Processing method capable of remarkably reducing temperature of ferrite induction transformer and electronic component of LED driving power supply

Abstract

The invention discloses a processing method capable of remarkably reducing the temperature of heating elements such as an LED driving power transformer, which is characterized in that the following steps are implemented on electronic components such as a high-heat-conductivity printed circuit board and a ferrite transformer body: S1, dedusting the electronic components; s2, printing solder paste on the circuit board; s3, mounting an electronic component heat-conducting gasket and a ferrite transformer; s4, soldering tin and fixing in a tin furnace; s5, other elements and wires are subjected to repair welding; s6, testing; and S7, mounting the circuit board on the inner wall of the metal shell of the LED driving power supply. Through the process, heat generated by each electronic element on the circuit board can be conducted to the high-heat-conduction substrate, heat is conducted to the metal shell of the LED driving power supply through the heat-conduction substrate, the metal shell can be used for dissipating heat of each electronic element in the driving power supply, the temperature of the transformer and the heating elements on the board is reduced, and the service life of the LED driving power supply is prolonged. The reliability of heating elements on the transformer and the circuit board is improved, and the service life of the power supply is prolonged.

Description

Technical Field

[0001] The present invention specifically relates to the technical field of LED driving power supplies, and in particular to a processing method that can significantly reduce the temperature of a ferrite inductor transformer and electronic components of an LED driving power supply. Background Art

[0002] The printed circuit board is the soul component inside the LED driver power supply. The circuit board is set up with a circuit, which includes transformers, switch tubes, rectifier diodes and other major heating devices. Generally, the temperature of capacitor components is up to 105 degrees, the PN junction temperature of semiconductor components is 150 degrees, and the temperature of transformer enameled wire is generally 125 degrees. Among them, the transformer has the highest heating temperature. When the ambient temperature is very high, the transformer temperature is too high, exceeding the temperature resistance limit of the enameled wire in the transformer, and the enameled wire insulation fails, causing a short circuit between turns and transformer damage. The switch tube has the second highest heat generation after the transformer. The PN junction temperature is 150 degrees, and it is also easy to die from heat. Any damage to any component will cause damage to the driver power supply.

[0003] In the existing technology, the heat dissipation of the driving power transformer and the semiconductor heat dissipation such as the switching tube is the biggest and most difficult problem to solve. In the comparative test experiment, the same electronic components and transformers, with the same output power, replaced the aluminum substrate with a fiberglass board, the transformer temperature was as high as over 173°C, while the transformer temperature on the aluminum substrate was only over 80 degrees.

[0004] Therefore, in order to solve such problems and extend the service life of LED driver power supply, it is imperative to propose a new assembly process. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a processing method that can significantly reduce the temperature of the ferrite inductor transformer and electronic components of the LED drive power supply.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A processing method that can significantly reduce the temperature of a ferrite inductor transformer and electronic components of an LED driving power supply, wherein the following steps are performed on electronic components such as a high thermal conductivity printed circuit board and a transformer body:

[0008] S1: Dust removal of electronic components;

[0009] S2: PCB printing solder paste;

[0010] S3: Attach thermal pads to inductors, transformers and electronic components;

[0011] S4: Fix with soldering tin in tin furnace;

[0012] S5: Re-solder other components and wires;

[0013] S6: Testing;

[0014] S7: The circuit board is mounted on the inner wall of the metal shell of the LED driver power supply.

[0015] Furthermore, in the S2 process, the circuit board is a high thermal conductivity printed circuit board made of a high thermal conductivity material such as an aluminum substrate, a copper substrate, a ceramic substrate, etc., and is printed with solder paste.

[0016] Furthermore, in the S3 process, the high thermal conductivity printed circuit board is made of a high thermal conductivity material such as an aluminum substrate, a copper substrate, a ceramic substrate, etc., and a thermal conductive pad is attached to the high thermal conductivity printed circuit board.

[0017] Furthermore, the thermally conductive gasket is a thermally conductive silicone gasket or the like.

[0018] Furthermore, in the process S3 , the thermally conductive gasket 2 is connected between the high thermal conductivity printed circuit board 3 and the transformer body 1 .

[0019] Furthermore, in the S4 process, the pins of the transformer body and the high thermal conductivity printed circuit board are fixed by welding solder.

[0020] Furthermore, in the S5 process, the soldering of other components and wires is to improve the circuit board, and the other components and wires are fixed by soldering with solder paste.

[0021] Furthermore, in the S6 process, the test is to use a detection device to test whether the solder joints have cold soldering, desoldering, and electrical performance, so as to ensure that the solder joints of the circuit board are firm enough and the welding is accurate and the electrical performance is good.

[0022] Furthermore, in the S7 process, the high thermal conductivity printed circuit board is installed inside the thermal conductive housing.

[0023] The beneficial effects of the present invention are:

[0024] Through the present invention, the production process is simpler, and the heat generated by each electronic component is conducted to the high thermal conductivity printed circuit board. The back of the printed circuit board is mounted on the inner wall of the metal shell of the LED driver power supply, and the heat generated by all the heat-generating electronic components in the driver power supply is conducted to the LED driver power supply shell, without increasing the heat dissipation cost, reducing the thermal resistance, and improving the heat dissipation effect. The material of the high thermal conductivity printed circuit board is a high thermal conductivity material such as an aluminum substrate, a copper substrate, and a ceramic substrate, and has good thermal conductivity. In the installation method of this method, conventional plug-in transformers can be mounted without re-molding, and the heat generated by the transformer is conducted to the high thermal conductivity printed circuit board through the thermal conductive pad. Experiments have proved that during the working process of the driver power supply, the transformer has the highest maximum heat generation temperature of the entire LED power supply. If the transformer temperature is too high, it will cause high-temperature damage to the transformer, causing the circuit board to fail to work normally, and may even cause risks such as fire. In the comparative test, the aluminum substrate was changed to a single-sided fiberglass board, and the other electronic components were exactly the same. The temperature of the transformer on the fiberglass board was above 173°C, while the transformer on the aluminum substrate of this technology can control the operating temperature at 77.0-81.6°C, increase the heat dissipation rate, significantly reduce the temperature of the components on the board, and improve the life of the driving power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the main structure of the transformer of the high thermal conductivity printed circuit board proposed by the present invention;

[0026] Figure 2 This is a schematic diagram of the exploded structure of the transformer of the high thermal conductivity printed circuit board proposed by the present invention;

[0027] Figure 3 This is a side structural schematic diagram of the transformer of the high thermal conductivity printed circuit board proposed by the present invention.

[0028] In the figure: 1. Transformer body; 2. Thermal conductive gasket; 3. High thermal conductivity printed circuit board; 4. Solder. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Reference Figure 1-3 A processing method for significantly reducing the temperature of a ferrite inductor transformer and electronic components of an LED driving power supply is provided. The following steps are performed on a high thermal conductivity printed circuit board 3, a transformer body 1 and electronic components:

[0031] S1: Dust removal of electronic components;

[0032] S2: PCB printing solder paste;

[0033] The high thermal conductivity printed circuit board 3 is made of a high thermal conductivity material such as an aluminum substrate, a copper substrate, or a ceramic substrate.

[0034] S3: Mounting thermal pads, inductors, transformers and electronic components;

[0035] When mounting the transformer, firstly, the thermally conductive silicone gasket 2 is mounted on the upper surface of the high thermal conductivity printed circuit board 3 , and then the transformer is mounted on the upper surface of the thermally conductive silicone gasket 2 to contact the transformer body 1 .

[0036] S4: Fix with soldering tin in tin furnace;

[0037] The pins of the transformer body 1 and the high thermal conductivity printed circuit board 3 are fixed by welding solder 4 .

[0038] S5: Re-solder other components and wires;

[0039] The repairing of other components and wires is to improve the circuit board, and other components and wires are fixed by soldering with solder paste.

[0040] S6: Testing;

[0041] The test is to use detection equipment to test whether the solder joints have cold soldering, desoldering and electrical performance, so as to ensure that the solder joints of the circuit board are firm enough and the welding is accurate and the electrical performance is good.

[0042] S7: Install the power board into the metal housing of the LED driver power supply;

[0043] After the transformer and other electronic components on the high thermal conductivity printed circuit board 3 are installed, the entire high thermal conductivity printed circuit board is installed inside the metal housing of the driving power supply.

[0044] Working principle of this embodiment: After dust removal, during the patch process, the thermal conductive silicone gasket 2 is directly pasted on the high thermal conductivity printed circuit board 3. The length of the pins can be trimmed according to the thickness of the thermal conductive silicone gasket 2, so that the transformer body 1 is pressed on the thermal conductive silicone gasket 2, and the pins and the circuit body are fixed by welding solder 4.

[0045] Among them, the pins of the ferrite inductor transformer can be pins, and the pins can be right-angled, bent, and L-shaped, or flat planar pins.

[0046] All electronic components of the present invention are welded on the printed circuit board, and only the main heating element is welded on the high thermal conductivity printed circuit board. The LED driving power supply is also within the protection scope of the present invention.

[0047] The LED driving power supply circuit board of the present invention has a high thermal conductivity substrate which also has the function of a heat sink and can be used as a bare board without an external heat sink or a metal aluminum shell to enhance heat dissipation, and is also within the protection scope of the present invention.

[0048] The thermally conductive gaskets mentioned above are not limited to formed gaskets, but also include solid gaskets formed after liquid glue is cured.

[0049] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A processing method that can significantly reduce the temperature of electronic components such as LED drive power supply ferrite inductor transformer, characterized in that: The following steps are performed on electronic components such as a high thermal conductivity printed circuit board (3) and a transformer body (1): S1: Dust removal of electronic components; S2: Printing solder paste on the circuit board; S3: Mounting thermal conductive sheet, inductor, transformer and electronic components on the circuit board; S4: Fix with soldering tin in tin furnace; S5: Re-solder other components and wires; S6: Testing; S7: The circuit board is mounted on the inner wall of the metal shell of the LED driver power supply.

2. A processing method for significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 1, characterized in that: In the S3 process, the high thermal conductivity printed circuit board (3) is made of a high thermal conductivity material such as an aluminum substrate, a copper substrate, a ceramic substrate, etc., and a thermal conductive pad is attached to the high thermal conductivity printed circuit board (3).

3. A processing method capable of significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 2, characterized in that: The thermally conductive gasket (2) is made of a material with high thermal conductivity, such as a silicone gasket.

4. A processing method capable of significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 3, characterized in that: In the S3 process, the thermally conductive gasket (2) is between the high thermal conductivity printed circuit board (3) and the transformer body (1).

5. A processing method capable of significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 4, characterized in that: In the S4 process, the pins of the transformer body (1) and the high thermal conductivity printed circuit board (3) are welded by solder (4).

6. A processing method capable of significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 1, characterized in that: In the S6 process, the test is to use a detection device to test whether the solder joints have cold soldering, desoldering, and electrical performance, so as to ensure that the solder joints of the circuit board are firm enough and the soldering is accurate.

7. A processing method capable of significantly reducing the temperature of ferrite inductor transformer and electronic components of LED driving power supply as claimed in claim 1, characterized in that: In the process S7, the high thermal conductivity printed circuit board (3) is mounted on the inner wall of the metal shell of the LED driving power supply.

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