Processing and testing device for pcba circuit board with multiple sealing paint layers

Abstract

The invention provides a pcba circuit board processing testing device with multiple sealing paint layers, and relates to the technical field of testing devices.The pcba circuit board processing testing device comprises a base, a support is installed at the top end of the base, a fixing rod is installed at the bottom end of the support, a sliding plate is arranged on the surface of the fixing rod, and a mounting plate is installed on the surface of the support; a hydraulic cylinder is mounted at the top end of the mounting plate, and a connecting rod is mounted at the output end of the hydraulic cylinder, so that the circuit board is accurately positioned and fixed, and the test accuracy and efficiency are improved. And through the synergistic effect of the sliding plate, the limiting plate, the clamping block and other components, the circuit board can be quickly mounted and dismounted, and the work of an operator is facilitated. And meanwhile, through cooperative use of the hydraulic cylinder and the pressing needle, accurate pressure application can be carried out on the welding spots on the circuit board, and therefore the welding quality is guaranteed. In addition, the device has the advantages of being simple in structure, convenient to operate, low in cost and the like, and is suitable for circuit board testing work in large-scale production.

Description

Technical Field

[0001] The invention relates to the technical field of testing devices, in particular to a PCB (computerized circuit board) processing and testing device with multiple sealing paint layers. Background Art

[0002] The traditional method has some shortcomings in actual operation. First, the traditional method usually requires manual positioning and fixing of the circuit board, which is cumbersome and error-prone. Second, the traditional method cannot achieve accurate pressure application on the solder joints on the circuit board, resulting in unstable welding quality. In addition, the device structure of the traditional method is complex and the cost is high, which is not convenient for application in large-scale production. These shortcomings are mainly due to the lack of attention to operational convenience and accuracy in the design and implementation process of the traditional method, as well as insufficient attention to cost control, which need to be optimized and improved. Summary of the invention

[0003] The purpose of the present invention is to solve the technical problems raised in the above background technology.

[0004] The present invention adopts the following technical scheme: a PCB circuit board processing and testing device with multiple sealing paint layers, comprising a base, a bracket is installed on the top of the base, a fixing rod is installed on the bottom end of the bracket, a sliding plate is arranged on the surface of the fixing rod, a mounting plate is installed on the surface of the bracket, a hydraulic cylinder is installed on the top of the mounting plate, a connecting rod is installed on the output end of the hydraulic cylinder, a pressing plate is installed on the bottom end of the connecting rod, a pressing needle is installed on the bottom end of the pressing plate, a limiting plate is installed on the top of the base, a card block is arranged inside the limiting plate, a side plate is installed on the right side of the card block, a stop block is installed on the surface of the side plate, a limiting block is arranged inside the limiting plate, a card plate is installed in the middle of the limiting block, a placement plate is installed in the middle of the card plate, a placement groove is opened on the top of the placement plate, and a pull handle is installed on the surface of the placement plate.

[0005] Preferably, the sliding plate slides on the surface of the fixed rod through the sliding groove, and the limiting plates are symmetrically distributed at the left and right ends of the top of the base. Here, it is more convenient for the sliding plate to slide.

[0006] Preferably, the card block slides inside the limit plate through the card slot, and the side plate is slidably connected to the limit plate. Here, it is more convenient for the card block to slide with the side plate.

[0007] Preferably, the limit block slides inside the limit plate through the limit groove, the limit block is symmetrically distributed at the upper and lower ends of the card plate, and the card plate is symmetrically distributed at the left and right ends of the placement plate. Here, it is more convenient for the limit block to slide.

[0008] Preferably, the card plate slides inside the baffle plate through the guide groove A, and the card plate slides inside the limit plate through the guide groove B, and the placement plate and the limit plate are slidably connected. Here, it is more convenient for the card plate to slide.

[0009] Preferably, a mounting block is installed at the bottom end of the connecting rod, a groove is provided at the top of the mounting block, a sliding groove A is provided inside the mounting block, a sliding block is installed at the top of the pressing plate, a rotating groove is provided at the top of the sliding block, a bolt is provided inside the rotating groove, a sliding plate is installed on the back of the pressing plate, a sliding groove B is installed on the surface of the sliding plate, a clamping rod is provided inside the sliding plate, and a stopper is installed on the right side of the clamping rod. Here, it is more convenient to replace the pressing plate and the pressing needle after long-term use.

[0010] Preferably, the sliding block slides inside the mounting block through the sliding groove A, the bolt rotates inside the sliding block through the rotating groove, and the bolt rotates inside the mounting block through the groove. Here, it is more convenient for the bolt to rotate.

[0011] Preferably, the slide plate slides inside the slide plate through the slide slot B, the clamping rod slides inside the slide plate through the fixing slot A, and the clamping rod slides inside the slide plate through the fixing slot B. Here, it is more convenient for the clamping rod to slide.

[0012] Preferably, an inner plate is installed at the bottom end of the sliding plate, an outer plate is installed at the bottom end of the sliding plate, and a buffer spring is installed at the bottom end of the sliding plate. Here, the circuit board is better protected.

[0013] Preferably, the inner plate is slidably connected to the fixed rod, the buffer spring is arranged between the inner plate and the outer plate, one end of the buffer spring away from the sliding plate is arranged at the top of the base, and the buffer spring slides on the surface of the fixed rod. Here, it is more convenient for the buffer spring to slide.

[0014] Compared with the prior art, the advantages and positive effects of the present invention are:

[0015] 1. In the present invention, by arranging the limit plate, the card slot, the card block, the side plate, the baffle plate, the guide groove A, the guide groove B, the limit groove, the limit block, the card plate, the placement plate, the placement groove and the pull handle, the circuit board is accurately positioned and fixed, and the accuracy and efficiency of the test are improved. Through the synergistic effect of the sliding plate, the limit plate, the card block and other components, the circuit board can be quickly installed and disassembled, which is convenient for the operator's work. At the same time, through the coordinated use of the hydraulic cylinder and the pressure needle, the solder joints on the circuit board can be accurately applied with pressure, thereby ensuring the welding quality. In addition, the device also has the advantages of simple structure, easy operation, low cost, etc., and is suitable for circuit board testing in large-scale production.

[0016] 2. In the present invention, by arranging the mounting block, groove, sliding groove A, sliding block, rotating groove, bolt, slide plate, fixed groove A, sliding groove B, fixed groove B, clamping rod and stopper, it is more convenient to replace the pressure plate and the pressure needle after long-term use. After long-term use, when it is necessary to replace the pressure plate and the pressure needle, first remove the bolt from the inside of the rotating groove with the help of a tool, and then take it out from the inside of the mounting block through the fixed groove. At this time, pinch the stopper and pull it toward the outer plate to make the clamping rod slide out of the inside of the sliding plate and the slide plate through the fixed groove A and the fixed groove B. Finally, pinch the pressure plate and pull it backwards to make the sliding block slide out of the inside of the mounting block through the sliding groove A, and the slide plate slide out of the inside of the sliding plate through the sliding groove B, so as to replace the pressure plate and the pressure needle.

[0017] 3. In the present invention, the inner plate, the outer plate and the buffer spring are provided to better protect the circuit board. During use, since the buffer spring is provided between the sliding plate and the base, when the pressing plate drives the sliding plate to slide downward, the buffer spring will slide and contract on the surface of the fixed rod, and at this time, the impact force generated by the sliding of the large part can be alleviated, thereby preventing the circuit board from being damaged due to excessive impact force during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional structural schematic diagram of a pcba circuit board processing and testing device with multiple sealing paint layers is provided for the present invention;

[0019] Figure 2 A schematic diagram of a base of a pcba circuit board processing and testing device with multiple sealing paint layers is provided for the present invention;

[0020] Figure 3 A bottom view of a base of a pcba circuit board processing and testing device with multiple sealing paint layers is provided for the present invention;

[0021] Figure 4 The present invention provides a schematic diagram of a press plate explosion of a pcba circuit board processing and testing device with multiple sealing paint layers;

[0022] Figure 5 The present invention provides an exploded bottom view of a pressing plate of a pcba circuit board processing and testing device with multiple sealing paint layers;

[0023] Figure 6 The present invention provides a schematic diagram of an explosion of a placement plate of a pcba circuit board processing and testing device with multiple sealing paint layers;

[0024] Figure 7 The present invention proposes a pcba circuit board processing and testing device with multiple sealing paint layers Figure 6 Enlarged view of point A in the middle;

[0025] Figure 8 The present invention proposes a pcba circuit board processing and testing device with multiple sealing paint layers Figure 6 Enlarged view of point B in the middle;

[0026] Fig. 9 The present invention proposes a pcba circuit board processing and testing device with multiple sealing paint layers Figure 4 Enlarged view of point C in the middle;

[0027] Fig.10 The present invention proposes a pcba circuit board processing and testing device with multiple sealing paint layers Figure 5 Enlarged view of point D in the middle.

[0028] Legend:

[0029] 1. Base; 2. Bracket; 3. Fixed rod; 4. Sliding plate; 5. Slide groove; 6. Mounting plate; 7. Hydraulic cylinder; 8. Connecting rod; 9. Pressing plate; 10. Pressing needle; 11. Limiting plate; 12. Slot; 13. Block; 14. Side plate; 15. Baffle; 16. Guide groove A; 17. Guide groove B; 18. Limiting groove; 19. Limiting block; 20. Card; 21. Placement plate; 22. Placement groove; 23. Pull handle; 24. Mounting block; 25. Groove; 26. Sliding groove A; 27. Sliding block; 28. Rotating groove; 29. ​​Bolt; 30. Slide plate; 31. Fixed groove A; 32. Sliding groove B; 33. Fixed groove B; 34. Card rod; 35. Block; 36. Inner plate; 37. Outer plate; 38. Buffer spring. DETAILED DESCRIPTION

[0030] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0031] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0032] Unless otherwise specified, the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in the technical field.

[0033] Embodiment 1

[0034] See also Figure 1-8The present invention provides a technical solution: a pcba circuit board processing and testing device with multiple sealing paint layers, comprising a base 1, a bracket 2 is installed on the top of the base 1, a fixing rod 3 is installed on the bottom of the bracket 2, a sliding plate 4 is arranged on the surface of the fixing rod 3, a mounting plate 6 is installed on the surface of the bracket 2, a hydraulic cylinder 7 is installed on the top of the mounting plate 6, a connecting rod 8 is installed on the output end of the hydraulic cylinder 7, a pressing plate 9 is installed on the bottom of the connecting rod 8, a pressing needle 10 is installed on the bottom of the pressing plate 9, a limiting plate 11 is installed on the top of the base 1, a card block 13 is arranged inside the limiting plate 11, a side plate 14 is installed on the right side of the card block 13, and the side plate The surface of the limit plate 14 is provided with a stopper 35, the inner part of the limit plate 11 is provided with a limit block 19, the middle of the limit block 19 is provided with a card plate 20, the middle of the card plate 20 is provided with a placement plate 21, the top of the placement plate 21 is provided with a placement groove 22, and the surface of the placement plate 21 is provided with a pull handle 23. By providing the limit plate 11, the card groove 12, the card block 13, the side plate 14, the baffle plate 15, the guide groove A16, the guide groove B17, the limit groove 18, the limit block 19, the card plate 20, the placement plate 21, the placement groove 22 and the pull handle 23, the circuit board is accurately positioned and fixed, and the accuracy and efficiency of the test are improved. Through the synergistic effect of the components such as the sliding plate 4, the limit plate 11, the card block 13, etc., the circuit board is quickly installed and removed, which is convenient for the operator's work. At the same time, through the coordinated use of the hydraulic cylinder 7 and the pressure needle 10, the solder joints on the circuit board can be accurately pressured, thereby ensuring the welding quality. In addition, the device has the advantages of simple structure, convenient operation, low cost, etc., and is suitable for circuit board testing work in large-scale production. The sliding plate 4 slides on the surface of the fixed rod 3 through the sliding groove 5, and the limiting plates 11 are symmetrically distributed at the left and right ends of the top of the base 1, which is more convenient for the sliding plate 4 to slide, and prevents the sliding plate 4 from being stuck by the fixed rod 3 during use, causing the sliding plate 4 to be unable to continue sliding. The card block 13 slides inside the limiting plate 11 through the card groove 12, and the side plate 14 is slidably connected to the limiting plate 11, which is more convenient for the card block 13 and the side plate 14 to slide, and avoids the card block 13 and the side plate 14 being stuck by the limiting plate 11 during use, causing the limiting plate 11 to be unable to continue sliding. The limit block 19 slides inside the limit plate 11 through the limit groove 18. The limit blocks 19 are symmetrically distributed at the upper and lower ends of the card plate 20, and the card plate 20 is symmetrically distributed at the left and right ends of the placement plate 21, which makes it easier for the limit block 19 to slide and prevents the limit block 19 from being stuck by the limit plate 11 during use, causing the limit block 19 to be unable to continue sliding. The card plate 20 slides inside the baffle 15 through the guide groove A16, and the card plate 20 slides inside the limit plate 11 through the guide groove B17. The placement plate 21 is slidably connected to the limit plate 11, which makes it easier for the card plate 20 to slide and prevents the card plate 20 from being stuck by the limit plate 11 during use, causing the card plate 20 to be unable to continue sliding.

[0035] Embodiment 2

[0036] See also Figure 1-4 and Fig. 9 A mounting block 24 is installed at the bottom end of the connecting rod 8, a groove 25 is provided at the top of the mounting block 24, a sliding groove A26 is provided inside the mounting block 24, a sliding block 27 is installed at the top of the pressing plate 9, a rotating groove 28 is provided at the top of the sliding block 27, a bolt 29 is provided inside the rotating groove 28, a slide plate 30 is installed on the back of the pressing plate 9, a sliding groove B32 is installed on the surface of the sliding plate 4, a clamping rod 34 is provided inside the sliding plate 4, and a stopper 35 is installed on the right side of the clamping rod 34, and more It is convenient to replace the pressing plate 9 and the pressing needle 10 after long-term use. When the pressing plate 9 and the pressing needle 10 need to be replaced after long-term use, the bolt 29 is first removed from the inside of the rotating groove 28 with the help of a tool, and then taken out from the inside of the mounting block 24 through the fixed groove. At this time, the stopper 35 is pinched and pulled toward the outer plate 37, so that the card rod 34 slides out of the inside of the sliding plate 4 and the sliding plate 30 through the fixed groove A31 and the fixed groove B33. Finally, the pressing plate 9 is pinched and pulled backwards to make the sliding block 27 slides out of the interior of the mounting block 24 through the sliding groove A26, and the slide plate 30 slides out of the interior of the sliding plate 4 through the sliding groove B32, so as to replace the pressure plate 9 and the pressure needle 10. The sliding block 27 slides inside the mounting block 24 through the sliding groove A26, and the bolt 29 rotates inside the sliding block 27 through the rotating groove 28. The bolt 29 rotates inside the mounting block 24 through the groove 25, which is more convenient for the bolt 29 to rotate, and prevents the bolt 29 from being unable to continue to rotate due to being stuck by the sliding block 27 or the mounting block 24 during use. The slide plate 30 slides inside the sliding plate 4 through the sliding groove B32, and the clamping rod 34 slides inside the slide plate 4 through the fixed groove A31. The clamping rod 34 slides inside the sliding plate 4 through the fixed groove B33, which is more convenient for the clamping rod 34 to slide, and prevents the clamping rod 34 from being stuck by the slide plate 30 or the sliding plate 4 during use, causing the clamping rod 34 to be unable to continue to slide.

[0037] Embodiment 3

[0038] See also Figure 1-4 and Fig.10The bottom end of the sliding plate 4 is installed with an inner plate 36, the bottom end of the sliding plate 4 is installed with an outer plate 37, and the bottom end of the sliding plate 4 is installed with a buffer spring 38 to better protect the circuit board. During use, the buffer spring 38 is arranged between the sliding plate 4 and the base 1, and when the pressure plate 9 drives the sliding plate 4 to slide downward, the buffer spring 38 will slide and shrink on the surface of the fixed rod 3, and at this time, most of the impact force generated by sliding can be alleviated, thereby preventing the circuit board from being damaged due to excessive impact force during use. The inner plate 36 is slidably connected to the fixed rod 3, and the buffer spring 38 is arranged between the inner plate 36 and the outer plate 37. The end of the buffer spring 38 away from the sliding plate 4 is arranged at the top of the base 1, and the buffer spring 38 slides on the surface of the fixed rod 3, which is more convenient for the buffer spring 38 to slide, and the buffer spring 38 is prevented from being stuck by the fixed rod 3 during use, resulting in the buffer spring 38 being unable to continue to slide.

[0039] Working principle: When in use, first place the base 1 at the required position, then pinch the handle 23 and pull it backward, so that the placement plate 21 drives the card plate 20 and the limit block 19 to slide backward, and then the card plate 20 slides backward inside the limit plate 11 through the guide groove B17, and slides backward inside the baffle 15 through the guide groove A16, and the limit block 19 slides backward inside the limit plate 11 through the limit groove 18. When the placement plate 21 completely slides out of the middle of the limit plate 11 and the surface of the limit block 19 contacts the back of the baffle 15, the circuit board is placed inside the placement plate 21 through the placement groove 22, and then through the pull handle 23 is pushed inward, and the placement plate 21 is used to drive the circuit board to slide to the bottom of the pressure plate 9 and the pressure needle 10 through the placement groove 22. At this time, the hydraulic cylinder 7 on the top of the mounting plate 6 is started, so that the hydraulic cylinder 7 drives the pressure plate 9 to slide downward through the connecting rod 8, and the pressure plate 9 drives the pressure needle 10 and the sliding plate 4 to slide downward in the middle of the bracket 2. At this time, the sliding plate 4 slides downward on the surface of the fixed rod 3 through the sliding groove 5. When the pressure needle 10 contacts the circuit board, the detection can be started, and during use, the buffer spring 38 between the inner plate 36 and the outer plate 37 can effectively alleviate the impact force brought by the pressure plate 9, thereby preventing the circuit board from being damaged due to excessive impact force. When the placing plate 21 needs to be disassembled for replacement after long-term use, pinch the side plate 14 and pull it upward, so that the card block 13 slides upward inside the limiting plate 11 through the card slot 12. When the card block 13 completely slides out of the limiting plate 11 through the card slot 12, pinch the pull handle 23 and pull it backward, so that the placing plate 21 drives the card plate 20 and the limiting block 19 to completely slide out of the limiting plate 11 through the guide groove B17 and the limiting groove 18 for replacement. When the pressing plate 9 and the pressing needle 10 need to be replaced, first pinch the stopper 35 and pull it toward the outer plate 37, so that the card rod 34 slides out of the sliding plate 4 through the fixing groove B33 and the fixing groove A31. With the inside of the slide plate 30, and then rotate the bolt 29 with the help of a tool, so that the bolt 29 can rotate upward inside the sliding block 27 through the rotating groove 28. When the bolt 29 is completely rotated out of the rotating groove 28, it can be taken out from the inside of the mounting block 24 through the groove 25. At this time, pinch the pressure plate 9 and pull it backwards, so that the sliding block 27 slides backward inside the mounting block 24 through the sliding groove A26, and the slide plate 30 slides backward inside the sliding plate 4 through the sliding groove B32. When the slide plate 30 completely slides out of the sliding plate 4 through the sliding groove B32, and the sliding block 27 completely slides out of the mounting block 24 through the sliding groove A26, it can be replaced.

[0040] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A PCB circuit board processing and testing device with multiple sealing paint layers, comprising a base (1), characterized in that: A bracket (2) is installed at the top end of the base (1), a fixed rod (3) is installed at the bottom end of the bracket (2), a sliding plate (4) is arranged on the surface of the fixed rod (3), a mounting plate (6) is installed on the surface of the bracket (2), a hydraulic cylinder (7) is installed at the top end of the mounting plate (6), a connecting rod (8) is installed at the output end of the hydraulic cylinder (7), a pressing plate (9) is installed at the bottom end of the connecting rod (8), a pressing needle (10) is installed at the bottom end of the pressing plate (9), and a limiting plate (10) is installed at the top end of the base (1). 11), a clamping block (13) is arranged inside the limit plate (11), a side plate (14) is installed on the right side of the clamping block (13), a stopper (35) is installed on the surface of the side plate (14), a limit block (19) is arranged inside the limit plate (11), a clamping plate (20) is installed in the middle of the limit block (19), a placement plate (21) is installed in the middle of the clamping plate (20), a placement groove (22) is opened at the top of the placement plate (21), and a handle (23) is installed on the surface of the placement plate (21).

2. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1 is characterized in that: The sliding plate (4) slides on the surface of the fixed rod (3) through the sliding groove (5), and the limiting plates (11) are symmetrically distributed at the left and right ends of the top of the base (1).

3. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1 is characterized in that: The clamping block (13) slides inside the limiting plate (11) through the clamping slot (12), and the side plate (14) is slidably connected to the limiting plate (11).

4. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1 is characterized in that: The limit block (19) slides inside the limit plate (11) through the limit groove (18); the limit block (19) is symmetrically distributed at the upper and lower ends of the clamping plate (20); and the clamping plate (20) is symmetrically distributed at the left and right ends of the placement plate (21).

5. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1 is characterized in that: The clamping plate (20) slides inside the baffle (15) through the guide groove A (16), and the clamping plate (20) slides inside the limiting plate (11) through the guide groove B (17), and the placement plate (21) is slidably connected to the limiting plate (11).

6. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1 is characterized in that: A mounting block (24) is installed at the bottom end of the connecting rod (8), a groove (25) is provided at the top end of the mounting block (24), a sliding groove A (26) is provided inside the mounting block (24), a sliding block (27) is installed at the top end of the pressure plate (9), a rotating groove (28) is provided at the top end of the sliding block (27), a bolt (29) is provided inside the rotating groove (28), a sliding plate (30) is installed on the back side of the pressure plate (9), a sliding groove B (32) is installed on the surface of the sliding plate (4), a clamping rod (34) is provided inside the sliding plate (4), and a stopper (35) is installed on the right side of the clamping rod (34).

7. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 6 is characterized in that: The sliding block (27) slides inside the mounting block (24) through the sliding groove A (26), the bolt (29) rotates inside the sliding block (27) through the rotating groove (28), and the bolt (29) rotates inside the mounting block (24) through the groove (25).

8. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 6 is characterized in that: The slide plate (30) slides inside the slide plate (4) through the slide groove B (32), the clamping rod (34) slides inside the slide plate (30) through the fixing groove A (31), and the clamping rod (34) slides inside the slide plate (4) through the fixing groove B (33).

9. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 1, characterized in that: An inner plate (36) is installed at the bottom end of the sliding plate (4), an outer plate (37) is installed at the bottom end of the sliding plate (4), and a buffer spring (38) is installed at the bottom end of the sliding plate (4).

10. The pcba circuit board processing and testing device with multiple sealing paint layers according to claim 9, characterized in that: The inner plate (36) is slidably connected to the fixed rod (3), the buffer spring (38) is arranged between the inner plate (36) and the outer plate (37), one end of the buffer spring (38) away from the sliding plate (4) is arranged at the top of the base (1), and the buffer spring (38) slides on the surface of the fixed rod (3).

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