-to-one correspondence in the first direction, so that multiple lines of line groups are formed in the second direction; a gap exists between lines corresponding to two adjacent cleaning patterns in each line of line group, at least one gap group is correspondingly formed in the first direction, and the adjacent gaps of any gap group in the second direction are at least not completely overlapped; wherein the first direction is different from the second direction.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and in particular relates to a graphic confirmation method, a laser processing method, a device, an equipment and a storage medium. Background Art

[0002] In the prior art, lasers can be used to clean the surface of printed circuit boards (PCBs) and to thin the boards. Specifically, a laser generator of a laser processing device outputs a laser of a specific wavelength, and the laser passes through an optical path through an ultra-high-speed laser galvanometer (also called a laser scanner) to make a cleaning motion on the printed circuit board that needs to be processed according to a preset cleaning pattern, so that surface materials or surface layers such as oil, dust, and oxide layers on the printed circuit board evaporate and separate after being irradiated by the laser, thereby achieving cleaning or thinning of the printed circuit board.

[0003] In the actual process of using laser to clean the printed circuit board, the applicant found that when using laser to clean the printed circuit board, the printed circuit board becomes darker more obviously in the intersection area of ​​the two adjacent laser galvanometer cleaning patterns. Summary of the invention

[0004] The purpose of the present application is to provide a pattern confirmation method, a laser processing method, a device, an equipment and a storage medium, which are intended to reduce the probability of a target plate such as a printed circuit board turning black in the boundary area where two adjacent laser galvanometers perform cleaning patterns.

[0005] In a first aspect, the present application provides a method for confirming a pattern for laser processing, the method comprising:

[0006] Determine a cleaning pattern of a plate to be processed, and perform laser cleaning on the plate to be processed according to the cleaning pattern;

[0007] The cleaning patterns include at least two, at least two of the cleaning patterns are arranged at intervals along the first direction, each of the cleaning patterns includes a plurality of lines spaced apart along the second direction, each of the lines of each of the cleaning patterns corresponds to each other in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the adjacent gaps in any gap group along the second direction at least do not completely overlap;

[0008] The first direction and the second direction are different.

[0009] Optionally, adjacent gaps in any gap group along the second direction at least do not completely overlap, including:

[0010] Adjacent gaps in any gap group along the second direction do not overlap at all.

[0011] Optionally, the line groups in each row are on the same horizontal line, and the multiple line groups include odd-numbered line groups and even-numbered line groups, and in any gap group, the projections of the gaps corresponding to the odd-numbered line groups in the second direction are completely overlapped, and the projections of the gaps corresponding to the even-numbered line groups in the second direction are completely overlapped.

[0012] Optionally, the first direction is perpendicular to the second direction, and the lines of the at least two cleaning patterns spaced apart along the first direction are both line segments.

[0013] Optionally, the plate to be processed is a printed circuit board.

[0014] In a second aspect, the present application provides a laser processing method, which is applied to a laser processing device, wherein the laser processing device is used for laser cleaning, and the method comprises:

[0015] Obtaining a cleaning pattern confirmed by the pattern confirmation method for laser processing described in any one of the first aspects;

[0016] The plate to be processed is laser cleaned according to the cleaning pattern.

[0017] Optionally, the cleaning pattern includes at least a first cleaning pattern and a second cleaning pattern; and the laser cleaning of the plate to be processed according to the cleaning pattern includes:

[0018] Moving the laser galvanometer of the laser processing equipment to make it correspond to the first cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the first cleaning pattern; and / or,

[0019] Moving the plate to be processed so that the first cleaning area thereof corresponds to the laser galvanometer of the laser processing device, and laser cleaning the plate to be processed according to the first cleaning pattern;

[0020] as well as,

[0021] Moving the laser galvanometer of the laser processing equipment to make it correspond to the second cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the second cleaning pattern; and / or,

[0022] The plate to be processed is moved so that the second cleaning area thereof corresponds to the laser galvanometer of the laser processing equipment, and the plate to be processed is laser cleaned according to the second cleaning pattern.

[0023] Optionally, the plate to be processed is a printed circuit board, and the method further includes:

[0024] The matching parameters of the gap that can be formed between the line segments of the first cleaning pattern and the second cleaning pattern of the printed circuit board, the working matching parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer are summarized and recorded to obtain the laser processing data of the printed circuit board using the laser galvanometer of the laser processing equipment.

[0025] In a third aspect, the present application provides a graphic confirmation device for laser processing, the device comprising:

[0026] A determination module, used to determine a cleaning pattern of a plate to be processed, so as to perform laser cleaning on the plate to be processed according to the cleaning pattern;

[0027] The cleaning patterns include at least two, at least two of the cleaning patterns are arranged at intervals along the first direction, each of the cleaning patterns includes a plurality of lines spaced apart along the second direction, each of the lines of each of the cleaning patterns corresponds to each other in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the adjacent gaps in any gap group along the second direction at least do not completely overlap;

[0028] The first direction and the second direction are different.

[0029] Optionally, adjacent gaps in any gap group along the second direction at least do not completely overlap, including:

[0030] Adjacent gaps in any gap group along the second direction do not overlap at all.

[0031] Optionally, the line groups in each row are on the same horizontal line, and the multiple line groups include odd-numbered line groups and even-numbered line groups, and in any gap group, the projections of the gaps corresponding to the odd-numbered line groups in the second direction are completely overlapped, and the projections of the gaps corresponding to the even-numbered line groups in the second direction are completely overlapped.

[0032] Optionally, the first direction is perpendicular to the second direction, and the lines of the at least two cleaning patterns spaced apart along the first direction are both line segments.

[0033] Optionally, the plate to be processed is a printed circuit board.

[0034] In a fourth aspect, the present application provides a laser processing device, which is applied to a laser processing device, wherein the laser processing device is used for laser cleaning, and the device comprises:

[0035] An acquisition module, used to acquire a cleaning pattern confirmed by the pattern confirmation device for laser processing according to any one of the third aspects above;

[0036] A cleaning module is used to perform laser cleaning on the plate to be processed according to the cleaning pattern.

[0037] Optionally, the cleaning pattern includes at least a first cleaning pattern and a second cleaning pattern; when the cleaning module performs laser cleaning on the plate to be processed according to the cleaning pattern, it is specifically used to:

[0038] Moving the laser galvanometer of the laser processing equipment to make it correspond to the first cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the first cleaning pattern; and / or,

[0039] Moving the plate to be processed so that the first cleaning area thereof corresponds to the laser galvanometer of the laser processing device, and laser cleaning the plate to be processed according to the first cleaning pattern;

[0040] as well as,

[0041] Moving the laser galvanometer of the laser processing equipment to make it correspond to the second cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the second cleaning pattern; and / or,

[0042] The plate to be processed is moved so that the second cleaning area thereof corresponds to the laser galvanometer of the laser processing equipment, and the plate to be processed is laser cleaned according to the second cleaning pattern.

[0043] Optionally, the plate to be processed is a printed circuit board, and the device further comprises:

[0044] A summary module is used to summarize and record the matching parameters of the gap that can be formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern of the printed circuit board, the working matching parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer, so as to obtain the laser processing data of the printed circuit board using the laser galvanometer of the laser processing equipment.

[0045] In a fifth aspect, the present application provides a computer device, including:

[0046] Processor, memory, bus, input and output interface, network interface;

[0047] The processor is connected to the memory, the input / output interface, and the network interface via the bus;

[0048] The memory stores a program;

[0049] When the processor executes the program stored in the memory, it implements the graphic confirmation method for laser processing as described in any one of the first aspects, or implements the laser processing method as described in any one of the second aspects.

[0050] In a sixth aspect, the present application provides a computer-readable storage medium, wherein instructions are stored in the computer-readable storage medium. When the instructions are executed on a computer, the computer executes a graphic confirmation method for laser processing as described in any one of the first aspects above, or implements a laser processing method as described in any one of the second aspects above.

[0051] In the seventh aspect, the present application provides a computer program product, which, when executed on a computer, enables the computer to execute the graphic confirmation method for laser processing as described in any one of the first aspects, or implement the laser processing method as described in any one of the second aspects.

[0052] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0053] The laser processing equipment of the pattern confirmation method for laser processing of the present embodiment determines the cleaning pattern used by the laser galvanometer for the plate to be processed, so as to laser process the plate according to the cleaning pattern; wherein the cleaning pattern includes at least two cleaning patterns spaced apart along the first direction, and each cleaning pattern includes a plurality of lines spaced apart along the second direction, which means that each cleaning pattern has a plurality of paths for guiding laser processing; the lines of each cleaning pattern correspond one-to-one in the first direction, so that a plurality of line groups are formed in the second direction, which means that the lines of the two cleaning patterns can be combined to form a line group; there are gaps between the lines corresponding to the two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, which is used to indicate the coordination between the cleaning patterns; the adjacent gaps of any gap group along the second direction at least do not completely overlap, so that the coordination between at least two cleaning patterns is a non-linear coordination; wherein the directions of the first direction and the second direction are different. When the laser processing equipment confirms the cleaning pattern according to the above-mentioned laser processing pattern confirmation method, and then laser cleans the plate to be processed according to the cleaning pattern, a cleaning pattern with incompletely overlapping gaps can be formed on the plate to be processed. The cleaning pattern with incompletely overlapping gaps allows the plate to have a larger surface area to absorb the excess laser energy of two adjacent laser cleanings, that is, using a larger target plate surface area to apportion the excess laser energy of these two adjacent laser cleanings, which can effectively reduce the probability of the plate turning black in the adjacent areas of two adjacent laser cleanings. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic flow chart of an embodiment of a method for pattern confirmation for laser processing in the present application;

[0055] Figure 2 A schematic diagram of a flow chart of an embodiment of the laser processing method of the present application;

[0056] Figure 3 This is a schematic diagram of the structure of an embodiment of a graphic confirmation device for laser processing of the present application;

[0057] Figure 4 This is a schematic diagram of the structure of an embodiment of the laser processing device of the present application;

[0058] Figure 5 A schematic diagram of the structure of an embodiment of a computer device of the present application;

[0059] Figure 6 A schematic diagram of an embodiment of cleaning graphics in the prior art;

[0060] Figure 7 The laser galvanometer of the laser processing equipment for this application controls the laser beam in execution Figure 6 A schematic diagram of the movement speed of an embodiment when clearing a line path in a graph;

[0061] Figure 8 A schematic diagram of the cleaning effect of the laser processing method of this application;

[0062] Fig. 9 A schematic diagram of the effect of an embodiment of the coordination of cleaning patterns in two adjacent laser cleanings in the prior art;

[0063] Fig.10 In accordance with Figure 6 A schematic diagram of the effect of an embodiment of the coordination of the junction of two cleaning areas after the cleaning pattern performs two adjacent laser cleanings on the target plate;

[0064] Fig.11 A schematic diagram of an embodiment of a first cleaning pattern A and a first cleaning pattern B of a pattern confirmation method for laser processing of the present application;

[0065] Fig.12 for Fig.11 Schematic diagram of the estimated cleaning effect of the first cleaning pattern A and the first cleaning pattern B;

[0066] Fig.13 A schematic diagram of an embodiment of the first cleaning pattern C, the first cleaning pattern D and the cleaning pattern E of the pattern confirmation method for laser processing of the present application;

[0067] Fig.14It is a schematic diagram of another embodiment of the first cleaning pattern F, the first cleaning pattern G and the cleaning pattern H of the pattern confirmation method for laser processing of the present application;

[0068] Fig.15 For laser processing equipment Fig.14 A schematic diagram of an embodiment of the effect of laser cleaning a target plate in which the first cleaning pattern F and the cleaning pattern H cooperate with each other;

[0069] Fig.16 For laser processing equipment Fig.14 FIG. 1 is a schematic diagram showing the effect of an embodiment in which the first cleaning pattern F and the cleaning pattern H cooperate to perform laser cleaning on a target plate. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0071] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", etc. used herein indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0072] In the description of the present invention, unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0073] In the description of the present invention, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0074] It should be noted that laser processing equipment is mainly composed of laser generator, laser galvanometer, optical lens, sensor, and control system, etc. Among them, the laser generator is mainly used to generate a laser beam of a specific frequency wavelength (referred to as laser); the laser galvanometer is also called a laser scanner, which is mainly used to control the moving direction and speed of the laser beam within a certain range; the optical lens is mainly used to adjust the focus or diffusion of the laser beam to meet different laser cleaning needs; the sensor is mainly used to detect, record and feedback the equipment parameters, environmental parameters and cleaning effects before and after the laser cleaning, so as to provide a reference for adjusting the relevant parameters of the laser processing equipment; the control system is mainly used to comprehensively control and manage the operation of the laser processing equipment. Laser processing equipment is a relatively mature existing technology, so it will not be described in detail here.

[0075] It is worth noting that in the actual use of laser processing equipment, in order to ensure the uniformity of laser irradiation during laser cleaning of target plates such as printed circuit boards (PCBs) and metal plates (or plates to be processed, plates, etc.), the laser output power of the laser generator is continuous and relatively constant. The laser generator of the laser processing equipment in a working state will always generate lasers with a relatively constant wavelength and frequency. The laser light path in the laser processing equipment is switched to control whether the laser is irradiated out of the laser processing equipment through the optical lens to achieve the "turning on" or "turning off" of the laser, so that the laser galvanometer will start to clean the laser from the starting end point of a line in the cleaning pattern to the ending end point of the line, and in the time interval of "turning off" the laser irradiation to the target plate, the laser galvanometer will move the laser from the ending end point of a line in the cleaning pattern that has been cleaned to the starting end point of another line that has not started cleaning, and so on, until the cleaning of all the line paths of the cleaning pattern is completed.

[0076] Of course, the laser galvanometer of the laser processing equipment controls the movement direction of the laser beam along the line from one end to the other end of the line each time it cleans along the line, and the movement direction is predictable. Moreover, since the cleaning pattern of the laser cleaning work in the prior art is usually composed of multiple parallel line segments, such as Figure 6 As shown, each line segment has a start endpoint and an end endpoint.

[0077] Please read further Figure 7, because the laser galvanometer of the laser processing equipment controls the laser beam, it needs to accelerate at the starting end point when executing laser cleaning of each line segment, until it reaches a uniform speed, and then decelerates when it is about to end the end point, resulting in the laser beam movement speed at the starting end point and the ending end point of each line segment in the cleaning pattern being not uniform or fast enough, which in turn causes the target plate near the starting end point and the ending end point of each line segment to absorb more laser energy for a longer time than the uniform laser cleaning part in the middle; and because the optical lens outlet of the laser processing equipment is mostly a circular lens, that is, the laser spot projected onto the target plate through the optical lens is mostly quasi-circular, that is to say, the laser galvanometer of the laser processing equipment controls the laser beam at the starting end point when executing laser cleaning of a line segment in the cleaning pattern, which can be understood as follows Figure 7 The circle X in the figure has the starting end point of the line segment as the center. The diameter of the circle X can be adjusted by adjusting the focal length of the optical lens and other parameters. That is to say, the target plates within the range of the circle X are all within the irradiation range of the laser spot, and the laser cleaning effect can be achieved. When the laser galvanometer of the laser processing equipment controls the laser beam to move along the starting end point of the line segment to the ending end point, the circle X represented by the laser spot moves along the starting end point of the line segment to the circle X' at the ending end point, realizing the laser cleaning of a line segment in the cleaning figure, and so on. The cycle continues until the cleaning of all the connecting paths of the cleaning figure is completed.

[0078] However, since the laser spot projected onto the target plate by the optical lens of the laser processing equipment is mostly circular, the cleaning pattern coordination of two adjacent laser cleanings on the target plate needs to avoid leaving a cleaning dead corner on the target plate. Figure 8 If the distance between the endpoints of different connecting lines in the matching structure formed by the cleaning patterns of two adjacent laser cleanings is too long (greater than the laser spot diameter, that is, y is greater than the circular diameter), then there will be the following on the target plate: Figure 8 The area indicated by K in the figure in part a is a dead corner of the cleaning process. The area within the dead corner is not cleaned by the laser. If the distance between the endpoints of different connecting lines in the matching structure formed by the cleaning patterns of two adjacent laser cleanings is exactly equal to the diameter of the laser spot (i.e., y is equal to the diameter of the circle), that is, the head and tail patterns of two adjacent laser cleanings are tangent, then there is a problem on the target plate. Figure 8 The two areas indicated by K1 and K2 in the middle part b are shown as blind spots, and the areas within the blind spots are not cleaned by the laser. It can be inferred that Figure 8As shown in the figure in part c, if the distance between the endpoints of different connecting lines in the coordination structure formed by the coordination of the cleaning patterns of two adjacent laser cleanings is less than the laser spot diameter and is not 0 (i.e., y is less than the circular diameter and is not equal to 0), then as y is less than the spot diameter and approaches 0, the cleaning dead angle area of ​​the two parts of the target plate that still exist will be smaller, and at the same time, the area L that is repeatedly laser cleaned will be larger; Figure 8 As shown in the figure in part d, when the distance between the endpoints of different lines in the coordination structure formed by the coordination of the cleaning patterns of two adjacent laser cleanings is equal to 0 (that is, y is equal to 0), there is no cleaning dead angle area between the cleaning patterns of two adjacent laser cleanings on the target plate, and the result is that an area L that is repeatedly laser cleaned appears at the intersection of each line segment of the coordination structure between the cleaning patterns, which is exactly equal to the circular area of ​​a light spot. This part of the area L that is repeatedly laser cleaned is the main reason why the target plate is prone to blackening; it can be understood that when the distance between the endpoints of different lines in the coordination structure formed by the cleaning patterns of two adjacent laser cleanings is less than 0 (that is, y is less than 0), there is no cleaning dead angle area between the cleaning patterns of two adjacent laser cleanings on the target plate, and more areas that are repeatedly laser cleaned will appear. The area that is repeatedly laser cleaned receives more than twice the laser energy than other normal laser cleaned positions, and these positions of the target plate are more likely to be blackened.

[0079] See also Fig. 9 In addition to the surface area L of the target plate that is repeatedly laser cleaned and becomes seriously black, the area M composed of the adjacent end deceleration area (near the end endpoints of all line segments in the cleaning pattern) and the front acceleration area (near the start endpoints of all line segments in the cleaning pattern) of the cleaning patterns of two adjacent laser cleanings are areas that are prone to receiving too much laser cleaning laser energy. The multiple areas L included in the area M are more seriously prone to receiving too much laser energy and being oxidized and blackened.

[0080] In summary, the cleaning pattern of multiple line segments is combined with the cleaning patterns of two adjacent laser cleanings on the target plate to form a coordinated structure, which presents a "line segment-shaped" surface area with a narrow width (i.e., the overlapping width of the two adjacent laser cleanings). This narrow "line segment-shaped" surface area receives too much laser energy from the two adjacent laser cleanings, causing the surface of the target plate to become black, which may affect the material quality indicators of the plate, such as flatness, color, etc. Fig.10 shown.

[0081] Of course, the distance N between the connection paths in the cleaning graph is also one of the factors that affect the blackening of the target plate. Please continue to refer to Fig. 9If the distance between two adjacent lines in the cleaning pattern is too large (greater than the laser spot diameter, that is, N is greater than the spot diameter), it can be understood that: then there are strip-shaped cleaning dead corners between the paths on the target plate; if the distance between two adjacent lines in the cleaning pattern is exactly equal to the laser spot diameter (that is, N is greater than the spot diameter), then there are no cleaning dead corners between the paths on the target plate; if the distance between two adjacent lines in the cleaning pattern is less than the laser spot diameter (that is, N is less than the spot diameter), it can be inferred that there may be strip-shaped areas parallel to the two adjacent lines in the cleaning pattern that receive too much laser energy from laser cleaning. These positions of the target plate are more likely to turn black. At this time, the probability of these positions of the target plate turning black can be reduced by reducing the power of the laser beam.

[0082] For this reason, please see Figure 1 , an embodiment of the present application of a laser processing image confirmation method applied to a laser processing device includes:

[0083] 101. Determine a cleaning pattern of a plate to be processed, and perform laser cleaning on the plate to be processed according to the cleaning pattern; there are at least two cleaning patterns, at least two of the cleaning patterns include lines spaced apart along a first direction, each cleaning pattern includes a plurality of lines spaced apart along a second direction, each line of each cleaning pattern corresponds one to one in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed correspondingly in the first direction, and adjacent gaps in any gap group along the second direction at least do not completely overlap; wherein the first direction and the second direction are different.

[0084] The laser processing device of the pattern confirmation method for laser processing of this embodiment determines the cleaning pattern used by the laser galvanometer for the plate to be processed, so as to perform laser processing on the plate according to the cleaning pattern; wherein the cleaning pattern includes at least two cleaning patterns spaced apart along the first direction, and each cleaning pattern includes a plurality of lines spaced apart along the second direction, which means that each cleaning pattern has a plurality of paths for guiding laser processing, for example, see Fig.11 As shown in: Assuming the first direction is horizontal and the second direction is vertical, Fig.11 The first cleaning pattern A and the second cleaning pattern B in the embodiment respectively have a plurality of lines spaced apart along the second direction; the lines of the cleaning patterns correspond one to one in the first direction, so that a plurality of line groups are formed in the second direction, that is, a line of each of the two cleaning patterns can be combined to form a line group, for example Fig.11The first cleaning pattern A and the second cleaning pattern B in the embodiment each have 6 paths for guiding laser processing, and the 6 lines of the first cleaning pattern A and the second cleaning pattern B correspond to each other in the first direction, so that 6 line groups are formed in the second direction, that is, each line group includes 1 corresponding line of each cleaning pattern. Fig.11 The portion framed by the middle dashed line is one of the line groups 1101; there is a gap between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the gap group is used to represent the coordination between the cleaning patterns, for example Fig.12 The two sweeping patterns in the figure form a gap group, and Fig.13 , Fig.14 The three cleaning patterns can form two gap groups, and so on; the adjacent gaps of any gap group along the second direction at least do not completely overlap, so that the cooperation between at least two cleaning patterns forms a non-linear cooperation, for example Fig.12 The cooperation between the two cleaning figures shown is a non-linear cooperation. Fig. 9 The coordination between the two cleaning patterns shown is a linear coordination; wherein the first direction and the second direction are different, and usually the first direction and the second direction can be between 0 and 90 degrees, preferably 90 degrees. When the laser processing equipment confirms the cleaning pattern according to the above-mentioned laser processing pattern confirmation method, and then laser cleaning is performed on the plate to be processed according to the cleaning pattern, a cleaning pattern with incompletely overlapping gap coordination can be formed on the plate to be processed. The coordination of the cleaning pattern with incompletely overlapping gap coordination allows the plate to have a larger surface area to absorb the excessive laser energy of two adjacent laser cleanings, that is, using a larger target plate surface area to apportion the excessive laser energy of these two adjacent laser cleanings, which can effectively reduce the probability of the plate turning black in the adjacent area of ​​the two adjacent laser cleanings.

[0085] It should be noted that the laser processing pattern confirmation method in the above embodiment is used by the laser processing equipment to adjust and confirm the cleaning pattern after acquiring the cleaning pattern stored in the database or the designated location and before laser cleaning the plate to be processed.

[0086] Furthermore, in the above-mentioned laser processing pattern confirmation method, the adjacent gaps of any gap group in the second direction at least do not completely overlap, for example Fig.12 As shown; further, specifically, it can be: the adjacent gaps of any gap group along the second direction do not overlap at all, for example Fig.15 shown.

[0087] Furthermore, in the above-mentioned embodiment of the laser processing pattern confirmation method, the line groups of each row of the cleaning pattern are on the same horizontal line, which means that the spacing between the lines of two or more cleaning patterns contained in the cleaning pattern is the same and the number of lines is the same, and the multiple line groups include odd-numbered line groups with odd ranking numbers and even-numbered line groups with even ranking numbers, and in any gap group, the projections of the gaps corresponding to the odd-numbered line groups in the second direction are completely overlapped (for example, Fig.15 The projection diagram T2 in the figure shows that the projection of the gaps corresponding to the even-numbered line groups in the second direction is completely overlapped (for example Fig.15 The projection diagram in FIG. 1 is shown in FIG.

[0088] Furthermore, in the graphic confirmation method of laser processing in the above embodiment, the first direction is perpendicular to the second direction. For example, the first direction of this embodiment is the horizontal direction and the second direction is the vertical direction. The lines of at least two cleaning graphics spaced apart along the first direction are both line segments.

[0089] Furthermore, the plate to be processed described in the above embodiments is a printed circuit board (PCB).

[0090] See also Figure 2 , an embodiment of the laser processing method of the present application, the cleaning patterns in this embodiment are all described by taking the combination of horizontal line segments as an example, it can be understood that the embodiment usually describes each cleaning path contained in the cleaning pattern with the concept of lines, and in actual applications, the cleaning pattern can be a combination of lines such as a combination of vertical line segments or a combination of curved line segments, which is not limited here. This embodiment includes:

[0091] 201. Obtain a cleaning pattern for laser processing.

[0092] The cleaning pattern of this embodiment includes at least a first cleaning pattern and a second cleaning pattern, wherein the first cleaning pattern and the second cleaning pattern are both composed of a plurality of line segments, and an alternating matching structure can be formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern (including the so-called alternating matching structure, i.e., the above-mentioned Figure 1 The gap mentioned in the embodiment) allows the first cleaning pattern and the second cleaning pattern to be alternately arranged along a first direction. For example, the first direction can be a direction in the cleaning pattern parallel to the line segment.

[0093] It should be noted that the laser processing equipment controls the laser galvanometer to focus on the target plate (i.e. Figure 1The spatial range for laser cleaning of the plate to be processed described in the embodiment is limited. Usually, the path for the laser galvanometer to perform laser cleaning is planned within this limited spatial range. The path can be composed of one or more line segments. The set of these line segments is the path of a cleaning pattern of the laser processing equipment. In other words, after the laser galvanometer of the laser processing equipment performs a cleaning pattern cleaning on the target plate, it may not be able to cover all the areas on the surface of the target plate that need to be laser cleaned. At this time, it is necessary to move the target plate or move its optical lens (or the entire laser processing equipment) to perform laser cleaning on other parts of the target plate that have not been cleaned. For this reason, the laser processing equipment is usually used in conjunction with a mechanical platform that can move in a plane. That is, move the laser galvanometer of the laser processing equipment so that it corresponds to the first cleaning area of ​​the plate, so that the subsequent steps can be laser processed according to the first cleaning pattern; and / or, move the plate so that its first cleaning area corresponds to the laser galvanometer of the laser processing equipment, so that the subsequent steps can be laser processed according to the first cleaning pattern; and, move the laser galvanometer of the laser processing equipment so that it corresponds to the second cleaning area of ​​the plate, so that the subsequent steps can be laser processed according to the second cleaning pattern; and / or, move the target plate so that its second cleaning area corresponds to the laser galvanometer of the laser processing equipment of the laser cleaning equipment, so that the subsequent steps can be laser processed according to the second cleaning pattern. For example, the target plate is placed on a mechanical platform that can move in a plane to receive laser cleaning by the laser processing equipment, and the target plate is moved after each cleaning pattern is cleaned, so that the surface of the target plate that needs laser cleaning but has not been covered by the laser cleaning is moved to a specific position to receive laser cleaning by the laser processing equipment; for another example, the target plate is placed on an immovable mechanical platform, and the target plate is laser cleaned according to each cleaning pattern by moving the laser galvanometer; for another example, the laser processing equipment is placed on a movable mechanical platform, and the moving mechanical platform and the moving laser galvanometer simultaneously perform laser cleaning on the target plate according to each cleaning pattern; for another example, the laser processing equipment is placed on a movable mechanical platform or a mechanical arm to perform laser cleaning on the target plate, and the laser processing equipment is moved after each cleaning pattern is cleaned, so that the laser galvanometer of the laser processing equipment can control the laser beam to cover the surface of the target plate that has not been cleaned by the laser. In the prior art, laser processing equipment usually only sets one cleaning pattern for laser cleaning work, and the outer contour of the cleaning pattern in the prior art is usually flat and linear, so that when the cleaning pattern is applied to the target plate for laser cleaning, the two adjacent cleaning areas will be combined to form a narrow "line segment type" surface area matching pattern (for example, the matching gap of the cleaning pattern is linear), thereby forming an unlimited boundary pattern to meet the surface laser cleaning of target plates of different sizes.

[0094] Unlike the prior art, the present embodiment needs to obtain the first cleaning pattern and the second cleaning pattern of the laser galvanometer in the laser processing equipment for the target plate, wherein the first cleaning pattern and the second cleaning pattern are both composed of a plurality of line segments, and an alternating matching structure can be formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern. That is to say, compared with the prior art, the present embodiment requires two different first cleaning patterns and second cleaning patterns to cooperate with each other for laser cleaning of the target plate, and the area where the connecting line of the first cleaning pattern and the line segments of the second cleaning pattern can form an alternating matching structure is larger than the "line segment type" surface area formed in the prior art (in terms of Fig.12 For example, the length of the cleaning pattern in the second direction (vertical direction) is fixed. When the gap width is constant (the distance between the end points of the line segments is the same), the more curved the matching gap between different line groups of the cleaning pattern is, the larger the area occupied by the matching gap between the cleaning patterns is than that of the straight line).

[0095] 202. Configuring matching parameters so that an alternating matching structure can be formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern.

[0096] It should be noted that the alternating matching structure formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern in step 201 can be set, for example, the matching parameters of the alternating matching structure include the alternating matching structure area (for example, reference Fig. 9 The area L or the area M or Fig.15 area L or area M in the figure), the shape of the alternating structure, the distance between the line segments of the alternating structure (for example, reference Fig. 9 The distance N in the figure), the distance between the endpoints of the line segments of the alternating matching structure (for example, the reference Figure 8 The distance y in Figure 1 One or more of the non-linear fitting clearances described in the embodiments.

[0097] In some other embodiments, the matching shape of the alternating matching structure in this step can be found in Fig.11 , Fig.11 A schematic diagram showing the first cleaning pattern A and the first cleaning pattern B of the present application, wherein the left side of the first cleaning pattern A is flush, and the end points of the line segments on the right side of the first cleaning pattern A are of different lengths (i.e., matching shape A); the left side of the second cleaning pattern B corresponds to the end points of the line segments on the right side of the first cleaning pattern A in length and matches (i.e., matching shape B), and the right side of the second cleaning pattern B is flush; it is suitable for cleaning target plates that can be covered by an even number of cleaning pattern width dimensions (or length dimensions). For the laser cleaning effect of the matching shape of the so-called alternating matching structure, please refer to Fig.12 , Fig.12 for Fig.11Schematic diagram of the cleaning effect estimation of the first cleaning pattern A and the first cleaning pattern B, from Fig.12 It can be seen that since the endpoints of the adjacent line segments of the matching structure between the first cleaning pattern A and the second cleaning pattern B are staggered on the surface (so it is called an alternating matching structure, that is, a matching structure that is embedded in each other and alternating, which is different from the linear matching structure of the prior art), the "surface area L" that is repeatedly laser cleaned will not be too concentrated on a vertical line as in the prior art, reducing the laser heat concentration of the "surface area L" that is repeatedly laser cleaned, and can reduce the probability of oxidation and blackening of the "surface area L" that is repeatedly laser cleaned; and because the first cleaning pattern A and the second cleaning pattern B are matched with each other, the "surface area L" that is repeatedly laser cleaned will not be too concentrated on a vertical line as in the prior art, reducing the laser heat concentration of the "surface area L" that is repeatedly laser cleaned. The endpoints of adjacent line segments are staggered on the surface, and the distance between the line segment endpoints of the alternating matching structure can be adjusted in coordination with the distance between the line segments of the alternating matching structure. For example, the laser power can be reduced so that the distance between the line segments of the alternating matching structure is smaller than the laser spot diameter, so that there are strip-shaped overlapping parts between the adjacent line segment paths of the laser cleaning. The longer distance between the line segment endpoints of the alternating matching structure (greater than 0 and less than the laser spot diameter) allows the two parts of the cleaning dead angle formed at the longer distance to be covered by the above-mentioned strip-shaped overlapping parts, which can also effectively reduce the formation of the "surface area L" that is repeatedly laser cleaned. Further preferably, Fig.12 When the first cleaning pattern A and the first cleaning pattern B form an alternating matching structure, the total length of the line segments of the first cleaning pattern A and the second cleaning pattern B corresponding to each row of the two patterns is equal.

[0098] See also Fig.13 , Fig.13 A schematic diagram of an embodiment of the first cleaning pattern C, the first cleaning pattern D and the cleaning pattern E of the present application method is shown, wherein when the second cleaning pattern D is ignored, the cleaning pattern E can be used as the second cleaning pattern E combined with the first cleaning pattern C to perform the above-mentioned laser cleaning work, to achieve similar Fig.11 Functional application; if some target plates require an odd number of cleaning pattern widths to cover and clean, then this embodiment can use the second cleaning pattern D as the middle pattern part of the first cleaning pattern C and the cleaning pattern E to form a combination of three cleaning patterns to perform the above-mentioned laser cleaning work. Preferably, please refer to Fig.14 , Fig.14 A schematic diagram showing an embodiment of the first cleaning pattern F, the first cleaning pattern G and the cleaning pattern H of the laser cleaning method of the present application, compared to Fig.13 In the embodiment, the alternating matching structure formed between the first cleaning pattern F, the first cleaning pattern G and the cleaning pattern H is a uniform alternating matching structure, also known as a gear-type meshing structure, that is, including Figure 1The adjacent gaps of any gap group mentioned in the embodiment do not overlap at all. This is a cleaning pattern in which the lengths of several line segments are orderly staggered, which is conducive to the adjustment and maintenance of the matching parameters of the alternating matching structure and is very convenient. More preferably, the uniform alternating matching structure is that the line segments of the first cleaning pattern and the line segments of the second cleaning pattern are sequentially embedded and matched. Please refer to Fig.15 , Fig.15 For laser processing equipment Fig.14 A schematic diagram of the effect of performing laser cleaning on a target plate in cooperation with the first cleaning pattern F and the cleaning pattern H is similar to Fig.12 The repeated part of the effect inference process will not be repeated here. It should be noted that Fig.15 Since the alternating coordination structure formed in the process is an alternating coordination structure in sequence, the area M that receives more laser energy formed by the laser galvanometer of the laser processing equipment controlling the laser deceleration and acceleration will also occupy a larger surface area on the target plate. The larger surface area is conducive to the heat dissipation of more laser energy, further reducing the probability of oxidation and blackening at these positions of the target plate due to receiving more laser energy, and the areas on the target plate that may have oxidation and blackening problems are more regular and controllable.

[0099] 203. Make the laser galvanometer of the laser cleaning device correspond to the first cleaning area of ​​the target plate.

[0100] The target plate of this step usually has a size that cannot be directly covered by the first cleaning pattern or the second cleaning pattern used by the laser processing equipment. Therefore, this step requires that the laser galvanometer of the laser processing equipment can work in the first cleaning area of ​​the target plate, that is, the moving range of the laser galvanometer to control the laser in this step is the first cleaning area. For example, move the laser processing equipment or move the target plate to a specific matching position so that the laser galvanometer of the laser processing equipment can be aimed at the first cleaning area of ​​the target plate for laser cleaning.

[0101] 204. Perform laser cleaning on the target plate along the connecting line of the first cleaning pattern to complete laser cleaning of the first cleaning pattern on the target plate.

[0102] Since the connecting lines of the first cleaning pattern are usually line paths composed of a number of line segments, curves, etc., the laser processing equipment will perform laser cleaning on each connecting line path according to certain rules (for example, from top to bottom, from left to right, and from right to left) in this step until all the connecting lines of the first cleaning pattern are completed and laser cleaning is performed on the target plate.

[0103] 205. Make the laser galvanometer of the laser processing equipment correspond to a second cleaning area of ​​the target plate, and the second cleaning area is adjacent to the first cleaning area.

[0104] The target plate of this step usually has a size that cannot be directly covered by any of the first cleaning pattern or the second cleaning pattern of the cleaning pattern used by the laser processing equipment. After completing the laser cleaning of the first cleaning pattern of the first cleaning area of ​​the target plate in step 203, this step requires that the laser galvanometer of the laser processing equipment can work in the second cleaning area of ​​the target plate, wherein the second cleaning area is adjacent to the first cleaning area, so as to achieve regular and continuous laser cleaning of the large-sized target plate. For example, the laser processing equipment is moved or the target plate is moved to another specific matching position, so that the laser galvanometer of the laser processing equipment can be aligned with the second cleaning area of ​​the target plate for laser cleaning.

[0105] 206. Perform laser cleaning on the target plate along the connecting line of the second cleaning pattern to complete laser cleaning of the second cleaning pattern on the target plate.

[0106] In this step, the laser processing equipment will perform laser cleaning path by path according to certain rules (for example, from top to bottom, from left to right, and from right to left) until all the connecting paths of the second cleaning pattern are completed to perform laser cleaning on the target plate, so that the first cleaning area and the second cleaning area on the target plate that realize adjacent cleaning have an area formed by the alternating matching structure. At this time, the first cleaning area and the second cleaning area on the target plate that realize adjacent cleaning have a laser cleaning area formed by the alternating matching structure, which is equivalent to the alternating matching structure that can be formed between the connecting lines of the first cleaning pattern and the connecting lines of the second cleaning pattern being reproduced on the target plate, and the alternating matching structure reproduced on the target plate is equivalent to the alternating matching structure area that can be formed between the connecting lines of the first cleaning pattern and the second cleaning pattern. In actual applications, the alternating matching structure area reproduced on the target plate is usually proportional to the theoretical area; compared with the prior art that only has one cleaning pattern when laser cleaning the target plate, this cleaning pattern is also a structure with a smooth contour, so that the laser galvanometer of the laser processing equipment in the prior art performs two adjacent cleaning operations on the target plate. The laser cleaning coordination of the cleaning pattern is an adjacent and parallel arrangement of the cleaning pattern. After laser cleaning, the coordination structure of the two adjacent cleaning areas usually formed on the target plate is a "line segment type" surface area with a narrow width. The "line segment type" surface area with a narrow width receives excessive laser energy from two adjacent laser cleanings, which will cause the surface of the target plate here to be easily oxidized and blackened. The above-mentioned embodiment of the present application has an alternating coordination structure formed between the connecting lines of the first cleaning pattern and the connecting lines of the second cleaning pattern, which has a larger surface area to absorb the excessive laser energy of two adjacent laser cleanings, that is, using a larger target plate surface area to share the excessive laser energy of these two adjacent laser cleanings, which can effectively reduce the probability of the target plate turning black in the adjacent areas of two adjacent laser cleanings.

[0107] See also Fig.16 , Fig.16 For laser processing equipment Fig.14 The figure is a schematic diagram of the effect of an embodiment in which the first cleaning pattern F and the cleaning pattern H cooperate to perform laser cleaning on the target plate. It can be seen from the figure that the above-mentioned embodiment of the present application can absorb the excessive laser energy of the two adjacent laser cleanings by adjusting the area of ​​the alternating matching structure formed between the connecting line of the first cleaning pattern and the connecting line of the second cleaning pattern, that is, using a larger surface area of ​​the target plate to share the excessive laser energy of the two adjacent laser cleanings, which can effectively reduce the probability of the target plate becoming black in the adjacent area of ​​the two adjacent laser cleanings.

[0108] 207. Summarize and record the coordination parameters of the gap that can be formed between the connecting lines of the first cleaning pattern and the connecting lines of the second cleaning pattern of the target plate, the working coordination parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer, and obtain the laser processing process data of the target plate using the laser galvanometer of the laser processing equipment.

[0109] It is understandable that there may be various factors that cause process problems such as oxidation and blackening of the target plate during the laser cleaning process. They may be related to the cleaning pattern setting mentioned in the above embodiment, or to the working coordination parameters of the laser galvanometer of the laser processing equipment (movement acceleration, uniform speed, deceleration speed, etc.) and the working environment parameters of the laser galvanometer (temperature, humidity, electromagnetic environment, etc.). In order to test and transplant the mature laser cleaning process data for the target plate, this step can summarize and record the alternating coordination structure (including Figure 1 The matching parameters of the matching gap described in the embodiment, the working matching parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer are used to obtain the laser cleaning process processing data of the target plate using the laser galvanometer of the laser processing equipment, so as to ensure that the verified laser cleaning process processing data of the target plate can be reused, reduce costs and accumulate experience.

[0110] The above embodiment describes the embodiment of the laser cleaning method of the present application. The following describes the embodiment of the pattern confirmation device for laser processing of the present application. Figure 3 , an embodiment of the graphic confirmation device for laser processing of the present application comprises:

[0111] The determination module 301 is used to determine a cleaning pattern of the plate to be processed, so as to perform laser cleaning on the plate to be processed according to the cleaning pattern;

[0112] The cleaning patterns include at least two, at least two of the cleaning patterns are arranged at intervals along the first direction, each of the cleaning patterns includes a plurality of lines spaced apart along the second direction, each of the lines of each of the cleaning patterns corresponds to each other in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the adjacent gaps in any gap group along the second direction at least do not completely overlap;

[0113] The first direction and the second direction are different.

[0114] Optionally, adjacent gaps in any gap group along the second direction at least do not completely overlap, including:

[0115] Adjacent gaps in any gap group along the second direction do not overlap at all.

[0116] Optionally, the line groups in each row are on the same horizontal line, and the multiple line groups include odd-numbered line groups and even-numbered line groups, and in any gap group, the projections of the gaps corresponding to the odd-numbered line groups in the second direction are completely overlapped, and the projections of the gaps corresponding to the even-numbered line groups in the second direction are completely overlapped.

[0117] Optionally, the first direction is perpendicular to the second direction, and the lines of the at least two cleaning patterns spaced apart along the first direction are both line segments.

[0118] Optionally, the plate to be processed is a printed circuit board.

[0119] The operation performed by the laser processing pattern confirmation device of the present application is similar to the above Figure 1 The operations performed in the embodiment are similar and will not be described in detail here.

[0120] See also Figure 4 The laser processing device of the present application is applied to laser processing equipment, including:

[0121] An acquisition module 401 is used to acquire a cleaning pattern confirmed by the laser processing pattern confirmation device according to any one of the third aspects above;

[0122] The cleaning module 402 is used to perform laser cleaning on the plate to be processed according to the cleaning pattern.

[0123] Optionally, the cleaning pattern includes at least a first cleaning pattern and a second cleaning pattern; when the cleaning module performs laser cleaning on the plate to be processed according to the cleaning pattern, it is specifically used to:

[0124] Moving the laser galvanometer of the laser processing equipment to make it correspond to the first cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the first cleaning pattern; and / or,

[0125] Moving the plate to be processed so that the first cleaning area thereof corresponds to the laser galvanometer of the laser processing device, and laser cleaning the plate to be processed according to the first cleaning pattern;

[0126] as well as,

[0127] Moving the laser galvanometer of the laser processing equipment to make it correspond to the second cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the second cleaning pattern; and / or,

[0128] The plate to be processed is moved so that the second cleaning area thereof corresponds to the laser galvanometer of the laser processing equipment, and the plate to be processed is laser cleaned according to the second cleaning pattern.

[0129] Optionally, the plate to be processed is a printed circuit board, and the device further comprises:

[0130] The summary module 403 is used to summarize and record the matching parameters of the gap that can be formed between the line segments of the first cleaning pattern and the line segments of the second cleaning pattern of the printed circuit board, the working matching parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer, so as to obtain the laser processing data of the printed circuit board using the laser galvanometer of the laser processing equipment.

[0131] The operation performed by the laser cleaning device of the present application is similar to the above Figure 2 The operations performed in the embodiment are similar and will not be described in detail here.

[0132] The computer device in the embodiment of the present application is described below. Figure 5 , an embodiment of the computer device in the embodiment of the present application includes:

[0133] The computer device 500 may include one or more processors (central processing units, CPU) 501 and a memory 502, in which one or more application programs or data are stored. The memory 502 is a volatile storage or a persistent storage. The program stored in the memory 502 may include one or more modules, and each module may include a series of instruction operations in the computer device. Furthermore, the processor 501 may be configured to communicate with the memory 502 to execute a series of instruction operations in the memory 502 on the computer device 500. The computer device 500 may also include one or more wireless network interfaces 503, one or more input and output interfaces 504, and / or one or more operating systems, such as Windows Server, Mac OS, Unix, Linux, FreeBSD, etc. The processor 501 may execute the aforementioned Figure 1 or Figure 2 The operations performed in the illustrated embodiment will not be described in detail here.

[0134] In addition, each functional unit in each embodiment of the present application can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, read-only memory), random access memory (RAM, random access memory), disk or optical disk and other media that can store program code.

[0135] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for confirming a pattern in laser processing, characterized in that: The method comprises: Determine a cleaning pattern of a plate to be processed, and perform laser cleaning on the plate to be processed according to the cleaning pattern; The cleaning patterns include at least two, at least two of the cleaning patterns are arranged at intervals along the first direction, each of the cleaning patterns includes a plurality of lines spaced apart along the second direction, each of the lines of each of the cleaning patterns corresponds to each other in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the adjacent gaps of any gap group along the second direction at least do not completely overlap; The first direction and the second direction are different.

2. The pattern confirmation method for laser processing according to claim 1, characterized in that: Adjacent gaps in any gap group along the second direction at least do not completely overlap, including: Adjacent gaps in any gap group along the second direction do not overlap at all.

3. The pattern confirmation method for laser processing according to claim 1, characterized in that: The line groups in each row are on the same horizontal line, and the multiple line groups include odd-numbered line groups and even-numbered line groups, and in any gap group, the projections of the gaps corresponding to the odd-numbered line groups in the second direction are completely overlapped, and the projections of the gaps corresponding to the even-numbered line groups in the second direction are completely overlapped.

4. The pattern confirmation method for laser processing according to any one of claims 1 to 3, characterized in that: The first direction is perpendicular to the second direction, and the lines of the at least two cleaning patterns spaced apart along the first direction are both line segments.

5. The pattern confirmation method for laser processing according to any one of claims 1 to 3, characterized in that: The plate to be processed is a printed circuit board.

6. A laser processing method, characterized in that: Applied to laser processing equipment, the laser processing equipment is used for laser cleaning, the method comprises: Obtaining a cleaning pattern confirmed by the pattern confirmation method for laser processing according to any one of claims 1 to 5; The plate to be processed is laser cleaned according to the cleaning pattern.

7. The laser processing method according to claim 6, characterized in that: The cleaning pattern at least includes a first cleaning pattern and a second cleaning pattern; and the laser cleaning of the plate to be processed according to the cleaning pattern includes: Moving the laser galvanometer of the laser processing equipment to make it correspond to the first cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the first cleaning pattern; and / or, Moving the plate to be processed so that the first cleaning area thereof corresponds to the laser galvanometer of the laser processing device, and laser cleaning the plate to be processed according to the first cleaning pattern; as well as, Moving the laser galvanometer of the laser processing equipment to make it correspond to the second cleaning area of ​​the plate to be processed, and laser cleaning the plate to be processed according to the second cleaning pattern; and / or, The plate to be processed is moved so that the second cleaning area thereof corresponds to the laser galvanometer of the laser processing equipment, and the plate to be processed is laser cleaned according to the second cleaning pattern.

8. The laser processing method according to claim 7, characterized in that: The plate to be processed is a printed circuit board, and the method further comprises: The matching parameters of the gap that can be formed between the line segments of the first cleaning pattern and the second cleaning pattern of the printed circuit board, the working matching parameters of the laser galvanometer, and the working environment parameters of the laser galvanometer are summarized and recorded to obtain the laser processing data of the printed circuit board using the laser galvanometer of the laser processing equipment.

9. A pattern confirmation device for laser processing, characterized in that: The device comprises: A determination module, used to determine a cleaning pattern of a plate to be processed, so as to perform laser cleaning on the plate to be processed according to the cleaning pattern; The cleaning patterns include at least two, at least two of the cleaning patterns are arranged at intervals along the first direction, each of the cleaning patterns includes a plurality of lines spaced apart along the second direction, each of the lines of each of the cleaning patterns corresponds to each other in the first direction, so that a plurality of line groups are formed in the second direction, there are gaps between the lines corresponding to two adjacent cleaning patterns in each line group, and at least one gap group is formed in the first direction, and the adjacent gaps in any gap group along the second direction at least do not completely overlap; The first direction and the second direction are different.

10. A laser processing device, characterized in that: Applied to laser processing equipment, the laser processing equipment is used for laser cleaning, the device comprises: An acquisition module, used to acquire a cleaning pattern confirmed by the pattern confirmation device for laser processing according to claim 9; A cleaning module is used to perform laser cleaning on the plate to be processed according to the cleaning pattern.

11. A computer device, characterized in that: include: Processor, memory, bus, input and output interface, network interface; The processor is connected to the memory, the input / output interface, and the network interface via the bus; The memory stores a program; When the processor executes the program stored in the memory, it implements the graphic confirmation method for laser processing as described in any one of claims 1 to 5, or implements the laser processing method as described in any one of claims 6 to 8.

12. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed on a computer, the computer executes the graphic confirmation method for laser processing as described in any one of claims 1 to 5, or implements the laser processing method as described in any one of claims 6 to 8.

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