Carrier plate structure and plastic packaging equipment applying same

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and provides a carrier plate structure and plastic packaging equipment applying the same, the carrier plate structure comprises a carrier plate assembly and a compression ring assembly, the carrier plate assembly comprises a carrier plate main body, the carrier plate main body is provided with a first side and a second side which are oppositely arranged, the compression ring assembly is connected to the first side of the carrier plate main body, and the compression ring assembly comprises a compression ring main body and a convex part; the wafer is loaded in the pressing ring main body, the convex part is connected to the pressing ring main body and is positioned between the pressing ring main body and the wafer, and the convex part is in contact with the wafer when the loading disc structure presses the wafer downwards. The projection part in the carrier plate structure comprises a plurality of bosses, the contact area between the compression ring assembly and the wafer can be effectively reduced through the bosses, the risk that plastic packaging materials scattered on the surface of the wafer make contact with the compression ring assembly and adhere to the compression ring assembly is reduced, and the product quality of the plastic packaging technology is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a carrier structure and a plastic packaging device using the same. Background Art

[0002] In the manufacturing of semiconductors, the plastic encapsulation process is a crucial step in the semiconductor manufacturing process. The protective layer of semiconductor devices is formed by injecting plastic encapsulation materials into the plastic encapsulation mold. In the wafer plastic encapsulation process, plastic encapsulation materials such as solid resin are sprinkled on the surface of the wafer, and then the wafer after the material is sprinkled is transported to the press for the next step of processing. However, during the transportation of the wafer, vibrations often occur, which will cause the plastic encapsulation materials on the surface of the wafer to scatter to the edge of the wafer surface.

[0003] At present, in order to transport the wafer after spreading the material to the press, the plastic sealing equipment is equipped with a loadhand, and an O-ring is set in the loadhand. When the loadhand is used to move the wafer after spreading the material into the mold of the press, the loadhand in the press is designed with a pressing action so that the O-ring presses down the wafer. By using the above-mentioned pressing action, the adsorption effect of the press on the wafer can be guaranteed to be stable and accurate. A good wafer adsorption effect is crucial to prevent the wafer from shifting under high pressure and high temperature environment. However, when the O-ring contacts the plastic sealing material at the edge of the wafer, due to the high temperature environment inside the press, the plastic sealing material may melt and adhere to the O-ring. Due to the plastic sealing process. The O-ring of the loadhand will repeatedly contact different wafers, which will cause contamination to the edge of the wafer in subsequent production, which not only affects the cleanliness of the plastic sealing process, but also may have an adverse effect on the performance of the wafer. Therefore, a new carrier structure and a plastic sealing device using it are urgently needed to solve the above technical problems. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a carrier structure and a plastic packaging device using the same, so as to solve the problem of plastic packaging material scattered on the surface of the wafer adhering to the O-ring in the prior art and improve the quality of the product.

[0005] In order to achieve the above-mentioned purpose and other related purposes, the present application provides a carrier structure, which is used in a plastic packaging device to transport wafers, including a carrier assembly and a pressure ring assembly;

[0006] The carrier assembly includes a carrier body, the carrier body has a first side and a second side arranged opposite to each other, the pressure ring assembly is connected to the first side of the carrier body, includes a pressure ring body and a protrusion, the wafer is loaded in the pressure ring body, the protrusion is connected to the pressure ring body and is located between the pressure ring body and the wafer, and the protrusion contacts the wafer when the carrier structure presses down the wafer.

[0007] Optionally, the pressure ring body is an annular structure, including a coaxially arranged annular body and an annular flange, the annular body is connected to the carrier body, and the annular flange is spaced around the outer side of the protrusion and connected to the side of the annular body away from the carrier body.

[0008] Optionally, the raised portion includes a plurality of bosses, which are spaced apart circumferentially along the annular structure of the annular main body, and a height of the bosses along the axial direction of the pressure ring main body is smaller than a height of the annular flange along the axial direction of the pressure ring main body.

[0009] Optionally, an air flow passage is provided in the pressure ring body, and the air flow passage has a first opening on the radial outer side of the pressure ring body;

[0010] The boss is provided with an air flow hole, the air flow hole is communicated with the air flow passage, and the air flow hole has a second opening on a side of the boss away from the carrier body.

[0011] Optionally, the boss is a cylindrical structure, the diameter of the boss of the cylindrical structure is 2 mm to 3 mm, and the height of the boss is 3 mm to 6 mm.

[0012] Optionally, the boss is a trapezoidal cylindrical structure, and the diameter of the top surface of the boss away from the annular body is smaller than the diameter of the bottom surface of the boss in contact with the annular body; wherein the diameter of the top surface of the boss is 2 mm to 3 mm.

[0013] Optionally, the boss is a trapezoidal cylindrical structure, and the top surface diameter of the boss away from the pressure ring body is larger than the bottom surface diameter of the boss in contact with the pressure ring body; wherein the angle between the outer side surface of the boss of the trapezoidal cylindrical structure and the axis of the boss is less than or equal to 30°.

[0014] Optionally, along the axial direction of the pressure ring body, the boss includes a first cylindrical body and a second cylindrical body coaxially stacked, the bottom surface of the first cylindrical body is connected to the annular body, the top surface of the first cylindrical body contacts and overlaps with the top surface of the second cylindrical body, and the bottom surface diameter of the second cylindrical body is larger than the top surface diameter of the first cylindrical body, and the bottom surface diameter of the first cylindrical body is larger than or equal to the top surface diameter of the first cylindrical body;

[0015] The bottom diameter of the second cylindrical body is 2 mm to 3 mm, and the angle between the outer side surface of the second cylindrical body and its axis is less than or equal to 30°.

[0016] The present application also provides a plastic packaging device, including a material spreading module, a pressing module and a loading module, the loading module including a movable slide rail and a carrier structure as described in any of the above-mentioned embodiments connected to the movable slide rail, the material spreading module is used to spread material on the wafer, and the loading module is used to transport the wafer after spreading material to the pressing module.

[0017] Optionally, the molding equipment also includes an air supply module, which includes an air supply part, an air supply pipeline and an air flow regulating valve, wherein the opposite ends of the air supply pipeline are respectively connected to the air supply part and the first opening of the carrier structure, and the air flow regulating valve is connected to the air supply pipeline to adjust the gas flow of the air supply pipeline.

[0018] As described above, the carrier structure and the plastic packaging equipment using the same provided by the present application have at least the following beneficial effects:

[0019] The carrier structure of the present application includes a carrier body and a pressure ring assembly, wherein a raised portion is provided in the pressure ring assembly, and the raised portion includes a plurality of bosses distributed at intervals in the circumferential direction of the annular body. When the carrier structure presses down the wafer, the contact area between the pressure ring assembly and the wafer can be effectively reduced by utilizing the bosses, thereby reducing the possibility of the plastic sealing material scattered on the surface of the wafer contacting the pressure ring assembly, thereby reducing the risk of the pressure ring assembly adhering to the plastic sealing material, and improving the product yield and product quality in the plastic sealing process; and, air flow holes are provided in the bosses, which can effectively remove the plastic sealing material scattered on the surface of the wafer under the bosses, thereby ensuring that no plastic sealing material particles remain in the contact area between the bosses and the wafer, thereby avoiding the situation where the plastic sealing material adheres to the pressure ring assembly, and improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 Shown is a structural schematic diagram of the carrier structure provided in Example 1 of the present application.

[0022] Figure 2 Shown is a partial structural schematic diagram of the right side of the carrier structure provided in the first embodiment of the present application.

[0023] Figure 3 A bottom view of a pressure ring assembly provided as an optional embodiment in Embodiment 1 of the present application is shown.

[0024] Figure 4A bottom view of a pressure ring assembly provided as another optional embodiment of the first embodiment of the present application is shown.

[0025] Figure 5 Shown is a schematic diagram of the structure of the airflow path provided in the optional embodiment of the first embodiment of the present application.

[0026] Figure 6 Shown is a structural schematic diagram of an airflow path provided in another optional embodiment of the first embodiment of the present application.

[0027] Figure 7 Shown is a schematic diagram of the structure of a boss provided in an optional embodiment of the first embodiment of the present application.

[0028] Figure 8 Shown is a schematic diagram of the structure of the plastic packaging equipment provided in Example 2 of the present application.

[0029] Reference numerals:

[0030] 10. Carrier structure; 20. Wafer; 11. Carrier assembly; 111. Carrier body; 112. Connecting shaft; 12. Pressing ring assembly; 121. Pressing ring body; 1211. Annular body; 1212. Annular flange; 1213. Air flow passage; 1214. First opening; 122. Raised portion; 1221. Air flow hole; 1222. Second opening; 1224. First cylindrical body; 1225. Second cylindrical body; 1. Loading module; 13. Moving slide rail; 2. Pressing machine module; 3. Spreading module; 4. Air supply module; 41. Air supply portion; 42. Air supply pipeline; 43. Air flow regulating valve. DETAILED DESCRIPTION

[0031] In order to make the technical purpose, technical solution and technical effect of the present application clearer, the technical solution in the present application will be clearly and completely described in conjunction with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present application, it should be noted that the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more implementations or examples in a suitable manner.

[0034] Embodiment 1

[0035] This embodiment provides a carrier structure 10 used in a plastic packaging device to transport a wafer 20. Figure 1 The carrier structure 10 provided in this embodiment includes a carrier assembly 11 and a pressure ring assembly 12 .

[0036] The carrier assembly 11 includes a carrier body 111, the carrier body 111 has a first side and a second side arranged opposite to each other, and the wafer 20 is loaded on the first side of the carrier body 111. The pressure ring assembly 12 is connected to the first side of the carrier body 111, and includes a pressure ring body 121 and a protrusion 122. The pressure ring body 121 is connected to the carrier body 111, and the wafer 20 is loaded in the pressure ring body 121. The protrusion 122 is connected to a side of the pressure ring body 121 away from the carrier body 111 and is located between the pressure ring body 121 and the wafer 20. When the carrier structure 10 presses down the wafer 20, the protrusion 122 contacts the wafer 20. Optionally, the pressure ring assembly 12 is fixedly connected to the carrier body 111, the protrusion 122 is fixedly connected to the pressure ring body 121, or the protrusion 122 and the pressure ring body 121 can also be an integrated structure.

[0037] Compared with the prior art in which the O-ring in the carrier structure 10 directly contacts the wafer, the carrier structure 10 provided in this embodiment contacts the wafer 20 through the protrusion 122 when pressing down the wafer 20, thereby ensuring the adsorption effect of the press module 2 of the molding equipment on the wafer 20, effectively reducing the contact area between the pressure ring assembly 12 and the wafer 20, and reducing the possibility of the molding material scattered on the surface of the wafer 20 contacting the pressure ring assembly 12, thereby reducing the risk of the pressure ring assembly 12 adhering to the molding material, thereby improving the product yield and product quality of the molding process.

[0038] Reference Figure 2 and Figure 3In this embodiment, the pressure ring body 121 is an annular structure, including an annular body 1211 and an annular flange 1212. The annular body 1211 and the annular flange 1212 are coaxially arranged in sequence along the axial direction of the annular structure of the pressure ring body 121. The annular body 1211 is connected to the carrier body 111, and the annular flange 1212 is connected to the side of the annular body 1211 away from the carrier body 111, and surrounds the outer periphery of the wafer 20 when the carrier structure 10 loads the wafer 20. The raised portion 122 is connected to the side of the annular body 1211 away from the carrier body 111, and is spaced apart from the annular flange 1212, and the annular flange 1212 surrounds the outer side of the raised portion 122, and the raised portion 122 is located between the wafer 20 and the annular body 1211. Optionally, the height of the raised portion 122 along the axial direction of the pressure ring body 121 is smaller than the height of the annular flange 1212 along the axial direction of the annular body 1211. When in use, the annular flange 1212 surrounds the outside of the wafer 20 to achieve loading of the wafer 20. When the carrier structure 10 presses down the wafer 20 in the press module 2 of the molding equipment, the raised portion 122 contacts the wafer 20 to ensure the adsorption effect of the press module 2 of the molding equipment on the wafer 20.

[0039] In this embodiment, refer to Figures 2 to 4 The annular body 1211 is annular in structure, and the raised portion 122 includes a plurality of bosses, which surround the axis of the annular body 1211 and are distributed at intervals along the circumference of the annular structure of the annular body 1211, and the height of the bosses along the axial direction of the pressure ring body 121 is less than the height of the annular flange 1212 along the axial direction of the annular body 1211. Optionally, the raised portion 122 includes at least 3 bosses, which surround the axis of the annular body 1211 and are evenly spaced along the circumference of the annular body 1211; further, the raised portion 122 may, for example, include 3 bosses, which are evenly arranged at a central angle of 120° along the circumference of the annular body 1211; or the raised portion 122 may, for example, include 4 bosses, which are evenly arranged at a central angle of 90° along the circumference of the annular body 1211; or the raised portion 122 may, for example, include 6 bosses, which are evenly arranged at a central angle of 60° along the circumference of the annular body 1211; or the number of the raised portions 122 may also be set to other suitable values, and the specific number and arrangement method may be adaptively set according to actual needs.

[0040] In an alternative embodiment, reference Figure 5 and Figure 6, an airflow passage 1213 is provided in the pressure ring body 121, and the airflow passage 1213 is provided with a first opening 1214 on the radial outer side of the pressure ring body 121. Optionally, the airflow passage 1213 can be an annular structure coaxially arranged with the annular body 1211, or an arc-shaped annular structure coaxially arranged with the annular body 1211. The first opening 1214 can be located on the outer side of the annular body 1211, or the first opening 1214 can also be located on the outer side of the annular flange 1212. An airflow hole 1221 is provided in the boss, and the airflow hole 1221 penetrates the boss and the side wall of the airflow passage 1213, so that the airflow hole 1221 is connected with the airflow passage 1213, and the airflow hole 1221 has a second opening 1222 on the side of the boss away from the carrier body 111, and the first opening 1214 is connected with the second opening 1222 through the airflow passage 1213 and the airflow hole 1221. When in use, air flow is provided to the air flow passage 1213 through the first opening 1214, and the air flow passes through the air flow passage 1213 and the air flow hole 1221 and blows toward the wafer 20 from the second opening 1222, so as to remove the plastic packaging material scattered on the surface of the wafer 20 below the boss, reduce or completely remove the plastic packaging material particles scattered in the contact area between the boss and the wafer 20, reduce or avoid the risk of the plastic packaging material sticking to the pressure ring assembly 12, and ensure the product yield and product quality of the plastic packaging process.

[0041] In an alternative embodiment, reference Figure 5 and Figure 6The boss is a cylindrical structure. Optionally, the diameter of the boss of the cylindrical structure is 2mm to 3mm. The diameter of the boss can be set to 2mm, 2.3mm, 2.5mm, 3mm or other suitable values. The height of the boss is 3mm to 6mm, for example, 3mm, 5mm, 6mm or other suitable sizes. By controlling the size of the cylindrical structure of the boss, the contact area between the pressure ring assembly 12 and the wafer 20 can be effectively reduced, thereby reducing the risk of scattered plastic packaging material adhering to the pressure ring assembly 12. Furthermore, an air flow hole 1221 is also provided in the boss of the cylindrical structure, and the air flow hole 1221 penetrates the air flow passage 1213 along the axial direction of the boss, so that the air flow hole 1221 is connected with the air flow passage 1213, and the shape of the air flow hole 1221 corresponds to the cylindrical structure of the boss, and the diameter of the air flow hole 1221 can be adaptively set according to actual design needs, for example, the diameter of the air flow hole 1221 can be set to 1mm~2mm, and the air flow blown out by the second opening 1222 during use can remove the plastic sealing material on the surface of the wafer 20 below the boss. In a specific embodiment, the raised portion 122 can include, for example, three bosses of cylindrical structures, and the three bosses of cylindrical structures are evenly spaced along the circumference of the annular body 1211, and the air flow passage 1213 can be annular in structure or an arcuate in structure, and the arc angle of the arcuate in structure of the air flow passage 1213 is at least 240°.

[0042] In an alternative embodiment, reference Figure 1 The boss is a trapezoidal cylindrical structure. The boss of the trapezoidal cylindrical structure has a top surface and a bottom surface that are relatively arranged. The bottom surface of the boss is connected to the annular body 1211. The top surface diameter of the boss is smaller than the bottom surface diameter that contacts the annular body 1211. Optionally, the top surface diameter of the boss of the trapezoidal cylindrical structure is 2mm to 3mm, and the height is 3mm to 6mm. The top surface diameter can be set to 2mm, 2.5mm, 3mm or other suitable sizes. By making the top surface diameter of the boss smaller than the bottom surface diameter, the contact area between the boss and the wafer 20 can be further reduced, thereby reducing the possibility of the plastic packaging material scattered on the surface of the wafer 20 contacting the boss. Furthermore, an air flow hole 1221 is provided in the boss of the trapezoidal cylindrical structure, and the air flow hole 1221 is connected to the air flow passage 1213 in the pressure ring body 121, so that the plastic packaging material scattered on the surface 20 of the wafer below the boss can be cleared through the air flow, thereby reducing the risk of the pressure ring assembly 12 sticking to the plastic packaging material and improving the product yield and product quality of the plastic packaging process.

[0043] In an alternative embodiment, reference Figure 2The boss is a trapezoidal cylindrical structure, the boss of the trapezoidal cylindrical structure has a top surface and a bottom surface that are relatively set, the bottom surface of the boss is connected to the annular body 1211, the top surface diameter of the boss is larger than the bottom surface diameter in contact with the annular body 1211, optionally, the top surface diameter of the boss of the trapezoidal cylindrical structure is 2mm~3mm, the height is 3mm~6mm, and the angle between the outer side surface of the boss of the trapezoidal cylindrical structure and the axis of the boss is less than or equal to 30°, for example, it can be 30°, 25°, 15°, 10° or other suitable angles. Furthermore, an air circulation hole 1221 is provided in the boss of the trapezoidal cylindrical structure, and the side walls of the air circulation hole 1221 are set with equal thickness, that is, the contour shape of the air circulation hole 1221 corresponds to the contour shape of the trapezoidal cylindrical structure of the boss. By controlling the top surface diameter to be larger than the bottom surface diameter, the blowing area of ​​the air circulation hole 1221 of the boss can be made larger than the contact area between the boss and the wafer, thereby effectively avoiding the adhesion of the plastic packaging material to the pressure ring assembly 12, thereby improving the product yield and product quality of the plastic packaging process.

[0044] In an alternative embodiment, reference Figure 7Along the axial direction of the pressure ring body 121, the boss includes a first cylindrical body 1224 and a second cylindrical body 1225 stacked together. The first cylindrical body 1224 and the second cylindrical body 1225 are coaxially arranged. The first cylindrical body 1224 has a top surface and a bottom surface arranged opposite to each other along its axial direction. The second cylindrical body 1225 also has a top surface and a bottom surface arranged opposite to each other along its axial direction. The bottom surface of the first cylindrical body 1224 is connected to the annular body 1211, and the top surface of the first cylindrical body 1224 is in contact with the top surface of the second cylindrical body 1225 and overlaps with each other. The bottom surface diameter of the second cylindrical body 1225 is larger than the top surface diameter of the first cylindrical body 1224. Optionally, the bottom diameter of the second cylindrical body 1225 is 2mm to 3mm, the height of the boss along its axial direction is 3mm to 6mm, and the angle between the outer side surface of the second cylindrical body 1225 and the axis of the second cylindrical body 1225 is less than or equal to 30°, wherein the height of the first cylindrical body 1224 and the height of the second cylindrical body 1225 can be set according to actual needs, for example, the height of the first cylindrical body 1224 can be set to 2mm to 4mm or other heights, and the height of the second cylindrical body 1225 can also be set to 2mm to 4mm; further, the bottom diameter of the first cylindrical body 1224 is greater than or equal to the top diameter of the first cylindrical body 1224. Furthermore, an air circulation hole 1221 can be provided in the boss, and the side walls of the air circulation hole 1221 are set with equal thickness, that is, the contour structure of the air circulation hole 1221 corresponds to the contour structure of the first cylindrical body 1224 and the second cylindrical body 1225 of the boss. By controlling the sizes of the top surface and the bottom surface of the first cylindrical body 1224 and the second cylindrical body 1225 and increasing the blowing area of ​​the air circulation hole 1221 of the boss, the structural stability of the boss can be improved, the blowing effect of the air circulation hole 1221 on the scattered plastic packaging material on the surface of the wafer 20 and the pressing effect of the boss on the wafer 20 are ensured, the adsorption effect of the press module 2 in the plastic packaging equipment on the wafer 20 is ensured, the problem of the plastic packaging material sticking to the pressure ring assembly 12 is avoided, and the product quality is improved.

[0045] In this embodiment, the compression ring assembly 12 can adopt an integrated structure or a discrete structure, for example, the compression ring body 121 and the protrusion 122 are integrally formed and then subsequently processed to form the compression ring assembly 12 of this embodiment, or the compression ring body 121 and the protrusion 122 are formed separately, and the protrusion 122 is connected to the compression ring body 121 to form the compression ring assembly 12 of this embodiment, or other acceptable methods can be used to process and form the compression ring assembly 12 of this embodiment, and this embodiment is not limited thereto. In addition, the compression ring body 121 and the protrusion 122 can be made of the same material, or they can also be made of different materials. The material of the compression ring assembly 12 can be, for example, rubber, polytetrafluoroethylene or other suitable materials.

[0046] In summary, in the carrier structure 10 of the present embodiment, a protrusion 122 is provided in the pressure ring assembly 12, and the protrusion 122 includes a plurality of bosses distributed at intervals along the circumference of the annular main body 1211. When the carrier structure 10 presses down the wafer, the bosses can effectively reduce the contact area between the pressure ring assembly 12 and the wafer, reduce the possibility of the plastic packaging material scattered on the surface of the wafer contacting the pressure ring assembly 12, and thus reduce the risk of the pressure ring assembly 12 adhering to the plastic packaging material, thereby improving the product yield and product quality in the plastic packaging process; and There is an air circulation hole 1221, which can effectively remove the plastic packaging material scattered on the wafer surface under the boss, thereby preventing the plastic packaging material from sticking to the pressure ring assembly 12; by adjusting the structural shape and characteristic size of the boss, the risk of the pressure ring assembly 12 contacting the plastic packaging material scattered on the wafer surface is further reduced, and the shape of the air circulation hole 1221 is changed according to the structural adaptability of the boss to ensure that no plastic packaging material particles remain in the contact area between the boss and the wafer, thereby effectively preventing the plastic packaging material from sticking to the pressure ring assembly 12 and improving product quality.

[0047] Embodiment 2

[0048] This embodiment provides a plastic packaging device, including a material spreading module 3 , a press module 2 and a loading module 1 .

[0049] Reference Figure 8 The loading module 1 includes a movable slide rail 13 and any one of the tray structures 10 described in the first embodiment. The tray structure 10 is connected to the movable slide rail 13 so that the tray structure 10 can move along the movable slide rail 13, thereby realizing the transportation of the wafer 20. Optionally, the tray assembly 11 of the tray structure 10 also includes a connecting shaft 112, one end of which is connected to the second side of the tray body 111, and the other end is connected to the movable slide rail 13, so as to drive the tray structure 10 to move along the movable slide rail 13. The material spreading module 3 is used to spread the wafer 20, and transport it to the press module 2 for plastic sealing through the loading module 1. Specifically, the material spreading module 3 spreads the plastic sealing material on the surface of the wafer 20, and the loading module 1 transports the wafer 20 after spreading the material into the mold of the press module 2 to plastic seal the wafer 20.

[0050] In this embodiment, the molding device also includes an air supply module 4, which includes an air supply part 41, an air supply pipeline 42 and an air flow regulating valve 43. The air supply pipeline 42 is respectively connected to the air supply part 41 and the first opening 1214 of the carrier structure 10, so that the air supply part 41 is connected to the air flow passage 1213, so that the air supply part 41 can provide air flow to the air flow passage 1213. The air flow regulating valve 43 is connected to the air supply pipeline 42, which is used to adjust the gas flow of the air supply pipeline 42 to ensure that the air flow blown out from the second opening 1222 of the carrier structure 10 can clear the molding material scattered under the boss.

[0051] The plastic packaging equipment provided in this embodiment includes any one of the carrier structures 10 described in the first embodiment, and thus also has the beneficial effects of the first embodiment.

[0052] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify, change or combine the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A carrier structure, used in plastic packaging equipment to transport wafers, characterized in that: It includes a carrier plate assembly and a pressure ring assembly; The carrier assembly includes a carrier body, the carrier body has a first side and a second side arranged opposite to each other, the pressure ring assembly is connected to the first side of the carrier body, includes a pressure ring body and a protrusion, the wafer is loaded in the pressure ring body, the protrusion is connected to the pressure ring body and is located between the pressure ring body and the wafer, and the protrusion contacts the wafer when the carrier structure presses down the wafer.

2. The carrier structure according to claim 1, characterized in that: The pressure ring body is an annular structure, including a coaxially arranged annular body and an annular flange, the annular body is connected to the carrier body, and the annular flange surrounds the outer side of the protrusion and is connected to the side of the annular body away from the carrier body.

3. The carrier structure according to claim 2, characterized in that: The raised portion includes a plurality of bosses, which are spaced apart along the circumference of the annular structure of the annular main body, and a height of the bosses along the axial direction of the pressure ring main body is smaller than a height of the annular flange along the axial direction of the pressure ring main body.

4. The carrier structure according to claim 3, characterized in that: An air flow passage is provided in the pressure ring body, and the air flow passage has a first opening on the radial outer side of the pressure ring body; The boss is provided with an air flow hole, the air flow hole is communicated with the air flow passage, and the air flow hole has a second opening on a side of the boss away from the carrier body.

5. The carrier structure according to claim 3 or 4, characterized in that: The boss is a cylindrical structure, the diameter of the boss of the cylindrical structure is 2mm-3mm, and the height of the boss is 3mm-6mm.

6. The carrier structure according to claim 3 or 4, characterized in that: The boss is a trapezoidal cylindrical structure, and the diameter of the top surface of the boss away from the annular body is smaller than the diameter of the bottom surface of the boss in contact with the annular body; wherein the diameter of the top surface of the boss is 2 mm to 3 mm.

7. The carrier structure according to claim 3 or 4, characterized in that: The boss is a trapezoidal cylindrical structure, and the top surface diameter of the boss away from the pressure ring body is larger than the bottom surface diameter of the boss in contact with the pressure ring body; wherein the angle between the outer side surface of the boss of the trapezoidal cylindrical structure and the axis of the boss is less than or equal to 30°.

8. The carrier structure according to claim 3 or 4, characterized in that: Along the axial direction of the pressure ring body, the boss includes a first cylindrical body and a second cylindrical body coaxially stacked, the bottom surface of the first cylindrical body is connected to the annular body, the top surface of the first cylindrical body contacts and overlaps with the top surface of the second cylindrical body, and the bottom surface diameter of the second cylindrical body is larger than the top surface diameter of the first cylindrical body, and the bottom surface diameter of the first cylindrical body is larger than or equal to the top surface diameter of the first cylindrical body; The bottom diameter of the second cylindrical body is 2 mm to 3 mm, and the angle between the outer side surface of the second cylindrical body and its axis is less than or equal to 30°.

9. A plastic packaging device, characterized in that: It includes a material spreading module, a press module and a loading module, the loading module includes a movable slide rail and a carrier structure as described in any one of claims 1 to 8 connected to the movable slide rail, the material spreading module is used to spread material on the wafers, and the loading module is used to transport the wafers after spreading material to the press module.

10. The plastic packaging equipment according to claim 9, characterized in that: It also includes a gas supply module, which includes a gas supply part, a gas supply pipeline and an air flow regulating valve. The opposite ends of the gas supply pipeline are respectively connected to the gas supply part and the first opening of the carrier structure. The air flow regulating valve is connected to the gas supply pipeline to adjust the gas flow of the gas supply pipeline.

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