Structure capable of solving problem of poor binding force between inorganic substrate and metal circuit and manufacturing method thereof

Abstract

The invention discloses a structure capable of solving the problem of poor binding force between an inorganic substrate and a metal circuit, which comprises an inorganic substrate, the inorganic substrate comprises a first surface and a second surface which are oppositely arranged, and a first resin-coated copper foil layer and a second resin-coated copper foil layer are respectively laminated on the first surface and the second surface of the inorganic substrate. Forming a base material with resin-coated copper foil layers on two sides; circuit manufacturing can be carried out on the first resin-coated copper foil layer and the second resin-coated copper foil layer; the first resin-coated copper foil layer is provided with a first hole site, the second resin-coated copper foil layer is provided with a second hole site, the inorganic substrate is provided with a third hole site, and the third hole site is in conduction connection with the first hole site and the second hole site. The first resin-coated copper foil layer and the second resin-coated copper foil layer are laminated on the inorganic substrate and then the circuit is manufactured, so that the binding force between the substrate and the circuit can be improved, and the reliability of the substrate and the circuit is improved. The manufacturing method of the structure can be used for large-scale production, the production cost can be effectively reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a structure and a manufacturing method thereof for solving the problem of poor bonding between an inorganic substrate and a metal circuit. Background Art

[0002] Inorganic substrates have unique advantages in semiconductor packaging. As inorganic substrates are used more and more widely in semiconductor packaging, the demand for substrate production is also increasing. Inorganic substrates are generally used in the substrate industry to produce metal circuits by seed layer sputtering. However, due to the material characteristics of inorganic substrates, there is a problem of poor bonding between the inorganic material of the substrate and the metal. Therefore, the poor bonding between the inorganic substrate itself and the metal circuit may cause the metal circuit to easily fall off or break from the inorganic substrate when subjected to external force or temperature changes. In addition, the metal circuit with a loose bond may increase resistance at the contact point. At the same time, the signal will also be attenuated due to poor contact during transmission, so there is a reliability problem.

[0003] Therefore, it is necessary to solve the problem of poor bonding between the inorganic substrate itself and the metal in order to improve the reliability of the metal circuit of the inorganic substrate. Summary of the invention

[0004] The main purpose of the present invention is to provide a structure for solving the problem of poor bonding between an inorganic substrate and a metal circuit, aiming to improve the bonding between the inorganic substrate and the metal circuit and solve the problem of poor reliability.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit includes an inorganic substrate, the inorganic substrate includes a first surface and a second surface that are arranged opposite to each other, and a first resin-coated copper foil layer and a second resin-coated copper foil layer are pressed on the first surface and the second surface of the inorganic substrate respectively to form a substrate having resin-coated copper foil layers on both sides;

[0007] Circuits can be made on the first resin-coated copper foil layer and the second resin-coated copper foil layer;

[0008] The first resin-coated copper foil layer is provided with a first hole position, the second resin-coated copper foil layer is provided with a second hole position, the inorganic substrate is provided with a third hole position between the first hole position and the second hole position, and the third hole position is conductively connected with the first hole position and the second hole position.

[0009] Preferably, the first resin-coated copper foil layer comprises a first resin layer and a first ultra-thin copper foil, the first resin layer is connected to the first surface, and the first ultra-thin copper foil is arranged on a side of the first resin layer away from the first surface;

[0010] The second resin-coated copper foil layer comprises a second resin layer and a second ultra-thin copper foil, the second resin layer is connected to the second surface, and the second ultra-thin copper foil is arranged on a side of the second resin layer away from the second surface;

[0011] A first circuit is arranged on the surface of the first ultra-thin copper foil, and a second circuit is arranged on the surface of the second ultra-thin copper foil.

[0012] Preferably, the first resin layer and the second resin layer have the same thickness, and the thickness is 20-40 μm, and the first ultra-thin copper foil and the second ultra-thin copper foil have a thickness of 2 μm or 3 μm.

[0013] Preferably, the first hole position is: a first blind hole formed by laser drilling on the first resin-coated copper foil layer and processing to the first surface;

[0014] The second hole position is: a second blind hole formed by laser drilling on the second resin-coated copper foil layer and processing to the second surface.

[0015] Preferably, the third hole position is: a first through hole formed on the first surface and the second surface of the inorganic substrate by chemical etching.

[0016] Preferably, the first resin layer and the second resin layer are made of resin materials with high light absorbance.

[0017] The present invention also provides a method for manufacturing a structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit, comprising at least the following steps:

[0018] Step S1, providing an inorganic substrate, wherein the inorganic substrate comprises a first surface and a second surface which are disposed opposite to each other at an upper and a lower position;

[0019] Step S2, covering the first surface and the second surface of the inorganic substrate with a first resin-coated copper foil layer and a second resin-coated copper foil layer respectively, and laminating the first resin-coated copper foil layer and the second resin-coated copper foil layer to the inorganic substrate through a lamination process to obtain a substrate having resin-coated copper foil layers on both sides;

[0020] Step S3, laser drilling is performed on the first resin-coated copper foil layer and the second resin-coated copper foil layer respectively, and the first resin-coated copper foil layer is processed to the first surface to obtain a first blind hole, and the second resin-coated copper foil layer is processed to the second surface to obtain a second blind hole;

[0021] Step S4, after laser drilling, pre-treating the first surface exposed in the first blind hole and the second surface exposed in the second blind hole to facilitate etching of the exposed first surface and the exposed second surface;

[0022] Step S5, etching the exposed positions of the first surface and the second surface of the inorganic substrate by chemical etching to obtain a first through hole connected to the first blind hole and the second blind hole.

[0023] Preferably, in step S2, the first resin-coated copper foil layer is formed by combining a first resin layer and a first ultra-thin copper foil by hot pressing and curing, and the second resin-coated copper foil layer is formed by combining a second resin layer and a second ultra-thin copper foil by hot pressing and curing.

[0024] Preferably, in step S4, the first surface exposed in the first blind hole and the second surface exposed in the second blind hole are pretreated by activating the exposed first surface and the second surface, and the activation treatment includes cleaning, degreasing and roughening to improve the activity of the first surface and the second surface.

[0025] Preferably, the method further includes step S6: using the MSAP process on the first ultra-thin copper foil and the second ultra-thin copper foil to manufacture the first circuit and the second circuit.

[0026] The technical solution provided by the present invention has the beneficial effect that: in this structure, the first surface and the second surface of the inorganic substrate are respectively laminated with a first resin-coated copper foil layer and a second resin-coated copper foil layer. Compared with the direct combination of the inorganic substrate and the metal material, the first resin-coated copper foil layer, the second resin-coated copper foil layer and the inorganic substrate have better bonding strength, and the first circuit and the second circuit can be directly formed on the first resin-coated copper foil layer and the second resin-coated copper foil layer. Therefore, using the first resin-coated copper foil layer and the second resin-coated copper foil layer to laminate on the inorganic substrate and then perform circuit production can effectively improve the bonding strength between the substrate and the circuit, and can improve the reliability of the substrate and the circuit.

[0027] The present invention provides a method for manufacturing a structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit. The process is short and the steps are few. The pressing and laser drilling processes of the substrate industry are used, and large-scale production can be carried out, which can effectively reduce production costs and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0029] Figure 1 A schematic cross-sectional view of a structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit according to an embodiment of the present invention;

[0030] Figure 2 A flowchart of a structure for solving the problem of poor bonding between an inorganic substrate and a metal circuit according to an embodiment of the present invention;

[0031] Figure 3 is a schematic cross-sectional view of an inorganic substrate according to an embodiment of the present invention;

[0032] Figure 4 It is a cross-sectional schematic diagram of a first resin-coated copper foil layer and a second resin-coated copper foil layer according to an embodiment of the present invention;

[0033] Figure 5 It is a cross-sectional schematic diagram of an inorganic substrate laminated with a first resin-coated copper foil layer and a second resin-coated copper foil layer according to an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of laser drilling on the first resin-coated copper foil layer and the second resin-coated copper foil layer according to an embodiment of the present invention;

[0035] Figure 7 A cross-sectional schematic diagram of an inorganic substrate in an embodiment of the present invention, wherein the first surface and the second surface are exposed and pre-treated;

[0036] Figure 8 It is a cross-sectional schematic diagram of manufacturing a first circuit and a second circuit on a first resin-coated copper foil layer and a second resin-coated copper foil layer according to an embodiment of the present invention.

[0037] Figure numerals: inorganic substrate 100, first surface 110, second surface 120, third hole position 130, first through hole 131, first resin-coated copper foil layer 200, first hole position 210, first blind hole 211, first resin layer 220, first ultra-thin copper foil 230, second resin-coated copper foil layer 300, second hole position 310, second blind hole 311, second resin layer 320, second ultra-thin copper foil 330, first circuit 400, second circuit 500. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for illustrative purposes. In the description of the present invention, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; the meaning of "multiple" is two or more. The term "include" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may be present or added.

[0039] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0040] Reference Figure 1 The structure of the embodiment of the present invention that can solve the problem of poor bonding strength between an inorganic substrate and a metal circuit includes an inorganic substrate 100, wherein the inorganic substrate 100 includes a first surface 110 and a second surface 120 that are arranged opposite to each other, and the inorganic substrate 100 has a first resin-coated copper foil layer 200 and a second resin-coated copper foil layer 300 pressed on the first surface 110 and the second surface 120, respectively, to form a substrate having resin-coated copper foil layers on both sides;

[0041] Circuits can be fabricated on the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300;

[0042] The first resin-coated copper foil layer 200 is provided with a first hole position 210 , the second resin-coated copper foil layer 300 is provided with a second hole position 310 , and the inorganic substrate 100 is provided with a third hole position 130 between the first hole position 210 and the second hole position 310 , and the third hole position 130 is conductively connected to the first hole position 210 and the second hole position 310 .

[0043] In the structure of the present embodiment, the first surface 110 and the second surface 120 of the inorganic substrate 100 are respectively laminated with a first resin-coated copper foil layer 200 and a second resin-coated copper foil layer 300. Compared with the direct bonding of the inorganic substrate 100 with the metal material, the first resin-coated copper foil layer 200, the second resin-coated copper foil layer 300 and the inorganic substrate 100 have better bonding strength, and the metal circuit can be directly formed on the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300. Therefore, laminating the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300 on the inorganic substrate 100 and then producing the metal circuit can effectively improve the bonding strength of the metal circuit and improve the reliability of the inorganic substrate 100 and the metal circuit.

[0044] In this embodiment, the first resin-coated copper foil layer 200 includes a first resin layer 220 and a first ultra-thin copper foil 230, the first resin layer 220 is connected to the first surface 110, and the first ultra-thin copper foil 230 is arranged on a side of the first resin layer 220 away from the first surface 110;

[0045] The second resin-coated copper foil layer 300 includes a second resin layer 320 and a second ultra-thin copper foil 330 , wherein the second resin layer 320 is connected to the second surface 120 , and the second ultra-thin copper foil 330 is disposed on a side of the second resin layer 320 away from the second surface 120 ;

[0046] A first circuit 400 is disposed on the surface of the first ultra-thin copper foil 230 , and a second circuit 500 is disposed on the surface of the second ultra-thin copper foil.

[0047] The first resin layer 220 of the first resin coated copper foil layer 200 and the second resin layer 320 of the second resin coated copper foil layer 300 are respectively connected to the first surface 110 and the second surface 120 of the inorganic substrate 100, the first ultra-thin copper foil 230 of the first resin coated copper foil layer 200 is arranged on the side of the first resin layer 220 away from the first surface 110, and the second ultra-thin copper foil 330 of the second resin coated copper foil layer 300 is arranged on the side of the second resin layer 320 away from the second surface 120, and circuits are produced on the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330.

[0048] Therefore, such an arrangement allows circuit production to be performed directly on the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 without copper coating on the inorganic substrate 100, and the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 are respectively connected to the first surface 110 and the second surface 120 of the inorganic substrate 100 through the first resin layer 220 and the second resin layer 320, so that the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 used for circuit production have good bonding with the inorganic substrate 100, thereby improving the reliability of the inorganic substrate 100 and the metal circuit.

[0049] In this embodiment, the first resin layer 220 and the second resin layer 320 are made of the same material and have the same thickness. The material is preferably PP or ABF, and the thickness is preferably 20-40 μm. The first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 are 2 μm or 3 μm thick.

[0050] Ultra-thin copper foil has extremely high conductivity and lower resistivity than traditional conductive materials. It can effectively reduce the resistance of signal transmission in the circuit and improve the overall performance.

[0051] In addition, ultra-thin copper foil is lightweight while maintaining high strength, which contributes to lightweight design.

[0052] In addition, the thinner the ultra-thin copper foil is, the less copper is needed in its production, which can reduce production costs.

[0053] The first resin layer 220 and the second resin layer 320 have the same thickness of 20-40 μm. After being combined with the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 respectively, the whole has sufficient insulation performance and structural strength.

[0054] In this embodiment, the first hole position 210 is: a first blind hole 211 formed by laser drilling on the first resin-coated copper foil layer 200 and processing to the first surface 110;

[0055] The second hole position 310 is a second blind hole 311 formed by laser drilling on the second resin-coated copper foil layer 300 and processing to the second surface 120 .

[0056] The third hole position 130 is a first through hole 131 formed on the first surface 110 and the second surface 120 of the inorganic substrate 100 by chemical etching.

[0057] The first surface 110 and the second surface 120 exposed in the first blind hole 211 and the second blind hole 311 are chemically etched to form the first through hole 131. Therefore, the first blind hole 211 and the second blind hole 311 have the function of defining the position, shape and aperture size of the first through hole 131.

[0058] Preferably, chemical etching is performed simultaneously on the exposed first surface 110 and the second surface 120 , which can ensure uniform etching to form the first through hole 131 , and can significantly reduce etching time and cost, thereby improving production efficiency.

[0059] In this embodiment, the first resin layer 220 and the second resin layer 320 are made of resin materials with high light absorption.

[0060] The first resin layer 220 and the second resin layer 320 made of a resin material with high absorbance have good light absorption properties, so that during the laser drilling process, the laser beam can be more effectively absorbed by the first resin layer 220 and the second resin layer 320, thereby converting it into heat energy, promoting its melting to form the first hole position 210 and the second hole position 310.

[0061] In this embodiment, the first resin layer 220 and the second resin layer 320 are preferably made of black polypropylene (PP) material. The black polypropylene (PP) material has high absorbance, so that the laser beam is effectively absorbed by the first resin layer 220 and the second resin layer 320, facilitating the molding of the first hole position 210 and the second hole position 310.

[0062] In this embodiment, the inorganic substrate 100 is made of glass material or ceramic material.

[0063] The inorganic substrate 100 made of glass material has low production cost, and the inorganic substrate 100 made of glass material has low dielectric loss, allowing clearer signal and power transmission, reducing power loss, and improving overall efficiency.

[0064] The inorganic substrate 100 made of ceramic material has high mechanical strength and shape stability, can withstand certain external pressure and deformation, and has excellent insulation performance. The ceramic substrate can effectively isolate the current and voltage in the circuit and prevent the occurrence of faults such as current leakage and short circuit, making the inorganic substrate 100 made of ceramic material highly reliable.

[0065] The present invention also provides a preparation method of the above embodiment. The specific process of the method is as follows Figure 2 , and combined with Figure 1 as well as Figure 3 to Figure 8 The specific instructions include the following steps:

[0066] Step S1, providing an inorganic substrate 100, wherein the inorganic substrate 100 comprises a first surface 110 and a second surface 120 which are disposed opposite to each other at the upper and lower sides;

[0067] Step S2, covering the first surface 110 and the second surface 120 of the inorganic substrate 100 with the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300 respectively, and laminating the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300 to the inorganic substrate 100 through a lamination process to obtain a substrate having resin-coated copper foil layers on both sides;

[0068] Step S3, laser drilling is performed on the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300 respectively, and the first resin-coated copper foil layer 200 is processed to the first surface 110 to obtain the first blind hole 211, and the second resin-coated copper foil layer 300 is processed to the second surface 120 to obtain the second blind hole 311;

[0069] Step S4, after laser drilling, pre-treating the first surface 110 exposed in the first blind hole 211 and the second surface 120 exposed in the second blind hole 311, so as to facilitate etching of the exposed first surface 110 and the second surface 120;

[0070] Step S5 , etching the exposed positions of the first surface 110 and the second surface 120 of the inorganic substrate 100 by chemical etching to obtain the first through hole 131 communicating with the first blind hole 211 and the second blind hole 311 .

[0071] Specifically, in step S2, the first resin-coated copper foil layer 200 is formed by combining the first resin layer 220 and the first ultra-thin copper foil 230 through hot pressing and curing, and the second resin-coated copper foil layer 300 is formed by combining the second resin layer 320 and the second ultra-thin copper foil 330 through hot pressing and curing.

[0072] Preferably, the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 are made by an electrolytic copper process.

[0073] In step S4, the first surface 110 exposed in the first blind hole 211 and the second surface 120 exposed in the second blind hole 311 are pre-treated by activating the exposed first surface 110 and the second surface 120. The activation treatment includes cleaning, degreasing and roughening to improve the activity of the first surface 110 and the second surface 120.

[0074] Since the first surface 110 and the second surface 120 may contain pollutants or other substances that are not conducive to etching, these substances may affect the penetration and reaction rate of the etching solution, thereby reducing the etching effect; and activating the exposed first surface 110 and the second surface 120 can remove the substances that are not conducive to etching, increase the activity of the first surface 110 and the second surface 120 and the contact area of ​​the etching solution, thereby improving the etching effect.

[0075] The manufacturing method of this embodiment further includes step S6: using the MSAP process to manufacture the first circuit 400 and the second circuit 500 on the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330; the specific processing process is as follows:

[0076] First, a layer of dry film photoresist is coated on the surface of the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330, and the circuit pattern is transferred to the dry film photoresist through ultraviolet exposure and development;

[0077] Next, copper is electroplated in the developed dry film photoresist pattern to form the desired conductive circuit;

[0078] The remaining dry film photoresist is stripped off by a chemical method to expose the areas on the surfaces of the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 that are not covered by the electroplated copper;

[0079] Then, the connected first hole 210, the second hole 310 and the third hole 130 are subjected to hole metallization treatment: a conductive material is deposited on the hole walls of the first hole 210, the second hole 310 and the third hole 130, so that the first hole 210, the second hole 310 and the third hole 130 form connected metallized holes;

[0080] It should be noted that the conductive material deposited on the hole walls of the first hole position 210, the second hole position 310 and the third hole position 130 of this embodiment is preferably copper;

[0081] After the metallization treatment is completed, the surfaces of the first ultra-thin copper foil 230 and the second ultra-thin copper foil 330 are chemically etched to remove the areas not covered by the electroplated copper, thereby obtaining the first circuit 400 and the second circuit 500 .

[0082] In the present embodiment, two methods are used to form holes in the overall structure, namely laser drilling and chemical etching. Specifically, laser drilling is first performed on the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300, and the drilling is performed to the first surface 110 and the second surface 120 of the inorganic substrate 100 to form a first blind hole 211 and a second blind hole 311; then, the first surface 110 exposed in the first blind hole 211 and the second surface 120 exposed in the second blind hole 311 are pretreated; after the pretreatment is completed, the exposed positions of the first surface 110 and the second surface 120 are etched by chemical etching to obtain a first through hole 131.

[0083] The first hole position 210 and the second hole position 310 of the first resin-coated copper foil layer 200 and the second resin-coated copper foil layer 300 are formed by laser drilling: the first resin layer 220 and the second resin layer 320 are made of resin materials with high absorbance, and thus have good light absorption, so that the laser beam is more effectively absorbed by the first resin layer 220 and the second resin layer 320, so as to facilitate the formation of the first hole position 210 and the second hole position 310;

[0084] In addition, the resin material has low thermal conductivity, which allows the laser beam to quickly heat and penetrate the surface of the first resin layer 220 and the second resin layer 320 when irradiated, and the heat will not be excessively conducted to the surrounding area, which is beneficial to maintaining the accuracy and shape of the first hole 210 and the second hole 310.

[0085] The material of the inorganic substrate 100 generally has high hardness and brittleness, which requires higher energy density and processing time for penetration during the drilling process, and high energy density may increase the risk of cracks and breakage, and increase processing costs and time;

[0086] During the laser drilling process, the material will be heated by the laser energy to form a heat-affected zone. For the inorganic substrate 100 made of ceramic or glass materials, the thermal conductivity is low and the heat-affected zone is relatively large, which may cause changes or damage to the material properties.

[0087] In addition, the inorganic substrate 100 may require additional processing, such as cleaning and deburring, by using laser drilling, and these processing steps will increase the complexity and cost of the production process;

[0088] Therefore, in the present embodiment, the inorganic substrate 100 is formed by chemically etching the exposed positions of the first surface 110 and the second surface 120 to obtain the first through hole 131;

[0089] For the inorganic substrate 100 , its chemical stability and reactivity make the etching process more controllable, so that the first through hole 131 with high precision can be formed;

[0090] Furthermore, the surface of the first through hole 131 processed by chemical etching is smooth, burr-free and dirt-free, and no cleaning, deburring or other treatment is required, which can improve efficiency and reduce costs, and help improve the reliability of subsequent processes and the quality of finished products;

[0091] In addition, it is preferred to chemically etch the exposed first surface 110 and the exposed second surface 120 simultaneously, which can effectively improve the processing efficiency.

[0092] Therefore, the preparation method of the above-mentioned embodiment provided by the present invention has a compact process and reasonable steps, and uses the pressing process of the substrate industry and a hole-forming method combining laser drilling and chemical etching, which can be mass-produced, can effectively reduce production costs, and improve production efficiency.

[0093] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the above embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit, characterized in that: include: An inorganic substrate (100), the inorganic substrate (100) comprising a first surface (110) and a second surface (120) arranged opposite to each other, the inorganic substrate (100) having a first resin-coated copper foil layer (200) and a second resin-coated copper foil layer (300) laminated on the first surface (110) and the second surface (120) respectively, to form a substrate having resin-coated copper foil layers on both sides; Circuits can be fabricated on the first resin-coated copper foil layer (200) and the second resin-coated copper foil layer (300); The first resin-coated copper foil layer (200) is provided with a first hole position (210), the second resin-coated copper foil layer (300) is provided with a second hole position (310), the inorganic substrate (100) is provided with a third hole position (130) between the first hole position (210) and the second hole position (310), and the third hole position (130) is conductively connected to the first hole position (210) and the second hole position (310).

2. The structure capable of solving the problem of poor bonding between inorganic substrate and metal circuit according to claim 1, characterized in that: The first resin-coated copper foil layer (200) comprises a first resin layer (220) and a first ultra-thin copper foil (230), the first resin layer (220) is connected to the first surface (110), and the first ultra-thin copper foil (230) is arranged on a side of the first resin layer (220) away from the first surface (110); The second resin-coated copper foil layer (300) comprises a second resin layer (320) and a second ultra-thin copper foil (330), the second resin layer (320) is connected to the second surface (120), and the second ultra-thin copper foil (330) is arranged on a side of the second resin layer (320) away from the second surface (120); A first circuit (400) is arranged on the surface of the first ultra-thin copper foil (230), and a second circuit (500) is arranged on the surface of the second ultra-thin copper foil.

3. The structure capable of solving the problem of poor bonding between inorganic substrate and metal circuit according to claim 2, characterized in that: The first resin layer (220) and the second resin layer (320) have the same thickness, and the thickness is 20-40 μm, and the first ultra-thin copper foil (230) and the second ultra-thin copper foil (330) have a thickness of 2 μm or 3 μm.

4. The structure capable of solving the problem of poor bonding between inorganic substrate and metal circuit according to claim 1, characterized in that: The first hole position (210) is: a first blind hole (211) formed by laser drilling on the first resin-coated copper foil layer (200) and processing to the first surface (110); The second hole position (310) is a second blind hole (311) formed by laser drilling on the second resin-coated copper foil layer (300) and processing to the second surface (120).

5. The structure capable of solving the problem of poor bonding between inorganic substrate and metal circuit according to claim 1, characterized in that: The third hole position (130) is a first through hole (131) formed on the first surface (110) and the second surface (120) of the inorganic substrate (100) by chemical etching.

6. The structure capable of solving the problem of poor bonding between inorganic substrate and metal circuit according to claim 2, characterized in that: The first resin layer (220) and the second resin layer (320) are made of resin materials with high light absorbance.

7. A method for manufacturing a structure that can solve the problem of poor bonding between an inorganic substrate and a metal circuit, characterized in that: At least the following steps are included: Step S1, providing an inorganic substrate (100), wherein the inorganic substrate (100) comprises a first surface (110) and a second surface (120) which are arranged opposite to each other at an upper and a lower position; Step S2, covering the first surface (110) and the second surface (120) of the inorganic substrate (100) with a first resin-coated copper foil layer (200) and a second resin-coated copper foil layer (300), respectively, and laminating the first resin-coated copper foil layer (200) and the second resin-coated copper foil layer (300) to the inorganic substrate (100) through a lamination process, so as to obtain a substrate having resin-coated copper foil layers on both sides; Step S3, laser drilling is performed on the first resin-coated copper foil layer (200) and the second resin-coated copper foil layer (300) respectively, and the first resin-coated copper foil layer (200) is processed to the first surface (110) to obtain a first blind hole (211); and the second resin-coated copper foil layer (300) is processed to the second surface (120) to obtain a second blind hole (311); Step S4, after laser drilling, pre-treating the first surface (110) exposed in the first blind hole (211) and the second surface (120) exposed in the second blind hole (311) to facilitate etching of the exposed first surface (110) and the second surface (120); Step S5, etching the exposed positions of the first surface (110) and the second surface (120) of the inorganic substrate (100) by chemical etching to obtain a first through hole (131) connected to the first blind hole (211) and the second blind hole (311).

8. The method for manufacturing a structure capable of solving the problem of poor bonding between an inorganic substrate and a metal circuit according to claim 7, characterized in that: In step S2, the first resin-coated copper foil layer (200) is formed by combining a first resin layer (220) and a first ultra-thin copper foil (230) by hot pressing and curing, and the second resin-coated copper foil layer (300) is formed by combining a second resin layer (320) and a second ultra-thin copper foil (330) by hot pressing and curing.

9. The method for manufacturing a structure capable of solving the problem of poor bonding between an inorganic substrate and a metal circuit according to claim 7, characterized in that: In step S4, the first surface (110) exposed in the first blind hole (211) and the second surface (120) exposed in the second blind hole (311) are pre-treated by activating the exposed first surface (110) and the second surface (120), wherein the activation treatment includes cleaning, degreasing and roughening to improve the activity of the first surface (110) and the second surface (120).

10. The method for manufacturing a structure capable of solving the problem of poor bonding between an inorganic substrate and a metal circuit according to claim 8, characterized in that: The method further comprises step S6: using the MSAP process on the first ultra-thin copper foil (230) and the second ultra-thin copper foil (330) to manufacture the first circuit (400) and the second circuit (500).

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