Patterned electrode structure design method

Abstract

The invention relates to a design method of a patterned electrode structure, a metal electrode layer and an insulating substrate are prepared, the insulating substrate is a polyester film or polyimide, and the metal electrode layer is any one or a combination of rolled copper, electrolytic copper, aluminum, gold, graphene, a carbon nanotube and conductive silver paste; the insulating substrate and the metal electrode layer with the same area are bonded and formed by adopting an epoxy adhesive or an acrylic adhesive and the like, the required appearance is formed by cutting through a die punching technology, and pin structures connected with leads are reserved on the insulating substrate and the metal electrode layer. According to the invention, the patterned electrode structure can be freely customized according to requirements, and a plurality of electrodes can be led out by using a complete piezoelectric device, so that the difficulty of an arraying process is greatly reduced, the bonding capability between the electrodes and the piezoelectric device can be improved, and the problem that the electrodes and the piezoelectric device are easy to debond is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of base arrays and relates to a method for designing a patterned electrode structure. Background Art

[0002] As an energy conversion device, one of the key processes of the transducer is how to reliably connect the sensitive element to the external wire or circuit. A commonly used solution is to directly weld or bond wires on the surface of the sensitive element to transmit signals. This solution is only applicable to single-layer sensitive elements, and there are problems such as high temperature during welding that damages the performance of the sensitive element and poor bonding reliability, and the applicable scenarios are highly limited. Another solution is to bond a single-layer metal electrode such as copper foil with pins to the surface of the sensitive element, and use the pins of the metal electrode to weld wires to transmit signals. This can be applied between multi-layer sensitive elements and also reduces the damage to the sensitive elements caused by high welding temperature.

[0003] Furthermore, in order to form a desired beam pattern in space, it is often necessary to arrange multiple transducers in a certain pattern to form an array. The conventional array method requires cutting piezoelectric devices and metal electrodes according to the number of array elements. Each array element corresponds to an independent piezoelectric device and metal electrode. During assembly, multiple devices are positioned and assembled to form a transducer array.

[0004] In the above scheme, since the surface of metal electrodes such as copper foil is smooth and has low adhesion to adhesives, and since the thickness of metal electrodes such as copper foil is thin and the mechanical strength is low, the surface roughness cannot be improved by conventional sandblasting process, so it is easy to debond with sensitive components when torn by external force or internal stress is released. In addition, the entire device needs to be cut and then assembled when arranging the array, which requires a lot of processing costs and process steps, increasing the complexity of the system and the risk of failure, especially when making large-scale high-frequency arrays with densely packed small primitives, the process difficulty is extremely high. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for designing a patterned electrode structure. This method can freely customize the patterned electrode structure according to needs, and can use a complete piezoelectric device to lead out multiple electrodes, which greatly reduces the difficulty of the array process. At the same time, it can also improve the bonding ability between the electrode and the piezoelectric device, solving the problem of easy debonding of the electrode and the piezoelectric device.

[0006] The technical solution of the present invention is to provide a method for designing a patterned electrode structure, prepare a metal electrode layer and an insulating substrate, wherein the insulating substrate is selected from polyester film or polyimide, and the metal electrode layer is any one of rolled copper, electrolytic copper, aluminum, gold, graphene, carbon nanotubes, and conductive silver paste or a combination thereof; The insulating substrate and the metal electrode layer of the same area are bonded together by using epoxy or acrylic adhesives, and cut into the desired shape by die-punching technology, wherein the insulating substrate and the metal electrode layer are both provided with pin structures for connecting leads; The metal electrode layer is processed into the desired pattern by etching technology.

[0007] The present invention proposes a patterned electrode structure design method, which can freely customize the patterned electrode structure according to needs, and can use a complete piezoelectric device to lead out multiple electrodes, greatly reducing the difficulty of the array process. At the same time, it can also improve the bonding ability between the electrode and the piezoelectric device, solving the problem of easy debonding between the electrode and the piezoelectric device.

[0008] Preferably, the metal electrode layer is an integral or discrete structure.

[0009] Preferably, after the materials are prepared, the pattern of the metal electrode layer can also be directly formed on the surface of the insulating substrate by sputtering technology.

[0010] Preferably, when the metal electrode layer is a discrete structure, each discrete electrode region leads out a signal through a sub-pin, and a sub-pin of one of the discrete electrode regions is selected to extend a patterned electrode for connection with the pin structure of the connecting lead.

[0011] Preferably, a printed structure is provided on the patterned electrode, and the printed structure penetrates downwardly through the metal electrode layer and the insulating substrate.

[0012] Preferably, the metal electrode layer is made of rolled copper material.

[0013] Preferably, the insulating substrate is made of PI material.

[0014] Preferably, the metal electrode layer is an integral structure.

[0015] Furthermore, there are multiple printed structures, which are evenly arranged on the patterned electrode.

[0016] Compared with the prior art, the present invention has the following advantages: The present invention can freely customize the structure of the patterned electrode according to needs. The metal electrode layer and the insulating substrate are integrally formed. The insulating substrate has the characteristics of strong insulation ability, good flexibility and high mechanical strength, and can fix the discrete metal electrode layer. At the same time, the patterned electrode utilizes processing techniques such as etching or sputtering, with high processing precision and low mass production cost, which solves the problem that it is difficult to lead out multiple electrodes from a piezoelectric device and reduces the difficulty of the array process. At the same time, a printing structure is introduced inside the patterned electrode, and the planar glue layer structure between the metal electrode layer and the piezoelectric material is optimized into a three-dimensional glue layer structure, which can increase the contact area between the glue layer and the patterned electrode, and at the same time, a glue layer similar to a "rivet" structure is formed to connect the upper and lower piezoelectric device interfaces of the patterned electrode, thereby improving the bonding ability between the patterned electrode and the piezoelectric device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a multi-channel patterned electrode structure according to an embodiment of the present invention.

[0018] Figure 2 Schematic diagram of the composition of a multi-channel patterned electrode according to an embodiment of the present invention.

[0019] Figure 3 Schematic diagram of a usage scenario of a multi-channel patterned electrode according to an embodiment of the present invention.

[0020] Figure 4 It is a schematic diagram of the usage scenario of the multi-channel patterned electrode according to an embodiment of the present invention.

[0021] Figure 5 Schematic diagram of a patterned electrode structure for improving electrode adhesion according to an embodiment of the present invention.

[0022] Figure 6 Schematic diagram of patterned electrode composition for improving electrode adhesion according to an embodiment of the present invention.

[0023] Figure 7 Schematic diagram of a usage scenario of a patterned electrode for improving electrode adhesion according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings: Example 1

[0025] The present invention provides a method for designing a patterned electrode structure. Figure 1~2The patterned electrode 1 shown in the figure includes a metal electrode layer 2 and an insulating substrate 3. When designing, the metal electrode layer and the insulating substrate are prepared first. The insulating substrate 3 has the characteristics of strong insulation ability, good flexibility and high mechanical strength, and is used to fix the metal electrode layer 2. The insulating substrate 3 is made of polyester film. In this embodiment, the metal electrode layer 2 is a discrete metal electrode layer, and the metal electrode layer 2 is made of rolled copper material; The insulating substrate 3 and the metal electrode layer 2 of the same area are bonded together using epoxy or acrylic adhesives, and are cut into the desired shape using die-punching technology; The metal electrode layer 2 is processed into the desired pattern by etching technology, and the finest patterned electrode area can be formed into 0.05mm wide; Both the insulating substrate 3 and the metal electrode layer 2 have a pin structure for welding leads.

[0026] As a preferred method, after the materials are prepared, the metal electrode layer 2 can also be directly formed on the surface of the insulating substrate 3 by sputtering technology.

[0027] See also Figure 3~4 , shows a usage scenario of a patterned electrode in this embodiment, a layer of patterned electrode 1 is placed between two layers of piezoelectric devices 4, in this embodiment, the metal electrode layer 2 is a discrete structure, that is, the metal electrode layer is composed of multiple parts, and the patterned electrode 1 has 9 electrode areas, and the 9 electrode areas all lead out signals through their own sub-pins, wherein a thin and long patterned electrode extends from the middle electrode area for connection with the pin structure of the connecting lead located at the edge. The 9 electrode areas, i.e., the metal electrode layer, lead out the signals of the 9 areas corresponding to the piezoelectric material respectively, realizing the function of one piezoelectric device leading out multiple sensing signals. Example 2

[0028] See also Figures 5 and 6 , a patterned electrode 1 with improved bonding ability shown in the figure includes a metal electrode layer 2, an insulating substrate 3, and a printed structure 8. Different from Example 1, in this embodiment, the metal electrode layer 2 is an integral structure, that is, it is a whole rather than composed of multiple independent parts, and a printed structure 8 is provided on the patterned electrode 1, and the printed structure 8 penetrates the metal electrode layer 2, the insulating substrate 3 and the metal electrode layer 2 downward in sequence, and at the same time optimizes the planar glue layer structure between the patterned electrode 1 and the piezoelectric device 9 to a three-dimensional glue layer structure, that is, the glue layer has a thickness of 10-200μm to form a three-dimensional glue layer structure. In this embodiment, the glue layer is 80μm. The printed structure 8 can increase the contact area between the glue layer and the electrode, and at the same time form a glue layer similar to a "rivet" structure to connect the upper and lower interfaces of the patterned electrode 1, thereby improving the bonding ability between the patterned electrode 1 and the piezoelectric device 9.

[0029] In this embodiment, the metal electrode layer 2 is made of rolled copper material, which has strong ductility and bending resistance. The insulating substrate 3 is made of PI material, which has stronger bonding ability to the adhesive layer than the metal electrode layer. In addition, the metal electrode layer 2 and the insulating substrate 3 are bonded and formed by acrylic adhesive. In this embodiment, the printed structure 8 adopts a cross structure, and there are multiple printed structures 8, and the multiple printed structures 8 are evenly arranged to improve the bonding ability between the patterned electrode 1 and the piezoelectric device 9.

[0030] See also Figure 7 , showing the use scenario of the structural design method for improving the electrode bonding ability in this embodiment. The patterned electrode 1 is located between two layers of piezoelectric devices 9 and bonded by a glue layer. The printed structure 8 increases the contact area between the glue layer and the patterned electrode 1, and at the same time forms a glue layer similar to a "rivet" structure to connect the upper and lower interfaces of the patterned electrode 1, thereby improving the bonding ability between the patterned electrode 1 and the piezoelectric device 9.

[0031] The above is only an explanation of the preferred embodiments of the present invention, which should not be construed as a limitation on the claims. Any equivalent process changes made using the present invention specification are included in the patent protection scope of the present invention.

Claims

1. A method for designing a patterned electrode structure, characterized in that: Prepare a metal electrode layer and an insulating substrate, wherein the insulating substrate is selected from polyester film or polyimide, and the metal electrode layer is any one of rolled copper, electrolytic copper, aluminum, gold, graphene, carbon nanotubes, and conductive silver paste or a combination thereof; The insulating substrate and the metal electrode layer of the same area are bonded together and cut into the desired shape by die-punching technology, wherein the insulating substrate and the metal electrode layer are both provided with pin structures for connecting leads; The metal electrode layer is processed into the desired pattern by etching technology.

2. The method for designing a patterned electrode structure according to claim 1, wherein: The metal electrode layer is an integral or discrete structure.

3. The method for designing a patterned electrode structure according to claim 1, wherein: After the materials are prepared, the pattern of the metal electrode layer can also be directly formed on the surface of the insulating substrate by sputtering technology.

4. The method for designing a patterned electrode structure according to claim 2, wherein: When the metal electrode layer is a discrete structure, each discrete electrode region leads out a signal through a sub-pin, and a sub-pin of one of the discrete electrode regions is selected to extend a patterned electrode for connection with the pin structure of the connecting lead.

5. The method for designing a patterned electrode structure according to claim 1, wherein: A printing structure is provided on the patterned electrode, and the printing structure penetrates downwardly through the metal electrode layer and the insulating substrate.

6. The method for designing a patterned electrode structure according to claim 5, characterized in that: The metal electrode layer is made of rolled copper material.

7. The method for designing a patterned electrode structure according to claim 5, wherein: The insulating substrate is made of PI material.

8. The method for designing a patterned electrode structure according to claim 5, wherein: The metal electrode layer is an integral structure.

9. The method for designing a patterned electrode structure according to claim 5, wherein: There are multiple printed structures, which are evenly arranged on the patterned electrodes.

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