Turnover welding control method and system for printed circuit board

Abstract

The invention relates to the technical field of electronic manufacturing, in particular to a printed circuit board overturning welding control method and system.The method comprises the steps that firstly, welding target information is collected, and welding paste spraying parameters are set; the method comprises the following steps of: setting an overturning parameter of an electronic component, determining an overturning butt joint position of a printed circuit board and the electronic component, and carrying out soldering paste positioning according to the set overturning parameter and spraying parameter; reflow soldering is carried out on the welding target, and preheating parameters of the temperature profile are set; by predicting the state of the soldering paste, corresponding to the temperature control time sequence node, constructing the thermal fine control adaptive model to perform adaptive adjustment on the temperature profile, and outputting the thermal control adjustment parameter corresponding to the temperature control time sequence node, the invention effectively solves the problem that the processing of different types of printed circuit boards and assemblies is not flexible enough. The adaptability of printed circuit board production is improved, the welding temperature and the amount of welding paste are accurately controlled, therefore, welding spot defects are reduced, and the welding quality is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic manufacturing, and in particular to a printed circuit board flip welding control method and system. Background Art

[0002] In the field of electronic manufacturing, welding of printed circuit boards and electronic components is a key step in the production process. In order to achieve precise installation and electrical connection of electronic components, the industry generally adopts advanced welding technology to ensure connection quality and equipment performance. The core of the welding process includes the correct application of solder paste and precise heat treatment control. Solder paste is usually composed of metal powder and flux. The application accuracy on the printed circuit board directly affects the quality and stability of the solder joints.

[0003] However, although welding technology has made significant progress, it still faces some challenges. Existing welding methods mostly rely on preset welding parameters, which may not be flexible enough when dealing with different types of printed circuit boards and components, and sometimes it is difficult to adapt to changing production needs. In addition, existing technologies often lack sufficient adaptability in the quantitative control of solder paste and the setting of heat treatment parameters, which may lead to inconsistent welding results and affect the overall reliability of the product. Therefore, the adaptability of solder paste status monitoring and temperature control during the welding process becomes the key to improving welding quality.

[0004] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present disclosure, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art known to those skilled in the art. Summary of the invention

[0005] The invention provides a printed circuit board flip welding control method and system, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is: A printed circuit board flip welding control method, the method comprising: Obtaining welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the welding target information; Setting flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; Perform reflow soldering on the printed circuit board and the electronic components, and set the preheating parameters in the temperature profile according to the soldering target information, wherein the reflow soldering process is performed by reflow and cooling according to the temperature profile, and the temperature profile is a variation profile of the soldering temperature at the temperature control timing node; Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; A thermal precision control adaptation model is constructed, wherein the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0007] Furthermore, the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node. The method includes: Selecting a number of the temperature control timing nodes as thermal regulation time points according to the solder paste state prediction result, and determining the time position of the temperature control timing node where the thermal regulation time point is located; Controlling the temperature of the reflow soldering according to the thermal control time point, and adaptively adjusting the soldering temperature corresponding to each thermal control time point; A temperature control trend is set corresponding to each of the thermal control time points based on the time position, and the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and postponed according to the temperature control timing node; The welding temperature corresponding to each thermal control time point and the temperature control trend are collected and integrated to generate the thermal control adjustment parameter.

[0008] Further, the temperature control timing node is selected according to the time position and set as a temperature control transition node, and the method includes: Acquire the interval time of each of the thermal control time points according to the time position, and set the node threshold value according to the operation time of performing the reflow soldering; Determine whether the interval time exceeds the node threshold, and if so, set a temperature control transition node between the two thermal control time points corresponding to the interval time; The thermal control adjustment parameters are optimized and set through the temperature control transition node.

[0009] Further, predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters, the method includes: Establishing a temperature control database, the temperature control database including historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Retrieving the historical temperature control information and the historical solder type information in the temperature control database as data for constructing a solder paste state prediction model, and training and evaluating the solder paste prediction model; According to the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between the solder type and the historical temperature, and based on the mapping relationship and the real-time temperature information, a real-time solder paste state prediction result is obtained.

[0010] Further, a temperature control database is established, and the method includes: Collecting the historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Constructing a solder type label index to reflect the mapping relationship between the solder type and the historical temperature control value, and the historical temperature control and the solder type relationship are in one-to-one correspondence; The printed circuit board and electronic component information material parameters are integrated, and the welding target information is tracked and classified for historical information to be called by the temperature control database.

[0011] Further, the preheating parameters in the temperature profile are set according to the welding target information, and the reflow process is performed according to the temperature profile. The method includes: Traversing the temperature control database, extracting the solder type and the welding target information from the temperature control database, and setting welding requirements according to the solder type and the welding target information; Divide the temperature profile into temperature control stages, wherein the temperature control stages include a preheating stage, a constant temperature stage, a reflow stage, and a cooling stage, and set a target temperature and a heating time for each temperature control stage according to the temperature control stage and the welding requirements; According to the temperature profile and the welding target information, the parameters required to be set in each temperature control stage of the temperature profile are set.

[0012] Further, the flipping parameters of the electronic component are set, and the flipping docking position of the printed circuit board and the electronic component is determined, and the printed circuit board and the electronic component are positioned for solder paste according to the flipping docking position and the solder paste spraying parameters. The method includes: Collecting the degree of freedom node information of the flipping mechanism, and generating a plurality of degree of freedom spaces according to the degree of freedom node information, wherein the plurality of spatial degrees of freedom correspond to the degree of freedom node information one by one; According to the spatial degrees of freedom and the flipping docking requirements, a control trajectory is set, and the control trajectory is sent to the flipping mechanism control terminal; Determine the starting position coordinates and target position coordinates of the flipping mechanism; Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes; Based on the flipping nodes and the alignment nodes, the control trajectory is segmented to obtain an initial trajectory, a flipping trajectory and an alignment trajectory; Outputting x initial trajectory control parameters of the initial trajectory, y flip trajectory control parameters of the flip trajectory, and z alignment trajectory control parameters of the alignment trajectory according to the starting position coordinates and the target position coordinates; The flipping mechanism is flipped and aligned based on the x initial trajectory control parameters, the y flipping trajectory control parameters and the z alignment trajectory control parameters.

[0013] Further, based on the spatial degrees of freedom and the flip docking requirements, a control trajectory is set, and the method includes: According to the multiple spatial degrees of freedom, a spatial degrees of freedom model is established, and the spatial degrees of freedom model is converted into discrete point data required for the control trajectory; Performing trajectory interpolation and connection on the discrete point data to generate a control continuous trajectory; A fitting algorithm is selected to perform smoothing on the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

[0014] A printed circuit board flip welding control system, the system comprising: Acquire a spray setting module, obtain welding target information, the welding target information includes printed circuit board parameters and electronic component parameters, and set solder paste spray parameters according to the welding target information; Setting the positioning docking module, setting the flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; A temperature reflow cooling module is provided to perform reflow soldering on the printed circuit board and the electronic components, and preheating parameters in the temperature profile are set according to the soldering target information. The reflow soldering process is performed by reflow and cooling according to the temperature profile. The temperature profile is a variation profile of the soldering temperature at the temperature control timing node. A prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; An adaptive adjustment module is constructed, and a thermal precision control adaptation model is constructed. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0015] Furthermore, the constructing of the adaptive adjustment module includes: Selecting a control time point unit, selecting a number of the temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing node where the thermal control time point is located; Controlling the adaptive temperature adjustment unit to control the temperature of the reflow soldering according to the thermal adjustment time point, and adaptively adjusting the soldering temperature corresponding to each thermal adjustment time point; A temperature control trend setting unit is configured to set a temperature control trend for each of the thermal control time points based on the time position, wherein the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and postponed according to the temperature control timing node; The integration parameter generation unit collects and integrates the welding temperature corresponding to each thermal control time point and the temperature control trend to generate the thermal control adjustment parameter.

[0016] The technical solution of the present invention can achieve the following technical effects: It effectively solves the inflexibility in processing different types of printed circuit boards and components, improves the adaptability of printed circuit board production, accurately controls the soldering temperature and solder paste amount, thereby reducing solder joint defects and greatly improving the quality of soldering.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a flow chart of a printed circuit board flip welding control method; Figure 2 It is a schematic diagram of the output process of thermal control adjustment parameters of temperature control timing nodes; Figure 3 This is a schematic diagram of the solder paste state prediction process; Figure 4 Create a flow chart for the temperature control database; Figure 5 This is a schematic diagram of the structure of the printed circuit board flip welding control system. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0022] Embodiment 1 like Figure 1 As shown, the present application provides a printed circuit board flip welding control method, the method comprising: S100: obtaining welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the welding target information; S200: setting flipping parameters of the electronic component, determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component for solder paste according to the flipping docking position and solder paste spraying parameters; S300: performing reflow soldering on the printed circuit board and the electronic components, and setting the preheating parameters in the temperature profile according to the soldering target information. The reflow soldering process is performed according to the temperature profile. The temperature profile is a change profile of the soldering temperature at the temperature control timing node. S400: predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, where the solder paste prediction result corresponds to a temperature control timing node; S500: construct a thermal precision control adaptation model, which adaptively adjusts the temperature profile according to the solder paste state prediction result and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0023] Specifically, first, before setting the spraying parameters, collect the relevant parameters of the printed circuit board and electronic components, such as size and material type, to ensure the quality and stability of the solder joints; set the solder paste spraying amount. It should be noted that when setting the solder paste spraying amount, the size, density and layout of the solder joints should be considered; then the machine vision system can be used to set the flipping parameters of the electronic components, and the solder paste spraying position and amount can be controlled according to the flipping docking position and the set solder paste spraying parameters to ensure that the flipping of the electronic components and the docking of the printed circuit board are accurate; then, the temperature profile is set through the welding target information, including the temperature of the preheating, insulation and cooling stages The reflow soldering equipment heats and cools according to the temperature profile, ensuring that the solder paste melts at the correct temperature and forms a solid solder joint after cooling. Deep learning can be used to analyze the state of the solder paste at different temperature control timing nodes, and the predicted results can be matched with the actual temperature control timing nodes to ensure that the solder paste can reach the ideal melting and solidification state at each temperature control timing node, thereby improving the uniformity and structural integrity of the solder joint. A thermal precision control adaptation model is then established that can analyze the predicted data of the solder paste state in real time. According to the output of the model, the parameters in the temperature profile are automatically adjusted to ensure that the welding temperature matches the solder paste state.

[0024] The technical solution of the present invention effectively solves the problem of inflexibility in processing different types of printed circuit boards and components, improves the adaptability of printed circuit board production, accurately controls the welding temperature and solder paste amount, thereby reducing solder joint defects and greatly improving the quality of welding.

[0025] Furthermore, if Figure 2 As shown in the figure, the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node, including: S510: Selecting a number of temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing node where the thermal control time point is located; S520: Controlling the temperature of the reflow soldering according to the thermal control time point, and adaptively adjusting the soldering temperature corresponding to each thermal control time point; S530: Setting a temperature control trend for each thermal control time point based on the time position, wherein the temperature control trend is set according to the thermal control time point that is postponed according to the temperature control timing node corresponding to the thermal control time point; S540: The welding temperature and temperature control trend corresponding to each thermal control time point are collected and integrated to generate thermal control adjustment parameters.

[0026] As a preferred embodiment of the above, a solder paste state prediction model is used to determine the key behavior moments of the solder paste in the reflow process, such as temperature change points, and these moments are selected as thermal control time points, and the specific time position of each thermal control time point is determined to accurately adjust the temperature profile in the reflow process; then, temperature control is implemented for each thermal control time point, and the temperature setting is adjusted according to the solder paste state prediction result. It should be noted that it is necessary to ensure that the solder paste can be melted and solidified under optimal conditions, and at the same time, the temperature sensor and control algorithm are used to adjust the welding temperature in real time to match the behavior prediction of the solder paste; then, based on the time position of each thermal control time point, the temperature trend and the stable stage are set to ensure that the setting of the temperature control trend matches the sequence and time of the entire temperature control timing node, forming a coherent temperature control strategy to ensure the continuity and efficiency of the temperature load welding process; at the same time, the temperature settings and temperature control trends of all thermal control time points are collected, and the temperature parameters and temperature control trends of each thermal control time point are integrated to generate a comprehensive temperature control profile, which is used to guide the reflow equipment to perform precise temperature adjustment to ensure the quality and efficiency of the welding process.

[0027] Further, the temperature control timing node is selected according to the time position and set as the temperature control transition node, including: Obtain the interval time of each thermal control time point according to the time position, and set the node threshold by executing the reflow soldering operation time; Determine whether the interval time exceeds the node threshold. If so, set a temperature control transition node between two thermal control time points corresponding to the interval time. The thermal control adjustment parameters are optimized and set through the temperature control transition node.

[0028] On the basis of the above embodiments, first, the interval time between each time point is collected according to the time position of the thermal control time point, and a node threshold is set based on past experience data, simulation test results or optimization feedback in actual operation in combination with the total operation time of reflow soldering. This threshold is used to determine whether a transition node needs to be set; check whether the interval time between each thermal control time point exceeds the node threshold. If the interval time exceeds the threshold, this indicates that one or more transition nodes are required between the two thermal control time points to ensure a smooth transition of temperature control. It should be noted that the setting of the transition node should ensure that the temperature change is not too rapid to avoid damage to the solder paste and electronic components; then, the thermal control adjustment parameters are optimized through the set temperature control transition nodes, such as adjusting the slope and duration of the temperature profile, to ensure that the setting of each temperature control transition node reflects the characteristics of the solder paste and the sensitivity of the electronic components, thereby improving the welding quality. At the same time, it should be noted that in the actual welding process, the parameters of the transition node are adjusted according to the real-time monitoring data to cope with changes in actual welding conditions.

[0029] Furthermore, if Figure 3 As shown in the figure, the solder paste state is predicted based on the solder paste spraying parameters and preheating parameters, including: S410: Establishing a temperature control database, the temperature control database includes historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; S420: Retrieving historical temperature control information and historical solder type information from a temperature control database as data for building a solder paste state prediction model, and training and evaluating the solder paste prediction model; S430: Based on the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between solder type and historical temperature, and based on the mapping relationship and real-time temperature information, a real-time solder paste state prediction result is obtained.

[0030] Specifically, first, build a database containing historical temperature control information, historical solder type information, real-time temperature information, and material parameters of printed circuit boards and electronic components to improve the accuracy and efficiency of decision-making; retrieve historical temperature control information and historical solder type information from the temperature control database, use these data to build a machine learning model to predict the solder paste state, and train the model based on these data to achieve the ability to identify solder paste behavior under different solder types and temperature conditions; apply deep learning technology to further analyze the temperature control database, learn the complex mapping relationship between different solder types and historical temperatures, and use deep learning models to mine deeper data patterns and associations to improve the accuracy of prediction results. At the same time, combine the mapping relationship and real-time temperature information obtained from deep learning to predict the real-time solder paste state. It should be noted that the prediction results should be fed back to the production line in real time, and the temperature control parameters should be adjusted based on actual conditions to ensure the optimization of the welding process.

[0031] Furthermore, if Figure 4 As shown, a temperature control database is established, including: S411: Collect historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; S412: constructing a solder type label index to reflect the mapping relationship between solder type and historical temperature control value, and the historical temperature control and solder type relationship have a one-to-one correspondence; S413: Integrate printed circuit board and electronic component information material parameters, track and classify welding target information for historical information, and provide it for temperature control database to call.

[0032] As a preferred embodiment of the above embodiment, historical temperature control information, historical solder type information, real-time temperature information and material parameters of printed circuit boards and electronic components are collected, and the temperature changes during the welding process are monitored and recorded in real time by a data acquisition system to ensure that the collected data are accurate, and the accuracy and completeness of the data are regularly verified to ensure the reliability of the information in the database; a label index system is created to mark the relationship between different solder types and the corresponding historical temperature control values, to ensure that there is a clear one-to-one correspondence between the historical temperature control value of each solder type and the solder type, to facilitate subsequent query and analysis, and it should be noted that when designing the database structure, the query efficiency and the convenience of data update should be considered to support rapid access and processing of large amounts of data; then the material parameters of the printed circuit boards and electronic components and the welding target information are integrated into a unified database management system, and all welding-related information is historically tracked, including the solder type, the temperature control parameters used, and the specific material properties of the printed circuit boards and components. A classification management strategy is adopted to organize and manage data according to factors such as welding materials, product types, and production dates, so that data retrieval is more efficient.

[0033] Further, the preheating parameters in the temperature profile are set according to the welding target information, and the reflow process is performed according to the temperature profile for reflow and cooling, including: Traversing the temperature control database, extracting solder type and welding target information from the temperature control database, and setting welding requirements according to the solder type and welding target information; The temperature profile is divided into temperature control stages, which include preheating stage, constant temperature stage, reflow stage and cooling stage. According to the temperature control stage and welding requirements, the target temperature and heating time are set for each temperature control stage. According to the temperature profile and welding target information, set the parameters required for each temperature control stage of the temperature profile.

[0034] On the basis of the above embodiment, data related to specific solder types and welding target information are extracted from the temperature control database, and the requirements of the welding process, such as the maximum and minimum limits of the welding temperature, are determined according to the extracted solder types and welding target information; then the temperature profile is divided into several key stages: preheating section, constant temperature section, reflow section and cooling section. The preheating section slowly heats up to avoid thermal shock and prepare for solder melting. The constant temperature section maintains a certain temperature to thoroughly dry the solder and prepare for melting. The reflow section: quickly heats up to above the melting point of the solder to ensure that the solder is completely melted to form a good solder joint. The cooling section: controls the cooling rate to ensure the quality of solder joint formation and prevent cracks in the solder joint. Then, the temperature and time settings of each stage are optimized using historical data and simulation results, and the temperature control parameters are adjusted according to real-time monitoring data to adapt to any changes that may occur in production.

[0035] Further, setting the flipping parameters of the electronic component, determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and the solder paste spraying parameters, including: Collecting the degree of freedom node information of the flipping mechanism, and generating a plurality of degree of freedom spaces according to the degree of freedom node information, wherein the plurality of spatial degrees of freedom correspond to the degree of freedom node information one by one; According to the spatial freedom and flip docking requirements, the control trajectory is set and sent to the flip mechanism control terminal; Determine the starting position coordinates and target position coordinates of the flipping mechanism; Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes; Based on the flipping nodes and the alignment nodes, the control trajectory is segmented to obtain the initial trajectory, flipping trajectory and alignment trajectory; According to the starting position coordinates and the target position coordinates, output x initial trajectory control parameters of the initial trajectory, y flip trajectory control parameters of the flip trajectory, and z alignment trajectory control parameters of the alignment trajectory; The flipping mechanism is flipped and aligned based on x initial trajectory control parameters, y flipping trajectory control parameters and z alignment trajectory control parameters.

[0036] Specifically, the degree of freedom node information is the active point of the flip mechanism, such as the arm of the flip mechanism. Based on these degree of freedom node information, multiple degree of freedom spaces in the simulation environment are constructed. The degree of freedom space is the motion range of the flip mechanism. Multiple spatial degrees of freedom correspond to multiple degree of freedom nodes one by one, and each degree of freedom node has corresponding spatial degrees of freedom; according to the specific needs of flip docking, such as the docking accuracy requirements of electronic components and printed circuit boards, a control trajectory is designed, and the designed control trajectory is sent to the control terminal of the flip mechanism to ensure that the mechanism can move according to the predetermined trajectory; the starting position coordinates of the flip mechanism and the target position coordinates of the electronic component to be docked to the printed circuit board are measured and determined; wherein, the degree of freedom control data of multiple degree of freedom nodes are collected respectively and output as a control sample data set, and the control sample data set includes the control parameters of each node, and the algorithm is applied, For example, machine learning algorithms analyze the collected motion data and identify key turning points in the motion trajectory. These points may be mutation points of speed or acceleration, or key positions of flipping angles. Flipping nodes and alignment nodes are extracted from the analysis results. Flipping nodes refer to the positions where the flipping mechanism starts or completes the flipping action, and alignment nodes refer to the moment before the electronic component and the printed circuit board are docked. According to the positions of key nodes, the efficiency and safety of the entire control trajectory are evaluated. The control trajectory is then divided into initial trajectory, flipping trajectory and alignment trajectory. Each part calculates control parameters for each trajectory segment for a specific operation stage, including speed, acceleration, and position coordinates. According to the calculated control parameters, precise flipping and alignment operations are performed through the control system of the flipping mechanism, and real-time data during the flipping process is monitored to ensure that each step is strictly executed according to the set parameters.

[0037] Furthermore, based on the spatial freedom and flip docking requirements, the control trajectory is set, including: According to multiple spatial degrees of freedom, a spatial degrees of freedom model is established, and the spatial degrees of freedom model is converted into discrete point data required for controlling the trajectory; Perform trajectory interpolation and connection on discrete point data to generate a control continuous trajectory; A fitting algorithm is selected to smooth the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

[0038] As a preferred embodiment of the above, the model is discretized by dividing the degree of freedom model into multiple small geometric elements, such as triangular facets, and the discrete data points generated above are connected through difference technology such as spline interpolation to generate a continuous control trajectory. A suitable trajectory smoothing algorithm, such as Gaussian filtering, moving average or spline curve fitting, is selected to eliminate mutations and oscillations in the trajectory and improve the smoothness of the movement. The continuous trajectory is smoothed to ensure the accuracy and stability during the flipping and docking process. This step not only reduces mechanical stress, but also improves the accuracy of docking; then the smoothed trajectory is converted into a format that can be recognized by the control terminal, such as G code, and the converted trajectory is sent to the control terminal of the flip mechanism. Ensure that the control system has been correctly configured and can interpret and execute the given trajectory instructions.

[0039] Embodiment 2 Based on the same inventive concept as the printed circuit board flip welding control method in the aforementioned embodiment, the present invention also provides a printed circuit board flip welding control system, such as Figure 5 The system comprises: Acquire a spray setting module, obtain welding target information, the welding target information includes printed circuit board parameters and electronic component parameters, and set solder paste spray parameters according to the welding target information; Set the positioning docking module, set the flipping parameters of the electronic components, and determine the flipping docking position of the printed circuit board and the electronic components, and perform solder paste positioning on the printed circuit board and the electronic components according to the flipping docking position and solder paste spraying parameters; Set up a temperature reflow cooling module, perform reflow soldering on the printed circuit board and electronic components, and set the preheating parameters in the temperature profile according to the soldering target information. The reflow soldering process is reflowed and cooled according to the temperature profile. The temperature profile is the change profile of the soldering temperature at the temperature control timing node. The prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and preheating parameters to obtain the solder paste prediction result, which corresponds to the temperature control timing node; Construct an adaptive adjustment module and a thermal precision control adaptation model. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction results, and outputs thermal control adjustment parameters corresponding to the temperature control timing nodes.

[0040] The above adjustment system in the present invention can effectively implement the printed circuit board flip welding control method, and the technical effects that can be achieved are as described in the above embodiments, which will not be repeated here.

[0041] Similarly, the above-mentioned optimization schemes for the system can also respectively achieve the optimization effects corresponding to the method in Example 1, which will not be repeated here.

[0042] Specifically, building an adaptive adjustment module includes: Select a control time point unit, select a number of temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determine the time position of the temperature control timing node where the thermal control time point is located; The control adapts the temperature adjustment unit to control the temperature of the reflow soldering according to the thermal adjustment time point, and adapts to adjust the soldering temperature corresponding to each thermal adjustment time point; Setting a temperature control trend unit, setting a temperature control trend for each thermal control time point based on the time position, and setting the temperature control trend according to the thermal control time point postponed according to the temperature control timing node corresponding to the thermal control time point; The integrated parameter generation unit collects and integrates the welding temperature and temperature control trend corresponding to each thermal control time point to generate thermal control adjustment parameters.

[0043] Although the present application has been described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Accordingly, this specification and the accompanying drawings are merely exemplary illustrations of the present application as defined therein, and are deemed to have covered any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, a person skilled in the art may make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application is intended to include these modifications and variations.

Claims

1. A printed circuit board flip welding control method, characterized in that: The method comprises: Obtaining welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the welding target information; Setting flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; Perform reflow soldering on the printed circuit board and the electronic components, and set the preheating parameters in the temperature profile according to the soldering target information, wherein the reflow soldering process is performed by reflow and cooling according to the temperature profile, and the temperature profile is a variation profile of the soldering temperature at the temperature control timing node; Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; A thermal precision control adaptation model is constructed, wherein the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

2. The printed circuit board flip welding control method according to claim 1, characterized in that: The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node, including: Selecting a number of the temperature control timing nodes as thermal regulation time points according to the solder paste state prediction result, and determining the time position of the temperature control timing node where the thermal regulation time point is located; Controlling the temperature of the reflow soldering according to the thermal control time point, and adaptively adjusting the soldering temperature corresponding to each thermal control time point; A temperature control trend is set corresponding to each of the thermal control time points based on the time position, and the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and postponed according to the temperature control timing node; The welding temperature corresponding to each thermal control time point and the temperature control trend are collected and integrated to generate the thermal control adjustment parameter.

3. The printed circuit board flip welding control method according to claim 2, characterized in that: Selecting the temperature control timing node according to the time position to set it as a temperature control transition node includes: Acquire the interval time of each of the thermal control time points according to the time position, and set the node threshold value according to the operation time of performing the reflow soldering; Determine whether the interval time exceeds the node threshold, and if so, set a temperature control transition node between the two thermal control time points corresponding to the interval time; The thermal control adjustment parameters are optimized and set through the temperature control transition node.

4. The printed circuit board flip welding control method according to claim 1, characterized in that: Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters includes: Establishing a temperature control database, the temperature control database including historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Retrieving the historical temperature control information and the historical solder type information in the temperature control database as data for constructing a solder paste state prediction model, and training and evaluating the solder paste prediction model; According to the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between the solder type and the historical temperature, and based on the mapping relationship and the real-time temperature information, a real-time solder paste state prediction result is obtained.

5. The printed circuit board flip welding control method according to claim 4, characterized in that: Establish a temperature control database, including: Collecting the historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Constructing a solder type label index to reflect the mapping relationship between the solder type and the historical temperature control value, and the historical temperature control and the solder type relationship are in one-to-one correspondence; The printed circuit board and electronic component information material parameters are integrated, and the welding target information is tracked and classified for historical information to be called by the temperature control database.

6. The printed circuit board flip welding control method according to claim 5, characterized in that: The preheating parameters in the temperature profile are set according to the welding target information, and the reflow soldering process is performed according to the temperature profile. The reflow soldering process includes: Traversing the temperature control database, extracting the solder type and the welding target information from the temperature control database, and setting welding requirements according to the solder type and the welding target information; Divide the temperature profile into temperature control stages, wherein the temperature control stages include a preheating stage, a constant temperature stage, a reflow stage, and a cooling stage, and set a target temperature and a heating time for each temperature control stage according to the temperature control stage and the welding requirements; According to the temperature profile and the welding target information, the parameters required to be set in each temperature control stage of the temperature profile are set.

7. The printed circuit board flip welding control method according to claim 1, characterized in that: Setting flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component for solder paste according to the flipping docking position and solder paste spraying parameters, including: Collecting the degree of freedom node information of the flipping mechanism, and generating a plurality of degree of freedom spaces according to the degree of freedom node information, wherein the plurality of spatial degrees of freedom correspond to the degree of freedom node information one by one; According to the spatial degrees of freedom and the flipping docking requirements, a control trajectory is set, and the control trajectory is sent to the flipping mechanism control terminal; Determine the starting position coordinates and target position coordinates of the flipping mechanism; Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes; Based on the flipping nodes and the alignment nodes, the control trajectory is segmented to obtain an initial trajectory, a flipping trajectory and an alignment trajectory; Outputting x initial trajectory control parameters of the initial trajectory, y flip trajectory control parameters of the flip trajectory, and z alignment trajectory control parameters of the alignment trajectory according to the starting position coordinates and the target position coordinates; The flipping mechanism is flipped and aligned based on the x initial trajectory control parameters, the y flipping trajectory control parameters and the z alignment trajectory control parameters.

8. The printed circuit board flip welding control method according to claim 7, characterized in that: Based on the spatial degrees of freedom and flip docking requirements, a control trajectory is set, including: According to the multiple spatial degrees of freedom, a spatial degrees of freedom model is established, and the spatial degrees of freedom model is converted into discrete point data required for the control trajectory; Performing trajectory interpolation and connection on the discrete point data to generate a control continuous trajectory; A fitting algorithm is selected to perform smoothing on the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

9. Printed circuit board flip welding control system, characterized in that: The system comprises: Acquire a spray setting module, obtain welding target information, the welding target information includes printed circuit board parameters and electronic component parameters, and set solder paste spray parameters according to the welding target information; Setting the positioning docking module, setting the flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; A temperature reflow cooling module is provided to perform reflow soldering on the printed circuit board and the electronic components, and preheating parameters in the temperature profile are set according to the soldering target information. The reflow soldering process is performed by reflow and cooling according to the temperature profile. The temperature profile is a variation profile of the soldering temperature at the temperature control timing node. A prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; An adaptive adjustment module is constructed, and a thermal precision control adaptation model is constructed. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

10. The printed circuit board flip welding control system according to claim 9, characterized in that: Building an adaptive adjustment module system includes: Selecting a control time point unit, selecting a number of the temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing node where the thermal control time point is located; Controlling the adaptive temperature adjustment unit to control the temperature of the reflow soldering according to the thermal adjustment time point, and adaptively adjusting the soldering temperature corresponding to each thermal adjustment time point; A temperature control trend setting unit is configured to set a temperature control trend for each of the thermal control time points based on the time position, wherein the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and postponed according to the temperature control timing node; The integration parameter generation unit collects and integrates the welding temperature corresponding to each thermal control time point and the temperature control trend to generate the thermal control adjustment parameter.

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