Novel microelectronic component detection equipment

Abstract

The invention provides novel microelectronic component detection equipment. The novel microelectronic component detection equipment comprises an equipment base, the track is arranged on the equipment base, a new material feeding port and an old material feeding port are formed in the two sides of the track respectively, new and old microelectronic devices are conveyed from two directions respectively, and the conveying directions are located on the same straight line; the material receiving unit is mounted on the equipment base and is close to the middle position of the track; the new material detection unit and the old material feeding unit are both installed on the equipment base and located on the two sides of the material receiving unit correspondingly. A probe is arranged in the new material detection unit, and the capacitance value and the resistance value of each passing microelectronic device are tested through the probe. According to the invention, the CCD camera and the probe are used for identifying the overall dimension of the received new microelectronic component, the capacitance value and the resistance value are detected, and meanwhile, the new microelectronic component is matched with the old material for connection and is quickly identified, so that the material receiving accuracy is effectively improved, and the condition of performance failure of the memory module product is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor memory module product manufacturing, in particular to the field of capacitance and resistance detection technology, and specifically to a novel microelectronic component detection equipment. Background Art

[0002] In the manufacturing of semiconductor memory module products, the accurate use of each microelectronic component is crucial. The outer packaging of microelectronic components has corresponding information marked on it. When the actual capacitance / resistance of the electronic component does not match the capacitance / resistance required by the memory module manufacturing, the manufacturing equipment cannot detect it in time, resulting in the risk of product performance failure; specifically, the following issues are involved:

[0003] 1. Before using microelectronic components, it is impossible to find that the actual capacitance / resistance value is inconsistent with the packaging label. When abnormal performance is found during post-process testing, the batch of products has been completed, causing a large number of memory sticks to be scrapped.

[0004] 2. Capacitance / resistance testing of microelectronic components: It is impossible to determine whether the connection between new and old materials is consistent. It is necessary to compare the measured values ​​of the microelectronic components before and after replacement to ensure consistency.

[0005] 3. The test value comparison data cannot be quickly queried and confirmed, cannot be transmitted to the computer, and the usage history cannot be analyzed and confirmed in time. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a novel microelectronic component detection equipment to solve the difficulties of the prior art.

[0007] To achieve the above-mentioned and other related purposes, the present invention provides a novel microelectronic component detection equipment, comprising:

[0008] Equipment base 1;

[0009] Track 2, the track 2 is opened on the equipment base 1, and the two sides of the track 2 are respectively a new material feed port 3 and an old material feed port 4, which transfer new and old microelectronic components from two directions respectively, and the transfer directions are on the same straight line;

[0010] A material receiving unit, which is installed on the equipment base 1 and close to the middle position of the track 2;

[0011] A new material detection unit and an old material feeding unit 5, both of which are installed on the equipment base 1 and are respectively arranged on both sides of the material receiving unit, and the new material detection unit, the old material feeding unit 5 and the material receiving unit share the same track 2;

[0012] The new material detection unit is provided with a probe 13, through which the capacitance and resistance of each microelectronic component passing through is tested.

[0013] According to a preferred embodiment, a conveyor chain 6 is installed at the bottom of the track 2 .

[0014] According to the preferred embodiment, the new material detection unit includes:

[0015] An auxiliary module 7, wherein a viewing hole 8 is formed on the auxiliary module 7;

[0016] A mobile unit, wherein the auxiliary module 7 is connected to the mobile unit and moves toward or away from the microelectronic component through a driving motor 9 in the mobile unit;

[0017] A downward pressing guide post 10, wherein the downward pressing guide post 10 is arranged above the auxiliary module 7 through a bracket, and the downward pressing guide post 10 is driven by a downward pressing motor 11 to move downward and abut against the rear end of the auxiliary module 7;

[0018] A number one CCD camera 12, wherein the number one CCD camera 12 is mounted above the track 2 through a bracket. When the auxiliary module 7 below moves to below the number one CCD camera 12, the number one CCD camera 12 photographs the microelectronic components through the viewing hole 8;

[0019] The probe 13 is installed on the discharge end of the first CCD camera 12 through a slider 14 and is also located directly above the track 2. The slider 14 drives the probe 13 to move up and down through a cylinder.

[0020] According to a preferred embodiment, the probe 13 is electrically connected to a computer system.

[0021] According to a preferred embodiment, the mobile unit comprises:

[0022] Driving motor 9;

[0023] A screw rod 15, wherein the screw rod 15 is mounted on the driving motor 9, and the screw rod 15 is arranged parallel to the auxiliary module 7;

[0024] A connecting block 16, one end of which is sleeved on the screw rod 15, and the other end of which is connected to the end of the auxiliary module 7 away from the track 2;

[0025] The guide rail 17 , the connecting block 16 is located directly below the screw rod 15 and is installed on the guide rail 17 through a slider, and the guide rail 17 is arranged parallel to the auxiliary module 7 .

[0026] According to a preferred solution, sensors 18 are also provided on the side of the guide rail 17 corresponding to the beginning and end of the connecting block 16 .

[0027] According to a preferred solution, a second CCD camera 19 is installed in the waste material feeding unit 5 , and the camera head of the second CCD camera 19 is located above the track 2 .

[0028] According to a preferred embodiment, a probe is also installed in the scrap material feeding unit 5 to detect the capacitance and resistance of the microelectronic components passing through the track 2 in the scrap material feeding unit 5 .

[0029] According to a preferred embodiment, the material receiving unit comprises:

[0030] A coil material strip mounting frame 20, on which a connecting material strip is mounted;

[0031] A guide groove 21, which is horizontally arranged on the discharge end of the coil material belt mounting frame 20, and has a through groove formed inside for feeding the material belt;

[0032] A flat pressing block 22, wherein the flat pressing block 22 is installed on the guide groove 21, and a gap is formed between the bottom of the flat pressing block 22 and the guide groove 21 for the material strip to pass through;

[0033] The fixed pressing unit is arranged above the guide groove 21, and the pressing block 24 is driven by the pressing motor 23 to press against the material receiving end of the new and old microelectronic components.

[0034] According to a preferred embodiment, the fixed pressing unit comprises:

[0035] Compressing motor 23;

[0036] The rotating shaft 25 is arranged in a stepped shape, one end of which is mounted on the clamping motor 23, and the rotating shaft 25 is driven by the clamping motor 23 to rotate;

[0037] A lower pressing block 24, which is also arranged in a stepped shape, with one end close to the clamping motor 23 connected to the end of the rotating shaft 25, and the other end extending downward to form a lower pressing end 26, and the lower pressing end 26 is arranged directly above the track 2;

[0038] The first guide block 27 , the side of the pressing block 24 close to the waste material feeding unit 5 moves along the vertical slideway 28 through the first guide block 27 .

[0039] According to the preferred embodiment, a No. 2 guide block 29 is installed on the side of the equipment base 1 close to the track 2, and a vertical through groove 30 is opened on the side of the No. 2 guide block 29 close to the lower pressure block 24. The lower pressure end 26 of the lower pressure block 24 is embedded in the vertical through groove 30, and moves toward or away from the track 2 as the clamping motor 23 is driven.

[0040] The present invention uses a CCD camera and a probe to identify the outline size of the received new microelectronic components, perform capacitance and resistance detection, and simultaneously match them with old materials for connection to quickly identify them, thereby effectively improving the accuracy of material connection and avoiding performance failure of memory module products.

[0041] The best embodiment for carrying out the present invention will be described in more detail below with reference to the accompanying drawings so that the features and advantages of the present invention can be easily understood. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 Shown is a schematic diagram of the three-dimensional structure of the present invention;

[0043] Figure 2 Shown is an enlarged schematic diagram of the three-dimensional structure of the new material detection unit in the present invention;

[0044] Figure 3 Shown is an enlarged schematic diagram of a partial three-dimensional structure of a new material detection unit in the present invention;

[0045] Figure 4 Shown is a schematic diagram of a three-dimensional structure from another viewing angle of the present invention;

[0046] Figure 5 Shown is an enlarged schematic diagram of a partial three-dimensional structure of a material receiving unit in the present invention;

[0047] Description of symbols

[0048] 1. Equipment base; 2. Track; 3. New material feed port; 4. Old material feed port; 5. Old material feeding unit; 6. Conveyor chain; 7. Auxiliary module; 8. Viewing hole; 9. Driving motor; 10. Downward pressure guide column; 11. Downward pressure motor; 12. No. 1 CCD camera; 13. Probe; 14. Slider; 15. Screw; 16. Connecting block; 17. Guide rail; 18. Sensor; 19. No. 2 CCD camera; 20. Coil material belt mounting bracket; 21. Guide groove; 22. Flat pressure block; 23. Clamping motor; 24. Downward pressure block; 25. Rotating shaft; 26. Downward pressure end; 27. No. 1 guide block; 28. Vertical slideway; 29. ​​No. 2 guide block; 30. Vertical through groove. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same parts. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of the present invention may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0051] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons of ordinary skill in the field to which the present invention belongs. The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not necessarily indicate a quantity limitation. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0052] Therefore, it is very important to develop new microelectronic component detection equipment and compare it with the computer system. When an error occurs, the manufacturing equipment stops working to prevent the performance failure of memory module products caused by abnormal capacitance / resistance.

[0053] The present invention proposes a novel microelectronic component detection equipment, which is used in the microelectronic component capacitance / resistance detection process. The present invention does not limit the type of microelectronic components, but the novel microelectronic component detection equipment structure is particularly suitable for the demand for connecting new and old materials of memory module products.

[0054] In general, the novel microelectronic component detection equipment proposed in the present invention mainly includes an equipment base 1, a track 2, a material receiving unit, a new material detection unit and an old material feeding unit 5. Figure 1 , which shows the arrangement relationship of the equipment base 1, the track 2, the material receiving unit, the new material detection unit and the old material feeding unit 5.

[0055] In order to prevent the performance failure of memory module products caused by abnormal capacitance / resistance, the problems in the background technology that the actual capacitance / resistance of microelectronic components cannot be found to be inconsistent with the packaging label before use, and when the performance abnormality is found during the post-process operation test, the batch of products has been completed, causing a large number of memory sticks to be scrapped; the capacitance / resistance detection of microelectronic components cannot determine whether the connection between the new and old materials is consistent, and the measured values ​​of the microelectronic components before and after replacement must be consistent; the test value comparison data cannot be quickly queried and confirmed, cannot be transmitted to the computer, and cannot be timely analyzed and confirmed in terms of the usage history. Therefore, in the technical solution provided in this embodiment, the received new microelectronic components are used with a CCD camera and a probe to identify the outline dimensions of the microelectronic components, perform capacitance and resistance detection, and match them with the old materials used for connection for rapid identification, thereby effectively improving the accuracy of material connection and avoiding the occurrence of performance failure of memory module products.

[0056] like Figure 1 As shown, a material receiving unit, a new material detection unit and an old material feeding unit 5 are installed on the equipment base 1, wherein the new material detection unit and the old material feeding unit 5 are respectively arranged on both sides of the material receiving unit. Figure 4 As shown, a concave track 2 is provided on one side of the equipment base 1 and is transmitted by a transmission chain 6. The two sides of the track 2 are respectively a new material feed port 3 and an old material feed port 4. It passes under a new material detection unit, a material receiving unit and an old material feeding unit 5 in sequence, thereby realizing the transmission of new and old microelectronic components from two directions respectively. The transmission directions are in the same straight line, and the material receiving effect is achieved under the material receiving unit.

[0057] Since the new material detection unit provided in this embodiment can perform material identification and capacitance and resistance measurement on the input new microelectronic components, errors in components before input can be avoided and batch defects can be avoided. To this end, the new material detection unit uses a No. 1 CCD camera 12 to identify the outline dimensions of the microelectronic components, and the connected computer module end calculates the detection points and selects matching detection probes. A probe 13 is also configured to extend for capacitance and resistance detection.

[0058] For this reason, Figure 2As shown, the No. 1 CCD camera 12 is installed above the track 2 through a bracket, and a movable auxiliary module 7 for pressing and positioning new microelectronic components is arranged below the No. 1 CCD camera 12. The auxiliary module 7 is connected to the mobile unit and is moved toward or away from the microelectronic component by a driving motor 9 in the mobile unit. After moving into position, the pressing motor 11 drives the pressing guide column 10 to move downward and abut against the rear end of the auxiliary module 7 to prevent shaking when the No. 1 CCD camera 12 is shooting. Considering that the No. 1 CCD camera 12 should avoid the influence of adjacent structures when shooting, a viewing hole 8 is opened on the auxiliary module 7 for this purpose, and the viewing hole 8 is used to limit the shooting range of the No. 1 CCD camera 12. Only objects within this range are detected objects. When the auxiliary module 7 below moves to below the No. 1 CCD camera 12, the No. 1 CCD camera 12 shoots the microelectronic component through the viewing hole 8.

[0059] Considering that the moving unit is far away from the microelectronic components, in order to ensure the linearity of the auxiliary module 7 during movement, the moving unit provided in this embodiment adopts a structure in which the drive motor 9 drives the lead screw 15 to drive the connecting block 16, wherein the lead screw 15 is installed on the drive motor 9, and the lead screw 15 is arranged parallel to the auxiliary module 7, one end of the connecting block 16 is sleeved on the lead screw 15, and the other end is connected to the end of the auxiliary module 7 away from the track 2, the connecting block 16 is located directly below the lead screw 15 and is installed on the guide rail 17 through a slider, and the guide rail 17 is arranged parallel to the auxiliary module 7. When moving, since the lead screw 15, the guide rail 17 and the auxiliary module 7 are all arranged in parallel, the linearity of the moving process can be effectively guaranteed; in addition, a sensor 18 is also arranged on the side of the guide rail 17 corresponding to the beginning and end of the connecting block 16, which can quickly feedback the moving stroke, avoid the occurrence of excessive movement of the auxiliary module 7, and improve the accuracy of detection and measurement;

[0060] It should be specifically explained that a probe 13 is provided in the new material detection unit, and the capacitance and resistance of each microelectronic component passing through the probe 13 are tested. The probe 13 test is located behind the shooting of the No. 1 CCD camera 12, so the probe 13 is installed on the discharge end of the No. 1 CCD camera 12 through a slider 14, and is also located directly above the track 2, wherein the slider 14 drives the probe 13 up and down through a cylinder. The probe 13 is extended during operation, and the probe 13 is retracted during non-operation detection. During use, since the No. 1 CCD camera 12 and the probe 13 are electrically connected to the computer system, the detection value of the new microelectronic components can be obtained in real time.

[0061] Similarly, the old microelectronic components used for pairing connection are input through the old material feeding unit 5, and a conveyor chain 6 is also installed in the old material feeding unit 5. The old microelectronic components passing through the old material feeding unit 5 pass through the No. 2 CCD camera 19 and the probe arranged above the track 2 in turn, so as to realize the capacitance and resistance detection of the microelectronic components passing through the track 2 in the old material feeding unit 5, and the No. 2 CCD camera 19 and the probe in this unit are also electrically connected to the computer system, and the actual detection value is obtained in the computer system, and compared with the received required value. When they are consistent, the equipment automatically receives the material, and the equipment can record the receiving status of the material, and stop receiving the material when the values ​​are inconsistent.

[0062] On this basis, the material receiving unit is arranged between the new material detection unit and the old material feeding unit 5, and a fixed pressing unit is installed on the track 2 in the material receiving unit to achieve the purpose of receiving new and old microelectronic components. A guide groove 21 is installed in a direction perpendicular to the track 2, and a coil material tape mounting frame 20 for mounting a connecting material tape is provided on the feeding end of the guide groove 21. A through groove for passing the material tape is formed inside the guide groove 21. In order to make the coil material tape pass through the guide groove 21 to obtain a tensioned and flat effect, a flattening block 22 is installed on the guide groove 21, and a gap for passing the material tape is formed between the bottom of the flattening block 22 and the guide groove 21.

[0063] As mentioned above, by fixing the pressing unit, the connecting ends of the new and old microelectronic components can obtain the effect of pressing down and connecting. For this purpose, the pressing block 24 is arranged in a stepped shape, with one end close to the track 2 forming a pressing end 26, and the other end connected to the rotating shaft 25; the rotating shaft 25 in this embodiment is also arranged in a stepped shape, with one end installed on the clamping motor 23. The rotating shaft 25 is driven by the clamping motor 23 to rotate, thereby driving the pressing block 24 to move toward the track below and apply pressure.

[0064] like Figure 5 As shown, in order to limit the consistency of the moving position of the lower pressing block 24 and avoid offset, on the one hand, the side of the lower pressing block 24 close to the old material feeding unit 5 is moved along the vertical slide 28 through the No. 1 guide block 27, and on the other hand, a No. 2 guide block 29 is installed on the side of the equipment base 1 close to the track 2, and a vertical through groove 30 is provided on the side of the No. 2 guide block 29 close to the lower pressing block 24, and the lower pressing end 26 of the lower pressing block 24 is embedded in the vertical through groove 30. When in use, the lower pressing end 26 can only move in the direction close to or away from the track 2 as driven by the clamping motor 23, thereby achieving a precise connection effect of the lower pressing end 26.

[0065] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A new type of microelectronic component detection equipment, characterized in that: include: Equipment base (1); A track (2), wherein the track (2) is arranged on the equipment base (1), and the two sides of the track (2) are respectively a new material feed port (3) and an old material feed port (4), and the new and old microelectronic components are respectively transferred from two directions, and the transfer directions are on the same straight line; A material receiving unit, the material receiving unit being installed on the equipment base (1) and close to the middle position of the track (2); A new material detection unit and an old material feeding unit (5), wherein the new material detection unit and the old material feeding unit (5) are both mounted on the equipment base (1) and are respectively arranged on both sides of the material receiving unit, and the new material detection unit, the old material feeding unit (5) and the material receiving unit share the same track (2); A probe (13) is provided in the new material detection unit, and the capacitance and resistance of each microelectronic component passing through the probe (13) are tested.

2. The novel microelectronic component detection equipment according to claim 1 is characterized in that: The new material detection unit comprises: an auxiliary module (7), and a viewing hole (8) is provided on the auxiliary module (7); A mobile unit, wherein the auxiliary module (7) is connected to the mobile unit and moves toward or away from the microelectronic component via a driving motor (9) in the mobile unit; A downward pressing guide column (10), wherein the downward pressing guide column (10) is arranged above the auxiliary module (7) through a bracket, and the downward pressing guide column (10) is driven by a downward pressing motor (11) to move downward and abut against the rear end of the auxiliary module (7); A number one CCD camera (12), wherein the number one CCD camera (12) is installed above the track (2) via a bracket, and when the auxiliary module (7) below moves to below the number one CCD camera (12), the number one CCD camera (12) photographs the microelectronic component through the viewing hole (8); The probe (13) is installed on the discharge end of the first CCD camera (12) through a slider (14) and is also arranged directly above the track (2). The slider (14) drives the probe (13) to move up and down through a cylinder.

3. The novel microelectronic component detection equipment according to claim 2 is characterized in that: The mobile unit comprises: A driving motor (9); A screw rod (15), wherein the screw rod (15) is mounted on the driving motor (9), and the screw rod (15) is arranged parallel to the auxiliary module (7); A connecting block (16), one end of which is sleeved on the screw rod (15), and the other end of which is connected to the end of the auxiliary module (7) away from the track (2); The guide rail (17) is located directly below the screw rod (15) and is mounted on the guide rail (17) via a slider. The guide rail (17) is arranged parallel to the auxiliary module (7).

4. The novel microelectronic component detection equipment according to claim 3 is characterized in that: A second CCD camera (19) is installed in the waste material feeding unit (5), and the camera head of the second CCD camera (19) is located above the track (2).

5. The novel microelectronic component detection equipment according to claim 4 is characterized in that: The material receiving unit comprises: A material coil and strip mounting frame (20), wherein a connecting material strip is mounted on the material coil and strip mounting frame (20); A guide groove (21), the guide groove (21) being horizontally arranged on the discharge end of the coil material strip mounting frame (20), and forming a through groove for the material strip to pass through; A flat pressing block (22), wherein the flat pressing block (22) is installed on the guide groove (21), and a gap is formed between the bottom of the flat pressing block (22) and the guide groove (21) for the material strip to pass through; A fixed pressing unit is arranged above the guide groove (21), and a pressing block (24) is driven by a pressing motor (23) to press against the connecting end of the new and old microelectronic components.

6. The novel microelectronic component detection equipment according to claim 5, characterized in that: The fixed pressing unit comprises: a pressing motor (23); A rotating shaft (25), wherein the rotating shaft (25) is arranged in a stepped shape, one end of which is mounted on the pressing motor (23), and the rotating shaft (25) is driven by the pressing motor (23) to rotate; A lower pressing block (24), the lower pressing block (24) is also arranged in a stepped shape, one end of which is close to the clamping motor (23) and is connected to the end of the rotating shaft (25), and the other end of which extends downward to form a lower pressing end (26), and the lower pressing end (26) is arranged directly above the track (2); A No. 1 guide block (27), the side of the lower pressing block (24) close to the old material feeding unit (5) moves along the vertical slideway (28) through the No. 1 guide block (27).

7. The novel microelectronic component detection equipment according to claim 6, characterized in that: A second guide block (29) is installed on the side of the equipment base (1) close to the track (2), and a vertical through groove (30) is opened on the side of the second guide block (29) close to the lower pressing block (24). The lower pressing end (26) of the lower pressing block (24) is embedded in the vertical through groove (30) and moves towards or away from the track (2) as the clamping motor (23) drives.

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