Wafer conveying device of photoetching machine

Abstract

The invention relates to a wafer conveying device of a photoetching machine, and belongs to the technical field of semiconductor manufacturing, the wafer conveying device comprises a conveying guide rail fixed with an external supporting structure, a lifting frame is slidably mounted at the bottom of the conveying guide rail, a transfer assembly is fixed at the bottom of the lifting frame through a middle column, the transfer assembly comprises a transverse plate body, and a supporting plate is slidably clamped on the transverse plate body; the number of the supporting plates is three, a power mechanism used for controlling the supporting plates to slide is installed at the bottom of the transverse plate body, one end of the conveying guide rail is located above a transfer site, the other end of the conveying guide rail is located above a target site, a protection box is arranged below the conveying guide rail, and a lower conveying assembly is fixed to the bottom in the protection box. The transport device can be conveniently transported at two places, unnecessary occupation of space is reduced, the transport device can move and ascend and descend, transfer and placement of wafers are further facilitated, protective gas can be introduced into the protective box, and particularly, the wafers can be protected from being oxidized and damaged when the wafers need to be temporarily stored.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer conveying device of a photolithography machine. Background Art

[0002] The photolithography machine is the core equipment in the semiconductor manufacturing process. The chip structure is formed by developing and etching the silicon wafer through the photolithography process. The wafer, which serves as the chip carrier, needs to be transported between the devices. The wafer itself is relatively fragile and requires additional protection during transportation. It is also necessary to prevent impurities from adhering to the surface so that subsequent processes can proceed smoothly.

[0003] For example, the Chinese invention patent document with the announcement number CN115167079B provides a chip conveying device for a photolithography machine, which belongs to the field of semiconductor material technology. The chip conveying device of the photolithography machine includes a chip outer box and a feeding device. The feeding device is located on one side of the chip outer box. One side end of the chip outer box is fixedly connected with a discharge ramp. A feeding tray is arranged on the feeding device, and the feeding tray corresponds to the discharge ramp. In the present invention, the staff only needs to put a plurality of chips on a plurality of chip partition strips, and the driving component controls the lifting of the lifting inner box through the lifting component. The lifting inner box moves upward the same distance each time, so that the topmost chip is controlled to move by the pushing component and the rolling component, so that the chip enters the feeding tray and is transported by the feeding device. According to the photolithography time of the chip by the photolithography machine, the lifting inner box only sends out one chip at a time, and the sending time is the same, and no human intervention is required, thereby avoiding the accumulation of chips during the transportation process and affecting the use of the photolithography machine.

[0004] However, the technical solution in the above document only temporarily stores the wafers on the wafer separator strips. During transportation, the structural safety of the wafers cannot be guaranteed during the sliding process. The transportation method is only horizontal position transfer, and the wafers are still in an exposed state. Therefore, the above document lacks good effects on the protection and stable transportation of the wafers. Moreover, the above document only involves a single transportation, and after the transportation arrives at the location, the wafers are still placed horizontally and are difficult to be further transferred and used. Therefore, the technical solution of the present invention is proposed. Summary of the invention

[0005] In order to overcome the technical defects of the prior art, the present invention provides a wafer conveying device for a lithography machine, which has the effect of stably transporting wafers and can be conveniently transferred between two locations, reducing unnecessary occupation of space, and can perform moving and lifting movements, further facilitating the transfer and placement of wafers, and protective gas can be introduced into the protective box, especially when the wafer needs to be temporarily stored, it can protect the wafer from being damaged by oxidation.

[0006] The technical solution adopted by the present invention is: it includes a transport rail fixed to an external supporting structure, and a lifting frame is slidably installed at the bottom of the transport rail. The lifting frame can be moved at the bottom of the transport rail by a power device. The lifting frame is used to control the up and down movement of the transfer assembly. When fast and direct transportation is required, the power device directly controls the horizontal movement of the lifting frame. When the lithography machine is running, it is necessary to transport the wafers from the storage device or the previous device, and the transportation device needs to be placed between the wafer source and the lithography machine without occupying extra space. The bottom of the lifting frame is fixed with a transfer assembly through an intermediate column. The transfer assembly includes a horizontal plate body, and a pallet is slidably clamped on the horizontal plate body. There are three pallets in total. The pallet is used to directly support the wafers, and the pallets on both sides can increase The width is further convenient for supporting the wafer. A power mechanism for controlling the sliding of the pallet is installed at the bottom of the cross plate body. The power mechanism is used to control the position of the pallet on the cross plate. One end of the transport rail is located above the transfer location, and the other end is located above the target location. A protection box is provided below the transport rail. The protection box is used to provide a storage environment for the transportation of the wafer and can be transported. The protection box and the transport rail need to be connected to the source of the lithography machine and the external wafer. An upper cover is fixed on the protection box. The upper cover can facilitate the protection and shielding of the internal wafers. A lower transport assembly is fixed on the bottom of the protection box. The lower transport assembly is used to transport the wafer and can protect and store part of the wafer. Power supply connectors are provided on the protection box and the lifting frame.

[0007] Preferably, in order to make the structure of the mobile frame more stable when in use, the mobile frame includes a parallel plate, the top of the parallel plate is slidably engaged with the bottom of the transport guide rail through a slider, a lifting and telescopic rod is fixed on the parallel plate, the bottom end of the lifting and telescopic rod passes through the parallel plate, and a bottom plate is fixed to the bottom end of the lifting and telescopic rod, a guide column is fixed on the bottom plate, and the top end of the guide column passes through the parallel plate and extends upward.

[0008] Preferably, in order to facilitate limiting the sliding of the support plate, a snap-in groove is opened on the side wall of the support plate, and the snap-in groove passes through the support plate. A limiting block is fixed on the upper surface of the cross plate body, and the side wall portion of the limiting block slides and snaps into the snap-in groove.

[0009] Preferably, in order to facilitate the precise movement of the pallet, a rack plate is fixed to the bottom of the pallet, the bottom of the pallet is in contact with the cross plate body, a top surface notch is provided on the cross plate body to allow the rack plate to pass through, an auxiliary support block extending to the bottom of the pallet is fixed on the side wall of the cross plate body, the top surface notch passes through the cross plate body and the auxiliary support block, and the auxiliary support block can support and protect the pallet.

[0010] Preferably, in order to further improve the stable operation of the support plate, an auxiliary cross bar is fixed on the side wall of the auxiliary support block, and a contact block is fixed on the bottom of the support plate. The contact block is provided with a through hole, and the contact block is slidably connected to the auxiliary cross bar through the through hole. When the contact block slides, it can support one end of the support plate and also play a limiting role.

[0011] Preferably, in order to facilitate the synchronous driving of the movement of the support plate, the power mechanism includes a power motor fixed to the side wall of the horizontal plate body through a seat body, the bottom of the horizontal plate body is rotatably clamped with a power shaft through a support plate, the power shaft is connected to the output shaft of the power motor, a power gear is fixed on the power shaft corresponding to the bottom of the support plate, a power channel is opened on the horizontal plate body corresponding to the rack plate, an upper transmission gear whose outer wall is meshed with the rack plate is rotatably installed between the inner walls of the power channel, a relay gear is rotatably installed in the power channel, and the outer wall of the relay gear is meshed with the power gear and the upper transmission gear.

[0012] Preferably, in order to facilitate the smooth descent of the pallet to place the wafer on the conveyor belt, the lower transport assembly includes two parallel conveyor belts, the conveyor belts are connected between the rotating rollers, the pallet is provided with three, and the conveyor belts can be located in the gap between the pallets when the lifting frame descends, and the cross plate is located between the inner wall of the protective box and the conveyor belt, so that the wafer can be blocked by the conveyor belt, thereby realizing the transfer and placement of the wafer, the rotating roller is installed on the bottom of the protective box through the mounting plate on one side, and a driving mechanism is fixed on the bottom of the protective box in the middle position of the conveyor belt, and the driving mechanism located in the center of the conveyor belt can avoid blocking the descent of the pallet.

[0013] Preferably, in order to facilitate the stable transportation of the wafers placed on the conveyor belt, the driving mechanism includes a driving motor fixed to one side of the conveyor belt through a vertical plate, a driving wheel is fixed to the output shaft of the driving motor, the outer wall of the driving wheel is in contact with the lower conveyor belt, an upper abutment wheel is rotatably mounted on the vertical plate, the upper abutment wheel is in contact with the bottom of the lower conveyor belt, and in actual use, gears can be provided on the outer wall of the driving wheel and teeth can be provided on the inner wall of the conveyor belt, thereby facilitating the precise movement of the conveyor belt.

[0014] Preferably, in order to perform auxiliary cleaning on the wafer and better utilize the protective environment in the protection box, a bevel gear extending to one side of the conveyor belt is fixed on the output shaft of the driving motor, and a cleaning mechanism is fixed to the bottom of the upper cover plate, and the cleaning mechanism includes a ring plate shell, and a vertical notch is fixed to the side wall of the ring plate shell; a tube body is rotatably clamped at the bottom of the upper cover plate, a transverse tube is provided at the bottom of the transverse tube, and an ejection hole is provided at the bottom of the transverse tube; the top of the tube body extends to above the upper cover plate, and a force-bearing wheel is provided on the outer wall of the tube body; a transmission rod is rotatably installed on the upper cover plate, and the bottom end of the transmission rod is dynamically connected to the bevel gear, and the top end of the transmission rod is dynamically connected to the force-bearing wheel through a transmission belt.

[0015] Preferably, in order to improve the usability of the device, the bottom of the protection box is connected to a discharge pipe, which is used to extract the gas in the protection box when needed, and the tube body is connected to an external high-pressure protection gas source.

[0016] The beneficial effects of the present invention are as follows: the transport device can be conveniently transported between two locations, placed on one side of the lithography machine or integrated in the lithography machine, reducing unnecessary occupation of space, the mobile frame can reciprocate between the two ends of the transport rail, and when the wafer on the transport assembly needs to be placed on the lower transport assembly, the lifting telescopic rod is extended so that the bottom plate can drive the transport assembly to descend, and the horizontal plate body is located between the inner wall of the protection box and the lower transport assembly, so that the horizontal plate body can be prevented from being blocked, and then the wafer on the pallet can be stably placed on the lower transport assembly, the power motor can control the position of the pallet, and can perform moving and lifting movements, further facilitating the transfer and placement of the wafers; When placing the wafer, the contact block on the pallet is brought close to the horizontal plate, and a detection device can be set on the bottom plate to perform appearance detection on the placed wafer, and then the power motor can drive the pallet and the wafer to move above the protection box, and then the lifting and telescopic rod is extended to make the pallet descend, and the pallet continues to descend so that the wafer is completely placed on the conveyor belt. At this time, the driving motor drives the conveyor belt to move, and then the wafer can be transported. After being transported to the target location, the lifting frame is still required to cooperate with the transfer component to lift the wafer out of the protection box, and protective gas can be introduced into the protection box, especially when the wafer needs to be temporarily stored, it can protect the wafer from being oxidized and damaged; When the lower transport assembly is in use, the driving motor drives the transport belt to move, and the wafer is transported, and the transmission rod can be driven to rotate by the bevel gear, and then the tube body is driven to rotate through the transmission belt. When the wafer moves, the horizontal tube rotates above the wafer and sprays a clean airflow. The airflow preferably uses an inert gas to clean the surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the lifting frame structure of the present invention.

[0019] Figure 3 It is a schematic diagram of the support plate structure of the present invention.

[0020] Figure 4 It is a schematic diagram of the bottom structure of the support plate of the present invention.

[0021] Figure 5 It is a schematic diagram of the auxiliary cross bar structure of the present invention.

[0022] Figure 6 for Figure 5 Schematic diagram of the enlarged structure at point A in the middle.

[0023] Figure 7 It is a schematic diagram of the upper transmission gear structure of the present invention.

[0024] Figure 8 It is a schematic diagram of the structure of the protection box of the present invention.

[0025] Fig. 9 This is a schematic diagram of the structure of the lower transport component of the present invention.

[0026] Fig.10 It is a schematic diagram of the driving mechanism structure of the present invention.

[0027] Fig.11 It is a schematic diagram of the cleaning mechanism structure of the present invention.

[0028] Explanation of the reference numerals: In the figure: 1, transport rail; 2, lifting frame; 201, parallel plate; 202, lifting telescopic rod; 203, bottom plate; 204, guide column; 3, transfer assembly; 301, horizontal plate body; 302, support plate; 303, clamping groove; 304, limit block; 305, contact block; 306, auxiliary support block; 307, auxiliary cross bar; 4, power mechanism; 401, power motor; 402, power shaft; 403, power gear Wheel; 404, upper transmission gear; 405, relay gear; 5, protection box; 501, upper cover plate; 502, discharge pipe; 6, lower transport assembly; 601, transport belt; 602, rotating roller; 7, driving mechanism; 701, driving motor; 702, driving wheel; 703, upper abutment wheel; 704, bevel gear; 8, cleaning mechanism; 801, ring plate shell; 802, tube body; 803, cross tube; 804, transmission rod; 805, transmission belt. DETAILED DESCRIPTION

[0029] The present invention will be further described below in conjunction with the accompanying drawings: like Figure 1-Figure 11As shown, this embodiment provides a wafer conveying device for a photolithography machine, including a transport guide rail 1 fixed to an external support structure, a lifting frame 2 is slidably installed at the bottom of the transport guide rail 1, and the lifting frame 2 can be moved at the bottom of the transport slide rail by a power device, which is not drawn in the accompanying drawings. The lifting frame 2 is used to control the up and down movement of the transfer component 3, and when fast and direct transportation is required, the power device directly controls the horizontal movement of the lifting frame 2. When the photolithography machine is running, it is necessary to transport wafers from a storage device or a previous device, and the transportation device needs to be placed between the wafer source and the photolithography machine, and does not need to occupy extra space. The bottom of the lifting frame 2 is fixed with a The transfer assembly 3 includes a transverse plate body 301, on which a pallet 302 is slidably connected, and there are three pallets 302 in total. The pallet 302 is used to directly support the wafer, and the pallets 302 on both sides can increase the width to further facilitate the support of the wafer. A power mechanism 4 for controlling the sliding of the pallet 302 is installed at the bottom of the transverse plate body 301. The power mechanism 4 is used to control the position of the pallet 302 on the transverse plate. One end of the transport guide rail 1 is located above the transfer location, and the other end is located above the target location. A protective box 5 is provided below the transport guide rail 1. The protective box 5 is used to provide a storage environment for the transportation of the wafer and can be transported. The protection box 5 needs to be connected to the photolithography machine and the source of external wafers, just like the transport rail 1. An upper cover plate 501 is fixed on the protection box 5, and the upper cover plate 501 can facilitate the protection and shielding of the internal wafers. A lower transport component 6 is fixed at the bottom of the protection box 5, and the lower transport component 6 is used to transport the wafers and can protect and store some wafers. Power supply connectors are provided on the protection box 5 and the lifting frame 2. The mobile frame includes a parallel plate 201. The top of the parallel plate 201 is slidably connected to the bottom of the transport rail 1 through a slider. A lifting telescopic rod 202 is fixed on the parallel plate 201. The bottom end of the lifting telescopic rod 202 passes through the parallel plate 201, and the lifting telescopic rod 20 2 is fixed with a bottom plate 203 at the bottom end, and a guide column 204 is fixed on the bottom plate 203. The top of the guide column 204 passes through the parallel plate 201 and extends upward, so that the structure of the mobile frame is more stable when in use. When in use, the mobile frame can reciprocate between the two ends of the transport guide rail 1. When the wafer on the transfer assembly 3 needs to be placed on the lower transport assembly 6, the lifting telescopic rod 202 is extended so that the bottom plate 203 can drive the transfer assembly 3 to descend, and the horizontal plate body 301 is located between the inner wall of the protection box 5 and the lower transport assembly 6, so that the horizontal plate body 301 can be prevented from being blocked, and then the wafer on the support plate 302 can be stably placed on the lower transport assembly 6.

[0030] The side wall of the support plate 302 is provided with a snap-in groove 303, and the snap-in groove 303 runs through the support plate 302. A limit block 304 is fixed on the upper surface of the cross plate body 301, and the side wall portion of the limit block 304 slides and is snapped into the snap-in groove 303, which can facilitate limiting the sliding of the support plate 302. A rack plate is fixed to the bottom of the support plate 302, and the bottom of the support plate 302 is fitted with the cross plate body 301. A top surface notch allowing the rack plate to pass is provided on the cross plate body 301, and an auxiliary support block 306 extending to the bottom of the support plate 302 is fixed on the side wall of the cross plate body 301. The top surface notch runs through the cross plate body 301 and the auxiliary support block 306. The auxiliary support block 306 can The auxiliary support block 306 is fixed with an auxiliary cross bar 307 on the side wall, and a contact block 305 is fixed with a contact block 305 at the bottom of the support plate 302. The contact block 305 is provided with a through hole, and the contact block 305 is slidably connected to the auxiliary cross bar 307 through the through hole. When the contact block 305 slides, it can support one end of the support plate 302, and it can also play a limiting role, which can further improve the stable operation of the support plate 302. The power mechanism 4 includes a power motor 401 fixed to the side wall of the horizontal plate body 301 through a seat body, and the bottom of the horizontal plate body 301 is connected with a power motor 401 through a support plate. The power shaft 402 is connected to the output shaft of the power motor 401, a power gear 403 is fixed on the power shaft corresponding to the lower side of the support plate 302, a power channel is provided on the horizontal plate body 301 corresponding to the rack plate, an upper transmission gear 404 whose outer wall and the rack plate are meshed is rotatably installed between the inner walls of the power channel, a relay gear 405 is rotatably installed in the power channel, the outer wall of the relay gear 405 is meshed with the power gear 403 and the upper transmission gear 404, so that the support plate 302 can be driven to move synchronously, and since the clamping groove 303 runs through the support plate 302, the support plate 302 can slide in both directions, and when sliding in the reverse direction, it is close to the outside Placing equipment can reduce the occupation of external space and avoid affecting the setting space of external equipment. When in use, the power motor 401 drives the relay gear 405 to rotate through the power shaft 402, and then drives the pallet 302 to move through the upper transmission gear 404, so as to achieve the effect of controlling the position of the pallet 302. When placing the chip, the contact block 305 on the pallet 302 is close to the cross plate, and the detection equipment can be set on the bottom plate 203 to perform appearance detection on the placed chip, and then the power motor 401 can drive the pallet 302 and the chip to move above the protective box 5, and then the lifting telescopic rod 202 is extended to make the pallet 302 descend.

[0031] The lower transport assembly 6 includes two parallel conveyor belts 601, which are connected between rotating rollers 602. The pallets 302 are provided with three conveyor belts 601. When the lifting frame 2 descends, the conveyor belt 601 can be located in the gap between the pallets 302, and the cross plate is located between the inner wall of the protection box 5 and the conveyor belt 601, so that the wafer can be blocked by the conveyor belt 601, thereby realizing the transfer and placement of the wafer. The rotating roller 602 is installed on the bottom of the protection box 5 through a mounting plate on one side. A driving mechanism 7 is fixed on the bottom of the protection box 5 in the middle position of the conveyor belt 601. The driving mechanism 7 located at the center of the conveyor belt 601 can avoid blocking the descent of the pallet 302, so that the pallet 302 can be smoothly descended to place the wafer on the conveyor belt 601. The driving mechanism 7 includes a driving mechanism fixed to one side of the conveyor belt 601 through a vertical plate. The driving motor 701 has a driving wheel 702 fixed on its output shaft, the outer wall of the driving wheel 702 is in contact with the lower conveyor belt 601, an upper wheel 703 is rotatably mounted on the vertical plate, the upper wheel 703 is in contact with the bottom of the lower conveyor belt 601, and in actual use, gears can be provided on the outer wall of the driving wheel 702 and teeth can be provided on the inner wall of the conveyor belt 601, so as to facilitate the precise movement of the conveyor belt 601, so as to facilitate the stable transportation of the wafers placed on the conveyor belt 601, after the wafers on the pallet 302 contact the conveyor belt 601, the pallet 302 continues to descend so that the wafers are completely placed on the conveyor belt 601, at this time, the driving motor 701 drives the conveyor belt 601 to move, so that the wafers can be transported, and after being transported to the target location, the lifting frame 2 is still required to cooperate with the transfer assembly 3 to lift the wafers out of the protective box 5.

[0032] A bevel gear 704 extending to one side of the conveyor belt 601 is fixed on the output shaft of the driving motor 701. When the driving motor 701 is running, the bevel gear 704 can be driven to rotate. A cleaning mechanism 8 is fixed to the bottom of the upper cover plate 501. The cleaning mechanism 8 includes a ring plate shell 801. A vertical notch is fixed on the side wall of the ring plate shell 801. A tube body 802 is rotatably connected to the bottom of the upper cover plate 501. A transverse tube 803 is provided at the bottom of the tube body 802. A spray hole is provided at the bottom of the transverse tube 803. The top of the tube body 802 extends to the top of the upper cover plate 501, and a force-bearing wheel is provided on the outer wall of the tube body 802. A transmission rod 804 is rotatably installed on the upper cover plate 501. The bottom end of the transmission rod 804 is dynamically connected to the bevel gear 704. The top of the transmission rod 804 is connected to the transmission belt 8 05 is dynamically connected to the force wheel, so that auxiliary cleaning of the wafer can be performed, and the protective environment in the protective box 5 can be better utilized. The bottom of the protective box 5 is connected to an exhaust pipe 502, and the exhaust pipe 502 is used to extract the gas in the protective box 5 when needed. The tube body 802 is connected to an external high-pressure protective gas source, which can improve the usability of the device. When the lower transport component 6 is used, the driving motor 701 drives the conveyor belt 601 to move, and the wafer is transported, and the transmission rod 804 can be driven to rotate by the bevel gear 704, and then the tube body 802 is driven to rotate through the transmission belt 805. Then, when the wafer moves, the cross tube 803 rotates above the wafer and sprays a clean airflow. The airflow preferably uses an inert gas, and the airflow is used to clean the surface of the wafer.

[0033] The transport device can be conveniently transferred between two locations and can be placed on one side of the lithography machine or integrated into the lithography machine, reducing unnecessary occupation of space. It can also be moved and lifted to further facilitate the transfer and placement of the wafers. Protective gas can be introduced into the protective box 5, especially when the wafers need to be temporarily stored, to protect the wafers from being damaged by oxidation.

[0034] The mobile frame can reciprocate between the two ends of the transport guide rail 1. When the wafer on the transfer assembly 3 needs to be placed on the lower transport assembly 6, the lifting telescopic rod 202 is extended so that the bottom plate 203 can drive the transfer assembly 3 to descend, and the horizontal plate body 301 is located between the inner wall of the protection box 5 and the lower transport assembly 6, so that the horizontal plate body 301 can be prevented from being blocked, and then the wafer on the pallet 302 can be stably placed on the lower transport assembly 6, and the power motor 401 drives the relay gear 405 to rotate through the power shaft 402, and then drives the pallet 302 to move through the upper transmission gear 404, so as to achieve the effect of controlling the position of the pallet 302. When placing the wafer, the contact block 305 on the pallet 302 is brought close to the horizontal plate, and a detection device can be set on the bottom plate 203 to perform an appearance inspection on the placed wafer, and then the power motor 401 can drive the pallet 302 and the wafer to move above the protective box 5, and then the lifting and telescopic rod 202 is extended to make the pallet 302 descend, and the pallet 302 continues to descend so that the wafer is completely placed on the conveyor belt 601. At this time, the driving motor 701 drives the conveyor belt 601 to move, so that the wafer can be transported. After being transported to the target location, the lifting frame 2 is still required to cooperate with the transfer component 3 to lift the wafer out of the protective box 5.

[0035] When the lower transport component 6 is in use, the driving motor 701 drives the transport belt 601 to move, and the wafer is transported, and the transmission rod 804 can be driven to rotate by the bevel gear 704, and then the tube body 802 is driven to rotate through the transmission belt 805. Then, when the wafer moves, the cross tube 803 rotates above the wafer and sprays a clean airflow. The airflow preferably uses an inert gas to clean the surface of the wafer.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention shall be defined by the attached claims and their equivalents.

Claims

1. A wafer conveying device for a photolithography machine, comprising a transport rail (1) fixed to an external support structure, a lifting frame (2) being slidably mounted on the bottom of the transport rail (1), the lifting frame (2) being capable of being moved at the bottom of the transport rail by a power device, characterized in that: A transfer assembly (3) is fixed to the bottom of the lifting frame (2) via an intermediate column. The transfer assembly (3) comprises a horizontal plate body (301). A support plate (302) is slidably engaged with the horizontal plate body (301). There are three support plates (302) in total. A power mechanism (4) for controlling the sliding of the support plates (302) is installed at the bottom of the horizontal plate body (301). One end of the transport guide rail (1) is located above the transfer location, and the other end is located above the target location. A protection box (5) is provided below the transport guide rail (1). An upper cover plate (501) is fixed to the top of the protection box (5). A lower transport assembly (6) is fixed to the bottom of the protection box (5). Power supply connectors are provided on the protection box (5) and the lifting frame (2).

2. The wafer conveying device of the photolithography machine according to claim 1, characterized in that: The mobile frame comprises a parallel plate (201), the top of the parallel plate (201) is slidably clamped to the bottom of the transport guide rail (1) via a slider, a lifting and telescopic rod (202) is fixed on the parallel plate (201), the bottom end of the lifting and telescopic rod (202) passes through the parallel plate (201), and a bottom plate (203) is fixed to the bottom end of the lifting and telescopic rod (202), a guide column (204) is fixed on the bottom plate (203), and the top end of the guide column (204) passes through the parallel plate (201) and extends upward.

3. The wafer conveying device of the lithography machine according to claim 1, characterized in that: A clamping groove (303) is provided on the side wall of the support plate (302), and the clamping groove (303) passes through the support plate (302). A limiting block (304) is fixed on the upper surface of the transverse plate body (301), and a side wall portion of the limiting block (304) is slidably clamped into the clamping groove (303).

4. The wafer conveying device for a photolithography machine according to claim 1, characterized in that: A rack plate is fixed to the bottom of the support plate (302), the bottom of the support plate (302) is in contact with the horizontal plate body (301), a top surface notch is provided on the horizontal plate body (301) to allow the rack plate to pass through, an auxiliary support block (306) is fixed to the side wall of the horizontal plate body (301) and extends to the bottom of the support plate (302), and the top surface notch passes through the horizontal plate body (301) and the auxiliary support block (306).

5. The wafer conveying device for a photolithography machine according to claim 4, characterized in that: An auxiliary cross bar (307) is fixed on the side wall of the auxiliary support block (306), a contact block (305) is fixed on the bottom of the support plate (302), a through hole is provided on the contact block (305), and the contact block (305) is slidably connected to the auxiliary cross bar (307) through the through hole.

6. The wafer conveying device for a photolithography machine according to claim 5, characterized in that: The power mechanism (4) comprises a power motor (401) fixed to the side wall of the horizontal plate body (301) via a seat body, a power shaft (402) is rotatably clamped at the bottom of the horizontal plate body (301) via a support plate, the power shaft (402) is connected to the output shaft of the power motor (401), a power gear (403) is fixed on the power shaft below the support plate (302), a power channel is provided on the horizontal plate body (301) corresponding to the rack plate, an upper transmission gear (404) whose outer wall is meshed with the rack plate is rotatably mounted between the inner walls of the power channel, a relay gear (405) is rotatably mounted in the power channel, and the outer wall of the relay gear (405) is meshed with the power gear (403) and the upper transmission gear (404).

7. The wafer conveying device for a photolithography machine according to claim 1, characterized in that: The lower transport assembly (6) comprises two parallel transport belts (601), wherein the transport belts (601) are connected between rotating rollers (602), and the rotating rollers (602) are mounted on the bottom of the protection box (5) via a mounting plate on one side, and a driving mechanism (7) is fixed on the bottom of the protection box (5) in the middle of the transport belts (601).

8. The wafer conveying device of the photolithography machine according to claim 7, characterized in that: The driving mechanism (7) comprises a driving motor (701) fixed to one side of the conveyor belt (601) via a vertical plate, a driving wheel (702) being fixed to an output shaft of the driving motor (701), an outer wall of the driving wheel (702) being in contact with the lower conveyor belt (601), an upper abutting wheel (703) being rotatably mounted on the vertical plate, and the upper abutting wheel (703) being in contact with the bottom of the lower conveyor belt (601).

9. The wafer conveying device of the photolithography machine according to claim 8, characterized in that: A bevel gear (704) extending to one side of the conveyor belt (601) is fixed on the output shaft of the driving motor (701); a cleaning mechanism (8) is fixed on the bottom of the upper cover plate (501); the cleaning mechanism (8) comprises a ring plate shell (801); a vertical notch is fixed on the side wall of the ring plate shell (801); a tube body (802) is rotatably clamped at the bottom of the upper cover plate (501); a horizontal tube (803) is provided at the bottom end of the tube body (802); The bottom of the transverse tube (803) is provided with a spray hole, the top end of the tube body (802) extends above the upper cover plate (501), and a force-bearing wheel is provided on the outer wall of the tube body (802), a transmission rod (804) is rotatably mounted on the upper cover plate (501), the bottom end of the transmission rod (804) is dynamically connected to the bevel gear (704), and the top end of the transmission rod (804) is dynamically connected to the force-bearing wheel via a transmission belt (805).

10. The wafer conveying device of the photolithography machine according to claim 9, characterized in that: The bottom of the protection box (5) is connected to a discharge pipe (502), and the pipe body (802) is connected to an external high-pressure protection gas source.

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