Chip on film and display module

Abstract

The invention provides a chip on film and a display module, the chip on film comprises a first binding part and a second binding part which extend along a first direction and a plurality of connecting parts which extend along a second direction, a first interval is arranged between the first binding part and the second binding part, the plurality of connecting parts are located in the first interval, and the first binding part and the second binding part extend along the second direction. Each connecting part is connected to the first binding part and the second binding part, a second interval is formed between every two adjacent connecting parts, and the second interval is arranged on the chip on film, so that the pulling force borne by the chip on film is reduced, the stress generated when the chip on film is pulled is reduced, and the risk that the binding position of the chip on film and the display panel is peeled off is reduced.

Description

[0001] This application is a divisional application with application date of July 1, 2022, application number 202210775466.3, and invention name “Chip-on film and display module”. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a chip-on-chip film and a display module. Background Art

[0003] With the advancement of display technology, high screen-to-body ratio displays have gradually become the mainstream trend in the market. To achieve a high screen-to-body ratio, the border must be narrowed. Among them, the use of chip on film (COF) technology can effectively narrow the border. COF technology is a technology that uses a flexible circuit board as a chip packaging carrier to connect the chip with the flexible circuit board circuit.

[0004] In recent years, curved displays have become popular among users due to their fashionable appearance and strong visual effects. However, during the assembly process of curved displays, due to the bending of the display panel and the printed circuit board (PCB), the COF is pulled and stress is generated, which leads to the risk of peeling at the binding point of the COF and the display panel. Summary of the invention

[0005] The present application provides a chip-on-film and a display module to alleviate the technical problem of the risk of peeling off at the binding point between the existing COF and the display panel.

[0006] To solve the above problems, the technical solutions provided by this application are as follows:

[0007] The present application provides a flip chip film, which includes:

[0008] A first binding portion extending along a first direction;

[0009] A second binding portion extending along the first direction and having a first interval between the second binding portion and the first binding portion;

[0010] A plurality of connecting portions, disposed in the first interval, each of the connecting portions extending along the second direction and connected to the first binding portion and the second binding portion;

[0011] Wherein, there is a second interval between two adjacent connecting parts.

[0012] In the chip-on-film provided in the embodiment of the present application, the chip-on-film further includes a third binding portion located in the first interval, and the third binding portion is connected to at least a portion of the connecting portion.

[0013] In the chip-on-film provided in the embodiment of the present application, the chip-on-film further includes at least one reinforcing portion located in at least a portion of the second interval, and each of the reinforcing portions is connected to two adjacent connecting portions.

[0014] In the flip chip film provided in the embodiment of the present application, the number of the reinforcement parts in each of the second intervals is 2, and the two reinforcement parts are respectively a first reinforcement part and a second reinforcement part, wherein the first reinforcement part is located on a side of the third binding part close to the first binding part, and the second reinforcement part is located on a side of the third binding part close to the second binding part.

[0015] In the chip-on-film provided in the embodiment of the present application, a plurality of the first reinforcing portions are arranged in a straight line, and a plurality of the second reinforcing portions are arranged in a straight line.

[0016] In the chip-on-film provided in the embodiment of the present application, a plurality of the first reinforcing portions are arranged in a staggered manner, and a plurality of the second reinforcing portions are arranged in a staggered manner.

[0017] In the chip-on-film provided in the embodiment of the present application, each of the reinforcing portions includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion are both connected to two adjacent connecting portions, and the first sub-portion and the second sub-portion are cross-arranged.

[0018] In the chip-on-film provided in the embodiment of the present application, the reinforcing portion close to the third binding portion is connected to the third binding portion.

[0019] In the chip-on-film provided in the embodiment of the present application, the spacing distance between any two adjacent second spacings is equal.

[0020] The present application also provides a display module, which includes:

[0021] Display panel;

[0022] A printed circuit board is fixed to the non-light-emitting side of the display panel; and

[0023] In one of the above embodiments, the first binding portion of the chip-on-film is bound to the display panel, and the second binding portion of the chip-on-film is bound to the printed circuit board.

[0024] The beneficial effects of the present application are as follows: in the chip-on-chip film and display module provided by the present application, the chip-on-chip film includes a first binding portion and a second binding portion extending along a first direction and a plurality of connecting portions extending along a second direction, a first interval is provided between the first binding portion and the second binding portion, a plurality of connecting portions are located within the first interval, and each connecting portion is connected to the first binding portion and the second binding portion, and a second interval is provided between two adjacent connecting portions, and the second interval is provided on the chip-on-chip film to reduce the pulling force on the chip-on-chip film, reduce the stress generated when the chip-on-chip film is pulled, and thereby reduce the risk of peeling off at the binding point between the chip-on-chip film and the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of a top view of the flip chip film provided in an embodiment of the present application.

[0027] Figure 2 Another schematic diagram of the top view structure of the flip chip film provided in an embodiment of the present application.

[0028] Figure 3 A schematic diagram of another top view structure of the flip chip film provided in an embodiment of the present application.

[0029] Figure 4 This is a stress simulation cloud diagram of the existing flip chip film.

[0030] Figure 5 A stress simulation cloud diagram of the flip chip film provided in an embodiment of the present application.

[0031] Figure 6 A schematic diagram of a cross-sectional structure of a display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented in. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the figures, units with similar structures are represented by the same reference numerals. In the accompanying drawings, the thickness of some layers and regions is exaggerated for clear understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited to this.

[0033] In order to solve the problem that during the assembly process of a curved display, the COF is pulled and stress is generated due to the bending of the display panel and the printed circuit board, and then the COF and the display panel are peeled off at the binding point, the present application provides a chip-on-film and a display module to solve the problem:

[0034] Please refer to Figure 1 , Figure 1 A schematic diagram of a top view structure of a chip-on-film provided in an embodiment of the present application. The chip-on-film 100 includes a first binding portion 10 and a second binding portion 20 both extending along a first direction X and a plurality of connecting portions 30 extending along a second direction Y. A first interval L1 is provided between the first binding portion 10 and the second binding portion 20. A plurality of connecting portions 30 are arranged in the first interval L1, each of the connecting portions 30 extends along the second direction Y, and each of the connecting portions 30 is connected to the first binding portion 10 and the second binding portion 20. Wherein, a second interval L2 is provided between two adjacent connecting portions 30.

[0035] In this way, by setting the second interval L2 on the chip-on-film 100, the pulling force on the chip-on-film 100 is reduced, and the stress generated when the chip-on-film 100 is pulled is reduced, thereby reducing the risk of peeling off the chip-on-film 100 and the display panel binding. Optionally, the spacing distance between each two adjacent second intervals L2 is equal to better balance the stress generated when the chip-on-film 100 is pulled.

[0036] It should be noted that the first direction X is a horizontal direction, and the second direction Y is a vertical direction, that is, the first direction X is perpendicular to the second direction Y. Of course, the present application is not limited thereto, and the first direction X of the present application may also be set at a certain angle to the second direction Y. The present application takes the example that the first direction X is perpendicular to the second direction Y.

[0037] The COF 100 further includes a third binding portion 40 located in the first interval L1, and the third binding portion 40 is connected to at least a portion of the connecting portion 30. Figure 1 As shown, the third binding portion 40 is connected to three adjacent connecting portions 30 in the middle area of ​​the COF 100. The third binding portion 40 is used to bind a driver integrated circuit (IC). Optionally, the third binding portion 40 also extends along the first direction X, that is, the third binding portion 40 is parallel to the first binding portion 10 and the second binding portion 20.

[0038] It can be understood that the first binding part 10, the second binding part 20 and the third binding part 40 all include a flexible substrate and binding terminals and signal traces arranged on the flexible substrate. For example, the first binding part 10 is provided with a plurality of first binding terminals arranged in an array, the second binding part 20 is provided with a plurality of second binding terminals arranged in an array, and the third binding part 40 is provided with a third binding terminal corresponding to the first binding terminal and a fourth binding terminal corresponding to the second binding terminal. The signal traces include a first input signal trace and an output signal trace, the input signal trace is electrically connected to the second binding terminal and the fourth binding terminal, and the output signal trace is electrically connected to the first binding terminal and the third binding terminal. The first binding part 10 is bound to the display panel, the second binding part 20 is bound to the printed circuit board, and the driver IC is bound to the third binding part 40 through the third binding terminal and the fourth binding terminal of the third binding part 40.

[0039] In addition, in order to achieve electrical connection between corresponding terminals on each binding part (first binding part 10, second binding part 20, third binding part 40), the signal routing must also be arranged in at least part of the connecting part 30, for example, the signal line is also arranged in the connecting part 30 that is connected to the third binding part 40.

[0040] Furthermore, in order to reinforce the overall structure of the COF 100, the COF 100 further includes at least one reinforcing portion 50 located in at least a portion of the second interval L2, and each reinforcing portion 50 is connected to two adjacent connecting portions 30. It is understandable that in order to reduce the wiring difficulty caused by concentrating all the signal lines in the connecting portions 30 connected to the third binding portion 40, the signal lines can be dispersed in each connecting portion 30, and the signal lines can be routed to the third binding portion 40 through the reinforcing portions 50 between the connecting portions 30.

[0041] Optionally, the number of the reinforcing parts 50 in each second interval L2 is 2, and the two reinforcing parts 50 are respectively a first reinforcing part 50-1 and a second reinforcing part 50-2, wherein the first reinforcing part 50-1 is located on a side of the third binding part 40 close to the first binding part 10, and the second reinforcing part 50-2 is located on a side of the third binding part 40 close to the second binding part 20. Multiple first reinforcing parts 50-1 are arranged in a staggered manner, and multiple second reinforcing parts 50-2 are arranged in a staggered manner to improve the stability of the overall structure of the chip-on-film 100.

[0042] In one embodiment, please refer to Figure 1 and Figure 2 , Figure 2 Another schematic diagram of the top view structure of the flip chip film provided in the embodiment of the present application. Different from the above-mentioned embodiment, the multiple first reinforcement parts 50-1 on the flip chip film 101 are arranged in a straight line, and the multiple second reinforcement parts 50-2 are arranged in a straight line. And the reinforcement part 50 close to the third binding part 40 is connected to the third binding part 40, so that when the signal routing in the connecting part 30 that is not connected to the third binding part 40 is to go to the third binding part 40, the signal routing of this part can be designed as a straight line, and go to the third binding part 40 through the two adjacent reinforcement parts 50 arranged in a straight line in the second intervals L2, so as to reduce the routing difficulty and reduce the risk of signal line failure.

[0043] In one embodiment, please refer to Figures 1 to 3 , Figure 3 Another schematic diagram of a top view of the COF film provided in an embodiment of the present application is shown in FIG. Different from the above embodiment, each of the reinforcing portions 50 on the COF film 102 includes a first sub-portion 51 and a second sub-portion 52, and the first sub-portion 51 and the second sub-portion 52 are both connected to two adjacent connecting portions 30, and the first sub-portion 51 and the second sub-portion 52 are arranged crosswise to further improve the stability of the overall structure of the COF film 102.

[0044] Optionally, the intersection centers of the first sub-portions 51 and the second sub-portions 52 of all the first reinforcement portions 50-1 are on a straight line, and the intersection centers of the first sub-portions 51 and the second sub-portions 52 of all the second reinforcement portions 50-2 are on a straight line, so that the first reinforcement portion 50-1 and the second reinforcement portion 50-2 are symmetrical about the third binding portion 40 to avoid stress concentration.

[0045] The following will illustrate the effect of the flip chip film of the present application through simulation:

[0046] Please refer to Figure 4 and Figure 5 , Figure 4 This is the stress simulation cloud diagram of the existing flip chip film. Figure 5 This is a stress simulation cloud diagram of the flip chip film provided in the embodiment of the present application. Figure 4 and Figure 5 It can be seen that Figure 4 When the existing chip-on-chip film is subjected to a pulling force, the maximum stress generated by the chip-on-chip film is relatively large, and the maximum stress is concentrated at the end of the chip-on-chip film, which is the binding portion of the chip-on-chip film used to bind to the display panel. The stress at this position is relatively large, which can easily cause the chip-on-chip film to peel off from the display panel.

[0047] The stress distribution of the flip chip film of the present application is as follows: Figure 5 As shown, from Figure 5 It can be seen that when the flip chip film is subjected to a tensile force, the maximum stress generated by the flip chip film is Figure 4 The maximum stress is small, and the maximum stress is concentrated in the middle position of the chip-on-chip film, that is, the middle position of the connecting portion 30, while the stress at the first binding portion 10 and the second binding portion 20 of the chip-on-chip film is small, thereby reducing the risk of peeling of the chip-on-chip film and the display panel.

[0048] It should be noted that the stress simulation of the embodiment of the present application is described by taking the structure of the COF 102 as an example, but the COF 100 and the COF 101 have the same function as the COF 102 .

[0049] Based on the same inventive concept, the present application embodiment also provides a display module, please refer to Figures 1 to 6 , Figure 6 A cross-sectional structural diagram of a display module provided in an embodiment of the present application. The display module 1000 comprises a display panel 200, a printed circuit board 300 and a chip-on-film 100 as one of the above embodiments, wherein the chip-on-film 100 is electrically connected to the display panel 200 and the printed circuit board 300.

[0050] The display panel 200 has a light emitting side and a non-light emitting side away from the light emitting side, and the printed circuit board 300 is fixed to the non-light emitting side of the display panel 200. The display panel 200 also includes a display area and a binding area located on one side of the display area, the first binding portion 10 of the chip-on-film 100 is bound to the binding area of ​​the display panel 200, and the second binding portion 20 of the chip-on-film 100 is bound to the printed circuit board 300, so as to realize the electrical connection between the printed circuit board 300 and the display panel 200.

[0051] Optionally, the display module 1000 can be applied to mobile phones, televisions, tablets, computers, wearable electronic devices, etc.

[0052] According to the above embodiments, it can be seen that:

[0053] The present application provides a chip-on-chip film and a display module, wherein the chip-on-chip film comprises a first binding portion and a second binding portion extending along a first direction and a plurality of connecting portions extending along a second direction, wherein a first interval is provided between the first binding portion and the second binding portion, wherein a plurality of connecting portions are located within the first interval, and each connecting portion is connected to the first binding portion and the second binding portion, and a second interval is provided between two adjacent connecting portions, wherein the second interval is provided on the chip-on-chip film to reduce the pulling force on the chip-on-chip film, and reduce the stress generated when the chip-on-chip film is pulled, thereby reducing the risk of peeling off at the binding point between the chip-on-chip film and the display panel.

[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0055] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip-on-film, characterized in that: include: A first binding portion extending along a first direction; A second binding portion extending along the first direction and having a first interval between the second binding portion and the first binding portion; A plurality of connecting parts are arranged in the first interval, each of the connecting parts extends along the second direction and is connected to the first binding part and the second binding part, and a second interval is formed between two adjacent connecting parts; a third binding portion, disposed in the first interval, the third binding portion being connected to at least a portion of the connecting portion; The first binding portion, the second binding portion and the third binding portion all include a flexible substrate and binding terminals and signal traces disposed on the flexible substrate, and the signal traces are also disposed in at least a portion of the connecting portion.

2. The chip-on-film according to claim 1, wherein: The chip-on-film further includes a reinforcing portion disposed in at least a portion of the second interval, and each of the reinforcing portions is connected to two adjacent connecting portions.

3. The chip-on-film according to claim 2, wherein: The number of the reinforcement parts in each of the second intervals is 2, and the two reinforcement parts are respectively a first reinforcement part and a second reinforcement part, wherein the first reinforcement part is located on a side of the third binding part close to the first binding part, and the second reinforcement part is located on a side of the third binding part close to the second binding part.

4. The chip-on-film according to claim 3, characterized in that: A plurality of the first reinforcing parts are arranged in a straight line, and a plurality of the second reinforcing parts are arranged in a straight line.

5. The chip-on-film according to claim 3, characterized in that: A plurality of the first reinforcing parts are arranged in a staggered manner, and a plurality of the second reinforcing parts are arranged in a staggered manner.

6. The chip-on-film according to claim 1, wherein: The third binding portion is also located in the second interval, and each of the third binding portions is connected to two adjacent connecting portions; and the interval distance between each two adjacent second intervals is equal.

7. The chip-on-film according to claim 1, wherein: The first binding part is provided with a plurality of first binding terminals arranged in an array, the second binding part is provided with a plurality of second binding terminals arranged in an array, the third binding part is provided with a third binding terminal corresponding to the first binding terminal and a fourth binding terminal corresponding to the second binding terminal; the signal routing includes a first input signal routing and an output signal routing, the input signal routing is electrically connected to the second binding terminal and the fourth binding terminal, and the output signal routing is electrically connected to the first binding terminal and the third binding terminal.

8. The chip on film according to any one of claims 2 to 7, characterized in that: Each of the reinforcing portions includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion are both connected to two adjacent connecting portions, and the first sub-portion and the second sub-portion are cross-arranged.

9. The chip-on-film according to any one of claims 2 to 7, characterized in that: The reinforcing portion close to the third binding portion is connected to the third binding portion.

10. A display module, characterized in that: include: Display panel; A printed circuit board is fixed to the non-light-emitting side of the display panel; as well as According to any one of claims 1 to 9, the first binding portion of the chip-on-film is bound to the display panel, and the second binding portion of the chip-on-film is bound to the printed circuit board.

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