Aluminum substrate circuit via hole die and drilling method thereof

Abstract

The invention relates to the technical field of aluminum substrate molds, and discloses an aluminum substrate circuit via hole mold and a use method of the aluminum substrate circuit via hole mold. A first drilling station and a second drilling station are arranged on a mold main body, and an aluminum substrate is sequentially placed on the first drilling station and the second drilling station; the upper die holder and the lower die holder are matched to conduct semi-shearing drilling on the aluminum substrate located at the first drilling station and conduct drilling shaping and die closing on the aluminum substrate located at the second drilling station, hole plugging is not needed, the punching efficiency and the yield of the aluminum substrate are improved, and meanwhile the machining cost of the aluminum substrate is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum substrate molds, and in particular to an aluminum substrate circuit via hole mold and a drilling method thereof. Background Art

[0002] Aluminum substrates have good advantages in thermal conductivity, electrical insulation, dimensional stability, and mechanical processing performance. Generally, aluminum substrates are composed of three layers, namely the circuit layer (copper foil), the insulation layer, and the aluminum metal base layer.

[0003] Usually, when an aluminum substrate is processed and used, it is necessary to drill holes in the aluminum substrate. The existing drilling scheme will form burrs in the holes after drilling the aluminum substrate. The burrs are likely to affect the subsequent voltage resistance test, resulting in a decrease in the yield rate of the aluminum substrate after drilling.

[0004] If the drilled hole is milled with a milling cutter after drilling, it will be relatively difficult to remove the burrs in the drilled hole by milling, and the time cost is high. If the drilled hole is directly punched with a machine, it is necessary to use a more advanced mold to remove the burrs in the drilled hole by punching, and a large amount of manpower and material resources need to be invested in the design of the mold, which leads to an increase in processing costs. Therefore, the existing technology still uses the traditional plugging process to process the burrs of the drilled hole, which has reduced the processing cost of the aluminum substrate, and therefore needs to be improved. Summary of the invention

[0005] The main purpose of the present invention is to provide an aluminum substrate circuit via hole mold and a drilling method thereof, aiming to provide a mold that can quickly drill holes in an aluminum substrate and a method for drilling holes using the mold.

[0006] To achieve the above-mentioned purpose, the present invention proposes an aluminum substrate circuit via hole mold, including a mold body, the mold body including an upper mold base and a lower mold base, a first drilling station and a second drilling station are respectively arranged at intervals on the mold body, the lower mold base is provided with a half-shear punch arranged vertically upward on the first drilling station, the upper mold base is provided with a half-shear inner top corresponding to the half-shear punch on the first drilling station, the upper mold base and the lower mold base cooperate with the half-shear inner top and the half-shear punch to realize half-shear drilling of the external aluminum substrate, the upper mold base is provided with a back-slap punch arranged vertically downward on the second drilling station, the lower mold base is provided with a back-slap inner top corresponding to the back-slap punch on the second drilling station, the upper mold base and the lower mold base cooperate with the back-slap punch and the back-slap inner top to realize back-slap forming of the half-shear drilling of the external aluminum substrate.

[0007] Specifically, the upper die seat includes an upper seat body, an upper pad and an upper stripping plate. The upper seat body and the upper stripping plate are respectively arranged on the upper and lower sides of the upper pad, and the half-shear inner top and the back-beating punch are both arranged at the upper stripping plate.

[0008] Specifically, the upper stripping plate is provided with an upper die mounting hole with an opening facing downward at the first drilling station and the second drilling station, and the half-shear inner top and the back-slap punch are respectively arranged in the corresponding upper die mounting holes and a receiving groove is formed at the lower end of the upper die mounting hole.

[0009] Specifically, the lower die base includes a lower seat body, a lower pad and a lower template. The lower template and the lower seat body are respectively arranged on the upper and lower sides of the lower pad, and the half-shear punch and the back-beating inner top are both arranged at the lower template.

[0010] Specifically, the lower template is provided with a lower mold mounting hole with an opening facing upward at the first drilling station and the second drilling station, the half-shear punch and the back-beat inner top are respectively arranged in the corresponding lower mold mounting holes, and the upper end portions of the half-shear punch and the back-beat inner top extend upward to the upper end of the lower template.

[0011] Specifically, the lower die base is provided with placement grooves corresponding to the external aluminum substrate at both the first drilling station and the second drilling station.

[0012] To achieve the above-mentioned purpose, the present invention also proposes a method for using a circuit via hole mold for an aluminum substrate, comprising the following steps: S1, opening an upper mold base and a lower mold base, placing an aluminum substrate in a first drilling station, and placing one side of the aluminum metal base toward the lower mold base; S2, closing the upper mold base and the lower mold base, so that the half-shear punch provided on the lower mold base cooperates with the half-shear inner top provided on the upper mold base to achieve half-shear drilling of the aluminum substrate; S3, opening the upper mold base and the lower mold base, taking out the half-shear drilled hole from the first drilling station and placing it in the second drilling station; S4, closing the upper mold base and the lower mold base, so that the back-slap punch provided on the upper mold base cooperates with the back-slap inner top provided on the lower mold base to achieve internal shaping of the half-shear drilling hole of the aluminum substrate and external mold closing of the half-shear drilling hole.

[0013] Specifically, before placing the aluminum substrate in the second drilling station in step S3, the portion protruding outward from the half-drilled aluminum substrate needs to be scraped for insulation coating.

[0014] Specifically, the depth of the half-shear drilling is 60% to 80% of the overall thickness of the aluminum substrate.

[0015] Specifically, the aluminum substrate includes an aluminum metal base layer, an insulating layer and a copper metal layer, the insulating layer is located between the aluminum metal layer and the copper metal layer, and the thickness ratio of the aluminum metal base layer to the insulating layer and the copper metal layer is eight to one to one.

[0016] The technical solution of the present invention is to set a first drilling station and a second drilling station on the mold body, and to place the aluminum substrate in the first drilling station and the second drilling station successively, and to perform half-shear drilling on the aluminum substrate located at the first drilling station through the cooperation of the upper mold base and the lower mold base, and to perform drilling, shaping and mold closing on the aluminum substrate located at the second drilling station without plugging the holes, thereby improving the hole opening efficiency and yield rate of the aluminum substrate and reducing the processing cost of the aluminum substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention in use state.

[0018] Figure 2 It is a cross-sectional view of the structure of the present invention in use state.

[0019] Figure 3 for Figure 2 An enlarged schematic diagram of point A.

[0020] Figure 4 for Figure 2 An enlarged schematic diagram of point B.

[0021] Figure 5 It is a cross-sectional view of the aluminum substrate of the present invention.

[0022] Figure 6 It is a schematic diagram of the semi-shear state of the aluminum substrate of the present invention after passing through the first drilling station.

[0023] Figure 7 It is a schematic diagram of the back-shooting state of the aluminum substrate of the present invention after passing through the second drilling station.

[0024] Figure 8 It is a cross-sectional view of the aluminum substrate after mold closing of the present invention.

[0025] The reference numerals include: 10, mold body; 11, upper mold base; 12, upper base body; 13, upper pad; 14, upper stripping plate; 15, lower mold base; 16, lower base body; 17, lower pad; 18, lower mold plate; 20, half-shear inner top; 21, back-beat punch; 30, half-shear punch; 31, back-beat inner top; 40, aluminum substrate; 41, aluminum metal base layer; 42, insulating layer; 43, copper metal layer; 44, half-shear drilling. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the present invention, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] like Figures 1 to 8As shown, a circuit via hole mold for an aluminum substrate includes a mold body 10, the mold body 10 includes an upper mold base 11 and a lower mold base 15, a first drilling station and a second drilling station are arranged on the mold body 10, the lower mold base 15 is provided with a half-shear punch 30 arranged vertically upward on the first drilling station, and the upper mold base 11 is provided with a half-shear inner top 20 corresponding to the half-shear punch 30 on the first drilling station, and the upper mold base 11 and the lower mold base 15 are connected by The half-shear inner top 20 and the half-shear punch 30 cooperate to realize the half-shear drilling 44 of the external aluminum substrate 40. The upper mold base 11 is provided with a back-beating punch 21 arranged vertically downward on the second drilling station, and the lower mold base 15 is provided with a back-beating inner top 31 corresponding to the back-beating punch 21 on the second drilling station. The upper mold base 11 and the lower mold base 15 cooperate with the back-beating punch 21 and the back-beating inner top 31 to realize the back-beating forming of the half-shear drilling 44 of the external aluminum substrate 40. When drilling the aluminum substrate 40, the aluminum substrate 40 is first placed in the first drilling station, and the upper die seat 11 and the lower die seat 15 cooperate with each other, and the half-shear punch 30 cooperates with the half-shear inner top 20 to perform half-shear drilling 44 on the aluminum substrate 40, and finally a half-shear-shaped circuit conduction hole is formed on the aluminum substrate 40, and then the aluminum substrate 40 with the circuit conduction hole is placed in the second drilling station, and the upper die seat 11 and the lower die seat 15 cooperate with each other, and the circuit hole of the aluminum substrate 40 is shaped and closed by the back-slap punch 21 and the back-slap inner top 31, and the outer side of the circuit conduction hole is closed by the back-slap punch 21, and the inner wall of the circuit conduction hole is shaped by the back-punch inner top, so that the inner wall of the circuit conduction hole is smooth, and the aluminum substrate 40 can be quickly opened and shaped without using plugging holes, which effectively improves the processing efficiency and yield rate of the aluminum substrate 40, reduces the hole opening cost of the aluminum substrate 40, and is convenient and fast.

[0030] The upper die base 11 includes an upper die body 12, an upper pad 13 and an upper stripping plate 14. The upper die body 12 and the upper stripping plate 14 are respectively arranged on the upper and lower sides of the upper pad 13. The half-shear inner top 20 and the back-beating punch 21 are both arranged on the upper stripping plate 14. The upper stripping plate 14 is provided with an upper die mounting hole with an opening facing downward at the first drilling station and the second drilling station. The half-shear inner top 20 and the back-beating punch 21 are respectively arranged in the corresponding upper die mounting holes and form a receiving groove at the lower end of the upper die mounting hole. In this embodiment, the upper die base 11 is formed by combining the upper die body 12, the upper pad 13 and the upper stripping plate 14, and then the upper die mounting hole is arranged on the upper stripping plate 14. The half-shear inner top 20 and the back-beating punch 21 are respectively installed in the upper die mounting holes located at the first drilling station and the second drilling station, so as to facilitate the half-shear drilling 44 and mold closing of the aluminum substrate 40 respectively, so as to improve the processing efficiency of the mold on the aluminum substrate 40.

[0031] The lower die base 15 includes a lower seat body 16, a lower pad 17 and a lower template 18. The lower template 18 and the lower seat body 16 are respectively arranged on the upper and lower sides of the lower pad 17. The half-shear punch 30 and the back-beating inner top 31 are both arranged at the lower template 18. The lower template 18 is provided with lower die mounting holes with openings facing upward on the first drilling station and the second drilling station. The half-shear punch 30 and the back-beating inner top 31 are respectively arranged in the corresponding lower die mounting holes, and the upper ends of the half-shear punch 30 and the back-beating inner top 31 extend upward to the upper end of the lower template 18. In this embodiment, a lower die seat 15 is formed by combining a lower seat body 16, a lower pad 17 and a lower template 18, and a lower die mounting hole is set on the lower template 18. A half-shear punch 30 and a back-beating inner top 31 are installed in the lower die mounting holes located at the first drilling station and the second drilling station, respectively, so as to facilitate the half-shear drilling 44 and mold closing of the aluminum substrate 40, so as to improve the processing efficiency of the mold on the aluminum substrate 40.

[0032] The lower die base 15 is provided with placement grooves corresponding to the external aluminum substrate 40 at the first drilling station and the second drilling station. In this embodiment, the placement groove is provided on the lower die base 15 so that the aluminum substrate 40 can be placed in the placement groove for drilling, thereby improving the accuracy of the aluminum substrate 40 during drilling and improving the processing yield of the aluminum substrate 40.

[0033] A method for using a circuit via hole mold for an aluminum substrate comprises the following steps: S1, opening an upper mold base 11 and a lower mold base 15, placing an aluminum substrate 40 at a first drilling station, with one side of an aluminum metal base layer 41 facing the lower mold base 15; S2, closing the upper mold base 11 and the lower mold base 15, so that a half-shear punch 30 provided on the lower mold base 15 cooperates with a half-shear inner top 20 provided on the upper mold base 11 to achieve a half-shear drilling 44 of the aluminum substrate 40; S3, opening the upper mold base 11 and the lower mold base 15, taking out the mold after the half-shear drilling 44 from the first drilling station and placing it at a second drilling station; S4, closing the upper mold base 11 and the lower mold base 15, so that a back-slap punch 21 provided on the upper mold base 11 cooperates with a back-slap inner top 31 provided on the lower mold base 15 to achieve internal shaping of the half-shear drilling 44 of the aluminum substrate 40 and external mold closing of the half-shear drilling 44. When drilling the aluminum substrate 40, one side of the aluminum metal base layer 41 is directed toward the lower die seat 15. At the first drilling station, the half-shear punch 30 on the lower die seat 15 and the half-shear inner top 20 on the upper die seat 11 cooperate with each other. Through the ductility of the metal, the aluminum substrate 40 is raised toward the half-shear inner top 20, and the aluminum metal base layer 41 of the aluminum substrate 40 forms a circuit conductive hole. Then the aluminum substrate 40 is placed in the second drilling station. At this time, the back-slap punch 21 on the upper die seat 11 and the back-slap inner top 31 on the lower die seat 15 cooperate with each other. The back-slap inner top 31 extends into the circuit conductive hole to shape the inner wall of the circuit conductive hole and support the circuit conductive hole at the same time. The back-slap punch 21 is used to shape and close the outer wall of the circuit conductive hole, thereby realizing drilling of the aluminum substrate 40.

[0034] Before placing the second drilling station in step S3, the insulating coating needs to be scraped off the outwardly protruding portion of the aluminum substrate 40 of the half-shear drilling 44. After the aluminum substrate 40 is half-shear drilled 44, the insulating coating is scraped off the outwardly protruding portion of the aluminum substrate 40, so that the back-beating portion can better contact with the copper metal layer 43 to avoid short circuit.

[0035] The depth of the half-shear drilled hole 44 is 60% to 80% of the overall thickness of the aluminum substrate 40. In this embodiment, the depth of the half-shear drilled hole 44 (i.e., the circuit conductive hole) is 80% of the overall thickness of the aluminum substrate 40, which ensures that the half-shear drilled hole 44 is penetrated while having a certain stability, effectively avoiding the phenomenon of direct shearing through. If the depth of the half-shear drilled hole 44 exceeds 80%, shearing through is very likely to occur, resulting in the scrapping of the aluminum substrate 40 or the need to use a plug hole for repair.

[0036] The aluminum substrate 40 includes an aluminum metal base layer 41, an insulating layer 42 and a copper metal layer 43, wherein the insulating layer 42 is located between the aluminum metal layer and the copper metal layer 43, and the thickness ratio of the aluminum metal base layer 41 to the insulating layer 42 and the copper metal layer 43 is eight to one to one. In this embodiment, the thickness ratio of the aluminum metal base layer 41 to the insulating layer 42 and the copper metal layer 43 is eight to one to one, so as to facilitate the manufacturing of the aluminum substrate 40 and the half-shear drilling 44.

[0037] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A circuit via mold for an aluminum substrate, comprising a mold body, the mold body comprising an upper mold base and a lower mold base, characterized in that: The first drilling station and the second drilling station are respectively arranged at intervals on the mold body, the lower mold base is provided with a half-shear punch arranged vertically upward on the first drilling station, the upper mold base is provided with a half-shear inner top corresponding to the half-shear punch on the first drilling station, the upper mold base and the lower mold base cooperate with the half-shear inner top and the half-shear punch to realize half-shear drilling of the external aluminum substrate, the upper mold base is provided with a back-slap punch arranged vertically downward on the second drilling station, the lower mold base is provided with a back-slap inner top corresponding to the back-slap punch on the second drilling station, the upper mold base and the lower mold base cooperate with the back-slap punch and the back-slap inner top to realize back-slap forming of the half-shear drilling of the external aluminum substrate.

2. The aluminum substrate circuit via mold according to claim 1, characterized in that: The upper die seat comprises an upper seat body, an upper pad and an upper stripping plate. The upper seat body and the upper stripping plate are respectively arranged on the upper and lower sides of the upper pad. The half-shear inner top and the back-beating punch are both arranged on the upper stripping plate.

3. The aluminum substrate circuit via mold according to claim 2, characterized in that: The upper stripping plate is provided with an upper die mounting hole opening downwardly disposed at the first drilling station and the second drilling station, and the half-shear inner top and the back-slap punch are respectively disposed in the corresponding upper die mounting holes and form a receiving groove at the lower end of the upper die mounting hole.

4. The aluminum substrate circuit via mold according to claim 1, characterized in that: The lower die base comprises a lower seat body, a lower pad and a lower template. The lower template and the lower seat body are respectively arranged on the upper and lower sides of the lower pad. The half-shear punch and the back-beating inner top are both arranged at the lower template.

5. The aluminum substrate circuit via mold according to claim 4, characterized in that: The lower template is provided with a lower mold mounting hole with an opening facing upward at the first drilling station and the second drilling station, the half-shear punch and the back-beat inner top are respectively arranged in the corresponding lower mold mounting holes, and the upper end portions of the half-shear punch and the back-beat inner top extend upward to the upper end of the lower template.

6. The aluminum substrate circuit via mold according to claim 1, characterized in that: The lower die base is provided with placement grooves corresponding to the external aluminum substrate at both the first drilling station and the second drilling station.

7. A method for using an aluminum substrate circuit via mold according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1. Open the upper die base and the lower die base, place the aluminum substrate at the first drilling station, and place the aluminum substrate side toward the lower die base; S2, closing the upper die base and the lower die base, so that the half-shear punch provided on the lower die base cooperates with the half-shear inner top provided on the upper die base to realize half-shear drilling of the aluminum substrate; S3, opening the upper die base and the lower die base, taking out the half-shear after drilling from the first drilling station and placing it in the second drilling station; S4. Close the upper die base and the lower die base so that the back-beating punch provided on the upper die base cooperates with the back-beating inner top provided on the lower die base to achieve internal shaping of the half-shear drilled hole of the aluminum substrate and external mold closing of the half-shear drilled hole.

8. The method for using the aluminum substrate circuit via mold according to claim 7, characterized in that: Before placing the aluminum substrate in the second drilling station in step S3, the protruding portion of the aluminum substrate through the half-shear drilling needs to be scraped for insulation coating.

9. The method for using the aluminum substrate circuit via mold according to claim 7, characterized in that: The depth of the half-shear drilling is 60% to 80% of the overall thickness of the aluminum substrate.

10. The method for using the aluminum substrate circuit via hole mold according to claim 7, characterized in that: The aluminum substrate comprises an aluminum metal base layer, an insulating layer and a copper metal layer, wherein the insulating layer is located between the aluminum metal layer and the copper metal layer, and the thickness ratio of the aluminum metal base layer to the insulating layer and the copper metal layer is eight to one to one.

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