Electronic module with leak-proof structure

Abstract

An electronic module with a leakproof structure comprises a carrier plate, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a radiator. The heat source is arranged on the carrier plate. The metal frame is arranged on the carrier plate and surrounds the heat source. The elastic isolation part is arranged between the metal frame and the heat source, the elastic isolation part comprises a continuous wall and a substrate, the substrate is connected with the bottom side of the continuous wall, a central opening is formed in the substrate, the heat source corresponds to the central opening, and the continuous wall defines an accommodating space. The liquid metal material is arranged on the heat source, and the elastic isolation component is suitable for limiting flowing of the liquid metal material. The radiator comprises a radiator bottom surface and a boss, and the boss is in contact with the liquid metal material.

Description

Technical Field

[0001] The embodiments of the present invention relate to an electronic module, and more particularly to an electronic module that uses liquid metal for heat conduction and has a structure for preventing liquid metal leakage. Background Art

[0002] Liquid metal materials have been used in electronic modules to provide electrical and thermal conductivity and other functions. Conventional electronic modules include components such as a carrier, a chip (heat source), and a metal frame. The chip is set on the carrier and the metal frame surrounds the chip. The upper surface of the chip will contact the liquid metal material. To prevent the liquid metal material from leaking, a circle of sealant will be applied to the metal frame. However, the sealant will adhere to the radiator, making it difficult to disassemble the radiator. And the processes of gluing and drying the sealant are not only labor-intensive but also time-consuming, thus increasing the production cost. In addition, in conventional technology, liquid metal materials are prone to leaking and cause short circuits in electronic parts. Summary of the invention

[0003] An embodiment of the present invention is an electronic module provided to solve the problems of the conventional technology, comprising a carrier, a heat source, a metal frame, an elastic isolation component, a liquid metal material and a heat sink. The heat source is disposed on the carrier. The metal frame is disposed on the carrier and surrounds the heat source. The elastic isolation component is disposed between the metal frame and the heat source, wherein the elastic isolation component comprises a continuous wall and a base material, the base material is connected to the bottom side of the continuous wall, the base material is formed with a central opening, the heat source corresponds to the central opening, and the continuous wall defines a accommodating space. The liquid metal material is disposed on the heat source, wherein the elastic isolation component is suitable for limiting the flow of the liquid metal material. The heat sink comprises a radiator bottom surface and a boss, the boss is formed on the radiator bottom surface, wherein the boss extends into the accommodating space and contacts the liquid metal material.

[0004] In one embodiment, the elastic isolation component is an insulating material.

[0005] In one embodiment, the electronic module further includes a plurality of electronic components and a waterproof material, wherein the plurality of electronic components are disposed on the carrier board, the plurality of electronic components are located between the metal frame and the heat source, and the waterproof material covers the plurality of electronic components.

[0006] In one embodiment, the base material of the elastic isolation component corresponds to the waterproof material.

[0007] In one embodiment, the electronic module further includes an elastic conductive component, which surrounds the elastic isolation component and is sandwiched between the bottom surface of the heat sink and the metal frame.

[0008] In one embodiment, the liquid metal material includes indium.

[0009] In one embodiment, the elastic isolation component includes an elastic insulating foam.

[0010] In one embodiment, the material of the continuous wall is elastic insulating foam, the material of the base material is elastic insulating foam, and the elastic isolation component also includes a first plastic material and a second plastic material. The first plastic material is arranged on the upper surface of the continuous wall, and the second plastic material is arranged on the upper surface of the base material.

[0011] In one embodiment, the elastic isolation component includes thermally conductive silicone.

[0012] The electronic module of the embodiment of the present invention adopts an elastic isolation component to replace the conventional sealant. The elastic isolation component is easy to disassemble and assemble, directly solving the various shortcomings of the conventional sealant and saving manufacturing costs. In addition, the elastic isolation component of the embodiment of the present invention can cover the electronic parts between the metal frame and the heat source to provide further protection for these electronic parts (avoid short circuit). In addition, the shape of the boss of the heat sink and the elastic isolation component can be matched to further reduce the chance of overflow of liquid metal material. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a combined diagram showing an electronic module of an embodiment of the present invention;

[0014] Figure 2 is an exploded view showing an electronic module according to an embodiment of the present invention;

[0015] Figure 3A Detailed structure of an elastic isolation component according to an embodiment of the present invention is shown;

[0016] Figure 3B is an exploded view showing an elastic isolation component according to another embodiment of the present invention;

[0017] Figure 4 Detailed structure of a heat sink according to an embodiment of the present invention is shown;

[0018] Figure 5 2 is a cross-sectional view taken along the VV direction of an electronic module according to an embodiment of the present invention.

[0019]

Explanation of symbols

[0020] M~Electronic module

[0021] 1~Carrier board

[0022] 100~Circuit board

[0023] 2. Heat source

[0024] 3. Metal frame

[0025] 4~Elastic isolation components

[0026] 41~Continuous wall

[0027] 42~Base material

[0028] 421~Central opening

[0029] 431~First plastic material

[0030] 432~Second plastic material

[0031] 5. Liquid metal

[0032] 6. Radiator

[0033] 61~Radiator bottom

[0034] 62~Boss

[0035] 621~bottom of boss

[0036] 63~Radiator fins

[0037] 64~Top surface of radiator base

[0038] 7. Electronic parts

[0039] 8. Waterproof material

[0040] 9~Elastic conductive parts

[0041] S~Accommodation space DETAILED DESCRIPTION

[0042] Figure 1 2 is a diagram showing an assembly of an electronic module according to an embodiment of the present invention. Figure 2 is an exploded view showing an electronic module according to an embodiment of the present invention. Figure 1 , 2 The electronic module M of the embodiment of the present invention comprises a carrier board 1, a heat source 2, a metal frame 3, an elastic isolation component 4, a liquid metal material 5 and a heat sink 6. The heat source 2 is disposed on the carrier board 1. The metal frame 3 is disposed on the carrier board 1 and surrounds the heat source 2. The elastic isolation component 4 is disposed between the metal frame 3 and the heat source 2. The carrier board 1 is disposed on a circuit board 100.

[0043] In one embodiment, the heat source 2 can be a central processing unit (CPU), a graphics processing unit (GPU), a network processing unit (NPU) or other electronic components. The above disclosure does not limit the present invention.

[0044] Figure 3A Detailed structure of the elastic isolation component of the embodiment of the present invention is shown. Figure 2 , 3AThe elastic isolation component 4 includes a continuous wall 41 and a bottom material 42. The bottom material 42 is connected to the bottom side of the continuous wall 41. The bottom material 42 forms a central opening 421. The heat source 2 corresponds to the central opening 421. The continuous wall 41 defines an accommodating space. The liquid metal material 5 is disposed on the heat source 2, wherein the elastic isolation component 4 is suitable for limiting the flow of the liquid metal material 5.

[0045] In one embodiment, the heat source 2 contacts the liquid metal material 5 through the central opening 421. The size of the central opening 421 matches the size of the heat source 2 to reduce the chance of liquid metal material 5 leaking.

[0046] The liquid metal material can be a metal material that can be liquefied, or a thermal conductive paste containing a metal component. In one embodiment, the liquid metal material can be further added with indium, thereby providing a better thermal conductive effect. The above disclosure does not limit the present invention.

[0047] Figure 4 FIG. 1 shows the detailed structure of a heat sink according to an embodiment of the present invention. Figure 5 2 is a cross-sectional view taken along the VV direction of an electronic module according to an embodiment of the present invention. Figure 4 , 5 In one embodiment, the heat sink 6 includes a heat sink bottom surface 61 and a boss 62, wherein the boss 62 is formed on the heat sink bottom surface 61, wherein the boss 62 extends into the accommodating space S and contacts the liquid metal material 5. The heat sink 6 may further include heat sink fins 63, which are disposed on a heat sink base top surface 64 of the heat sink 4.

[0048] Matching reference Figure 2 , 5 In one embodiment, the continuous wall 41 may interfere with the boss 62 to provide a better leak-proof effect.

[0049] Matching reference Figure 2 , 3A , 4, 5, in one embodiment, the area of ​​the boss bottom surface 621 of the boss 62 is larger than the area of ​​the central opening 421. In other words, the boss bottom surface 621 can fully cover the central opening 421 to provide a better leak-proof effect.

[0050] Matching reference Figure 2 , 5 In one embodiment, the elastic isolation component 4 is made of an insulating material.

[0051] Matching reference Figure 2 , 5In one embodiment, the electronic module further includes a plurality of electronic components 7 and a waterproof material 8 . The electronic components 7 are disposed on the carrier 1 . The electronic components 7 are located between the metal frame 3 and the heat source 2 . The waterproof material 8 covers the electronic components 7 .

[0052] In one embodiment, the waterproof material 8 may be a waterproof coating. The above disclosure does not limit the present invention. In another embodiment, the waterproof material 8 may also be a film or other waterproof materials.

[0053] These electronic components 7 can be capacitors, inductors or other electrical components. The above disclosure does not limit the present invention.

[0054] Matching reference Figure 3A , 5 In one embodiment, the bottom material 42 of the elastic isolation member 4 corresponds to the waterproof material 8. Specifically, the bottom material 42 covers and abuts against the waterproof material 8 to prevent the liquid metal material 5 from overflowing to the electronic component 7 and causing a short circuit.

[0055] Matching reference Figure 2 , 5 In the next embodiment, the electronic module further includes an elastic conductive component 9, which surrounds the elastic isolation component 4 and is sandwiched between the bottom surface 61 of the heat sink and the metal frame 3. The elastic conductive component 9 is used with the metal frame 3 to prevent electromagnetic interference (EMI) leakage.

[0056] Figure 3B FIG. 2 is an exploded view showing an elastic isolation component of another embodiment of the present invention. Figure 3B In this embodiment, the elastic isolation component 4 is mainly composed of elastic insulating foam. For example, the continuous wall 41 and the base material 42 of the elastic isolation component 4 are made of elastic insulating foam. In addition, the elastic isolation component 4 also includes a first plastic material 431 and a second plastic material 432. The first plastic material 431 is disposed on the upper surface of the continuous wall 41, and the second plastic material 432 is disposed on the upper surface of the base material 42. The first plastic material 431 can be attached to the upper surface of the continuous wall 41 by adhesive. The second plastic material 432 can be attached to the upper surface of the base material 42 by adhesive.

[0057] In one embodiment, since the plastic material has an anti-adhesion function, the liquid metal material 5 can be prevented from adhering to the elastic isolation component 4 .

[0058] In another embodiment, the elastic isolation member 4 may be made of thermally conductive silicone. The elastic isolation member 4 may be integrally formed or formed by a continuous wall attached to a substrate. In this embodiment, since the thermally conductive silicone itself has an anti-adhesion function, the surface of the thermally conductive silicone may not be provided with plastic material.

[0059] The electronic module of the embodiment of the present invention adopts an elastic isolation component to replace the conventional sealant. The elastic isolation component is easy to disassemble and assemble, directly solving the various shortcomings of the conventional sealant and saving manufacturing costs. In addition, the elastic isolation component of the embodiment of the present invention can cover the electronic parts between the metal frame and the heat source to provide further protection for these electronic parts (avoid short circuit). In addition, the shape of the boss of the heat sink and the elastic isolation component can be matched to further reduce the chance of overflow of liquid metal material.

[0060] Although the present invention has been disclosed as above with specific preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can still make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined by the attached claims.

Claims

1. An electronic module with an anti-leakage structure, characterized in that: include: a carrier board; a heat source disposed on the carrier plate; a metal frame disposed on the carrier and surrounding the heat source; an elastic isolation component, disposed between the metal frame and the heat source, wherein the elastic isolation component comprises a continuous wall and a base material, the base material is connected to the bottom side of the continuous wall, the base material is formed with a central opening, the heat source corresponds to the central opening, and the continuous wall defines a containing space; A liquid metal material is disposed on the heat source, wherein the elastic isolation component is suitable for limiting the flow of the liquid metal material; and A heat sink includes a heat sink bottom surface and a boss, wherein the boss is formed on the heat sink bottom surface, wherein the boss extends into the accommodating space and contacts the liquid metal material.

2. The electronic module with anti-leakage structure according to claim 1, characterized in that: The elastic isolation component is made of insulating material.

3. The electronic module with anti-leakage structure according to claim 2, characterized in that: It also includes a plurality of electronic components and a waterproof material. The plurality of electronic components are arranged on the carrier board, the plurality of electronic components are located between the metal frame and the heat source, and the waterproof material covers the plurality of electronic components.

4. The electronic module with anti-leakage structure according to claim 3, characterized in that: The base material of the elastic isolation component corresponds to the waterproof material.

5. The electronic module with anti-leakage structure according to claim 2, characterized in that: The invention also comprises an elastic conductive component, which surrounds the elastic insulating component and is sandwiched between the bottom surface of the heat sink and the metal frame.

6. The electronic module with anti-leakage structure according to claim 2, characterized in that: The liquid metal material includes indium.

7. The electronic module with anti-leakage structure according to claim 2, characterized in that: The elastic isolation component includes an elastic insulating foam.

8. The electronic module with anti-leakage structure according to claim 7, characterized in that: The elastic isolation component also includes a plastic material, and the plastic material is arranged on the upper surface of the elastic isolation component.

9. The electronic module with anti-leakage structure according to claim 2, characterized in that: The material of the continuous wall is elastic insulating foam, the material of the base material is elastic insulating foam, the elastic isolation component also includes a first plastic material and a second plastic material, the first plastic material is arranged on the upper surface of the continuous wall, and the second plastic material is arranged on the upper surface of the base material.

10. The electronic module with anti-leakage structure according to claim 2, characterized in that: The elastic isolation component includes thermally conductive silica gel.

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