Staggered vein-shaped embedded micro-channel radiator

Abstract

The invention discloses a staggered vein-shaped embedded micro-channel radiator, and belongs to the field of radiators. According to the radiator, N inflow branches and N + 1 outflow branches are etched on a substrate, N is larger than or equal to 2, a plurality of forked branches of 45 degrees are arranged between the inflow branches and the outflow branches, and a heat dissipation working medium flows in from the N inflow branches, passes through the forked branches and then flows out after being converged in the N + 1 outflow branches. Therefore, by adopting the vein-shaped micro-channel structure, the micro-channel space is reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of radiators, and in particular to an embedded micro-channel radiator in a staggered vein shape. Background Art

[0002] With the development of miniaturization of chip electronic chip size, the current average heat flux density of electronic chips can reach 600W / cm2, and the heat flux density at local locations will even be as high as 1000W / cm2. The heat dissipation demand of chips continues to become a research hotspot. Based on the heat dissipation medium outside the chip, there are natural convection cooling technology, forced air cooling technology, forced liquid cooling technology, and phase change cooling technology. This heat dissipation mode is limited by the heat transfer path from the chip heat source to the cooling medium, and the embedded microchannel is directly made inside the chip substrate to realize the integrated packaging manufacturing of the heat dissipation structure and the chip, and the heat dissipation effect is better. The embedded parallel straight microchannel is the most basic embedded microchannel. On this basis, the academic community has conducted research on embedded microchannels with pin fins and integrated manifolds.

[0003] Although the embedded DC microchannel has a good heat dissipation effect, its simple structure makes the heat dissipation capacity of the microchannel in various parts of the chip very similar, so that some areas with lower heat generation power may be "overcooled", wasting the heat dissipation effect. As far as the current research on embedded DC microchannel is concerned, its microchannel occupies a large proportion of the entire chip substrate, which reduces the stability of the microchannel and is not conducive to production. Summary of the invention

[0004] The present invention provides a staggered leaf-vein-shaped embedded microchannel radiator, which adopts a leaf-vein-shaped microchannel radiator structure to reduce microchannel space and improve heat dissipation effect.

[0005] The staggered vein-shaped embedded microchannel heat sink of the embodiment of the present invention comprises:

[0006] N inflow branches and N+1 outflow branches are etched on the substrate, N is greater than or equal to 2, and there are multiple 45-degree branch branches between the inflow branches and the outflow branches. The heat sink flows into the N inflow branches, and after passing through multiple branch branches, it converges in the N+1 outflow branches and then flows out.

[0007] In an embodiment of the present invention, each of the N inflow tributaries has a plurality of bifurcation nodes, and two bifurcation tributaries with an angle of 45 degrees to the inflow tributaries are branched out at each bifurcation node. Adjacent bifurcation tributaries among the N inflow tributaries are connected to form N-1 outflow tributaries, and the bifurcation tributaries on both sides of the first and Nth tributaries are connected to form two outflow tributaries respectively.

[0008] In an embodiment of the present invention, the substrate is diamond.

[0009] In the embodiment of the present invention, the width of the inflow branch and the outflow branch is 0.5 mm, and the width of the bifurcated branch is 0.71 mm.

[0010] The staggered leaf vein embedded microchannel heat sink of the embodiment of the present invention adopts a leaf vein microchannel structure to reduce the microchannel space and improve the heat dissipation effect, which is suitable for the situation where the chip temperature is unevenly distributed. According to Ansys simulation, under the condition of the same heat dissipation internal surface area, compared with the three different structures of straight type, grid type and tree type, the staggered leaf vein embedded structure has a lower maximum temperature difference, which indicates that the temperature peak of the structure is smaller and has better heat dissipation capacity.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0013] Figure 1 A schematic diagram of a staggered leaf-veined embedded microchannel heat sink according to an embodiment of the present invention;

[0014] Figure 2 for Figure 1 A top view of the staggered leaf-veined embedded microchannel heat sink shown;

[0015] Figure 3 for Figure 1 The exploded structural diagram of the staggered vein-shaped embedded microchannel heat sink shown;

[0016] Figure 4 Schematic diagram of another staggered leaf-veined embedded microchannel heat sink according to an embodiment of the present invention. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0018] The staggered vein-shaped embedded microchannel heat sink includes: N inflow branches and N+1 outflow branches etched on a substrate, N is greater than or equal to 2, and there are multiple 45-degree bifurcated branches between the inflow branches and the outflow branches. The heat dissipation medium flows into the N inflow branches, and after passing through multiple bifurcated branches, it converges in the N+1 outflow branches and then flows out.

[0019] Each of the N inflow tributaries has multiple bifurcation nodes. Two bifurcated tributaries with an angle of 45 degrees to the inflow tributary are branched out at each bifurcation node. The adjacent bifurcated tributaries among the N inflow tributaries are connected to form N-1 outflow tributaries. The bifurcated tributaries on both sides of the first and Nth tributaries are connected to form two outflow tributaries respectively.

[0020] Specifically, the design of the present invention increases the spacing between microchannels on the basis of parallel straight microchannels. Starting from a single water inlet, it is divided into an even number of inflow branches, and the ends thereof are not directly connected to the water outlet. An outflow branch is designed between two adjacent inflow branches, and its starting end is not directly connected to the water inlet. On both sides of the inflow branch, bifurcated branches are designed at a 45-degree angle along the flow direction of the working fluid. After the bifurcated branches are extended by half the branch interval in the lateral dimension, they intersect with the adjacent bifurcated branches at the outflow branch. After the outflow branches intersect at the water outlet, the working fluid flows out of the radiator through the water outlet and enters the cooling tower outside the chip, thereby realizing the circulation of the working fluid. Figure 1 As shown, the heat sink structure is shown when N is equal to 2. Figure 2 and Figure 3 Bit Figure 1 The top view and exploded view of the heat sink are shown in Figure 1. Figure 4 As shown, the heat sink structure is shown when N is equal to 4.

[0021] The heat sink of the embodiment of the present application can adjust the density of the bifurcated branches according to the heat dissipation area of ​​the chip. For example, the distance between the cross nodes is small at the location where the heat dissipation is large, and the distance between the cross nodes is large at the location where the heat dissipation is small. When the heat dissipation of the chip is uniform, the cross nodes can be evenly arranged, and the distance between the cross nodes is equal to the distance between the inflow branch and the outflow branch formed by the inflow branch.

[0022] In an embodiment of the present invention, the substrate is diamond.

[0023] Figure 1 The microfluidic structure shown is the simplest structure of the present invention. The designed chip has a length of 50 mm, a width of 30 mm, a height of 1 mm, a microfluidic inlet and outlet width of 1 mm, a water inlet branch channel and a water outlet branch channel width of 0.5 mm, and a bifurcated branch channel width of 0.71 mm. During simulation, the main heating area of ​​the chip is set to a length of 20 mm and a width of 15 mm, located in the upper center of the chip.

[0024] for Figure 1 The structure of the embodiment has a lower maximum temperature difference than the three different structures of the straight type, the grid type, and the tree type under the same heat dissipation internal surface area, the working fluid temperature, and the water inlet flow rate through Ansys simulation, which indicates that the temperature peak of the structure is smaller and has better heat dissipation capacity. The simulation results are shown in Table 1.

[0025] Table 1

[0026] Parameters and simulated temperature difference of the French vein structure and three comparison structures, T = 300K, v = 0.2m / s

[0027]

[0028] Further, the microfluidic structure of the present invention is simulated when N=4, as shown in FIG. Figure 4 As shown. This structure is based on the simplest staggered vein structure, maintaining the chip size, the position and size of the water inlet and outlet, and the main heating area of ​​the chip unchanged. Based on the premise that the inner surface area of ​​the microchannel is approximately equal, since when the chip has N inflow tributaries, there are 2N+1 inflow and outflow tributaries, the width of the inflow tributaries, outflow tributaries, and bifurcated tributaries is reduced in inverse proportion to the number of tributaries, that is, the width of the microchannel is reduced to 5 / (2N+1) times of the simplest structure, while keeping the height unchanged. When N=4, the microchannel width of the inlet and outlet tributaries is 0.26mm, and the width of the bifurcated tributaries is 0.18mm.

[0029] Furthermore, the microchannel structure when N=6 was modeled, and the heat dissipation performance of the staggered leaf vein microchannel was compared and analyzed horizontally. Taking the microchannel structure when N=2, 4, and 6, after Ansys simulation, it was found that with the increase of N value, the maximum temperature difference decreased, indicating that the temperature peak decreased. The data results after simulation are shown in Table 2. However, with the further increase of N value, the pressure resistance of the microchannel structure may decrease and the working fluid flow may change. Therefore, this simulation result is used to illustrate the situation when there are fewer tributaries, but cannot illustrate the situation when the tributaries are extremely dense.

[0030] Table 2

[0031] Parameters and simulation temperature difference of leaf vein structure when N=2,46, T=300K, v=0.2m / s

[0032]

[0033] The staggered leaf-vein-shaped embedded microchannel heat sink proposed in an embodiment of the present invention adopts a leaf-vein-shaped microchannel structure to reduce the microchannel space and improve the heat dissipation effect, and is suitable for the situation where the chip temperature is unevenly distributed.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "N" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

Claims

1. An embedded microchannel heat sink with staggered vein shape, characterized in that: include: N inflow branches and N+1 outflow branches are etched on the substrate, N is greater than or equal to 2, and there are multiple 45-degree branch branches between the inflow branches and the outflow branches. The heat sink flows into the N inflow branches, and after passing through multiple branch branches, it converges in the N+1 outflow branches and then flows out.

2. The embedded microchannel heat sink with staggered vein shape according to claim 1, characterized in that: Each of the N inflow tributaries has multiple bifurcation nodes. Two bifurcated tributaries with an angle of 45 degrees to the inflow tributary are branched out at each bifurcation node. The adjacent bifurcated tributaries among the N inflow tributaries are connected to form N-1 outflow tributaries. The bifurcated tributaries on both sides of the first and Nth tributaries are connected to form two outflow tributaries respectively.

3. The embedded microchannel heat sink with staggered vein shape according to claim 1, characterized in that: The substrate is diamond.

4. The staggered vein-shaped embedded microchannel heat sink according to claim 1, characterized in that: The width of the inflow and outflow tributaries is 0.5 mm, and the width of the bifurcated tributaries is 0.71 mm.

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