Ultra-wideband radio frequency receiving front-end SIP module system based on HTCC

Abstract

The invention belongs to the technical field of electronic reconnaissance, and discloses an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC, which comprises a three-dimensional package for signal transmission, and the three-dimensional package comprises a BGA layer, a package internal signal transmission layer, a top microstrip wiring and a device placement layer; the miniaturization advantage is obvious: the packaging substrate is formed by sintering aluminum oxide ceramic at high temperature, and the packaging substrate has 12 layers and is small in size. And the system integration degree is high: a single SIP module can be integrated with radio frequency front-end systems such as an amplitude limiter, a radio frequency switch, a filter, a low noise amplifier, a digital control attenuator and the like, so that related function indexes are realized. According to the radio frequency transmission line and power supply structure design, the structure comprises a radio frequency signal transmission line and a power supply distribution line. Wherein the routing of the radio frequency layer adopts a quasi-coaxial-strip line-quasi-coaxial structure, and good signal transmission can be realized in a frequency band of 2-10GHz.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic reconnaissance, and in particular relates to an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC. Background Art

[0002] As the RF receiving front end develops towards miniaturization and high integration of three-dimensional packaging, the application of three-dimensional interconnection technology has received widespread attention in the industry. At present, the design requirements for ultra-wideband receiving front ends are getting higher and higher, and high performance, miniaturization, and high integration are the development needs. Therefore, it is of great significance to develop an RF front-end module that can achieve high density and high performance.

[0003] Through the above analysis, the problems and defects of the prior art are as follows: The traditional receiving front end divides the signal into multiple channels, and then mixes, filters and amplifies the signal of each channel separately. This design will not only increase the attenuation in the circuit, causing the noise coefficient in the receiving link to deteriorate, but also the complexity of the link will increase the overall size. Summary of the invention

[0004] In view of the problems existing in the prior art, the present invention provides an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC.

[0005] The present invention is implemented in this way: an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC includes: A three-dimensional package for signal transmission, the three-dimensional package includes a BGA layer, an internal signal transmission layer, a top microstrip wiring, and a device placement layer.

[0006] A package internal signal transmission layer is arranged above the BGA layer; a top microstrip wiring is arranged above the package internal signal transmission layer; and a device placement layer is arranged above the top microstrip wiring.

[0007] Furthermore, the BGA layer defines and allocates relevant functions of the BGA, including input and output of radio frequency signals, calibration signal input, and attenuation control bit definition.

[0008] Furthermore, the signal transmission layer inside the package includes a radio frequency layer and a power supply layer, which are used for transmission of radio frequency signals and transmission and distribution of power supply signals.

[0009] Furthermore, the top-level design includes a microstrip line layout, a device placement area, and pads for gold wire bonding to transmit signals.

[0010] Another object of the present invention is to provide a method for controlling an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC, comprising: Step 1: Define and allocate relevant functions of BGA in the BGA layer, including input and output of RF signals, calibration signal input, and attenuation control bit definition.

[0011] Step 2, encapsulating the internal signal transmission layer including the radio frequency layer and the power supply layer, which are used for the transmission and distribution of radio frequency signals and power supply signals.

[0012] Step 3, the top-level design includes the microstrip line layout, device placement area, and pads for gold wire bonding to transmit signals.

[0013] Another object of the present invention is to provide a signal transmission method of an ultra-wideband radio frequency receiving front-end SIP module based on HTCC, comprising the following steps: The input, output, calibration signal input and attenuation control bits of the RF signal are defined in the BGA layer, and the RF signal is input through the BGA layer.

[0014] The RF signal is transmitted from the BGA layer to the signal transmission layer inside the package, the RF signal is transmitted through the RF layer of the signal transmission layer inside the package, and the power signal is transmitted and distributed through the power layer.

[0015] The RF signal is guided to the device placement layer through the top microstrip wiring, and the signal is amplified, filtered or attenuated on the device placement layer.

[0016] The signal transmission method further comprises: The RF layer and the power layer are designed separately in the signal transmission layer inside the package. The RF layer is used for the transmission of RF signals, and the power layer is used for the transmission and distribution of power signals, thereby realizing the separate transmission of RF signals and power signals and reducing signal interference.

[0017] The signal transmission method further comprises: The microstrip lines are rationally laid out in the top microstrip wiring so that the RF signals can be efficiently transmitted to the various RF components on the device placement layer through the microstrip lines, and the RF components are connected through gold wire bonding pads to ensure high-frequency transmission and processing of the signals.

[0018] The signal transmission method further includes a calibration step, specifically comprising: The calibration signal is introduced into the package through the calibration signal input port of the BGA layer to perform precise calibration of the RF signal, ensuring the accuracy of RF signal transmission and the stability of the system.

[0019] In combination with the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solutions to be protected by the present invention are as follows: First, the present invention proposes an ultra-wideband SIP module that can achieve good RF signal transmission at 2-10GHz. The present invention adopts HTCC technology to design the packaging substrate, which can ensure the high chemical stability, high thermal conductivity and high-density wiring capacity of the substrate, and has the characteristics of small size and high welding stability. The present invention adopts multi-layer power wiring to distribute the supplied power to ensure that chips at different positions can work normally within the working voltage. The present invention can integrate a series of RF chips and can realize functions such as filtering, amplification, and attenuation control.

[0020] The present invention has the characteristics of miniaturization, is easy to be integrated into various systems, does not occupy too much space, and is easy to carry and deploy.

[0021] The present invention can be tested by a flexible fixture test and a test board controlled by an external program. The test process is convenient and fast, and it is more intuitive to verify the performance.

[0022] The present invention has the characteristics of low power consumption, the power of the entire link is controlled within 2W, and the temperature characteristic is good.

[0023] Second, the present invention solves the problems of excessive attenuation in the conventional receiving front-end circuit, deterioration of the noise coefficient in the receiving link, and increase in the overall size due to the complexity of the link in the prior art. In domestic and foreign research, the signal transmission and processing between multiple levels are mainly realized by planar cascading. This design scheme will increase the size of the RF front end with the increase of components and functions. Therefore, miniaturization of the receiving front end is the current development trend. By adopting new materials and new processes, using multi-layer board technology and three-dimensional packaging technology, a high-performance, highly integrated miniaturized receiving front end is designed.

[0024] The present invention provides an ultra-wideband receiving front end that can improve the traditional large volume and link redundancy problems. Through reasonable design, it can be used as a standardized and universal module, suitable for all non-full-band receiving needs, and is also widely used in miniaturized and ultra-wideband electronic reconnaissance receiving systems. It includes but is not limited to the following features: 1. Obvious advantages of miniaturization: The packaging substrate is made of alumina ceramics sintered at high temperature, with a total of 12 layers of substrates and a small size.

[0025] 2. High system integration: A single SIP module can integrate RF front-end systems such as limiters, RF switches, filters, low noise amplifiers, digitally controlled attenuators, etc., thereby achieving relevant functional indicators.

[0026] 3. RF transmission line and power structure design: This structure includes RF signal transmission lines and power distribution lines. The RF layer line uses a quasi-coaxial-stripline-quasi-coaxial structure, which can achieve good signal transmission in the 2-10GHz frequency band; in addition, in order to cope with the voltage distribution of the external power supply, a two-layer power distribution structure is designed in this structure.

[0027] 4. Good interconnection consistency and short interconnection distance: The bottom of the present invention adopts a ball grid array (BGA) structure, which can achieve stable vertical interconnection between substrates and high signal transmission quality.

[0028] Third, as auxiliary evidence of the inventiveness of the present invention, it is also reflected in the following important aspects: (1) The expected benefits and commercial value of the technical solution of the present invention after transformation are: 1. Due to its ultra-wideband characteristics, the receiving front end of the present invention can be applied to a variety of communication systems, including radio communication, microwave communication, etc., providing high data transmission rate and high-capacity communication capabilities. At the same time, due to the high module integration and high degree of miniaturization, the receiving front end is easy to integrate into various systems, does not take up too much space, and is easy to carry and deploy.

[0029] 2. In the field of signal monitoring, the ultra-wideband receiving front end of the present invention can be used to monitor and analyze signals in different frequency bands, which is of great value for spectrum analysis and signal intelligence collection.

[0030] 3. The present invention reduces production costs and improves production efficiency through modular design, making the product more competitive in the market. It can also integrate chips with different functions together. This flexibility makes the ultra-wideband SIP module have a wide range of application prospects in diverse market demands.

[0031] (2) The technical solution of the present invention fills the technical gap in the industry at home and abroad: The present invention solves the problems of excessive attenuation in the conventional receiving front-end circuit, deterioration of the noise coefficient in the receiving link, and increase in the overall size due to the complexity of the link in the prior art. In domestic and foreign research, the signal transmission and processing between multiple levels are mainly realized by planar cascading. This design scheme will increase the size of the RF front end with the increase of components and functions. Therefore, miniaturization of the receiving front end is the current development trend. By adopting new materials and new processes, using multi-layer board technology and three-dimensional packaging technology, a high-performance, highly integrated miniaturized receiving front end is designed.

[0032] (3) The technical solution of the present invention solves a technical problem that people have been eager to solve but have never been able to solve successfully: The present invention allows multiple circuit layers to be stacked in the vertical direction, significantly improving the integration and functional density of the circuit. Through three-dimensional layout, the signal transmission path can be shortened, signal delay and interference can be reduced, and the stability and reliability of signal transmission can be improved. The three-dimensional structural design can better utilize space for thermal management, and effectively improve the heat dissipation efficiency through heat conduction between vertically stacked layers. Due to the shortened signal path, the three-dimensional transmission structure design helps to reduce the power consumption of the circuit. Compared with the traditional two-dimensional design, the three-dimensional transmission structure design can significantly reduce the occupied space, which helps to achieve miniaturization and portability. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a system structure diagram of an ultra-wideband radio frequency receiving front-end SIP module based on HTCC provided in an embodiment of the present invention.

[0034] Figure 2 It is a schematic diagram of the inter-layer layout and layer name allocation diagram in a multi-layer board provided by an embodiment of the present invention.

[0035] Figure 3 The present invention is a flowchart of a method for controlling an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC provided by an embodiment of the present invention.

[0036] Figure 4 It is a SIP transmission structure diagram provided by an embodiment of the present invention, showing in detail the bottom layer, RF layer, power layer routing and top layout wiring diagram.

[0037] Figure 5 It is an overall schematic diagram of the SIP transmission structure provided by an embodiment of the present invention.

[0038] Figure 6 It is a schematic diagram of the standing wave ratio of the SIP structure simulation test provided by the embodiment of the present invention.

[0039] Figure 7 It is a schematic diagram of S parameters of a SIP structure simulation test provided by an embodiment of the present invention.

[0040] Figure 8 This is a graph of S parameter test results of a SIP module after installing components provided by an embodiment of the present invention.

[0041] Fig. 9 It is a schematic diagram of the port standing wave ratio test results provided by an embodiment of the present invention.

[0042] Figure 1 Middle: 1. BGA layer; 2. Signal transmission layer inside the package; 3. Top microstrip wiring; 4. Device placement layer. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0044] The technical solution of the present invention solves the technical problems of the prior art.

[0045] 1) The problem of insufficient integration.

[0046] Prior art problems: Traditional RF receiving front-end modules are usually composed of multiple discrete components, which are connected by wires on a circuit board, resulting in low system integration, occupying a large physical space, and increasing losses and interference in the signal transmission path.

[0047] Solution of the present invention: The present invention adopts HTCC (high temperature co-fired ceramic) technology and utilizes a three-dimensional packaging structure to highly integrate the transmission, processing and output functions of RF signals into a compact SIP (system-in-package) module, thereby greatly improving the system integration and reducing the occupied space and loss in the signal path.

[0048] 2) Signal transmission loss and interference problems.

[0049] Existing technical problems: In traditional RF receiving front-end modules, the signal transmission path is long and susceptible to external interference, resulting in signal loss and distortion during transmission, affecting the overall performance of the system, especially in ultra-wideband applications, where signal integrity is particularly important.

[0050] The solution of the present invention: By designing a multi-layer structure in a three-dimensional package, especially the RF layer and the power layer in the signal transmission layer inside the package, the present invention realizes the optimized distribution and transmission of RF signals and power signals. The design of the top microstrip wiring further reduces the signal path length, reduces the loss and interference in the transmission, and thus ensures the integrity and stability of the signal.

[0051] 3) RF component integration and layout complexity issues.

[0052] Existing technical problems: Components such as amplifiers, filters and attenuators in the RF receiving front-end system usually require a large PCB board area and have a complex layout, which can easily lead to crosstalk and parasitic effects between signals, affecting system performance.

[0053] Solution of the present invention: In the top-level design of the three-dimensional packaging structure, the present invention optimizes the microstrip line layout, and compactly places the RF components on the device placement layer, and achieves efficient signal transmission through gold wire bonding and pad connection. Such a design not only simplifies the layout of components, but also reduces the complexity of the system, and reduces signal crosstalk and parasitic effects.

[0054] 4) System calibration and signal accuracy issues.

[0055] Existing technical problems: In traditional RF receiving systems, the signal path is complex and the system calibration is difficult, which affects the signal processing accuracy. Especially in ultra-wideband receiving applications, the calibration accuracy is crucial to the system performance.

[0056] Solution of the present invention: The present invention designs a special calibration signal input port in the BGA layer, and realizes high-precision calibration within the system by accurately defining and allocating the RF signal and the calibration signal. This design greatly improves the accuracy of signal processing and ensures the stability and reliability of the system.

[0057] The present invention achieves significant technical progress.

[0058] 1) Improved system integration and space utilization.

[0059] Through HTCC three-dimensional packaging technology, the present invention integrates a multi-layer structure and complex radio frequency functions into a SIP module, greatly improving the integration of the system, reducing the required physical space, and is suitable for high-density, high-performance radio frequency receiving front-end applications.

[0060] 2) Enhanced signal transmission integrity and anti-interference capabilities.

[0061] The present invention reduces the loss and interference in the signal transmission process by optimizing the transmission path design of the radio frequency signal and the power supply signal, especially the fine design of the top microstrip wiring and the radio frequency layer, which ensures the high integrity and low distortion of the signal in ultra-wideband transmission.

[0062] 3) Simplifies the layout of RF components and system design.

[0063] By compactly placing the RF components on the device placement layer and using optimized microstrip lines and gold wire bonding technology, the present invention simplifies the layout design of the RF components, reduces system complexity, improves the processing efficiency of RF signals, and reduces the difficulty of system design.

[0064] 4) High-precision system calibration and signal processing are achieved.

[0065] The present invention realizes high-precision system calibration through the functional definition of the BGA layer and the optimized calibration signal input design, enhances the accuracy of RF signal processing and the stability of the system, and is particularly suitable for high-precision signal processing requirements in ultra-wideband RF receiving applications.

[0066] Through the technical solution of the present invention, the problems existing in the prior art, such as low integration, large signal loss, complex component layout and difficult system calibration, have been effectively solved. The significant technological progress enables the RF receiving front-end module to show excellent performance in complex ultra-wideband applications and has broad application prospects.

[0067] like Figure 1 As shown, an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC provided by an embodiment of the present invention includes the following steps: A three-dimensional package for signal transmission, the three-dimensional package includes a BGA layer 1, a package internal signal transmission layer 2, a top microstrip wiring 3, and a device placement layer 4.

[0068] A package internal signal transmission layer 2 is arranged above the BGA layer 1 ; a top microstrip wiring 3 is arranged above the package internal signal transmission layer 2 ; and a device placement layer 4 is arranged above the top microstrip wiring 3 .

[0069] In the BGA layer provided in the embodiment of the present invention, relevant functions of BGA are defined and allocated, including input and output of radio frequency signals; calibration signal input and attenuation control bit definition.

[0070] The internal signal transmission layer of the package provided in the embodiment of the present invention includes a radio frequency layer and a power supply layer, which are used for transmission of radio frequency signals and transmission and distribution of power supply signals.

[0071] The top-level design provided by the embodiment of the present invention includes a microstrip line layout, a device placement area, and a pad for gold wire bonding to transmit signals.

[0072] The HTCC-based ultra-wideband RF receiving front-end SIP module system in the embodiment of the present invention integrates the transmission, processing and output of RF signals into a compact module through three-dimensional packaging technology, aiming to improve the performance, integration and reliability of the RF receiving front-end.

[0073] 1. Three-dimensional packaging structure and signal transmission.

[0074] First, the three-dimensional package structure consists of BGA layer 1, package internal signal transmission layer 2, top microstrip wiring 3 and device placement layer 4. BGA layer 1 is located at the bottom and is mainly used for the input and output of RF signals, the input of calibration signals and the definition of attenuation control bits. Package internal signal transmission layer 2 is located above BGA layer 1 and is responsible for the transmission and distribution of RF signals and power signals. Through this layer, the RF signal is transmitted from the input port to each functional module in the package to ensure efficient signal transmission.

[0075] 2. Encapsulate the functions of the internal signal transmission layer.

[0076] The RF layer and the power layer are designed in the signal transmission layer 2 inside the package, which are used for the transmission of RF signals and power signals respectively. The RF layer is responsible for guiding the RF signal from the input end to each device in the module while maintaining the integrity and high-frequency performance of the signal. The power layer is used for the transmission and distribution of the power signal to ensure that each functional module obtains stable power support. This design realizes the separation and optimization of RF signals and power signals in the package, reducing the interference between them.

[0077] 3. Top microstrip routing and device placement.

[0078] The top microstrip wiring 3 is located above the signal transmission layer 2 inside the package, and is mainly used to layout the microstrip line and signal transmission path. Microstrip line is a high-frequency transmission line used to transmit signals between different RF modules. Through reasonable microstrip line layout, the signal can be efficiently transmitted to each functional device on the device placement layer 4. The device placement layer 4 provides a stable platform for placing key RF components such as amplifiers, filters, attenuators, etc. These components are connected by microstrip lines and gold wire bonding pads to ensure accurate transmission and processing of signals.

[0079] 4. Signal processing and calibration.

[0080] During the signal processing, the RF signal enters the package through the BGA layer 1 and is transmitted and processed in the signal transmission layer 2 inside the package. The top microstrip wiring 3 further guides the signal to the various RF components on the device placement layer 4 for amplification, filtering or attenuation. The processed signal is transmitted back to the BGA layer 1 through the signal transmission layer 2 inside the package and output. During the calibration process, the system can introduce the calibration signal into the package through the calibration signal input port of the BGA layer 1 for calibration operation to ensure the accuracy of signal transmission and the stability of the system. The overall design achieves efficient RF signal processing and transmission through a multi-layer structure and optimized layout, meeting the performance requirements of the ultra-wideband receiving front-end module.

[0081] like Figure 3As shown, an embodiment of the present invention provides a method for controlling an ultra-wideband radio frequency receiving front-end SIP module system based on HTCC, including: S101, defining and allocating related functions of BGA in the BGA layer, including input and output of radio frequency signals, calibration signal input, and attenuation control bit definition.

[0082] S102, the internal signal transmission layer of the package includes a radio frequency layer and a power layer, which are used for transmission of radio frequency signals and transmission and distribution of power signals.

[0083] S103, the top-level design includes the microstrip line layout, the device placement area, and the pads for gold wire bonding to transmit signals.

[0084] Another object of the present invention is to provide a computer device, the computer device comprising a memory and a processor, the memory storing a computer program, and when the computer program is executed by the processor, the processor executes the steps of the HTCC-based ultra-wideband RF receiving front-end SIP module system control method.

[0085] Another object of the present invention is to provide a computer-readable storage medium storing a computer program, which, when executed by a processor, enables the processor to execute the steps of the HTCC-based ultra-wideband RF receiving front-end SIP module system control method.

[0086] Another object of the present invention is to provide an information data processing terminal, wherein the information data processing terminal is used to implement the HTCC-based ultra-wideband radio frequency receiving front-end SIP module system.

[0087] The present invention is specifically implemented: Figure 4 It is a SIP transmission structure diagram provided by an embodiment of the present invention, showing in detail the bottom layer, RF layer, power layer routing and top layout wiring diagram.

[0088] Figure 6 , Figure 7 , Figure 8 , Fig. 9 It is the simulation result of the SIP structure provided by the embodiment of the present invention, including the insertion loss and return loss result diagram.

[0089] The ultra-wideband RF receiving front-end passive transmission structure of the present invention can effectively transmit RF signals within 2-10GHz. The signal is input from the BGA solder ball on the bottom pad and transmitted to the top microstrip line through the structure. Good signal transmission effect can be achieved. Different RF devices can be integrated by changing the top layout through designing the routing, thereby realizing different system functions.

[0090] In order to achieve efficient and stable RF signal transmission, the present invention proposes a detailed implementation method, which uses BGA balls at the bottom of the substrate to introduce RF signals, uses a quasi-coaxial structure to transmit signals vertically, and uses strip lines and microstrip lines to transmit signals horizontally. The following are the detailed steps of the implementation method: 1.BGA is used on the bottom for signal transmission.

[0091] BGA solder balls, or solder balls in Ball Grid Array packages, are tiny metal balls used to connect chips to pads on printed circuit boards (PCBs), usually made of tin alloys. These solder balls are arranged in a regular grid, and each solder ball is connected to a pin on the chip, which is an important part of the BGA package. One of the main features of the BGA package is these solder balls, which enable the package to have a higher pin density, a smaller package size, better heat dissipation performance, and better electrical signal transmission characteristics.

[0092] In this design, different functions of BGA at different positions on the bottom are defined according to the layout of the transmission line and the system function. Specifically, they include: RF input, RF output, calibration, power supply, RF selection and attenuation control, etc. By defining BGA, the corresponding functions are accurately implemented during system operation.

[0093] 2. Transmission line design.

[0094] After the RF signal is introduced from the BGA, it is transmitted vertically through the quasi-coaxial line and horizontally through the stripline and microstrip line. Therefore, the design of the transmission line is crucial to the quality of signal transmission. The quasi-coaxial structure consists of a vertical transmission via in the middle and surrounding ground isolation vias. The transmission mode of the microstrip line is the quasi-TEM mode, and the main transmission mode of the quasi-coaxial and stripline is the TEM mode, both of which can complete the transmission of electromagnetic signals. By impedance matching the transmission line, adjusting the pad size, and introducing ground holes around the transmission line, the discontinuity of the signal and the resulting parasitic effects can be reduced to achieve good transmission performance.

[0095] 3. Link function realization.

[0096] The design integrates a series of RF devices, including limiters, switches, filters, low-noise amplifiers, etc. After actual testing, it can realize functions such as filtering, amplification, and attenuation control.

[0097] 4. Power distribution and management.

[0098] For the integrated chips that need power supply, the structure is designed with multi-layer power supply lines to distribute the power supply and ensure that the chips at different positions can work normally within the operating voltage.

[0099] 5. Microassembly technology.

[0100] Micro-assembly technology is an advanced electronic assembly technology that integrates key process technologies such as high-density interconnection substrate technology, multi-chip module technology, system / subsystem assembly technology, and 3D assembly technology. This technology interconnects bare integrated circuit chips, thin / thick film hybrid circuits, and micro-small surface mount components at high density to form high-density, multi-functional modular electronic products with three-dimensional structures.

[0101] Due to the small size and high integration of this product, the integrated chip needs to be attached through micro-assembly technology to ensure that the chip can be assembled in a predetermined position, so as to better complete the system function.

[0102] 6. Flexible fixture testing.

[0103] The design can be tested with a dedicated fixture, with the top pin at the bottom of the fixture corresponding to the BGA pad, and an external test board can control the relevant functions of the link.

[0104] Through the above implementation method, the SIP module of the present invention integrates RF devices such as limiters, RF switches, filters, low noise amplifiers, digitally controlled attenuators, etc., and can achieve functions such as filtering, amplification, and attenuation control through programmable control. At the same time, through the design of the transmission lines and power lines inside the substrate, good signal transmission can be achieved while ensuring normal power supply.

[0105] An ultra-wideband SIP radio frequency front-end module includes a quasi-coaxial transmission structure and a stripline and microstrip line structure.

[0106] The layout of the power supply line of the ultra-wideband SIP RF front-end module and the power supply port of the top power supply.

[0107] The ultra-wideband SIP RF front-end module includes the layout and routing of the top device placement.

[0108] An ultra-wideband SIP module design based on HTCC integrates multiple RF chips with different functions, which can realize functions such as filtering, amplification, and attenuation control.

[0109] In order to prove the creativity and technical value of the technical solution of the present invention, this section provides application examples of the claimed technical solution on specific products or related technologies.

[0110] The embodiments of the present invention have achieved some positive effects during the development or use process, and indeed have great advantages over the prior art. The following content is described in conjunction with data, charts, etc. of the test process.

[0111] Through simulation and actual measurement, the present invention can achieve an insertion loss of less than 2.8dB and a port standing wave ratio of less than 1.7 in the 2-10GHz frequency band. After adding the device for link testing, the gain flatness is less than 2dB and the port standing wave ratio is less than 2.5. It can realize functions such as filtering, amplification, and attenuation control.

[0112] The present invention provides an ultra-wideband receiving front end that can improve the traditional problems of large volume and link redundancy. Through reasonable design, it can be used as a standardized and universal module, suitable for all non-full-band receiving needs, and is also widely used in miniaturized and ultra-wideband electronic reconnaissance receiving systems.

[0113] The measured results are as follows Figure 6 , Figure 7 As shown, the module test results are as follows Figure 8 As shown, within 2-10GHz, the insertion loss is less than 2.8dB and the standing wave ratio is less than 2.

[0114] It should be noted that the embodiments of the present invention can be implemented by hardware, software, or a combination of software and hardware. The hardware part can be implemented using dedicated logic; the software part can be stored in a memory and executed by an appropriate instruction execution system, such as a microprocessor or dedicated design hardware. It can be understood by a person of ordinary skill in the art that the above-mentioned devices and methods can be implemented using computer executable instructions and / or contained in a processor control code, such as a carrier medium such as a disk, CD or DVD-ROM, a programmable memory such as a read-only memory (firmware), or a data carrier such as an optical or electronic signal carrier. Such code is provided on the carrier medium. The device and its modules of the present invention can be implemented by hardware circuits such as very large-scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, etc., or programmable hardware devices such as field programmable gate arrays, programmable logic devices, etc., can also be implemented by software executed by various types of processors, and can also be implemented by a combination of the above-mentioned hardware circuits and software, such as firmware.

[0115] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with the technical field within the technical scope disclosed by the present invention and within the spirit and principle of the present invention should be covered by the protection scope of the present invention.

Claims

1. An ultra-wideband RF receiving front-end SIP module system based on HTCC, characterized in that: include: A three-dimensional package for signal transmission, the three-dimensional package includes a BGA layer, an internal signal transmission layer, a top microstrip wiring, and a device placement layer; A package internal signal transmission layer is arranged above the BGA layer; a top microstrip wiring is arranged above the package internal signal transmission layer; A device placement layer is set above the top microstrip wiring.

2. The HTCC-based ultra-wideband RF receiving front-end SIP module system as claimed in claim 1, characterized in that: The BGA layer defines and allocates related functions of the BGA, including input and output of radio frequency signals, calibration signal input, and attenuation control bit definition.

3. The HTCC-based ultra-wideband RF receiving front-end SIP module system as claimed in claim 1, characterized in that: The signal transmission layer inside the package includes a radio frequency layer and a power supply layer, which are used for transmission of radio frequency signals and transmission and distribution of power supply signals.

4. The HTCC-based ultra-wideband RF receiving front-end SIP module system as claimed in claim 1, characterized in that: The top-level design includes a microstrip line layout, a device placement area, and pads for gold wire bonding to transmit signals.

5. A signal transmission method of an ultra-wideband radio frequency receiving front-end SIP module based on HTCC, characterized in that: The following steps are involved: Define the input, output, calibration signal input and attenuation control bits of the RF signal in the BGA layer, and input the RF signal through the BGA layer; Transmitting RF signals from the BGA layer to the signal transmission layer inside the package, transmitting RF signals through the RF layer of the signal transmission layer inside the package, and transmitting and distributing power signals through the power layer; The RF signal is guided to the device placement layer through the top microstrip wiring, and the signal is amplified, filtered or attenuated on the device placement layer.

6. The signal transmission method according to claim 5, characterized in that: The signal transmission method further comprises: The RF layer and the power layer are designed separately in the signal transmission layer inside the package. The RF layer is used for the transmission of RF signals, and the power layer is used for the transmission and distribution of power signals, thereby realizing the separate transmission of RF signals and power signals and reducing signal interference.

7. The signal transmission method according to claim 5, characterized in that: The signal transmission method further comprises: The microstrip lines are rationally laid out in the top microstrip wiring so that the RF signals can be efficiently transmitted to the various RF components on the device placement layer through the microstrip lines, and the RF components are connected through gold wire bonding pads to ensure high-frequency transmission and processing of the signals.

8. The signal transmission method according to claim 5, characterized in that: The signal transmission method further includes a calibration step, specifically comprising: The calibration signal is introduced into the package through the calibration signal input port of the BGA layer to perform precise calibration of the RF signal, ensuring the accuracy of RF signal transmission and the stability of the system.

Images