Preparation method of conductive pattern and conductive pattern

Abstract

The embodiment of the invention provides a preparation method of a conductive pattern. The method comprises the following steps: providing an imprint mold with a first pattern shape on a male mold of the imprint mold, smearing a catalyst colloid on the male mold, forming a first pattern on the surface of the catalyst colloid, contacting the male mold with a substrate for 1 s < = T < = 10 min under the pressure of 1 Mpa < = P < = 5 Mpa, so that the catalyst colloid with the first pattern is transferred to the substrate, and soaking the substrate in the metal plating solution to obtain the conductive pattern. Compared with the traditional photoetching technology, the conductive pattern prepared by the method does not need the complicated steps of photoresist coating, exposure, development and the like, and the transfer printing process of the first pattern can be realized only by applying certain pressure to the first pattern and the substrate. The whole preparation process does not need assistance of a light source and is not limited by the light source. The catalyst colloid only needs to be smeared on the male die and then transferred to the base plate, the using amount of the catalyst colloid is saved, the thickness of the metal coating can be automatically adjusted according to needs, and certain operation flexibility is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of conductive patterns, and in particular to a method for preparing a conductive pattern and a conductive pattern. Background Art

[0002] The traditional methods for preparing conductive patterns mainly include photolithography and nanoimprinting technology. The photolithography process requires copper plating on the substrate to prepare the conductive material, and then applying the resist on the conductive material for exposure, development, etching, and film stripping to prepare the conductive pattern. Nanoimprinting technology requires first applying the resist on the substrate, imprinting with a mold, and then curing with ultraviolet light, then etching the excess resist, and then metal precipitation and demolding to prepare the conductive pattern. The traditional method of preparing conductive patterns has a long process flow, and both require the resist to prepare the conductive pattern with the assistance of a light source, which has certain limitations in use. Summary of the invention

[0003] The present application provides a method for preparing a conductive pattern and a conductive pattern, so as to solve the technical problem that the preparation of the conductive pattern requires the assistance of a light source, resulting in limitations in the preparation of the conductive pattern.

[0004] In the first aspect, an embodiment of the present application provides a method for preparing a conductive pattern, comprising: providing an imprinting mold, the imprinting mold comprising a convex mold, and the convex mold having a first pattern shape. Coating a catalyst colloid on the convex mold so that the surface where the catalyst colloid contacts the convex mold forms a first pattern. Providing a substrate, contacting the convex mold with the substrate for a predetermined time T under a predetermined pressure P, so as to transfer the catalyst colloid with the first pattern to the substrate; wherein 1Mpa≤P≤5Mpa, 1s≤T≤10min. Drying the substrate, immersing the dried substrate in a metal plating solution for chemical plating, so that the surface of the catalyst colloid facing away from the substrate forms a conductive pattern.

[0005] In some embodiments, the catalyst colloid comprises a pressure sensitive adhesive and / or a hot melt adhesive.

[0006] In some embodiments, the pressure-sensitive adhesive includes at least one of a rubber-type pressure-sensitive adhesive, an acrylate-type pressure-sensitive adhesive, or a silicone-type pressure-sensitive adhesive. And / or, the hot-melt adhesive includes at least one of a polyamide-based hot-melt adhesive, a polyurethane-based hot-melt adhesive, a polyester-based hot-melt adhesive, an ethylene-vinyl acetate copolymer-based hot-melt adhesive, or an ethylene-ethyl acrylate copolymer-based hot-melt adhesive.

[0007] In some embodiments, the catalyst colloid includes any one of palladium colloid, nickel colloid or platinum colloid. And / or, the imprint mold includes any one of polydimethylsiloxane, silicon, silicon dioxide or nickel. And / or, the material of the substrate includes any one of silicon, glass, glass fiber board, polyethylene terephthalate, cyclic olefin copolymer or polyimide.

[0008] In some embodiments, it is characterized in that 1.15Mpa≤P≤1.25Mpa, and / or, 8s≤T≤15s.

[0009] In some embodiments, the coating method includes at least one of spraying, brushing, rolling, flow coating or dripping.

[0010] In some embodiments, the metal plating solution includes at least one of a zinc plating solution, a copper plating solution, a nickel plating solution, a chromium plating solution, a gold plating solution, a tin plating solution or a silver plating solution.

[0011] In some embodiments, the substrate is dried and immersed in a metal plating solution for chemical plating so that the catalyst colloid is away from the surface of the substrate to form a conductive pattern, including placing the substrate in a drying device at a temperature of 60°C to 80°C for drying for 30 minutes to 60 minutes, immersing the dried substrate in the metal plating solution for chemical plating for a time of 1 minute to 30 minutes, and washing the chemically plated substrate with water and then placing it in a drying device at a temperature of 80°C to 100°C for drying so that the catalyst colloid is away from the surface of the substrate to form the conductive pattern.

[0012] In some embodiments, the thickness of the conductive pattern is 50 nm to 2 μm.

[0013] In a second aspect, an embodiment of the present application further provides a conductive pattern, which is prepared by using any preparation method as described in the first aspect.

[0014] Different from the related art, the embodiment of the present application provides a method for preparing a conductive pattern. The method includes providing an imprinting mold, the convex mold of the imprinting mold has a first pattern shape, applying a catalyst colloid on the convex mold, forming a first pattern on the surface of the catalyst colloid, contacting the convex mold with the substrate for 1s≤T≤10min under a pressure of 1Mpa≤P≤5Mpa, so that the catalyst colloid with the first pattern is transferred to the substrate, and then the substrate is immersed in a metal plating solution to obtain a conductive pattern. The above process is simple to operate and has a short process flow. Compared with traditional photolithography technology, the conductive pattern prepared in the present application does not require complex steps such as photoresist coating, exposure, and development. It only needs to apply a certain pressure to the first pattern and the substrate base to realize the transfer process of the first pattern. Moreover, the above-mentioned entire preparation process does not require the assistance of a light source and is not limited by the light source. The catalyst colloid only needs to be applied to the convex mold and then transferred to the substrate, saving the amount of catalyst colloid, and the thickness of the metal coating can be adjusted as needed, with certain operational flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0016] Figure 1 It is a schematic diagram of the process of preparing some conductive patterns provided in the embodiments of the present application;

[0017] Figure 2 is a schematic diagram of the structure of some imprinting molds provided in the embodiments of the present application;

[0018] Figure 3 It is a schematic diagram of some convex molds provided in the embodiments of the present application after the catalyst colloid is coated;

[0019] Figure 4 are some schematic diagrams of transferring the catalyst colloid on the convex mold to the substrate provided in the embodiments of the present application;

[0020] Figure 5 is a schematic diagram of some catalyst colloid layers attached to a substrate provided in the embodiments of the present application;

[0021] Figure 6 It is a schematic diagram of forming a metal layer on some catalyst colloid layers provided in the embodiments of the present application. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0023] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "several" and "multiple" is more than two, unless otherwise clearly and specifically defined.

[0024] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0025] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. In addition, the technical features involved in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.

[0026] In the first aspect, the present application provides a method for preparing a conductive pattern, please refer to Figure 1 , Figure 1 It is a schematic diagram of the process of preparing some conductive patterns provided in the embodiments of the present application.

[0027] Step S1: providing an imprinting mold 10 , wherein the imprinting mold comprises a convex mold 11 , and the convex mold 11 has a first pattern shape.

[0028] Please refer to Figure 2The imprinting mold 10 is a tool used to form a specific pattern, texture or shape on the surface of a material. The imprinting mold 10 includes a convex mold 11, and the convex mold 11 has a first pattern shape. The first pattern shape is a left-right mirror image of the conductive pattern to ensure that the pattern imprinted by the imprinting mold 10 is consistent with the desired pattern. For example, a material with an imprinting material (metal sheet, plastic film, etc.) is placed on the convex mold 11, and sufficient pressure is applied by a press or other equipment so that the first pattern shape on the convex mold 11 is imprinted onto the surface of the material. During the imprinting process, the material undergoes plastic deformation, thereby replicating the first pattern shape on the convex mold 11. The imprinting mold 10 is widely used in metal processing, plastic products, jewelry making, etc. The material for preparing the imprinting mold 10 includes any one of polydimethylsiloxane, silicon, silicon dioxide or nickel.

[0029] According to different imprinting methods, the designed imprinting mold 10 is also different. For example, for step-by-step imprinting, a flat imprinting mold can be designed. For roller-type imprinting, a roller-type imprinting mold can be designed.

[0030] Step S2: coating the catalyst colloid on the convex mold 11 so that the surface where the catalyst colloid contacts the convex mold 11 forms a first pattern.

[0031] Please refer to Figure 3 After the catalyst colloid is coated on the convex mold 11, a catalyst colloid layer 20 can be formed on the surface of the convex mold 11. The catalyst colloid is a colloid system formed by dispersing nano-scale catalyst metals in a specific solvent or dispersion medium. The catalyst metal in the catalyst colloid can reduce the activation energy of the chemical plating reaction, reduce the metal ions in the metal plating solution to metal elements, and form a metal coating. For example, the catalyst colloid is palladium colloid, and the metal plating solution is a copper plating solution. The palladium colloid can catalyze the copper ions in the copper plating solution to be reduced to metallic copper on the surface of the substrate to form a metallic copper coating.

[0032] In some embodiments, the catalyst colloid includes any one of palladium colloid, nickel colloid, or platinum colloid.

[0033] In some embodiments, the catalyst colloid includes a pressure-sensitive adhesive and / or a hot-melt adhesive, wherein the pressure-sensitive adhesive and / or the hot-melt adhesive can increase the adhesion between the catalyst colloid and the substrate after subsequent transfer, thereby reducing the possibility of the catalyst colloid falling off.

[0034] Pressure sensitive adhesive is a pressure sensitive adhesive with the characteristics of dry adhesion and permanence. It is very sensitive to pressure during the bonding process, and can be immediately bonded to the adhesive with finger pressure. Add the pressure sensitive adhesive to the catalyst colloid, and after transferring the catalyst colloid to the substrate, apply a certain pressure on the catalyst colloid. The pressure sensitive adhesive in the catalyst colloid can quickly bond to the substrate and play a good fixing role.

[0035] In some embodiments, the pressure-sensitive adhesive includes at least one of a rubber-type pressure-sensitive adhesive, an acrylate-type pressure-sensitive adhesive, or a silicone-type pressure-sensitive adhesive.

[0036] Hot melt adhesive is an adhesive that can melt and become sticky after being heated. After adding the hot melt adhesive to the catalyst colloid, the imprinting mold 10 is placed at a suitable temperature, the hot melt adhesive in the catalyst colloid melts, and then the catalyst colloid is transferred to the substrate and cooled. The hot melt adhesive in the catalyst colloid can be quickly solidified, so that the catalyst colloid is firmly bonded to the substrate, playing a good fixing role.

[0037] In some embodiments, the hot melt adhesive includes at least one of polyamide hot melt adhesive, polyurethane hot melt adhesive, polyester hot melt adhesive, ethylene-vinyl acetate copolymer hot melt adhesive or ethylene-ethyl acrylate copolymer hot melt adhesive.

[0038] Step S3: providing a substrate 30, and contacting the convex mold 11 with the substrate 30 for a predetermined time T under a predetermined pressure P to transfer the catalyst colloid with the first pattern to the substrate 30; wherein 1 MPa≤P≤5 MPa, 1 s≤T≤10 min.

[0039] Please refer to Figure 4 and Figure 5 , the convex mold 11 transfers the catalyst colloid layer 20 of the first pattern to the substrate 30 through the microcontact printing technology. Microcontact printing is a micro-machining technology that prints patterns on a substrate by combining an elastic stamp with a self-assembled monolayer technology. Compared with traditional photolithography, microcontact printing does not require an expensive imaging exposure system. The printing process can be completed by using an imprint mold 10 and conventional ink or self-assembled monolayer materials, without the need for complex photoresist coating, exposure, development and other steps. Microcontact printing is not only fast and cheap, does not require the harsh conditions of a clean room, but is also suitable for a variety of different surfaces and has the characteristics of flexible and changeable operation methods.

[0040] In some embodiments, under a predetermined pressure P of 1.15 MPa≤P≤1.25 MPa, preferably 1.2 MPa, the punch 11 is contacted with the substrate 30 for a predetermined time T of 8s≤T≤15s, preferably 10s, to transfer the catalyst colloid with the first pattern to the substrate 30.

[0041] The substrate 30 is a base material for receiving the transfer of the first pattern formed on the surface of the catalyst colloid on the imprint mold 10. The material of the substrate 30 is not limited, and can be silicon, glass, glass fiber board, polyethylene terephthalate, cyclic olefin copolymer or polyimide, etc. The form of the substrate 30 can be selected according to the desired conductive pattern, and can be a flat surface, a curved surface or a flexible surface, etc.

[0042] Before the substrate 30 is brought into micro-contact with the convex mold 11, the surface of the substrate 30 may be processed, such as physical cleaning or plasma cleaning. Physical cleaning may be performed by wiping the surface of the substrate 30 with a dust-free cloth dipped in an organic solvent such as alcohol or acetone to remove pollutants such as grease, dust, and fingerprints. Plasma cleaning may bombard the surface of the substrate 30 with active particles of plasma to remove organic pollutants and weak interface layers on the surface, and at the same time increase the roughness and activity of the surface of the substrate 30, thereby improving adhesion.

[0043] In some embodiments, a specific chemical group is introduced on the surface of the substrate 30, and the chemical group includes at least one of a carboxyl group, a hydroxyl group, and an amine group. The above groups can form chemical bonds with molecules in the catalyst colloid, thereby improving adhesion.

[0044] For example, a strong oxidant such as potassium permanganate or potassium dichromate is used to oxidize the surface of the substrate, so that the hydrocarbon chains on the surface of the substrate are broken and oxygen-containing functional groups such as hydroxyl or carboxyl are introduced. In particular, when the substrate material is a carbon-based material such as graphite or carbon fiber, an oxidant such as concentrated nitric acid is used for oxidation treatment. Specifically, at a certain temperature, the substrate is immersed in concentrated nitric acid for a period of time, taken out, cleaned, and dried, so that groups such as hydroxyl and carboxyl groups can be introduced on the surface of the substrate.

[0045] For another example, for some polymer substrates, the polymer substrates may be first halogenated to introduce halogen atoms onto the surface of the polymer substrates, and then specific chemical groups may be introduced via nucleophilic substitution reactions. Specifically, the polymer substrates may be first immersed in a solution of chlorine or bromine to undergo a halogenation reaction to introduce halogen atoms onto the surface of the polymer substrates. The halogenated substrates may then be immersed in a solution containing a nucleophilic agent, such as sodium hydroxide, ethanolamine, etc., to undergo a nucleophilic substitution reaction to introduce groups such as hydroxyl groups and amine groups.

[0046] Among them, when the adhesive added to the catalyst colloid contains an isocyanate group, when it comes into contact with the hydroxyl group on the surface of the substrate, the (-N=C=O) in the isocyanate reacts with the (-OH) in the hydroxyl group to form an urethane bond (-NH-COO-). The formation of this chemical bond enables the adhesive to have good adhesion and durability to the substrate.

[0047] When the adhesive added to the catalyst colloid contains epoxy groups, when it comes into contact with the carboxyl groups on the surface of the substrate, the carboxyl groups can undergo a ring-opening reaction with the epoxy groups to form an ester bond (-COO-). This chemical bond can increase the adhesion between the adhesive and the substrate, allowing the catalyst colloid to be firmly bonded to the substrate.

[0048] When the adhesive added to the catalyst colloid contains isocyanate, when it comes into contact with the amine group on the surface of the substrate, the amine group can react with the isocyanate to form a urea bond (-NH-CO-NH-), and this chemical bond can improve the bonding strength and chemical resistance between the catalyst colloid and the substrate.

[0049] Step S4: drying the substrate 30, and immersing the dried substrate 30 in a metal plating solution for chemical plating, so that the catalyst colloid is away from the surface of the substrate 30 to form a conductive pattern. Figure 6 By chemical plating, a metal layer 40 is electroplated on the catalyst colloid layer 20, and the metal layer 40 has a conductive pattern.

[0050] Chemical plating is a plating method in which, in the absence of an external current, metal ions in a metal plating solution are reduced to metal elements under the action of a catalyst with the aid of a suitable reducing agent. These metal elements are gradually deposited on the surface of the substrate 30 to form a metal coating.

[0051] The conductive pattern formed by chemical plating usually has good conductivity and uniformity, which can improve the performance and reliability of electronic equipment. The uniform conductive pattern can reduce resistance, reduce the loss of signal transmission, and improve the working efficiency and stability of electronic equipment. Compared with other preparation methods of conductive materials, chemical plating can form a uniform conductive pattern on a substrate 30 of complex shape, which can meet the design requirements of various electronic devices. At the same time, the conductive pattern formed by chemical plating has good corrosion resistance and wear resistance, and can be used in harsh environments.

[0052] A first pattern will be formed on the surface of the catalyst colloid after it contacts the convex mold 11, and the catalyst colloid will be transferred to the substrate 30. After the catalyst colloid having the first pattern contacts the metal plating solution, the reduced metal ions in the metal plating solution will precipitate according to the shape of the first pattern to form a conductive pattern.

[0053] In some embodiments, the substrate 30 is dried and immersed in a metal plating solution for chemical plating so that the catalyst colloid is away from the surface of the substrate 30 to form a conductive pattern, including: placing the substrate 30 in a drying device at a temperature of 60°C to 80°C for drying for 30 minutes to 60 minutes, immersing the dried substrate 30 in the metal plating solution for chemical plating for a chemical plating time of 1 minute to 30 minutes, and washing the chemically plated substrate 30 with water and then placing it in a drying device at a temperature of 80°C to 100°C for drying so that the catalyst colloid is away from the surface of the substrate 30 to form the conductive pattern.

[0054] Drying the substrate 30 can ensure that the surface of the substrate 30 is dry and reduce the adverse effects of moisture on the subsequent chemical plating process. For example, if there is a lot of moisture on the surface of the substrate 30, the metal plating solution may be diluted, affecting the effect of chemical plating and the quality of the metal layer, resulting in uneven thickness of the metal plating layer and defects such as pores. In addition, during the process of drying the substrate 30, the catalyst colloid on the surface of the substrate 30 can be more tightly attached to the substrate 30. When the surface of the substrate 30 is dry, the bonding force between the catalyst colloid and the substrate 30 will be enhanced, thereby better playing a catalytic role in the chemical plating process and promoting the precipitation of metal on the substrate 30.

[0055] The conductive pattern formed on the substrate 30 is to meet the requirements of the fields of electronic equipment, integrated circuits, etc. for conductive performance. The conductive pattern can be various geometric shapes, such as lines, grids, circles, squares, etc., or complex graphics and patterns. The conductive pattern can be used as part of the conductive line to realize the transmission of current and the transfer of signals. For example, in the manufacture of printed circuit boards, the conductive pattern is formed on the substrate 30 by chemical plating to connect electronic components and realize the function of the circuit.

[0056] The embodiment of the present application provides a method for preparing a conductive pattern. The method includes providing an imprinting mold 10, the convex mold 11 of the imprinting mold 10 has a first pattern shape, applying a catalyst colloid on the convex mold 11, and forming a first pattern on the surface of the catalyst colloid, contacting the convex mold 11 with the substrate 30 for a predetermined time under a predetermined pressure, so that the catalyst colloid with the first pattern is transferred to the substrate 30, and then immersing the substrate 30 in a metal plating solution to obtain a conductive pattern. The above process is simple to operate and has a short process flow. Compared with traditional photolithography technology, the conductive pattern prepared in the present application does not require complex steps such as photoresist coating, exposure, and development, and the entire preparation process does not require the assistance of a light source and is not limited by the light source. The catalyst colloid only needs to be applied to the convex mold 11 and then transferred to the substrate 30, saving the amount of catalyst colloid, and the thickness of the metal coating can be adjusted as needed, with a certain degree of operational flexibility.

[0057] In some embodiments, the coating method includes at least one of spraying, brushing, rolling, flow coating or dripping. Specifically, the prepared catalyst colloid is adsorbed by the sleeve and evenly transferred to the surface of the male mold 11. During the rolling process, the roller and the male mold 11 maintain a certain pressure and angle to ensure that the catalyst colloid can fully cover the surface of the male mold 11.

[0058] In some embodiments, the metal plating solution includes at least one of zinc plating solution, copper plating solution, nickel plating solution, chromium plating solution, gold plating solution, tin plating solution or silver plating solution. The above metal plating solution is a commercial metal plating solution, or the metal plating solution is prepared from the following components: metal salt, solvent water, reducing agent, additives, etc. Among them, the metal salt can be silver nitrate, silver perchlorate, sodium silver cyanide, copper sulfate, copper chloride, copper nitrate, nickel sulfate, nickel chloride, zinc sulfate, zinc chloride, zinc nitrate, sodium dichromate, sodium chromate, chromium trioxide, stannous chloride, stannous sulfate or tin tetrachloride, etc. The additive can be at least one of ethanol, methanol, disodium ethylenediaminetetraacetic acid, ethylenediamine, triethanolamine, ethylenediaminetetraacetic acid, succinic acid, citric acid, propionic acid, glycolic acid, boric acid, tartrate, sodium hydroxide, potassium hydroxide or ammonia water.

[0059] In some embodiments, the thickness of the conductive pattern is 50 nm to 2 μm. The thickness of the conductive pattern can be designed according to requirements, for example, the thickness of the conductive pattern can be 50 nm, 100 nm, 200 nm, 400 nm, 0.5 μm, 1 μm or 2 μm.

[0060] In a second aspect, an embodiment of the present application further provides a conductive pattern, which is prepared by any preparation method of the first aspect.

[0061] The following is a specific description of the preparation of a conductive pattern of a copper metal circuit as an example:

[0062] Example 1

[0063] (1) Using polydimethylsiloxane as a raw material, an imprinting mold is prepared, wherein the imprinting mold has a convex mold, and the convex mold has a first pattern shape.

[0064] (2) The palladium colloid is coated on the convex mold by roll coating, so that the surface where the palladium colloid contacts the convex mold forms a first pattern.

[0065] (3) A glass substrate was provided, and the convex mold was brought into contact with the glass substrate at a pressure of 1.2 MPa for 10 seconds, so that the palladium colloid of the first pattern was transferred onto the glass substrate.

[0066] (4) The glass substrate is placed in an oven at 60° C. and dried for 60 minutes. The dried glass substrate is immersed in a copper plating solution for chemical plating, so that a conductive pattern of copper metal circuits is formed on the surface of the palladium colloid away from the substrate.

[0067] Example 2

[0068] (1) Using polydimethylsiloxane as a raw material, an imprinting mold is prepared, wherein the imprinting mold has a convex mold, and the convex mold has a first pattern shape.

[0069] (2) Adding acrylic pressure-sensitive adhesive to palladium colloid, coating the palladium colloid on the convex mold by roller coating, so that the surface of the palladium colloid in contact with the convex mold forms a first pattern.

[0070] (3) A glass substrate was provided, and the convex mold was brought into contact with the glass substrate at a pressure of 1.2 MPa for 10 seconds, so that the palladium colloid of the first pattern was transferred onto the glass substrate.

[0071] (4) The glass substrate is placed in an oven at 60° C. and dried for 60 minutes. The dried glass substrate is immersed in a copper plating solution for chemical plating, so that a conductive pattern of copper metal circuits is formed on the surface of the palladium colloid away from the substrate.

[0072] The conductive patterns of the copper metal circuits prepared in Example 1 and Example 2 do not need to be prepared under the condition of a light source, and the process flow is simple and time-saving, the catalyst colloid adheres firmly to the substrate, and the thickness of the metal coating is uniform.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Under the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present application as described above, which are not provided in detail for the sake of simplicity. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for preparing a conductive pattern, characterized in that: include: Providing an imprinting mold, the imprinting mold comprising a convex mold, the convex mold having a first pattern shape; Applying a catalyst colloid on the convex mold so that a first pattern is formed on the surface where the catalyst colloid contacts the convex mold; Providing a substrate, contacting the convex mold with the substrate for a predetermined time T under a predetermined pressure P, so as to transfer the catalyst colloid with the first pattern to the substrate; wherein 1Mpa≤P≤5Mpa, 1s≤T≤10min; The substrate is dried, and then immersed in a metal plating solution for chemical plating, so that the catalyst colloid is away from the surface of the substrate to form a conductive pattern.

2. The preparation method according to claim 1, characterized in that: The catalyst colloid includes a pressure-sensitive adhesive and / or a hot-melt adhesive.

3. The preparation method according to claim 2, characterized in that: The pressure-sensitive adhesive comprises at least one of a rubber-type pressure-sensitive adhesive, an acrylate-type pressure-sensitive adhesive or a silicone-type pressure-sensitive adhesive; and / or, The hot melt adhesive includes at least one of polyamide hot melt adhesive, polyurethane hot melt adhesive, polyester hot melt adhesive, ethylene-vinyl acetate copolymer hot melt adhesive or ethylene-ethyl acrylate copolymer hot melt adhesive.

4. The preparation method according to claim 1, characterized in that: The catalyst colloid includes any one of palladium colloid, nickel colloid or platinum colloid; and / or, The imprint mold comprises any one of polydimethylsiloxane, silicon, silicon dioxide or nickel; and / or, The material of the substrate includes any one of silicon, glass, glass fiber board, polyethylene terephthalate, cyclic olefin copolymer or polyimide.

5. The preparation method according to claim 1, characterized in that: 1.15Mpa≤P≤1.25Mpa, and / or, 8s≤T≤15s.

6. The preparation method according to claim 1, characterized in that: The coating method includes at least one of spraying, brushing, rolling, flow coating or dripping.

7. The preparation method according to claim 1, characterized in that: The metal plating solution includes at least one of a zinc plating solution, a copper plating solution, a nickel plating solution, a chromium plating solution, a gold plating solution, a tin plating solution or a silver plating solution.

8. The preparation method according to claim 1, characterized in that: The step of drying the substrate and immersing the dried substrate in a metal plating solution for chemical plating so that the catalyst colloid is away from the surface of the substrate to form a conductive pattern includes: The substrate is placed in a drying device at a temperature of 60°C to 80°C for 30 minutes to 60 minutes, and the dried substrate is immersed in the metal plating solution for chemical plating, and the chemical plating time is 1 minute to 30 minutes. The chemically plated substrate is washed with water and then placed in a drying device at a temperature of 80°C to 100°C for drying, so that the catalyst colloid is away from the surface of the substrate to form the conductive pattern.

9. The preparation method according to claim 1, characterized in that: The thickness of the conductive pattern is 50 nm to 2 μm.

10. A conductive pattern, characterized in that: The method is prepared according to any one of claims 1 to 9.

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