Novel column planting equipment and column planting method

Abstract

The invention provides novel column implanting equipment and a column implanting method, and relates to the technical field of column implanting equipment.The novel column implanting equipment comprises a column laying plate, an implanting site is arranged on the column laying plate, and the shape and size of the implanting site allow an implanting component in a vertical state to be accommodated; the posture adjusting device acts on the implanted component and adjusts the posture and / or position of the implanted component; and the force acting device is used for applying variable force to the implantation component when the posture adjusting device adjusts the posture and / or the position of the implantation component, so that the implantation component falls into the implantation site. A highly flexible and effective system can be created through magnetic adsorption, vacuum adsorption and vibration modes, the probability that a columnar object is successfully inserted into an implantation site can be improved, meanwhile, the problems of possible blockage, damage caused by friction and the like in the insertion process can be reduced, the yield can be improved, and the production cost can be reduced. The method is especially suitable for application scenes requiring high precision and high success rate.

Description

Technical Field

[0001] The present invention relates to the technical field of column planting equipment, and in particular to a novel column planting equipment and a column planting method. Background Art

[0002] As the performance requirements of electronic products continue to increase, such as computers, communication equipment, consumer electronics, etc., higher requirements are placed on packaging technology, including faster model transmission speeds and higher integration. The packaging density of chips is getting higher and higher, requiring packaging technology to be able to realize more functional units in a smaller space. Pillar technology can effectively reduce circuit paths and improve circuit operating speed and reliability.

[0003] With the development of the semiconductor industry, especially the progress of integrated circuit technology, pillar planting has gradually matured as a high-density connection technology. Pillar planting equipment can ensure the accuracy of the relative position of pillars and pads. Pillar planting technology was initially mainly used in high-end computers, communication equipment and other fields. With the increasing demand for high-performance and high-reliability packaging in industries such as consumer electronics, automotive electronics, and medical equipment, pillar planting technology has been applied and promoted in a wider range of application fields.

[0004] In the prior art, the column planting method is all done manually. After the substrate with glue applied is positioned by a fixture, tweezers are used to place the tin columns one by one at the implantation site. The tin columns fall on the glue application position corresponding to the substrate by their own gravity, thus completing the entire column planting work. The column planting has poor stability and low efficiency, and there is room for improvement. Summary of the invention

[0005] In view of the defects in the prior art, the object of the present invention is to provide a novel column planting device and column planting method.

[0006] A novel column implanting device provided according to the present invention comprises a column laying plate: an implantation site is arranged on the column laying plate, and the shape and size of the implantation site allow for accommodating an implant component in an upright state; a posture adjustment device: the posture adjustment device acts on the implant component to adjust the posture and / or position of the implant component; a force application device: when the posture adjustment device adjusts the posture and / or position of the implant component, a variable force is applied to the implant component, causing the implant component to fall into the implantation site.

[0007] Preferably, the posture adjustment device comprises: a vibration device: the vibration device is arranged below the pillar plate, and the vibration device makes the implant component vibrate within a preset frequency range.

[0008] Preferably, the force application device comprises a magnetic component, the magnetic component is arranged below the pillar board, the implant component comprises a magnetic material component, and the magnetic component applies a downward magnetic force to the implant component.

[0009] Preferably, the magnetic assembly is configured to be movable in a plane below the pillar board;

[0010] And / or, the magnitude of the magnetic field strength of the magnetic assembly is configured to vary within a certain range.

[0011] Preferably, the force application device includes a vacuum assembly, the vacuum assembly is configured to communicate with the implantation site, the vacuum assembly draws a vacuum on the implantation site.

[0012] Preferably, the vacuum degree of the vacuum component is configured to be within a certain range, and the vacuum rate of the vacuum component is configured to vary within a certain range.

[0013] Preferably, the implantation sites are arranged in an array on the pillar board, and the air inlet and outlet of the vacuum component are connected to any implantation site; the air inlet and outlet of the vacuum component are configured as an asymmetric structure relative to the implantation site array.

[0014] Preferably, the force application device includes a magnetic component and a vacuum component. When the implant component is transferred to the implantation site, the magnetic component and the vacuum component simultaneously apply a downward force to the implant component and cooperate with the gravity of the implant component to complete the implantation.

[0015] Preferably, the column laying plate is arranged on a vacuum base, and a pressure plate is arranged above the outer periphery of the column laying plate, and the pressure plate and the vacuum base cooperate to clamp the column laying plate; a cover plate is arranged above the pressure plate, and the cover plate forms a recessed working cavity directly above the column laying plate.

[0016] According to a column planting method provided by the present invention, the column planting method comprises:

[0017] Adding implant components to the post board;

[0018] The force application device and the posture adjustment device are turned on, and the implant component falls into the implantation site under the combined action of gravity, vacuum, vibration, shaking and / or magnetic force;

[0019] Turn off the force application device and the posture adjustment device, remove the redundant implanted components on the surface of the column laying board, and complete the column laying action.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention can create a highly flexible and effective system through magnetic adsorption, vacuum adsorption and vibration, which helps to increase the probability of successful insertion of columnar objects into implantation sites, and at the same time helps to reduce problems such as blockage and damage caused by friction that may occur during the insertion process, and helps to improve the yield rate, especially for application scenarios requiring high precision and high success rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 This is a schematic diagram of the overall structure of the column planting device mainly embodied in the present invention;

[0024] Figure 2 This is a schematic axial view of the column board installation structure mainly embodied in the present invention;

[0025] Figure 3 This is a top view of the column board installation structure mainly embodied in the present invention;

[0026] Figure 4 This is a cross-sectional view of the column board installation structure mainly embodied in the present invention;

[0027] Figure 5 This is a schematic diagram of the implantation site structure of the present invention;

[0028] Figure 6 The present invention mainly embodies the array diagram of implantation sites on the pillar board;

[0029] Figure 7 The figure is a schematic diagram of the overall structure of the brush device mainly embodied in the present invention.

[0030] As shown in the figure:

[0031] Vacuum assembly 3 brush head 504

[0032] Vacuum base 301 Implant component 505

[0033] Cover plate 302 Working chamber 6

[0034] Pressure plate 303 Air inlet and outlet 7

[0035] Pillar board 304 First chamber 8

[0036] Magnetic assembly 4 Vacuum channel 9

[0037] Brush device 5 Implantation site 10

[0038] Column box 503 DETAILED DESCRIPTION

[0039] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0040] It should be emphasized that the implant component 505 of the present application can be a columnar structure or a spherical structure. The device of the technical solution of the present application is particularly suitable for columnar implant components 505, and can also be suitable for spherical implant components 505.

[0041] Embodiment 1

[0042] like Figure 1 As shown, a novel column implanting device provided according to the present invention includes a column board 304, a posture adjustment device and a force application device. An implantation site 10 is arranged on the column board 304. The shape and size of the implantation site 10 allow for accommodating an implant member 505 in an upright state. The posture adjustment device acts on the implant member 505 to adjust the posture and / or position of the implant member 505. When the posture adjustment device adjusts the posture and / or position of the implant member 505, the force application device applies a variable force to the implant member 505, causing the implant member 505 to fall into the implantation site 10.

[0043] The following contents of the technical solution of the present application are described by taking the columnar implant component 505 as an example. Further, the implant component 505 of the present application may include a tin column. The present embodiment is described by taking the tin column as an example and does not limit the material of the implant component 505.

[0044] Specifically, the column planting device includes a frame erected on the ground, the frame is the installation base of the device, the frame includes a base and legs, and a leg is respectively provided at the four corners below the base to achieve stable support for the base. The force application device includes a magnetic component 4 and / or a vacuum component 3.

[0045] like Figure 1 and Figure 2 As shown, in a feasible implementation manner: the magnetic component 4 is disposed below the pillar board 304, the implant component 505 includes a magnetic material component, and the magnetic component 4 applies a downward magnetic force to the implant component 505. Specifically, the implant component 505 includes a magnetic material component, and a magnetic coating may be attached to the surface of the tin pillar.

[0046] The technical solution of the present application provides a feasible implementation of a magnetic assembly 4: the magnetic assembly 4 is configured to be movable in the plane below the pillar board 304. Specifically, the magnetic assembly 4 may include a magnetic component and an orthogonal guide rail, the magnetic component is mounted on the orthogonal guide rail, and the magnetic component can move along the orthogonal guide rail, thereby realizing the movement of the magnetic component in the plane below the pillar board 304.

[0047] More specifically, the orthogonal guide rail of the present application can be composed of two groups of linear reciprocating drive devices, which are arranged orthogonally, and the magnetic component is installed on the movable part of one group of linear reciprocating drive devices, and the linear reciprocating drive device equipped with the magnetic component is installed on the movable part of the other group of linear reciprocating drive devices. It should be further explained that the implementation method of the present application only provides a technical solution that can realize the movement of the magnetic component 4 in the plane below the column board 304, and does not limit the specific implementation method. The linear reciprocating drive device of the present application can include a linear motor, a motor threaded screw pair, a handwheel threaded screw pair, a motor gear rack structure, etc. in the prior art that can realize fully automatic structures and semi-automatic structures of linear reciprocating motion.

[0048] The technical solution of the present application provides another feasible implementation of the magnetic assembly 4: the magnetic assembly 4 is configured to be fixedly installed below the pillar board 304, and preferably, the magnitude of the magnetic field strength of the magnetic assembly 4 is configured to vary within a certain range. Thus, the force applied by the magnetic assembly 4 to the implant member 505 is a variable force, which facilitates the implant member 505 to enter the implantation site 10.

[0049] It should be supplemented that: in the embodiment where the magnetic assembly 4 is configured to be movable within the plane below the pillar board 304, the strength of the magnetic field of the magnetic assembly 4 may also be configured to vary within a certain range.

[0050] like Figure 3 , Figure 4 , Figure 5 , Figure 6 as well as Figure 7As shown, in a feasible embodiment: the force application device includes a vacuum component 3, the vacuum component 3 is configured to communicate with the implantation site 10, and the vacuum component 3 evacuates the implantation site 10. Specifically, the vacuum component 3 includes a vacuum base 301, the vacuum base 301 is arranged on the frame, the column board 304 is arranged on the vacuum base 301, a pressing plate 303 is arranged above the outer periphery of the column board 304, the pressing plate 303 and the vacuum base 301 cooperate to clamp the column board 304, and a cover plate 302 is arranged above the pressing plate 303, and the cover plate 302 forms a concave working chamber 6 just above the column board 304. It should be further explained that a vacuum channel 9 is arranged below any implantation site 10 on the column board 304, and a first chamber 8 is formed in the vacuum base 301, and the first chamber 8 connects the air inlet and outlet 7 on the vacuum base 301 with any vacuum channel 9. Therefore, when the vacuum assembly 3 works together, the air inlet and outlet 7, the first chamber 8, the vacuum channel 9 and the implantation site 10 can all be evacuated into a negative pressure air chamber.

[0051] In one feasible embodiment: the air inlet and outlet 7 of the vacuum component 3 is configured as an asymmetric structure relative to the array of implantation sites 10. In another feasible embodiment: the vacuum degree of the vacuum component 3 is configured to be within a certain range, preferably the vacuum degree of the vacuum component 3 is configured to be about -70Kpa, and the vacuum rate of the vacuum component 3 is configured to vary within a certain range. Thus, the vacuum component 3 exerts a varying force on the implant member 505, and the above two feasible embodiments can be used simultaneously.

[0052] It should be emphasized that, in the present application, preferably, when the posture adjustment device adjusts the posture and / or position of the implant component 505, the magnetic component 4 and the vacuum component 3 simultaneously apply a downward force to the implant component 505, and complete the implantation in cooperation with the gravity of the implant component 505. During the movement, the implant component 505 falls into the implantation site 10 on the surface of the pillar board 304 under the combined action of its own gravity, the vacuum suction force in the pillar board 304, and the magnetic force of the magnetic component 4 to complete the pillar implantation action.

[0053] The posture adjustment device acts on the implant component 505 to adjust the posture and / or position of the implant component 505. The technical solution of the present application provides two feasible posture adjustment devices, one is a brush device 5, and the other is a vibration device. The brush device 5 and the vibration device can be used alone or in combination.

[0054] Specifically, the brush device 5 is arranged above the pillar board 304, and the brush device 5 moves to transfer the implant component 505 to the implantation site 10. When the brush device 5 transfers the implant component 505, the force device applies a variable force to the implant component 505, causing the implant component 505 to fall into the implantation site 10. During operation, the implant component 505 is put onto the pillar board 304, and the brush device 5 moves on the pillar board 304 to transfer the implant component 505 to the implantation site 10. Under the combined action of the variable force applied by the force device and the gravity of the implant component 505 itself, the implant component 505 falls into the implantation site 10 to complete the pillar planting action.

[0055] The vibration device is arranged below the pillar board 304. The vibration device makes the implant component 505 vibrate within a preset frequency range. The output types of the vibration device include vertical vibration, horizontal vibration and shaking. During operation, the implant component 505 is put on the pillar board 304. When the vibration device drives the implant component 505 to vibrate, the implant component 505 falls into the implantation site 10 under the combined action of the changing force applied by the force device and the gravity of the implant component 505 itself to complete the pillar planting action.

[0056] like Figure 7 As shown, the brush device 5 is configured to be able to move in a horizontal direction in the space above the column board 304, and the brush device 5 itself is configured to be able to rotate. The brush device 5 includes a brush head 504 that can rotate and a motion component. The motion component can be a spatial slide rail mechanism, and the spatial slide rail mechanism can be a slide rail group that moves along the spatial coordinate X axis, Y axis and Z axis respectively in the prior art, so as to realize the brush head 504 to move along the X axis, Y axis and Z axis respectively in the spatial coordinate system above the column board 304. The motion component can also be a multi-degree-of-freedom manipulator, preferably a seven-degree-of-freedom manipulator, and the brush head 504 is installed at the output end of the seven-degree-of-freedom manipulator to realize the free movement of the brush head 504 in the spatial coordinate system above the column board 304. It should be supplemented that the present application does not make specific restrictions on the motion component, and the devices in the prior art that can realize the translation of the brush head 504 in the space above the column board 304 can all be applicable to the technical solution of the present application.

[0057] Furthermore, the technical solution of the present application can also integrate the column supply box 503 and the brush head 504 into one body, and the column supply box 503 can spread out the implant components 505 in the box. When performing the column planting operation, the brush device 5 moves to the top of the column laying board 304, and the column supply box 503 spreads out the implant components 505, and the implant components 505 fall on the column laying board 304. The brush device 5 rotates and translates to transfer the implant components 505 to the implantation site 10. Under the combined effect of the changing force applied by the magnetic component 4 and the vacuum component 3 and its own gravity, the implant components 505 adjust their posture and finally fall into the implantation site 10.

[0058] Embodiment 2

[0059] Based on the first embodiment, according to a novel column planting device provided by the present invention, the magnetic field strength of the magnetic component 4, the vacuuming rate of the vacuum component 3 and the frequency of the vibration device can all be designed according to actual needs.

[0060] Specifically, the setting of the magnetic field strength of the magnetic component 4 is related to the shape and weight of the implant component 505 .

[0061] The shape of the cylindrical object: Generally speaking, the longer the cylinder, the greater the magnetic force required. This is because a long cylinder may produce a greater leverage effect, increasing the risk of tilting or shifting. The larger the diameter of the cylinder, the larger the contact area, and generally requires a stronger magnetic force to ensure stable adsorption. A flat cylinder end face is easier to adsorb than an arc-shaped cylinder end face because it provides a larger contact area.

[0062] Weight of cylindrical objects: Weight is proportional to the required magnetic force. The heavier the object, the greater the magnetic force required to overcome gravity and maintain stable adsorption. The magnetic force should be at least greater than the weight of the object, and a safety factor is usually set, such as 1.5-2 times the weight of the object.

[0063] The magnetic force calculation can be expressed by a simplified magnetic force calculation formula:

[0064] F=μ*B^2*A / (2*μ0)

[0065] Where: F = magnetic force (N); μ = magnetic permeability of the material; B = magnetic induction intensity (T); A = contact area (m^2); μ0 = vacuum permeability (4π×10^-7H / m).

[0066] This application provides a specific implementation as a reference:

[0067] Assume that the smallest diameter column (0.15 mm) is used;

[0068] A=π*(0.15 / 2000)^2=1.77×10^-8m^2;

[0069] Assume that the magnetic induction intensity B = 0.5T (this is a typical magnetic induction intensity of a permanent magnet);

[0070] F=(0.5^2*1.77×10^-8) / (2*4π×10^-7);

[0071] F≈0.000884N=0.884mN.

[0072] Calculation of vacuum adsorption force:

[0073] The calculation formula of vacuum adsorption force is:

[0074] F=P*A

[0075] Where: F = vacuum adsorption force (N); P = pressure difference (Pa); A = contact area (m^2).

[0076] This application provides a specific implementation as a reference:

[0077] The same minimum diameter column (0.15 mm) was used;

[0078] A=π*(0.15 / 2000)^2=1.77×10^-8m^2;

[0079] Assume that the vacuum pressure difference we use is P = 50kPa (this is a typical industrial vacuum system pressure);

[0080] F = 50000*1.77×10^-8;

[0081] F = 0.000885N = 0.885mN.

[0082] Comparison and analysis:

[0083] For the smallest diameter pillars (0.15 mm), the calculated magnetic and vacuum forces are very close, both around 0.88-0.89 mN. However, these forces still need to be compared with gravity and other forces such as surface tension.

[0084] Gravity calculation: Assuming that the column material is steel (density is about 7800kg / m^3), the length is 1.5mm (10 times the diameter), the volume V = π*(0.15 / 2000)^2*0.0015 = 2.65×10^-11m^3, and the weight W = 7800*2.65×10^-11*9.81≈2.03×10^-6N = 0.00203mN.

[0085] Safety factor consideration: Assuming a 20-fold safety factor is required, the total force required = 0.00203*20 = 0.0406 mN.

[0086] Force distribution: Since the calculated magnetic attraction force and vacuum adsorption force are much greater than the required total force, you can choose to use only one of the forces, or use a combination of the two forces. For example, you can choose: vacuum adsorption force: 0.0365mN (90% of the required total force) magnetic attraction force: 0.0041mN (10% of the required total force).

[0087] Adjustment parameters: For vacuum adsorption, the vacuum pressure can be reduced to about 2.06kPa to achieve a force of 0.0365mN. For magnetic attraction, the magnetic induction intensity can be reduced to about 0.1T to achieve a force of 0.0041mN.

[0088] Conclusion: For the smallest size of pillars, both vacuum adsorption and magnetic attraction can provide sufficient force. Considering the need to implant a large number of pillars and minimize the interference between adjacent pillars, it is recommended to mainly use vacuum adsorption force, supplemented by a small amount of magnetic attraction force. For pillars with larger diameters (up to 0.4mm), the force will increase accordingly, but the principle still applies. In practical applications, it may be necessary to adjust the size and proportion of the force according to the specific situation (such as pillar material, environmental conditions, etc.). Furthermore, an adjustable system can be designed that can dynamically adjust the vacuum pressure and magnetic field strength according to pillars of different sizes and materials.

[0089] In a specific case:

[0090] Take a column with a diameter of 0.4 mm and assume its length is 3 mm as an example;

[0091] Magnetic attraction calculation:

[0092] F = (B^2*A) / (2*μ0);

[0093] A=π*(0.4 / 2000)^2=1.26×10^-7m^2;

[0094] Assume that the magnetic induction intensity remains unchanged, B = 0.5T;

[0095] F=(0.5^2*1.26×10^-7) / (2*4π×10^-7);

[0096] F≈0.00628N=6.28mN.

[0097] Calculation of vacuum adsorption force:

[0098] Use the formula: F = P * A;

[0099] A=π*(0.4 / 2000)^2=1.26×10^-7m^2;

[0100] Maintain the same pressure difference, P = 50kPa;

[0101] ^

[0102] F = 50000*1.26×10-7;

[0103] F = 0.0063N = 6.3mN.

[0104] Gravity calculation:

[0105] Assume that the column material is still steel (density is about 7800kg / m^3) and the length is 3mm;

[0106] Volume V = π*(0.4 / 2000)^2*0.003=3.77×10^-10m^3;

[0107] Weight W = 7800*3.77×10^-10*9.81≈2.88×10^-5N=0.0288mN.

[0108] Safety factor considerations:

[0109] Maintaining a safety factor of 20 times, the total force required = 0.0288*20 = 0.576mN.

[0110] Force distribution: The calculated magnetic and vacuum forces are much greater than the total required force. The strength of these forces can be significantly reduced: for example, you can choose: vacuum force: 0.518mN (90% of the total required force); magnetic force: 0.058mN (10% of the total required force).

[0111] Adjust parameters: For vacuum adsorption, we can reduce the vacuum pressure to about 4.11kPa to achieve a force of 0.518mN. For magnetic attraction, we can reduce the magnetic induction intensity to about 0.054T to achieve a force of 0.058mN.

[0112] Analysis and conclusions: For the largest size of the column (0.4mm diameter, 3mm length), the required force is significantly greater than the smallest size of the column, but it is still much less than the maximum force that can be provided by the magnetic and vacuum forces at full power. Both vacuum and magnetic suction can easily provide sufficient force, and even significantly reduce their strength. Due to the need to implant a large number of columns and considering the weakening and minimization of interference between adjacent columns, it is still recommended to mainly use vacuum suction force, supplemented by a small amount of magnetic suction force. Compared with the smallest size column, the largest size column requires about 14 times the force (0.576mN vs 0.0406mN). This means that the system needs to have enough adjustment range to accommodate columns of different sizes.

[0113] Furthermore, the advantages and disadvantages of magnetic attraction, vibration, and vacuum adsorption when planting columns are as follows:

[0114]

[0115]

[0116] This application combines magnetic adsorption, vacuum adsorption and vibration to create a more efficient and reliable system for inserting cylindrical objects into holes. Specifically:

[0117] Initial positioning and alignment: Magnetic attraction can start to work as soon as the column approaches the orifice, helping with initial positioning and alignment. This is because the magnetic force can attract the column at a certain distance, guiding it to the approximately correct position even if it is not perfectly aligned.

[0118] Stable grip: Vacuum suction can be activated when the cylinder approaches the orifice, providing a stable and controlled grip. This method is suitable for a variety of materials and can ensure that the cylinder will not fall out during the insertion process.

[0119] Overcoming resistance and self-alignment: The vibration system can provide slight vibrations during the insertion process to help overcome friction between the post and the hole wall and possible sticking. The vibration can also promote the self-alignment of the post, making it easier to slide into the hole.

[0120] Precise control: Magnetic force can provide the main vertical force to help control the descent speed. Vacuum adsorption can accurately control the position of the column to prevent lateral deviation. Vibration can adjust the frequency and amplitude as needed to adapt to different insertion stages.

[0121] Adaptability: This combined system can adapt to various materials and shapes of columns: For magnetic materials, it can mainly rely on magnetic adsorption. For non-magnetic materials, it can mainly use vacuum adsorption. The vibration system can be used for all types of materials.

[0122] Overcoming their respective shortcomings: The disadvantage of magnetic adsorption that the strength varies with distance can be compensated by vacuum adsorption. The problem of vacuum adsorption being sensitive to surface conditions can be partially alleviated by vibration. The instability that may be caused by vibration can be offset by the stabilizing effect of magnetic and vacuum adsorption.

[0123] Optimization of the insertion process: Initial stage: mainly use magnetic force for rough positioning. Contact stage: start vacuum suction to ensure stable grasping. Insertion stage: turn on vibration and gradually reduce magnetic and vacuum suction to let the column slide into the hole in a controlled state. Final positioning: magnetic or vacuum suction can be increased briefly to ensure that the column is fully in place.

[0124] Improved success rate: By combining these three methods, the system can better cope with various possible problems, such as: imperfect initial alignment; tiny burrs or irregularities on the hole wall; slight defects on the column surface; interference from environmental factors (such as vibration or airflow).

[0125] Real-time adjustment: The insertion process can be monitored by sensors, and the magnitude of the three forces and vibration parameters can be adjusted in real time to obtain the best effect.

[0126] Adapt to different sizes: This combined system can more easily adapt to different sized columns and holes, simply by adjusting the parameters of the individual subsystems.

[0127] Combining magnetic attraction, vacuum attraction, and vibration can create a highly flexible and effective system. This approach can significantly increase the probability of successfully inserting a cylindrical object into a hole while reducing the potential for problems during the insertion process. Although this system may be more complicated to initially set up and control, it provides greater reliability and adaptability, especially when dealing with cylinders of various materials, shapes, and sizes. In application scenarios that require high precision and high success rates, this combined approach may bring significant benefits.

[0128] Embodiment 3

[0129] Based on the first or second embodiment, a column planting method according to the present invention includes:

[0130] Implant components 505 are added to the pillar board 304.

[0131] The force application device and the posture adjustment device are turned on to draw a vacuum so that a negative pressure air chamber is formed at the implantation site 10. The implantation component 505 falls into the implantation site 10 under the combined effect of gravity, vacuum, vibration, shaking and / or magnetic force;

[0132] The force application device and the posture adjustment device are turned off, and the redundant implanted components 505 on the surface of the pillar laying plate 304 are removed to complete the pillar laying action.

[0133] It should be noted that during the vibration of the implant component 505, the vibration frequency of the vibration device can be dynamically adjusted to ensure that the column does not jump out of the cover plate 302. The vibration device generally has a seesaw rocking mechanism, a rotary rocking mechanism, and a reciprocating rocking mechanism. These three types of mechanisms can further improve the yield of column implantation. The above three rocking mechanisms can also exist independently from the vibration device. The three methods of implanting the bulb, the electromagnetic device, the vibration device, and the vacuum structure, can also exist independently or any combination of them can be used.

[0134] It should be further explained that the column planting device and column planting method of the present application are also applicable to ball planting.

[0135] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0136] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A new type of column planting equipment, characterized in that: include: Pillar board (304): the pillar board (304) is provided with an implantation site (10), the shape and size of the implantation site (10) allowing for the accommodation of an implantation member (505) in an upright state; A posture adjustment device: acts on the implant component (505) to adjust the posture and / or position of the implant component (505); Force application device: When the posture adjustment device adjusts the posture and / or position of the implant component (505), a variable force is applied to the implant component (505), so that the implant component (505) falls into the implantation site (10).

2. The novel column planting device according to claim 1, characterized in that: The posture adjustment device comprises: Vibration device: The vibration device is arranged below the pillar plate, and the vibration device makes the implant component (505) vibrate within a preset frequency range.

3. The novel column planting device according to claim 1, characterized in that: The force application device comprises a magnetic component (4), the magnetic component (4) is arranged below the pillar board (304), the implant component (505) comprises a magnetic material component, and the magnetic component (4) applies a downward magnetic force to the implant component (505).

4. The novel column planting device as claimed in claim 3 is characterized in that: The magnetic assembly (4) is configured to be movable in a plane below the pillar board (304); And / or, the magnitude of the magnetic field strength of the magnetic component (4) is configured to vary within a certain range.

5. The novel column planting device according to claim 1, characterized in that: The force application device comprises a vacuum component (3), wherein the vacuum component (3) is configured to communicate with the implantation site (10), and the vacuum component (3) evacuates the implantation site (10).

6. The novel column planting device according to claim 5, characterized in that: The vacuum degree of the vacuum component (3) is configured to be within a certain range, and the vacuum rate of the vacuum component (3) is configured to vary within a certain range.

7. The novel column planting device according to claim 5, characterized in that: The implantation sites (10) are arranged in an array on the pillar board (304), and the air inlet and outlet (7) of the vacuum component (3) are connected to any implantation site (10); The air inlet and outlet (7) of the vacuum assembly (3) are configured in an asymmetric structure relative to the array of implantation sites (10).

8. The novel column planting device according to claim 1, characterized in that: The force application device comprises a magnetic component (4) and a vacuum component (3), and when the implant member (505) is transferred to the implantation site (10): The magnetic component (4) and the vacuum component (3) simultaneously exert a downward force on the implant component (505) and cooperate with the gravity of the implant component (505) to complete the implantation.

9. The novel column planting device according to claim 1, characterized in that: The column laying plate (304) is arranged on the vacuum base (301), a pressing plate (303) is arranged above the outer periphery of the column laying plate (304), and the pressing plate (303) and the vacuum base (301) cooperate to clamp the column laying plate (304); A cover plate (302) is arranged above the pressing plate (303), and the cover plate (302) forms a recessed working cavity (6) just above the column laying plate (304).

10. A column planting method, characterized in that: Using the novel column planting device according to any one of claims 1 to 9, the column planting method comprises: Adding implant components (505) to the pillar board (304); The force application device and the posture adjustment device are turned on, and the implant component (505) falls into the implantation site (10) under the combined effect of gravity, vacuum, vibration, shaking and / or magnetic force; The force application device and the posture adjustment device are turned off, and the redundant implanted components (505) on the surface of the column laying plate (304) are removed to complete the column laying action.

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